JPH08118860A - Data carrier and manufacture thereof - Google Patents

Abstract

PURPOSE: To enhance reliability of the quality of a data carrier and improve workability thereof by a method wherein holding pieces for holding a data communication means and a circuit substrate between other center core sheets are provided on any of center core sheets in a card type data carrier such as an ID card, etc., for controlling going in and out. CONSTITUTION: An ID card which is a card type data carrier comprises a base sheet 1, a coil (data communication means) 2, a circuit substrate 3, a resin member 4 and a cover sheet 5. The base sheet 1 is produced by laminating five center core sheets 1a to 1e and one oversheet 1f on one another. The coil 2 and the circuit substrate 3 are disposed in a recessed portion 1g formed on the base sheet 1 and, after gaps among the coil 2, the circuit substrate 3 and the recessed portion 1g are filled with the resin member 4, the cover sheet 5 is stuck thereon. That is, the coil 2 and a substrate 3a are held between holding pieces 1a2 , 1c2 provided on the center core sheets 1a, 1c and between the center core sheets 1c, 1e, respectively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card type data carrier such as an ID card for managing entrance / exit of a building and a manufacturing method thereof.

[0002]

2. Description of the Related Art Conventionally, there is a data carrier of this type and a manufacturing method thereof as shown in FIG. This is an ID card used for building entry / exit management, etc. As shown in Fig. 15 (a), four center core sheets are used.
A base sheet A having A ₁ , A ₂ , A ₃ , and A ₄ laminated is provided with a recess A ₅ by processing such as cutting, and the recess A ₅ is provided as shown in FIG.
The A _5, and the coil (data communication means) B which performs data communication by electromagnetic induction between the write / read unit, a circuit board C which is the circuit configured to hold the data obtained by the coil B In this state, the gap between the coil B and the circuit board C and the recess A ₅ is filled with the resin body D, and the cover sheet E composed of _one center core sheet E ₁ is provided as shown in FIG. Is formed on the base sheet A with an adhesive F.

Generally, the base sheet A and the cover sheet E are the uppermost center core sheets of the respective sheets.
Common information G such as name and pattern is printed on A ₁ or E ₁ , and transparent oversheets A ₆ and E ₂ are laminated as a top layer for protection.

[0004]

In the above-mentioned conventional data carrier and its manufacturing method, the base sheet A
A gap is created between the coil B and the circuit board C and the recess A ₅ due to the variation in the processing of the recess A ₅ in the groove A and the variation in the outer dimensions of the coil B and the circuit board C, and the gap is filled with the resin body D. However, during the application of the resin body D and before the curing is completed, the coil B and the circuit board C float, are misaligned, bubbles are trapped, etc. There is a possibility that problems such as poor workability and poor workability may occur.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a data carrier having high reliability in quality and excellent workability, and a manufacturing method thereof.

[0006]

In order to solve the above-mentioned problems, a device according to claim 1 has a data communication means, a circuit board for holding data obtained by the data communication means, and a plurality of center cores. A base sheet formed by stacking the sheets and having a recess for arranging the data communication means and the circuit board; and a cover sheet attached to the base sheet,
In a data carrier used by being attached to a moving body, a sandwiching piece for sandwiching the data communication means and the circuit board with another center core sheet is provided in any of the center core sheets. .

According to a second aspect of the present invention, in the first aspect of the present invention, the sandwiching piece is formed to be bent in the stacking direction of the center core sheets.

According to a third aspect of the present invention, in the first aspect, a resin body is filled in a gap between the data communication means and the circuit board and the concave portion of the base sheet.

According to a fourth aspect, in the first aspect, the data communication means is an antenna for transmitting and receiving microwaves.

According to a fifth aspect of the present invention, the recess formed in the base sheet in which a plurality of center core sheets are laminated,
In a method of manufacturing a data carrier, in which a data communication means and a circuit board for holding data obtained by the data communication means are arranged, and then a cover sheet is attached to the base sheet, the base sheet is formed by first laminating the base sheet. Part of the center core sheet, the data communication means and the circuit board are previously arranged in the recess formed by the center core sheet, and then another center core sheet having a sandwiching piece is further laminated, and the sandwiching piece and the center previously laminated. The data communication means and the circuit board are sandwiched between the core sheet and the core sheet.

According to a sixth aspect of the present invention, the recess formed in the base sheet in which a plurality of center core sheets are laminated,
After disposing the data communication means and the circuit board holding the data obtained by the data communication means and filling the resin body in the gap between the data communication means and the circuit board and the recessed portion of the base sheet, the cover sheet is used as the base sheet. In the method of manufacturing a data carrier to be adhered to, the resin body is sandwiched between the sandwiching piece provided on one of the center core sheets and the other center core sheet while sandwiching the data communication means and the circuit board. The cover sheet is attached to the base sheet before filling and filling of the resin body.

[0012]

According to the first aspect of the present invention, the data communication means and the circuit board arranged in the recess of the base sheet are provided between the sandwiching piece provided on one of the center core sheets and the other center core sheet. Since it is sandwiched, it is unlikely that misalignment will occur within the recess.

Further, according to the second aspect of the invention, since the sandwiching pieces bent and formed in the stacking direction of the center core sheet are sandwiched by utilizing the bending elasticity, the data communication means and the circuit board are Furthermore, it becomes difficult for misalignment to occur in the recess.

According to the third aspect of the present invention, the data communication means and the circuit board are sandwiched by the sandwiching pieces provided on the center core sheet, and are not easily positioned within the recesses. When the gap between the sheet and the recess is filled with the resin body, it becomes difficult for air bubbles to be trapped inside the resin body.

According to the fourth aspect of the invention, since the antenna as the data communication means transmits and receives microwaves having a short wavelength, even an antenna formed of a conductor of one turn resonates. Therefore, it is not necessary to wind the conductor many times like other data communication means such as a coil by electromagnetic induction, and the size can be reduced.

According to a fifth aspect of the present invention, a recess is formed by a part of the center core sheets previously laminated, and the data communication means and the circuit board are arranged in the recess.
If another center core sheet having a sandwiching piece is further laminated, the sandwiching piece sandwiches the data communication means and the circuit board, so that each member can be assembled simply by stacking them in order from above.

According to the sixth aspect of the present invention, the data communication means and the circuit board are sandwiched by the sandwiching pieces so that they are less likely to be misaligned, and when the cover sheet is attached to the base sheet, the cover sheet is covered. Since the resin body filled on the inner surface side of does not harden and there is no hard unevenness on the surface,
No unevenness occurs on the surface of the cover sheet.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. This is, for example, a card-type data carrier used for entrance / exit management of buildings and facilities, so-called ID card, which includes a base sheet 1, a coil (data communication means) 2, a circuit board 3, a resin body 4, and a cover. Sheet
It consists of 5.

The base sheet 1 is formed of a plastic material such as polyvinyl chloride into a sheet of a regular size that can be divided into a plurality of products in a later step, and is opaque with the same plate thickness shown in FIG. 5 center core sheets 1a, 1b, 1
It is manufactured by laminating c, 1d, 1e and one thin transparent oversheet 1f. Note that FIG. 2 shows a plan view of one product.

The first layer of the center core sheet 1a shown in FIG. 2 (a), the center has an elliptical hole 1a _1, opposing distance on the ellipse hole 1a ₁ are orthogonal to each other becomes the maximum and minimum 4 As shown in FIG. 3, the two inner edge portions are bent and formed in the plate thickness direction in which the protruding sandwiching pieces 1a ₂ are laminated. The second layer of the center core sheet 1b shown in (b) has the same size as the oval hole 1b ₁ and the first layer of the center core sheet 1a at the center. The center core sheet 1c of the third layer shown in FIG. 3C has an elliptical hole 1c ₁ at the center smaller than that of the center core sheet 1a of the first layer, and the elliptic hole 1c ₁ has the first layer Similar to the center core sheet 1a of the eye, four inner edge portions orthogonal to each other are protruded from the sandwiching pieces 1c ₂ as shown in FIG.
Are bent and formed in the plate thickness direction. Figure (d)
The fourth-layer center core sheet 1d shown in FIG.
Elliptical hole 1d _{1 of the} same size as the center core sheet 1c of the _{1st layer}
have. The fifth-layer center core sheet 1e shown in FIG. 6 (e) has no holes. The sixth-layer oversheet 1f shown in FIG. 6 (f) has no holes.

The base sheet 1 is processed by laminating the above six sheets by thermocompression bonding, which is a sectional view shown in FIG. 5 (a). Correspondingly, a substantially two-step recess 1g is formed in the center.

The coil (data communication means) 2 is formed into an elliptical plate shape by winding a thin copper wire for a predetermined number of turns, and the outer diameter of the ellipse is defined by the elliptic hole 1b ₁ of the center core sheet 1b of the second layer. Is slightly smaller, and the inner diameter is the 4th layer center core sheet
It is slightly larger than the elliptic hole 1d _{1 of} 1d, and its plate thickness is formed slightly thinner than the plate thickness of the center core sheet.

The circuit board 3 is an unsealed IC on the board 3a.
And other circuit elements are mounted, and the circuit elements are covered with an epoxy resin or the like to be in a sealed state. The substrate 3a has no an elliptical plate shape, an outer diameter slightly smaller than the elliptical recess 1d ₁ of the fourth layer of the center core sheet 1d, plate thickness than the thickness of the center core sheet the same as the coil 2 It is formed slightly thin.

Then, the coil 2 and the circuit board 3 described above are used.
Is arranged in the recess 1g of the base sheet 1. That is, as shown in FIG. 5 (b), is sandwiched between the center core sheet 1e of the substrate 3a of the circuit board 3 and the clamping pieces 1c ₂ of the third layer of the center core sheet 1c fifth layer elliptical holes 1d ₁ of the fourth layer of the center core sheet 1d while Yo expanding the clamping pieces 1c ₂
To store. Further, as shown in FIG. (C), clamping pieces 1a to be sandwiched between the coil 2 and clamping pieces 1a ₂ of the first layer of the center core sheet 1a and the third layer of the center core sheet 1c ₂ is expanded and stored in the elliptic hole 1b ₁ of the center core sheet 1b of the second layer. Thus, as shown in FIG. 3D, the coil 2 and the circuit board 3a of the circuit board 3 arranged in the recess 1g of the base sheet 1 have the sandwiching pieces 1a ₂ and 1c ₂ folded in the stacking direction of the center core sheet. Since it is bent, it is more firmly clamped by its bending elasticity. A plan view of this state is shown in FIG.

Then, as shown in FIG.
Is filled in the concave portion 1g of the base sheet 1. This resin body 4
Is a liquid resin such as epoxy and flows into the gap with the recess 1g so as to cover the coil 2 and the circuit board 3.

Next, the base sheet 1 is in the above-mentioned fixed-size sheet state, as shown in FIG. 6 (f), the adhesive 6 is applied to the center core sheet 1a of the first layer, and g)
As shown in Fig. 4, before the resin body 4 is cured, the cover sheet 5 in a fixed-size sheet is polymerized on the base sheet 1, and while being held under pressure, the resin body 4 and the adhesive 6 are cured and applied. It

This cover sheet 5 is manufactured by laminating an opaque center core sheet 5a and a transparent oversheet 5b similar to those used for the base sheet 1. At this time, common information 7 such as a name and a pattern is printed on the center core sheet 5a, and a transparent oversheet 5b is further laminated as a top layer for protection.

FIG. 7 shows a state in which the above-mentioned sheets are stacked in a standard size, and the sheets are pressurized and held as indicated by the white arrows in FIG. The products are stacked as shown in (b), and then, as shown in (c) of the same figure, they are divided and cut by a predetermined punching die to make products one by one.

When the card type data carrier (ID card) manufactured as described above is used for entrance / exit management of a building or facility, as shown in FIG.
The card is carried by a human being, which is a moving body, and an antenna is installed at a doorway of a building or a gate of a facility, and the antenna is connected to a controller. Then, when a person passes near the antenna when entering or leaving a building or facility, the coil (data communication means) 2 built in the ID card and the antenna perform mutual data communication by electromagnetic induction, and the profit is obtained. The obtained data is retained on the circuit board 3. That is, data is read and written between the ID card and the controller via the antenna, and the controller is connected to a higher-order control unit such as a sequencer or computer, and the data read by the controller is identified and the higher-order control is performed. The doorway of the building and the gate of the facility are opened and closed through the unit.

In such a data carrier, as described above, the coil arranged in the recess 1g of the base sheet 1
2 is sandwiched between the sandwiching piece 1a ₂ of the center core sheet 1a of the first layer and the center core sheet 1c of the third layer, and the substrate 3a of the circuit board 3 is of the center core sheet 1c of the third layer. It is sandwiched between the sandwiching piece 1c ₂ and the fifth-layer center core sheet 1e, and the sandwiching pieces 1a ₂ and 1c ₂ are formed by bending in the stacking direction of the center core sheets. Since it is sandwiched by utilizing its bending elasticity, the coil 2 and the circuit board 3 are unlikely to be misaligned in the concave portion 1g of the base sheet 1.

Further, since the coil 2 and the circuit board 3 are covered with the resin body 4 filled in the gap between the base sheet 1 and the recess 1g, the resin body 4 is excellent in environmental resistance against vibration and oil. As described above, it is less likely to cause misalignment when filling, so it can be done while discharging the internal air without entraining air bubbles, it is easy to work, and the specified characteristics are realized to ensure quality reliability. Will also be higher.

The cover sheet 5 is the base sheet 1
Since the resin body 4 filled in the concave portion 1g is adhered to the base sheet 1 before being cured, there is no hard unevenness on the inner surface side of the cover sheet 5 when the resin body 4 is cured. Since the surface of 5 does not have irregularities, the appearance is also good.

Next, a second embodiment will be described below with reference to FIGS. 9 to 13. This is different from the base sheet 1 of the first embodiment only in the structure of the base sheet 11 and the manufacturing method thereof, and the members having substantially the same functions are designated by the same reference numerals.

As shown in FIG. 9, the base sheet 11 includes three opaque center core sheets 11a, 11 having the same plate thickness.
c, 11d and a thin transparent oversheet 11e and 1
It is manufactured by laminating a sheet of adhesive layer 11b.

The first-layer center core sheet 11a shown in FIG. 9 (a) has an elliptical hole 11a ₁ slightly larger than the outer diameter of the coil 2 in the center, and the elliptic hole 11a ₁ has a facing distance. As shown in FIG. 10, two sandwiching pieces 11a ₂ projecting short and two sandwiching pieces 11a ₃ projecting long are laminated at their tip portions on four inner edge portions which are maximum and minimum and are orthogonal to each other. Each is formed by bending in the thickness direction. The adhesive layer 11b of the second layer shown in FIG. 3B is coated with an adhesive for adhering the center core sheet 11a of the first layer to the center core sheet 11c of the third layer below. It is a layer that is formed.
The third layer center core sheet 11c shown in FIG.
An elliptical hole 11c ₁ having the same size as the first-layer center core sheet 11a is provided in the center. The fourth-layer center core sheet 11d shown in FIG. 6 (d) has no holes. Same figure
The fifth-layer oversheet 11e shown in (e) has no holes.

FIG. 11 (a) is a sectional view showing a state in which the three sheets, the center core sheets 11c and 11d of the third to fifth layers and the over sheet 11e, are laminated by thermocompression bonding. Then, as shown in FIG. 11 (b), the the recess, i.e. the elliptical recess 11c ₁ of the third layer of the center core sheet 11c,
The coil 2 and the circuit board 3 are arranged. At this time, the board 3a of the circuit board 3 fits within the inner diameter of the coil 2. Next, as shown in FIG. 11 (c), an adhesive is applied to the third center core sheet 11c to form the second adhesive layer 11b.
After forming, the first center core sheet 11a is laminated and the adhesive layer 11b is cured, as shown in FIG. 11 (d). Then, as shown in FIG. 11 (d), the coil 2 has two shorter holding pieces of the center core sheet 11a.
Between 11a ₂ and the fourth layer of the center core sheet 11d, also the substrate 3a of the circuit board 3, as shown in FIG. 13, the longer the two holding pieces 11a ₃ and fourth layer center Core sheet 11d
Is sandwiched between the coil 2 and the circuit board 3 respectively.
Will be arranged in the recess 11f of the base sheet 11. FIG. 12 is a plan view of this state.

Then, as shown in FIG.
Is filled in the recess 11f of the base sheet 11 and flows into the gap between the recess 11f so as to cover the coil 2 and the circuit board 3.

Next, as shown in FIG. 6 (f), the base sheet 11 is attached to the center core sheet 11a of the first layer with an adhesive.
6 is applied, and as shown in (g) of the same figure, before the resin body 4 is cured, the same cover sheet 5 as in the first embodiment is polymerized on the base sheet 11 and is held together with the resin body 4 under pressure. The adhesive 6 is hardened and applied.

Then, in the same manner as in the first embodiment, a product of a standard size is divided and cut into individual products.

In addition to the effects of the first embodiment, in such a data carrier, as described above, the center core sheets 11c and 11d of the third to fifth layers and the oversheet 11 are provided.
First, the three sheets of e are laminated, and the coil 2 and the circuit board 3 are arranged in the concave portion, that is, the elliptic hole 11c ₁ of the center core sheet 11c of the third layer, and then the sandwiching piece 11a ₂ and the sandwiching piece 11a _{2 are} sandwiched. in more stacked first layer of the center core sheet 11a with the one-sided 11a _3, because to clamp the substrate 3a of the coil 2 and the circuit board 3 in the holding pieces 11a ₂ and clamping piece 11a _3, in turn each member It can be assembled simply by stacking it from the top, improving workability.

Further, the number of center core sheets to be laminated is four, which is smaller than the six in the first embodiment, and the thickness of the data carrier is thin.

In each of the first and second embodiments, the data communication means uses the coil 2 which transmits and receives by electromagnetic induction, but the antenna which transmits and receives by the microwave having a short wavelength is also used. Good. In this case, since the microwave has a short wavelength, the antenna 8 is a loop antenna formed of a one-turn conductor as shown in Fig. 14 (a), or a flexible printed circuit board as shown in Fig. 14 (b). A loop antenna in which a conductor pattern of one turn is printed on the film 8a, and further, an antenna such as a planar antenna in which a rectangular conductor pattern is printed on the same film 8a as shown in FIG. 7C, resonates and the coil 2 As described above, it is not necessary to wind the conductor many times, and the size can be reduced.

In each of the first and second embodiments, the thickness of each center core sheet constituting the base sheet and the cover sheet, depending on the shapes and the positional relationships of the data communication means 2 and the circuit board 3, The number of sheets, the shape, the number and position of the sandwiching pieces, the stacking order, and the like may be appropriately set.

Further, in the first and second embodiments, the adhesive 6 when the cover sheet 5 is applied to the base sheet 1 and the second adhesive layer 11b formed in the second embodiment.
Is coated with the adhesive only on one sheet side, but may be coated on both sides, and further, without depending on the adhesive,
You may adhere | attach by the method by thermocompression bonding, the method by ultrasonic welding, etc.

Further, in both the first and second embodiments, the resin body 4 does not necessarily have to be filled when it is used in a place where there is no problem with the environment such as vibration and oil.

Further, in both the first and second embodiments, the transparent oversheet laminated as a protective layer on the uppermost layers of the base sheet and the cover sheet may not be laminated if unnecessary.

[0047]

According to the first aspect of the present invention, the data communication means and the circuit board arranged in the concave portion of the base sheet are provided between the sandwiching piece provided on one of the center core sheets and another center core sheet. Since it is sandwiched, it is less likely that misalignment will occur in the recess, so that predetermined characteristics are realized and the reliability of quality is improved.

According to the second aspect of the present invention, since the sandwiching pieces bent in the stacking direction of the center core sheet are sandwiched by utilizing the bending elasticity, the data communication means and the circuit board are further recessed. It becomes difficult to cause misalignment inside.

According to the third aspect of the present invention, the data communication means and the circuit board are sandwiched by the sandwiching pieces provided on the center core sheet, and are not easily positioned in the recesses. When the resin body is filled in the gap with the recess, it can be done while the air inside the resin body is not entrained and the air inside is discharged, and the work is easy, and the specified characteristics are realized to ensure high quality reliability. Become.

According to the fourth aspect of the invention, since the antenna which is the data communication means transmits and receives microwaves having a short wavelength, even an antenna formed of a conductor of one turn resonates, and accordingly, It is not necessary to wind the conductor a large number of times like other data communication means such as a coil by electromagnetic induction, and the size can be reduced.

Further, according to a fifth aspect of the present invention, another center core is provided in which a recess is formed by a part of the center core sheets previously laminated, and the data communication means and the circuit board are arranged in the recess, and which has a sandwiching piece. If the sheets are further laminated, the data communication means and the circuit board are sandwiched by the sandwiching pieces, so that the members can be assembled simply by stacking them in order from above.

According to the sixth aspect of the present invention, the data communication means and the circuit board are sandwiched by the sandwiching pieces so that they are less likely to be misaligned, and when the cover sheet is attached to the base sheet, the inner surface of the cover sheet is covered. Since the resin body filled in the side is not cured and there is no hard unevenness on the surface, no unevenness is generated on the surface of the cover sheet and the appearance is improved.

[Brief description of drawings]

FIG. 1 is a sectional view showing a first embodiment of the present invention.

FIG. 2 is a plan view of each sheet constituting the above base sheet.

FIG. 3 is a cross-sectional view of a first-layer center core sheet that constitutes the above base sheet.

FIG. 4 is a cross-sectional view of a third layer center core sheet that constitutes the above base sheet.

FIG. 5 is a cross-sectional view showing an operation sequence of the above.

FIG. 6 is a plan view showing a state in which a coil and a circuit board are arranged in a concave portion of the above base sheet.

FIG. 7 is a perspective view showing a state in which the above sheets are stacked in a standard size.

FIG. 8 is an explanatory diagram showing an actual usage state of the above.

FIG. 9 is a plan view of each sheet constituting the base sheet of the second embodiment of the present invention.

FIG. 10 is a cross-sectional view of a first-layer center core sheet that constitutes the above base sheet.

FIG. 11 is a cross-sectional view showing an operation sequence of the above.

FIG. 12 is a plan view showing a state in which a coil and a circuit board are arranged in a concave portion of the above base sheet.

13 is a cross-sectional view taken along line XX of FIG.

FIG. 14 is a diagram showing an antenna (data communication means) for transmitting and receiving microwaves.

FIG. 15 is a cross-sectional view showing a work order of a conventional example.

[Explanation of symbols]

1 Base sheet 1g Recess 1a ₂ Holding piece 1c ₂ Holding piece 11c ₁ Recess (Elliptical hole in detail) 11a ₂ Holding piece 11a ₃ Holding piece 2 Coil (data communication means) 3 Circuit board 4 Resin body 5 Cover sheet 8 Antenna (data (Communication means)

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display area H05K 1/18 Q 8718-4E

Claims (6)

[Claims] 1. A data communication means, a circuit board for holding data obtained by the data communication means, and a recess for arranging the data communication means and the circuit board by laminating a plurality of center core sheets. In a data carrier that is equipped with a base sheet and a cover sheet that is attached to the base sheet and is used by being attached to a moving body, a sandwiching piece that sandwiches the data communication means and the circuit board with another center core sheet. Is a data carrier characterized by being provided on any of the center core sheets. 2. The sandwiching piece is bent and formed in a stacking direction of the center core sheet.
The listed data carrier. 3. The data carrier according to claim 1, wherein a resin body is filled in a gap between the data communication unit and the circuit board and the recess of the base sheet. 4. The data carrier according to claim 1, wherein the data communication means is an antenna for transmitting and receiving microwaves. 5. The base sheet is covered with a data communication means and a circuit board for holding data obtained by the data communication means, which are arranged in a recess formed in a base sheet in which a plurality of center core sheets are laminated. In the method of manufacturing a data carrier for attaching a sheet, the base sheet has a sandwiching piece after the data communication means and the circuit board are arranged in advance in a concave portion formed by a part of the center core sheet previously laminated. A data carrier characterized by further stacking the other center core sheet having, and sandwiching the data communication means and the circuit board between the sandwiching piece and the previously stacked center core sheet. Production method. 6. A data communication means and a circuit, wherein a data communication means and a circuit board for holding data obtained by the data communication means are arranged in a recess formed in a base sheet formed by laminating a plurality of center core sheets. In a method of manufacturing a data carrier in which a cover sheet is attached to a base sheet after a resin body is filled in a gap between a substrate and a recessed portion of the base sheet, a sandwiching piece provided on one of the center core sheets and another center sheet. The resin sheet is filled with the data communication means and the circuit board sandwiched between the core sheet and the cover sheet, and the cover sheet is attached to the base sheet before the resin sheet is cured. Data carrier manufacturing method.