JPH0812785A - Conductive thermoplastic resin sheet - Google Patents
Conductive thermoplastic resin sheetInfo
- Publication number
- JPH0812785A JPH0812785A JP6149634A JP14963494A JPH0812785A JP H0812785 A JPH0812785 A JP H0812785A JP 6149634 A JP6149634 A JP 6149634A JP 14963494 A JP14963494 A JP 14963494A JP H0812785 A JPH0812785 A JP H0812785A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- sheet
- parts
- thermoplastic resin
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 8
- 239000011231 conductive filler Substances 0.000 claims abstract description 19
- 239000002245 particle Substances 0.000 claims abstract description 16
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000011230 binding agent Substances 0.000 claims abstract description 11
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 238000002834 transmittance Methods 0.000 claims abstract description 8
- 230000000903 blocking effect Effects 0.000 abstract description 15
- 239000000945 filler Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 23
- 238000000576 coating method Methods 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000007666 vacuum forming Methods 0.000 description 2
- 229920008790 Amorphous Polyethylene terephthalate Polymers 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- PYVHTIWHNXTVPF-UHFFFAOYSA-N F.F.F.F.C=C Chemical compound F.F.F.F.C=C PYVHTIWHNXTVPF-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009503 electrostatic coating Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、導電性熱可塑性樹脂シ
ートに係り、特に金型で真空および／または圧空成形な
どにより成形するのに有用な両面に導電層を設けた半透
明の導電性熱可塑性樹脂シ−トに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive thermoplastic resin sheet, and more particularly to a semitransparent conductive sheet having conductive layers provided on both sides, which is useful for molding by vacuum and / or pressure molding with a mold. The present invention relates to a thermoplastic resin sheet.
【０００２】[0002]
【従来の技術】従来、導電性熱可塑性樹脂シートは、塩
化ビニル、ポリスチレン、ポリエチレンテレフタレー
ト、ポリカーボネートなどの熱可塑性樹脂シート（以
下、シートとする）に、カーボン微粉末や金属微粉末な
どの導電性フィラーを含む導電性塗料をグラビア、リバ
ース、マイヤーバーなどのコーティング方法により塗工
処理して導電層を設けて得られていた。2. Description of the Related Art Conventionally, conductive thermoplastic resin sheets are thermoplastic resin sheets such as vinyl chloride, polystyrene, polyethylene terephthalate, and polycarbonate (hereinafter referred to as sheets), and conductive carbon fine powder or metal fine powder. It has been obtained by applying a conductive coating material containing a filler by a coating method such as gravure, reverse or Meyer bar to provide a conductive layer.
【０００３】しかし、有機溶剤系の塗料は熱風などによ
って充分乾燥した場合でも有機溶剤は完全には除去され
ず、２〜３％は導電層に残存し、それが可塑剤の役をし
て導電層自体のガラス転移点を下げるだけでなく、残存
した溶剤はシート自体を劣化させ脆くするという問題が
あった。However, even if the organic solvent type coating material is sufficiently dried by hot air or the like, the organic solvent is not completely removed, and 2-3% remains in the conductive layer, which acts as a plasticizer and becomes conductive. There is a problem that not only the glass transition point of the layer itself is lowered, but also the remaining solvent deteriorates the sheet itself to make it brittle.
【０００４】有機溶剤系の塗料をシートの両面に塗工し
て導電層を設けた場合は、導電層同士が重なり、導電性
シートを巻き取る際の冷却温度と巻取張力の条件および
保管などの経時変化によっては、導電性シート同士のブ
ロッキングが起こり、ブロッキング程度が軽い場合でも
残留溶剤による影響で導電性シ−トが劣化しているとき
には、導電性シートが割れるという欠点があった。When a conductive layer is provided by coating both sides of a sheet with an organic solvent-based paint, the conductive layers overlap with each other, the cooling temperature and the winding tension condition when the conductive sheet is wound, and storage, etc. There is a drawback that the conductive sheets are blocked by the aging of the conductive sheet, and even if the blocking degree is light, the conductive sheet is cracked when the conductive sheet is deteriorated due to the influence of the residual solvent.
【０００５】このようなブロッキングを避ける一般的な
方法としては、導電層を完全に乾燥させ、導電性シート
を冷却した後に、可及的に弱い張力で導電性シ−トを巻
取ることであるが、乾燥温度が高いと導電性シートがネ
ックインする可能性があるため、乾燥条件には限界があ
った。A general method for avoiding such blocking is to completely dry the conductive layer, cool the conductive sheet, and then wind the conductive sheet with a tension as weak as possible. However, if the drying temperature is high, the conductive sheet may be necked in, so there is a limit to the drying conditions.
【０００６】また、導電層上にさらにガラス転移点の高
い樹脂を薄くコーティングする方法もあるが、この方法
はコストが上がるばかりでなく、導電性低下の原因にも
なった。There is also a method of thinly coating a resin having a higher glass transition point on the conductive layer, but this method not only increases the cost, but also causes a decrease in conductivity.
【０００７】さらに、塗料の配合には、一般に耐ブロッ
キング性を向上させるアンチブロッキング剤としてシリ
コン系およびシリカ系、あるいはプラスチックの微粒子
が使用されるが、シリコン系のものは電子部品などのト
レー用の導電性シートには後工程におけるハンダ付けの
阻害となるので使用できない。また、シリカ系のものは
摩擦抵抗が大きく導電性シートを金型で真空成形する
時、型離れが極端に悪くなるため不適当である。前記プ
ラスチックの微粒子としては、一般にはポリエチレンが
使用されるが、添加量が少ないと効果がなく、一定量を
超えると成形時の熱によってポリエチレンが１２０℃で
造膜して導電層をカバーするため、導電性の低下を招く
という不利があった。Further, in the formulation of the coating material, generally, silicon-based and silica-based or fine particles of plastic are used as an anti-blocking agent for improving the blocking resistance. The silicon-based one is used for trays of electronic parts and the like. It cannot be used for the conductive sheet because it hinders soldering in the subsequent process. Further, silica-based materials are not suitable because the frictional resistance is large and the mold release becomes extremely bad when vacuum-molding a conductive sheet with a mold. Polyethylene is generally used as the fine particles of the plastic, but if the addition amount is small, it is not effective, and if the amount exceeds a certain amount, the heat of molding causes the polyethylene to form a film at 120 ° C. to cover the conductive layer. However, there is a disadvantage that the conductivity is lowered.
【０００８】また、図１に示すような絞り深さが２０ｍ
ｍ以上で複雑な形状の部品用のトレーを真空成形するよ
うな場合は、剥離抵抗が大きくなるので、型離れが悪く
なることがあり、特に成形品が電子部品などのトレーで
あるときにはシリコン系の離型剤は使用できず、歩留ま
りも極端に悪くなる場合があった。Further, the aperture depth as shown in FIG. 1 is 20 m.
In the case of vacuum forming a tray for parts having a complicated shape of m or more, the peeling resistance becomes large, so the mold release may deteriorate. Especially when the molded product is a tray for electronic parts, etc. However, the release agent could not be used, and the yield could be extremely poor.
【０００９】[0009]
【発明が解決しようとする課題】本発明は、上記した従
来の各種問題を解決して、導電性シートのブロッキング
を防ぐと共に成形時の型離れを改善できる導電性シート
の提供を課題とする。SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned various problems of the prior art and to provide a conductive sheet capable of preventing blocking of the conductive sheet and improving mold release at the time of molding.
【００１０】[0010]
【課題を解決するための手段】本発明は、従来の課題を
解決するもので、その要旨とするところは、 １）バインダー １００重量部、 ２）導電性フィラー（粒径０．１〜０．５μｍ） １５〜３５重量部、 ３）４フッ化エチレン（導電性フィラーとほぼ同一粒径）２５〜６５重量部、 からなる組成の連続した導電層を両面に設けた導電性シ
ートであって、表面固有抵抗値が１０4 〜１０8 Ωの範
囲、全光線透過率が１０〜５０％の範囲である導電性シ
ートにある。Means for Solving the Problems The present invention is to solve the conventional problems, and the gist thereof is: 1) 100 parts by weight of binder, 2) conductive filler (particle size 0.1 to 0. 5 μm) 15 to 35 parts by weight, 3) tetrafluoroethylene (approximately the same particle size as the conductive filler) 25 to 65 parts by weight, a conductive sheet having a continuous conductive layer having a composition of The conductive sheet has a surface resistivity of 10 4 to 10 8 Ω and a total light transmittance of 10 to 50%.
【００１１】以下、本発明を詳細に説明する。本発明の
導電性シートは、シートの両面に導電層を設けたもので
ある。このシートに用いられる樹脂としては、塩化ビニ
ル、ポリスチレン、アモルファス−ポリエチレンテレフ
タレート、ポリカーボネート樹脂などのような透明性の
よい樹脂が挙げられる。また、必要に応じてシートの表
面にコロナ処理やプラズマ処理などを施してもよい。The present invention will be described in detail below. The conductive sheet of the present invention has a conductive layer provided on both sides of the sheet. Examples of the resin used in this sheet include resins having good transparency such as vinyl chloride, polystyrene, amorphous-polyethylene terephthalate, and polycarbonate resin. Further, if necessary, the surface of the sheet may be subjected to corona treatment, plasma treatment, or the like.
【００１２】上記導電層は、バインダー、導電性フィラ
ー、４フッ化エチレンからなる組成でシートの両面に連
続して設けられている。バインダーは、シートと接着力
の大きいものの中から選ぶことが好ましく、例えば、ウ
レタン系、ポリエステル系、アクリル系、エチレン−酢
酸ビニル系、ポバール系などが挙げられる。The conductive layer is made of a composition of a binder, a conductive filler, and tetrafluoroethylene, and is continuously provided on both sides of the sheet. The binder is preferably selected from those having a large adhesive force to the sheet, and examples thereof include urethane-based, polyester-based, acrylic-based, ethylene-vinyl acetate-based, and Poval-based binders.
【００１３】導電性フィラーは、カーボンや金属物など
が挙げられ、導電性フィラーは、バインダー１００重量
部に対して１５〜３５重量部の範囲、好ましくは、２０
〜３０重量部の範囲である。この範囲が１５重量部未満
の場合には、必要な導電性が得られず、３５重量部を超
える場合には、全光線透過率が１０％未満になり半透明
な導電性シートが得られないので好ましくない。また、
前記導電性フィラーの粒径については、０．１〜０．５
μｍの範囲、好ましくは０．２〜０．４μｍの範囲であ
る。この粒径が０．１μｍの未満の場合には、導電層の
中に埋没して表層に存在しなくなり、ブロッキング性お
よび表面固有抵抗値が所望の数値にすることができず、
０．５μｍを超える場合には、全光線透過率が１０％未
満となるので好ましくない。Examples of the conductive filler include carbon and metallic materials, and the conductive filler is in the range of 15 to 35 parts by weight, preferably 20 parts by weight with respect to 100 parts by weight of the binder.
-30 parts by weight. When this range is less than 15 parts by weight, the required conductivity cannot be obtained, and when it exceeds 35 parts by weight, the total light transmittance is less than 10% and a semitransparent conductive sheet cannot be obtained. It is not preferable. Also,
The particle size of the conductive filler is 0.1 to 0.5.
It is in the range of μm, preferably in the range of 0.2 to 0.4 μm. When the particle size is less than 0.1 μm, the particles are buried in the conductive layer and do not exist in the surface layer, so that the blocking property and the surface specific resistance cannot be set to desired values,
When it exceeds 0.5 μm, the total light transmittance is less than 10%, which is not preferable.
【００１４】導電性層を構成する４フッ化エチレンは、
バインダー１００重量部に対して２５〜６５重量部の範
囲、好ましくは、４０〜５０重量部の範囲である。この
範囲が２５重量部未満の場合には、その導電層の表面に
現れる量が少ないことからブロッキング性および金型剥
離性に不具合が生じ、６５重量部を超える場合には、導
電性フィラーの繋がりを阻害し表面固有抵抗値が低下し
全光線透過率も低下するため好ましくない。The tetrafluoroethylene constituting the conductive layer is
It is in the range of 25 to 65 parts by weight, preferably in the range of 40 to 50 parts by weight, based on 100 parts by weight of the binder. When this range is less than 25 parts by weight, the amount that appears on the surface of the conductive layer is small, so that there is a problem in blocking property and mold releasability, and when it exceeds 65 parts by weight, the connection of the conductive filler is caused. And the surface specific resistance value is lowered and the total light transmittance is also lowered, which is not preferable.
【００１５】また、４フッ化エチレンの粒径は、導電性
フィラーとほぼ同一であることが必要であり、具体的に
は導電性フィラーの粒径に対して±０．１μｍ程度の
差、好ましくは同一粒径であることが望ましい。Further, the particle size of tetrafluoroethylene needs to be almost the same as that of the conductive filler. Specifically, a difference of about ± 0.1 μm with respect to the particle size of the conductive filler is preferable. Preferably have the same particle size.
【００１６】この４フッ化エチレンの粒径は、導電性フ
ィラーの粒径より小さい場合には、導電層の中に埋没し
てしまい表層に存在しなくなり、そのためブロッキング
性および金型剥離性に不具合が起こるという問題があ
る。また、４フッ化エチレンの粒径が導電性フィラーよ
り大きい場合には、導電性フィラーの導電性を阻害し表
面固有抵抗値に不具合が生じ、全光線透過率も１０％未
満となるので好ましくない。If the particle size of the tetrafluoroethylene is smaller than the particle size of the conductive filler, it will be buried in the conductive layer and will not exist in the surface layer, so that the blocking property and the mold releasability will be impaired. There is a problem that occurs. Further, when the particle size of tetrafluoroethylene is larger than the conductive filler, the conductivity of the conductive filler is obstructed to cause a problem in the surface specific resistance value, and the total light transmittance becomes less than 10%, which is not preferable. .
【００１７】本発明では、上記組成からなる塗料がシー
トの両面に導電層として設けられるが、この導電層を設
ける方法としては、従来公知のグラビア、リバース、マ
イヤーバー、はけ塗り、スプレー塗装、静電塗装、フロ
ーコーティング、浸漬塗装、ローラー塗装、共押出、ラ
ミネート、転写などが挙げられる。In the present invention, the coating material having the above composition is provided as a conductive layer on both surfaces of the sheet. As a method for providing the conductive layer, conventionally known gravure, reverse, Meyer bar, brush coating, spray coating, Electrostatic coating, flow coating, dip coating, roller coating, coextrusion, laminating, transfer and the like can be mentioned.
【００１８】また、本発明の導電性シートは、表面固有
抵抗値が１０4 〜１０8 Ωの範囲であり、この範囲が１
０4 Ωより低いと電子部品等の端子が導通し、ショート
するという問題があり、１０8 Ωより高いと容器などの
移動に伴う振動などの摩擦により静電気が帯電し、電子
部品の回路が破壊されるという不利があるので好ましく
ない。The conductive sheet of the present invention has a surface specific resistance value in the range of 10 4 to 10 8 Ω, and this range is 1
If it is lower than 0 4 Ω, there is a problem that the terminals of electronic parts will conduct and short-circuit. If it is higher than 10 8 Ω, static electricity will be charged by the friction such as vibration caused by the movement of the container and the circuit of the electronic parts will be destroyed. It is not preferable because it is disadvantageous.
【００１９】[0019]
【作用】バインダーと導電性フィラーと非移行性で非粘
着性、摩擦係数の低い４フッ化エチレンとからなる塗料
で、シートの両面に導電層を設けることにより型離れに
優れた導電性シートを得ることができる。また、ブロッ
キング性についても導電性シートの導電層表面に非粘着
性で常温では軟化することのない４フッ化エチレンを一
定量介在させることにより、導電性シートと導電性シー
トの間に隙間ができ、ブロッキング性が改善される。[Function] A conductive sheet excellent in mold release is provided by providing a conductive layer on both sides of a sheet with a coating composed of a binder, a conductive filler, non-migrating, non-adhesive and low-friction ethylene tetrafluoride. Obtainable. Regarding the blocking property, a certain amount of non-adhesive tetrafluoroethylene that does not soften at room temperature is interposed on the surface of the conductive layer of the conductive sheet to form a gap between the conductive sheets. The blocking property is improved.
【００２０】[0020]
実施例 ０．５ｔの硬質塩ビシートに、バインダーとしてウレタ
ン、導電性フィラーとしてカーボン、固形分８％の導電
性塗料に表１の各配合で４フッ化エチレンを添加し、硬
質塩ビシートの両面にウエットで約１０ｇ／ｍ2 、グラ
ビアロールにより両面をコーティングし、８０℃で３０
秒間、乾燥させた後、２００ｍを一定の張力で巻き取っ
た。導電性硬質塩ビシートのブロッキング性を確認する
ため、巻き取った状態で４５℃の条件で１ヶ月間保管
し、ブロッキング性を確認した。その結果、シートの偏
肉等の影響で極端に圧力がかかる部分についても異常は
認められなかった。また、図１に示す金型で真空成形し
た場合でも良好な剥離性が得られた。Example To a hard vinyl chloride sheet of 0.5 t, urethane was used as a binder, carbon was used as a conductive filler, and tetrafluoroethylene was added to each of the formulations shown in Table 1 in a conductive paint having a solid content of 8%. Wet about 10g / m 2 , coat both sides with gravure roll,
After drying for 2 seconds, 200 m was wound up with a constant tension. In order to confirm the blocking property of the conductive hard vinyl chloride sheet, the blocking property was confirmed by storing the film in a wound state at 45 ° C. for 1 month. As a result, no abnormality was found in the portion where the pressure was extremely applied due to the uneven thickness of the sheet. Also, good peelability was obtained even when vacuum molding was performed using the mold shown in FIG.
【００２１】[0021]
【表１】 [Table 1]
【００２２】比較例１ 次に本発明の組成から外れた場合の物性の評価を上記実
施例と同様に行った結果を表２に示した。Comparative Example 1 Next, the results of the evaluation of the physical properties when the composition deviates from the composition of the present invention in the same manner as in the above-mentioned Examples are shown in Table 2.
【００２３】[0023]
【表２】 表１および表２中、耐ブロッキング性については、二枚
の導電性シートを重ねて導電層同士を９０℃で１秒熱シ
ールし、ブロッキング状態を確認した。○は良好を示
す、△は多少表面が取られた、×は接着してしまった、
である。 熱シール条件：６Kg/cm2、１秒で行った。 表面固有抵抗値：テスターで２点間（１５mm）測定し、
○は１０4 〜１０8 Ωの範囲内、×は範囲外である。 全光線透過率：ＪＩＳ Ｋ ７１０５により測定し、○
は１０〜５０％の範囲内、×は範囲外である。 金型剥離性：図１の型で真空成形した場合の剥離性で、
○は問題なし、△は多少抵抗が見られた、×はかなり抵
抗が見られた、である。[Table 2] Regarding the blocking resistance in Tables 1 and 2, the blocking state was confirmed by stacking two conductive sheets and heat-sealing the conductive layers at 90 ° C. for 1 second. ○ means good, △ means that the surface is slightly removed, × means that it has adhered,
Is. Heat-sealing conditions: 6 kg / cm 2 , 1 second. Surface resistivity: Measured between 2 points (15mm) with a tester,
◯ is in the range of 10 4 to 10 8 Ω, and x is out of the range. Total light transmittance: measured according to JIS K 7105, ○
Is in the range of 10 to 50%, and x is out of the range. Mold releasability: The releasability when vacuum-molded with the mold of Fig. 1,
○ means no problem, △ means that some resistance was observed, and × means that resistance was considerably observed.
【００２４】[0024]
【発明の効果】上記実施例から明らかなように、バイン
ダーと導電性フィラーと４フッ化エチレンとからなる塗
料で、シートの両面に導電層を設けることによって導電
層の摩擦摩耗物性の改善と同時に非粘着効果が得られる
ばかりでなく、導電性シートの表面をマット状にする結
果となり、ブロッキング性の改善に大きな効果が得られ
た。また、４フッ化エチレンの粒径を導電性フィラーに
ほぼ同一にすることによって透明性を損なうことなく、
導電性についても大きな低下は認められなかった。さら
に４フッ化エチレンの非粘着特性および低摩耗性の効果
により、真空成形時の型離れが向上し歩留が上がった。As is apparent from the above-mentioned examples, a coating material comprising a binder, a conductive filler and tetrafluoroethylene is provided with conductive layers on both sides of the sheet to improve the friction and wear properties of the conductive layer at the same time. Not only the non-adhesive effect was obtained, but the surface of the conductive sheet was made into a matte shape, and a great effect was obtained in improving the blocking property. Further, by making the particle size of tetrafluoroethylene almost the same as that of the conductive filler, the transparency is not impaired,
No significant decrease was observed in the conductivity. Furthermore, due to the effect of non-adhesive property and low wear property of tetrafluoroethylene, the mold release at the time of vacuum forming was improved and the yield was increased.
【図１】実施例で使用した金型を示すもので、（ａ）は
平面図、（ｂ）はその縦断面図である。1A and 1B show a mold used in Examples, where FIG. 1A is a plan view and FIG. 1B is a longitudinal sectional view thereof.
Claims (1)
可塑性樹脂シートであって、表面固有抵抗値が１０4 〜
１０8 Ωの範囲で、全光線透過率が１０〜５０％の範囲
であることを特徴とする導電性熱可塑性樹脂シート。1. 1) 100 parts by weight of binder, 2) 15-35 parts by weight of conductive filler (particle size 0.1 to 0.5 μm), 3) tetrafluoroethylene (particle size almost the same as conductive filler). A conductive thermoplastic resin sheet having a continuous conductive layer having a composition of 25 to 65 parts by weight on both sides and having a surface specific resistance value of 10 4 to
A conductive thermoplastic resin sheet having a total light transmittance of 10 to 50% in a range of 10 8 Ω.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14963494A JP3401327B2 (en) | 1994-06-30 | 1994-06-30 | Conductive thermoplastic resin sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14963494A JP3401327B2 (en) | 1994-06-30 | 1994-06-30 | Conductive thermoplastic resin sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0812785A true JPH0812785A (en) | 1996-01-16 |
| JP3401327B2 JP3401327B2 (en) | 2003-04-28 |
Family
ID=15479519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14963494A Expired - Lifetime JP3401327B2 (en) | 1994-06-30 | 1994-06-30 | Conductive thermoplastic resin sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3401327B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005254584A (en) * | 2004-03-11 | 2005-09-22 | Tsutsunaka Plast Ind Co Ltd | Conductive polyester resin sheet |
| JP2011012210A (en) * | 2009-07-03 | 2011-01-20 | Nof Corp | Conductive hard coat film and antireflection film |
| JP2013116607A (en) * | 2011-12-05 | 2013-06-13 | Shin Etsu Polymer Co Ltd | Conductive sheet for embossed carrier tape and embossed carrier tape |
| US12617128B2 (en) | 2019-10-16 | 2026-05-05 | Kobayashi & Co., Ltd. | Release film and method for manufacturing release film |
-
1994
- 1994-06-30 JP JP14963494A patent/JP3401327B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005254584A (en) * | 2004-03-11 | 2005-09-22 | Tsutsunaka Plast Ind Co Ltd | Conductive polyester resin sheet |
| JP2011012210A (en) * | 2009-07-03 | 2011-01-20 | Nof Corp | Conductive hard coat film and antireflection film |
| JP2013116607A (en) * | 2011-12-05 | 2013-06-13 | Shin Etsu Polymer Co Ltd | Conductive sheet for embossed carrier tape and embossed carrier tape |
| US12617128B2 (en) | 2019-10-16 | 2026-05-05 | Kobayashi & Co., Ltd. | Release film and method for manufacturing release film |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3401327B2 (en) | 2003-04-28 |
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