JPH0812821A - Electrical insulating composition - Google Patents
Electrical insulating compositionInfo
- Publication number
- JPH0812821A JPH0812821A JP6173495A JP17349594A JPH0812821A JP H0812821 A JPH0812821 A JP H0812821A JP 6173495 A JP6173495 A JP 6173495A JP 17349594 A JP17349594 A JP 17349594A JP H0812821 A JPH0812821 A JP H0812821A
- Authority
- JP
- Japan
- Prior art keywords
- density
- polyisoprene
- low
- weight
- density polyethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 25
- 229920001195 polyisoprene Polymers 0.000 claims abstract description 18
- 229920001684 low density polyethylene Polymers 0.000 claims description 22
- 239000004702 low-density polyethylene Substances 0.000 claims description 22
- 230000015556 catabolic process Effects 0.000 abstract description 20
- 238000000034 method Methods 0.000 abstract description 11
- 239000011810 insulating material Substances 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 2
- 239000003963 antioxidant agent Substances 0.000 description 8
- 238000004132 cross linking Methods 0.000 description 7
- -1 azo compound Chemical class 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 230000003078 antioxidant effect Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 238000002076 thermal analysis method Methods 0.000 description 4
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 3
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002978 peroxides Chemical class 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 2
- VETPHHXZEJAYOB-UHFFFAOYSA-N 1-n,4-n-dinaphthalen-2-ylbenzene-1,4-diamine Chemical compound C1=CC=CC2=CC(NC=3C=CC(NC=4C=C5C=CC=CC5=CC=4)=CC=3)=CC=C21 VETPHHXZEJAYOB-UHFFFAOYSA-N 0.000 description 2
- XDOFQFKRPWOURC-UHFFFAOYSA-N 16-methylheptadecanoic acid Chemical compound CC(C)CCCCCCCCCCCCCCC(O)=O XDOFQFKRPWOURC-UHFFFAOYSA-N 0.000 description 2
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 2
- XOUQAVYLRNOXDO-UHFFFAOYSA-N 2-tert-butyl-5-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1 XOUQAVYLRNOXDO-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- UTGQNNCQYDRXCH-UHFFFAOYSA-N N,N'-diphenyl-1,4-phenylenediamine Chemical compound C=1C=C(NC=2C=CC=CC=2)C=CC=1NC1=CC=CC=C1 UTGQNNCQYDRXCH-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical class [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 229920003020 cross-linked polyethylene Polymers 0.000 description 2
- 239000004703 cross-linked polyethylene Substances 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000002530 phenolic antioxidant Substances 0.000 description 2
- 229910052845 zircon Inorganic materials 0.000 description 2
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 2
- HGTUJZTUQFXBIH-UHFFFAOYSA-N (2,3-dimethyl-3-phenylbutan-2-yl)benzene Chemical group C=1C=CC=CC=1C(C)(C)C(C)(C)C1=CC=CC=C1 HGTUJZTUQFXBIH-UHFFFAOYSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- ROLAGNYPWIVYTG-UHFFFAOYSA-N 1,2-bis(4-methoxyphenyl)ethanamine;hydrochloride Chemical compound Cl.C1=CC(OC)=CC=C1CC(N)C1=CC=C(OC)C=C1 ROLAGNYPWIVYTG-UHFFFAOYSA-N 0.000 description 1
- LKLLNYWECKEQIB-UHFFFAOYSA-N 1,3,5-triazinane Chemical compound C1NCNCN1 LKLLNYWECKEQIB-UHFFFAOYSA-N 0.000 description 1
- APTGHASZJUAUCP-UHFFFAOYSA-N 1-n,4-n-di(octan-2-yl)benzene-1,4-diamine Chemical compound CCCCCCC(C)NC1=CC=C(NC(C)CCCCCC)C=C1 APTGHASZJUAUCP-UHFFFAOYSA-N 0.000 description 1
- PWNBRRGFUVBTQG-UHFFFAOYSA-N 1-n,4-n-di(propan-2-yl)benzene-1,4-diamine Chemical compound CC(C)NC1=CC=C(NC(C)C)C=C1 PWNBRRGFUVBTQG-UHFFFAOYSA-N 0.000 description 1
- XGIDEUICZZXBFQ-UHFFFAOYSA-N 1h-benzimidazol-2-ylmethanethiol Chemical compound C1=CC=C2NC(CS)=NC2=C1 XGIDEUICZZXBFQ-UHFFFAOYSA-N 0.000 description 1
- HBMFCGVCUHLQPN-UHFFFAOYSA-N 1h-benzimidazol-2-ylmethanethiol;zinc Chemical compound [Zn].C1=CC=C2NC(CS)=NC2=C1 HBMFCGVCUHLQPN-UHFFFAOYSA-N 0.000 description 1
- JFGVTUJBHHZRAB-UHFFFAOYSA-N 2,6-Di-tert-butyl-1,4-benzenediol Chemical compound CC(C)(C)C1=CC(O)=CC(C(C)(C)C)=C1O JFGVTUJBHHZRAB-UHFFFAOYSA-N 0.000 description 1
- OLQFXOWPTQTLDP-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCO OLQFXOWPTQTLDP-UHFFFAOYSA-N 0.000 description 1
- BMFMTNROJASFBW-UHFFFAOYSA-N 2-(furan-2-ylmethylsulfinyl)acetic acid Chemical compound OC(=O)CS(=O)CC1=CC=CO1 BMFMTNROJASFBW-UHFFFAOYSA-N 0.000 description 1
- VFBJXXJYHWLXRM-UHFFFAOYSA-N 2-[2-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]ethylsulfanyl]ethyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCSCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 VFBJXXJYHWLXRM-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- XBWSIEWHSVIKTB-UHFFFAOYSA-N 3,5-ditert-butyl-4-[(2,6-ditert-butyl-4-hydroxyphenyl)methyl]phenol Chemical compound CC(C)(C)C1=CC(O)=CC(C(C)(C)C)=C1CC1=C(C(C)(C)C)C=C(O)C=C1C(C)(C)C XBWSIEWHSVIKTB-UHFFFAOYSA-N 0.000 description 1
- UIGULSHPWYAWSA-UHFFFAOYSA-N 3-amino-4-[(2-methylpropan-2-yl)oxy]-4-oxobutanoic acid;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)C(N)CC(O)=O UIGULSHPWYAWSA-UHFFFAOYSA-N 0.000 description 1
- MDWVSAYEQPLWMX-UHFFFAOYSA-N 4,4'-Methylenebis(2,6-di-tert-butylphenol) Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 MDWVSAYEQPLWMX-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- UDQCDDZBBZNIFA-UHFFFAOYSA-N 4-methyl-1,3-dihydrobenzimidazole-2-thione Chemical compound CC1=CC=CC2=C1NC(=S)N2 UDQCDDZBBZNIFA-UHFFFAOYSA-N 0.000 description 1
- IELAVJDOWOPAMD-UHFFFAOYSA-N 4-n-hexylbenzene-1,4-diamine Chemical compound CCCCCCNC1=CC=C(N)C=C1 IELAVJDOWOPAMD-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- LIQDVINWFSWENU-UHFFFAOYSA-K aluminum;prop-2-enoate Chemical compound [Al+3].[O-]C(=O)C=C.[O-]C(=O)C=C.[O-]C(=O)C=C LIQDVINWFSWENU-UHFFFAOYSA-K 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- ULBTUVJTXULMLP-UHFFFAOYSA-N butyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCCC ULBTUVJTXULMLP-UHFFFAOYSA-N 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- TXTCTCUXLQYGLA-UHFFFAOYSA-L calcium;prop-2-enoate Chemical compound [Ca+2].[O-]C(=O)C=C.[O-]C(=O)C=C TXTCTCUXLQYGLA-UHFFFAOYSA-L 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229920003211 cis-1,4-polyisoprene Polymers 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 150000001923 cyclic compounds Chemical class 0.000 description 1
- UQLDLKMNUJERMK-UHFFFAOYSA-L di(octadecanoyloxy)lead Chemical compound [Pb+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O UQLDLKMNUJERMK-UHFFFAOYSA-L 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- AFZSMODLJJCVPP-UHFFFAOYSA-N dibenzothiazol-2-yl disulfide Chemical compound C1=CC=C2SC(SSC=3SC4=CC=CC=C4N=3)=NC2=C1 AFZSMODLJJCVPP-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- AFSIMBWBBOJPJG-UHFFFAOYSA-N ethenyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC=C AFSIMBWBBOJPJG-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- VLHZUYUOEGBBJB-UHFFFAOYSA-N hydroxy stearic acid Natural products OCCCCCCCCCCCCCCCCCC(O)=O VLHZUYUOEGBBJB-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- CDOSHBSSFJOMGT-UHFFFAOYSA-N linalool Chemical compound CC(C)=CCCC(C)(O)C=C CDOSHBSSFJOMGT-UHFFFAOYSA-N 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- DZBOAIYHPIPCBP-UHFFFAOYSA-L magnesium;2-methylprop-2-enoate Chemical compound [Mg+2].CC(=C)C([O-])=O.CC(=C)C([O-])=O DZBOAIYHPIPCBP-UHFFFAOYSA-L 0.000 description 1
- DWLAVVBOGOXHNH-UHFFFAOYSA-L magnesium;prop-2-enoate Chemical compound [Mg+2].[O-]C(=O)C=C.[O-]C(=O)C=C DWLAVVBOGOXHNH-UHFFFAOYSA-L 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- JFOJYGMDZRCSPA-UHFFFAOYSA-J octadecanoate;tin(4+) Chemical compound [Sn+4].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O JFOJYGMDZRCSPA-UHFFFAOYSA-J 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 150000002898 organic sulfur compounds Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- WBHHMMIMDMUBKC-XLNAKTSKSA-N ricinelaidic acid Chemical compound CCCCCC[C@@H](O)C\C=C\CCCCCCCC(O)=O WBHHMMIMDMUBKC-XLNAKTSKSA-N 0.000 description 1
- 229960003656 ricinoleic acid Drugs 0.000 description 1
- FEUQNCSVHBHROZ-UHFFFAOYSA-N ricinoleic acid Natural products CCCCCCC(O[Si](C)(C)C)CC=CCCCCCCCC(=O)OC FEUQNCSVHBHROZ-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
- 229960002447 thiram Drugs 0.000 description 1
- GRPURDFRFHUDSP-UHFFFAOYSA-N tris(prop-2-enyl) benzene-1,2,4-tricarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C(C(=O)OCC=C)=C1 GRPURDFRFHUDSP-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- XKMZOFXGLBYJLS-UHFFFAOYSA-L zinc;prop-2-enoate Chemical compound [Zn+2].[O-]C(=O)C=C.[O-]C(=O)C=C XKMZOFXGLBYJLS-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、電気絶縁用、特に高圧
ケーブル、及びこれらの接続部、端末部等の高圧電気絶
縁部材として好適な電気絶縁性組成物に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrically insulating composition suitable for electrical insulation, particularly a high voltage cable, and a high voltage electrical insulating member such as a connecting portion or a terminal portion thereof.
【0002】[0002]
【従来技術および発明が解決しようとする課題】最近、
電力ケーブルに要求される電圧階級は年々大きく上昇
し、より高度な信頼性が求められている。かかる電力ケ
ーブルの電気絶縁性組成物として、従来まで低密度ポリ
エチレン、または架橋ポリエチレンが汎用されていた。
ところで、当該電力ケーブルには落雷等の事故により、
瞬間的ではあるが、大きな電圧が負荷されることがあ
る。このため、電力ケーブルに用いられる電気絶縁材料
にはこのような事故に対応する強い抵抗力を有すること
が重要となり、衝撃破壊電圧特性(インパルス破壊特
性)が重要な特性となる。2. Description of the Prior Art Recently,
The voltage class required for power cables is increasing year by year, and higher reliability is required. Conventionally, low-density polyethylene or crosslinked polyethylene has been widely used as an electrically insulating composition for such power cables.
By the way, due to an accident such as a lightning strike on the power cable,
A large voltage may be loaded, although momentarily. Therefore, it is important for the electric insulating material used for the power cable to have a strong resistance to such an accident, and the impact breakdown voltage characteristic (impulse breakdown characteristic) is an important characteristic.
【0003】また、大容量の電力ケーブルの運転時にお
ける、導体の発熱により90℃程度の高温となり、これ
ら大容量電力ケーブルの絶縁層は、かかる高温度におい
てもインパルス破壊特性が良好なことが要求される。す
なわち、該電力ケーブルの事故時においては、絶縁層が
90℃付近の高温の状態においても前記したインパルス
破壊特性に優れることが必要となる。Further, when a large capacity power cable is operated, the heat generated by the conductor causes a high temperature of about 90 ° C., and the insulating layer of these large capacity power cables is required to have good impulse breakdown characteristics even at such a high temperature. To be done. That is, at the time of an accident of the power cable, it is necessary that the insulating layer has excellent impulse breakdown characteristics even in a high temperature state of about 90 ° C.
【0004】しかしながら、従来までの低密度ポリエチ
レン、または架橋ポリエチレンの絶縁層とする電力ケー
ブルはインパルス破壊特性、特に90℃のおけるインパ
ルス破壊特性が必ずしも十分とは言えなかった。However, conventional power cables having an insulating layer of low-density polyethylene or cross-linked polyethylene are not always satisfactory in impulse breakdown characteristics, particularly at 90 ° C.
【0005】本発明者らは、インパルス破壊特性が良好
な電気絶縁用、特に高圧ケーブル、及びこれらの接続
部、端末部等の高圧電気絶縁部材として好適な電気絶縁
性組成物について鋭意研究を重ねた結果、低密度ポリエ
チレンに対して、3,4−ポリイソプレンを配合した組
成物は、高度な電気特性を有し、特にインパルス破壊特
性、及び高温下におけるインパルス破壊特性が極めて良
好であることを見出し、本発明するに至った。The inventors of the present invention have conducted extensive studies on electrical insulating compositions having good impulse breakdown characteristics, particularly high voltage cables, and electrically insulating compositions suitable as high voltage electrical insulating members for their connecting parts, terminal parts and the like. As a result, it was found that the composition in which 3,4-polyisoprene was blended with low-density polyethylene had a high degree of electrical characteristics, and particularly had extremely good impulse breakdown characteristics and impulse breakdown characteristics at high temperatures. Heading out, the present invention was completed.
【0006】[0006]
【課題を解決するための手段】前記課題は、低密度ポリ
エチレン100重量部に対して、3,4−ポリイソプレ
ンを3〜50重量部配合してなることを特徴とする電気
絶縁性組成物によって解決される。好ましくはJIS
K6760によって測定されたメルトインデックス及び
密度がそれぞれ0.2〜3.0g/10min、0.9
15〜0.925g/cm3 である低密度ポリエチレン
100重量部に対して、3,4−ポリイソプレンを3〜
50重量部配合してなることを特徴とする電気絶縁性組
成物によって解決される。The above object is achieved by an electrically insulating composition characterized in that 3 to 50 parts by weight of 3,4-polyisoprene are blended with 100 parts by weight of low-density polyethylene. Will be resolved. Preferably JIS
The melt index and the density measured by K6760 are 0.2 to 3.0 g / 10 min and 0.9, respectively.
3 to 4 parts of 3,4-polyisoprene are added to 100 parts by weight of low density polyethylene of 15 to 0.925 g / cm 3.
It is solved by an electrically insulating composition characterized by being mixed in an amount of 50 parts by weight.
【0007】[0007]
【作用】低密度ポリエチレン100重量部に対して、
3,4−ポリイソプレンを3〜50重量部配合した組成
物とすることで、高度な電気特性を有し、特にインパル
ス破壊特性、及び高温下におけるインパンルス破壊特性
が極めて良好となる。Function: To 100 parts by weight of low density polyethylene,
By using a composition containing 3 to 50 parts by weight of 3,4-polyisoprene, the composition has high electrical properties, and in particular, the impulse rupture property and the impulsive rupture property at high temperature become extremely good.
【0008】次に本発明で用いる材料について詳細に説
明する。本発明に用いる低密度ポリエチレンとしては、
いわゆる高圧法による低密度ポリエチレンであって、例
えばエチレンを酸素、ペルオキシド、アゾ化合物等の開
始剤により1000〜2000気圧程度、150〜25
0℃程度の条件下にて重合されたものである。Next, the materials used in the present invention will be described in detail. As the low density polyethylene used in the present invention,
A low-density polyethylene by a so-called high-pressure method, for example, ethylene is added with an initiator such as oxygen, peroxide, and azo compound to about 1000 to 2000 atm, 150 to 25 atm.
It was polymerized under the condition of about 0 ° C.
【0009】本発明に用いる低密度ポリエチレンは、い
わゆる高圧法による低密度ポリエチレンであれば、公知
の低密度ポリエチレンを用いることができるが、JIS
K6760によって測定されたメルトインデックス
(以下、単にメルトインデックスという)が0.1〜
4.0、好ましくは0.2〜3.0、就中0.8〜1.
3g/10min、JIS K6760によって測定し
た密度(以下、単に密度という)が0.905〜0.9
30、好ましくは0.915〜0.925g/cm3 就
中0.918〜0.922g/cm3 である。メルトイ
ンデックスが0.1g/10minよりも小さい、また
は4.0g/10minよりも大きいものは成型加工性
に劣る傾向にある。また、密度が0.905g/cm3
よりも小さいもの、0.930g/cm3 よりも大きい
ものはインパルス破壊強度に劣る傾向にある。As the low-density polyethylene used in the present invention, known low-density polyethylene can be used as long as it is a low-density polyethylene obtained by a so-called high pressure method.
The melt index measured by K6760 (hereinafter simply referred to as melt index) is 0.1 to
4.0, preferably 0.2-3.0, especially 0.8-1.
3g / 10min, the density measured by JIS K6760 (hereinafter, simply referred to as density) is 0.905 to 0.9
30, preferably 0.915 to 0.925 g / cm 3 and especially 0.918 to 0.922 g / cm 3 . If the melt index is smaller than 0.1 g / 10 min or larger than 4.0 g / 10 min, the moldability tends to be poor. The density is 0.905 g / cm 3
Those smaller than 0.930 g / cm 3 tend to be inferior in impulse fracture strength.
【0010】また、本発明に用いる低密度ポリエチレン
は、破断点伸びは450〜800%、就中550〜75
0%、熱分析(DSC)法による融点が100〜115
℃、好ましくは105〜110℃であるものを用いるこ
とが好ましい。破断点伸びは450%よりも小さくて
も、800%よりも大きくても機械的強度の点で問題が
生じる傾向がある。熱分析(DSC)法による融点が1
00℃未満のものでは、機械的強度の点で問題が生じる
傾向にあり、110℃よりも大きいものはインパルス破
壊強度に劣る傾向にある。なお、熱分析(DSC)法に
よる融点の測定方法は、具体的には昇温速度10℃/m
in、窒素ガス雰囲気(100ml/min)条件下で
行なう。The low-density polyethylene used in the present invention has an elongation at break of 450 to 800%, especially 550 to 75%.
0%, melting point 100-115 by thermal analysis (DSC) method
It is preferable to use a material having a temperature of ° C, preferably 105 to 110 ° C. If the elongation at break is less than 450% or more than 800%, problems tend to occur in terms of mechanical strength. Melting point by thermal analysis (DSC) method is 1
If it is less than 00 ° C, the mechanical strength tends to be problematic, and if it is higher than 110 ° C, the impulse fracture strength tends to be poor. In addition, the measuring method of the melting point by the thermal analysis (DSC) method is, specifically, a heating rate of 10 ° C./m.
in nitrogen gas atmosphere (100 ml / min).
【0011】上記の中でも、JIS K6760によっ
て測定されたメルトインデックス及び密度がそれぞれ
0.2〜3.0g/10min、0.915〜0.92
5g/cm3 であるものが好ましく、特にJIS K6
760によって測定されたメルトインデックス及び密度
がそれぞれ0.2〜3.0g/10min、0.915
〜0.925g/cm3 であって、かつ熱分析(DS
C)法による融点が105〜110℃であるものが好ま
しい。Among the above, the melt index and the density measured by JIS K6760 are 0.2 to 3.0 g / 10 min and 0.915 to 0.92, respectively.
It is preferably 5 g / cm 3 , particularly JIS K6
Melt index and density measured by 760 are 0.2 to 3.0 g / 10 min and 0.915, respectively.
˜0.925 g / cm 3 and thermal analysis (DS
Those having a melting point of 105 to 110 ° C. according to the method C) are preferable.
【0012】上記低密度ポリエチレンに市販品として
は、三菱油化社製ZF−30R(メルトインデックス
1.1g/10min、密度0.920g/cm3 )、
三菱油化社製HE−30(メルトインデックス0.3g
/10min、密度0.920g/cm3 )、三菱油化
社製ZF−50(メルトインデックス0.7g/10m
in、密度0.924g/cm3 )、宇部興産社製UB
EC530(メルトインデックス1.1g/10mi
n、密度0.920g/cm3 )、住友化学社製スミカ
センC−215(メルトインデックス1.4g/10m
in、密度0.920g/cm3 )、日本石油社製W−
300(メルトインデックス2.0g/10min、密
度0.919g/cm3 )等が挙げられる。特に三菱油
化社製ZF−30R(メルトインデックス1.1g/1
0min、密度0.920g/cm3 )は好適に用いら
れる。Commercial products of the above low-density polyethylene include ZF-30R (melt index 1.1 g / 10 min, density 0.920 g / cm 3 ) manufactured by Mitsubishi Petrochemical Co., Ltd.
HE-30 manufactured by Mitsubishi Petrochemical Co., Ltd. (melt index 0.3 g
/ 10 min, density 0.920 g / cm 3 ), Mitsubishi Yuka Co., Ltd. ZF-50 (melt index 0.7 g / 10 m)
in, density 0.924 g / cm 3 ), UB manufactured by Ube Industries, Ltd.
EC530 (melt index 1.1g / 10mi
n, density 0.920 g / cm 3 ), Sumikasen C-215 (melt index 1.4 g / 10 m, manufactured by Sumitomo Chemical Co., Ltd.)
in, density 0.920 g / cm 3 ), Nippon Oil Co., Ltd. W-
300 (melt index 2.0 g / 10 min, density 0.919 g / cm 3 ) and the like. In particular, ZF-30R manufactured by Mitsubishi Petrochemical Co., Ltd. (melt index 1.1 g / 1
0 min and a density of 0.920 g / cm 3 ) are preferably used.
【0013】本発明で用いる3,4−ポリイソプレンと
しては、公知の3,4−ポリイソプレンを用いることが
でき、例えば、密度が通常0.850〜0.95、就中
0.88〜0.95g/cm3 のものである。また重量
平均分子量は通常15万〜25万、好ましくは18万〜
23万、さらに好ましくは20〜23万である。3,4
−ポリイソプレンは、通常1,4−ポリイソプレンを少
量不純物として含むが、本発明で用いる3,4−ポリイ
ソプレンは、1,4−ポリイソプレンが混在する形態で
あって良い。3,4−ポリイソプレンの配合量は、低密
度ポリエチレン100重量部に対して、3〜50重量
部、好ましくは10〜25、さらに好ましくは10〜2
0重量部配合する。3重量部未満であるとインパルス破
壊特性が低下する傾向にあり、また50重量部よりも大
きくてもしてインパルス破壊特性が低下する傾向にあ
る。As the 3,4-polyisoprene used in the present invention, known 3,4-polyisoprene can be used. For example, the density is usually 0.850 to 0.95, especially 0.88 to 0. 0.95 g / cm 3 . The weight average molecular weight is usually 150,000 to 250,000, preferably 180,000 to
It is 230,000, more preferably 20 to 230,000. 3,4
-Polyisoprene usually contains a small amount of 1,4-polyisoprene as an impurity, but the 3,4-polyisoprene used in the present invention may be in a form in which 1,4-polyisoprene is mixed. The content of 3,4-polyisoprene is 3 to 50 parts by weight, preferably 10 to 25, and more preferably 10 to 2 parts by weight with respect to 100 parts by weight of low-density polyethylene.
Add 0 parts by weight. If it is less than 3 parts by weight, the impulse breakdown characteristic tends to deteriorate, and if it is more than 50 parts by weight, the impulse breakdown characteristic tends to deteriorate.
【0014】本発明の絶縁性組成物は必要に応じて架橋
して用いてもよい。この場合、架橋剤として、ジアルキ
ルパーオキサイド、ジアルコキシパーオキサイド、ジア
シルパーオキサイド等の有機過酸化物が用いられる。例
えば、ジクミルパーオキサイド、ジターシャリーブチル
パーオキサイド等を適宜用いればよい。また、テトラメ
チルチウラムジサルファイド、ジベンゾチアジルジサル
ファイド、ジブチルジチオジチカルバミン亜鉛等の有機
硫黄化合物及び硫黄とこれらの化合物との混合物を用い
ることができる。これらの中で、ジクミルパーオキサイ
ド、ジターシャリーブチルパーオキサイドが好ましい。
本発明の電気絶縁性組成物を架橋剤によって架橋する場
合には、150〜290℃、好ましくは170〜250
℃にて、10〜120分間加熱処理すればよい。The insulating composition of the present invention may be used after being crosslinked if necessary. In this case, as the cross-linking agent, an organic peroxide such as dialkyl peroxide, dialkoxy peroxide or diacyl peroxide is used. For example, dicumyl peroxide, ditertiary butyl peroxide, etc. may be used appropriately. Further, organic sulfur compounds such as tetramethylthiuram disulfide, dibenzothiazyl disulfide, zinc dibutyldithiodithicarbamine, and mixtures of sulfur with these compounds can be used. Of these, dicumyl peroxide and ditertiary butyl peroxide are preferable.
When the electrically insulating composition of the present invention is crosslinked with a crosslinking agent, the temperature is 150 to 290 ° C., preferably 170 to 250.
The heat treatment may be performed at 10 ° C. for 10 to 120 minutes.
【0015】また、架橋は、シラン架橋タイプであって
もよい。例えば、ビニルトリメトキシシラン、ビニルト
リエトキシシランのようなシラン化合物と、ジクミルオ
キサイド、ヒドロキシペプチルオキサイド等のラジカル
発生剤とにより低密度ポリエチレンにグラフトさせ、該
シラングラフト化された低密度ポリエチレンをジブチル
チンジウラレート、ジブチルチンジアセテート等のシラ
ノール縮合触媒を添加混合し、水分存在下で架橋すれば
よい。Further, the crosslinking may be a silane crosslinking type. For example, silane compounds such as vinyltrimethoxysilane and vinyltriethoxysilane, and dicumyl oxide, and radical generators such as hydroxypeptyl oxide are grafted onto low-density polyethylene, and the silane-grafted low-density polyethylene is A silanol condensation catalyst such as dibutyltin dilaurate or dibutyltin diacetate may be added and mixed, and crosslinked in the presence of water.
【0016】また、本発明の組成物は電子線照射によっ
て架橋してもよい。電子線の照射量は通常2〜30Mr
ad程度である。The composition of the present invention may be crosslinked by electron beam irradiation. The electron beam dose is usually 2 to 30 Mr
It is about ad.
【0017】さらに本発明の組成物を架橋するときには
架橋助剤を配合してもよい。架橋助剤としては、ジビニ
ルベンゼン、ジアリルフタレート、ジアリルイソフタレ
ート、4,4´−イソプロピリデンジフェノールビス
(ジエチレングリコールメタクリレート)エーテル、ト
リアリルトリメリテート、2,2´−ビス(4−アクリ
ロキシジエトキシフェニル)プロパン等の芳香族多官能
性化合物、syn−1,2−ポリブタジエン、1,4−
ブタンジオールジアクリレート、N,N´−メチレンビ
スアクリルアミド、エチレングリコールジメタアクリレ
ート、ネオペンチルグリコールジメタクリレート、トリ
メチロールプロパントリメタクリレート、ペンタエリス
リトールテトラメタクリレート、1,6−ヘキサジオー
ルメタクリレート、テトラヘキサンジオールジメタクリ
レート等の脂肪族多官能性化合物、トリアリルイソシア
ヌレート、トリアリルシアヌレート、トリアクリロイル
ヘキサヒドロ−1,3,5−トリアジン、ジアクリルク
ロレンデート等の脂肪族多官能性環状化合物、アルムニ
ウムアクリレート、アルミニウムメタクリレート、亜鉛
アクリレート、亜鉛メタクリレート、マグネシウムアク
リレート、マグネシウムメタクリレート、カルシウムア
クリレート、カルシウムメタクリレート、ジルコンアク
リレート、ジルコンメタクリレート等の含金属多官能性
化合物等を例示され、これらの1種または2種以上を
0.1〜3.0重量部程度添加すれば良い。上記架橋助
剤中、トリアリルイソシアヌレート、トリアリルシアヌ
レート、トリアクリロイルヘキサヒドロ−1,3,5−
トリアジンが好ましい。Further, when the composition of the present invention is crosslinked, a crosslinking aid may be added. As the crosslinking aid, divinylbenzene, diallyl phthalate, diallyl isophthalate, 4,4'-isopropylidenediphenol bis (diethylene glycol methacrylate) ether, triallyl trimellitate, 2,2'-bis (4-acryloxydiene) Aromatic polyfunctional compounds such as ethoxyphenyl) propane, syn-1,2-polybutadiene, 1,4-
Butanediol diacrylate, N, N'-methylenebisacrylamide, ethylene glycol dimethacrylate, neopentyl glycol dimethacrylate, trimethylolpropane trimethacrylate, pentaerythritol tetramethacrylate, 1,6-hexadiol methacrylate, tetrahexanediol dimethacrylate. Polyfunctional aliphatic compounds such as triallyl isocyanurate, triallyl cyanurate, triacryloylhexahydro-1,3,5-triazine, diacrylchlorendate, and other polyfunctional cyclic compounds, aluminum acrylate , Aluminum methacrylate, zinc acrylate, zinc methacrylate, magnesium acrylate, magnesium methacrylate, calcium acrylate, cal Um methacrylate, zircon acrylate, are exemplified a metal-containing polyfunctional compounds such as zircon methacrylate, these one or more may be added in an amount of about 0.1 to 3.0 parts by weight. Among the above crosslinking assistants, triallyl isocyanurate, triallyl cyanurate, triacryloyl hexahydro-1,3,5-
Triazine is preferred.
【0018】本発明の低密度ポリエチレン100重量部
に対して、3,4−ポリイソプレン3〜50重量部配合
してなる電気絶縁性組成物には、本発明の目的を損なわ
ない程度に酸化防止剤、滑剤、安定剤、充填剤、着色剤
等を配合してもよい。The electrically insulative composition prepared by blending 3 to 50 parts by weight of 3,4-polyisoprene with 100 parts by weight of the low-density polyethylene of the present invention is antioxidant to the extent that the object of the present invention is not impaired. Agents, lubricants, stabilizers, fillers, colorants and the like may be added.
【0019】酸化防止剤としては、ヒンダードフェノー
ル系酸化防止剤、アミン系酸化防止剤等が例示される。
ヒンダードフェノール系酸化防止剤としては、公知もの
を使用でき、例えば、テトラキス[メチレン−3−
(3,5−ジ−tert−ブチル−4−ヒドロキシフェ
ノール)プロピオネート](チバガイギー社製イルガノ
ックス1010)、2,2−チオ[ジエチル−ビス−3
−(3,5−ジ−tert−ブチル−4−ヒドロキシフ
ェノール)プロピオネート](チバガイギー社製イルガ
ノックス1035)、4,4´−チオビス(3−メチル
−6−tert−ブチルフェノール)(大内新興社製ノ
クラック300)、4,4´−メチレン−ビス(3,5
−ジ−tert−ブチルフェノール)(英ICI社製ア
イオノックス220)、アミン系酸化防止剤としては、
例えばN,N´−ジ−β−ナフチル−p−フェニレンジ
アミン(大内新興社製ノクラックホワイト)、N,N´
−ジフェニル−p−フェニレンジアミン(大内新興社製
ノクラックDP)、N,N´−ジイソプロピル−p−フ
ェニレンジアミン(デユポン社製アンチオキシダントN
o.23)、N,N´−ビス(1−メチル−ヘプチル)
−p−フェニレンジアミン(Eastman chem
社製Eastzone30)、フェニル,ヘキシル−p
−フェニレンジアミン(Pennwalt社製NTO3
´3´)、N,N´−ジ−β−ナフチル−p−フェニレ
ンジアミン(精工化学社製Nonfelex F)、
N,N´−ビス(1−エチル,3−メチルペンチル)−
p−フェニレンジアミン(ユニロイヤル社製Flexz
on8−L)、2−メルカプトメチルベンズイミダゾー
ル(大内新興社製ノクラックMMB)、2−メルカプト
メチルベンズイミダゾール亜鉛塩(大内新興社製ノクラ
ックMMBZ)等を挙げることができる。上記の酸化防
止剤の中でもヒンダードフェノール系酸化防止剤、特に
4,4´−チオビス(3−メチル−6−tert−ブチ
ルフェノール)が好ましい。Examples of the antioxidant include hindered phenol type antioxidants, amine type antioxidants and the like.
As the hindered phenolic antioxidant, known compounds can be used, for example, tetrakis [methylene-3-
(3,5-di-tert-butyl-4-hydroxyphenol) propionate] (Irganox 1010 manufactured by Ciba-Geigy), 2,2-thio [diethyl-bis-3]
-(3,5-di-tert-butyl-4-hydroxyphenol) propionate] (Ciba Geigy Irganox 1035), 4,4'-thiobis (3-methyl-6-tert-butylphenol) (Ouchi Shinsei Co., Ltd.) Nocrac 300), 4,4'-methylene-bis (3,5
-Di-tert-butylphenol) (Ionox 220 manufactured by British ICI Co., Ltd.), as amine-based antioxidants,
For example, N, N'-di-β-naphthyl-p-phenylenediamine (Nocrack white manufactured by Ouchi Shinko Co., Ltd.), N, N '
-Diphenyl-p-phenylenediamine (Nocrac DP manufactured by Ouchi Shinko Co., Ltd.), N, N'-diisopropyl-p-phenylenediamine (Antioxidant N manufactured by Deyupon)
o. 23), N, N'-bis (1-methyl-heptyl)
-P-phenylenediamine (Eastman chem)
Eastzone 30), phenyl, hexyl-p
-Phenylenediamine (NTO3 manufactured by Pennwalt)
'3'), N, N'-di-β-naphthyl-p-phenylenediamine (Nonfelex F manufactured by Seiko Chemical Co., Ltd.),
N, N'-bis (1-ethyl, 3-methylpentyl)-
p-phenylenediamine (Uniroy's Flexz
on8-L), 2-mercaptomethylbenzimidazole (Nocrac MMB manufactured by Ouchi Shinko Co., Ltd.), 2-mercaptomethylbenzimidazole zinc salt (Nocrac MMBZ manufactured by Ouchi Shinko Co., Ltd.) and the like. Among the above antioxidants, hindered phenolic antioxidants, especially 4,4'-thiobis (3-methyl-6-tert-butylphenol) are preferable.
【0020】滑剤としては、従来公知のものが広く使用
でき、例えばステアリン酸、及びステアリン酸亜鉛、ス
テアリン酸スズ、ステアリン酸カルシウム、ステアリン
酸鉛、ステアリン酸マグネシウム等のステアリン酸金属
塩、イソステアリン酸、酪酸、カプリン酸、カプロン
酸、ラウリン酸、オレイン酸、及びそれらの金属塩、ビ
ニルステアレート、n−ブチルステアレート等の脂肪酸
エステル、ステアリン酸アミド、オキシステアリン酸ア
ミド、オレイン酸アミド、リシノール酸等の脂肪酸アマ
イド、パラフィン等の1種または2種以上が用いられ
る。As the lubricant, conventionally known ones can be widely used, and examples thereof include stearic acid, metal stearates such as zinc stearate, tin stearate, calcium stearate, lead stearate and magnesium stearate, isostearic acid, butyric acid. , Capric acid, caproic acid, lauric acid, oleic acid and their metal salts, fatty acid esters such as vinyl stearate, n-butyl stearate, stearic acid amide, oxystearic acid amide, oleic acid amide, ricinoleic acid, etc. One or more kinds of fatty acid amide, paraffin, etc. are used.
【0021】本発明の電気絶縁性組成物は、通常の混練
手段によって、例えばバンバリーミキサー、ヘンシュル
ミキサー、ニーダ、ロール、ブレンダなどによって混練
され、次いで押出し機、射出成型機などの成型機を用い
て特定の製品形状、例えば電線用電気絶縁層、高圧ケー
ブルの接続部、端末部等の機器用高圧電気絶縁性用部
材、テープ、シート、スペーサー、プラグ、ソケット、
パイプ、絶縁棒、各種電装成型品、回路部品、封止材料
等に加工される。The electrically insulating composition of the present invention is kneaded by a conventional kneading means, for example, a Banbury mixer, a Henshur mixer, a kneader, a roll, a blender, etc., and then using a molding machine such as an extruder or an injection molding machine. Specific product shape, for example, electrical insulation layer for electric wires, high voltage cable connection part, high voltage electrical insulation member for equipment such as terminal part, tape, sheet, spacer, plug, socket,
Processed into pipes, insulating rods, various electrical components, circuit components, sealing materials, etc.
【0022】本発明の電気絶縁性組成物を電力ケーブル
の絶縁層として用いる場合には、公知の方法にて形成す
ればよい。例えば、加圧押出、チュービング法によって
導体上に連続形成される。また、66kv以上程度の電
力ケーブルでは、内部半導電層、外部半導電層を適宜設
ければよい。導体上にセパレーターテープを施すもの、
絶縁層上にさらにシース層を設ける態様であってよい。When the electrically insulating composition of the present invention is used as an insulating layer of a power cable, it may be formed by a known method. For example, it is continuously formed on the conductor by pressure extrusion or a tubing method. Further, in a power cable of about 66 kv or more, the inner semiconductive layer and the outer semiconductive layer may be appropriately provided. Applying separator tape on the conductor,
A mode in which a sheath layer is further provided on the insulating layer may be used.
【0023】本発明の絶縁性組成物を電力ケーブルの絶
縁体として用いる場合には、ケーブルの導体は、純銅、
軟銅、硬銅等の公知の導体を用いればよい。絶縁層の厚
さは、送電容量に応じて適宜設計すればよく、たとえば
1〜30mm程度である。When the insulating composition of the present invention is used as an insulator of a power cable, the conductor of the cable is pure copper,
A known conductor such as annealed copper or hard copper may be used. The thickness of the insulating layer may be appropriately designed according to the power transmission capacity, and is, for example, about 1 to 30 mm.
【0024】(実施例1〜6、比較例1〜5)表1に示
す各成分をロールミルを用いて120℃にて混練し、圧
縮成型器中で120℃で15分間溶融成型し、厚さ0.
3mmのシートを得た。なお、架橋の場合は、180℃
で20分間加熱プレス成型を行った。該シートは室温ま
たは90℃にてインパルス破壊特性試験を行った。(Examples 1 to 6 and Comparative Examples 1 to 5) The components shown in Table 1 were kneaded at 120 ° C. using a roll mill, and melt-molded in a compression molding machine at 120 ° C. for 15 minutes to give a thickness. 0.
A 3 mm sheet was obtained. In case of crosslinking, 180 ℃
Was heated and pressed for 20 minutes. The sheet was tested for impulse breakdown characteristics at room temperature or 90 ° C.
【0025】なお、実施例、比較例で用いた配合剤は、
以下の通りである。 1)低密度ポリエチレン(三菱油化社製、ZF−30
R、密度0.920g/cm3 、メルトインデックス
1.1g/10分、破断点伸び740%、DSCによる
融点106℃) 2)3,4−ポリイソプレン(クラレ社製、KM4−K
1、重量平均分子量20万、1,4−ポリイソプレンを
20重量%含有) 3)シス−1,4−ポリイソプレン(クラレ社製、IR
−10) 4)ジクミルパーオキサイド(日本油脂製DCP) 5)酸化防止剤(大内新興社製、N−300、4,4´
−チオビス(3−メチル−6−tert−ブチルフェノ
ール))The compounding agents used in Examples and Comparative Examples are
It is as follows. 1) Low density polyethylene (ZF-30 manufactured by Mitsubishi Petrochemical Co., Ltd.)
R, density 0.920 g / cm 3 , melt index 1.1 g / 10 minutes, elongation at break 740%, melting point 106 ° C. by DSC) 2) 3,4-polyisoprene (Kuraray KM4-K)
1, weight average molecular weight 200,000, containing 20% by weight of 1,4-polyisoprene) 3) cis-1,4-polyisoprene (Kuraray Co., IR
-10) 4) Dicumyl peroxide (DCP manufactured by NOF Corporation) 5) Antioxidant (manufactured by Ouchi Shinko Co., Ltd., N-300, 4, 4 ')
-Thiobis (3-methyl-6-tert-butylphenol))
【0026】(インパルス破壊特性試験)改良型McK
eown電極系にて1×40μsecの負極インパルス
標準波を予想破壊電圧の70%値を初期値として、室温
及び90℃にて、5kv/3回印加のステップアップ昇
圧方式で課電した。なお、インパルス耐圧値は1条件に
つき10試料のデータを採取し、ワイブル解析後、破壊
確率63.3%における破壊値をもって、その試料のイ
ンパルス耐圧値とし、結果を表1に示した。(Impulse Destruction Characteristic Test) Improved McK
The negative electrode impulse standard wave of 1 × 40 μsec was applied by an eown electrode system at a room temperature and 90 ° C. by a step-up boosting method of applying 5 kv / 3 times, with an initial value of 70% of the expected breakdown voltage. As for the impulse withstand voltage value, data of 10 samples was collected for each condition, and after the Weibull analysis, the destruction value at a destruction probability of 63.3% was used as the impulse withstand voltage value of the sample, and the results are shown in Table 1.
【0027】[0027]
【表1】 [Table 1]
【0028】本発明の絶縁性組成物は、非架橋の場合
で、低密度ポリエチレン単独よりもインパルス破壊電圧
が20〜45kv/mm大きく、また高温(90℃)に
おいてもインパルス破壊電圧が32〜57kv/mm大
きい。また、架橋の場合においても、低密度ポリエチレ
ン単独よりもインパルス破壊電圧が62〜67kv/m
m大きく、また高温(90℃)においてもインパルス破
壊電圧が25〜53kv/mm大きい。The non-crosslinked insulating composition of the present invention has an impulse breakdown voltage of 20 to 45 kv / mm higher than that of low density polyethylene alone, and an impulse breakdown voltage of 32 to 57 kv even at high temperature (90 ° C.). / Mm larger. Also in the case of cross-linking, the impulse breakdown voltage is 62 to 67 kv / m compared to low density polyethylene alone.
m is large, and the impulse breakdown voltage is 25 to 53 kv / mm large even at a high temperature (90 ° C.).
【0029】[0029]
【効果】本発明における絶縁性組成物は、電気破壊強度
等の電気特性、特に高温における、電気破壊強度が良好
である。したがって、高圧の電気絶縁体として極めて有
望なものであり、大容量の電力ケーブルの絶縁体として
適用でき、かつその信頼性が高まる。また、電気破壊強
度等の電気特性が優れているが故に、従来までの絶縁層
を低減することができ、電力ケーブルの小型化が図れ
る。[Effect] The insulating composition of the present invention has good electric characteristics such as electric breakdown strength, particularly good electric breakdown strength at high temperature. Therefore, it is extremely promising as a high-voltage electrical insulator, can be applied as an insulator of a large-capacity power cable, and its reliability is enhanced. Further, since the electric characteristics such as the electric breakdown strength are excellent, it is possible to reduce the number of insulating layers used in the past, and it is possible to reduce the size of the power cable.
Claims (2)
て、3,4−ポリイソプレン3〜50重量部配合してな
ることを特徴とする電気絶縁性組成物。1. An electrically insulating composition comprising 100 parts by weight of low-density polyethylene and 3 to 50 parts by weight of 3,4-polyisoprene.
6760によって測定されたメルトインデックス及び密
度がそれぞれ0.2〜3.0g/10min、0.91
5〜0.925g/cm3 である特許請求の範囲第1項
記載の電気絶縁性組成物。2. The low density polyethylene is JIS K
Melt index and density measured by 6760 are 0.2-3.0 g / 10 min, 0.91 respectively.
The electrically insulating composition according to claim 1, which has an amount of 5 to 0.925 g / cm 3 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6173495A JPH0812821A (en) | 1994-07-01 | 1994-07-01 | Electrical insulating composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6173495A JPH0812821A (en) | 1994-07-01 | 1994-07-01 | Electrical insulating composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0812821A true JPH0812821A (en) | 1996-01-16 |
Family
ID=15961578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6173495A Pending JPH0812821A (en) | 1994-07-01 | 1994-07-01 | Electrical insulating composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0812821A (en) |
-
1994
- 1994-07-01 JP JP6173495A patent/JPH0812821A/en active Pending
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