JPH08148772A - Printed circuit board for thermocompression bonding - Google Patents
Printed circuit board for thermocompression bondingInfo
- Publication number
- JPH08148772A JPH08148772A JP28813894A JP28813894A JPH08148772A JP H08148772 A JPH08148772 A JP H08148772A JP 28813894 A JP28813894 A JP 28813894A JP 28813894 A JP28813894 A JP 28813894A JP H08148772 A JPH08148772 A JP H08148772A
- Authority
- JP
- Japan
- Prior art keywords
- thermocompression bonding
- thermocompression
- circuit board
- printed circuit
- glass epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 230000002708 enhancing effect Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 17
- 239000004593 Epoxy Substances 0.000 abstract description 14
- 239000011521 glass Substances 0.000 abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 10
- 229910052802 copper Inorganic materials 0.000 abstract description 10
- 239000010949 copper Substances 0.000 abstract description 10
- 238000010438 heat treatment Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】
【目的】 ガラスエポキシ基板とプラスチックを熱圧着
するとき、熱圧着工具の温度設定が簡単で、熱圧着強度
を充分強化できる改良されたプリント基板の提供にあ
る。
【構成】 ガラスエポキシ基板１上の熱圧着シール３と
接触する部分に銅パターン５を設ける。これにより、ガ
ラスエポキシ基板１の熱伝導性が高まり、熱圧着工具か
らの熱は銅パターン５を通して熱圧着シール３を容易に
加熱し、プラスチック２との熱圧着強度を高めることが
できる。
(57) [Summary] [Object] To provide an improved printed circuit board which can easily set the temperature of a thermocompression bonding tool and can sufficiently enhance the thermocompression bonding strength when thermocompressing a glass epoxy substrate and a plastic. [Structure] A copper pattern 5 is provided on a portion of the glass epoxy substrate 1 that contacts the thermocompression-bonding seal 3. As a result, the thermal conductivity of the glass epoxy substrate 1 is enhanced, and the heat from the thermocompression bonding tool can easily heat the thermocompression bonding seal 3 through the copper pattern 5 to enhance the thermocompression bonding strength with the plastic 2.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、熱圧着するプリント基
板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermocompression printed circuit board.
【０００２】[0002]
【従来の技術】プリント基板の熱圧着は、図１に概略図
を示すように、ガラスエポキシ基板１と支持体プラスチ
ック２の間に熱圧着シール３をはさみ、熱圧着工具４に
よる加熱によってガラスエポキシ基板１とプラスチック
２とを接着している。2. Description of the Related Art As shown in FIG. 1, a thermocompression bonding of a printed circuit board is carried out by sandwiching a thermocompression bonding seal 3 between a glass epoxy substrate 1 and a support plastic 2 and heating it by a thermocompression bonding tool 4. The substrate 1 and the plastic 2 are bonded together.
【０００３】この方法に使用する従来のガラスエポキシ
基板１は、図４に示すようにプラスチック２との圧着強
度を確保する為に、熱圧着シール３との接触部は平坦で
なければならず、パターン配置禁止領域となっているこ
とが多く、接触部を避けた中央部分に銅パターン５が設
けられている。The conventional glass epoxy substrate 1 used in this method must have a flat contact portion with the thermocompression-bonding seal 3 in order to secure the pressure-bonding strength with the plastic 2 as shown in FIG. It is often a pattern placement prohibited area, and the copper pattern 5 is provided in the central portion avoiding the contact portion.
【０００４】[0004]
【発明が解決しようとする課題】そこで、このガラスエ
ポキシ基板１を熱圧着する時、ガラスエポキシの熱伝導
性が悪い為、熱圧着工具４による加熱温度を高くし、時
間をかけて熱圧着する必要があった。しかし、接着され
る側がプラスチックであるので、熱圧着する温度と時間
の制限が厳しく充分な接着強度が得られない場合が多
く、熱圧着工具４の温度管理が非常に難かしかった。Therefore, when the glass epoxy substrate 1 is thermocompression-bonded, since the thermal conductivity of the glass epoxy is poor, the heating temperature by the thermocompression-bonding tool 4 is increased and the thermocompression bonding is performed over time. There was a need. However, since the side to be bonded is plastic, the temperature and time for thermocompression bonding are severely limited, and in many cases sufficient bonding strength cannot be obtained, and it was very difficult to control the temperature of the thermocompression bonding tool 4.
【０００５】本発明の目的は、上記従来のガラスエポキ
シ基板とプラスチックの熱圧着に比較し、熱圧着工具の
温度設定が簡単で、熱圧着強度を充分強化することので
きるプリント基板を提供することにある。An object of the present invention is to provide a printed circuit board in which the temperature of the thermocompression bonding tool can be set easily and the thermocompression bonding strength can be sufficiently enhanced as compared with the conventional thermocompression bonding of the glass epoxy substrate and the plastic. It is in.
【０００６】[0006]
【課題を解決するための手段】上記の目的は、熱圧着に
よって支持体プラスチックに固定するプリント基板の熱
圧着部分に熱伝導性を高めるための金属パターンを形成
し、さらにスルーホールを形成し、且つ該スルーホール
に熱伝導性の高い金属を充填したことによって達成され
る。The above-mentioned object is to form a metal pattern for enhancing thermal conductivity in a thermocompression-bonded portion of a printed circuit board fixed to a support plastic by thermocompression bonding, and further to form a through hole, Further, it is achieved by filling the through hole with a metal having high thermal conductivity.
【０００７】[0007]
【作用】上記プリント基板によれば、基板の熱圧着部分
に熱伝導性を高める金属パターンが形成され、熱圧着時
に加熱工具から加えられる熱は金属パターン及びスルー
ホール内充填の金属を通して熱圧着シールに伝熱し、伝
熱効率が高まるから、加熱工具から加える熱は少なくて
済み、急速加熱により過大な熱が加わる時間が短縮でき
る。According to the above-mentioned printed circuit board, a metal pattern for enhancing thermal conductivity is formed in the thermocompression bonding portion of the circuit board, and the heat applied from the heating tool at the time of thermocompression bonding is passed through the metal pattern and the metal filled in the through hole to perform thermocompression bonding. Since the heat is transferred to and the heat transfer efficiency is increased, less heat is required from the heating tool, and the time required for applying excessive heat can be shortened by rapid heating.
【０００８】また、このため熱圧着工具の温度設定、時
間設定の幅が広がり、良好な熱圧着により熱圧着強度を
高めることができる。For this reason, the range of temperature setting and time setting of the thermocompression bonding tool is widened, and the thermocompression bonding strength can be increased by favorable thermocompression bonding.
【０００９】[0009]
【実施例】以下本発明を一実施例によって説明する。図
２の様に、ガラスエポキシ基板１上の熱圧着シール３と
接触する部分にも銅パターン５を設ける。これにより、
ガラスエポキシ基板１の熱伝導性を向上させることがで
きる。EXAMPLES The present invention will be described below with reference to examples. As shown in FIG. 2, a copper pattern 5 is also provided on a portion of the glass epoxy substrate 1 that contacts the thermocompression-bonding seal 3. This allows
The thermal conductivity of the glass epoxy substrate 1 can be improved.
【００１０】その結果、熱圧着時に、熱圧着工具４から
ガラスエポキシ基板１に加える熱はより少なくて済み、
ガラスエポキシ基板１の銅パターン５を通して熱圧着シ
ールを容易に加熱することができ、プラスチック２に過
大な熱が加わる度合も少なくすることができる。As a result, less heat is applied from the thermocompression bonding tool 4 to the glass epoxy substrate 1 during thermocompression bonding,
The thermocompression-bonding seal can be easily heated through the copper pattern 5 of the glass epoxy substrate 1, and the degree to which excessive heat is applied to the plastic 2 can be reduced.
【００１１】その為、熱圧着時の熱圧着工具の温度設
定、時間設定等は従来の場合に比較して設定の幅が広が
り、充分熱圧着強度が強化される設定が容易にできる。Therefore, the temperature setting, time setting, etc. of the thermocompression bonding tool at the time of thermocompression bonding have a wider range of settings than in the conventional case, and the thermocompression bonding strength can be easily strengthened.
【００１２】図３はさらに他の実施例で、ガラスエポキ
シ基板１の熱圧着シール３と接触する部分にスルーホー
ル６を設け、このスルーホール６に銅パターンを流し込
む。これにより、熱圧着工具４からの熱は基板エッジに
形成された銅パターン５から伝わっていくだけではな
く、スルーホール６を通じて熱圧着面の銅パターン５に
伝わる為より一層熱伝導性が良くなる。これにより熱圧
着時の温度設定、時間設定が容易で、充分な熱圧着強度
が得られる。FIG. 3 shows still another embodiment, in which a through hole 6 is provided in a portion of the glass epoxy substrate 1 which is in contact with the thermocompression seal 3, and a copper pattern is poured into the through hole 6. As a result, the heat from the thermocompression bonding tool 4 is not only transferred from the copper pattern 5 formed at the edge of the substrate but also transferred to the copper pattern 5 on the thermocompression bonding surface through the through hole 6, so that the thermal conductivity is further improved. This makes it easy to set the temperature and time during thermocompression bonding and obtain sufficient thermocompression bonding strength.
【００１３】なお、熱伝導性を高めるパターン及び充填
用金属としては、銅以外の通常用いられている金属、合
金が利用でき、またこの基板エッジに形成するパターン
は基板の他の部分に形成されるパターンとは異なる金属
を利用することもできる。As the pattern for enhancing the thermal conductivity and the filling metal, a commonly used metal or alloy other than copper can be used, and the pattern formed on the edge of the substrate is formed on the other part of the substrate. It is also possible to use a metal different from the pattern.
【００１４】[0014]
【発明の効果】以上のように本発明のプリント基板によ
れば、次の様な効果が得られる。As described above, according to the printed circuit board of the present invention, the following effects can be obtained.
【００１５】（１）熱伝導性が向上することにより、熱
圧着の温度設定、加熱時間設定が容易になる。(1) By improving the thermal conductivity, it becomes easy to set the temperature and heating time for thermocompression bonding.
【００１６】（２）熱圧着の加熱時間を少なく出来る
為、作業時間の短縮につながる。(2) Since the heating time for thermocompression bonding can be reduced, the working time can be shortened.
【００１７】（３）熱圧着強度が強化されるので、接着
面が剥れにくく、熱圧着不良が減少する。(3) Since the thermocompression bonding strength is enhanced, the adhesive surface is less likely to peel off and the thermocompression bonding defects are reduced.
【図１】熱圧着の概略を説明する側断面図である。FIG. 1 is a side sectional view illustrating an outline of thermocompression bonding.
【図２】本発明の一実施例の側断面図である。FIG. 2 is a side sectional view of one embodiment of the present invention.
【図３】本発明の他の実施例の側断面図である。FIG. 3 is a side sectional view of another embodiment of the present invention.
【図４】従来の熱圧着基板の側断面図である。FIG. 4 is a side sectional view of a conventional thermocompression bonding substrate.
１…ガラスエポキシ基板、２…プラスチック、３…熱圧
着シール、４…熱圧着工具、５…銅パターン、６…スル
ーホール。DESCRIPTION OF SYMBOLS 1 ... Glass epoxy board, 2 ... Plastic, 3 ... Thermocompression bonding, 4 ... Thermocompression bonding tool, 5 ... Copper pattern, 6 ... Through hole.
Claims (2)
定するプリント基板の熱圧着部分に、熱伝導性を高める
ための金属パターンを形成し、熱圧着強度の増加と安定
化を向上させたことを特徴とする熱圧着用プリント基
板。1. A metal pattern for enhancing thermal conductivity is formed on a thermocompression-bonded portion of a printed circuit board which is fixed to a support plastic by thermocompression-bonding, thereby increasing thermocompression-bonding strength and improving stability. Printed circuit board for thermocompression bonding.
定するプリント基板の熱圧着部分に熱伝導性を高めるた
めの金属パターンを形成すると共にスルーホールを形成
し、且つ該スルーホールに熱伝導性の高い金属を充填し
て成り、熱圧着強度の増加と安定化を向上させたことを
特徴とする熱圧着用プリント基板。2. A metal pattern for enhancing thermal conductivity is formed in a thermocompression bonding portion of a printed circuit board which is fixed to a support plastic by thermocompression bonding, a through hole is formed, and the through hole has high thermal conductivity. A printed circuit board for thermocompression bonding, which is formed by filling a metal and has improved thermocompression bonding strength and stability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28813894A JPH08148772A (en) | 1994-11-22 | 1994-11-22 | Printed circuit board for thermocompression bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28813894A JPH08148772A (en) | 1994-11-22 | 1994-11-22 | Printed circuit board for thermocompression bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08148772A true JPH08148772A (en) | 1996-06-07 |
Family
ID=17726309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28813894A Pending JPH08148772A (en) | 1994-11-22 | 1994-11-22 | Printed circuit board for thermocompression bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08148772A (en) |
-
1994
- 1994-11-22 JP JP28813894A patent/JPH08148772A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20040106 |