JPH0816151B2 - Aromatic amine resin and method for producing the same - Google Patents
Aromatic amine resin and method for producing the sameInfo
- Publication number
- JPH0816151B2 JPH0816151B2 JP62252517A JP25251787A JPH0816151B2 JP H0816151 B2 JPH0816151 B2 JP H0816151B2 JP 62252517 A JP62252517 A JP 62252517A JP 25251787 A JP25251787 A JP 25251787A JP H0816151 B2 JPH0816151 B2 JP H0816151B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- resin
- aromatic amine
- carbon atoms
- general formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 title claims description 87
- 239000011347 resin Substances 0.000 title claims description 87
- 150000004982 aromatic amines Chemical class 0.000 title claims description 27
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- -1 aromatic amine compound Chemical class 0.000 claims description 34
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- 125000003545 alkoxy group Chemical group 0.000 claims description 6
- IFVTZJHWGZSXFD-UHFFFAOYSA-N biphenylene Chemical group C1=CC=C2C3=CC=CC=C3C2=C1 IFVTZJHWGZSXFD-UHFFFAOYSA-N 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical group C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims description 6
- 125000005843 halogen group Chemical group 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims description 6
- 239000003377 acid catalyst Substances 0.000 claims description 4
- 125000002252 acyl group Chemical group 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 description 28
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 21
- 239000003795 chemical substances by application Substances 0.000 description 14
- 239000002994 raw material Substances 0.000 description 11
- 239000003054 catalyst Substances 0.000 description 10
- 239000012948 isocyanate Substances 0.000 description 10
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 229920003180 amino resin Polymers 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 9
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 150000002513 isocyanates Chemical class 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 150000003335 secondary amines Chemical class 0.000 description 5
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 150000003141 primary amines Chemical class 0.000 description 4
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 4
- DAJPMKAQEUGECW-UHFFFAOYSA-N 1,4-bis(methoxymethyl)benzene Chemical group COCC1=CC=C(COC)C=C1 DAJPMKAQEUGECW-UHFFFAOYSA-N 0.000 description 3
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 3
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000003456 ion exchange resin Substances 0.000 description 3
- 229920003303 ion-exchange polymer Polymers 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 229940078552 o-xylene Drugs 0.000 description 3
- 229920003192 poly(bis maleimide) Polymers 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000035484 reaction time Effects 0.000 description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- CZZZABOKJQXEBO-UHFFFAOYSA-N 2,4-dimethylaniline Chemical group CC1=CC=C(N)C(C)=C1 CZZZABOKJQXEBO-UHFFFAOYSA-N 0.000 description 2
- MLPVBIWIRCKMJV-UHFFFAOYSA-N 2-ethylaniline Chemical compound CCC1=CC=CC=C1N MLPVBIWIRCKMJV-UHFFFAOYSA-N 0.000 description 2
- DOLQYFPDPKPQSS-UHFFFAOYSA-N 3,4-dimethylaniline Chemical group CC1=CC=C(N)C=C1C DOLQYFPDPKPQSS-UHFFFAOYSA-N 0.000 description 2
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 2
- ZUVPLKVDZNDZCM-UHFFFAOYSA-N 3-chloro-2-methylaniline Chemical compound CC1=C(N)C=CC=C1Cl ZUVPLKVDZNDZCM-UHFFFAOYSA-N 0.000 description 2
- JJYPMNFTHPTTDI-UHFFFAOYSA-N 3-methylaniline Chemical compound CC1=CC=CC(N)=C1 JJYPMNFTHPTTDI-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- HRXZRAXKKNUKRF-UHFFFAOYSA-N 4-ethylaniline Chemical compound CCC1=CC=C(N)C=C1 HRXZRAXKKNUKRF-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- YWMLORGQOFONNT-UHFFFAOYSA-N [3-(hydroxymethyl)phenyl]methanol Chemical group OCC1=CC=CC(CO)=C1 YWMLORGQOFONNT-UHFFFAOYSA-N 0.000 description 2
- 229960000583 acetic acid Drugs 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000006735 epoxidation reaction Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004128 high performance liquid chromatography Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- RNVCVTLRINQCPJ-UHFFFAOYSA-N o-toluidine Chemical compound CC1=CC=CC=C1N RNVCVTLRINQCPJ-UHFFFAOYSA-N 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- RZXMPPFPUUCRFN-UHFFFAOYSA-N p-toluidine Chemical compound CC1=CC=C(N)C=C1 RZXMPPFPUUCRFN-UHFFFAOYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- 238000006462 rearrangement reaction Methods 0.000 description 2
- 229960001755 resorcinol Drugs 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- 239000011592 zinc chloride Substances 0.000 description 2
- 235000005074 zinc chloride Nutrition 0.000 description 2
- DZSJGYKKLRZRMS-UHFFFAOYSA-N 1,1-dimethyl-2,3-dihydroinden-4-amine Chemical compound C1=CC=C(N)C2=C1C(C)(C)CC2 DZSJGYKKLRZRMS-UHFFFAOYSA-N 0.000 description 1
- UVXKCEMBYZHXMM-UHFFFAOYSA-N 1,1-dimethyl-2,3-dihydroindene-4,6-diamine Chemical compound C1=C(N)C=C(N)C2=C1C(C)(C)CC2 UVXKCEMBYZHXMM-UHFFFAOYSA-N 0.000 description 1
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- CPDNGRVWRPXTGS-UHFFFAOYSA-N 1,4-dimethoxy-2,3,5,6-tetramethylbenzene Chemical group COC1=C(C)C(C)=C(OC)C(C)=C1C CPDNGRVWRPXTGS-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- WTFAGPBUAGFMQX-UHFFFAOYSA-N 1-[2-[2-(2-aminopropoxy)propoxy]propoxy]propan-2-amine Chemical compound CC(N)COCC(C)OCC(C)OCC(C)N WTFAGPBUAGFMQX-UHFFFAOYSA-N 0.000 description 1
- VVAKEQGKZNKUSU-UHFFFAOYSA-N 2,3-dimethylaniline Chemical group CC1=CC=CC(N)=C1C VVAKEQGKZNKUSU-UHFFFAOYSA-N 0.000 description 1
- CDULGHZNHURECF-UHFFFAOYSA-N 2,3-dimethylaniline 2,4-dimethylaniline 2,5-dimethylaniline 2,6-dimethylaniline 3,4-dimethylaniline 3,5-dimethylaniline Chemical class CC1=CC=C(N)C(C)=C1.CC1=CC=C(C)C(N)=C1.CC1=CC(C)=CC(N)=C1.CC1=CC=C(N)C=C1C.CC1=CC=CC(N)=C1C.CC1=CC=CC(C)=C1N CDULGHZNHURECF-UHFFFAOYSA-N 0.000 description 1
- KWVPRPSXBZNOHS-UHFFFAOYSA-N 2,4,6-Trimethylaniline Chemical compound CC1=CC(C)=C(N)C(C)=C1 KWVPRPSXBZNOHS-UHFFFAOYSA-N 0.000 description 1
- ZPDPRPHPYMTWMA-UHFFFAOYSA-N 2,4-di(propan-2-yl)aniline Chemical compound CC(C)C1=CC=C(N)C(C(C)C)=C1 ZPDPRPHPYMTWMA-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- HGXVKAPCSIXGAK-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine;4,6-diethyl-2-methylbenzene-1,3-diamine Chemical compound CCC1=CC(CC)=C(N)C(C)=C1N.CCC1=CC(C)=C(N)C(CC)=C1N HGXVKAPCSIXGAK-UHFFFAOYSA-N 0.000 description 1
- GEQNZVKIDIPGCO-UHFFFAOYSA-N 2,4-dimethoxyaniline Chemical compound COC1=CC=C(N)C(OC)=C1 GEQNZVKIDIPGCO-UHFFFAOYSA-N 0.000 description 1
- XVBLEUZLLURXTF-UHFFFAOYSA-N 2,4-dimethylbenzene-1,3-diamine Chemical compound CC1=CC=C(N)C(C)=C1N XVBLEUZLLURXTF-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- RLYCRLGLCUXUPO-UHFFFAOYSA-N 2,6-diaminotoluene Chemical compound CC1=C(N)C=CC=C1N RLYCRLGLCUXUPO-UHFFFAOYSA-N 0.000 description 1
- FOYHNROGBXVLLX-UHFFFAOYSA-N 2,6-diethylaniline Chemical compound CCC1=CC=CC(CC)=C1N FOYHNROGBXVLLX-UHFFFAOYSA-N 0.000 description 1
- UFFBMTHBGFGIHF-UHFFFAOYSA-N 2,6-dimethylaniline Chemical group CC1=CC=CC(C)=C1N UFFBMTHBGFGIHF-UHFFFAOYSA-N 0.000 description 1
- OEWYVHJLQDINFS-UHFFFAOYSA-N 2-(2-aminoethyl)aniline Chemical compound NCCC1=CC=CC=C1N OEWYVHJLQDINFS-UHFFFAOYSA-N 0.000 description 1
- YKOLZVXSPGIIBJ-UHFFFAOYSA-N 2-Isopropylaniline Chemical compound CC(C)C1=CC=CC=C1N YKOLZVXSPGIIBJ-UHFFFAOYSA-N 0.000 description 1
- ZMXYNJXDULEQCK-UHFFFAOYSA-N 2-amino-p-cresol Chemical compound CC1=CC=C(O)C(N)=C1 ZMXYNJXDULEQCK-UHFFFAOYSA-N 0.000 description 1
- WYWNLVJBQRJIOU-UHFFFAOYSA-N 2-methyl-4-propan-2-ylaniline Chemical compound CC(C)C1=CC=C(N)C(C)=C1 WYWNLVJBQRJIOU-UHFFFAOYSA-N 0.000 description 1
- PZOZYLSYQJYXBI-UHFFFAOYSA-N 2-propan-2-yloxyaniline Chemical compound CC(C)OC1=CC=CC=C1N PZOZYLSYQJYXBI-UHFFFAOYSA-N 0.000 description 1
- AEIOZWYBDBVCGW-UHFFFAOYSA-N 2-tert-butylaniline Chemical compound CC(C)(C)C1=CC=CC=C1N AEIOZWYBDBVCGW-UHFFFAOYSA-N 0.000 description 1
- KWTZFUAWBOIKBN-UHFFFAOYSA-N 2-tert-butylbenzene-1,3-diamine Chemical compound CC(C)(C)C1=C(N)C=CC=C1N KWTZFUAWBOIKBN-UHFFFAOYSA-N 0.000 description 1
- SDYWXFYBZPNOFX-UHFFFAOYSA-N 3,4-dichloroaniline Chemical compound NC1=CC=C(Cl)C(Cl)=C1 SDYWXFYBZPNOFX-UHFFFAOYSA-N 0.000 description 1
- MKARNSWMMBGSHX-UHFFFAOYSA-N 3,5-dimethylaniline Chemical group CC1=CC(C)=CC(N)=C1 MKARNSWMMBGSHX-UHFFFAOYSA-N 0.000 description 1
- 229940018563 3-aminophenol Drugs 0.000 description 1
- DHYHYLGCQVVLOQ-UHFFFAOYSA-N 3-bromoaniline Chemical compound NC1=CC=CC(Br)=C1 DHYHYLGCQVVLOQ-UHFFFAOYSA-N 0.000 description 1
- RQKFYFNZSHWXAW-UHFFFAOYSA-N 3-chloro-p-toluidine Chemical compound CC1=CC=C(N)C=C1Cl RQKFYFNZSHWXAW-UHFFFAOYSA-N 0.000 description 1
- PNPCRKVUWYDDST-UHFFFAOYSA-N 3-chloroaniline Chemical compound NC1=CC=CC(Cl)=C1 PNPCRKVUWYDDST-UHFFFAOYSA-N 0.000 description 1
- GDJLLPTUSIUMOM-UHFFFAOYSA-N 3-ethyl-2-methylaniline Chemical compound CCC1=CC=CC(N)=C1C GDJLLPTUSIUMOM-UHFFFAOYSA-N 0.000 description 1
- AMKPQMFZCBTTAT-UHFFFAOYSA-N 3-ethylaniline Chemical compound CCC1=CC=CC(N)=C1 AMKPQMFZCBTTAT-UHFFFAOYSA-N 0.000 description 1
- XCCNRBCNYGWTQX-UHFFFAOYSA-N 3-propan-2-ylaniline Chemical compound CC(C)C1=CC=CC(N)=C1 XCCNRBCNYGWTQX-UHFFFAOYSA-N 0.000 description 1
- OMVFXCQLSCPJNR-UHFFFAOYSA-N 4-amino-2,6-dimethylphenol Chemical compound CC1=CC(N)=CC(C)=C1O OMVFXCQLSCPJNR-UHFFFAOYSA-N 0.000 description 1
- LJXDFLGENKUMOA-UHFFFAOYSA-N 4-amino-2-tert-butylphenol Chemical compound CC(C)(C)C1=CC(N)=CC=C1O LJXDFLGENKUMOA-UHFFFAOYSA-N 0.000 description 1
- KGEXISHTCZHGFT-UHFFFAOYSA-N 4-azaniumyl-2,6-dichlorophenolate Chemical compound NC1=CC(Cl)=C(O)C(Cl)=C1 KGEXISHTCZHGFT-UHFFFAOYSA-N 0.000 description 1
- WDFQBORIUYODSI-UHFFFAOYSA-N 4-bromoaniline Chemical compound NC1=CC=C(Br)C=C1 WDFQBORIUYODSI-UHFFFAOYSA-N 0.000 description 1
- NVVVQTNTLIAISI-UHFFFAOYSA-N 4-butan-2-ylaniline Chemical compound CCC(C)C1=CC=C(N)C=C1 NVVVQTNTLIAISI-UHFFFAOYSA-N 0.000 description 1
- JCLZLZKUISPXDC-UHFFFAOYSA-N 4-chloro-2,6-dimethylaniline Chemical compound CC1=CC(Cl)=CC(C)=C1N JCLZLZKUISPXDC-UHFFFAOYSA-N 0.000 description 1
- QSNSCYSYFYORTR-UHFFFAOYSA-N 4-chloroaniline Chemical compound NC1=CC=C(Cl)C=C1 QSNSCYSYFYORTR-UHFFFAOYSA-N 0.000 description 1
- PTMVFRKAMOUORT-UHFFFAOYSA-N 4-ethylbenzene-1,3-diamine Chemical compound CCC1=CC=C(N)C=C1N PTMVFRKAMOUORT-UHFFFAOYSA-N 0.000 description 1
- KRZCOLNOCZKSDF-UHFFFAOYSA-N 4-fluoroaniline Chemical compound NC1=CC=C(F)C=C1 KRZCOLNOCZKSDF-UHFFFAOYSA-N 0.000 description 1
- IPDXWXPSCKSIII-UHFFFAOYSA-N 4-propan-2-ylbenzene-1,3-diamine Chemical compound CC(C)C1=CC=C(N)C=C1N IPDXWXPSCKSIII-UHFFFAOYSA-N 0.000 description 1
- WRDWWAVNELMWAM-UHFFFAOYSA-N 4-tert-butylaniline Chemical compound CC(C)(C)C1=CC=C(N)C=C1 WRDWWAVNELMWAM-UHFFFAOYSA-N 0.000 description 1
- JFQJDZQPICZGJF-UHFFFAOYSA-N 4-tert-butylbenzene-1,3-diamine Chemical compound CC(C)(C)C1=CC=C(N)C=C1N JFQJDZQPICZGJF-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 238000005727 Friedel-Crafts reaction Methods 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- AFBPFSWMIHJQDM-UHFFFAOYSA-N N-methyl-N-phenylamine Natural products CNC1=CC=CC=C1 AFBPFSWMIHJQDM-UHFFFAOYSA-N 0.000 description 1
- 229920000557 Nafion® Polymers 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical class [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- XMUZQOKACOLCSS-UHFFFAOYSA-N [2-(hydroxymethyl)phenyl]methanol Chemical group OCC1=CC=CC=C1CO XMUZQOKACOLCSS-UHFFFAOYSA-N 0.000 description 1
- TYKJHNHWWQDPMW-UHFFFAOYSA-N [6-(acetyloxymethyl)naphthalen-2-yl]methyl acetate Chemical compound C1=C(COC(C)=O)C=CC2=CC(COC(=O)C)=CC=C21 TYKJHNHWWQDPMW-UHFFFAOYSA-N 0.000 description 1
- SSFGHKDDKYEERH-UHFFFAOYSA-N [6-(hydroxymethyl)naphthalen-2-yl]methanol Chemical compound C1=C(CO)C=CC2=CC(CO)=CC=C21 SSFGHKDDKYEERH-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- SBXKRBZKPQBLOD-UHFFFAOYSA-N aminohydroquinone Chemical compound NC1=CC(O)=CC=C1O SBXKRBZKPQBLOD-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 125000002490 anilino group Chemical group [H]N(*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 238000010533 azeotropic distillation Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000012362 glacial acetic acid Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229940093915 gynecological organic acid Drugs 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- NCBZRJODKRCREW-UHFFFAOYSA-N m-anisidine Chemical compound COC1=CC=CC(N)=C1 NCBZRJODKRCREW-UHFFFAOYSA-N 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- ABRWESLGGMHKEA-UHFFFAOYSA-N n-tert-butylaniline Chemical compound CC(C)(C)NC1=CC=CC=C1 ABRWESLGGMHKEA-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- VMPITZXILSNTON-UHFFFAOYSA-N o-anisidine Chemical compound COC1=CC=CC=C1N VMPITZXILSNTON-UHFFFAOYSA-N 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BHAAPTBBJKJZER-UHFFFAOYSA-N p-anisidine Chemical compound COC1=CC=C(N)C=C1 BHAAPTBBJKJZER-UHFFFAOYSA-N 0.000 description 1
- LRTFPLFDLJYEKT-UHFFFAOYSA-N para-isopropylaniline Chemical compound CC(C)C1=CC=C(N)C=C1 LRTFPLFDLJYEKT-UHFFFAOYSA-N 0.000 description 1
- DYFXGORUJGZJCA-UHFFFAOYSA-N phenylmethanediamine Chemical compound NC(N)C1=CC=CC=C1 DYFXGORUJGZJCA-UHFFFAOYSA-N 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000011085 pressure filtration Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001256 steam distillation Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は新規な芳香族アミン樹脂およびその製造方法
に関する。TECHNICAL FIELD The present invention relates to a novel aromatic amine resin and a method for producing the same.
この芳香族アミン樹脂は、エポキシ樹脂の原料または
他のエポキシ化合物に対する硬化剤、マレイミド樹脂の
原料または他のマレイミド化合物に対する硬化剤、イソ
シアナート樹脂の原料または他のイソシアナート化合物
に対する硬化剤、キレート樹脂、イオン交換樹脂、成形
材料、絶縁塗料、接着剤、ゴム変性剤、各種樹脂に対す
る添加剤、脱酸剤およびポリイミド、ポリアミド、ポリ
アミドイミドの原料等、多方面に利用できる。This aromatic amine resin is a curing agent for epoxy resin raw materials or other epoxy compounds, a curing agent for maleimide resin raw materials or other maleimide compounds, a curing agent for isocyanate resin raw materials or other isocyanate compounds, and a chelate resin. , Ion-exchange resins, molding materials, insulating coatings, adhesives, rubber modifiers, additives for various resins, deoxidizers and raw materials for polyimide, polyamide, polyamide-imide, etc.
従来より芳香族アミン樹脂は、芳香族アミン類とホル
マリンとによる縮合物として知られている。例えば、ア
ニリンとホルマリンから下記一般式(d) で表わされるアニリン−ホルマリン樹脂が製造されてい
る(K.フレイ;ヘルベチカ・ヒミー・アクタ18巻481(1
935))。Aromatic amine resins have hitherto been known as condensation products of aromatic amines and formalin. For example, from aniline and formalin, the following general formula (d) An aniline-formalin resin represented by (K. Frey; Helvetica Himi Actor Vol. 18 481 (1
935)).
一般式(d)で表わされるような、第二アミンから成
るアニリン−ホルマリン樹脂などの従来の芳香族アミノ
樹脂は、マレイミド化やイソシアナート化が困難なの
で、マレイミド樹脂やイソシアナート樹脂の原料として
は適さない。したがって、従来の芳香族アミノ樹脂は、
硬化剤としての用途に多用されていた。しかし、耐熱性
複合材用マトリックス樹脂や耐熱性接着剤などの硬化剤
として利用する場合に、従来の芳香族アミノ樹脂は、近
年の高度な要求性能に応じられなくなってきた。Conventional aromatic amino resins such as aniline-formalin resins composed of secondary amines represented by the general formula (d) are difficult to be maleimidized or isocyanated, so that they are used as raw materials for maleimide resins or isocyanate resins. Not suitable. Therefore, the conventional aromatic amino resin is
It was widely used as a curing agent. However, when used as a curing agent for a heat-resistant composite matrix resin or a heat-resistant adhesive, conventional aromatic amino resins have not been able to meet the recent high performance requirements.
耐熱性複合材、耐熱性接着剤等は、外部応力としての
応力集中等の瞬間的な衝撃に耐えることが要求されてい
る。このため、理想的にはゴムのように弾性変形するこ
とが重要な要素として注目されている。このような弾性
変形を判断する基準としては、特にマトリックス樹脂の
破断時の伸びが重要である。マトリックス樹脂の伸びが
大きい程、複合材等で要求されるガラス繊維やカーボン
繊維等の補強剤の欠点を補うことができる。すなわち、
複合材全体として強度向上になる。Heat-resistant composite materials, heat-resistant adhesives, and the like are required to withstand instantaneous impacts such as stress concentration as external stress. For this reason, elastically deforming like rubber ideally attracts attention as an important factor. As a criterion for determining such elastic deformation, the elongation at break of the matrix resin is particularly important. The greater the elongation of the matrix resin, the more the drawbacks of reinforcing agents such as glass fibers and carbon fibers required for composite materials can be compensated. That is,
The overall strength of the composite material is improved.
更に、これらマトリックス樹脂等においては、耐熱性
や寸法安定性のほか、長期間の保存安定性も重要であ
り、光および空気中の酸素による劣化が小さいことも要
求されている。この耐酸化性は主に樹脂の構造に由来す
るものであり、前記機械的強度等の要求と併せ、従来の
芳香族アミノ樹脂は構造的欠陥に起因する種々の欠点を
克服することは困難であった。Furthermore, in these matrix resins and the like, in addition to heat resistance and dimensional stability, long-term storage stability is important, and it is required that deterioration due to light and oxygen in the air is small. This oxidation resistance is mainly derived from the structure of the resin, and it is difficult for conventional aromatic amino resins to overcome various drawbacks caused by structural defects, together with the requirements for the mechanical strength and the like. there were.
また、前記アニリン−ホルマリン樹脂は、縮合度を高
くして機械的特性等を向上させる目的で、その縮合時の
ホルマリンのモル比を上げると、架橋構造になってしま
う。したがって、一般にその分子量はたかだか600程度
にしか上げることができない(野田等、工業化学雑誌55
巻484〜487(1952))。Further, the aniline-formalin resin has a cross-linked structure if the molar ratio of formalin at the time of condensation is increased for the purpose of increasing the degree of condensation and improving the mechanical properties and the like. Therefore, in general, its molecular weight can only be increased to about 600 (Noda et al., Journal of Industrial Chemistry 55).
Volume 484-487 (1952)).
なお、本発明者らはこれらの欠点を改良できる新規な
芳香族アミン樹脂を見出し、本件出願人が昭和62年9月
17日に出願した(特開昭64−74226号)。しかしなが
ら、この樹脂は第二アミンより成るので、イソシアナー
ト化やマレイミド化が困難である。また、硬化剤として
利用する場合に、使用量を比較的多くしなければならな
い点、硬化速度が比較的遅いという点などの問題がなお
残されていた。The inventors of the present invention found a novel aromatic amine resin capable of improving these drawbacks, and the applicant of the present invention, September 1987
Filed on 17th (Japanese Patent Laid-Open No. 64-74226). However, since this resin is composed of a secondary amine, it is difficult to form isocyanate or maleimid. Further, when used as a curing agent, there still remain problems such as a relatively large amount to be used and a relatively slow curing speed.
本発明は上記問題に鑑み成されたものであり、その目
的は、硬化剤として使用した場合に、耐熱性、機械的強
度、寸法安定性、光や空気中の酸素に対する安定性が優
れた硬化樹脂が得られ、更にはそれら特性に優れたイソ
シアナート樹脂、マレイミド樹脂等の原料としても利用
できる芳香族アミン樹脂およびその製造方法を提供する
ことにある。The present invention has been made in view of the above problems, and its object is to obtain excellent curing properties when used as a curing agent, such as heat resistance, mechanical strength, dimensional stability, and stability against light and oxygen in the air. An object of the present invention is to provide an aromatic amine resin which can be used as a raw material of an isocyanate resin, a maleimide resin and the like, which is capable of obtaining a resin and has excellent properties, and a method for producing the aromatic amine resin.
本発明者らは、上記目的を達成するため鋭意検討を重
ねた結果、本発明を完成するに至った。The present inventors have conducted intensive studies to achieve the above object, and as a result, completed the present invention.
すなわち、本発明は、 一般式(a) (式中、Aはフェニレン基、アルキル置換フェニレン
基、ジフェニレン基、ジフェニルエーテル基またはナフ
チレニル基を示し、R1はハロゲン原子、水酸基、炭素数
4以下の低級アルコキシ基または炭素数5以下の低級ア
ルキル基を示し、かつR1は互いに同一であっても異なっ
てもよく、環を形成してもよい。lは1または2を示
し、mは0〜3の整数を示し、nは0〜300の整数を示
す。)で表わされる芳香族アミン樹脂、 および、一般式(b) (式中、R1はハロゲン原子、水酸基、炭素数4以下の低
級アルコキシ基または炭素数5以下の低級アルキル基を
示し、かつR1は互いに同一であっても異なってもよく、
環を形成してもよい。lは1または2を示し、mは0〜
3の整数を示す。)で表わされる芳香族アミン化合物
と、 一般式(c) R2OCH2−A−CH2OR2 (c) (式中、Aはフェニレン基、アルキル置換フェニレン
基、ジフェニレン基、ジフェニルエーテル基またはナフ
チレニル基を示し、R2は水素原子、アシル基または炭素
数4以下の低級アルキル基を示す。)で表わされるアラ
ルキルアルコール誘導体を前記芳香族アミン化合物に対
して10モル%以上の酸触媒の存在下で反応させることを
特徴とする一般式(a)で表わされる芳香族アミン樹脂
の製造方法である。That is, the present invention provides a compound represented by the general formula (a): (In the formula, A represents a phenylene group, an alkyl-substituted phenylene group, a diphenylene group, a diphenyl ether group or a naphthylenyl group, and R 1 is a halogen atom, a hydroxyl group, a lower alkoxy group having 4 or less carbon atoms or a lower alkyl group having 5 or less carbon atoms. And R 1 may be the same or different from each other and may form a ring, 1 represents 1 or 2, m represents an integer of 0 to 3, and n represents 0 to 300. An aromatic amine resin represented by the general formula (b) (In the formula, R 1 represents a halogen atom, a hydroxyl group, a lower alkoxy group having 4 or less carbon atoms or a lower alkyl group having 5 or less carbon atoms, and R 1 may be the same or different from each other,
You may form a ring. l represents 1 or 2, m is 0
Indicates an integer of 3. And an aromatic amine compound represented by the general formula (c) R 2 OCH 2 —A—CH 2 OR 2 (c) (wherein A is a phenylene group, an alkyl-substituted phenylene group, a diphenylene group, a diphenyl ether group or a naphthylenyl group). Group, wherein R 2 represents a hydrogen atom, an acyl group or a lower alkyl group having 4 or less carbon atoms) in the presence of 10 mol% or more of an acid catalyst with respect to the aromatic amine compound. Is a method for producing an aromatic amine resin represented by the general formula (a).
本発明の芳香族アミン樹脂は、第一アミンから成る樹
脂なので、イソシアナート化、マレイミド化、エポキシ
化等が容易である。Since the aromatic amine resin of the present invention is a resin composed of a primary amine, isocyanate formation, maleimidization, epoxidation and the like are easy.
また、本発明の芳香族アミン樹脂を、他の樹脂(例え
ばイソシアナート化合物、エポキシ化合物、ビスマレイ
ミド化合物等)の硬化剤として使用すると、高度な性能
を有する樹脂を得ることができる。In addition, when the aromatic amine resin of the present invention is used as a curing agent for another resin (for example, an isocyanate compound, an epoxy compound, a bismaleimide compound, and the like), a resin having high performance can be obtained.
例えば、本発明の樹脂を、ビスマレイミド化合物の硬
化剤として用いた場合、硬化樹脂の機械的強度や寸法安
定性が優れ、また、耐熱性、光および空気中の酸素に対
する安定性も問題がない。その具体的な一例を挙げる
と、本発明の樹脂をメチレンジアニリンから誘導される
ビスマレイミドの硬化剤として使用した場合、硬化樹脂
の曲げ強度、曲げ弾性率、空気中での熱分解開始温度、
膨張係数、水分吸収率は、硬化剤にメチレンジアニリン
を使用した場合のケルイミド1050(商品名:成形グレー
ド、ローヌプーラン社製)樹脂と比べて優れており、ガ
ラス転移温度および熱変形温度はほぼ同等である。For example, when the resin of the present invention is used as a curing agent for a bismaleimide compound, the cured resin has excellent mechanical strength and dimensional stability, and there is no problem with heat resistance and stability against light and oxygen in the air. . As a specific example thereof, when the resin of the present invention is used as a curing agent for bismaleimide derived from methylenedianiline, bending strength of the cured resin, flexural modulus, thermal decomposition initiation temperature in air,
The expansion coefficient and moisture absorption rate are superior to those of Kerimide 1050 (trade name: molding grade, manufactured by Rhone-Poulenc) when methylenedianiline is used as the curing agent, and the glass transition temperature and heat distortion temperature are almost the same. Is equivalent.
また、本発明の樹脂を用いたプレポリマーは低沸点溶
剤(ジオキサン、メチレンクロライド等)に可溶であ
る。Further, the prepolymer using the resin of the present invention is soluble in low boiling point solvents (dioxane, methylene chloride, etc.).
従来は、ケルイミド等のプレポリマーを、高沸点の非
プロトン性極性溶剤(N−メチルピロリドン等)に溶解
させ、その溶液をガラスクロスやカーボンクロスに含浸
させることによってプリプレグが作製されていた。その
ような従来の方法に対し、本発明の樹脂をプレポリマー
に用れば、低沸点溶剤に溶解可能であるので、溶剤の揮
発除去が容易に行なわれ、極めて良好なプリプレグが得
られる。Conventionally, a prepreg has been produced by dissolving a prepolymer such as kelimide in a high-boiling point aprotic polar solvent (N-methylpyrrolidone or the like) and impregnating the solution into glass cloth or carbon cloth. In contrast to such a conventional method, when the resin of the present invention is used as a prepolymer, it can be dissolved in a low boiling point solvent, so that the solvent can be easily volatilized and removed, and an extremely good prepreg can be obtained.
更には、本発明の樹脂は、本件出願人が先に出願した
前述の明細書に記載された樹脂よりも、硬化速度が速
く、特に半導体封止用樹脂に用いるに好ましいものであ
る。Further, the resin of the present invention has a faster curing rate than the resins described in the above-mentioned specification filed previously by the applicant of the present invention, and is particularly preferable for use as a semiconductor encapsulating resin.
次に、本発明の芳香族アミン樹脂の製造方法を説明す
る。Next, a method for producing the aromatic amine resin of the present invention will be described.
本発明の樹脂は、一般式(b)で表わされる芳香族ア
ミン化合物と一般式(c)で表わされるアラルキルアル
コール誘導体を共縮合反応させて製造することができ
る。その反応の中間においては、第二アミンを含む樹脂
が生成するが、この第二アミンは転位反応によって本発
明の第一アミン樹脂に導けばよい。その転位反応は、そ
の縮合反応において、第二アミン樹脂が生成される反応
条件よりも、(イ)触媒量の増加(ロ)反応温度を上げ
る(ハ)反応時間を長くする等の手段により行なわれ
る。特に、触媒量の増加が効果的である。The resin of the present invention can be produced by subjecting an aromatic amine compound represented by the general formula (b) and an aralkyl alcohol derivative represented by the general formula (c) to a cocondensation reaction. In the middle of the reaction, a resin containing a secondary amine is formed, and this secondary amine may be led to the primary amine resin of the present invention by a rearrangement reaction. In the condensation reaction, the rearrangement reaction is carried out by means such as (a) increasing the amount of catalyst (b) increasing the reaction temperature (c) making the reaction time longer than the reaction conditions for producing the secondary amine resin. Be done. In particular, increasing the amount of catalyst is effective.
また、従来より公知のアニリン−ホルマリン樹脂が、
先に述べたように分子量をたかだか600程度にしか上げ
られないのに対し、本発明の芳香族アミン樹脂において
は、芳香族アミン化合物とアラルキルアルコール誘導体
のモル比を変えることにより、一般式(a)のnが0の
ものを主成分とする低分子量樹脂から、nが300程度ま
での高分子量樹脂まで任意に選択することができる。し
たがって、本発明の製造方法は、常温で液状のものから
高軟化点の樹脂状のものまで種々の形態の芳香族アミン
樹脂を、用途に応じて製造できることも特徴として挙げ
られる。In addition, conventionally known aniline-formalin resin,
As described above, while the molecular weight can be increased to about 600 at most, in the aromatic amine resin of the present invention, by changing the molar ratio of the aromatic amine compound and the aralkyl alcohol derivative, the general formula (a It is possible to arbitrarily select from a low molecular weight resin whose main component is n) of 0) to a high molecular weight resin whose n is up to about 300. Therefore, the production method of the present invention is also characterized in that various forms of aromatic amine resins can be produced depending on the intended use, from those that are liquid at room temperature to those that are resinous with a high softening point.
液状〜低軟化点の本発明の樹脂は、その縮合反応の際
に、アラルキルアルコール誘導体に対して芳香族アミン
化合物のモル比を大きくすれば得ることができる。その
ようにして得た液状〜低軟化点の樹脂は、溶融配合、含
浸、塗布等の作業性に優れ、接着剤、塗料、ウレタンお
よび他の樹脂への添加剤等の分野で主に利用される。The liquid to low softening point resin of the present invention can be obtained by increasing the molar ratio of the aromatic amine compound to the aralkyl alcohol derivative during the condensation reaction. The liquid to low softening point resin thus obtained is excellent in workability such as melt blending, impregnation and coating, and is mainly used in the fields of adhesives, paints, urethanes and additives to other resins. You.
高軟化点の本発明の樹脂は、その縮合反応の際に、ア
ラルキルアルコール誘導体と芳香族アミン類とのモル比
を理論量に近いところにすれば得ることができる。その
ようにして得た高軟化点の樹脂は、成形材料、イオン交
換樹脂、積層用樹脂等の分野で利用できる。The resin of the present invention having a high softening point can be obtained by making the molar ratio of the aralkyl alcohol derivative and the aromatic amine close to the theoretical amount during the condensation reaction. The resin having a high softening point thus obtained can be used in the fields of molding materials, ion exchange resins, laminating resins and the like.
このような本発明の製造方法で得られる芳香族アミン
樹脂の分子量範囲は300〜60,000程度であり、樹脂の軟
化点範囲は常温で液状〜250℃程度である(JIS−K−25
48による環球法軟化点)。The molecular weight range of the aromatic amine resin obtained by the production method of the present invention is about 300 to 60,000, and the softening point range of the resin is liquid at room temperature to about 250 ° C. (JIS-K-25
Ring and ball softening point by 48).
以下、本発明の芳香族アミン樹脂の製造方法の具体例
を詳細に説明する。Hereinafter, specific examples of the method for producing an aromatic amine resin of the present invention will be described in detail.
まず、一般式(c)で表わされるアラルキルアルコー
ル誘導体1モルに対し一般式(b)で表わされる芳香族
アミン化合物を1〜15モル、好ましくは1.1〜10モルの
範囲で加え、酸触媒の存在下でそのまま昇温して後述の
温度で反応させる。反応が進行するにつれて生成する
水、アルコールまたは有機酸類を系外にトラップする。
必要によっては系内に残存する微量の揮発分を窒素によ
り系外に除去する。First, the aromatic amine compound represented by the general formula (b) is added in an amount of 1 to 15 mol, preferably 1.1 to 10 mol, relative to 1 mol of the aralkyl alcohol derivative represented by the general formula (c), and the presence of an acid catalyst is present. The temperature is raised as it is, and the reaction is performed at the temperature described below. Water, alcohol or organic acids produced as the reaction proceeds is trapped outside the system.
If necessary, a small amount of volatile matter remaining in the system is removed from the system by nitrogen.
なお、本発明に使用する一般式(c)で表わされるア
ラルキルアルコール誘導体のAは、 のフェニレン基、 のアルキル置換フェニレン基、 のジフェニレン基、 のジフェニルエーテル基、 のナフチレニル基などであり、R2は水素原子、アシル基
またはアルキル基である。R2のアシル基、アルキル基
は、炭素原子数が4以下であると反応が早く、また炭素
原子数が4、すなわちブチル基においてtert−ブチル基
は反応が遅い傾向にある。したがって、本発明で用いる
ものとしては、α,α′−ジヒドロキシ−o−キシレ
ン、α,α′−ジヒドロキシ−m−キシレン、α,α′
−ジヒドロキシ−p−キシレン、α,α′−ジアセトキ
シ−o−キシレン、α,α′−ジアセトキシ−m−キシ
レン、α,α′−ジアセトキシ−p−キシレン、α,
α′−ジプロピオノキシ−p−キシレン、α,α′−ジ
−n−ブチロキシ−p−キシレン、α,α′−ジメトキ
シ−o−キシレン、α,α′−ジメトキシ−m−キシレ
ン、α,α′−ジメトキシ−p−キシレン、α,α′−
ジエトキシ−o−キシレン、α,α′−ジエトキシ−m
−キシレン、α,α′−ジエトキシ−p−キシレン、
α,α′−ジイソプロポキシ−o−キシレン、α,α′
−ジイソプロポキシ−m−キシレン、α,α′−ジイソ
プロポキシ−p−キシレン、α,α′−ジ−n−プロポ
キシ−p−キシレン、α,α′−ジ−n−ブトキシ−m
−キシレン、α,α′−ジ−n−ブトキシ−p−キシレ
ン、α,α′−ジ−sec−ブトキシ−p−キシレン、
α,α′−ジイソブトキシ−p−キシレン、4,4′−ジ
ヒドロキシメチルジフェニルエーテル、4,4′−ジヒド
ロキシメチルジフェニル、2,6−ジヒドロキシメチルナ
フタレン、4,4′−ジアセトキシメチルジフェニルエー
テル、4,4′−ジアセトキシメチルジフェニル、2,6−ジ
アセトキシメチルナフタレン、4,4′−メトキシメチル
ジフェニルエーテル、4,4′−メトキシメチルジフェニ
ル、4,4′−ジエトキシメチルジフェニルエーテル、4,
4′−ジイソプロポキシメチルジフェニル、4,4′−ジイ
ソブトキシメチルジフェニルエーテル、α,α′−ジメ
トキシ−2−メチル−p−キシレン、α,α′−ジメト
キシ−3−メチル−m−キシレン、α,α′−ジヒドロ
キシ−2,5−ジメチル−p−キシレン、α,α′−ジメ
トキシ−2,5−ジメチル−p−キシレン、α,α′−ジ
メトキシ−2,4−ジメチル−1,3−キシレン、α,α′−
ジメトキシ−2,4−ジメチル−1,5−キシレン等を挙げる
ことができる。なお、その中でより好適な化合物は、
α,α′−ジメトキシ−p−キシレンである。In addition, A of the aralkyl alcohol derivative represented by the general formula (c) used in the present invention is A phenylene group of An alkyl-substituted phenylene group of Diphenylene group of Diphenyl ether group, And a naphthylenyl group, and R 2 is a hydrogen atom, an acyl group or an alkyl group. The acyl group and alkyl group of R 2 have a rapid reaction when the number of carbon atoms is 4 or less, and the tert-butyl group tends to have a slow reaction when the number of carbon atoms is 4, that is, a butyl group. Therefore, those used in the present invention include α, α′-dihydroxy-o-xylene, α, α′-dihydroxy-m-xylene, α, α ′.
-Dihydroxy-p-xylene, α, α'-diacetoxy-o-xylene, α, α'-diacetoxy-m-xylene, α, α'-diacetoxy-p-xylene, α,
α'-dipropionoxy-p-xylene, α, α'-di-n-butyroxy-p-xylene, α, α'-dimethoxy-o-xylene, α, α'-dimethoxy-m-xylene, α, α ' -Dimethoxy-p-xylene, α, α'-
Diethoxy-o-xylene, α, α′-diethoxy-m
-Xylene, α, α'-diethoxy-p-xylene,
α, α′-diisopropoxy-o-xylene, α, α ′
-Diisopropoxy-m-xylene, α, α'-diisopropoxy-p-xylene, α, α'-di-n-propoxy-p-xylene, α, α'-di-n-butoxy-m
-Xylene, α, α'-di-n-butoxy-p-xylene, α, α'-di-sec-butoxy-p-xylene,
α, α′-diisobutoxy-p-xylene, 4,4′-dihydroxymethyldiphenyl ether, 4,4′-dihydroxymethyldiphenyl, 2,6-dihydroxymethylnaphthalene, 4,4′-diacetoxymethyldiphenyl ether, 4,4 ′ -Diacetoxymethyldiphenyl, 2,6-diacetoxymethylnaphthalene, 4,4′-methoxymethyldiphenyl ether, 4,4′-methoxymethyldiphenyl, 4,4′-diethoxymethyldiphenylether, 4,
4'-diisopropoxymethyldiphenyl, 4,4'-diisobutoxymethyldiphenyl ether, α, α'-dimethoxy-2-methyl-p-xylene, α, α'-dimethoxy-3-methyl-m-xylene, α , Α'-dihydroxy-2,5-dimethyl-p-xylene, α, α'-dimethoxy-2,5-dimethyl-p-xylene, α, α'-dimethoxy-2,4-dimethyl-1,3- Xylene, α, α'-
Examples thereof include dimethoxy-2,4-dimethyl-1,5-xylene. In addition, the more preferable compound among them is
It is α, α'-dimethoxy-p-xylene.
本発明で使用する一般式(b)で表わされる芳香族ア
ミン化合物のR1はハロゲン原子、水酸基、炭素数4以下
の低級アルコキシ基、または炭素数5以下の低級アルキ
ル基であり、これらは0〜3個あり、互いに同じでも異
なってもよく、環を形成してもよい。アミノ基は1また
は2個である。具体的には、アニリン、o−トルイジ
ン、m−トルイジン、p−トルイジン、o−エチルアニ
リン、m−エチルアニリン、p−エチルアニリン、o−
イソプロピルアニリン、m−イソプロピルアニリン、p
−イソプロピルアニリン、o−n−プロピルアニリン、
o−tert−ブチルアニリン、p−tert−ブチルアニリ
ン、o−n−ブチルアニリン、p−sec−ブチルアニリ
ン、2,3−キシリジン、2,4−キシリジン、2,6−キシリ
ジン、3,4−キシリジン、3,5−キシリジン、2−メチル
−3エチルアニリン、2−メチル−4−イソプロピルア
ニリン、2,6−ジエチルアニリン、2−エチル−5−ter
t−ブチルアニリン、2,4−ジイソプロピルアニリン、2,
4,6−トリメチルアニリン、4−クロロアニリン、4−
ブロモアニリン、4−フルオロアニリン、3−クロロア
ニリン、3−ブロモアニリン、3,4−ジクロロアニリ
ン、3−クロロ−o−トルイジン、3−クロロ−p−ト
ルイジン、2,6−ジメチル−4−クロロアニリン、o−
アミノフェノール、m−アミノフェノール、p−アミノ
フェノール、2−アミノ−4−クレゾール、4−アミノ
−2−tert−ブチルフェノール、2,6−ジメチル−4−
アミノフェノール、2,6−ジクロロ−4−アミノフェノ
ール、2−アミノ−1,3−レゾルシン、4−アミノ−1,3
−レゾルシン、2−アミノハイドロキノン、2−メトキ
シアニリン、3−メトキシアニリン、4−メトキシアニ
リン、2−イソプロポキシアニリン、2,4−ジメトキシ
アニリン、o−フェニレンジアミン、m−フェニレンジ
アミン、p−フェニレンジアミン、2,4−ジアミノトル
エン、2,6−ジアミノトルエン、2,4−ジアミノエチルベ
ンゼン、2,6−ジアミノエチルベンゼン、2,4−ジアミノ
イソプロピルベンゼン、2,4−ジアミノ−tert−ブチル
ベンゼン、2,6−ジアミノ−tert−ブチルベンゼン、2,4
−ジアミノ−1,3−ジメチルベンゼン、1,1−ジメチル−
4−アミノインダン、1,1−ジメチル−4,6−ジアミノイ
ンダン等を挙げることができる。なお、好適な化合物
は、アニリン、トルイジン類、キシリジン類、アミノフ
ェノール類およびジアミン類であり、特に好適なものは
アニリンである。R 1 of the aromatic amine compound represented by the general formula (b) used in the present invention is a halogen atom, a hydroxyl group, a lower alkoxy group having 4 or less carbon atoms, or a lower alkyl group having 5 or less carbon atoms. ~ 3, which may be the same or different from each other, and may form a ring. The number of amino groups is 1 or 2. Specifically, aniline, o-toluidine, m-toluidine, p-toluidine, o-ethylaniline, m-ethylaniline, p-ethylaniline, o-
Isopropylaniline, m-isopropylaniline, p
-Isopropylaniline, on-propylaniline,
o-tert-butylaniline, p-tert-butylaniline, on-butylaniline, p-sec-butylaniline, 2,3-xylidine, 2,4-xylidine, 2,6-xylidine, 3,4- Xylidine, 3,5-xylidine, 2-methyl-3ethylaniline, 2-methyl-4-isopropylaniline, 2,6-diethylaniline, 2-ethyl-5-ter
t-butylaniline, 2,4-diisopropylaniline, 2,
4,6-trimethylaniline, 4-chloroaniline, 4-
Bromoaniline, 4-fluoroaniline, 3-chloroaniline, 3-bromoaniline, 3,4-dichloroaniline, 3-chloro-o-toluidine, 3-chloro-p-toluidine, 2,6-dimethyl-4-chloro Aniline, o-
Aminophenol, m-aminophenol, p-aminophenol, 2-amino-4-cresol, 4-amino-2-tert-butylphenol, 2,6-dimethyl-4-
Aminophenol, 2,6-dichloro-4-aminophenol, 2-amino-1,3-resorcinol, 4-amino-1,3
-Resorcin, 2-aminohydroquinone, 2-methoxyaniline, 3-methoxyaniline, 4-methoxyaniline, 2-isopropoxyaniline, 2,4-dimethoxyaniline, o-phenylenediamine, m-phenylenediamine, p-phenylenediamine , 2,4-diaminotoluene, 2,6-diaminotoluene, 2,4-diaminoethylbenzene, 2,6-diaminoethylbenzene, 2,4-diaminoisopropylbenzene, 2,4-diamino-tert-butylbenzene, 2, 6-diamino-tert-butylbenzene, 2,4
-Diamino-1,3-dimethylbenzene, 1,1-dimethyl-
4-aminoindane, 1,1-dimethyl-4,6-diaminoindane and the like can be mentioned. In addition, preferable compounds are aniline, toluidines, xylidines, aminophenols and diamines, and particularly preferable one is aniline.
酸触媒としては、無機または有機の酸、特に鉱酸、例
えば塩酸、リン酸、硫酸または硝酸を、あるいは塩化亜
鉛、塩化第二錫、塩化アルミニウム、塩化第二鉄のよう
なフリーデルクラフツ形触媒を、メタンスルホン酸また
はp−トルエンスルホン酸などの有機スルホン酸を、更
にはトリフルオロメタンスルホン酸、ナフィオンH(商
品名:デュポン社製)のような超強酸を単独で使用する
かまたは併用してもよい。工業的に好ましいのは安価な
塩酸である。触媒の使用量は、芳香族アミン化合物に対
し10コル%以上、好ましくは20〜100モル%である。こ
の範囲以下では、反応の進行が遅くなり、また、完全に
第一アミンへの転化が達成されにくい。この範囲以上で
は反応における問題はないが、経済的でない。The acid catalyst may be an inorganic or organic acid, especially a mineral acid such as hydrochloric acid, phosphoric acid, sulfuric acid or nitric acid, or a Friedel-Crafts type catalyst such as zinc chloride, stannic chloride, aluminum chloride or ferric chloride. Is used alone or in combination with an organic sulfonic acid such as methanesulfonic acid or p-toluenesulfonic acid, and further a super strong acid such as trifluoromethanesulfonic acid and Nafion H (trade name: manufactured by DuPont). Good. Industrially preferable is inexpensive hydrochloric acid. The amount of the catalyst used is 10 col% or more, preferably 20 to 100 mol%, based on the aromatic amine compound. Below this range, the reaction progresses slowly, and complete conversion to the primary amine is difficult to achieve. Above this range, there is no problem in the reaction, but it is not economical.
反応温度は、130℃以上の温度であることが必要であ
り、130℃より低いと反応は極端に遅くなる。また反応
時間を出来るだけ短縮するためには約170〜240℃の温度
範囲が望ましい。反応時間は10〜40時間である。The reaction temperature must be 130 ° C or higher, and if it is lower than 130 ° C, the reaction becomes extremely slow. In order to shorten the reaction time as much as possible, a temperature range of about 170 to 240 ° C is desirable. The reaction time is between 10 and 40 hours.
なお、本発明の方法では反応に不活性な溶媒を使用し
てもよいが、通常は無触媒で反応を行なう。反応終了
後、触媒として使用した酸は、例えば苛性ソーダー水溶
液、水酸化カリウム水溶液、アンモニア水等の希アルカ
リ水溶液で中和した後、分液する。In the method of the present invention, a solvent inert to the reaction may be used, but the reaction is usually carried out without a catalyst. After completion of the reaction, the acid used as the catalyst is neutralized with a dilute alkaline aqueous solution such as an aqueous solution of caustic soda, an aqueous solution of potassium hydroxide and aqueous ammonia, and then separated.
以下の反応において未反応の芳香族アミン化合物が残
存する場合には、これを真空下で留去するか、あるいは
水蒸気蒸留によって留去する。When an unreacted aromatic amine compound remains in the following reaction, this is distilled off under vacuum or steam distillation.
以上のようにして本発明の芳香族アミノ樹脂が得られ
る。The aromatic amino resin of the present invention is obtained as described above.
以下、本発明を実施例により、更に詳細に説明する。 Hereinafter, the present invention will be described in more detail with reference to Examples.
実施例1 攪拌器、温度計およびディーンスターク共沸蒸留トラ
ップを装着した反応容器に、一般式(b)で表される芳
香族アミン化合物としてのアニリン111.6g(1.2モ
ル)、一般式(c)で表わされるアラルキルアルコール
誘導体としてのα,α′−ジメトキシ−p−キシレン6
6.5g(0.4モル)および触媒としての35%塩酸水溶液62.
6g(0.6モル)を装入し、窒素ガスを通気させながら昇
温した。内温110℃ぐらいからトラップに留出する水を
系外へ除去した。更に昇温すると約130℃よりメタノー
ルの留出が認められ、生成するメタノールを留去しなが
ら昇温をつづけ、170℃に達したのち3時間一定に保っ
た。メタノールの発生がほとんどなくなり、このあとひ
きつづき昇温して190〜200℃で12時間反応させた。次い
で、冷却して内温を95℃に下げ、これに15%苛性ソーダ
ー水溶液168gを加え、攪拌中和を行なった。静置後、下
層の水層を分液除去し、飽和食塩水300gを加え洗浄分液
を行なった。次に、窒素気流下で加熱脱水を行なったの
ち、加圧濾過して無機塩等を除いた。これを2〜3mmHg
の真空下で真空濃縮して未反応のアニリン51.9gを回収
した。残査を排出して淡黄褐色のアニリン樹脂94.5gを
得た。Example 1 A reaction vessel equipped with a stirrer, a thermometer, and a Dean-Stark azeotropic distillation trap had 111.6 g (1.2 mol) of aniline as an aromatic amine compound represented by the general formula (b), and a general formula (c). Α, α'-dimethoxy-p-xylene 6 as an aralkyl alcohol derivative represented by
6.5 g (0.4 mol) and 35% aqueous hydrochloric acid solution 62.
6 g (0.6 mol) was charged and the temperature was raised while nitrogen gas was passed through. Since the internal temperature was about 110 ° C, water distilled in the trap was removed from the system. When the temperature was further raised, methanol was distilled off from about 130 ° C., and the temperature was raised while distilling off the generated methanol. After reaching 170 ° C., the temperature was kept constant for 3 hours. The generation of methanol almost disappeared, and then the temperature was raised and the reaction was carried out at 190 to 200 ° C for 12 hours. Then, the mixture was cooled to reduce the internal temperature to 95 ° C., 168 g of a 15% aqueous caustic soda solution was added, and the mixture was stirred and neutralized. After standing, the lower aqueous layer was separated and removed, and 300 g of saturated saline was added to carry out washing and separation. Next, after heat dehydration was performed under a nitrogen stream, pressure filtration was performed to remove inorganic salts and the like. This is 2-3mmHg
After vacuum concentration under vacuum, 51.9 g of unreacted aniline was recovered. The residue was discharged to obtain 94.5 g of a light yellowish brown aniline resin.
以上のようにして得た本発明の芳香族アミノ樹脂を、
高速液体クロマトグラフィーにより組成分析した結果、
一般式(a)のn=0は28、n=1は16.8、n=2は1
0.5、n=3は7.8、n≧4は36.9(モル%)であった。The aromatic amino resin of the present invention obtained as described above,
As a result of composition analysis by high performance liquid chromatography,
In the general formula (a), n = 0 is 28, n = 1 is 16.8, and n = 2 is 1
0.5, n = 3 was 7.8, and n ≧ 4 was 36.9 (mol%).
また、この樹脂のアミノ当量(過塩素酸−氷酢酸法)
は0.578当量/(100g)であり、JIS−K−2548による環
球法軟化点測定装置で測定した軟化点は68℃であった。
また、平均分子量は960であった。Also, the amino equivalent of this resin (perchloric acid-glacial acetic acid method)
Was 0.578 equivalents / (100 g), and the softening point measured by a ring and ball method softening point measuring apparatus according to JIS-K-2548 was 68 ° C.
Further, the average molecular weight was 960.
なお、この樹脂のIR分析の結果を第1図に示す。 The results of IR analysis of this resin are shown in FIG.
実施例2 一般式(b)で表される芳香族アミン化合物として2,
4−ジアミノトルエン244.4g(2.0モル)を用い、触媒と
して35%塩酸209g(2.0モル)を用いた以外は実施例1
と同様にして反応させ、132gの赤褐色油状のジアミノト
ルエン樹脂を得た。Example 2 As the aromatic amine compound represented by the general formula (b),
Example 1 except that 244.4 g (2.0 mol) of 4-diaminotoluene was used and 209 g (2.0 mol) of 35% hydrochloric acid was used as a catalyst.
The reaction was carried out in the same manner as described above to obtain 132 g of reddish brown oily diaminotoluene resin.
以上のようにして得た本発明の芳香族アミノ樹脂を、
高速液体クロマトグラフィーにより組成分析した結果、
一般式(a)のn=0は44.5、n=1は29.7、n=2は
14.6、n≧3は11.2(モル%)であった。The aromatic amino resin of the present invention obtained as described above,
As a result of composition analysis by high performance liquid chromatography,
In the general formula (a), n = 0 is 44.5, n = 1 is 29.7, and n = 2 is
14.6 and n ≧ 3 were 11.2 (mol%).
また、この樹脂のアミン当量は1.204であり、軟化点
は46℃、平均分子量は550であった。The amine equivalent of this resin was 1.204, the softening point was 46 ° C., and the average molecular weight was 550.
実施例3 一般式(b)で表される芳香族アミン化合物としてア
ニリン121.1g(1.3モル)を用い、一般式(c)で表わ
されるアラルキルアルコール誘導体としてα,α′−ジ
ヒドロキシ−m−キシレン138.2g(1.0モル)を用い、
触媒として濃硫酸33g(0.325モル)を用いた以外は実施
例1と同様にして反応させ、淡黄褐色のアニリン樹脂15
1gを得た。Example 3 121.1 g (1.3 mol) of aniline was used as the aromatic amine compound represented by the general formula (b), and α, α'-dihydroxy-m-xylene 138.2 was used as the aralkyl alcohol derivative represented by the general formula (c). g (1.0 mol),
The reaction was carried out in the same manner as in Example 1 except that 33 g (0.325 mol) of concentrated sulfuric acid was used as the catalyst, and a light yellowish brown aniline resin 15
1 g was obtained.
以上のようにして得た本発明の芳香族アミノ樹脂のア
ミン当量は0.496であり、JIS−K−2548による環球法軟
化点測定装置で測定した軟化点は118℃であり、平均分
子量は6500であった。The aromatic amino resin of the present invention thus obtained has an amine equivalent of 0.496, a softening point measured by a ring and ball softening point measuring device according to JIS-K-2548 of 118 ° C., and an average molecular weight of 6500. there were.
実施例4 反応容器に一般式(b)で表される芳香族アミン化合
物としてのp−アミノフェノール109g(1.0モル)、一
般式(c)で表わされるアラルキルアルコール誘導体と
してのα,α′−ジアセトキシ−p−キシレン110.2g
(0.5モル)、触媒としての塩化亜鉛6.8g(0.05モル)
とp−トルエンスルホン酸19g(0.1モル)を装入し、水
流ポンプによる減圧下で反応させた。反応は130℃ぐら
いから始まり3時間で170℃まで昇温した。途中、生成
する酢酸は深冷トラップで回収した。同温度で3時間保
持したのち、更に反応温度を200℃まで上げ200〜210℃
で1時間熟成を行なって終了した。95℃まで冷却してか
らトルエン300mlを加え、攪拌溶解させ、これにトリエ
チルアミン20.2gを加えたのち、水200mlを加え攪拌後、
静置して下層である水層を分液除去した。更にもう一
回、水200mlで水洗分液を行なったのち、真空濃縮して
トルエンおよび未反応のp−アミノフェノールを除去し
た。得られた残査の褐色樹脂としてp−アミノフェノー
ルの共縮合樹脂138gを得た。Example 4 109 g (1.0 mol) of p-aminophenol as an aromatic amine compound represented by the general formula (b) and α, α′-diacetoxy as an aralkyl alcohol derivative represented by the general formula (c) were placed in a reaction vessel. -P-xylene 110.2g
(0.5 mol), zinc chloride as catalyst 6.8 g (0.05 mol)
And 19 g (0.1 mol) of p-toluenesulfonic acid were charged and the reaction was carried out under reduced pressure by a water-jet pump. The reaction started at around 130 ° C and was heated up to 170 ° C in 3 hours. On the way, acetic acid produced was collected by a cryogenic trap. After maintaining at the same temperature for 3 hours, the reaction temperature is further increased to 200 ° C and 200 to 210 ° C.
It was aged for 1 hour and finished. After cooling to 95 ° C, 300 ml of toluene was added and dissolved by stirring. To this, 20.2 g of triethylamine was added, and then 200 ml of water was added and after stirring,
The mixture was allowed to stand, and the lower aqueous layer was separated and removed. The liquid was washed once again with 200 ml of water for liquid separation, and concentrated in vacuo to remove toluene and unreacted p-aminophenol. As a residual brown resin thus obtained, 138 g of a co-condensation resin of p-aminophenol was obtained.
以上のようにして得た本発明の芳香族アミノ樹脂のア
ミン当量は0.525であり、JIS−K−2548による環球法軟
化点測定装置で測定した軟化点は94℃であり、平均分子
量は2200であった。The aromatic amino resin of the present invention obtained as described above has an amine equivalent of 0.525, a softening point measured by a ring and ball softening point measuring device according to JIS-K-2548 of 94 ° C., and an average molecular weight of 2200. there were.
実施例5〜13 一般式(b)で表される芳香族アミン化合物の種類、
一般式(c)で表わされるアラルキルアルコール誘導体
の種類と量、触媒の種類と量および反応条件を表−1に
示すようにした以外は実施例1と同様に反応させ、表−
1に示すような本発明の各種芳香族アミン樹脂を得た。Examples 5 to 13 Types of aromatic amine compounds represented by the general formula (b),
The reaction was carried out in the same manner as in Example 1 except that the type and amount of the aralkyl alcohol derivative represented by the general formula (c), the type and amount of the catalyst, and the reaction conditions were as shown in Table 1.
Various aromatic amine resins of the present invention as shown in 1 were obtained.
使用例1 実施例1で得たアニリン樹脂100gを乾燥オルソジクロ
ロベンゼン1400gに溶解させた。次に、温度5〜10℃で
ホスゲン253gを3時間かけて溶液中に吹きこんだ。この
後、ホスゲンをゆっくりと吹き込みながら昇温して120
〜140℃で2時間熟成を行なった。次いで、ホスゲンの
通気を止めて窒素ガスの通気に切り換え、十分脱ガスを
行なってから冷却した。この反応液を真空濃縮して溶剤
のオルソジクロロベンゼンを回収し、淡褐色油状のイソ
シアナート化樹脂111gを得た。 Use Example 1 100 g of the aniline resin obtained in Example 1 was dissolved in 1400 g of dry orthodichlorobenzene. Next, at a temperature of 5 to 10 ° C., 253 g of phosgene was blown into the solution over 3 hours. After this, the temperature was raised by slowly blowing phosgene to 120
Aged at ~ 140 ° C for 2 hours. Then, ventilation of phosgene was stopped, and ventilation of nitrogen gas was switched to sufficient degassing, followed by cooling. The reaction solution was concentrated under vacuum to recover the solvent ortho-dichlorobenzene, and 111 g of a light brown oily isocyanate resin was obtained.
以上のようにして得たイソシアナート化樹脂10.4gを
メチレンクロリド400gに溶解し「A液」とした。次に、
DETDA(エチルコーポレーション製)2.2g/JEFFAMINE T
−5000(テキサコケミカル製)10g/メチレンクロリド25
00gより成る「B液」と前記「A液」とを混合し、これ
をガラス板に流延させ、一夜放置後、120℃/2時間ポス
トキュアすることによって良好なポリウレアフィルムを
得ることができた。10.4 g of the isocyanate resin obtained as described above was dissolved in 400 g of methylene chloride to give “A liquid”. next,
DETDA (Ethyl Corporation) 2.2g / JEFFAMINE T
-5000 (manufactured by Texaco Chemical) 10 g / methylene chloride 25
A good polyurea film can be obtained by mixing the “solution B” composed of 00 g and the “solution A”, casting the mixture on a glass plate, leaving it to stand overnight, and post-curing at 120 ° C. for 2 hours. Was.
使用例2 実施例1で得られたアニリン樹脂40重量部とビスマレ
イミド−s(大和化成工業製)100重量部とを混合し、1
80℃で10分間加熱溶融を行なってプレポリマーを作製し
た。Use Example 2 40 parts by weight of the aniline resin obtained in Example 1 and 100 parts by weight of bismaleimide-s (manufactured by Daiwa Kasei Kogyo Co., Ltd.) were mixed to prepare 1
A prepolymer was prepared by heating and melting at 80 ° C. for 10 minutes.
このプレポリマーの各種溶剤に対する溶解性を測定し
た。その結果を実験例1として表−2に示す。更に、こ
のプレポリマーの外観、軟化温度、ゲル化時間、嵩比重
を実験例1として表−3に示す。なお、比較のため、市
販のケルイミド−1050(商品名:成形グレード、日本ポ
リイミド(株)製)について同様に行なった結果を比較
実験例1として表2および表3に示す。The solubility of this prepolymer in various solvents was measured. The results are shown in Table 2 as Experimental Example 1. Further, the appearance, softening temperature, gelling time, and bulk specific gravity of this prepolymer are shown in Table 3 as Experimental Example 1. For comparison, Table 2 and Table 3 show, as Comparative Experimental Example 1, the same results as those of commercially available Kelimide-1050 (trade name: molding grade, manufactured by Nippon Polyimide Co., Ltd.).
次に、このプレポリマーおよびケルイミド−1050を各
々200℃の温度で40kg/cm2の圧力のもとで1時間圧縮成
形を行ない、その後250℃で4時間ポストキュアして硬
化物の試験片を作成した。この試験片の機械強度および
熱物性などを測定した。その結果を各々実験例1、比較
実験例1として表−3に示す。Next, each of the prepolymer and Kelimide-1050 was compression-molded at a temperature of 200 ° C. under a pressure of 40 kg / cm 2 for 1 hour and then post-cured at 250 ° C. for 4 hours to obtain a cured test piece. Created. The mechanical strength and thermophysical properties of this test piece were measured. The results are shown in Table 3 as Experimental Example 1 and Comparative Experimental Example 1, respectively.
〔発明の効果〕 以上説明したように、本発明の芳香族アミン樹脂は第
一アミンから成る樹脂なので、イソシアナート化、マレ
イミド化、エポキシ化などが容易であり、ポリアミドな
どの原料としても利用可能である。 [Effects of the Invention] As described above, since the aromatic amine resin of the present invention is a resin composed of primary amines, it is easy to undergo isocyanate formation, maleimidation formation, epoxidation formation, etc., and can be used as a raw material for polyamide and the like. Is.
更に、本発明の芳香族アミン樹脂を硬化剤として、あ
るいは他の樹脂の原料として用いた場合には、得られる
硬化樹脂は、機械的強度、寸法安定性、耐熱性、光およ
び空気中の酸素に対する安定性に優れており、またその
硬化速度も速い。Furthermore, when the aromatic amine resin of the present invention is used as a curing agent or as a raw material for other resins, the resulting cured resin has mechanical strength, dimensional stability, heat resistance, light and oxygen in the air. It has excellent stability to and has a fast curing speed.
更に、本発明の芳香族アミン樹脂を用いたプレポリマ
ーは、低融点溶剤に可溶であるため、良好なプレポリマ
ーを容易に得られる。Further, since the prepolymer using the aromatic amine resin of the present invention is soluble in the low melting point solvent, a good prepolymer can be easily obtained.
更に、本発明の芳香族アミン樹脂は、安価な原料か
ら、簡単な操作により製造でき、しかも副成物のない無
公害な方法で得られる。Furthermore, the aromatic amine resin of the present invention can be produced from an inexpensive raw material by a simple operation, and can be obtained by a pollution-free method with no by-products.
本発明の芳香族アミン樹脂は、以上のような効果を有
するので、硬化剤、硬化樹脂の原料、キレート樹脂、イ
オン交換樹脂、成形材料、絶縁塗料、接着剤、ゴム変性
剤、各種樹脂に対する添加剤、脱酸剤およびポリイミ
ド、ポリアミド、ポリアミドイミドの原料等、多方面に
利用できる。Since the aromatic amine resin of the present invention has the above effects, it is added to a curing agent, a raw material of the curing resin, a chelate resin, an ion exchange resin, a molding material, an insulating paint, an adhesive, a rubber modifier, and various resins. It can be used in various fields such as agents, deoxidizers, and raw materials for polyimide, polyamide, and polyamideimide.
第1図は、実施例1により得た芳香族アミン樹脂のIR分
析結果を示す図である。FIG. 1 is a graph showing the IR analysis result of the aromatic amine resin obtained in Example 1.
Claims (2)
基、ジフェニレン基、ジフェニルエーテル基またはナフ
チレニル基を示し、R1はハロゲン原子、水酸基、炭素数
4以下の低級アルコキシ基または炭素数5以下の低級ア
ルキル基を示し、かつR1は互いに同一であっても異なっ
てもよく、環を形成してもよい。lは1または2を示
し、mは0〜3の整数を示し、nは0〜300の整数を示
す。)で表わされる芳香族アミン樹脂。1. A compound of the general formula (a) (In the formula, A represents a phenylene group, an alkyl-substituted phenylene group, a diphenylene group, a diphenyl ether group or a naphthylenyl group, and R 1 is a halogen atom, a hydroxyl group, a lower alkoxy group having 4 or less carbon atoms, or a lower alkyl group having 5 or less carbon atoms. And R 1 may be the same or different from each other and may form a ring, 1 represents 1 or 2, m represents an integer of 0 to 3, and n represents 0 to 300. An aromatic amine resin represented by an integer.
級アルコキシ基または炭素数5以下の低級アルキル基を
示し、かつR1は互いに同一であっても異なってもよく、
環を形成してもよい。lは1または2を示し、mは0〜
3の整数を示す。)で表わされる芳香族アミン化合物
と、 一般式(c) R2OCH2−A−CH2OR2 (c) (式中、Aはフェニレン基、アルキル置換フェニレン
基、ジフェニレン基、ジフェニルエーテル基またはナフ
チレニル基を示し、R2は水素原子、アシル基または炭素
数4以下の低級アルキル基を示す。)で表わされるアラ
ルキルアルコール誘導体を前記芳香族アミン化合物に対
して10モル%以上の酸触媒の存在下で反応させることを
特徴とする 一般式(a) (式中、Aはフェニレン基、アルキル置換フェニレン
基、ジフェニレン基、ジフェニルエーテル基またはナフ
チレニル基を示し、R1はハロゲン原子、水酸基、炭素数
4以下の低級アルコキシ基または炭素数5以下の低級ア
ルキル基を示し、かつR1は互いに同一であっても異なっ
てもよく、環を形成してもよい。lは1または2を示
し、mは0〜3の整数を示し、nは0〜300の整数を示
す。)で表わされる芳香族アミン樹脂の製造方法。2. Formula (b) (In the formula, R 1 represents a halogen atom, a hydroxyl group, a lower alkoxy group having 4 or less carbon atoms or a lower alkyl group having 5 or less carbon atoms, and R 1 may be the same or different from each other,
You may form a ring. l represents 1 or 2, m is 0
Indicates an integer of 3. And an aromatic amine compound represented by the general formula (c) R 2 OCH 2 —A—CH 2 OR 2 (c) (In the formula, A is a phenylene group, an alkyl-substituted phenylene group, a diphenylene group, a diphenyl ether group or a naphthylenyl group. Group, wherein R 2 represents a hydrogen atom, an acyl group or a lower alkyl group having 4 or less carbon atoms) in the presence of 10 mol% or more of an acid catalyst with respect to the aromatic amine compound. The general formula (a) is characterized in that (In the formula, A represents a phenylene group, an alkyl-substituted phenylene group, a diphenylene group, a diphenyl ether group or a naphthylenyl group, and R 1 is a halogen atom, a hydroxyl group, a lower alkoxy group having 4 or less carbon atoms or a lower alkyl group having 5 or less carbon atoms. And R 1 may be the same or different from each other and may form a ring, 1 represents 1 or 2, m represents an integer of 0 to 3, and n represents 0 to 300. A method for producing an aromatic amine resin represented by.
Priority Applications (12)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62252517A JPH0816151B2 (en) | 1987-10-08 | 1987-10-08 | Aromatic amine resin and method for producing the same |
| EP88309298A EP0311387B1 (en) | 1987-10-08 | 1988-10-06 | Aromatic amine resins, their production process and thermosetting resin compositions making use of the same |
| DE88309298T DE3883134T2 (en) | 1987-10-08 | 1988-10-06 | Aromatic amine resins, their manufacturing process and thermosetting resin mixtures using them. |
| AU23486/88A AU589071B2 (en) | 1987-10-08 | 1988-10-07 | Aromatic amine resins, their production process and thermosetting resin compositions making use of the same |
| CA000579570A CA1312875C (en) | 1987-10-08 | 1988-10-07 | Aromatic amine resins, their production process and thermosetting resin compositions making use of the same |
| US07/254,701 US4937318A (en) | 1987-10-08 | 1988-10-07 | Aromatic amine resins |
| KR1019880013160A KR910008334B1 (en) | 1987-10-08 | 1988-10-08 | Aromatic amine resin and its preparation |
| CN 88107877 CN1017055B (en) | 1987-10-08 | 1988-10-08 | Method for producing aromatic amine resin |
| US07/511,235 US5051494A (en) | 1987-10-08 | 1990-04-19 | Thermosetting resin composition comprising an aromatic amine |
| US07/511,093 US5106953A (en) | 1987-10-08 | 1990-04-19 | Aromatic amine resins, processes for producing the same and a thermosetting resin composition containing the same |
| US07/823,478 US5145949A (en) | 1987-10-08 | 1992-01-22 | Production process for making aromatic amine resins |
| CN92100728A CN1062544A (en) | 1987-10-08 | 1992-02-01 | Thermosetting resin composition containing novel aromatic amine resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62252517A JPH0816151B2 (en) | 1987-10-08 | 1987-10-08 | Aromatic amine resin and method for producing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0195125A JPH0195125A (en) | 1989-04-13 |
| JPH0816151B2 true JPH0816151B2 (en) | 1996-02-21 |
Family
ID=17238470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62252517A Expired - Lifetime JPH0816151B2 (en) | 1987-10-08 | 1987-10-08 | Aromatic amine resin and method for producing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0816151B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW473493B (en) | 1996-11-13 | 2002-01-21 | Mitsui Chemicals Inc | Polymaleimide resin composition and laminate plate for semiconductor substrate using it |
| JP5019585B2 (en) * | 2007-02-26 | 2012-09-05 | 日本化薬株式会社 | Epoxy resin composition, cured product thereof, and fiber-reinforced composite material |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5214280A (en) * | 1975-07-25 | 1977-02-03 | Retsukisu Kogyo Kk | Chuck device |
-
1987
- 1987-10-08 JP JP62252517A patent/JPH0816151B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0195125A (en) | 1989-04-13 |
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