JPH08167635A - Jig for preventing positional deviation of integrated circuit package - Google Patents

Abstract

PURPOSE: To prevent the positional deviation of an integrated circuit package positioned in a visual inspector when the package is set on a low-frictional coefficient inspecting stage of the inspector by a carrying jig. CONSTITUTION: With keeping away from a rubber-made suction pad (nozzle) 8 at the top end of a carrying arm 7, a tubular jig 9 having a spring 14 is moved to depress a mold surface of an integrated circuit package 1 enough to change it from its suction state to a suction stop stage while the shear exerted on the package 1 due to the elastic deformation of the pad 8 is forcibly suppressed by the total load of the elastic force of the spring 14 and the weight of the jig 9.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit package (hereinafter referred to as "IC") inspection device for preventing positional deviation of an integrated circuit package that prevents the positional deviation of the IC that occurs when the IC is transported or transferred. Regarding jigs.

[0002]

2. Description of the Related Art In various IC inspection apparatuses, a carrying jig is used to carry and transfer an IC. This transfer jig comprises a combination of a transfer arm and a nozzle, and the nozzle is pressed against the mold surface of the IC, and the inside of the nozzle is evacuated through the transfer arm to suck the IC by vacuum.

The transfer arm 7 has a length of 5 as shown in FIG.
It is an iron pipe pipe having a diameter of 0 to 70 mm and a diameter of 8 mm, and a hollow nozzle 8 having a conical shape with a bottom diameter of 5 mm is attached to the tip of the transfer arm 7 that comes into contact with the mold surface of the IC 1 to be detected. Has been.

For the conical nozzle 8, a rubber suction pad is used which can maintain the close contact with the mold surface of the detected IC 1 in consideration of the state of the mold surface of the detected IC 1. The mold surface of the IC is securely vacuum-adsorbed.

The IC1 is transferred using the above-mentioned transfer jig.
In transferring, first, the transfer arm 7 is set to the nozzle 8
Is lowered to a height at which it contacts the mold surface of IC1 to be detected, the nozzle 8 at the tip of the transfer arm 7 is brought into contact with the mold surface of IC1, and the inside of the nozzle 8 is evacuated through the transfer arm 7 by a vacuum suction unit that generates a vacuum. hand,
The mold surface of the detected IC 1 is vacuum-sucked.

Next, the transfer arm 7 is raised and laterally moved to a predetermined position, and then the transfer arm 7 and the nozzle 8 are again moved.
Is lowered to position IC1 at the set position of the inspection device, the vacuum suction unit returns the inside of the nozzle 8 from the vacuum state to the atmospheric pressure state through the transfer arm 7, and the detected IC1 is moved to the set position of the inspection device. Put it.

Next, referring to FIG. 3, a general visual inspection apparatus 1
The configuration of No. 7 will be described. The appearance inspection device 17 is a detected IC
1 is mounted on the tray 2, the measuring unit 4 for measuring the lead shape dimension of the IC 1 to be detected, and the lead shape dimension data value measured by the measuring section 4 is compared with the set standard value. The data processing unit section 18 for determining the quality of the detected IC 1 is stored, the non-defective article storage section 5 for storing only the good detected IC 1 by the output of the data processing unit 18, and the defective detected IC 1 are stored. The defective jig storage unit 6 is used to transfer and transfer the IC from the supply unit 3 to the storage unit 5 or 6 using the transfer jig.

The role of the carrying jig (the carrying arm 7 and the nozzle 8) in the appearance inspection device 17 is to firstly measure the lead shape of the detected IC 1 mounted on the tray 2 supplied to the supply section 3. In order to perform this, highly accurate transportation into the limited inspection area on the measurement unit 4 is performed, and secondly, after the measurement is completed, a non-defective product is determined to be a non-defective product according to the result of the pass / fail judgment in the data processing unit 18. This is to reliably store the defective product in the tray 2 of the storage unit 5 in the tray 2 of the defective product storage unit 6, respectively.

[0009]

By the way, the IC to be detected is detected by a transfer jig using the transfer arm 7 and the nozzle 8.
When 1 is transferred, the rubber suction pad used for the nozzle 8 of the transfer arm 7 is elastically deformed by about 15% when the IC is sucked and when the IC is not sucked. Power is generated when returning to the state.

The power generated in the suction pad at that time is 3.
It is about 0 gf (W), and the friction coefficient of the inspection stage surface of the appearance inspection device on which the IC is transferred is 0.03 (F / W).
When the detected IC1 weighs 10 g, the maximum lateral deviation of the IC is about 100 μm. Therefore, it is very difficult for the transfer jig using the transfer arm 7 and the nozzle 8 to install the detection target IC 1 to be transferred in a minute inspection area on the measurement unit 4, and especially when the measurement unit 4 is a laser device. In the visual inspection device 17 composed of a displacement meter,
Since the lead edge coordinates are measured by the one-dimensional scanning of the laser displacement meter, if an error occurs in the measurement point of the lead coordinates of the detected IC 1, the measurement result data of each measurement item will be different from the definition of each measurement item, The reliability of the measurement data result becomes low, which causes a problem such as an increase in false alarm rate and miss rate, which causes an erroneous inspection result when a good product is a defective product or a defective product is a good product.

Further, due to the elastic deformation of the rubber suction pad (nozzle) 8 at the tip of the carrying jig, the IC 1 to be detected is detected.
It is difficult to keep the IC horizontal because the tilt phenomenon occurs in the IC, the IC cannot be reliably accommodated in the accommodating tray 2 after the detection is completed, and the lead of the IC 1 to be detected comes into contact with the tray 2 so that a defective IC is defective. There was a risk that this would occur.

An object of the present invention is to provide an integrated circuit package which corrects the inclination of the IC caused by elastic deformation of the suction pad when the suction suction of the IC by the suction pad is stopped or the suction is stopped, and prevents lateral displacement of the IC. It is to provide a jig for preventing positional deviation.

[0013]

In order to achieve the above object, a jig for preventing misalignment of an integrated circuit package according to the present invention has a pressing jig, and an integrated circuit package using a suction pad at the tip of a carrying jig. When vacuum adsorption or adsorption stop of
A jig for preventing positional deviation of the integrated circuit package for preventing positional deviation of the integrated circuit package caused by elastic deformation of the suction pad, wherein the reduction jig is slidably provided on the tip of the carrying jig. And pressing down the mold surface of the integrated circuit package while avoiding the suction pad,
The tilt of the integrated circuit package caused by the elastic deformation of the suction pad is corrected, and the elastic force of the suction pad acts on the integrated circuit package to cancel the lateral force applied to the integrated circuit package.

Further, the pressing jig produces the drag force by its own weight.

The pressing jig applies an external force to the dead weight to generate the drag force.

Further, the pressing jig obtains an external force to generate the drag force.

The pressing jig is provided with a rotation stop and slides.

The pressing jig is composed of a hollow structure surrounding the outer circumference of the suction pad, and has a flat lower surface that contacts the mold surface of the integrated circuit package.

[0019]

It is noted that the elastic deformation caused in the suction pad when the suction suction of the IC is stopped or the suction is stopped by the suction pad causes the phenomenon of the inclination of the IC and the phenomenon of the lateral displacement. Down the mold surface of the IC,
The IC tilt phenomenon due to the elastic deformation of the suction pad is suppressed, and the IC moving direction due to the elastic deformation of the suction pad is restricted only to the lateral direction, and the reaction force against the lateral movement force of the IC is exerted through the pressing jig. With the drag force I
The moving force of C is canceled to prevent displacement of the IC.

[0020]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1A is a cross-sectional front view of a main part showing Embodiment 1 of the present invention, and FIG. 1B is a sectional view taken along line II of FIG.
A line cross-sectional view, (c) is a cross-sectional front view of a main portion showing an IC suction state.

In the figure, the jig for preventing misalignment of the integrated circuit package according to the present invention is intended for the carrying jig including the carrying arm 7 and the nozzle 8 shown in FIG. An IC 1 that has a pressing jig 9 and is generated by elastic deformation of the suction pad 8 when the suction suction of the IC (nozzle 8) 8 at the tip of the transfer jig is performed by vacuum suction or when suction of the IC is stopped.
It is intended to prevent the positional deviation of the.

In the present invention, the pressing jig 9 is slidably provided at the tip of the carrying jig, and the mold surface 1a of the IC1 is pressed down while avoiding the suction pad 8 to correct the inclination of the IC1. , Due to elastic deformation of the suction pad 8
A drag force that cancels the lateral force applied to C is applied to IC1.

The pressing jig 9 of this embodiment produces the above-mentioned drag force by its own weight, and is provided with a rotation stop so that it can slide. The pressing jig of this embodiment is composed of a hollow structure that surrounds the outer periphery of the suction pad 8, and contacts the mold surface 1a of the IC 1 with the flat lower surface 9a. A specific example of the tool 9 is shown in FIG. 1 (a), taking a hollow jig 9 having a hollow structure made of a tubular body (hereinafter referred to as a tubular jig 9) as an example.
This will be described with reference to (b) and (c).

The cylindrical jig 9 according to this embodiment is made of an iron cylindrical body, and its diameter is about 2 mm larger than the diameter of the rubber suction pad 8 forming the nozzle at the tip of the transfer arm 7, and the height is about 30 mm. It consists of a cylinder with a wall thickness of 1 mm.
In the case of the above example, when the friction coefficient of the inspection stage surface of the appearance inspection device is about 0.03 (F / W) and the detected IC 1 has a weight of 10 g, the weight of the cylindrical jig 9 is 30 to 40 g.
It is appropriately set within the range. The weight of the cylindrical jig 9 described above is a value that does not affect the suction of the IC by the suction pad.

The cylindrical jig 9 is provided so as to be slidable on the outer periphery of the transfer arm 7 and movable up and down. The guide 11 is inserted into the cylindrical jig 9 for about 15 mm (the suction stroke of the IC 1 to be detected). Four holes 12 are formed diagonally through the vertical direction (longer than the length).

A cylindrical iron fixing part 10 is fixed to the transfer arm 7, and the hole 1 of the cylindrical jig 9 is fixed to the fixing part 10.
2 has a hole 10a for receiving the guide 11. The guide 11 has its upper end fixed in a hole 10a penetrating in the vertical direction of the fixing portion 10 and extends downward in parallel with the transport arm 7, and its lower end is locked in the hole 12 of the cylindrical jig 9 so as not to be pulled out. Are fitted together to support the cylindrical jig 9 slidably in the vertical direction. Here, since the holes 12 penetrating in the vertical direction are arranged in four directions in the cylindrical jig 9, the cylindrical jig 9 slides while being prevented from rotating with respect to the transfer arm 7 by using the guide 11 as a guide. With this structure, the displacement of the cylindrical jig 9 in the rotational direction does not occur due to the rotational displacement of the tubular jig 9.

Further, the side surface of the fixed portion 10 has a screw hole, and is screwed on all four sides 16 mm to be 3 mm higher than the lower end 8a of the rubber suction pad (nozzle) 8 of the transfer arm 7.
The cylindrical jig 9 is supported by the transfer arm 7 so that the lower end 9a of the cylindrical jig 9 is located at a low height. The lower surface 9a of the tubular jig 9 is flat.

A case will be described in which ICs are transferred and transferred using the transfer jig according to the first embodiment. When the IC is vacuum-sucked, the transfer jig is positioned right above the IC. In this case, the cylindrical jig 9 projects downward from the lower end 8a of the suction pad 8 at the tip of the transfer arm by its own weight. The amount of protrusion is 3 mm set above.

In this state, the transfer arm 7 is lowered to avoid the suction pad 8 and the cylindrical jig 9 is attached to the mold surface 1 of the IC 1.
Then, the transfer arm 7 is lowered about 3 mm to bring the suction pad 8 into contact with the mold surface 1a of the IC 1. Next, the transfer arm 7 and the suction pad 8 are evacuated to suction the IC by the suction pad 8 (see FIG.
(C)). The IC is transported in this state. After the transportation, when the IC is set at the set position of the appearance inspection apparatus, the IC suctioned by the transportation jig is placed on a pallet or the like, and the evacuation of the suction pellet 8 is stopped.

Here, when the IC is vacuum-sucked by the suction pad 8 and when the IC is released by opening the suction pad to the atmosphere, the IC is tilted and laterally displaced due to elastic deformation of the suction pad. The phenomenon occurs.

According to the first embodiment of the present invention, since the flat lower surface 9a of the tubular jig 9 contacts the mold surface 1a of the IC 1 and applies its own weight to the IC pad 1, the IC pad 1 is pressed down. The tilt is corrected and the IC is held horizontally. Further, when the inclination of the IC is corrected and the IC is kept horizontal, the moving direction of the IC due to the elastic deformation of the suction pad 8 is restricted only to the lateral direction. However, the mold surface 1a of the IC1 has a cylindrical jig. The reaction force due to the own weight of 9 acts downward, and the reaction force cancels the lateral movement force of IC1 and suppresses the movement of IC, so that the lateral displacement of IC is avoided. As a result, by applying the jig of the present invention to the conveying jig in the visual inspection device 17 shown in FIG. 3, each part in the visual inspection device 17 (supply unit 3, measurement unit 4, non-defective item storage unit 5, ICs that are problematic when transferred to the defective product storage section 6)
The position shift of is prevented. As a result, the reliability of the measurement data and the stability when placing the detected IC 1 are enhanced, and the lead appearance of the detected IC 1 can be reliably selected. The dimensions, weight, etc. of the tubular jig 9 described above are examples, and the dimensions, weight, and appearance of the transport arm and the suction pad of the transport jig with which the tubular jig 9 is combined. It is arbitrarily selected based on factors such as the surface friction coefficient of the inspection stage of the inspection device.

In the first embodiment, the reaction force due to the own weight of the tubular jig 9 is applied to the downward direction of the IC, but the lightweight tubular jig 9 is used, and the fixing portion 10 and the tubular jig 9 are connected to each other. A spring is stretched between the two to apply a reaction force only to the spring load of the spring to the IC1 through the cylindrical jig 9, and the reaction force due to the spring load of the spring cancels the lateral movement force of the IC. Alternatively, the movement of the IC may be suppressed to avoid lateral displacement of the IC. In this case, the tubular jig (roll-down jig) 9 receives the external force from the spring to generate the drag force. In addition, tubular jig (roll down jig)
The means by which 9 obtains an external force is not limited to the spring.

(Embodiment 2) FIG. 2A is a cross-sectional front view of a main part showing a jig for preventing misalignment of an integrated circuit package according to Embodiment 2 of the present invention, and FIG. -II line sectional drawing, (c) is a principal part sectional front view which shows the adsorption | suction state of IC.

In the jig for preventing misalignment of the first embodiment shown in FIG. 1, when the vacuum pressure is strengthened in accordance with the change of physical factors such as the size and weight of the IC 1 to be detected, the rubber suction pad at the time of suction. Since the (nozzle) 8 is largely elastically deformed as shown in the conventional example, the detected IC is detected only by the weight of the tubular jig 9.
In some cases, it may not be possible to stably carry the No. 1 sheet.

Therefore, in this embodiment, the fixing portion 10 is provided with the spring 14 having an elastic force weaker than the suction force of the rubber suction pad (nozzle) 8 of the transfer arm 7 in the displacement preventing jig described in the first embodiment. And a cylindrical jig 9 are added. According to the present embodiment, the elastic force of the spring 14 is added to the weight of the tubular jig 9 as compared with the case where only the own weight of the tubular jig 9 as in the first embodiment is applied, and the total load is applied to the IC. Since it acts as a drag force, the drag force acting on the detected IC 1 can be increased, and the increase in the vacuum force of the suction pad due to a change in physical factors such as the size and weight of the detected IC 1 can be dealt with. Even if the detection IC1 is large,
The inclination of the IC caused by the elastic deformation of the suction pad adapted to generate a strong vacuum force can be corrected by the total load of the elastic force of the spring 14 and the weight of the tubular jig 9, and a large object to be detected can be detected. The IC1 can always be held in a stable posture.

When the detected IC 1 is transferred to the set position, the flat load is applied to the flat bottom surface 9a of the cylindrical jig 9 by the total load of the elastic force of the spring 14 and the weight of the cylindrical jig 9. By pressing down the mold surface 1a of the detection IC1 to correct the inclination of the IC1 and restricting the moving direction of the IC1 due to the elastic deformation of the suction pad 8 only in the lateral direction, the tube is resisted against the lateral moving force of the IC. A reaction force due to the total load of the elastic force of the spring 14 and the weight of the cylindrical jig 9 is applied via the jig 9, and the moving force of IC1 is canceled by the reaction force to cancel IC1.
It is possible to prevent the displacement of the position. In addition, spring 1
4 can be replaced by urethane rubber having elasticity. Further, the convex portion 13 is provided on the transfer arm 7 and the concave portion 15 is provided on the tubular jig 9, respectively, and the convex and concave portions 13 and 15 are coupled to each other by concavo-convex connection so that the cylindrical jig 9 is prevented from rotating with respect to the transport arm 7. The jig 9 is slid so that the IC 1 is not displaced in the rotational direction due to the rotational displacement of the tubular jig 9.

In the embodiment, the cylindrical jig 9 is used as the pressing jig, but the jig is not limited to the cylindrical jig, and a hollow jig having a polygonal cylindrical shape may be used. Good. Further, the jig for preventing misalignment of the present invention is applied to the appearance inspection device, but the invention is not limited to this, and the IC can be accurately conveyed like a handler equipped with a tester and the set position can be set with high accuracy. It is applicable to any device as long as it is transferred to.

[0039]

As described above, according to the present invention, the mold surface of the IC is pressed down by the pressing jig, and in order to suppress the inclination phenomenon of the IC due to the elastic deformation of the suction pad, the suction pad is vacuum sucked. The IC can be held horizontally and held, and the IC can be transported and transferred reliably.

Further, the mold surface of the IC is pressed by a pressing jig to correct the inclination of the IC due to the elastic deformation of the suction pad, and the movement direction of the IC due to the elastic deformation of the suction pad is restricted to the lateral direction. The reaction force is applied to the lateral movement force of the
To cancel the displacement of IC by canceling the moving force of
Even when the IC is detached from the suction pad, the IC is not displaced in the lateral direction, and the detection target IC to be transferred can be installed in a minute inspection area, and the lead coordinates of the detection IC are measured. It is possible to prevent the occurrence of errors in the points and increase the reliability of the inspection result, and the false alarm rate and the oversight rate that cause false inspection results as if the good product is a defective product or the defective product is a good product. Can be reduced. In addition, ICs adjacent to each other on the inspection stage of the appearance inspection device
It is possible to prevent defective ICs from being produced without collision between them.

Further, the pressing jig is slidably provided at the tip of the carrying jig and presses down the mold surface of the IC while avoiding the suction pad, so that the suction pad interferes with the vacuum suction operation of the IC. In this case, the vacuum suction operation of the IC by the suction pad and the position deviation prevention operation of the IC by the pressing jig can be performed in parallel, and the processing can be performed quickly.

Further, as a drag force for canceling the moving force applied to the IC, any one of a load due to the weight of the pressing jig, a total load obtained by adding an external force to the weight of the pressing jig, and a load due to an external force applied to the pressing jig are used. Can be used, IC
It is possible to select a drag force that cancels the moving force applied to the IC by adapting it to the IC to be transferred, and for example, if the vacuum pressure becomes stronger as the physical factors such as the size and weight of the IC to be detected are changed. However, it is possible to handle the IC in a stable manner.

Further, by pressing down the IC with a pressing jig having a hollow structure surrounding the outer circumference of the suction pad, the surface of the IC of the suction pad can be uniformly pressed down by the pressing jig. , The inclination of the IC can be surely corrected, and the lateral deviation can be surely regulated.

[Brief description of drawings]

1A is a cross-sectional front view of a main part of a jig for preventing misalignment of an integrated circuit package according to a first embodiment of the present invention, FIG. 1B is a cross-sectional view taken along line I-I of FIG. (C) is a front view of a cross section of a main portion showing a suction state of an IC.

2A is a cross-sectional front view of a main part of a jig for preventing misalignment of an integrated circuit package according to a second embodiment of the invention, FIG. 2B is a cross-sectional view taken along line II-II of FIG. (C) is I
It is a principal part sectional front view which shows the adsorption state of C.

FIG. 3 is a diagram showing a state in which a conventional example is applied to a general appearance inspection device.

[Explanation of symbols]

 1 IC 1a IC mold surface 7 Transfer arm 8 Adsorption pad (nozzle) 9 Cylindrical jig (rolling down jig) 14 Spring

Claims (6)

[Claims] 1. An integrated circuit having a pressing jig, which prevents displacement of the integrated circuit package caused by elastic deformation of the suction pad when vacuum suction or stop of suction of the integrated circuit package is performed by the suction pad at the tip of the transfer jig. A jig for preventing positional deviation of the circuit package, wherein the pressing jig is slidably provided on the tip of the carrying jig, and presses down the mold surface of the integrated circuit package while avoiding the suction pad. , While correcting the inclination of the integrated circuit package caused by the elastic deformation of the suction pad,
A jig for preventing positional deviation of an integrated circuit package, wherein a force for canceling a lateral force applied to the integrated circuit package by the elastic deformation of the suction pad is applied to the integrated circuit package. 2. The jig for preventing misalignment of an integrated circuit package according to claim 1, wherein the pressing jig is one for generating the drag force by its own weight. 3. The jig for preventing misalignment of an integrated circuit package according to claim 2, wherein the pressing jig applies an external force to the dead weight to generate the drag force. 4. The jig for preventing misalignment of an integrated circuit package according to claim 1, wherein the pressing jig obtains an external force to generate the drag force. 5. The jig for preventing misalignment of an integrated circuit package according to claim 1, 2, 3 or 4, wherein the pressing jig is provided with a rotation stop and slides. . 6. The pressing jig is made of a hollow structure surrounding the outer periphery of the suction pad, and has a flat lower surface that contacts the mold surface of the integrated circuit package. The jig for preventing the positional deviation of the integrated circuit package described in 2, 3, 4 or 5.