JPH08172786A - 腐食性が改善された静電チャック - Google Patents

腐食性が改善された静電チャック

Info

Publication number
JPH08172786A
JPH08172786A JP7181553A JP18155395A JPH08172786A JP H08172786 A JPH08172786 A JP H08172786A JP 7181553 A JP7181553 A JP 7181553A JP 18155395 A JP18155395 A JP 18155395A JP H08172786 A JPH08172786 A JP H08172786A
Authority
JP
Japan
Prior art keywords
insulator
electrode
electrostatic chuck
substrate
peripheral portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP7181553A
Other languages
English (en)
Japanese (ja)
Inventor
Shamouil Shamouilian
シャモウィリアン シャモウィル
John F Cameron
エフ． キャメロン ジョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JPH08172786A publication Critical patent/JPH08172786A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
JP7181553A 1994-07-18 1995-07-18 腐食性が改善された静電チャック Withdrawn JPH08172786A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/276,735 US5606485A (en) 1994-07-18 1994-07-18 Electrostatic chuck having improved erosion resistance
US08/276735 1994-07-18

Publications (1)

Publication Number Publication Date
JPH08172786A true JPH08172786A (ja) 1996-07-02

Family

ID=23057876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7181553A Withdrawn JPH08172786A (ja) 1994-07-18 1995-07-18 腐食性が改善された静電チャック

Country Status (6)

Country Link
US (1) US5606485A (de)
EP (1) EP0693771B1 (de)
JP (1) JPH08172786A (de)
KR (1) KR100307688B1 (de)
AT (1) ATE160903T1 (de)
DE (1) DE69501135T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001251871A (ja) * 2000-03-07 2001-09-14 Toto Ltd 静電アクチュエータおよびその製造方法

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5885469B1 (en) * 1996-11-05 2000-08-08 Applied Materials Inc Topographical structure of an electrostatic chuck and method of fabricating same
US5729423A (en) * 1994-01-31 1998-03-17 Applied Materials, Inc. Puncture resistant electrostatic chuck
US5822171A (en) * 1994-02-22 1998-10-13 Applied Materials, Inc. Electrostatic chuck with improved erosion resistance
JP3457477B2 (ja) * 1995-09-06 2003-10-20 日本碍子株式会社 静電チャック
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
US5986873A (en) * 1996-07-01 1999-11-16 Packard Hughes Interconnect Co. Creating surface topography on an electrostatic chuck with a mandrel
US5870271A (en) * 1997-02-19 1999-02-09 Applied Materials, Inc. Pressure actuated sealing diaphragm for chucks
EP0948042A1 (de) * 1998-03-06 1999-10-06 VenTec Gesellschaft für Venturekapital und Unternehmensberatung Elektrostatische Vorrichtung zum Halten von Wafern und anderen Bauteilen
US5969934A (en) * 1998-04-10 1999-10-19 Varian Semiconductor Equipment Associats, Inc. Electrostatic wafer clamp having low particulate contamination of wafers
US6077353A (en) * 1998-06-02 2000-06-20 Applied Materials, Inc. Pedestal insulator for a pre-clean chamber
US6013984A (en) * 1998-06-10 2000-01-11 Lam Research Corporation Ion energy attenuation method by determining the required number of ion collisions
US6067222A (en) * 1998-11-25 2000-05-23 Applied Materials, Inc. Substrate support apparatus and method for fabricating same
US6115232A (en) * 1998-12-03 2000-09-05 Lsi Logic Corporation Method for forming an ion implanted electrostatic chuck
US6169652B1 (en) 1999-03-12 2001-01-02 Euv, L.L.C. Electrostatically screened, voltage-controlled electrostatic chuck
US6261977B1 (en) * 1999-09-08 2001-07-17 United Microelectronics Corp. Method for preventing an electrostatic chuck from being corroded during a cleaning process
US6839217B1 (en) 1999-10-01 2005-01-04 Varian Semiconductor Equipment Associates, Inc. Surface structure and method of making, and electrostatic wafer clamp incorporating surface structure
US6362946B1 (en) 1999-11-02 2002-03-26 Varian Semiconductor Equipment Associates, Inc. Electrostatic wafer clamp having electrostatic seal for retaining gas
US6538873B1 (en) 1999-11-02 2003-03-25 Varian Semiconductor Equipment Associates, Inc. Active electrostatic seal and electrostatic vacuum pump
KR20010066139A (ko) * 1999-12-31 2001-07-11 황인길 척을 가지고 있는 반도체 제조 장치
KR100384060B1 (ko) * 2000-12-04 2003-05-14 삼성전자주식회사 반도체장치 애싱설비의 척 플레이트 및 이를 이용한 척조립체
US7128804B2 (en) * 2000-12-29 2006-10-31 Lam Research Corporation Corrosion resistant component of semiconductor processing equipment and method of manufacture thereof
US7252738B2 (en) * 2002-09-20 2007-08-07 Lam Research Corporation Apparatus for reducing polymer deposition on a substrate and substrate support
US20050042881A1 (en) * 2003-05-12 2005-02-24 Tokyo Electron Limited Processing apparatus
JP4705816B2 (ja) * 2005-07-27 2011-06-22 株式会社日立ハイテクノロジーズ プラズマ処理装置
DE202006007122U1 (de) 2006-05-03 2006-09-07 Retzlaff, Udo, Dr. Mobiler, transportabler, elektrostatischer Substrathalter aus Halbleitermaterial
JP5317424B2 (ja) * 2007-03-28 2013-10-16 東京エレクトロン株式会社 プラズマ処理装置
US8043433B2 (en) * 2008-02-11 2011-10-25 Applied Materials, Inc. High efficiency electro-static chucks for semiconductor wafer processing
US8454027B2 (en) * 2008-09-26 2013-06-04 Lam Research Corporation Adjustable thermal contact between an electrostatic chuck and a hot edge ring by clocking a coupling ring
US9859142B2 (en) 2011-10-20 2018-01-02 Lam Research Corporation Edge seal for lower electrode assembly
US9869392B2 (en) 2011-10-20 2018-01-16 Lam Research Corporation Edge seal for lower electrode assembly
KR101877339B1 (ko) * 2012-12-20 2018-07-11 주식회사 원익아이피에스 기판처리시스템의 기판캐리어 및 그를 가지는 기판처리시스템
US10090211B2 (en) 2013-12-26 2018-10-02 Lam Research Corporation Edge seal for lower electrode assembly
US20170047867A1 (en) * 2015-08-12 2017-02-16 Applied Materials, Inc. Electrostatic chuck with electrostatic fluid seal for containing backside gas
JP7797336B2 (ja) * 2022-08-25 2026-01-13 新光電気工業株式会社 基板固定装置及び基板固定装置の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4184188A (en) * 1978-01-16 1980-01-15 Veeco Instruments Inc. Substrate clamping technique in IC fabrication processes
US4384918A (en) * 1980-09-30 1983-05-24 Fujitsu Limited Method and apparatus for dry etching and electrostatic chucking device used therein
JPS57149734A (en) * 1981-03-12 1982-09-16 Anelva Corp Plasma applying working device
JPS6131636U (ja) * 1984-07-31 1986-02-26 株式会社 徳田製作所 静電チヤツク
JPS6372877A (ja) * 1986-09-12 1988-04-02 Tokuda Seisakusho Ltd 真空処理装置
US4724510A (en) * 1986-12-12 1988-02-09 Tegal Corporation Electrostatic wafer clamp
JPH01298721A (ja) * 1988-05-27 1989-12-01 Tokuda Seisakusho Ltd 真空処理装置
JPH0227748A (ja) * 1988-07-16 1990-01-30 Tomoegawa Paper Co Ltd 静電チャック装置及びその作成方法
US5275683A (en) * 1991-10-24 1994-01-04 Tokyo Electron Limited Mount for supporting substrates and plasma processing apparatus using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001251871A (ja) * 2000-03-07 2001-09-14 Toto Ltd 静電アクチュエータおよびその製造方法

Also Published As

Publication number Publication date
EP0693771B1 (de) 1997-12-03
EP0693771A1 (de) 1996-01-24
KR100307688B1 (ko) 2001-11-30
DE69501135T2 (de) 1998-04-09
ATE160903T1 (de) 1997-12-15
US5606485A (en) 1997-02-25
DE69501135D1 (de) 1998-01-15
KR960005928A (ko) 1996-02-23

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Legal Events

Date Code Title Description
A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20021001