JPH08183197A - Manufacture of thermal head - Google Patents

Manufacture of thermal head

Info

Publication number
JPH08183197A
JPH08183197A JP33754294A JP33754294A JPH08183197A JP H08183197 A JPH08183197 A JP H08183197A JP 33754294 A JP33754294 A JP 33754294A JP 33754294 A JP33754294 A JP 33754294A JP H08183197 A JPH08183197 A JP H08183197A
Authority
JP
Japan
Prior art keywords
heat generating
common electrode
individual
resistor
resistance value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33754294A
Other languages
Japanese (ja)
Inventor
Kazuo Baba
和夫 馬場
Hiroshi Arisawa
宏 有沢
Koichi Haga
浩一 羽賀
Shimizu Sagawa
清水 佐川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Priority to JP33754294A priority Critical patent/JPH08183197A/en
Publication of JPH08183197A publication Critical patent/JPH08183197A/en
Pending legal-status Critical Current

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  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

PURPOSE: To make an outline of a heat generating part clear when a heat generating resistor is formed by the thick film technique so as to improve print images by supplying pulse current in between individual electrodes and lowering a resistance value of the heat generating resistor at this part so as to form a separate heat generating part individually. CONSTITUTION: A resistance value of a heat generating resistor 6 is adjusted by the pulse trimming method. In this step, the resistance value of the heat generating resistor 6 is constant in its longitudinal direction, so that a part of the electric current flowing in between electrodes leaks in the longitudinal direction of the heat generating resistor 6, a heat generating part in the heat generating resistor 6 becomes unclear and consuming power increases. Accordingly, by applying a pulse current having a pulse width of 1μsec or below in between an exposure part 4a of a common electrode pullout part 4 and an individual electrode 5, the resistance value of the heat generating resistor 6 in between a tip 4b of an opposed common electrode pullout part 4 and a tip 5b of the individual electrode 5 is partially lowered, in which a heat generating part 6' is formed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、感熱記録方式のファク
シミリやサ−マルプリンタ等の感熱記録装置に使用され
るサ−マルヘッドの製造方法に関し、特に、厚膜技術に
より形成した帯状の発熱抵抗体を有するサーマルヘッド
の製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a thermal head used in a thermal recording apparatus such as a thermal recording type facsimile or a thermal printer, and more particularly to a belt-shaped heat generating resistor formed by a thick film technique. The present invention relates to a method of manufacturing a thermal head having a body.

【0002】[0002]

【従来の技術】サ−マルヘッドは、印刷時の騒音が小さ
く、また、現像・定着工程が不要なため取り扱いが容易
である等の利点を有しており、印字記録装置として広く
使用されている。サ−マルヘッドは、複数の個別電極と
共通電極と発熱抵抗体とを有し、選択された個別電極及
び共通電極間に電力を供給して、その部分の発熱抵抗体
を発熱させ、熱記録(印字)を行うように構成されてい
る。
2. Description of the Related Art Thermal heads are widely used as a printing and recording apparatus because they have the advantages of low noise during printing and easy handling because they do not require a developing / fixing process. . The thermal head has a plurality of individual electrodes, a common electrode, and a heating resistor, and supplies electric power between the selected individual electrode and the common electrode to cause the heating resistor in that portion to generate heat, thereby performing thermal recording ( (Printing).

【0003】サーマルヘッドの発熱抵抗体を形成する方
法としては、スクリ−ン印刷等の厚膜技術を用いる方法
と、スパッタリング等の薄膜技術を用いる方法とが知ら
れているが、厚膜技術による場合は、薄膜技術にくらべ
て製造設備が安価で生産性が高いという利点を有してい
る。発熱抵抗体が厚膜技術により形成されたサーマルヘ
ッドとしては、発熱抵抗体をスクリーン印刷又は描画ノ
ズルあるいはリフトオフ法により帯状に形成したもの
と、発熱抵抗体をリフトオフ法等の微細加工技術により
発熱部毎に個別に形成したものとが存在する。帯状に形
成した発熱抵抗体は、個別に形成したものに比較して歩
留りが高いという利点がある。
As a method for forming a heating resistor of a thermal head, a method using a thick film technique such as screen printing and a method using a thin film technique such as sputtering are known. In this case, it has an advantage that the manufacturing equipment is inexpensive and the productivity is high as compared with the thin film technology. As a thermal head in which the heating resistor is formed by the thick film technology, the heating resistor is formed in a band shape by screen printing or drawing nozzles or a lift-off method, and the heating resistor is formed by a fine processing technique such as a lift-off method. There are those individually formed. The heating resistor formed in the band shape has an advantage that the yield is higher than that of the individually formed heating resistors.

【0004】帯状の発熱抵抗体を有するサーマルヘッド
の一例について、図5及び図6を参照しながら説明す
る。サーマルヘッドは、セラミック製の絶縁基板50の
表面に形成されたグレーズ製の蓄熱層51を有してい
る。蓄熱層51の表面には、主走査方向(X方向)に沿
って延設された帯状の共通電極本体部52及びこの本体
部52から櫛状に副走査方向(Y方向)に突出する共通
電極引出し部53とから構成される共通電極と、前記共
通電極引出し部53間に配置され前記引出し部53に対
して千鳥状に配置された複数の個別電極54とが形成さ
れ、交互リード型の電極構造を有している。共通電極引
出し部53と各個別電極54は、蓄熱層51の表面に主
走査方向(X方向)に沿って延設された帯状の発熱抵抗
体55によって接続されている。共通電極本体部52、
引出し部53、個別電極54及び発熱抵抗体55の表面
は、グレーズ製の耐磨耗層56(図6)によって被覆さ
れており、この耐磨耗層56の発熱抵抗体55を被覆し
ている部分が感熱記録紙やインクドナーフィルム等に接
触して熱を伝える印字部57を構成している。また、こ
の印字部57は、耐磨耗層56の他の部分の表面より突
出して構成されている。上記構成のサーマルヘッドは、
図6に示すように、プラテンローラ60の表面に沿って
搬送される感熱記録紙61(若しくはインクドナーフィ
ルムを介して配置される受像紙)に前記印字部57が押
しつけられることにより印字記録が行なわれる。
An example of a thermal head having a strip-shaped heating resistor will be described with reference to FIGS. The thermal head has a glaze heat storage layer 51 formed on the surface of a ceramic insulating substrate 50. On the surface of the heat storage layer 51, a strip-shaped common electrode main body 52 extending along the main scanning direction (X direction) and a common electrode protruding from the main body 52 in a comb shape in the sub scanning direction (Y direction). A common electrode including a lead portion 53 and a plurality of individual electrodes 54 arranged between the common electrode lead portions 53 and arranged in a zigzag pattern with respect to the lead portion 53 are formed. It has a structure. The common electrode lead-out portion 53 and each individual electrode 54 are connected to each other by a strip-shaped heat generating resistor 55 extending on the surface of the heat storage layer 51 along the main scanning direction (X direction). Common electrode body 52,
The surfaces of the lead-out portion 53, the individual electrode 54, and the heating resistor 55 are covered with a wear resistant layer 56 (FIG. 6) made of glaze, and the heating resistor 55 of the wear resistant layer 56 is covered. A portion constitutes a printing unit 57 which transfers heat by contacting a thermal recording paper or an ink donor film. The print portion 57 is formed so as to project from the surface of the other portion of the abrasion resistant layer 56. The thermal head with the above configuration is
As shown in FIG. 6, print recording is performed by pressing the printing unit 57 against the thermal recording paper 61 (or the image receiving paper arranged via the ink donor film) conveyed along the surface of the platen roller 60. Be done.

【0005】ところで、上記のような構造のサーマルヘ
ッドで12dot/mm以上の印字ドット密度を実現しよう
とすると、1ドットの幅が84μm(1mm÷12)以下
となる。前記したような交互リード型の電極配置を採用
した場合、図5に示すように、印字部分となる両電極間
の幅W1と、隣接する電極間の幅W2とを同一に形成し
た場合、上記条件を満たす幅(電極スペース)W2は僅
か21μm以下になってしまう。このように、電極スペ
ースが20μm以下になると、隣接する電極間における
短絡や切断等の欠陥が発生しやすくなり、製品の歩留り
が低下するという問題点が生じる。
By the way, when it is attempted to realize a print dot density of 12 dots / mm or more with the thermal head having the above-mentioned structure, the width of one dot becomes 84 μm (1 mm / 12) or less. In the case of adopting the alternate lead type electrode arrangement as described above, as shown in FIG. 5, when the width W1 between both electrodes which is the printed portion and the width W2 between the adjacent electrodes are formed to be the same as above, The width (electrode space) W2 that satisfies the condition is only 21 μm or less. As described above, when the electrode space is 20 μm or less, defects such as a short circuit and a disconnection between adjacent electrodes are likely to occur, which causes a problem that the yield of products is reduced.

【0006】このような問題を解決するため、共通電極
引出し部の端部と個別電極の先端部とが対向するように
配列し、この対向する電極間に両電極を接続するように
帯状の発熱抵抗体を形成することが考えられるが、この
場合、電極間に流れる電流が帯状の発熱抵抗体の長手方
向に漏洩し、発熱部の輪郭が不明確になり実用可能な印
字ドットが得られないという欠点があった。
In order to solve such a problem, the end portions of the common electrode lead-out portion and the end portions of the individual electrodes are arranged so as to face each other, and a strip-shaped heat is generated so that both electrodes are connected between the facing electrodes. It is conceivable to form a resistor, but in this case, the current flowing between the electrodes leaks in the longitudinal direction of the strip-shaped heating resistor, and the contour of the heating part becomes unclear, so a practical print dot cannot be obtained. There was a drawback.

【0007】そこで、この対策として、サーマルヘッド
の製造段階において、発熱抵抗体の両電極(共通電極と
個別電極)間にパルス電流を供給し、この両電極間に挟
まれた発熱抵抗体の抵抗値を部分的に低下させて個別に
分離した発熱部を形成することが提案されている(特開
平3−169649号公報参照)。これは、所定の強度
の電界を両電極間に印加することにより、その電界強度
に応じて発熱抵抗体の抵抗値が減少するという性質を利
用するものである。
Therefore, as a countermeasure against this, at the manufacturing stage of the thermal head, a pulse current is supplied between both electrodes (common electrode and individual electrode) of the heating resistor so that the resistance of the heating resistor sandwiched between the two electrodes is increased. It has been proposed to partially reduce the value to form individually separated heat generating portions (see Japanese Patent Laid-Open No. 3-169649). This utilizes the property that the resistance value of the heating resistor is reduced according to the electric field strength by applying an electric field of a predetermined strength between both electrodes.

【0008】[0008]

【発明が解決しようとする課題】しかしながら、共通電
極引出し部と個別電極間にパルス電流が供給されると、
共通電極引出し部側から隣接する共通電極引出し部方向
へパルス電流が漏洩するため、部分的に抵抗値を低下さ
せたい発熱抵抗体の両電極間だけでなく、その周辺部の
発熱抵抗体においても抵抗値の低下が生じるため、発熱
部の輪郭が明確になるという効果を十分に発揮すること
ができなかった。
However, when a pulse current is supplied between the common electrode extraction portion and the individual electrodes,
Since the pulse current leaks from the common electrode lead-out side toward the adjacent common electrode lead-out part, not only between both electrodes of the heating resistor whose resistance value is to be partially lowered, but also in the peripheral heating resistor. Since the resistance value is reduced, the effect that the contour of the heat generating portion becomes clear cannot be sufficiently exerted.

【0009】本発明は上記実情に鑑みてなされたもの
で、帯状の発熱抵抗体を有するサ−マルヘッドにおい
て、厚膜技術で発熱抵抗体を形成した場合に、発熱部の
輪郭を明確にして印字画質の向上を図ることができるサ
ーマルヘッドの製造方法を提供することを目的としてい
る。
The present invention has been made in view of the above circumstances, and in a thermal head having a strip-shaped heating resistor, when the heating resistor is formed by the thick film technique, the contour of the heating portion is clarified and printed. It is an object of the present invention to provide a method of manufacturing a thermal head that can improve image quality.

【0010】[0010]

【課題を解決するための手段】上記目的を達成するため
本発明方法は、サーマルヘッドの製造方法において、次
の各工程を具備することを特徴としている。個別電極形
成工程として、互に分離した複数の個別電極から成る第
1の個別電極列及びこの個別電極列に対向して配置する
第2の個別電極列を形成する。抵抗体形成工程として、
第1及び第2の個別電極列の各個別電極間を接続する帯
状の発熱抵抗体を形成する。発熱部形成工程として、前
記個別電極間にパルス電流を供給し、この部分の発熱抵
抗体の抵抗値を低下させて個別に分離した発熱部を形成
する。共通電極形成工程として、前記個別電極列の一方
を互に共通に接続して共通電極とする。
To achieve the above object, the method of the present invention is characterized by including the following steps in a method of manufacturing a thermal head. In the individual electrode forming step, a first individual electrode row composed of a plurality of individual electrodes separated from each other and a second individual electrode row arranged so as to face the individual electrode row are formed. As the resistor formation process,
A strip-shaped heating resistor is formed to connect between the individual electrodes of the first and second individual electrode rows. In the heating portion forming step, a pulse current is supplied between the individual electrodes to reduce the resistance value of the heating resistor in this portion to form the individually heating portions. In the common electrode forming step, one of the individual electrode rows is commonly connected to each other to form a common electrode.

【0011】[0011]

【作用】本発明によれば、発熱抵抗体にパルス電流を供
給する際には、共通電極となる電極側は互に接続されて
いないので、抵抗値を低下させたい発熱抵抗体の両電極
間だけ電流が流れ、この部分の抵抗値のみを低下させる
ことができる。
According to the present invention, when the pulse current is supplied to the heating resistor, the electrodes serving as the common electrode are not connected to each other. Only a current flows, and it is possible to reduce only the resistance value of this portion.

【0012】[0012]

【実施例】本発明の一実施例に係るサーマルヘッドの製
造方法ついて、図1、図2及び図3を参照しながら説明
する。先ず、アルミナ製の絶縁基板1の表面に蓄熱層2
を形成する。次に、この蓄熱層2の表面に金等からなる
電極層を形成した後、フォトリソエッチングによりパタ
ーニングし、帯状の共通電極本体部3、複数の共通電極
引出し部4、この引出し部4の各端部に対向して配置さ
れる個別電極5を形成する(図1(a)及び図3
(a))。この場合の印字密度は、1印字ドットの幅を
84μmとして12dot/mmとしている。このために、
共通電極引出し部4の先端部4aと個別電極5の先端部
5aとの間隔は40μmとなっている。尚、共通電極引
出し部4aは、後述するように最終的には共通電極本体
部3に接続されて共通電極を構成する。
EXAMPLE A method of manufacturing a thermal head according to an example of the present invention will be described with reference to FIGS. 1, 2 and 3. First, the heat storage layer 2 is formed on the surface of the insulating substrate 1 made of alumina.
To form. Next, after an electrode layer made of gold or the like is formed on the surface of the heat storage layer 2, patterning is performed by photolithography etching to form a strip-shaped common electrode body portion 3, a plurality of common electrode lead portions 4, and each end of the lead portion 4. An individual electrode 5 arranged so as to face the portion (FIGS. 1A and 3).
(A)). In this case, the print density is 12 dots / mm with the width of one print dot being 84 μm. For this,
The distance between the tip 4a of the common electrode lead-out portion 4 and the tip 5a of the individual electrode 5 is 40 μm. The common electrode lead-out portion 4a is finally connected to the common electrode main body portion 3 to form a common electrode, as described later.

【0013】次に、共通電極引出し部4の先端部4bと
個別電極5の先端部5bを接続するように、酸化ルテニ
ウムを含む抵抗体形成用ペ−ストを幅60〜80μmの
主走査方向に帯状となるように形成し、焼成して発熱抵
抗体6を形成する(図1(b))。抵抗体形成用ペ−ス
トを幅60〜80μmの帯状に形成するには、いわゆる
厚膜リフトオフ法、厚膜ペ−ストの厚膜リフトオフ法、
厚膜ペ−ストのノズルによる直接描画法を用いることに
より行なう。また、発熱抵抗体6の幅60〜80μm
は、厚膜リフトオフ法や厚膜ペ−ストのノズルによる直
接描画法による副走査方向Yに沿う位置決め誤差が10
μm程度見込まれることから、若干の安全率をもって決
定されている。
Next, a resistor forming paste containing ruthenium oxide is formed in the main scanning direction with a width of 60 to 80 μm so as to connect the tip 4b of the common electrode lead-out portion 4 and the tip 5b of the individual electrode 5. The heating resistor 6 is formed in a band shape and fired to form the heating resistor 6 (FIG. 1B). In order to form the resistor forming paste in a strip shape having a width of 60 to 80 μm, a so-called thick film lift-off method, a thick film lift-off method of a thick film paste,
It is performed by using a direct drawing method using a nozzle of a thick film paste. Further, the width of the heating resistor 6 is 60 to 80 μm
Has a positioning error of 10 in the sub-scanning direction Y due to the thick film lift-off method or the direct drawing method using a thick film paste nozzle.
Since it is expected to be in the order of μm, it is determined with a slight safety factor.

【0014】次に、蓄熱層2の表面に形成された共通電
極本体部3、共通電極引出し部4、個別電極5及び発熱
抵抗体6の表面を共通電極本体部3の引出し部側の一部
及び共通電極引出し部4の一部が露出する(露出部3a
及び露出部4a)ように、グレ−ズ製の耐磨耗層7で被
覆する(図1(c)及び(図2(b)))。更に、サー
マルヘッドの用途によっては、発熱抵抗体6等の表面近
傍にグレ−ズ製の表面平滑化層を形成してもよい。
Next, the surfaces of the common electrode body portion 3, the common electrode lead-out portion 4, the individual electrodes 5 and the heating resistor 6 formed on the surface of the heat storage layer 2 are partially covered by the lead-out portion side of the common electrode body portion 3. And a part of the common electrode lead-out portion 4 is exposed (exposed portion 3a
And an exposed portion 4a) is covered with a wear resistant layer 7 made of glaze (FIGS. 1C and 2B). Further, depending on the use of the thermal head, a surface smoothing layer made of glaze may be formed near the surface of the heating resistor 6 or the like.

【0015】続いて、パルストリミング法により発熱抵
抗体6の抵抗値を調整する。すなわち、この段階では発
熱抵抗体6の抵抗値はその長手方向に一定であるため、
電極間を流れる電流は発熱抵抗体6の長手方向に一部漏
洩し、発熱抵抗体6における発熱部が不明確になるとと
もに消費電力が増大してしまう。このため、共通電極引
出し部4の露出部4aと個別電極5との間に、パルス幅
1μsec以下のパルス電流を印加することにより、対向
する共通電極引出し部4の先端部4bと個別電極5の先
端部5b間の発熱抵抗体6の抵抗値を部分的に低下さ
せ、この部分に発熱部6′を形成する(図2(a))。
本実施例では、従来例で記載した製造方法と異なり、最
終的に共通電極となる共通電極引出し部4はこの段階で
は互に接続されていないため、隣接する共通電極引出し
部方向へのパルス電流の漏洩がなく、抵抗値の部分的な
低下がパルスが印加される両電極間だけに限定されて生
じるため、発熱部6′の輪郭を明確に規定することがで
きる。
Then, the resistance value of the heating resistor 6 is adjusted by the pulse trimming method. That is, at this stage, since the resistance value of the heating resistor 6 is constant in the longitudinal direction,
The current flowing between the electrodes partially leaks in the longitudinal direction of the heating resistor 6, making the heating portion of the heating resistor 6 unclear and increasing power consumption. Therefore, by applying a pulse current having a pulse width of 1 μsec or less between the exposed portion 4 a of the common electrode lead-out portion 4 and the individual electrode 5, the tip portion 4 b of the common electrode lead-out portion 4 and the individual electrode 5 which are opposed to each other are applied. The resistance value of the heating resistor 6 between the tip portions 5b is partially reduced, and a heating portion 6'is formed in this portion (FIG. 2 (a)).
In the present embodiment, unlike the manufacturing method described in the conventional example, since the common electrode lead-out portions 4 that will eventually become the common electrodes are not connected to each other at this stage, a pulse current in the direction of the adjacent common electrode lead-out portion is obtained. Since there is no leakage and the partial reduction of the resistance value occurs only between the electrodes to which the pulse is applied, the contour of the heating portion 6'can be clearly defined.

【0016】前記発熱抵抗体6の抵抗値の低下率は、発
熱抵抗体6の材料、焼成温度あるいは耐磨耗層7の材
料、焼成温度等により異なるが、印加する電圧とパルス
幅によっても変化する。本実施例の条件では、例えば5
00Vの電圧を1μsec印加すると約50%、1000
Vの電圧を0.1μsec印加すると約65%、2000
Vの電圧を0.01μsec印加すると約75%の低下率
であった。従って、上記電圧とパルス幅を適当に選択し
て、共通電極引出し部4の露出部4aと個別電極5との
間に前記パルスを印加すれば、その部分の発熱抵抗体6
の抵抗値を他の部分に比べて40%以上低くすることが
でき、発熱抵抗体6に所定間隔で多数の発熱部6′を同
時に形成することができる。
The rate of decrease in the resistance value of the heating resistor 6 varies depending on the material of the heating resistor 6, the firing temperature or the material of the abrasion resistant layer 7, the firing temperature, etc., but it also changes depending on the applied voltage and the pulse width. To do. Under the conditions of this embodiment, for example, 5
When a voltage of 00V is applied for 1 μsec, about 50%, 1000
Applying a voltage of V for 0.1 μsec, about 65%, 2000
When a V voltage of 0.01 μsec was applied, the rate of decrease was about 75%. Therefore, if the above voltage and pulse width are appropriately selected and the pulse is applied between the exposed portion 4a of the common electrode lead-out portion 4 and the individual electrode 5, the heating resistor 6 at that portion is applied.
It is possible to lower the resistance value of 40% or more as compared with other portions, and it is possible to simultaneously form a large number of heat generating portions 6 ′ on the heat generating resistor 6 at predetermined intervals.

【0017】その後、共通電極引出し部4の露出部4a
と共通電極本体部3の露出部3aとを銀エポキシから成
る接続部8により接続し、共通電極を完成する(図2
(b)及び図3(c))。更に、銀エポキシによる接続
部8を、エポキシ樹脂層9によって被覆してこれを保護
する(図2(c)及び図3(d))。
Thereafter, the exposed portion 4a of the common electrode lead-out portion 4 is formed.
The exposed portion 3a of the common electrode body 3 is connected by the connecting portion 8 made of silver epoxy to complete the common electrode (see FIG. 2).
(B) and FIG.3 (c)). Further, the connection portion 8 made of silver epoxy is covered with an epoxy resin layer 9 to protect it (FIGS. 2 (c) and 3 (d)).

【0018】上記製造方法により作製されたサーマルヘ
ッドは、図4に示すように、支持板10上に接着剤を介
して配置され、サーマルヘッドの各個別電極5の端部に
形成されたIC接続端子5aは、前記支持板10上に配
置された駆動基板11上に実装された駆動用IC12に
ボンディングワイヤ13を介して接続されている。ま
た、駆動基板11には、信号入力端子としての外部接続
用配線14が形成され、この外部接続用配線14と駆動
用IC12とはボンディングワイヤ15を介して接続さ
れている。また、駆動用IC12及びボンディングワイ
ヤ13,15は保護樹脂16によって被覆され、更に、
前記保護用樹脂16は金属または樹脂製のカバ−17に
よって保護されている。サーマルヘッドの発熱抵抗体6
上には記録紙20を搬送するプラテンロ−ラ21が配置
され、このプラテンローラ21による押圧によって前記
記録紙20をサーマルヘッド側に密着させるように構成
されている。
As shown in FIG. 4, the thermal head manufactured by the above-mentioned manufacturing method is arranged on the supporting plate 10 with an adhesive, and the IC connection is formed at the end of each individual electrode 5 of the thermal head. The terminal 5a is connected to a drive IC 12 mounted on a drive substrate 11 arranged on the support plate 10 via a bonding wire 13. Further, an external connection wiring 14 as a signal input terminal is formed on the drive substrate 11, and the external connection wiring 14 and the drive IC 12 are connected via a bonding wire 15. Further, the driving IC 12 and the bonding wires 13 and 15 are covered with a protective resin 16, and further,
The protective resin 16 is protected by a metal or resin cover 17. Heater resistor 6 of thermal head
A platen roller 21 that conveys the recording paper 20 is arranged on the upper side, and the recording paper 20 is brought into close contact with the thermal head side by being pressed by the platen roller 21.

【0019】次に、前述の構成を備えたサーマルヘッド
の作用について説明する。画像信号に応じて所定の個別
電極5に駆動用IC12を介して選択的に電流が供給さ
れると、その個別電極5の先端部5bと共通電極引出し
部4の先端部4b間に形成された発熱部6′が発熱す
る。このとき、個別電極5の先端部5bと共通電極引出
し部4の先端部4b間に流れる電流は、発熱抵抗体6の
隣接する発熱部6′との間には抵抗値の大きな部分が介
在するために、隣接する発熱部6′にはほとんど漏洩せ
ず、各発熱部6′の領域は独立して発熱する。従って、
この発熱抵抗体6を覆う耐摩耗層7の印字部7aをプラ
テンロ−ラ21表面の記録紙20(感熱記録紙あるいは
インクドナ−フィルム)に押しつけると、感熱記録紙あ
るいは転写受像紙の前記印字部7aと接触する部分に輪
郭が鮮明な印字ドットが形成される。
Next, the operation of the thermal head having the above construction will be described. When a current is selectively supplied to a predetermined individual electrode 5 via the driving IC 12 in accordance with an image signal, it is formed between the tip portion 5b of the individual electrode 5 and the tip portion 4b of the common electrode lead-out portion 4. The heat generating portion 6'heats. At this time, the current flowing between the tip portion 5b of the individual electrode 5 and the tip portion 4b of the common electrode lead-out portion 4 has a large resistance value portion between the adjacent heating portion 6'of the heating resistor 6. Therefore, the heat is hardly leaked to the adjacent heat generating portions 6 ', and the regions of the heat generating portions 6'independently generate heat. Therefore,
When the printing portion 7a of the abrasion resistant layer 7 covering the heating resistor 6 is pressed against the recording paper 20 (heat-sensitive recording paper or ink donor film) on the surface of the platen roller 21, the printing portion 7a of the heat-sensitive recording paper or transfer image receiving paper is obtained. A print dot having a clear contour is formed in a portion that comes into contact with.

【0020】以上、本発明の実施例を詳述したが、本発
明は前記実施例に限定されるものではなく、特許請求の
範囲に記載された本発明を逸脱することなく、種々の小
設計変更を行うことが可能である。例えば、16dot/m
m以上の高密度化も容易であるし、個別電極5の先端部
5bと共通電極引出し部4の先端部4b間の距離をさら
に小さくする、いわゆる副走査分割型といわれる面積階
調用サ−マルヘッドの製造も可能である。また両電極の
幅をさらに小さくして、いわゆる熱集中型サ−マルヘッ
ドの製造も可能である。その結果、カラ−プリンタに用
いられる副走査分割型サ−マルヘッドや熱集中型サ−マ
ルヘッド等の特殊な構成のサ−マルヘッドを厚膜技術で
作製できるようになり、製品の低コスト化を図ることが
できる。また、上記実施例においては、対向電極型のサ
ーマルヘッドについて説明したが、交互リード型のサー
マルヘッドにも適用することができる。
Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments, and various small designs can be made without departing from the present invention described in the claims. It is possible to make changes. For example, 16dot / m
It is easy to make the density higher than m, and the distance between the tip portion 5b of the individual electrode 5 and the tip portion 4b of the common electrode lead-out portion 4 is further reduced, so-called sub-scanning division type thermal head for area gradation. Can be manufactured. Further, it is possible to manufacture a so-called heat concentration type thermal head by further reducing the width of both electrodes. As a result, a thermal head having a special configuration such as a sub-scanning split type thermal head or a heat concentration type thermal head used in a color printer can be manufactured by a thick film technique, and the cost of the product can be reduced. be able to. Further, although the counter electrode type thermal head has been described in the above embodiment, the present invention can also be applied to an alternating lead type thermal head.

【0021】[0021]

【発明の効果】本発明によれば、共通電極引出し部が帯
状の共通電極本体部に接続されていない状態で、共通電
極引出し部と個別電極間にパルス電流を供給し、この共
通電極引出し部と個別電極に挟まれた発熱抵抗体の抵抗
値を部分的に低下させて個別に分離した発熱部を形成し
た後に、共通電極引出し部と共通電極本体部とを電気的
に接続する工程を有することにより、個別に分離した発
熱部を発熱抵抗体に形成することができる。従って、帯
状の発熱抵抗体を使用する場合において、個別に分離し
た発熱部を確実に形成することができ、発熱部の輪郭を
明確にして印字画質の向上を図ることができる。
According to the present invention, a pulse current is supplied between the common electrode lead-out portion and the individual electrodes in a state where the common electrode lead-out portion is not connected to the strip-shaped common electrode body portion, and the common electrode lead-out portion is provided. And a step of electrically connecting the common electrode lead-out portion and the common electrode main body portion after partially reducing the resistance value of the heating resistor sandwiched between the individual electrodes to form the individually separated heat generating portion. As a result, it is possible to form the individually-generated heat generating portions on the heat generating resistor. Therefore, when the strip-shaped heat generating resistor is used, it is possible to surely form the heat generating portions that are individually separated, and it is possible to improve the print image quality by clarifying the contour of the heat generating portion.

【図面の簡単な説明】[Brief description of drawings]

【図1】(a)〜(c)は本発明の一実施例のサ−マル
ヘッドの製造工程の一部を示す平面説明図である。
1A to 1C are plan explanatory views showing a part of a manufacturing process of a thermal head according to an embodiment of the present invention.

【図2】(a)〜(c)は本発明の一実施例のサ−マル
ヘッドの製造工程の一部を示す平面説明図である。
2A to 2C are plan explanatory views showing a part of the manufacturing process of the thermal head according to the embodiment of the present invention.

【図3】(a)〜(d)は本発明の一実施例のサ−マル
ヘッドの製造工程を示す断面説明図である。
3A to 3D are cross-sectional explanatory views showing a manufacturing process of a thermal head according to an embodiment of the present invention.

【図4】実施例によるサーマルヘッドを使用した印字記
録装置の構成説明図である。
FIG. 4 is a structural explanatory view of a print recording apparatus using a thermal head according to an embodiment.

【図5】交互リード型の電極配置を有するサーマルヘッ
ドの平面説明図である。
FIG. 5 is a plan view of a thermal head having an alternating lead type electrode arrangement.

【図6】サーマルヘッドを使用した印字記録装置の構成
説明図である。
FIG. 6 is a structural explanatory view of a print recording apparatus using a thermal head.

【符号の説明】[Explanation of symbols]

1…絶縁基板、 2…蓄熱層、 3…共通電極本体部、
4…共通電極引出し部、 5…個別電極、 6…発熱
抵抗体、 6′…発熱部、 7…耐磨耗層、8…接続
部、 9…エポキシ樹脂層、 10…支持板、 11…
駆動基板
1 ... Insulating substrate, 2 ... Heat storage layer, 3 ... Common electrode main body,
4 ... Common electrode lead-out part, 5 ... Individual electrode, 6 ... Heating resistor, 6 '... Heating part, 7 ... Wear resistant layer, 8 ... Connection part, 9 ... Epoxy resin layer, 10 ... Support plate, 11 ...
Drive board

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 B41J 3/20 114 C (72)発明者 佐川 清水 神奈川県海老名市本郷2274番地 富士ゼロ ックス株式会社内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical display location B41J 3/20 114 C (72) Inventor Sagawa Shimizu 2274 Hongo, Ebina-shi, Kanagawa Fuji Xerox Co., Ltd. Within

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】互に分離した複数の個別電極から成る第1
の個別電極列及びこの個別電極列に対向して配置する第
2の個別電極列を形成する個別電極形成工程と、 第1及び第2の個別電極列の各個別電極間を接続する帯
状の発熱抵抗体を形成する抵抗体形成工程と、 前記個別電極間にパルス電流を供給し、この部分の発熱
抵抗体の抵抗値を低下させて個別に分離した発熱部を形
成する発熱部形成工程と、 前記個別電極列の一方を互に共通に接続して共通電極と
する共通電極形成工程と、を具備することを特徴とする
サーマルヘッドの製造方法。
1. A first comprising a plurality of individual electrodes separated from each other
Individual electrode row and an individual electrode forming step of forming a second individual electrode row arranged to face the individual electrode row, and a strip-shaped heat generation for connecting between the individual electrodes of the first and second individual electrode rows A resistor forming step of forming a resistor, and a heating portion forming step of supplying a pulse current between the individual electrodes to reduce the resistance value of the heating resistor in this portion to form individually separated heating portions, A step of forming a common electrode by commonly connecting one of the individual electrode rows to each other to form a common electrode.
JP33754294A 1994-12-28 1994-12-28 Manufacture of thermal head Pending JPH08183197A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33754294A JPH08183197A (en) 1994-12-28 1994-12-28 Manufacture of thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33754294A JPH08183197A (en) 1994-12-28 1994-12-28 Manufacture of thermal head

Publications (1)

Publication Number Publication Date
JPH08183197A true JPH08183197A (en) 1996-07-16

Family

ID=18309640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33754294A Pending JPH08183197A (en) 1994-12-28 1994-12-28 Manufacture of thermal head

Country Status (1)

Country Link
JP (1) JPH08183197A (en)

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