JPH081842B2 - METHOD OF MANUFACTURING RESISTOR NETWORK AND MANUFACTURING SUBSTRATE USED FOR THE SAME - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a resistance network and a manufacturing substrate used for the method, and has a uniform size regardless of the specification or size of the resistance network to be manufactured. The present invention relates to a substrate that can be used.

[0002]

2. Description of the Related Art A resistor network, which is often used as a pull-up resistor or a pull-down resistor of a microcomputer, has a structure in which a plurality of resistor elements are housed on a single chip substrate and is generally as follows. It is manufactured through a manufacturing process.

First, in a rectangular unit region of a plurality of rows and a plurality of columns surrounded by the slits, on the upper surface of a ceramic manufacturing substrate which is fired while forming a plurality of substrate dividing slits in a grid pattern at equal intervals, After forming a predetermined electrode portion and common line by batch printing, a predetermined number of resistance elements are formed by batch printing so that the electrode portion and the common line are brought into conduction with a predetermined circuit configuration.

Next, the resistance value is adjusted by laser trimming or the like according to the measurement result of the resistance value of each resistance element. In this way, the ceramic substrate having the predetermined resistance circuit formed in each unit region is divided into each unit chip substrate along the slits extending in the row direction and the column direction.

After that, a predetermined number of lead pins are bonded to each unit chip substrate provided with a resistance circuit. The lead pins are usually joined using a lead frame, and the unit chip substrates are successively joined to a plurality of lead pins provided at predetermined intervals in the longitudinal direction of the lead frame. One lead pin is provided for each unit chip substrate and one lead pin is provided for each of the above-mentioned electrode parts and common lines, and each lead pin is joined to the substrate so as to be electrically connected to the terminals of each continuous part and common line. It In this way, after the resistive network is mostly supported by the lead frame, a resin package for protecting the resistance element and the common wire is applied to the board, and then the lead pins are cut from the lead frame. By doing so, the resistance network is completed.

Further, the resistor network may be one in which the lead pins are joined to the respective terminal portions as described above, or there is a case in which the chip form is kept.

The resistance network has different specifications depending on the number of lead pins or the number of terminals, but the lead pins are arranged on the unit chip substrate at predetermined intervals in the longitudinal direction (row direction of the ceramic substrate). It is arranged. Therefore, as the number of lead pins increases, the lengthwise dimension required for the unit chip substrate, that is, the row direction dimension required for the unit area of the ceramic substrate also increases. Therefore, as shown in FIG. Alternatively, the ceramic substrates 1 having different lengths in the row direction are required depending on the number of terminals. It should be noted that the dimensional numerical values shown in the drawing do not correspond to the actual dimensions in the drawing.

As described above, conventionally, it was necessary to use ceramic substrates having different sizes due to the difference in the specifications of the resistance networks to be produced, but this has the following problems. .

That is, since it is not possible to use the same process for printing the resistance element, the process for printing the electrode portion and the common line, and the material handling (such as the substrate carrying direction) for the ceramic substrate used in the laser trimming, it is manufactured. Each time the specifications of the resistance network differed, the type of device had to be changed one by one, and the setup was forced to interrupt the manufacturing work for a long time, resulting in very poor productivity.

There is also a problem that the manufacturing process of the resistor network cannot be completely automated because the material handling cannot be shared.

Further, it is not possible to use a common magazine for accommodating the substrates, and there is a disadvantage that magazines corresponding to the respective sizes of the substrates must be prepared.

The present invention has been devised under the circumstances as described above. Even when manufacturing a resistor network having different numbers of lead pins and terminals, the manufacturing method of a uniform size is used. So that the substrate can be used,
The object is to solve the above-mentioned conventional problems all at once.

[0013]

In order to solve the above problems, the present invention takes the following technical means.

According to the first aspect of the present invention, there is provided a method of manufacturing a plurality of types of resistor networks having different sizes, and this method has a plurality of slits formed in a grid pattern on the upper surface in a regular interval. A method for manufacturing a resistor network using a manufacturing substrate comprising a plurality of rows and columns each having a long rectangular unit region that is long in the row direction and short in the column direction. While having a frame portion of a predetermined width on at least one of both side edge portions facing to,
A plurality of types of resistor networks of different sizes to be manufactured have a column-direction dimension set to a common multiple of the column-direction dimensions of each resistor network, and the frame is provided with a recognition means so that the production is planned. It is characterized in that a manufacturing substrate of a certain size can be used regardless of the size of the resistance network. The recognizing means may be a recognizing means for positioning for performing alignment with the process apparatus, or may be a recognizing means for recognizing specifications of resistor networks of different types.

According to the second aspect of the present invention,
A chip-shaped resistor network manufacturing substrate is provided, and this manufacturing substrate is formed in a plurality of rows and a plurality of columns by engraving a plurality of slits on the upper surface in an evenly spaced grid pattern. In the unit area of a short oblong rectangle,
A chip resistance network manufacturing substrate on which a predetermined resistance circuit is formed by printing, and a frame portion having a predetermined width is provided on at least one of both side edge portions facing each other in the row direction. Of the resistance network having different column-direction dimensions set to a common multiple of each column-direction dimension, and the recognition means is formed in the frame portion. The recognizing means may be the recognizing means for positioning for performing the alignment with respect to the process apparatus, or represents the specifications of the resistance network, as described in the first aspect of the present invention. It can also be used as a specification recognition means.

[0016]

The manufacturing substrate used in the present invention has a rectangular unit area, which is long in the row direction and short in the column direction, on the upper surface of which a resistance circuit is formed by printing.
It is set to multiple rows and multiple columns. The length in the row direction of this unit region differs depending on the number of mounting lead pins or the number of terminals of the resistor network to be manufactured, as described above.
As the number of lead pins or terminals increases, the length of the unit area in the row direction must be increased.

When the number of unit areas set in the row direction is the same, when the length of the unit area in the row direction increases, the length in the row direction occupied by the plurality of unit areas arranged in the row direction naturally increases. In the manufacturing substrate of the present invention provided with a frame portion having a predetermined width on the side edge portion in the row direction, the substrate length required for extending the row direction length of the plurality of unit regions arranged in the row direction is set to the frame portion. You can ask.

That is, by increasing the length in the row direction occupied by a plurality of unit areas arranged in the row direction, it is possible to form a unit area in the frame portion that is out of the unit area forming range in the row direction. it can.

Therefore, when the length of the unit region in the row direction is set to be large, in other words, even when a resistor network in which the number of lead pins to be mounted or the number of terminals is increased is produced, the length of the substrate itself is set in the row direction. There is no need to increase the height. Moreover, in the manufacturing substrate used in the present invention, the frame portion having the predetermined width is conveniently formed at the side edge portion in the row direction, so that the frame portion can be provided with the recognition means. The recognition means may be a positioning hole for appropriately positioning the manufacturing substrate with respect to the process equipment, or a specification recognition means for indicating a difference in specifications of the resistance network. In particular, by providing the specification recognizing means, the process equipment can automatically determine the specifications of the resistance network to be manufactured, which cannot be determined simply by looking at the board because the width of the slit is small. However, it is possible to greatly contribute to the achievement of the object of the present invention that each process is performed by using a manufacturing substrate having a uniform size when manufacturing different types of resistance networks.

Further, the manufacturing substrate of the present invention has a column direction length corresponding to a common multiple of the column direction lengths of a plurality of types of resistor networks of different sizes to be manufactured. Therefore, when manufacturing a plurality of types of resistance networks, it is possible to use the manufacturing substrate having the same length in the row direction.

As described above, according to the present invention, even if there are various sizes of the unit chip substrate of the resistor network to be manufactured, they have the same size (the row-direction dimension and the column-direction dimension are the same). Each manufacturing process can be performed using the manufacturing substrate.

As a result, the problems of common material handling for substrates used in the printing process and laser trimming process and the problem of common magazines in the substrates, which have hitherto been a problem, can be solved all at once. it can. Further, by achieving such common material handling, it is possible to completely automate the manufacturing process of a plurality of types of resistor networks having different specifications, and it is possible to significantly improve productivity.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be specifically described below with reference to the drawings.

As shown in FIG. 1, the resistance network manufacturing substrate 1 of the present invention has a rectangular shape in a plan view. And, on the upper surface thereof, a plurality of horizontal slits 2a ... And a plurality of vertical slits 2b.
Enclosed by 2b ... A rectangular unit area A ... Long in the row direction and short in the column direction is formed in a plurality of rows and a plurality of columns.

After a predetermined number of electrode portions and common lines (not shown) are collectively printed and formed in each unit area A, a predetermined number of resistance elements (are connected to the electrode portions and common lines). A predetermined resistance circuit of the resistance network is formed by collectively printing (not shown).

After that, a resistor network is completed through a trimming process for the resistance element, a substrate dividing process for dividing the substrate 1 into each unit area, a lead pin (not shown) bonding process, and the like.

The manufacturing substrate 1 of the present invention is provided with frame portions 3 having a predetermined width in the row direction on both side edge portions facing each other in the row direction (longitudinal direction in the unit area A).
Therefore, even when a resistance network having different specifications, that is, different numbers of lead pins mounted or different numbers of terminals is produced, it is not inconvenient to prepare substrates having different lengths in the row direction.

That is, the lead pins are arranged in the longitudinal direction (row direction in the unit area A) of the unit chip substrate obtained by dividing the substrate 1 into unit areas.
The unit area A is mounted at a predetermined interval according to the number of lead pins mounted on each unit chip substrate.
The required length in the row direction is different.

If the set number of the unit areas A in the row direction is the same, if the length of the unit area A in the row direction increases, the length in the row direction occupied by the plurality of unit areas arranged in the row direction also increases. In this case, in the manufacturing substrate 1 of the invention of the present application, a region corresponding to an increase in the length in the row direction occupied by the plurality of unit regions arranged in the row direction is defined as each frame portion 3,
3 can be obtained.

Therefore, even if the length in the row direction of the substrate itself is not extended, the set value of the length in the row direction of the unit area A can be increased to fabricate a resistor network in which the number of lead pin mounting pins is increased. You can do it.

Further, in the resistance network substrate 1 of this example, the length in the other direction is set to a length that matches the common multiple of the lengths in the column direction of the unit regions A having a plurality of sizes to be manufactured. are doing. Therefore, even when a resistor network having different set values for the column-direction length of the unit region A is manufactured,
It is not necessary to change the length of the manufacturing substrate itself in the column direction.

In the case of this embodiment, the planned length in the column direction of the unit area A is 3 mm, 4 m which is generally adopted as the substrate width of the resistor network at present.
We are considering three types, m and 6 mm, and the substrate 1
The length in the row direction is, for example, 48 mm or 60 mm
Is set.

As described above, in the resistance network manufacturing substrate 1 of the present invention, the column direction length and the row direction length remain constant even if the specifications of the resistance network to be manufactured are different. Good. Therefore, it is no longer necessary to prepare manufacturing substrates of various sizes according to the type of resistance network to be manufactured as in the related art, and the manufacturing cost can be significantly reduced.

Further, in the manufacturing substrate 1 of the present invention, as described above, the frame portion 3 having a predetermined width is conveniently formed at the side edge in the row direction even if the type of the resistance network to be manufactured is different. Therefore, the positioning recognition hole 4 can be provided in the frame portion as shown in FIG. In this case, the positioning of the substrate 1 with respect to the processing apparatus can be accurately performed by the positioning recognition hole 4 in the printing process of the resistance element or the electrode portion, the trimming process for the resistance element, and the like. Can significantly improve the processing system.

This means that the defective product generation rate of the resistor network is drastically reduced and the productivity is greatly improved. The positioning recognition mark may be, for example, a recess or a protrusion.

Further, it is very convenient to provide a cutout portion 5 on the edge of the frame portion 3 for easily selecting the type of substrate as shown in FIG.

In order to effectively prevent the resistance network from being defective even if there is a misalignment in the printing of the above-mentioned electrode portions etc. that are collectively printed across the slits in the adjacent unit areas A, A, The slits 2a and 2b are usually formed with an extremely narrow width as shown in FIG.
For this reason, if the size and shape of the substrate are constant, it is very difficult to visually identify the slits 2a and 2b to determine which specification of the resistor network the substrate is for.

Therefore, in this embodiment, the cutout portion 5 is formed.
In addition, the position of the notch 5 is changed according to the specification of the resistance network to be manufactured, so that the type of the substrate 1 can be easily selected. In addition, as a selection method,
For example, the type of the substrate 1 may be distinguished by the set number of the cutout portions 5.

The scope of the present invention is not limited to the above-mentioned embodiments. For example, in the above embodiment, the frame portions are provided on both side edge portions facing each other in the row direction. However, the frame portion may be provided on only one side edge portion, and the width of the frame portion may be the same as that of the substrate. It may be determined as appropriate considering the size and the like.

[Brief description of drawings]

FIG. 1 is a plan view of a resistor network manufacturing substrate according to an embodiment of the present invention.

FIG. 2 is an enlarged sectional view taken along line II-II in FIG.

FIG. 3 is a plan view of a conventional resistor network substrate.

[Explanation of symbols]

 1 Resistor Network Manufacturing Substrate 2a, 2b Slit 3 Frame Part A Unit Area

Claims (4)

[Claims] 1. A plurality of slits are formed on the upper surface in a grid pattern at equal intervals so that the slits are long in the row direction and in the column direction.
A method for manufacturing a resistance network of a plurality of types having different sizes using a manufacturing substrate formed by forming a plurality of short rectangular unit regions in a plurality of rows and a plurality of columns, wherein the manufacturing substrates are opposed to each other in a row direction. while comprising a frame part of at least a predetermined width at one side edge portion, both to have a plurality of kinds of size column dimensions are set to a common multiple of each column dimensions different resistance networks of manufactured scheduled
In addition, by providing the frame with a recognition means, a manufacturing substrate of a certain size can be used regardless of the size of the resistor network to be manufactured. And a method for manufacturing a resistor network. 2. The recognizing means is a position with respect to a process apparatus.
The recognizing means for positioning for performing the alignment,
The method according to 1. 3. The recognition means is a resistor network element.
The method according to claim 1, wherein the method is a specification recognizing unit that represents a situation. 4. A plurality of slits are equally spaced on the upper surface.
Formed in multiple rows and multiple columns by engraving in a grid pattern
In a rectangular unit area that is long in the row direction and short in the column direction,
A chip-shaped resistor network on which a predetermined resistor circuit is printed.
Substrate for manufacturing At least one of both side edges facing each other in the row direction
While having a frame part, there are multiple sizes to be manufactured.
Set to the common multiple of each column dimension of different resistance networks.
It has a fixed dimension in the column direction and is recognized in the above frame part.
A resistor network, characterized in that the means are formed.
Substrate for ark production.