JPH08192532A - Imaging device - Google Patents

Abstract

(57) [Abstract] [Purpose] Each electrode of the image sensor array is accurately connected to a predetermined electrode wiring to cause the light emitting diode device to emit accurate light, or the solid-state image sensor array is configured to accurately correspond to external image information. It is possible to take out various electrical signals. An image device comprising: a lens member (2) composed of a plurality of lenses (2b) and an image element member (1) having a large number of image element arrays (5) fixed together.
A plurality of image element arrays 5 are arranged between a first substrate 4 made of a translucent material having a plurality of individual electrode wirings 4a and a second substrate 6 having a common electrode wiring 6b. The individual electrode 5a of the image element array 5 is connected to the individual electrode wiring 4a of the first substrate 4 by flip-chip connection, and the common electrode 5b is connected to the common electrode wiring 6b of the second substrate 6, and Each image element array 5 is the second substrate 6
It is press-fitted into the recess 6a provided in the.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image forming apparatus used in an image forming apparatus such as an optical printer head or an image reading apparatus such as an image sensor.

[0002]

2. Description of the Related Art A conventional image forming apparatus, for example, an image forming apparatus used in an image forming apparatus such as an optical printer head, usually has a lens made of a resin such as polycarbonate in which a plurality of lenses are linearly arranged and supported at predetermined intervals. A plate and a base plate made of a resin such as polycarbonate in which a large number of light emitting diode element arrays are linearly mounted are provided side by side so that each lens and each light emitting diode element array have a one-to-one correspondence. It has a fixed structure.Each light emitting diode element of each light emitting diode element array is made to selectively emit light in response to an external electric signal, and the light emitted by the light emitting diode element is externally transmitted through a lens. By forming an image on the photoconductor and forming a latent image on the photoconductor, it functions as an image forming apparatus.

A light-emitting diode element array linearly arranged and mounted on the base plate generally has 64 light-emitting diode elements linearly arranged therein, which is suitable for a B4 size image forming apparatus. When used, the 32 light emitting diode element arrays are mounted on the base plate so that each of the 32 light emitting diode element arrays has a one-to-one correspondence with each lens.

Further, each of the light emitting diode element arrays has a common electrode on the lower surface thereof, and the common electrode wiring previously formed by depositing the common electrode on the upper surface of the base plate is made of, for example, epoxy resin or silver powder. The common electrode is mounted on the base plate while being electrically connected to the common electrode wiring by adhering via a conductive resin adhesive added with.

Further, in each light emitting diode element array mounted on the upper surface of the base plate, its individual electrode is electrically connected to an individual electrode wiring adhered to the upper surface of the base plate through a bonding wire, By connecting the common electrode wiring and the individual electrode wiring on the upper surface of the base plate to an external electric circuit, each light emitting diode element of the light emitting diode element array is electrically connected to the external electric circuit.

However, in this conventional image device, the individual electrodes provided in the light emitting diode element array are connected to the individual electrode wirings of the base plate through the bonding wires, and the individual electrodes of the light emitting diode element array are in the thousands. Since it is extremely large, it takes a long time to electrically connect the individual electrodes of the light-emitting diode element array to the individual electrode wirings of the base plate, which deteriorates the workability of manufacturing the image device and makes the image device as a product expensive. Had.

In the above embodiments, the image forming apparatus used in the image forming apparatus such as the optical printer head has been described as an example. However, in the image reading apparatus such as the image sensor using the solid-state image sensor array, The image device used has the same drawbacks.

Therefore, in order to solve the above-mentioned drawbacks, the applicant of the present invention previously provided an image element array facing a lens with a first substrate made of a translucent material having individual electrode wiring and a second substrate having common electrode wiring. In the meantime, an image device in which the individual electrode of each image element array is flip-chip connected to the individual electrode wiring of the first substrate and the common electrode is connected to the common electrode wiring of the second substrate is proposed.

According to such an image device, the individual electrodes of the image element array and the individual electrode wirings of the second substrate are flip-chip connected, that is, the first substrate is mounted on the image element array mounted on the second substrate. Since the individual electrodes of the element array and the individual electrode wirings of the first substrate are placed so as to be in contact with each other, and the individual electrodes and the individual electrode wirings are connected by being joined by soldering, the individual image element array is connected. Even if there are thousands of electrodes, all of them are electrically connected to the individual electrode wirings of the first substrate at once and firmly, and as a result, the productivity of the image device becomes extremely excellent.

[0010]

However, in this conventional image device, since the first substrate and the second substrate are both flat, the individual electrodes of the image element array are connected to the individual electrode wirings of the first substrate. At this time, or when the common electrode of the image element array is connected to the common electrode wiring of the second substrate, the position of the image element array is likely to be displaced, and if the position of the image element array is displaced, the individual electrodes of the image element array are It has a drawback that it cannot be accurately electrically connected to a predetermined individual electrode wiring.

At the same time, in this image device, the individual heights of the image element arrays vary, and the common electrode of each image element array is connected to the common electrode wiring of the second substrate via solder or conductive resin adhesive. In doing so, there is variation in the amount of solder or conductive resin adhesive interposed between the common electrode of each image element array and the common electrode wiring of the second substrate, and the first substrate having the individual electrode wiring and the common electrode. Since each of the second substrates having the wiring is formed of a material which is hard to be thermally deformed, each image element array mounted on the second substrate has a high level at the position of its individual electrode. As a result, the first substrate is placed on the image element array so that the individual electrodes and the individual electrode wirings come into contact with each other, and the individual electrodes and the individual electrode wirings are soldered. Flip through In the case of a top connection, it is impossible to bring all of the individual electrodes into contact with the individual electrode wirings of the first substrate, and there is also the drawback that all the individual electrodes cannot be reliably and firmly electrically connected to the individual electrode wirings. Triggered.

[0012]

SUMMARY OF THE INVENTION The present invention has been devised in view of the above drawbacks, and an object thereof is to securely electrically connect individual electrodes of an image element array to individual electrode wirings and common electrodes to common electrode wirings for light emission. An object of the present invention is to provide an image device capable of accurately causing a diode element to emit light in accordance with an external electric signal, or taking out an accurate electric signal corresponding to external image information from a solid-state image sensor array.

[0013]

SUMMARY OF THE INVENTION The present invention is an image device in which a lens member composed of a plurality of lenses and an image element member having a large number of image element arrays are fixed together. In addition, a plurality of image element arrays are arranged between a first substrate made of a translucent material having a plurality of individual electrode wirings and a second substrate having a common electrode wiring, and each image element array is individually arranged. The electrodes are formed by connecting the electrodes to the individual electrode wirings of the first substrate by flip-chip connection, and connecting the common electrodes to the common electrode wirings of the second substrate, and each of the image element arrays is provided on the second substrate. It is characterized by being pressed into.

The present invention is also characterized in that the deflection temperature under load of the second substrate is 180 to 240 ° C.

Further, the present invention is characterized in that a groove is provided between the concave portions of the second substrate.

Furthermore, the present invention is characterized in that the second substrate has a coefficient of thermal expansion of −3.0 × 10 ⁻⁶ / ° C. to 1.0 × 10 ⁻⁶ / ° C.

[0017]

According to the image device of the present invention, the individual electrodes of the image element array are connected to the individual electrode wirings of the first substrate by the flip-chip connection method. The individual electrode wirings of the first substrate are electrically connected at once and firmly, and the image device as a product becomes inexpensive.

Further, according to the image device of the present invention, since the concave portion is provided in the second substrate and the image element array is press-fitted into the concave portion, the position of the image element array is fixed and the positional deviation does not occur. , As a result, the individual electrodes of the image element array are accurately brought into contact with the predetermined individual electrode wiring,
All individual electrodes can be reliably and firmly electrically connected to the individual electrode wiring.

Further, according to the image device of the present invention, each image element array is press-fitted into the concave portion provided in the second substrate, and the height position of the individual electrode of each image element array is adjusted by adjusting the press-fitting amount. Therefore, it is possible to bring all the individual electrodes of the image element array into contact with the predetermined individual electrode wirings of the first substrate to securely and firmly electrically connect all the individual electrodes to the individual electrode wirings. .

[0020]

The present invention will now be described in detail with reference to the accompanying drawings. 1 to 3 show an embodiment in which the image device of the present invention is adopted in an optical printer head as an image forming device, 1 is an image element member, 2 is a lens member, and 3 is a support.

The image element member 1 is, as shown in FIG.
A first substrate 4 having a plurality of individual electrode wirings 4a on its lower surface;
A plurality of light-emitting diode element arrays 5 each having an upper surface to which an individual electrode 5a is attached and a lower surface to which a common electrode 5b is attached, and a second surface having a recess 6a into which the light-emitting diode element array 5 is press fitted and a common electrode wiring 6b It is composed of a substrate 6.

The second substrate 6 of the image element member 1 acts as a supporting member for supporting the light emitting diode element array 5, and is formed of, for example, liquid crystal polymer resin.

On the upper surface of the second substrate 6, a plurality of concave portions 6a each having a size slightly smaller than the outer dimensions of the light emitting diode element array 5 are linearly arranged and formed.
The light emitting diode element array 5 is press-fitted therein, whereby the light emitting diode element array 5 is linearly arranged on the second substrate 6. At this time, the common electrode 5b of the light emitting diode element array 5 is also electrically connected to the common electrode wiring 6b attached to the upper surface of the second substrate 6.

The light emitting diode element array 5 press-fitted on the upper surface of the second substrate 6 comprises a plurality of light emitting diode elements 5c, and the light emitting diode elements 5c individually and selectively emit light in response to an external electric signal. Then, by irradiating the external photoconductor P with the emitted light, a latent image for forming an image is formed on the photoconductor P.

The light emitting diode element 5c is a GaAsP type, Ga
P-based light-emitting diodes are used, for example, in the case of a GaAsP-based light-emitting diodes, as well as heating to a high temperature the GaAs substrate at furnace First AsH ₃ and (arsine) PH ₃ and (Hosuhin) Ga (gallium ) Is contacted with a gas to grow a single crystal of n-type semiconductor GaAsP (gallium-arsenic-phosphorus) on the substrate surface, and then Si ₃ is grown on the GaAsP single crystal surface.
A windowed film of N ₄ (silicon nitride) is deposited, and Zn (zinc) gas is exposed to the window to form an n-type semiconductor GaAsP.
Zn is diffused into a part of the single crystal to form a p-type semiconductor, and pn
It is formed by providing a bond.

In the case of a B4 size optical printer head, the number of the light emitting diode elements 5c is 2048 (8 per 1 mm).
Are arranged in a straight line, specifically, a light emitting diode element array in which 64 light emitting diode elements 5c are one unit.
By arranging 32 5 linearly, 2048 light emitting diode elements 5c are arrayed and mounted on the second substrate 6.

Further, the first substrate 4 having individual electrode wirings 4a is fixed on the upper surface of the light emitting diode element array 5 mounted on the second substrate 6.

The first substrate 4 serves to electrically connect the individual electrode wiring 4a to the individual electrode 5a of the light emitting diode element array 5, and the individual electrode of the light emitting diode element array 5 is connected.
5a is flip-chip connected to the individual electrode wiring 4a of the first substrate 4, specifically, the first substrate 4 is mounted on the second substrate 6 on which the light emitting diode element array 5 is mounted, and the individual electrode wiring of the first substrate 4 is mounted. 4a and each individual electrode 5a of the light emitting diode element array 5
The solder bumps previously applied to the substrate are placed so as to face each other, and then the solder bumps are heated and melted, and the individual electrode wirings 4a of the first substrate 4 and the light emitting diode element array.
By soldering each individual electrode 5a of 5
The substrate 4 is fixed on the light emitting diode element array 5 while electrically connecting the individual electrode wiring 4a to the individual electrode 5a of each light emitting diode element array 5. In this case, even if the total number of the individual electrodes 5a of each light emitting diode element array 5 is large, all of the individual electrodes 5a are attached to the individual electrode wirings 4a attached to the lower surface of the first substrate 4 at once through solder, and Because of strong electrical connection, each individual electrode 5a of the light emitting diode element array 5 and each individual electrode wiring 4a of the first substrate 4 can be electrically connected in an extremely short time, and the image device is assembled. Productivity and productivity are greatly improved.

Further, in the image element member 1, since the light emitting diode element array 5 is press-fitted onto the upper surface of the second substrate 6, its position is not fixed and no positional deviation occurs. At the same time, the press-fitting amount is adjusted. By doing so, the heights of the individual electrodes 5a of each light-emitting diode element array 5 can be made constant, so that the light-emitting diode element array 5
When connecting the individual electrodes 5a of the above to the individual electrode wirings 4a of the first substrate 4 by flip-chip connection, all the individual electrodes 5a of the light emitting diode element array 5 are connected to the individual electrode wirings of the first substrate 4 respectively.
The individual electrodes 5a can be accurately brought into contact with each other, and as a result, all individual electrodes 5a can be reliably and firmly electrically connected to the predetermined individual electrode wiring 4a.

When the second substrate 6 of the image element member 1 is made of a material having a deflection temperature under load of 180 to 240 ° C., for example, a liquid crystal polymer resin, the second substrate 6 is heated to a temperature of 180 ° C. or higher. And the light emitting diode element array 5 in the recess 6b.
Press-fitting allows the second substrate 6 to be appropriately deformed to allow the light-emitting diode element array 5 to be press-fitted without causing damage, whereby the light-emitting diode element array 5 can be accurately positioned at a predetermined position on the second substrate 6. Can be implemented in. Therefore, it is preferable that the second substrate 6 of the image element member 1 is formed of a material having a deflection temperature under load of 180 to 240 ° C., such as a liquid crystal polymer resin.

When the second substrate 6 of the image element member 1 is provided with a groove between the concave portions 6a provided on the upper surface thereof, the groove has a spring property around the concave portion 6a, whereby the second substrate 6 of the second substrate 6 is provided. When the light emitting diode element array 5 is press-fitted into the recess 6a and the light emitting diode element eye 5 is mounted on the second substrate 6, excessive force acts on the light emitting diode element array 5 to prevent damage to the light emitting diode element array 5. It will not be generated. Therefore, the second substrate of the image element member 1
It is preferable that the groove 6 be provided between the recesses 6a provided on the upper surface of the groove 6.

Further, a material having a coefficient of thermal expansion of the second substrate 6 of the image element member 1 of −3.0 × 10 ⁻⁶ / ° C. to 1.0 × 10 ⁻⁶ / ° C.,
For example, when the individual electrodes 5a of the light emitting diode element array 5 and the individual electrodes 4a of the first substrate 4 are connected to each other by being formed of liquid crystal polymer resin or the like, even if heat is applied to the second substrate 6, The substrate 6 hardly thermally expands, and as a result, the position of the light emitting diode element array 5 mounted on the second substrate 6 is always constant, which allows the light emitting diode element array to be arranged.
The individual electrodes 5a of 5 and the individual electrodes 4a of the first substrate 4 are accurately
And it becomes possible to connect firmly. Therefore, the thermal expansion coefficient of the second substrate 6 of the image element member 1 is −3.0 × 10 ^−6.
It is preferably set in the range of / ° C to 1.0 × 10 ^-6 / ° C.

Furthermore, the first substrate 4 is made of a translucent material such as crystallized glass or quartz. Since the first substrate 4 is translucent, each light emitting diode element 5c of the light emitting diode element array 5 is The emitted light passes through the first substrate 4 and travels to the lens member 2 described later.

An image element member 1 comprising the first substrate 4, the light emitting diode element array 5 and the second substrate 6 is provided with a lens member 2 on the upper part thereof at a constant distance, and a plurality of lens members 2 are provided. And a lens plate 2a in which the holes are linearly arranged and formed, and a lens 2b which is adhesively fixed to the lens plate 2a via an adhesive such as resin so as to close the holes.

The lens plate 2a of the lens member 2 acts as a supporting member for supporting a plurality of lenses 2b on the upper surface at a predetermined interval, and the holes serve as lenses for emitting light emitted from each light emitting diode element 5b of the light emitting diode element array 5. It has the function of transmitting to 2b.

Further, each lens 2b supported by the lens plate 2a transmits the light emitted from each emitting diode element 5b to the photoconductor P.
A lens formed of a transparent resin such as an acrylic resin or a polycarbonate resin or a transparent inorganic material such as glass, which has the function of irradiating the surface, is preferably used.

Each of the lenses 2b is linearly adhered to the lens plate 2a at predetermined intervals by adhering a part of the outer surface to the lens plate 2a via an epoxy resin adhesive, for example.

Further, the image element member 1 and the lens member 2
By fixing each of them to a pair of supports 3, each light emitting diode element array 5 and each lens 2b are provided side by side so as to correspond one-to-one with a predetermined distance.

The support 3 has a first alignment reference surface 3a on the top thereof and a second alignment reference surface 3b on the bottom thereof, and the lens plate 2a is attached to the first alignment reference surface 3a of the support 3. Of the image element member on the lower surface of the second alignment reference surface 3b.
By fixing the outer peripheral portion of the upper surface of the first substrate 4 to each other, the respective light emitting diode element arrays 5 and the respective lenses 2b are in a one-to-one correspondence with a predetermined distance therebetween. The support 3 is made of, for example, glass epoxy resin or the like.

Thus, according to the image device of the present invention, a predetermined power is applied to each light emitting diode element 5c of the image element member 1 to individually and selectively cause each light emitting diode element 5c to emit light, and each light emitting diode element 5c. The light emitted by 5c is reflected by the lens 2b.
An image is formed on the surface of the external photoconductor P via the, and a predetermined latent image is formed on the photoconductor P to function as an image forming apparatus.

The present invention is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the scope of the present invention. For example, in the above-mentioned embodiments, the optical printer head, etc. However, the light emitting diode element array may be replaced with a solid-state image pickup element array to be used in an image reading apparatus such as an image sensor.

[0042]

According to the image device of the present invention, since the individual electrodes of the image element array are connected to the individual electrode wirings of the first substrate by the flip chip connection method, even if there are many individual electrodes of the image element array, All of them are electrically connected to the individual electrode wirings of the first substrate at once and firmly, and the image device as a product becomes inexpensive.

Further, according to the image device of the present invention, since the concave portion is provided in the second substrate and the image element array is press-fitted into the concave portion, the position of the image element array is fixed and the positional deviation does not occur. , As a result, the individual electrodes of the image element array are accurately brought into contact with the predetermined individual electrode wiring,
All individual electrodes can be reliably and firmly electrically connected to the individual electrode wiring.

Further, according to the image device of the present invention, each image element array is press-fitted into the concave portion provided in the second substrate, and the height position of the individual electrode of each image element array is adjusted by adjusting the press-fitting amount. Therefore, it is possible to bring all the individual electrodes of the image element array into contact with the predetermined individual electrode wirings of the first substrate to securely and firmly electrically connect all the individual electrodes to the individual electrode wirings. .

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view showing an embodiment in which an image device of the present invention is used in an optical printer head as an image forming device.

2 is a cross-sectional view of the optical printer head shown in FIG.

FIG. 3 is an enlarged sectional view of a main part of the optical printer head shown in FIG.

[Explanation of symbols]

 Image element member 2 Lens member 3 Support 1st substrate 4a Individual electrode wiring 5 .... Light emitting diode element array 5a ... Individual electrode 5b ... Common electrode 5c ... Light emitting diode element 6 ... Second substrate 6a ... Recessed portion 6b: Common electrode wiring P: Photoconductor

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location H04N 1/036 A

Claims (4)

[Claims] 1. An image device in which a lens member including a plurality of lenses and an image element member having a large number of image element arrays are fixed together, the image element member including a plurality of individual electrode wirings. A plurality of image element arrays are arranged between a first substrate made of a light-transmissive material having a light emitting element and a second substrate having a common electrode wiring, and the individual electrodes of each image element array are provided as individual electrodes of the first substrate. It is formed by connecting the wiring to the wiring by flip-chip connection, connecting the common electrode to the common electrode wiring of the second substrate, and press-fitting each of the image element arrays into a recess provided in the second substrate. Image device. 2. The deflection temperature under load of the second substrate is 180 to 24.
The image device according to claim 1, wherein the temperature is 0 ° C. 3. The image device according to claim 1, wherein a groove is provided between the concave portions of the second substrate. 4. The coefficient of thermal expansion of the second substrate is −3.0 × 10 ^−6.
/ ° C to 1.0 x 10 ^-6 / ° C.
The image device according to 1.