JPH08198966A - Production of polyarylene sulfide - Google Patents
Production of polyarylene sulfideInfo
- Publication number
- JPH08198966A JPH08198966A JP7031739A JP3173995A JPH08198966A JP H08198966 A JPH08198966 A JP H08198966A JP 7031739 A JP7031739 A JP 7031739A JP 3173995 A JP3173995 A JP 3173995A JP H08198966 A JPH08198966 A JP H08198966A
- Authority
- JP
- Japan
- Prior art keywords
- reaction
- solvent
- alkali metal
- pas
- aromatic compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 title claims abstract description 11
- 229920000412 polyarylene Polymers 0.000 title claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000006243 chemical reaction Methods 0.000 claims abstract description 75
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 39
- 239000002904 solvent Substances 0.000 claims abstract description 30
- 150000001491 aromatic compounds Chemical class 0.000 claims abstract description 27
- 125000000524 functional group Chemical group 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 22
- 229910052977 alkali metal sulfide Inorganic materials 0.000 claims abstract description 16
- 150000001875 compounds Chemical class 0.000 claims abstract description 12
- 230000001590 oxidative effect Effects 0.000 claims abstract description 6
- 239000002002 slurry Substances 0.000 claims abstract description 6
- 239000012298 atmosphere Substances 0.000 claims abstract description 5
- 150000003857 carboxamides Chemical class 0.000 claims abstract description 5
- 238000001816 cooling Methods 0.000 claims description 20
- 239000007789 gas Substances 0.000 claims description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 13
- 239000012065 filter cake Substances 0.000 claims description 10
- 239000012071 phase Substances 0.000 claims description 10
- 239000007791 liquid phase Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000001914 filtration Methods 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- DADSZOFTIIETSV-UHFFFAOYSA-N n,n-dichloroaniline Chemical compound ClN(Cl)C1=CC=CC=C1 DADSZOFTIIETSV-UHFFFAOYSA-N 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 abstract description 10
- 229920000647 polyepoxide Polymers 0.000 abstract description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 18
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 17
- 239000004734 Polyphenylene sulfide Substances 0.000 description 13
- 229920000069 polyphenylene sulfide Polymers 0.000 description 13
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical group ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 238000005406 washing Methods 0.000 description 11
- 239000011342 resin composition Substances 0.000 description 10
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 9
- 150000003462 sulfoxides Chemical class 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 229910052979 sodium sulfide Inorganic materials 0.000 description 8
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- -1 ether compound Chemical class 0.000 description 6
- 238000010992 reflux Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 150000003568 thioethers Chemical class 0.000 description 5
- 239000006227 byproduct Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 239000012765 fibrous filler Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000007086 side reaction Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- BSWWXRFVMJHFBN-UHFFFAOYSA-N 2,4,6-Tribromophenol Natural products OC1=C(Br)C=C(Br)C=C1Br BSWWXRFVMJHFBN-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- FAXWFCTVSHEODL-UHFFFAOYSA-N 2,4-dibromophenol Chemical compound OC1=CC=C(Br)C=C1Br FAXWFCTVSHEODL-UHFFFAOYSA-N 0.000 description 2
- ATCRIUVQKHMXSH-UHFFFAOYSA-N 2,4-dichlorobenzoic acid Chemical compound OC(=O)C1=CC=C(Cl)C=C1Cl ATCRIUVQKHMXSH-UHFFFAOYSA-N 0.000 description 2
- AVYGCQXNNJPXSS-UHFFFAOYSA-N 2,5-dichloroaniline Chemical compound NC1=CC(Cl)=CC=C1Cl AVYGCQXNNJPXSS-UHFFFAOYSA-N 0.000 description 2
- SSIZLKDLDKIHEV-UHFFFAOYSA-N 2,6-dibromophenol Chemical compound OC1=C(Br)C=CC=C1Br SSIZLKDLDKIHEV-UHFFFAOYSA-N 0.000 description 2
- YTBRNEUEFCNVHC-UHFFFAOYSA-N 4,4'-dichlorobiphenyl Chemical group C1=CC(Cl)=CC=C1C1=CC=C(Cl)C=C1 YTBRNEUEFCNVHC-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 150000004677 hydrates Chemical class 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- PBKONEOXTCPAFI-UHFFFAOYSA-N 1,2,4-trichlorobenzene Chemical compound ClC1=CC=C(Cl)C(Cl)=C1 PBKONEOXTCPAFI-UHFFFAOYSA-N 0.000 description 1
- SMVUMPPZJFHJSI-UHFFFAOYSA-N 1,2-dichloro-5-(4-chlorophenyl)cyclohexa-2,4-dien-1-ol Chemical group OC1(CC(=CC=C1Cl)C1=CC=C(C=C1)Cl)Cl SMVUMPPZJFHJSI-UHFFFAOYSA-N 0.000 description 1
- XKEFYDZQGKAQCN-UHFFFAOYSA-N 1,3,5-trichlorobenzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1 XKEFYDZQGKAQCN-UHFFFAOYSA-N 0.000 description 1
- ZPQOPVIELGIULI-UHFFFAOYSA-N 1,3-dichlorobenzene Chemical compound ClC1=CC=CC(Cl)=C1 ZPQOPVIELGIULI-UHFFFAOYSA-N 0.000 description 1
- MDRUKDLYOLTXBU-UHFFFAOYSA-N 2,3,4-tribromoaniline Chemical compound NC1=CC=C(Br)C(Br)=C1Br MDRUKDLYOLTXBU-UHFFFAOYSA-N 0.000 description 1
- YILIWRGPGBLGAK-UHFFFAOYSA-N 2,3,4-tribromobenzenethiol Chemical compound SC1=CC=C(Br)C(Br)=C1Br YILIWRGPGBLGAK-UHFFFAOYSA-N 0.000 description 1
- JWHSTVSAXLKNAZ-UHFFFAOYSA-N 2,3,4-tribromobenzoic acid Chemical compound OC(=O)C1=CC=C(Br)C(Br)=C1Br JWHSTVSAXLKNAZ-UHFFFAOYSA-N 0.000 description 1
- OUCSIUCEQVCDEL-UHFFFAOYSA-N 2,3,4-tribromophenol Chemical compound OC1=CC=C(Br)C(Br)=C1Br OUCSIUCEQVCDEL-UHFFFAOYSA-N 0.000 description 1
- OULFPMYYSOHQIV-UHFFFAOYSA-N 2,3,4-trichloro-n-phenylaniline Chemical compound ClC1=C(Cl)C(Cl)=CC=C1NC1=CC=CC=C1 OULFPMYYSOHQIV-UHFFFAOYSA-N 0.000 description 1
- RRJUYQOFOMFVQS-UHFFFAOYSA-N 2,3,4-trichloroaniline Chemical compound NC1=CC=C(Cl)C(Cl)=C1Cl RRJUYQOFOMFVQS-UHFFFAOYSA-N 0.000 description 1
- PJFUHFZHSSLCTE-UHFFFAOYSA-N 2,3,4-trichlorobenzenethiol Chemical compound SC1=CC=C(Cl)C(Cl)=C1Cl PJFUHFZHSSLCTE-UHFFFAOYSA-N 0.000 description 1
- ALLSOOQIDPLIER-UHFFFAOYSA-N 2,3,4-trichlorobenzoic acid Chemical compound OC(=O)C1=CC=C(Cl)C(Cl)=C1Cl ALLSOOQIDPLIER-UHFFFAOYSA-N 0.000 description 1
- HSQFVBWFPBKHEB-UHFFFAOYSA-N 2,3,4-trichlorophenol Chemical compound OC1=CC=C(Cl)C(Cl)=C1Cl HSQFVBWFPBKHEB-UHFFFAOYSA-N 0.000 description 1
- YTDHEFNWWHSXSU-UHFFFAOYSA-N 2,3,5,6-tetrachloroaniline Chemical compound NC1=C(Cl)C(Cl)=CC(Cl)=C1Cl YTDHEFNWWHSXSU-UHFFFAOYSA-N 0.000 description 1
- BRFIPEIKLLLCJW-UHFFFAOYSA-N 2,3,5-tribromoaniline Chemical compound NC1=CC(Br)=CC(Br)=C1Br BRFIPEIKLLLCJW-UHFFFAOYSA-N 0.000 description 1
- CPZODYYAEUMMDQ-UHFFFAOYSA-N 2,3,5-tribromobenzenethiol Chemical compound BrC1=C(C=C(C=C1Br)Br)S CPZODYYAEUMMDQ-UHFFFAOYSA-N 0.000 description 1
- VXRZWSOTDBLHDQ-UHFFFAOYSA-N 2,3,5-tribromobenzoic acid Chemical compound OC(=O)C1=CC(Br)=CC(Br)=C1Br VXRZWSOTDBLHDQ-UHFFFAOYSA-N 0.000 description 1
- SKDJCHZVXDLVIE-UHFFFAOYSA-N 2,3,5-tribromophenol Chemical compound OC1=CC(Br)=CC(Br)=C1Br SKDJCHZVXDLVIE-UHFFFAOYSA-N 0.000 description 1
- MKYRCNRHZFXRRT-UHFFFAOYSA-N 2,3,5-trichloro-n-phenylaniline Chemical compound ClC1=CC(Cl)=C(Cl)C(NC=2C=CC=CC=2)=C1 MKYRCNRHZFXRRT-UHFFFAOYSA-N 0.000 description 1
- MOTBXEPLFOLWHZ-UHFFFAOYSA-N 2,3,5-trichloroaniline Chemical compound NC1=CC(Cl)=CC(Cl)=C1Cl MOTBXEPLFOLWHZ-UHFFFAOYSA-N 0.000 description 1
- LDZBJXAJFZJITQ-UHFFFAOYSA-N 2,3,5-trichlorobenzenethiol Chemical compound SC1=CC(Cl)=CC(Cl)=C1Cl LDZBJXAJFZJITQ-UHFFFAOYSA-N 0.000 description 1
- CGFDSIZRJWMQPP-UHFFFAOYSA-N 2,3,5-trichlorobenzoic acid Chemical compound OC(=O)C1=CC(Cl)=CC(Cl)=C1Cl CGFDSIZRJWMQPP-UHFFFAOYSA-N 0.000 description 1
- WWGQHTJIFOQAOC-UHFFFAOYSA-N 2,3,5-trichlorophenol Chemical compound OC1=CC(Cl)=CC(Cl)=C1Cl WWGQHTJIFOQAOC-UHFFFAOYSA-N 0.000 description 1
- XZIDTOHMJBOSOX-UHFFFAOYSA-N 2,3,6-TBA Chemical compound OC(=O)C1=C(Cl)C=CC(Cl)=C1Cl XZIDTOHMJBOSOX-UHFFFAOYSA-N 0.000 description 1
- UEVXAXSPNCMQIC-UHFFFAOYSA-N 2,3,6-tribromoaniline Chemical compound NC1=C(Br)C=CC(Br)=C1Br UEVXAXSPNCMQIC-UHFFFAOYSA-N 0.000 description 1
- FNPQDLUBNNNGTA-UHFFFAOYSA-N 2,3,6-tribromobenzenethiol Chemical compound BrC1=C(C(=CC=C1Br)Br)S FNPQDLUBNNNGTA-UHFFFAOYSA-N 0.000 description 1
- IUCILSOWKNCUOC-UHFFFAOYSA-N 2,3,6-tribromobenzoic acid Chemical compound OC(=O)C1=C(Br)C=CC(Br)=C1Br IUCILSOWKNCUOC-UHFFFAOYSA-N 0.000 description 1
- VCNCNAPAHSSWCI-UHFFFAOYSA-N 2,3,6-tribromophenol Chemical compound OC1=C(Br)C=CC(Br)=C1Br VCNCNAPAHSSWCI-UHFFFAOYSA-N 0.000 description 1
- ZJMMPUVJZQBMEM-UHFFFAOYSA-N 2,3,6-trichloroaniline Chemical compound NC1=C(Cl)C=CC(Cl)=C1Cl ZJMMPUVJZQBMEM-UHFFFAOYSA-N 0.000 description 1
- KKLACKSYGWSSQN-UHFFFAOYSA-N 2,3,6-trichlorobenzenethiol Chemical compound SC1=C(Cl)C=CC(Cl)=C1Cl KKLACKSYGWSSQN-UHFFFAOYSA-N 0.000 description 1
- XGCHAIDDPMFRLJ-UHFFFAOYSA-N 2,3,6-trichlorophenol Chemical compound OC1=C(Cl)C=CC(Cl)=C1Cl XGCHAIDDPMFRLJ-UHFFFAOYSA-N 0.000 description 1
- YNVNFMCYBIBHLH-UHFFFAOYSA-N 2,3-dibromobenzoic acid Chemical compound OC(=O)C1=CC=CC(Br)=C1Br YNVNFMCYBIBHLH-UHFFFAOYSA-N 0.000 description 1
- OVXWBXQPDNQKDT-UHFFFAOYSA-N 2,3-dichloro-4-phenylaniline Chemical compound ClC1=C(Cl)C(N)=CC=C1C1=CC=CC=C1 OVXWBXQPDNQKDT-UHFFFAOYSA-N 0.000 description 1
- SWWAIMIGDYXEBA-UHFFFAOYSA-N 2,3-dichloro-5-(4-chloro-3-sulfanylphenyl)benzenethiol Chemical group C1=C(Cl)C(S)=CC(C=2C=C(Cl)C(Cl)=C(S)C=2)=C1 SWWAIMIGDYXEBA-UHFFFAOYSA-N 0.000 description 1
- BRPSAOUFIJSKOT-UHFFFAOYSA-N 2,3-dichloroaniline Chemical compound NC1=CC=CC(Cl)=C1Cl BRPSAOUFIJSKOT-UHFFFAOYSA-N 0.000 description 1
- QGRKONUHHGBHRB-UHFFFAOYSA-N 2,3-dichlorobenzenethiol Chemical compound SC1=CC=CC(Cl)=C1Cl QGRKONUHHGBHRB-UHFFFAOYSA-N 0.000 description 1
- QAOJBHRZQQDFHA-UHFFFAOYSA-N 2,3-dichlorobenzoic acid Chemical compound OC(=O)C1=CC=CC(Cl)=C1Cl QAOJBHRZQQDFHA-UHFFFAOYSA-N 0.000 description 1
- UMPSXRYVXUPCOS-UHFFFAOYSA-N 2,3-dichlorophenol Chemical compound OC1=CC=CC(Cl)=C1Cl UMPSXRYVXUPCOS-UHFFFAOYSA-N 0.000 description 1
- WYOLRSXBYGGDGN-UHFFFAOYSA-N 2,4,5-tribromo-n-phenylaniline Chemical compound C1=C(Br)C(Br)=CC(Br)=C1NC1=CC=CC=C1 WYOLRSXBYGGDGN-UHFFFAOYSA-N 0.000 description 1
- IANBJQQTAKDKDC-UHFFFAOYSA-N 2,4,5-tribromoaniline Chemical compound NC1=CC(Br)=C(Br)C=C1Br IANBJQQTAKDKDC-UHFFFAOYSA-N 0.000 description 1
- FLQLTDFABYDBBV-UHFFFAOYSA-N 2,4,5-tribromobenzoic acid Chemical compound OC(=O)C1=CC(Br)=C(Br)C=C1Br FLQLTDFABYDBBV-UHFFFAOYSA-N 0.000 description 1
- XPUSKKJATQFMBF-UHFFFAOYSA-N 2,4,5-tribromophenol Chemical compound OC1=CC(Br)=C(Br)C=C1Br XPUSKKJATQFMBF-UHFFFAOYSA-N 0.000 description 1
- RVSTYTOHDGDAMX-UHFFFAOYSA-N 2,4,5-trichloro-n-phenylaniline Chemical compound C1=C(Cl)C(Cl)=CC(Cl)=C1NC1=CC=CC=C1 RVSTYTOHDGDAMX-UHFFFAOYSA-N 0.000 description 1
- GUMCAKKKNKYFEB-UHFFFAOYSA-N 2,4,5-trichloroaniline Chemical compound NC1=CC(Cl)=C(Cl)C=C1Cl GUMCAKKKNKYFEB-UHFFFAOYSA-N 0.000 description 1
- JARIALSGFXECCH-UHFFFAOYSA-N 2,4,5-trichlorobenzenethiol Chemical compound SC1=CC(Cl)=C(Cl)C=C1Cl JARIALSGFXECCH-UHFFFAOYSA-N 0.000 description 1
- PTFNNDHASFGWFI-UHFFFAOYSA-N 2,4,5-trichlorobenzoic acid Chemical compound OC(=O)C1=CC(Cl)=C(Cl)C=C1Cl PTFNNDHASFGWFI-UHFFFAOYSA-N 0.000 description 1
- LHJGJYXLEPZJPM-UHFFFAOYSA-N 2,4,5-trichlorophenol Chemical compound OC1=CC(Cl)=C(Cl)C=C1Cl LHJGJYXLEPZJPM-UHFFFAOYSA-N 0.000 description 1
- VCSYHNQUFKZSOE-UHFFFAOYSA-N 2,4,6-tribromo-n-phenylaniline Chemical compound BrC1=CC(Br)=CC(Br)=C1NC1=CC=CC=C1 VCSYHNQUFKZSOE-UHFFFAOYSA-N 0.000 description 1
- GVPODVKBTHCGFU-UHFFFAOYSA-N 2,4,6-tribromoaniline Chemical compound NC1=C(Br)C=C(Br)C=C1Br GVPODVKBTHCGFU-UHFFFAOYSA-N 0.000 description 1
- CSGWTASASRPRAX-UHFFFAOYSA-N 2,4,6-tribromobenzenethiol Chemical compound SC1=C(Br)C=C(Br)C=C1Br CSGWTASASRPRAX-UHFFFAOYSA-N 0.000 description 1
- GHVMJSHEGZYRQL-UHFFFAOYSA-N 2,4,6-tribromobenzoic acid Chemical compound OC(=O)C1=C(Br)C=C(Br)C=C1Br GHVMJSHEGZYRQL-UHFFFAOYSA-N 0.000 description 1
- HLNRCXQIZGIJSU-UHFFFAOYSA-N 2,4,6-trichloro-n-phenylaniline Chemical compound ClC1=CC(Cl)=CC(Cl)=C1NC1=CC=CC=C1 HLNRCXQIZGIJSU-UHFFFAOYSA-N 0.000 description 1
- NATVSFWWYVJTAZ-UHFFFAOYSA-N 2,4,6-trichloroaniline Chemical compound NC1=C(Cl)C=C(Cl)C=C1Cl NATVSFWWYVJTAZ-UHFFFAOYSA-N 0.000 description 1
- OOXQIHPXUMNXJZ-UHFFFAOYSA-N 2,4,6-trichlorobenzenethiol Chemical compound SC1=C(Cl)C=C(Cl)C=C1Cl OOXQIHPXUMNXJZ-UHFFFAOYSA-N 0.000 description 1
- RAFFVQBMVYYTQS-UHFFFAOYSA-N 2,4,6-trichlorobenzoic acid Chemical compound OC(=O)C1=C(Cl)C=C(Cl)C=C1Cl RAFFVQBMVYYTQS-UHFFFAOYSA-N 0.000 description 1
- LINPIYWFGCPVIE-UHFFFAOYSA-N 2,4,6-trichlorophenol Chemical compound OC1=C(Cl)C=C(Cl)C=C1Cl LINPIYWFGCPVIE-UHFFFAOYSA-N 0.000 description 1
- DYSRXWYRUJCNFI-UHFFFAOYSA-N 2,4-dibromoaniline Chemical compound NC1=CC=C(Br)C=C1Br DYSRXWYRUJCNFI-UHFFFAOYSA-N 0.000 description 1
- NAGGYODWMPFKJQ-UHFFFAOYSA-N 2,4-dibromobenzoic acid Chemical compound OC(=O)C1=CC=C(Br)C=C1Br NAGGYODWMPFKJQ-UHFFFAOYSA-N 0.000 description 1
- KQCMTOWTPBNWDB-UHFFFAOYSA-N 2,4-dichloroaniline Chemical compound NC1=CC=C(Cl)C=C1Cl KQCMTOWTPBNWDB-UHFFFAOYSA-N 0.000 description 1
- FGBVJFREPSJSNG-UHFFFAOYSA-N 2,4-dichlorobenzenethiol Chemical compound SC1=CC=C(Cl)C=C1Cl FGBVJFREPSJSNG-UHFFFAOYSA-N 0.000 description 1
- HFZWRUODUSTPEG-UHFFFAOYSA-N 2,4-dichlorophenol Chemical compound OC1=CC=C(Cl)C=C1Cl HFZWRUODUSTPEG-UHFFFAOYSA-N 0.000 description 1
- SQQKOTVDGCJJKI-UHFFFAOYSA-N 2,5-dibromobenzoic acid Chemical compound OC(=O)C1=CC(Br)=CC=C1Br SQQKOTVDGCJJKI-UHFFFAOYSA-N 0.000 description 1
- QIULLHZMZMGGFH-UHFFFAOYSA-N 2,5-dichlorobenzenethiol Chemical compound SC1=CC(Cl)=CC=C1Cl QIULLHZMZMGGFH-UHFFFAOYSA-N 0.000 description 1
- QVTQYSFCFOGITD-UHFFFAOYSA-N 2,5-dichlorobenzoic acid Chemical compound OC(=O)C1=CC(Cl)=CC=C1Cl QVTQYSFCFOGITD-UHFFFAOYSA-N 0.000 description 1
- RANCECPPZPIPNO-UHFFFAOYSA-N 2,5-dichlorophenol Chemical compound OC1=CC(Cl)=CC=C1Cl RANCECPPZPIPNO-UHFFFAOYSA-N 0.000 description 1
- HQLOEBRPCVIFCT-UHFFFAOYSA-N 2,6-dibromobenzoic acid Chemical compound OC(=O)C1=C(Br)C=CC=C1Br HQLOEBRPCVIFCT-UHFFFAOYSA-N 0.000 description 1
- JDMFXJULNGEPOI-UHFFFAOYSA-N 2,6-dichloroaniline Chemical compound NC1=C(Cl)C=CC=C1Cl JDMFXJULNGEPOI-UHFFFAOYSA-N 0.000 description 1
- JBISHCXLCGVPGW-UHFFFAOYSA-N 2,6-dichlorobenzenethiol Chemical compound SC1=C(Cl)C=CC=C1Cl JBISHCXLCGVPGW-UHFFFAOYSA-N 0.000 description 1
- MRUDNSFOFOQZDA-UHFFFAOYSA-N 2,6-dichlorobenzoic acid Chemical compound OC(=O)C1=C(Cl)C=CC=C1Cl MRUDNSFOFOQZDA-UHFFFAOYSA-N 0.000 description 1
- HOLHYSJJBXSLMV-UHFFFAOYSA-N 2,6-dichlorophenol Chemical compound OC1=C(Cl)C=CC=C1Cl HOLHYSJJBXSLMV-UHFFFAOYSA-N 0.000 description 1
- BLCFCAOALNHVIJ-UHFFFAOYSA-N 2-chloro-5-(3,4-dichlorophenyl)aniline Chemical group C1=C(Cl)C(N)=CC(C=2C=C(Cl)C(Cl)=CC=2)=C1 BLCFCAOALNHVIJ-UHFFFAOYSA-N 0.000 description 1
- VNMTYQDWZUNHPX-UHFFFAOYSA-N 3,4,5-tribromobenzenethiol Chemical compound SC1=CC(Br)=C(Br)C(Br)=C1 VNMTYQDWZUNHPX-UHFFFAOYSA-N 0.000 description 1
- XOGYQVITULCUGU-UHFFFAOYSA-N 3,4,5-trichloroaniline Chemical compound NC1=CC(Cl)=C(Cl)C(Cl)=C1 XOGYQVITULCUGU-UHFFFAOYSA-N 0.000 description 1
- VHUYFTLLFNDZPS-UHFFFAOYSA-N 3,4,5-trichlorobenzenethiol Chemical compound SC1=CC(Cl)=C(Cl)C(Cl)=C1 VHUYFTLLFNDZPS-UHFFFAOYSA-N 0.000 description 1
- ICUICNRYLHKQGS-UHFFFAOYSA-N 3,4,5-trichlorobenzoic acid Chemical compound OC(=O)C1=CC(Cl)=C(Cl)C(Cl)=C1 ICUICNRYLHKQGS-UHFFFAOYSA-N 0.000 description 1
- GBNHEBQXJVDXSW-UHFFFAOYSA-N 3,4,5-trichlorophenol Chemical compound OC1=CC(Cl)=C(Cl)C(Cl)=C1 GBNHEBQXJVDXSW-UHFFFAOYSA-N 0.000 description 1
- WDNBURPWRNALGP-UHFFFAOYSA-N 3,4-Dichlorophenol Chemical compound OC1=CC=C(Cl)C(Cl)=C1 WDNBURPWRNALGP-UHFFFAOYSA-N 0.000 description 1
- UQRLKWGPEVNVHT-UHFFFAOYSA-N 3,5-dichloroaniline Chemical compound NC1=CC(Cl)=CC(Cl)=C1 UQRLKWGPEVNVHT-UHFFFAOYSA-N 0.000 description 1
- VPOMSPZBQMDLTM-UHFFFAOYSA-N 3,5-dichlorophenol Chemical compound OC1=CC(Cl)=CC(Cl)=C1 VPOMSPZBQMDLTM-UHFFFAOYSA-N 0.000 description 1
- GPAPPPVRLPGFEQ-UHFFFAOYSA-N 4,4'-dichlorodiphenyl sulfone Chemical compound C1=CC(Cl)=CC=C1S(=O)(=O)C1=CC=C(Cl)C=C1 GPAPPPVRLPGFEQ-UHFFFAOYSA-N 0.000 description 1
- ITYPDNADFUOZPO-UHFFFAOYSA-N 4-(3,4,5-trichlorophenyl)phenol Chemical group C1=CC(O)=CC=C1C1=CC(Cl)=C(Cl)C(Cl)=C1 ITYPDNADFUOZPO-UHFFFAOYSA-N 0.000 description 1
- SPXFVZDKSRPFPW-UHFFFAOYSA-N 4-bromo-2,5-dichloroaniline Chemical compound NC1=CC(Cl)=C(Br)C=C1Cl SPXFVZDKSRPFPW-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- GIXBJLLKRKPWGJ-UHFFFAOYSA-N BrC1=C(C(=C(C=C1)NC1=CC=CC=C1)Br)Br Chemical compound BrC1=C(C(=C(C=C1)NC1=CC=CC=C1)Br)Br GIXBJLLKRKPWGJ-UHFFFAOYSA-N 0.000 description 1
- PDDQVVWTXCNZCT-UHFFFAOYSA-N Brc1cc(Br)c(Br)c(Nc2ccccc2)c1 Chemical compound Brc1cc(Br)c(Br)c(Nc2ccccc2)c1 PDDQVVWTXCNZCT-UHFFFAOYSA-N 0.000 description 1
- AVQUGVAFWSKRNL-UHFFFAOYSA-N Brc1cc(Nc2ccccc2)cc(Br)c1Br Chemical compound Brc1cc(Nc2ccccc2)cc(Br)c1Br AVQUGVAFWSKRNL-UHFFFAOYSA-N 0.000 description 1
- GJRJZHMEKIJBQX-UHFFFAOYSA-N Brc1ccc(Br)c(Nc2ccccc2)c1Br Chemical compound Brc1ccc(Br)c(Nc2ccccc2)c1Br GJRJZHMEKIJBQX-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- MPCSEPVEYFIBNT-UHFFFAOYSA-N ClC1=C(C(=CC=C1C1=CC=CC=C1)Cl)N Chemical compound ClC1=C(C(=CC=C1C1=CC=CC=C1)Cl)N MPCSEPVEYFIBNT-UHFFFAOYSA-N 0.000 description 1
- GPPQHVRAYUTQGC-UHFFFAOYSA-N ClC1=C(C=C(C=C1C1=CC=CC=C1)Cl)N Chemical compound ClC1=C(C=C(C=C1C1=CC=CC=C1)Cl)N GPPQHVRAYUTQGC-UHFFFAOYSA-N 0.000 description 1
- RCSWHRKVYNVQBK-UHFFFAOYSA-N Clc1cc(Nc2ccccc2)cc(Cl)c1Cl Chemical compound Clc1cc(Nc2ccccc2)cc(Cl)c1Cl RCSWHRKVYNVQBK-UHFFFAOYSA-N 0.000 description 1
- VGDLGHPTSRSQSJ-UHFFFAOYSA-N Clc1ccc(Cl)c(Nc2ccccc2)c1Cl Chemical compound Clc1ccc(Cl)c(Nc2ccccc2)c1Cl VGDLGHPTSRSQSJ-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- ZWXPDGCFMMFNRW-UHFFFAOYSA-N N-methylcaprolactam Chemical compound CN1CCCCCC1=O ZWXPDGCFMMFNRW-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920003232 aliphatic polyester Polymers 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 229910001508 alkali metal halide Inorganic materials 0.000 description 1
- 150000008045 alkali metal halides Chemical class 0.000 description 1
- 125000002877 alkyl aryl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000005577 anthracene group Chemical group 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 125000006354 carbonyl alkylene group Chemical group 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- QTNDMWXOEPGHBT-UHFFFAOYSA-N dicesium;sulfide Chemical compound [S-2].[Cs+].[Cs+] QTNDMWXOEPGHBT-UHFFFAOYSA-N 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- GLNWILHOFOBOFD-UHFFFAOYSA-N lithium sulfide Chemical compound [Li+].[Li+].[S-2] GLNWILHOFOBOFD-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003541 multi-stage reaction Methods 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 238000005580 one pot reaction Methods 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- DPLVEEXVKBWGHE-UHFFFAOYSA-N potassium sulfide Chemical compound [S-2].[K+].[K+] DPLVEEXVKBWGHE-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- AHKSSQDILPRNLA-UHFFFAOYSA-N rubidium(1+);sulfide Chemical compound [S-2].[Rb+].[Rb+] AHKSSQDILPRNLA-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 125000000475 sulfinyl group Chemical group [*:2]S([*:1])=O 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 229920000247 superabsorbent polymer Polymers 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、ポリアリーレンスルフ
ィド(以下、PASと略すことがある)の製造法に関
し、更に詳しくはエポキシ樹脂や熱可塑性樹脂との接着
性に優れたPASの製造法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing polyarylene sulfide (hereinafter sometimes abbreviated as PAS), and more specifically to a method for producing PAS excellent in adhesiveness with epoxy resin or thermoplastic resin. .
【0002】[0002]
【従来の技術】PASは耐熱性、成形加工性に優れ、更
には良好な耐薬品性、難燃性、寸法安定性等を有するた
め、電気・電子部品あるいは機械部品等に広く使用され
ている。しかし、PASは他の樹脂との接着性、特にエ
ポキシ樹脂との接着性が比較的悪い。そのため、例えば
エポキシ系接着剤によるPAS同士の接合、PASと他
の材料との接合、あるいはエポキシ樹脂による電気・電
子部品の封止等の際に、PASとエポキシ樹脂との接着
性の悪さが問題となっていた。2. Description of the Related Art PAS is widely used for electric / electronic parts or mechanical parts because it has excellent heat resistance and molding processability and further has good chemical resistance, flame retardancy and dimensional stability. . However, PAS has relatively poor adhesiveness with other resins, especially with epoxy resin. Therefore, for example, when the PASs are bonded to each other with an epoxy adhesive, the PASs are bonded to another material, or the electric / electronic components are sealed with an epoxy resin, poor adhesion between the PAS and the epoxy resin is a problem. It was.
【0003】かかる問題に鑑みて、PASとエポキシ樹
脂との接着性を改良する種々の試みがなされている。例
えば、特開平2‐272063号公報にはカルナバワッ
クスを含むポリフェニレンスルフィド(以下、PPSと
略すことがある)樹脂組成物、特開平4‐275368
号公報には繊維状及び/又は非繊維状充填剤とポリアル
キレンエーテル化合物を配合してなるPPS樹脂組成
物、特開平5‐171041号公報には橋かけポリアク
リル酸塩等の高吸水性樹脂を含むPPS樹脂組成物、特
開平6‐57136号公報には芳香族スルホン化合物、
及び繊維状及び/又は非繊維状充填剤を配合してなるP
PS樹脂組成物、特開平6‐107946号公報には脂
肪族ポリエステル、及び繊維状及び/又は非繊維状充填
剤を配合してなるPPS樹脂組成物、また、特開平6‐
166816号公報にはポリ(エチレンシクロヘキサン
ジメチレンテレフタレート)共重合体を配合してなるP
PS樹脂組成物が夫々開示されている。しかし、上記の
いずれにおいても、PPSより耐熱性の低い物質を添加
するため、樹脂組成物の耐熱性が低下し、更には機械的
強度が著しく低下する樹脂組成物もあった。In view of such problems, various attempts have been made to improve the adhesion between PAS and epoxy resin. For example, JP-A-2-272063 discloses a polyphenylene sulfide (hereinafter sometimes abbreviated as PPS) resin composition containing carnauba wax, JP-A-4-275368.
Japanese Patent Laid-Open No. 5-1711041 discloses a PPS resin composition prepared by mixing a fibrous and / or non-fibrous filler with a polyalkylene ether compound, and Japanese Patent Laid-Open No. 5-171041 discloses a super absorbent polymer such as a crosslinked polyacrylate. A PPS resin composition containing, an aromatic sulfone compound in JP-A-6-57136,
And P containing a fibrous and / or non-fibrous filler
PS resin composition, JP-A-6-107946 discloses a PPS resin composition containing an aliphatic polyester, and a fibrous and / or non-fibrous filler, and JP-A-6-107946.
No. 166816 discloses a P containing a poly (ethylenecyclohexanedimethylene terephthalate) copolymer.
Each PS resin composition is disclosed. However, in any of the above, the addition of a substance having a lower heat resistance than PPS has resulted in a decrease in the heat resistance of the resin composition and, in some resin compositions, a marked decrease in the mechanical strength.
【0004】また、特開平4‐198267号公報に
は、カルボキシル基含有PASを含むPAS樹脂組成
物、また特開平5‐25388号公報には、アミノ基含
有PASを含むPAS樹脂組成物が開示されている。し
かし、得られたPASの接着強度は十分なものではなか
った。Further, JP-A-4-198267 discloses a PAS resin composition containing a PAS containing a carboxyl group, and JP-A-5-25388 discloses a PAS resin composition containing a PAS containing an amino group. ing. However, the adhesive strength of the obtained PAS was not sufficient.
【0005】[0005]
【発明が解決しようとする課題】本発明は、従来のPA
Sの持つ高い耐熱性と機械的強度に加えて、エポキシ樹
脂等との接着性にも優れたPASを作ることができ、し
かも溶媒の回収率が高く、水洗浄工程を簡略化できるの
で、生産性高く、かつコスト的に有利に製造する方法を
提供するものである。The present invention is based on the conventional PA.
In addition to the high heat resistance and mechanical strength of S, it is possible to make PAS that has excellent adhesiveness to epoxy resin, etc. Moreover, the recovery rate of the solvent is high, and the water washing process can be simplified. It is intended to provide a method of producing a highly advantageous and cost-effective one.
【0006】[0006]
【課題を解決するための手段】本発明は、有機アミド系
溶媒中でアルカリ金属硫化物とジハロ芳香族化合物とを
反応させてポリアリーレンスルフィドを製造する方法に
おいて、アルカリ金属硫化物に対して0.5〜5.0モ
ル%の官能基含有ハロ置換芳香族化合物を、アルカリ金
属硫化物とジハロ芳香族化合物との反応の前の又は反応
中の反応系内に添加して、反応させることにより得たポ
リアリーレンスルフィドのスラリーを濾過した後、得ら
れた含溶媒濾過ケーキを非酸化性ガス雰囲気下150〜
250℃の温度で加熱して溶媒を除去し、次いで水洗浄
することを特徴とするポリアリーレンスルフィドの製造
法である。The present invention relates to a method for producing a polyarylene sulfide by reacting an alkali metal sulfide with a dihaloaromatic compound in an organic amide solvent, wherein the alkali metal sulfide is 0%. By adding 0.5 to 5.0 mol% of a functional group-containing halo-substituted aromatic compound in the reaction system before or during the reaction of the alkali metal sulfide and the dihalo-aromatic compound, and reacting After filtering the obtained slurry of polyarylene sulfide, the obtained solvent-containing filter cake is heated to 150-150 ° C. under a non-oxidizing gas atmosphere.
A method for producing a polyarylene sulfide, which comprises heating at a temperature of 250 ° C. to remove a solvent and then washing with water.
【0007】該方法において添加する官能基含有ハロ置
換芳香族化合物は、アルカリ金属硫化物に対して、下限
が0.5モル%であり、上限が5.0モル%、好ましく
は3.5モル%である。上記下限未満では接着性が殆ど
改善されない。上記上限を越えては製造したPASの熱
安定性が著しく悪くなり、そのため、成形時にゲル状物
が発生し、成形性が極めて悪くなる。官能基含有ハロ置
換芳香族化合物は、アルカリ金属硫化物とジハロ芳香族
化合物との反応の前の又は反応中のいづれの時点でも反
応系内に添加できる。好ましくは反応の前の反応系内に
添加され、この際、反応系内の温度は、好ましくは12
0〜200℃である。また、該方法では、比較的多量の
官能基含有ハロ置換芳香族化合物が未反応のまま反応系
に残存するため、反応後これを分離回収することが好ま
しい。The functional group-containing halo-substituted aromatic compound added in this method has a lower limit of 0.5 mol% and an upper limit of 5.0 mol%, preferably 3.5 mol, based on the alkali metal sulfide. %. If it is less than the above lower limit, the adhesiveness is hardly improved. When the amount exceeds the above upper limit, the thermal stability of the produced PAS is remarkably deteriorated, so that a gel-like substance is generated during molding and the moldability is extremely deteriorated. The functional group-containing halo-substituted aromatic compound can be added to the reaction system at any time before or during the reaction between the alkali metal sulfide and the dihalo-aromatic compound. It is preferably added to the reaction system before the reaction, and the temperature in the reaction system is preferably 12
It is 0 to 200 ° C. Further, in this method, a relatively large amount of the functional group-containing halo-substituted aromatic compound remains unreacted in the reaction system. Therefore, it is preferable to separate and collect this after the reaction.
【0008】本発明で用いられる官能基含有ハロ置換芳
香族化合物としては、少なくとも一の芳香族環を有し、
芳香族環を形成する炭素原子のうち少なくとも一の炭素
原子及び/又は芳香族環の側鎖を形成する炭素原子の少
なくとも一の炭素原子に官能基を有しており、同時に芳
香族環を形成する炭素原子のうち少なくとも二の炭素原
子にハロゲン原子が結合している芳香族化合物を使用す
ることができる。ここで芳香族環としては、ベンゼン
環、ナフタレン環、アントラセン環等を挙げることがで
きる。これらのうちベンゼン環が好ましい。The functional group-containing halo-substituted aromatic compound used in the present invention has at least one aromatic ring,
It has a functional group on at least one carbon atom among the carbon atoms forming the aromatic ring and / or at least one carbon atom forming the side chain of the aromatic ring, and simultaneously forms an aromatic ring. It is possible to use an aromatic compound in which a halogen atom is bonded to at least two carbon atoms among the carbon atoms to be used. Here, examples of the aromatic ring include a benzene ring, a naphthalene ring, and an anthracene ring. Of these, a benzene ring is preferable.
【0009】官能基含有ハロ置換芳香族化合物が2個以
上の芳香族環を有する場合には、それらの芳香族環は、
直接単結合で結合していてもよく、二価の基を介在して
結合していてもよい。該二価の基としては、例えば酸素
原子、硫黄原子、スルフィニル基、スルホニル基、カル
ボニル基、オキシアルキレン基、カルボニルアルキレン
基、及びポリメチレン基等の二価の炭化水素残基等を挙
げることができる。When the functional group-containing halo-substituted aromatic compound has two or more aromatic rings, those aromatic rings are:
It may be directly bonded by a single bond or may be bonded via a divalent group. Examples of the divalent group include divalent hydrocarbon residues such as oxygen atom, sulfur atom, sulfinyl group, sulfonyl group, carbonyl group, oxyalkylene group, carbonylalkylene group, and polymethylene group. .
【0010】官能基としては、例えば活性水素含有基即
ち‐NH2 、‐SH、‐OH、‐NHR、‐COOH、
‐CONH2 、‐CONHRを挙げることができる。上
記官能基中のRは、アルキル基、シクロアルキル基、ア
リール基、アルカリール基、アリール置換アルキル基を
示す。これらの官能基のうち、‐NH2 、‐COOHが
好ましい。また、ハロゲン原子としては、フッ素、塩
素、臭素、ヨウ素原子が好ましく、塩素原子が特に好ま
しい。Examples of the functional group include active hydrogen-containing groups, ie, --NH 2 , --SH, --OH, --NHR, --COOH,
-CONH 2, mention may be made of a -CONHR. R in the above functional groups represents an alkyl group, a cycloalkyl group, an aryl group, an alkaryl group, or an aryl-substituted alkyl group. Of these functional groups, —NH 2 and —COOH are preferable. As the halogen atom, fluorine, chlorine, bromine and iodine atoms are preferable, and chlorine atom is particularly preferable.
【0011】官能基含有ハロ置換芳香族化合物として
は、特開昭62‐95320号又は特開昭62‐185
717号公報に記載されているものを使用できる。官能
基として‐NH2 を持つ官能基含有ハロ置換芳香族化合
物としては、例えば2,5‐ジクロロアニリン、2,6
‐ジクロロアニリン、2,4‐ジクロロアニリン、2,
3‐ジクロロアニリン、3,5‐ジクロロアニリン、
2,4‐ジブロモアニリン、2,2´‐ジアミノ‐4,
4´‐ジクロロジフェニルエーテル、2,4´‐ジアミ
ノ‐2´,4‐ジクロロジフェニルエーテル、2,2´
‐ジアミノ‐4,4´‐ジクロロジフェニルチオエーテ
ル、2,4´‐ジアミノ‐2´,4‐ジクロロジフェニ
ルチオエーテル、2,2´‐ジアミノ‐4,4´‐ジク
ロロジフェニルスルホキシド、2,4´‐ジアミノ‐2
´,4‐ジクロロジフェニルスルホキシド、2,2´‐
ジアミノ‐4,4´‐ジクロロジフェニルメタン、2,
4´‐ジアミノ‐2´,4‐ジクロロジフェニルメタ
ン、2,5‐ジクロロ‐4´‐アミノジフェニルエーテ
ル、2,5‐ジブロモ‐4´‐アミノジフェニルエーテ
ル、2,5‐ジクロロ‐4´‐アミノジフェニルチオエ
ーテル、2,5‐ジブロモ‐4´‐アミノジフェニルチ
オエーテル、2,5‐ジクロロ‐4´‐アミノジフェニ
ルスルホキシド、2,5‐ジブロモ‐4´‐アミノジフ
ェニルスルホキシド、2,5‐ジクロロ‐4´‐アミノ
ジフェニルメタン、2,5‐ジブロモ‐4´‐アミノジ
フェニルメタン等のジハロ芳香族化合物及び2,3,4
‐トリクロロアニリン、2,3,5‐トリクロロアニリ
ン、2,3,6‐トリクロロアニリン、2,4,5‐ト
リクロロアニリン、2,4,6‐トリクロロアニリン、
3,4,5‐トリクロロアニリン、2,3,4‐トリブ
ロモアニリン、2,3,5‐トリブロモアニリン、2,
3,6‐トリブロモアニリン、2,4,5‐トリブロモ
アニリン、2,4,6‐トリブロモアニリン、3,4,
5‐トリブロモアニリン、2,5‐ジクロロ‐4‐ブロ
モアニリン、2,2´‐ジアミノ‐3,4,4´‐トリ
クロロジフェニルエーテル、2,4´‐ジアミノ‐2
´,5´,4‐トリクロロジフェニルエーテル、2,
4,5‐トリクロロ‐4´‐アミノジフェニルエーテ
ル、2,3,4‐トリクロロ‐4´‐アミノジフェニル
エーテル、2,4,5‐トリブロモ‐4´‐アミノジフ
ェニルエーテル、2,4,6‐トリブロモ‐4´‐アミ
ノジフェニルエーテル、2,5‐ジクロロ‐6‐ブロモ
‐4´‐アミノジフェニルエーテル、2,4,5‐トリ
クロロ‐2´‐アミノジフェニルエーテル、2,2´‐
ジアミノ‐3,4,4´‐トリクロロジフェニルチオエ
ーテル、2,4,5‐トリクロロ‐4´‐アミノチオエ
ーテル、2,2´‐ジアミノ‐4,5,4´‐トリクロ
ロジフェニルスルホキシド、2,4,5‐トリクロロ‐
4´‐アミノジフェニルスルホキシド、2,2´‐ジア
ミノ‐3,4,4´‐トリクロロジフェニルメタン、
2,4,5‐トリクロロ‐4´‐アミノジフェニルメタ
ン、2,4,4´‐トリクロロ‐2´‐アミノジフェニ
ルプロパン、3,4,4´‐トリクロロ‐3´‐アミノ
ビフェニル等のトリハロ芳香族化合物及び2,3,4,
5‐テトラクロロアニリン、2,3,5,6‐テトラク
ロロアニリン、テトラクロロアミノジフェニルエーテ
ル、テトラクロロアミノジフェニルチオエーテル等のポ
リハロ芳香族化合物が挙げられる。官能基として‐CO
OHを持つ官能基含有ハロ置換芳香族化合物としては、
例えば2,6‐ジクロロ安息香酸、2,5‐ジクロロ安
息香酸、2,4‐ジクロロ安息香酸、2,3‐ジクロロ
安息香酸、2,6‐ジブロモ安息香酸、2,5‐ジブロ
モ安息香酸、2,4‐ジブロモ安息香酸、2,3‐ジブ
ロモ安息香酸等のジハロ芳香族化合物及び2,3,4‐
トリクロロ安息香酸、2,3,5‐トリクロロ安息香
酸、2,3,6‐トリクロロ安息香酸、2,4,5‐ト
リクロロ安息香酸、2,4,6‐トリクロロ安息香酸、
3,4,5‐トリクロロ安息香酸、2,3,4‐トリブ
ロモ安息香酸、2,3,5‐トリブロモ安息香酸、2,
3,6‐トリブロモ安息香酸、2,4,5‐トリブロモ
安息香酸、2,4,6‐トリブロモ安息香酸、3,4,
5‐トリブロモ安息香酸等のトリハロ芳香族化合物が挙
げられる。官能基として‐SHを持つ官能基含有ハロ置
換芳香族化合物としては、例えば2,6‐ジクロロチオ
フェノール、2,5‐ジクロロチオフェノール、2,4
‐ジクロロチオフェノール、2,3‐ジクロロチオフェ
ノール、2,2´‐ジメルカプト‐4,4´‐ジクロロ
ジフェニルエーテル、2,4´‐ジメルカプト‐2´,
4‐ジクロロジフェニルエーテル、2,2´‐ジメルカ
プト‐4,4´‐ジクロロジフェニルチオエーテル、
2,4´‐ジメルカプト‐2´,4‐ジクロロジフェニ
ルチオエーテル、2,2´‐ジメルカプト‐4,4´‐
ジクロロジフェニルスルホキシド、2,4´‐ジメルカ
プト‐2´,4‐ジクロロジフェニルスルホキシド、
2,2´‐ジメルカプト‐4,4´‐ジクロロジフェニ
ルメタン、2,4´‐ジメルカプト‐2´,4‐ジクロ
ロジフェニルメタン、2,5‐ジクロロ‐4´‐メルカ
プトジフェニルエーテル、2,5‐ジブロモ‐4´‐メ
ルカプトジフェニルエーテル、2,5‐ジクロロ‐4´
‐メルカプトジフェニルチオエーテル、2,5‐ジブロ
モ‐4´‐メルカプトジフェニルチオエーテル、2,5
‐ジクロロ‐4´‐メルカプトジフェニルスルホキシ
ド、2,5‐ジブロモ‐4´‐メルカプトジフェニルス
ルホキシド、2,5‐ジクロロ‐4´‐メルカプトジフ
ェニルメタン、2,5‐ジブロモ‐4´‐メルカプトジ
フェニルメタン、2,5‐ジブロモ‐4´‐メルカプト
ジフェニルエーテル等のジハロ芳香族化合物及び2,
3,4‐トリクロロチオフェノール、2,3,5‐トリ
クロロチオフェノール、2,3,6‐トリクロロチオフ
ェノール、2,4,5‐トリクロロチオフェノール、
2,4,6‐トリクロロチオフェノール、3,4,5‐
トリクロロチオフェノール、2,3,4‐トリブロモチ
オフェノール、2,3,5‐トリブロモチオフェノー
ル、2,3,6‐トリブロモチオフェノール、2,4,
5‐トリブロモチオフェノール、2,4,6‐トリブロ
モチオフェノール、3,4,5‐トリブロモチオフェノ
ール、2,2´‐ジメルカプト‐3,4,4´‐トリク
ロロジフェニルエーテル、2,4,5‐トリクロロ‐4
´‐メルカプトジフェニルエーテル、2,2´‐ジメル
カプト‐4,5,4´‐トリクロロジフェニルチオエー
テル、2,4,5‐トリクロロ‐4´‐メルカプトジフ
ェニルチオエーテル、2,2´‐ジメルカプト‐3,
5,4´‐トリクロロジフェニルスルホキシド、2,
4,5‐トリクロロ‐4´‐メルカプトジフェニルスル
ホキシド、3,3´‐ジメルカプト‐4,4´,5‐ト
リクロロジフェニルメタン、2,4,5‐トリクロロ‐
4´‐メルカプトジフェニルメタン、3,3´‐ジメル
カプト‐4,4´,5‐トリクロロビフェニル、3,
4,5‐トリクロロ‐4´‐メルカプトビフェニル等の
トリハロ芳香族化合物が挙げられる。官能基として‐O
Hを持つ官能基含有ハロ置換芳香族化合物としては、例
えば2,6‐ジクロロフェノール、2,5‐ジクロロフ
ェノール、2,4‐ジクロロフェノール、2,3‐ジク
ロロフェノール、3,4‐ジクロロフェノール、3,5
‐ジクロロフェノール、2,4‐ジブロモフェノール、
2,6‐ジブロモフェノール、2,2´‐ジヒドロキシ
‐4,4´‐ジクロロジフェニルエーテル、2,4´‐
ジヒドロキシ‐2´,4‐ジクロロジフェニルエーテ
ル、2,2´‐ジヒドロキシ‐4,4´‐ジクロロジフ
ェニルチオエーテル、2,4´‐ジヒドロキシ‐2´,
4‐ジクロロジフェニルチオエーテル、2,2´‐ジヒ
ドロキシ‐4,4´‐ジクロロジフェニルスルホキシ
ド、2,4´‐ジヒドロキシ‐2´,4‐ジクロロジフ
ェニルスルホキシド、2,2´‐ジヒドロキシ‐4,4
´‐ジクロロジフェニルメタン、2,4´‐ジヒドロキ
シ‐2´,4‐ジクロロジフェニルメタン、2,5‐ジ
クロロ‐4´‐ヒドロキシジフェニルエーテル、2,5
‐ジブロモ‐4´‐ヒドロキシジフェニルエーテル、
2,5‐ジクロロ‐4´‐ヒドロキシジフェニルチオエ
ーテル、2,5‐ジブロモ‐4´‐ヒドロキシジフェニ
ルチオエーテル、2,5‐ジクロロ‐4´‐ヒドロキシ
ジフェニルスルホキシド、2,5‐ジブロモ‐4´‐ヒ
ドロキシジフェニルスルホキシド、2,5‐ジクロロ‐
4´‐ヒドロキシジフェニルメタン、2,5‐ジブロモ
‐4´‐ヒドロキシジフェニルメタン、2,5‐ジブロ
モ‐4´‐ヒドロキシジフェニルエーテル等のジハロ芳
香族化合物及び2,3,4‐トリクロロフェノール、
2,3,5‐トリクロロフェノール、2,3,6‐トリ
クロロフェノール、2,4,5‐トリクロロフェノー
ル、2,4,6‐トリクロロフェノール、3,4,5‐
トリクロロフェノール、2,3,4‐トリブロモフェノ
ール、2,3,5‐トリブロモフェノール、2,3,6
‐トリブロモフェノール、2,4,5‐トリブロモフェ
ノール、2,4,6‐トリブロモフェノール、3,4,
5‐トリブロモフェノール、2,2´‐ジヒドロキシ‐
3,4,4´‐トリクロロジフェニルエーテル、2,
4,5‐トリクロロ‐4´‐ヒドロキシジフェニルエー
テル、2,2´‐ジヒドロキシ‐3,4,4´‐トリク
ロロジフェニルチオエーテル、2,4,5‐トリクロロ
‐4´‐ヒドロキシジフェニルチオエーテル、2,2´
‐ジヒドロキシ‐4,4´,5‐トリクロロジフェニル
スルホキシド、2,4,5‐トリクロロ‐4´‐ヒドロ
キシジフェニルスルホキシド、2,2´‐ジヒドロキシ
‐4,4´,5‐トリクロロジフェニルメタン、2,
4,6‐トリクロロ‐4´‐ヒドロキシジフェニルメタ
ン、3‐ヒドロキシ‐3,4,4´‐トリクロロビフェ
ニル、3,4,5‐トリクロロ‐4´‐ヒドロキシビフ
ェニル等のトリハロ芳香族化合物が挙げられる。官能基
として‐NHRを持つ官能基含有ハロ置換芳香族化合物
としては、例えば2,6‐ジクロロ(フェニル)アミノ
ベンゼン、2,5‐ジクロロ(フェニル)アミノベンゼ
ン、2,4‐ジクロロ(フェニル)アミノベンゼン、
2,3‐ジクロロ(フェニル)アミノベンゼン等のジハ
ロ芳香族化合物及び2,3,4‐トリクロロ(フェニル
アミノ)ベンゼン、2,3,5‐トリクロロ(フェニル
アミノ)ベンゼン、2,3,6‐トリクロロ(フェニル
アミノ)ベンゼン、2,4,5‐トリクロロ(フェニル
アミノ)ベンゼン、2,4,6‐トリクロロ(フェニル
アミノ)ベンゼン、3,4,5‐トリクロロ(フェニル
アミノ)ベンゼン、2,3,4‐トリブロモ(フェニル
アミノ)ベンゼン、2,3,5‐トリブロモ(フェニル
アミノ)ベンゼン、2,3,6‐トリブロモ(フェニル
アミノ)ベンゼン、2,4,5‐トリブロモ(フェニル
アミノ)ベンゼン、2,4,6‐トリブロモ(フェニル
アミノ)ベンゼン、3,4,5‐トリブロモ(フェニル
アミノ)ベンゼン等のトリハロ芳香族化合物が挙げられ
る。上記のうち、官能基として‐NH2 を持つ官能基含
有ハロ置換芳香族化合物が好ましく使用され、特にジク
ロロアニリンが好ましい。As the halo-substituted aromatic compound containing a functional group, JP-A-62-95320 or JP-A-62-185 is known.
The one described in Japanese Patent No. 717 can be used. Examples of the functional group-containing halo-substituted aromatic compound having -NH 2 as a functional group include 2,5-dichloroaniline and 2,6
-Dichloroaniline, 2,4-dichloroaniline, 2,
3-dichloroaniline, 3,5-dichloroaniline,
2,4-dibromoaniline, 2,2'-diamino-4,
4'-dichlorodiphenyl ether, 2,4'-diamino-2 ', 4-dichlorodiphenyl ether, 2,2'
-Diamino-4,4'-dichlorodiphenyl thioether, 2,4'-diamino-2 ', 4-dichlorodiphenyl thioether, 2,2'-diamino-4,4'-dichlorodiphenyl sulfoxide, 2,4'-diamino -2
′, 4-Dichlorodiphenyl sulfoxide, 2,2′-
Diamino-4,4'-dichlorodiphenylmethane, 2,
4'-diamino-2 ', 4-dichlorodiphenylmethane, 2,5-dichloro-4'-aminodiphenyl ether, 2,5-dibromo-4'-aminodiphenyl ether, 2,5-dichloro-4'-aminodiphenylthioether, 2,5-dibromo-4'-aminodiphenyl thioether, 2,5-dichloro-4'-aminodiphenyl sulfoxide, 2,5-dibromo-4'-aminodiphenyl sulfoxide, 2,5-dichloro-4'-aminodiphenylmethane Aromatic compounds such as 2,5-dibromo-4'-aminodiphenylmethane and 2,3,4
-Trichloroaniline, 2,3,5-trichloroaniline, 2,3,6-trichloroaniline, 2,4,5-trichloroaniline, 2,4,6-trichloroaniline,
3,4,5-trichloroaniline, 2,3,4-tribromoaniline, 2,3,5-tribromoaniline, 2,
3,6-tribromoaniline, 2,4,5-tribromoaniline, 2,4,6-tribromoaniline, 3,4
5-tribromoaniline, 2,5-dichloro-4-bromoaniline, 2,2'-diamino-3,4,4'-trichlorodiphenyl ether, 2,4'-diamino-2
′, 5 ′, 4-trichlorodiphenyl ether, 2,
4,5-Trichloro-4'-aminodiphenyl ether, 2,3,4-trichloro-4'-aminodiphenyl ether, 2,4,5-tribromo-4'-aminodiphenyl ether, 2,4,6-tribromo-4 ' -Aminodiphenyl ether, 2,5-dichloro-6-bromo-4'-aminodiphenyl ether, 2,4,5-trichloro-2'-aminodiphenyl ether, 2,2'-
Diamino-3,4,4'-trichlorodiphenylthioether, 2,4,5-trichloro-4'-aminothioether, 2,2'-diamino-4,5,4'-trichlorodiphenyl sulfoxide, 2,4,5 -Trichloro-
4'-aminodiphenyl sulfoxide, 2,2'-diamino-3,4,4'-trichlorodiphenylmethane,
Trihaloaromatic compounds such as 2,4,5-trichloro-4'-aminodiphenylmethane, 2,4,4'-trichloro-2'-aminodiphenylpropane and 3,4,4'-trichloro-3'-aminobiphenyl And 2, 3, 4,
Examples thereof include polyhaloaromatic compounds such as 5-tetrachloroaniline, 2,3,5,6-tetrachloroaniline, tetrachloroaminodiphenyl ether and tetrachloroaminodiphenylthioether. -CO as a functional group
As the halo-substituted aromatic compound having a functional group having OH,
For example, 2,6-dichlorobenzoic acid, 2,5-dichlorobenzoic acid, 2,4-dichlorobenzoic acid, 2,3-dichlorobenzoic acid, 2,6-dibromobenzoic acid, 2,5-dibromobenzoic acid, 2 Aromatic compounds such as 2,4-dibromobenzoic acid and 2,3-dibromobenzoic acid, and 2,3,4-
Trichlorobenzoic acid, 2,3,5-trichlorobenzoic acid, 2,3,6-trichlorobenzoic acid, 2,4,5-trichlorobenzoic acid, 2,4,6-trichlorobenzoic acid,
3,4,5-Trichlorobenzoic acid, 2,3,4-Tribromobenzoic acid, 2,3,5-Tribromobenzoic acid, 2,
3,6-tribromobenzoic acid, 2,4,5-tribromobenzoic acid, 2,4,6-tribromobenzoic acid, 3,4
Trihaloaromatic compounds such as 5-tribromobenzoic acid may be mentioned. Examples of the functional group-containing halo-substituted aromatic compound having -SH as a functional group include 2,6-dichlorothiophenol, 2,5-dichlorothiophenol, 2,4
-Dichlorothiophenol, 2,3-dichlorothiophenol, 2,2'-dimercapto-4,4'-dichlorodiphenyl ether, 2,4'-dimercapto-2 ',
4-dichlorodiphenyl ether, 2,2'-dimercapto-4,4'-dichlorodiphenyl thioether,
2,4'-dimercapto-2 ', 4-dichlorodiphenylthioether, 2,2'-dimercapto-4,4'-
Dichlorodiphenyl sulfoxide, 2,4'-dimercapto-2 ', 4-dichlorodiphenyl sulfoxide,
2,2'-dimercapto-4,4'-dichlorodiphenylmethane, 2,4'-dimercapto-2 ', 4-dichlorodiphenylmethane, 2,5-dichloro-4'-mercaptodiphenyl ether, 2,5-dibromo-4' -Mercaptodiphenyl ether, 2,5-dichloro-4 '
-Mercaptodiphenyl thioether, 2,5-dibromo-4'-mercaptodiphenyl thioether, 2,5
-Dichloro-4'-mercaptodiphenyl sulfoxide, 2,5-dibromo-4'-mercaptodiphenyl sulfoxide, 2,5-dichloro-4'-mercaptodiphenylmethane, 2,5-dibromo-4'-mercaptodiphenylmethane, 2,5 Dihalo aromatic compounds such as -dibromo-4'-mercaptodiphenyl ether and 2,
3,4-trichlorothiophenol, 2,3,5-trichlorothiophenol, 2,3,6-trichlorothiophenol, 2,4,5-trichlorothiophenol,
2,4,6-Trichlorothiophenol, 3,4,5-
Trichlorothiophenol, 2,3,4-tribromothiophenol, 2,3,5-tribromothiophenol, 2,3,6-tribromothiophenol, 2,4
5-tribromothiophenol, 2,4,6-tribromothiophenol, 3,4,5-tribromothiophenol, 2,2'-dimercapto-3,4,4'-trichlorodiphenyl ether, 2,4 5-trichloro-4
′ -Mercaptodiphenyl ether, 2,2′-dimercapto-4,5,4′-trichlorodiphenylthioether, 2,4,5-trichloro-4′-mercaptodiphenylthioether, 2,2′-dimercapto-3
5,4'-trichlorodiphenyl sulfoxide, 2,
4,5-Trichloro-4'-mercaptodiphenyl sulfoxide, 3,3'-dimercapto-4,4 ', 5-trichlorodiphenylmethane, 2,4,5-trichloro-
4'-mercaptodiphenylmethane, 3,3'-dimercapto-4,4 ', 5-trichlorobiphenyl, 3,
Examples include trihaloaromatic compounds such as 4,5-trichloro-4'-mercaptobiphenyl. -O as a functional group
Examples of the functional group-containing halo-substituted aromatic compound having H include 2,6-dichlorophenol, 2,5-dichlorophenol, 2,4-dichlorophenol, 2,3-dichlorophenol, 3,4-dichlorophenol, 3,5
-Dichlorophenol, 2,4-dibromophenol,
2,6-dibromophenol, 2,2'-dihydroxy-4,4'-dichlorodiphenyl ether, 2,4'-
Dihydroxy-2 ', 4-dichlorodiphenyl ether, 2,2'-dihydroxy-4,4'-dichlorodiphenyl thioether, 2,4'-dihydroxy-2',
4-dichlorodiphenyl thioether, 2,2'-dihydroxy-4,4'-dichlorodiphenyl sulfoxide, 2,4'-dihydroxy-2 ', 4-dichlorodiphenyl sulfoxide, 2,2'-dihydroxy-4,4
′ -Dichlorodiphenylmethane, 2,4′-dihydroxy-2 ′, 4-dichlorodiphenylmethane, 2,5-dichloro-4′-hydroxydiphenyl ether, 2,5
-Dibromo-4'-hydroxydiphenyl ether,
2,5-dichloro-4'-hydroxydiphenyl thioether, 2,5-dibromo-4'-hydroxydiphenyl thioether, 2,5-dichloro-4'-hydroxydiphenyl sulfoxide, 2,5-dibromo-4'-hydroxydiphenyl Sulfoxide, 2,5-dichloro-
Dihalo aromatic compounds such as 4'-hydroxydiphenylmethane, 2,5-dibromo-4'-hydroxydiphenylmethane, 2,5-dibromo-4'-hydroxydiphenyl ether and 2,3,4-trichlorophenol,
2,3,5-trichlorophenol, 2,3,6-trichlorophenol, 2,4,5-trichlorophenol, 2,4,6-trichlorophenol, 3,4,5-
Trichlorophenol, 2,3,4-tribromophenol, 2,3,5-tribromophenol, 2,3,6
-Tribromophenol, 2,4,5-tribromophenol, 2,4,6-tribromophenol, 3,4
5-tribromophenol, 2,2'-dihydroxy-
3,4,4'-trichlorodiphenyl ether, 2,
4,5-Trichloro-4'-hydroxydiphenyl ether, 2,2'-dihydroxy-3,4,4'-trichlorodiphenylthioether, 2,4,5-trichloro-4'-hydroxydiphenylthioether, 2,2 '
-Dihydroxy-4,4 ', 5-trichlorodiphenyl sulfoxide, 2,4,5-trichloro-4'-hydroxydiphenyl sulfoxide, 2,2'-dihydroxy-4,4', 5-trichlorodiphenylmethane, 2,
Trihalo aromatic compounds such as 4,6-trichloro-4'-hydroxydiphenylmethane, 3-hydroxy-3,4,4'-trichlorobiphenyl, and 3,4,5-trichloro-4'-hydroxybiphenyl can be mentioned. Examples of the functional group-containing halo-substituted aromatic compound having -NHR as a functional group include 2,6-dichloro (phenyl) aminobenzene, 2,5-dichloro (phenyl) aminobenzene, and 2,4-dichloro (phenyl) amino. benzene,
Dihaloaromatic compounds such as 2,3-dichloro (phenyl) aminobenzene and 2,3,4-trichloro (phenylamino) benzene, 2,3,5-trichloro (phenylamino) benzene, 2,3,6-trichloro (Phenylamino) benzene, 2,4,5-trichloro (phenylamino) benzene, 2,4,6-trichloro (phenylamino) benzene, 3,4,5-trichloro (phenylamino) benzene, 2,3,4 -Tribromo (phenylamino) benzene, 2,3,5-tribromo (phenylamino) benzene, 2,3,6-tribromo (phenylamino) benzene, 2,4,5-tribromo (phenylamino) benzene, 2,4 , 6-Tribromo (phenylamino) benzene, 3,4,5-Tribromo (phenylamino) benzene Include trihalo aromatic compounds. Among the above, a functional group-containing halo-substituted aromatic compound having —NH 2 as a functional group is preferably used, and dichloroaniline is particularly preferable.
【0012】本発明において使用する有機アミド系溶媒
は、PAS重合のために知られており、たとえばN‐メ
チルピロリドン(NMP)、N,N‐ジメチルホルムア
ミド、N,N‐ジメチルアセトアミド、N‐メチルカプ
ロラクタム等、及びこれらの混合物を使用でき、NMP
が好ましい。これらは全て、水よりも低い蒸気圧を持
つ。The organic amide solvents used in the present invention are known for PAS polymerization, such as N-methylpyrrolidone (NMP), N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl Caprolactam, etc., and mixtures thereof can be used, NMP
Is preferred. They all have a lower vapor pressure than water.
【0013】アルカリ金属硫化物も公知であり、たとえ
ば、硫化リチウム、硫化ナトリウム、硫化カリウム、硫
化ルビジウム、硫化セシウム及びこれらの混合物であ
る。これらの水和物及び水溶液であっても良い。又、こ
れらにそれぞれ対応する水硫化物及び水和物を、それぞ
れに対応する水酸化物で中和して用いることができる。
安価な硫化ナトリウムが好ましい。Alkali metal sulphides are also known, for example lithium sulphide, sodium sulphide, potassium sulphide, rubidium sulphide, cesium sulphide and mixtures thereof. These hydrates and aqueous solutions may be used. Further, hydrosulfides and hydrates corresponding to these can be used after being neutralized with the corresponding hydroxides.
Inexpensive sodium sulfide is preferred.
【0014】ジハロ芳香族化合物は、たとえば特公昭4
5‐3368号公報記載のものから選ぶことができる
が、好ましくはp‐ジクロロベンゼンである。又、少量
(20モル%以下)のジフェニルエーテル、ジフェニル
スルホン又はビフェニルのパラ、メタ又はオルトジハロ
物を1種類以上用いて共重合体を得ることができる。例
えば、m‐ジクロロベンゼン、o‐ジクロロベンゼン、
p,p´‐ジクロロジフェニルエーテル、m,p´‐ジ
クロロジフェニルエーテル、m,m´‐ジクロロジフェ
ニルエーテル、p,p´‐ジクロロジフェニルスルホ
ン、m,p´‐ジクロロジフェニルスルホン、m,m´
‐ジクロロジフェニルスルホン、p,p´‐ジクロロビ
フェニル、m,p´‐ジクロロビフェニル、m,m´‐
ジクロロビフェニルである。The dihalo aromatic compound is, for example, Japanese Patent Publication No.
It can be selected from those described in JP-A-5-3368, but is preferably p-dichlorobenzene. Further, a copolymer can be obtained by using a small amount (20 mol% or less) of one or more kinds of para, meta or orthodihalo compounds of diphenyl ether, diphenyl sulfone or biphenyl. For example, m-dichlorobenzene, o-dichlorobenzene,
p, p'-dichlorodiphenyl ether, m, p'-dichlorodiphenyl ether, m, m'-dichlorodiphenyl ether, p, p'-dichlorodiphenyl sulfone, m, p'-dichlorodiphenyl sulfone, m, m '
-Dichlorodiphenyl sulfone, p, p'-dichlorobiphenyl, m, p'-dichlorobiphenyl, m, m'-
It is dichlorobiphenyl.
【0015】有機アミド溶媒中でのアルカリ金属硫化物
とジハロ芳香族化合物との反応自体は、公知の通りに行
うことができる。該反応中に、反応缶の気相部分を冷却
することにより反応缶内の気相の一部を凝縮させ、これ
を液相に還流せしめることが好ましい。これにより、生
成したPASの解重合を回避できると共に、一層高分子
量のPASを製造することが可能となる。The reaction itself between the alkali metal sulfide and the dihaloaromatic compound in the organic amide solvent can be carried out in a known manner. During the reaction, it is preferable to cool a gas phase portion of the reaction can to condense a part of the gas phase in the reaction can and to reflux this to a liquid phase. This makes it possible to avoid depolymerization of the produced PAS and to produce a higher molecular weight PAS.
【0016】反応缶の気相部分を冷却することにより反
応缶内の気相の一部を凝縮させ、これを液相に還流せし
める方法としては、特開平5‐222196号公報に記
載の方法を使用することができる。As a method of condensing a part of the gas phase in the reaction can by cooling the gas phase part of the reaction can and returning it to the liquid phase, the method described in JP-A-5-222196 is disclosed. Can be used.
【0017】還流される液体は、水とアミド系溶媒の蒸
気圧差の故に、液相バルクに比較して水含有率が高い。
この水含有率の高い還流液は、反応溶液上部に水含有率
の高い層を形成する。その結果、残存のアルカリ金属硫
化物(例えばNa2 S)、ハロゲン化アルカリ金属(例
えばNaCl)、オリゴマー等が、その層に多く含有さ
れるようになる。従来法においては230℃以上の高温
下で、生成したPASとNa2 S等の原料及び副生成物
とが均一に混じりあった状態では、高分子量のPASが
得られないばかりでなく、せっかく生成したPASの解
重合も生じ、チオフェノールの副生成が認められる。し
かし、本発明では、反応缶の気相部分を積極的に冷却し
て、水分に富む還流液を多量に液相上部に戻してやるこ
とによって上記の不都合な現象が回避でき、反応を阻害
するような因子を真に効率良く除外でき、高分子量PA
Sを得ることができるものと思われる。但し、本発明は
上記現象による効果のみにより限定されるものではな
く、気相部分を冷却することによって生じる種々の影響
によって、高分子量のPASが得られるのである。The refluxed liquid has a high water content compared to the liquid phase bulk because of the difference in vapor pressure between water and the amide solvent.
This reflux liquid having a high water content forms a layer having a high water content on the reaction solution. As a result, the residual alkali metal sulfide (for example, Na 2 S), alkali metal halide (for example, NaCl), oligomer and the like are contained in a large amount in the layer. In the conventional method, at a high temperature of 230 ° C. or higher, when the generated PAS and the raw materials such as Na 2 S and by-products are uniformly mixed, not only high-molecular-weight PAS cannot be obtained but Depolymerization of PAS also occurred, and thiophenol by-product was observed. However, in the present invention, by positively cooling the gas phase portion of the reaction vessel and returning a large amount of water-rich reflux liquid to the upper portion of the liquid phase, the above-mentioned inconvenient phenomenon can be avoided and the reaction is inhibited. Of high molecular weight PA
It seems that S can be obtained. However, the present invention is not limited only to the effects due to the above-mentioned phenomenon, and high-molecular weight PAS can be obtained by various influences caused by cooling the gas phase portion.
【0018】本発明においては、従来法のように反応の
途中で水を添加することを要しない。しかし、水を添加
することを全く排除するものではない。但し、水を添加
する操作を行えば、本発明の利点のいくつかは失われ
る。従って、好ましくは、重合反応系内の全水分量は反
応の間中一定である。In the present invention, it is not necessary to add water during the reaction unlike the conventional method. However, the addition of water is not excluded at all. However, some of the advantages of the present invention are lost if the operation of adding water is performed. Therefore, preferably, the total water content in the polymerization reaction system is constant throughout the reaction.
【0019】反応缶の気相部分の冷却は、外部冷却でも
内部冷却でも可能であり、自体公知の冷却手段により行
える。たとえば、反応缶内の上部に設置した内部コイル
に冷媒体を流す方法、反応缶外部の上部に巻きつけた外
部コイルまたはジャケットに冷媒体を流す方法、反応缶
上部に設置したリフラックスコンデンサーを用いる方
法、反応缶外部の上部に水をかける又は気体(空気、窒
素等)を吹き付ける等の方法が考えられるが、結果的に
缶内の還流量を増大させる効果があるものならば、いず
れの方法を用いても良い。外気温度が比較的低いなら
(たとえば常温)、反応缶上部に従来備えられている保
温材を取外すことによって、適切な冷却を行うことも可
能である。外部冷却の場合、反応缶壁面で凝縮した水/
アミド系溶媒混合物は反応缶壁を伝わって液相中に入
る。従って、該水分に富む混合物は、液相上部に溜り、
そこの水分量を比較的高く保つ。内部冷却の場合には、
冷却面で凝縮した混合物が同様に冷却装置表面又は反応
缶壁を伝わって液相中に入る。The gas phase portion of the reaction can can be cooled by external cooling or internal cooling, and can be performed by a cooling means known per se. For example, a method of flowing a cooling medium into an internal coil installed in the upper part of the reaction can, a method of flowing a cooling medium into an external coil or jacket wound around the upper part of the outside of the reaction can, and a reflux condenser installed in the upper part of the reaction can are used. The method may be such as sprinkling water or blowing gas (air, nitrogen, etc.) on the upper part of the outside of the reaction can. Any method is effective as long as it has the effect of increasing the reflux amount in the can. May be used. If the outside air temperature is relatively low (for example, room temperature), it is also possible to perform appropriate cooling by removing the heat insulating material conventionally provided on the upper part of the reaction can. In the case of external cooling, water condensed on the reactor wall surface
The amide-based solvent mixture enters the liquid phase along the wall of the reaction vessel. Thus, the water-rich mixture pools on top of the liquid phase,
Keep the water content there relatively high. For internal cooling,
The mixture condensed on the cooling surface likewise travels along the surface of the cooling device or the wall of the reaction vessel into the liquid phase.
【0020】一方、液相バルクの温度は、所定の一定温
度に保たれ、あるいは所定の温度プロフィールに従って
コントロールされる。一定温度とする場合、 230〜275
℃の温度で 0.1〜20時間反応を行うことが好ましい。よ
り好ましくは、 240〜265 ℃の温度で1〜6時間であ
る。より高い分子量のPASを得るには、2段階以上の
反応温度プロフィールを用いることが好ましい。この2
段階操作を行う場合、第1段階は 195〜240 ℃の温度で
行うことが好ましい。温度が低いと反応速度が小さす
ぎ、実用的ではない。 240℃より高いと反応速度が速す
ぎて、十分に高分子量なPASが得られないのみなら
ず、副反応速度が著しく増大する。第1段階の終了は、
重合反応系内ジハロ芳香族化合物残存率が1モル%〜40
モル%、且つ分子量が 3,000〜20,000の範囲内の時点で
行うことが好ましい。より好ましくは、重合反応系内ジ
ハロ芳香族化合物残存率が2モル%〜15モル%、且つ分
子量が 5,000〜15,000の範囲である。残存率が40モル%
を越えると、第2段階の反応で解重合など副反応が生じ
やすく、一方、1モル%未満では、最終的に高分子量P
ASを得難い。その後昇温して、最終段階の反応は、反
応温度 240〜270 ℃の範囲で、1時間〜10時間行うこと
が好ましい。温度が低いと十分に高分子量化したPAS
を得ることができず、また 270℃より高い温度では解重
合等の副反応が生じやすくなり、安定的に高分子量物を
得難くなる。On the other hand, the temperature of the liquid phase bulk is maintained at a predetermined constant temperature or controlled according to a predetermined temperature profile. 230 to 275 for constant temperature
It is preferable to carry out the reaction at a temperature of ° C for 0.1 to 20 hours. More preferably, the temperature is 240 to 265 ° C. and the time is 1 to 6 hours. To obtain higher molecular weight PAS, it is preferable to use a reaction temperature profile of two or more steps. This 2
When carrying out the stepwise operation, the first step is preferably carried out at a temperature of 195 to 240 ° C. If the temperature is low, the reaction rate is too slow, which is not practical. If the temperature is higher than 240 ° C., the reaction rate is too fast, PAS having a sufficiently high molecular weight cannot be obtained, and the side reaction rate remarkably increases. The end of the first stage is
Dihalo aromatic compound residual rate in the polymerization reaction system is 1 mol% to 40
It is preferable to carry out at a time of mol% and a molecular weight in the range of 3,000 to 20,000. More preferably, the residual ratio of the dihalo-aromatic compound in the polymerization reaction system is 2 mol% to 15 mol% and the molecular weight is 5,000 to 15,000. Residual rate is 40 mol%
When it is more than 1, the side reaction such as depolymerization is likely to occur in the second step reaction, while when it is less than 1 mol%, the high molecular weight P is finally obtained.
It is difficult to get AS. Thereafter, the temperature is raised, and the reaction in the final stage is preferably carried out at a reaction temperature of 240 to 270 ° C. for 1 to 10 hours. PAS with sufficiently high molecular weight at low temperature
At a temperature higher than 270 ° C., side reactions such as depolymerization are likely to occur, making it difficult to stably obtain a high molecular weight product.
【0021】実際の操作としては、先ず不活性ガス雰囲
気下で、アミド系溶媒中のアルカリ金属硫化物中の水分
量が所定の量となるよう、必要に応じて脱水または水添
加する。水分量は、好ましくは、アルカリ金属硫化物1
モル当り0.5〜2.5モル、特に0.8〜1.2モル
とする。2.5モルを超えては、反応速度が小さくな
り、しかも反応終了後の濾液中にフェノール等の副生成
物量が増大し、重合度も上がらない。0.5モル未満で
は、反応速度が速すぎ、十分な高分子量の物を得ること
ができないと共に、副反応等の好ましくない反応が生ず
る。As a practical operation, first, dehydration or water addition is carried out in an inert gas atmosphere, if necessary, so that the amount of water in the alkali metal sulfide in the amide solvent becomes a predetermined amount. The water content is preferably alkali metal sulfide 1
The amount is 0.5 to 2.5 mol, especially 0.8 to 1.2 mol per mol. If it exceeds 2.5 mols, the reaction rate will be low, and the amount of by-products such as phenol will increase in the filtrate after the reaction and the degree of polymerization will not increase. If it is less than 0.5 mol, the reaction rate is too fast to obtain a sufficiently high molecular weight product, and unfavorable reactions such as side reactions occur.
【0022】反応時の気相部分の冷却は、一定温度での
1段反応の場合では、反応開始時から行うことが望まし
いが、少なくとも 250℃以下の昇温途中から行わなけれ
ばならない。多段階反応では、第1段階の反応から冷却
を行うことが望ましいが、遅くとも第1段階反応の終了
後の昇温途中から行うことが好ましい。冷却効果の度合
いは、通常反応缶内圧力が最も適した指標である。圧力
の絶対値については、反応缶の特性、攪拌状態、系内水
分量、ジハロ芳香族化合物とアルカリ金属硫化物とのモ
ル比等によって異なる。しかし、同一反応条件下で冷却
しない場合に比べて、反応缶圧力が低下すれば、還流液
量が増加して、反応溶液気液界面における温度が低下し
ていることを意味しており、その相対的な低下の度合い
が水分含有量の多い層と、そうでない層との分離の度合
いを示していると考えられる。そこで、冷却は反応缶内
圧が、冷却をしない場合と比較して低くなる程度に行う
のが好ましい。冷却の程度は、都度の使用する装置、運
転条件などに応じて、当業者が適宜設定できる。In the case of the one-step reaction at a constant temperature, the cooling of the gas phase portion during the reaction is preferably performed from the start of the reaction, but it must be performed at least during the temperature increase of 250 ° C. or less. In the multi-stage reaction, it is preferable to perform cooling from the first-stage reaction, but it is preferable to perform cooling at the latest after the completion of the first-stage reaction. Regarding the degree of cooling effect, the pressure inside the reaction vessel is usually the most suitable index. The absolute value of the pressure varies depending on the characteristics of the reaction vessel, the stirring state, the water content in the system, the molar ratio of the dihalo aromatic compound to the alkali metal sulfide, and the like. However, as compared with the case of not cooling under the same reaction conditions, if the reactor pressure is decreased, the amount of reflux liquid is increased, which means that the temperature at the reaction solution gas-liquid interface is decreased. It is considered that the degree of relative decrease indicates the degree of separation between the layer having a high water content and the layer having no water content. Therefore, it is preferable to cool the reactor so that the internal pressure of the reactor becomes lower than that in the case where no cooling is performed. The degree of cooling can be appropriately set by those skilled in the art according to the equipment used, operating conditions, and the like.
【0023】上記の反応条件を種々選択することによ
り、所望の粘度を持つPASを製造することができる。PAS having a desired viscosity can be produced by variously selecting the above reaction conditions.
【0024】PASの分子量をより大きくするために、
例えば1,3,5‐トリクロロベンゼン、1,2,4‐
トリクロロベンゼン等のポリハロ化合物を、パラ及びメ
タジハロ芳香族化合物の合計量に対して好ましくは5モ
ル%以下の濃度で使用することもできる。In order to increase the molecular weight of PAS,
For example, 1,3,5-trichlorobenzene, 1,2,4-
A polyhalo compound such as trichlorobenzene can also be used in a concentration of preferably 5 mol% or less based on the total amount of para and metadihalo aromatic compounds.
【0025】また、他の少量添加物として、末端停止
剤、修飾剤としてのモノハロ化物を併用することもでき
る。Further, as a small amount of other additives, a terminal terminating agent and a monohalo compound as a modifying agent can be used in combination.
【0026】本発明においては、上記工程で得られたP
ASスラリーを濾過した後、得られた含溶媒濾過ケーキ
を非酸化性ガス雰囲気下150〜250℃の温度で加熱
して溶媒を除去し、次いで水洗浄を施す。In the present invention, P obtained in the above process
After filtering the AS slurry, the solvent-containing filter cake obtained is heated at a temperature of 150 to 250 ° C. in a non-oxidizing gas atmosphere to remove the solvent, and then washed with water.
【0027】例えば、上記のようにして得られたPAS
スラリーを濾過し、溶媒を含むPASケーキを得る。次
いで、該PASケーキは、ヘリウム、アルゴン、水素、
窒素等の非酸化性ガス気流中、好ましくは酸素濃度5.
0体積%未満の窒素ガス気流中、150〜250℃、好
ましくは180〜230℃の温度で、好ましくは0.5
〜20時間、特に好ましくは1〜10時間加熱される。
該加熱は、好ましくは常圧〜3気圧、特に好ましくは常
圧下で行われる。該加熱温度が上記下限未満では、溶媒
の除去に長時間を必要とし、生産性の低下が生じる。上
記上限を越えては、PASの着色が著しくなり好ましく
ない。上記の加熱による溶媒除去を行うことにより、P
ASの接着強度を高めることができると共に、従来の水
洗浄により溶媒を除去する方法に比べて、水洗浄等の工
程を簡略化でき、かつ溶媒の回収率を著しく向上せしめ
ることができるため、生産性が高くコスト的に有利であ
る。For example, the PAS obtained as described above
The slurry is filtered to give a PAS cake with solvent. The PAS cake is then helium, argon, hydrogen,
An oxygen concentration in a non-oxidizing gas stream such as nitrogen is preferably 5.
In a nitrogen gas stream of less than 0% by volume, at a temperature of 150 to 250 ° C, preferably 180 to 230 ° C, preferably 0.5.
It is heated for -20 hours, particularly preferably for 1-10 hours.
The heating is preferably carried out under normal pressure to 3 atm, particularly preferably under normal pressure. If the heating temperature is less than the above lower limit, it takes a long time to remove the solvent, resulting in a decrease in productivity. If the upper limit is exceeded, the PAS is markedly colored, which is not preferable. By removing the solvent by heating as described above, P
Since the adhesive strength of AS can be increased, the steps such as water washing can be simplified and the recovery rate of the solvent can be remarkably improved as compared with the conventional method of removing the solvent by water washing. It is highly cost effective.
【0028】水洗浄は、好ましくは上記加熱後の濾過ケ
ーキを水に分散させることにより行われる。例えば、上
記のようにして得られた加熱後のPASケーキを、重量
で好ましくは1〜5倍の水中に投入して、好ましくは常
温〜90℃で、好ましくは5分間〜10時間攪拌混合し
た後、濾過する。該攪拌混合及び濾過操作を好ましくは
2〜10回繰り返すことにより、PASに付着した溶媒
及び副生塩の除去を行って水洗浄を終了する。上記のよ
うにして水洗浄を行うことにより、フィルターケーキに
水を注ぐ洗浄方法に比べて少ない水量で効率的な洗浄が
可能となる。Washing with water is preferably carried out by dispersing the above-mentioned heated filter cake in water. For example, the heated PAS cake obtained as described above is put into water, preferably 1 to 5 times by weight, and stirred and mixed at room temperature to 90 ° C. for preferably 5 minutes to 10 hours. After that, it is filtered. By repeating the stirring and mixing and filtering operations preferably 2 to 10 times, the solvent adhering to the PAS and the by-product salt are removed, and the washing with water is completed. By performing water washing as described above, it becomes possible to perform efficient washing with a small amount of water as compared with the washing method in which water is poured into the filter cake.
【0029】本発明の方法により製造されたPASは、
急激な結晶化が進行しないので、成形収縮等によるクラ
ック発生等を抑制することができ、エポキシ樹脂や熱可
塑性樹脂と高い接着性を有する。従って、電気・電子部
品の封止等の分野において有用である。The PAS produced by the method of the present invention is
Since rapid crystallization does not proceed, it is possible to suppress the occurrence of cracks due to molding shrinkage and the like, and it has high adhesiveness with epoxy resins and thermoplastic resins. Therefore, it is useful in the field of sealing electric / electronic parts.
【0030】本発明のPASを成形加工する際には、慣
用の添加剤、例えばカーボンブラック、炭酸カルシウ
ム、シリカ、酸化チタン等の粉末状充填剤、又は炭素繊
維、ガラス繊維、アスベスト繊維、ポリアラミド繊維等
の繊維状充填剤を混入することができる。When the PAS of the present invention is molded and processed, conventional additives such as powdered fillers such as carbon black, calcium carbonate, silica and titanium oxide, or carbon fibers, glass fibers, asbestos fibers, polyaramid fibers are used. Fibrous fillers such as can be mixed.
【0031】以下、本発明を実施例により更に詳細に説
明するが、本発明はこれら実施例により限定されるもの
ではない。Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples.
【0032】[0032]
【実施例】実施例において、溶融粘度V6 は、島津製作
所製フローテスターCFT‐500Cを用いて300
℃、荷重20kgf/cm2 、L/D=10で6分間保
持した後に測定した粘度(ポイズ)である。EXAMPLES In the examples, the melt viscosity V 6 was 300 using a flow tester CFT-500C manufactured by Shimadzu Corporation.
It is a viscosity (poise) measured after holding for 6 minutes at L / D = 10 at a temperature of 20 kgf / cm 2 and a load of 20 kgf / cm 2 .
【0033】DSCにより、結晶化温度Tc を測定し
た。装置としては、セイコー電子製示差走査熱量計SS
C/5200を用い、以下のようにして測定した。試料
10mgを窒素気流中、昇温速度20℃/分で室温から
320℃まで昇温した後、320℃で5分間保持して溶
融した。次いで10℃/分の速度で冷却した。このとき
の発熱ピーク温度を結晶化温度Tc とした。The crystallization temperature T c was measured by DSC. The device is a differential scanning calorimeter SS manufactured by Seiko Denshi.
It measured using C / 5200 as follows. 10 mg of the sample was heated from room temperature to 320 ° C. at a heating rate of 20 ° C./min in a nitrogen stream, and then held at 320 ° C. for 5 minutes to melt. It was then cooled at a rate of 10 ° C / min. The exothermic peak temperature at this time was defined as the crystallization temperature Tc .
【0034】パラジクロルベンゼン(以下ではp‐DC
Bと略すことがある)及び2,5‐ジクロロアニリン
(以下ではDCAと略すことがある)の反応率は、ガス
クロマトグラフィーによる測定結果から算出した。ここ
で、各反応率は下記式により求めた。Paradichlorobenzene (hereinafter p-DC
The reaction rates of B) and 2,5-dichloroaniline (hereinafter sometimes abbreviated as DCA) were calculated from the measurement results by gas chromatography. Here, each reaction rate was calculated by the following formula.
【0035】[0035]
【数1】p‐DCBの反応率(%)=(1−残存p‐D
CB重量/仕込p‐DCB重量)×100## EQU1 ## Reaction rate (%) of p-DCB = (1-remaining p-D
CB weight / p-DCB weight) × 100
【0036】[0036]
【数2】DCAの反応率(%)=(1−残存DCA重量
/仕込DCA重量)×100 接着強度の測定は下記の通りに行った。PPS40重量
部にガラスファイバー(CS 3J‐961S、商標、
日東紡績株式会社製)30重量部及び炭酸カルシウム
(SL‐1000、商標、竹原化学工業株式会社製)3
0重量部を混合した後、二軸異方向回転押出機を用い3
20℃で混練して、ペレットを作成した。得られたペレ
ットから、シリンダー温度320℃、金型温度130℃
に設定した射出成形機により、JIS K6850に従
う試験片を作成した。JIS K6850に準拠し、得
られた試験片をエポキシ樹脂系接着剤[長瀬チバ株式会
社製、主剤(XNR3101、商標)/硬化剤(XNH
3101、商標)=100重量部/33.3重量部]を
用いて90℃、30分の硬化条件で接着した後、引張速
度5mm/分、チャック間距離130mmで引張試験を
行い、接着強度を測定した。但し、実施例4について
は、ガラスファイバー及び炭酸カルシウムを配合せず、
PPSのみにより試験片を作成し、接着強度を測定し
た。## EQU00002 ## DCA reaction rate (%) = (1-remaining DCA weight / prepared DCA weight) × 100 The adhesive strength was measured as follows. 40 parts by weight of PPS with glass fiber (CS 3J-961S, trademark,
30 parts by weight of Nitto Boseki Co., Ltd. and calcium carbonate (SL-1000, trademark, manufactured by Takehara Chemical Industry Co., Ltd.) 3
After mixing 0 parts by weight, 3 using a twin-screw counter-rotating extruder
The mixture was kneaded at 20 ° C to prepare pellets. Cylinder temperature 320 ℃, mold temperature 130 ℃ from the obtained pellets
A test piece according to JIS K6850 was created by the injection molding machine set to. According to JIS K6850, the obtained test piece was used as an epoxy resin adhesive [manufactured by Nagase Ciba Co., Ltd., main agent (XNR3101, trademark) / curing agent (XNH
3101, trademark) = 100 parts by weight / 33.3 parts by weight] at 90 ° C. for 30 minutes, and then a tensile test is performed at a pulling speed of 5 mm / minute and a chuck distance of 130 mm to obtain the adhesive strength. It was measured. However, for Example 4, without blending glass fiber and calcium carbonate,
A test piece was prepared using only PPS, and the adhesive strength was measured.
【0037】[0037]
【実施例1】150リットルオートクレーブに、フレー
ク状硫化ソーダ(60.4重量%Na2 S)19.38
1kgと、N‐メチル‐2‐ピロリドン(以下ではNM
Pと略すことがある)45.0kgを仕込んだ。窒素気
流下攪拌しながら209℃まで昇温して、水4.640
kgを留出させた(残存する水分量は硫化ソーダ1モル
当り1.12モル)。その後、オートクレーブを密閉し
て180℃まで冷却し、p‐DCB22.732kg、
DCA0.170kg(硫化ソーダに対して0.7モル
%)及びNMP18.0kgを仕込んだ。液温150℃
で窒素ガスを用いて1kg/cm2 Gに加圧して昇温を
開始した。液温が260℃になった時点で昇温を止め、
2時間攪拌しつつ反応を進めた。Example 1 Flake-shaped sodium sulfide (60.4 wt% Na 2 S) 19.38 was placed in a 150 liter autoclave.
1 kg and N-methyl-2-pyrrolidone (hereinafter NM
45.0 kg was charged. While stirring under a nitrogen stream, the temperature was raised to 209 ° C. and water was reduced to 4.640
kg was distilled (the residual water content was 1.12 mol per mol of sodium sulfide). Then, the autoclave was closed and cooled to 180 ° C, p-DCB22.732kg,
DCA 0.170 kg (0.7 mol% with respect to sodium sulfide) and NMP 18.0 kg were charged. Liquid temperature 150 ℃
Then, the temperature was started by pressurizing to 1 kg / cm 2 G with nitrogen gas. When the liquid temperature reaches 260 ° C, stop raising the temperature,
The reaction proceeded with stirring for 2 hours.
【0038】得られたスラリーを濾過して溶媒を除去
し、次に含溶媒濾過ケーキを、酸素濃度3.0体積%未
満の窒素気流中、220℃で約6時間加熱し溶媒を除去
した。次に、得られたPPS粉末に常法により水洗浄、
濾過を7回繰り返した後、120℃で約8時間熱風循環
乾燥機中で乾燥し、白色粉末状のポリマーを得た。The obtained slurry was filtered to remove the solvent, and then the solvent-containing filter cake was heated at 220 ° C. for about 6 hours in a nitrogen stream having an oxygen concentration of less than 3.0% by volume to remove the solvent. Next, the obtained PPS powder is washed with water by a conventional method,
After repeating filtration seven times, it was dried in a hot air circulation dryer at 120 ° C. for about 8 hours to obtain a white powdery polymer.
【0039】p‐DCBの反応率は98.6%であり、
DCAの反応率は33.1%であった。The reaction rate of p-DCB is 98.6%,
The reaction rate of DCA was 33.1%.
【0040】[0040]
【実施例2】DCAを0.243kg(硫化ソーダに対
して1.0モル%)とした以外は、実施例1と同一の条
件で実施した。Example 2 The procedure of Example 1 was repeated, except that DCA was changed to 0.243 kg (1.0 mol% based on sodium sulfide).
【0041】p‐DCBの反応率は98.5%であり、
DCAの反応率は34.0%であった。The reaction rate of p-DCB is 98.5%,
The reaction rate of DCA was 34.0%.
【0042】[0042]
【実施例3】DCAを0.778kg(硫化ソーダに対
して3.2モル%)とした以外は、実施例1と同一の条
件で実施した。Example 3 The procedure of Example 1 was repeated, except that DCA was 0.778 kg (3.2 mol% based on sodium sulfide).
【0043】p‐DCBの反応率は98.5%であり、
DCAの反応率は28.6%であった。The reaction rate of p-DCB is 98.5%,
The reaction rate of DCA was 28.6%.
【0044】[0044]
【実施例4】p‐DCBを22.161kg、DCAを
0.243kg(硫化ソーダに対して1.0モル%)と
し、オートクレーブ上部を散水により冷却しながら、反
応を液温220℃で5時間、その後昇温して液温260
℃で5時間行った以外は、実施例1と同一の条件で実施
した。Example 4 With p-DCB being 22.161 kg and DCA being 0.243 kg (1.0 mol% with respect to sodium sulfide), the reaction was carried out at a liquid temperature of 220 ° C. for 5 hours while cooling the upper part of the autoclave with water spray. , And then the temperature is increased to 260
It carried out on the same conditions as Example 1 except having performed at 5 degreeC for 5 hours.
【0045】p‐DCBの反応率は98.7%であり、
DCAの反応率は38.0%であった。The reaction rate of p-DCB is 98.7%,
The reaction rate of DCA was 38.0%.
【0046】[0046]
【比較例1】p‐DCBを22.638kgとし、DC
Aを添加しなかった以外は、実施例1と同一の条件で実
施した。Comparative Example 1 p-DCB was set to 22.638 kg and DC
It carried out on the same conditions as Example 1 except not adding A.
【0047】p‐DCBの反応率は98.4%であっ
た。The reaction rate of p-DCB was 98.4%.
【0048】[0048]
【比較例2】DCAを1.264kg(硫化ソーダに対
して5.2モル%)とした以外は、実施例1と同一の条
件で実施した。COMPARATIVE EXAMPLE 2 The procedure of Example 1 was repeated except that DCA was changed to 1.264 kg (5.2 mol% based on sodium sulfide).
【0049】p‐DCBの反応率は98.5%であり、
DCAの反応率は38.1%であった。得られたポリマ
ーは、増粘が著しく成形できなかった。The reaction rate of p-DCB is 98.5%,
The reaction rate of DCA was 38.1%. The obtained polymer was not able to be molded because of its thickening.
【0050】[0050]
【比較例3】溶媒除去のための含溶媒濾過ケーキの加熱
処理を実施せず、水洗浄及び濾過の操作を9回行った以
外は、実施例1と同一条件で実施した。[Comparative Example 3] The same procedure as in Example 1 was carried out except that the solvent-containing filter cake was not heat-treated for solvent removal, and the washing and filtering operations were repeated 9 times.
【0051】以上の結果を表1に示す。The above results are shown in Table 1.
【0052】[0052]
【表1】 実施例1〜3は、DCAの添加量を本発明の範囲内で変
化させたものである。いずれも接着強度は高かった。ま
た、DCA添加量を増加すると、接着強度は増加した。
実施例4は、反応を二段階とし、かつオートクレーブの
上部を冷却したものである。接着強度は高かった。ま
た、実施例4の溶融粘度V6 が高く、高分子量のPPS
が得られることが分かった。[Table 1] In Examples 1 to 3, the amount of DCA added was changed within the range of the present invention. The adhesive strength was high in all cases. Moreover, the adhesive strength increased as the amount of DCA added increased.
In Example 4, the reaction was carried out in two stages and the upper part of the autoclave was cooled. The adhesive strength was high. In addition, the melt viscosity V 6 of Example 4 was high, and high molecular weight PPS was used.
It turns out that
【0053】一方、比較例1は、実施例1と同一条件
下、DCAを添加しなかったものである。実施例1に比
べて、PPSの接着強度は著しく低かった。比較例2
は、実施例1と同一条件下、DCA添加量が本発明の範
囲を越えたものである。得られたPPSは、増粘が著し
く成形できず実用性に乏しいことが分かった。比較例3
は、含溶媒濾過ケーキの加熱処理を実施しなかった以外
は、実施例1と同一条件で実施したものである。実施例
1と比べて、PPSの接着強度は著しく低いものであっ
た。On the other hand, in Comparative Example 1, DCA was not added under the same conditions as in Example 1. The adhesive strength of PPS was significantly lower than that of Example 1. Comparative Example 2
Indicates that the amount of DCA added exceeds the range of the present invention under the same conditions as in Example 1. It was found that the obtained PPS had a marked increase in viscosity and could not be molded and was not practical. Comparative Example 3
Was carried out under the same conditions as in Example 1 except that the solvent-containing filter cake was not heat-treated. Compared with Example 1, the adhesive strength of PPS was extremely low.
【0054】[0054]
【発明の効果】本発明は、従来のPASの持つ高い耐熱
性と機械的強度に加えて、エポキシ樹脂等との接着性に
も優れたPASを製造する方法を提供する。また、加熱
により濾過ケーキ中の溶媒を除去するため、溶媒の回収
率が著しく高く、かつ水洗浄工程を簡略化できる。従っ
て、生産性が高く、かつコスト的に有利である。INDUSTRIAL APPLICABILITY The present invention provides a method for producing a PAS excellent in adhesiveness with an epoxy resin or the like in addition to the high heat resistance and mechanical strength of the conventional PAS. Further, since the solvent in the filter cake is removed by heating, the recovery rate of the solvent is extremely high and the water washing step can be simplified. Therefore, the productivity is high and the cost is advantageous.
Claims (6)
物とジハロ芳香族化合物とを反応させてポリアリーレン
スルフィドを製造する方法において、アルカリ金属硫化
物に対して0.5〜5.0モル%の官能基含有ハロ置換
芳香族化合物を、アルカリ金属硫化物とジハロ芳香族化
合物との反応の前の又は反応中の反応系内に添加して、
反応させることにより得たポリアリーレンスルフィドの
スラリーを濾過した後、得られた含溶媒濾過ケーキを非
酸化性ガス雰囲気下150〜250℃の温度で加熱して
溶媒を除去し、次いで水洗浄することを特徴とするポリ
アリーレンスルフィドの製造法。1. A method for producing a polyarylene sulfide by reacting an alkali metal sulfide and a dihaloaromatic compound in an organic amide solvent, wherein 0.5 to 5.0 mol% relative to the alkali metal sulfide. By adding the functional group-containing halo-substituted aromatic compound in the reaction system before or during the reaction of the alkali metal sulfide and the dihalo-aromatic compound,
After filtering the slurry of polyarylene sulfide obtained by reacting, the solvent-containing filter cake obtained is heated at a temperature of 150 to 250 ° C. under a non-oxidizing gas atmosphere to remove the solvent, and then washed with water. A method for producing a polyarylene sulfide, which comprises:
ルカリ金属硫化物に対して0.5〜3.5モル%で添加
する請求項1記載の方法。2. The method according to claim 1, wherein the functional group-containing halo-substituted aromatic compound is added in an amount of 0.5 to 3.5 mol% based on the alkali metal sulfide.
とにより反応缶内の気相の一部を凝縮させ、これを液相
に還流せしめる請求項1又は2記載の方法。3. The method according to claim 1 or 2, wherein during the reaction, a part of the gas phase in the reaction can is condensed by cooling the gas phase part of the reaction can, and the gas is refluxed to the liquid phase.
クロロアニリンである請求項1〜3のいずれか一つに記
載の方法。4. The method according to claim 1, wherein the functional group-containing halo-substituted aromatic compound is dichloroaniline.
で行う請求項1〜4のいずれか一つに記載の方法。5. The heating of the filter cake is performed at 180 to 230 ° C.
The method according to any one of claims 1 to 4, wherein
未満の窒素ガスである請求項1〜5のいずれか一つに記
載の方法。6. The non-oxidizing gas has an oxygen concentration of 5.0% by volume.
The method according to any one of claims 1 to 5, which is less than nitrogen gas.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03173995A JP3582610B2 (en) | 1995-01-27 | 1995-01-27 | Method for producing polyarylene sulfide |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03173995A JP3582610B2 (en) | 1995-01-27 | 1995-01-27 | Method for producing polyarylene sulfide |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08198966A true JPH08198966A (en) | 1996-08-06 |
| JP3582610B2 JP3582610B2 (en) | 2004-10-27 |
Family
ID=12339413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03173995A Expired - Fee Related JP3582610B2 (en) | 1995-01-27 | 1995-01-27 | Method for producing polyarylene sulfide |
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| Country | Link |
|---|---|
| JP (1) | JP3582610B2 (en) |
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