JPH08201317A - Method and apparatus for measuring element distribution in sample and composition analysis - Google Patents
Method and apparatus for measuring element distribution in sample and composition analysisInfo
- Publication number
- JPH08201317A JPH08201317A JP7014573A JP1457395A JPH08201317A JP H08201317 A JPH08201317 A JP H08201317A JP 7014573 A JP7014573 A JP 7014573A JP 1457395 A JP1457395 A JP 1457395A JP H08201317 A JPH08201317 A JP H08201317A
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- Prior art keywords
- sample
- electron
- composition
- backscattered
- intensity
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Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、試料中の元素分布測定
と組成分析方法およびその装置に係り、詳しくは走査型
電子顕微鏡における後方散乱電子を検出し、その輝度分
布を解析することにより、元素分布を測定し、さらに組
成を分析する方法およびその装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for measuring element distribution in a sample, a composition analysis method and an apparatus therefor, and more specifically, by detecting backscattered electrons in a scanning electron microscope and analyzing the brightness distribution thereof. The present invention relates to a method and apparatus for measuring element distribution and further analyzing composition.
【0002】[0002]
【従来の技術】走査型電子顕微鏡(以下、SEMと略称
する)を用いた試料中微小部分の元素分布測定と組成分
析としては、たとえば鉄鋼中のニッケル(Ni) やクロム
(Cr)、マンガン(Mn)、モリブデン(Mo) 、炭素(C)
などを測定する場合は、たとえば特開平3−165440号公
報に開示されているエネルギー分散形X線分析装置があ
る。2. Description of the Related Art Elemental distribution measurement and composition analysis of minute portions in a sample using a scanning electron microscope (hereinafter abbreviated as SEM) include, for example, nickel (Ni) and chromium in steel.
(Cr), manganese (Mn), molybdenum (Mo), carbon (C)
When measuring such as, there is an energy dispersive X-ray analyzer disclosed in, for example, JP-A-3-165440.
【0003】その内容は、電子顕微鏡あるいは類似装置
と組み合わせて使用されるエネルギー分散形X線分析装
置において、電子顕微鏡あるいは類似装置の試料照射電
子線の照射電子線エネルギーをモニタし、かつX線分析
処理にこれを使う機能を有することを特徴とするもので
ある。[0003] The content is that in an energy dispersive X-ray analyzer used in combination with an electron microscope or similar device, the irradiation electron beam energy of a sample irradiation electron beam of the electron microscope or similar device is monitored and X-ray analysis is performed. It is characterized by having a function of using this for processing.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、上記し
た特開平3−165440号の装置を用いて元素分布測定を行
うには、測定所要時間が非常に長いため1日に測定でき
る試料数が制限されて測定コストがかかるなどの不都合
があり、また特性X線の発生する領域は入射電子線のス
ポットサイズに比して約1μm と大きいため、測定倍率
や空間分解能も要求精度に対して不十分であるなどの問
題がある。なお、SEMに後方散乱電子検出器を備え
て、元素のおおよその分布を測定する方法もあるが、そ
の方法では元素の同定や分析をすることが不可能であ
る。However, in order to measure the element distribution using the apparatus disclosed in Japanese Patent Laid-Open No. 3-165440, the time required for the measurement is very long, so that the number of samples that can be measured per day is limited. In addition, there are inconveniences such as high measurement cost, and because the area where characteristic X-rays are generated is as large as about 1 μm compared to the spot size of the incident electron beam, the measurement magnification and spatial resolution are insufficient for the required accuracy. There is such a problem. Although there is a method in which the SEM is equipped with a backscattered electron detector to measure the approximate distribution of the elements, it is impossible to identify or analyze the elements by this method.
【0005】本発明は、上記した従来技術の有する課題
を解決すべくなされたものであって、試料中微小部分を
観察しつつ迅速かつ高精度に元素分布測定および組成分
析を行うことの可能な方法および装置を提供することを
目的とする。The present invention has been made to solve the above-mentioned problems of the prior art. It is possible to perform element distribution measurement and composition analysis rapidly and highly accurately while observing a minute portion in a sample. It is an object to provide a method and a device.
【0006】[0006]
【課題を解決するための手段】上記目的を達成するため
に、本発明は、低加速度電子線を試料表面に照射し、二
次電子像を観察しながら同時に試料表面に生じる後方散
乱電子を検出してその輝度分布を測定し、あらかじめ求
めた組成既知試料による後方散乱電子強度を用いて校正
することにより、試料中元素の分布測定および組成を分
析することを特徴とする試料中の元素分布測定と組成分
析方法である。In order to achieve the above object, the present invention irradiates a sample surface with a low-acceleration electron beam and simultaneously detects a secondary electron image while simultaneously detecting backscattered electrons generated on the sample surface. Then, the luminance distribution is measured, and the distribution of elements in the sample is measured and the composition is analyzed by performing calibration using the backscattered electron intensity obtained from a sample of known composition determined in advance. And the composition analysis method.
【0007】また、本発明は、低加速度電子線を照射す
る走査型電子顕微鏡と、この走査型電子顕微鏡の鏡筒部
に取り付けられる二次電子検出器と後方散乱電子検出器
と照射電流測定装置と、前記後方散乱電子検出器で検出
された後方散乱電子強度信号を入力して一定の輝度分布
を得るためにゲインを調整する後方散乱電子強度増幅器
と、あらかじめ記憶されている組成既知試料の後方散乱
電子強度によって前記後方散乱電子強度増幅器から入力
される後方散乱電子強度信号を校正して試料の組成を求
める演算処理手段とからなることを特徴とする試料中の
元素分布測定と組成分析装置である。The present invention also provides a scanning electron microscope for irradiating a low-acceleration electron beam, a secondary electron detector, a backscattered electron detector, and an irradiation current measuring device which are attached to the lens barrel of the scanning electron microscope. A backscattered electron intensity amplifier for adjusting the gain to obtain a constant brightness distribution by inputting the backscattered electron intensity signal detected by the backscattered electron detector, A device for measuring element distribution in a sample and a composition analyzer, comprising: an arithmetic processing unit for calibrating a backscattered electron intensity signal input from the backscattered electron intensity amplifier according to scattered electron intensity to obtain a composition of the sample. is there.
【0008】[0008]
【作 用】本発明者らは、電子線を照射した際に試料表
面に発生する後方散乱電子強度が原子番号に比例するこ
とに着目し、その後方散乱電子強度の分布を測定するこ
とにより元素分布測定が可能であることを見出した。な
お、この場合、後方散乱電子の発生領域、すなわち、元
素分布測定の分解能が電子線の加速電圧、照射電流、電
子線の径の影響を受けるのを避けるため、SEMの電子
銃に指向性のよい電界放射型を用い、低加速電圧、低照
射電流とした。また、電子線の照射電流も常に変動して
おり、さらにこの手法では直接的に元素の同定ができる
ものではないから、観察中に照射電流を測定し、後方散
乱電子検出器の増幅器のゲインを調整することにより、
常に一定の輝度分布が得られるようにした。[Operation] The present inventors focused on the fact that the backscattered electron intensity generated on the sample surface when irradiated with an electron beam was proportional to the atomic number, and measured the distribution of the backscattered electron intensity to determine the element It was found that distribution measurement is possible. In this case, in order to avoid the influence of the generation region of the backscattered electrons, that is, the resolution of the element distribution measurement from the acceleration voltage of the electron beam, the irradiation current, and the diameter of the electron beam, the electron gun of the SEM has a directivity. A good field emission type was used, and low acceleration voltage and low irradiation current were used. Also, the irradiation current of the electron beam is constantly changing, and since this method cannot directly identify the element, the irradiation current is measured during observation and the gain of the amplifier of the backscattered electron detector is adjusted. By adjusting
A constant brightness distribution is always obtained.
【0009】したがって、本発明によれば、電界放射型
の電子銃を用いて低加速電圧の電子線を試料表面に照射
し、二次電子像を観察しながら同時に、試料表面に生じ
る後方散乱電子を検出し、その輝度分布を解析するよう
にしたので、常に一定の輝度分布が得られ、自動的に試
料中元素の同定および分布解析さらには定量分析を行う
ことが可能である。Therefore, according to the present invention, a back-scattered electron generated on the sample surface is simultaneously irradiated with a low acceleration voltage electron beam by irradiating the sample surface with a field emission type electron gun and observing a secondary electron image. Is detected and its luminance distribution is analyzed, so that a constant luminance distribution is always obtained, and it is possible to automatically perform the identification and distribution analysis of the elements in the sample, and further the quantitative analysis.
【0010】また、本発明によれば、特性X線の強度分
布を測定する代わりに後方散乱電子の強度分布を測定す
るようにしたので、元素分布測定と定量分析を迅速に行
うことができ、測定・分析に要する時間の短縮や省エネ
ルギーを図ることが可能である。たとえば、従来のED
Sの二次元マッピングにおいては、分析時間30分以上で
分解能が1μm 程度であったが、本発明の後方散乱電子
では約54秒であり、その分解能も10nm程度である。Further, according to the present invention, the intensity distribution of the backscattered electrons is measured instead of measuring the intensity distribution of the characteristic X-ray, so that the element distribution measurement and the quantitative analysis can be performed quickly, It is possible to reduce the time required for measurement and analysis and save energy. For example, conventional ED
In the two-dimensional mapping of S, the resolution was about 1 μm when the analysis time was 30 minutes or more, but it was about 54 seconds for the backscattered electron of the present invention, and the resolution was also about 10 nm.
【0011】[0011]
【実施例】以下に、本発明の実施例について、図面を参
照して詳しく説明する。図1は本発明に係る測定・分析
装置の一例を示す概要図である。この図において、1は
電子銃室や試料を収納する試料室、観察室等を備えたS
EMの鏡筒部、2は鏡筒部1の制御部、3は鏡筒部1に
取り付けられる後方散乱電子検出器、4は鏡筒部1に取
り付けられる二次電子検出器、5は後方散乱電子検出器
3で検出された試料表面の後方散乱電子強度信号を入力
して一定の輝度分布を得るためにゲインを調整する後方
散乱電子強度増幅器、6は鏡筒部1に取り付けられる照
射電流検出器、7は照射電流測定装置、8は観察用モニ
タ、9は組成既知試料の後方散乱電子強度を記憶し、後
方散乱電子検出器3からの後方散乱電子強度信号と比較
演算する測定・分析演算装置、10は測定・分析モニタで
ある。Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a schematic diagram showing an example of a measurement / analysis apparatus according to the present invention. In this figure, 1 is an S equipped with an electron gun chamber, a sample chamber for storing a sample, an observation chamber, etc.
EM lens barrel portion, 2 is a control unit of the lens barrel portion 1, 3 is a backscattering electron detector attached to the lens barrel portion 1, 4 is a secondary electron detector attached to the lens barrel portion 1, and 5 is backscattering A backscattered electron intensity amplifier for inputting the backscattered electron intensity signal of the sample surface detected by the electron detector 3 to adjust the gain in order to obtain a constant brightness distribution, 6 is an irradiation current detection attached to the lens barrel portion 1. Measuring instrument 7, an irradiation current measuring device, 8 an observation monitor, 9 a backscattered electron intensity of a sample having a known composition, and a calculation / analysis operation for comparison calculation with the backscattered electron intensity signal from the backscattered electron detector 3. The device, 10 is a measurement / analysis monitor.
【0012】SEMの鏡筒部1の試料室に試料をセット
し、検査者は観察用モニタ8を見ながら通常の電子顕微
鏡像が得られるように調整する。そこで、観察用モニタ
8で後方散乱電子像を映し、その後方散乱電子強度を後
方散乱電子強度増幅器5でゲインを調整して一定の輝度
分布にした後、測定・分析演算装置9に取り込んで、あ
らかじめ記憶されている組成既知試料の後方散乱電子強
度と比較演算して試料の組成を求めた後、測定・分析モ
ニタ10にその測定・分析結果を表示する。なお、測定中
に照射電流が変化した場合は、照射電流検出器6がその
照射電流の変化を検出して照射電流測定装置7を介して
制御部2および後方散乱電子強度増幅器5に信号を送
り、照射電流が設定値になるように制御する。The sample is set in the sample chamber of the lens barrel portion 1 of the SEM, and the examiner makes adjustments while looking at the observation monitor 8 so that a normal electron microscope image can be obtained. Therefore, the backscattered electron image is displayed on the observation monitor 8, the gain of the backscattered electron intensity is adjusted by the backscattered electron intensity amplifier 5 to obtain a constant luminance distribution, and then the measurement / analysis calculation device 9 imports it. The composition of the sample is obtained by performing a comparison operation with the backscattered electron intensity of the sample of known composition stored in advance, and then the measurement / analysis result is displayed on the measurement / analysis monitor 10. If the irradiation current changes during measurement, the irradiation current detector 6 detects the change in the irradiation current and sends a signal to the control unit 2 and the backscattered electron intensity amplifier 5 via the irradiation current measuring device 7. , The irradiation current is controlled to reach the set value.
【0013】このように構成された本発明装置の性能を
確認すべく、Fe;37.31 wt%,Cu;50.75 wt%,C;1
1.94 wt%からなる三元系試料を用いて調査した。この
ときの加速電圧;5kV, プローブ電流;0.5nA とした。
図2は、倍率 500倍で測定した元素分布状態の顕微鏡写
真である。この図において、白色領域はCu、灰色領域は
Fe、黒色領域はCをそれぞれ示しているが、この図から
明らかなように、元素の分布が高感度に検出できるか
ら、良好な測定結果が得られることがわかる。In order to confirm the performance of the device of the present invention thus constructed, Fe; 37.31 wt%, Cu; 50.75 wt%, C; 1
The investigation was carried out using a ternary sample consisting of 1.94 wt%. At this time, the acceleration voltage was 5 kV and the probe current was 0.5 nA.
FIG. 2 is a micrograph of the element distribution state measured at a magnification of 500 times. In this figure, the white area is Cu and the gray area is
The Fe and black regions respectively indicate C, but as is clear from this figure, it is understood that good measurement results can be obtained because the element distribution can be detected with high sensitivity.
【0014】また、原子番号Zに対して後方散乱電子強
度が、図3に示すように量子化されているため、元素の
同定を行うことができ、その面積占有率(%)を計算す
ることにより、元素濃度(atomic%)が得られる。そこ
で、SEMの視野を30倍の低倍率に変えて元素濃度を測
定した結果を図4に示した。その結果、C;40.20 atom
ic%, Fe;27.51 atomic%,Cu;30.77 atomic%と測定
された。したがって、本発明における検出下限は0.01at
omic%である。Further, since the backscattered electron intensity is quantized with respect to the atomic number Z as shown in FIG. 3, the element can be identified and its area occupancy (%) can be calculated. Gives the elemental concentration (atomic%). Therefore, the result of measuring the element concentration by changing the field of view of the SEM to a low magnification of 30 times is shown in FIG. As a result, C; 40.20 atom
ic%, Fe; 27.51 atomic%, Cu; 30.77 atomic% were measured. Therefore, the lower limit of detection in the present invention is 0.01 at.
It is omic%.
【0015】つぎに、Cr濃度の異なるCr鋼 (Cr含有率;
13〜60mass%、平均原子番号;24.8〜25.74)を試料と
し、加速電圧;15kV、プローブ電流;0.3nA として、平
均原子番号と後方散乱電子強度との関係について調べ
た。このとき、同一視野で後方散乱電子強度を3回測定
し、3視野で測定した。その結果を図5に示す。図中に
おいて、エラーバーは3視野測定のばらつきを、□印は
それらの平均値をそれぞれ示す。測定の結果は、視野ご
とのばらつきはあるものの、それらを平均することによ
り、平均原子番号と後方散乱電子強度との間に良好な相
関を有する検量線が得られた。Next, Cr steels having different Cr concentrations (Cr content ratio;
The relationship between the average atomic number and the backscattered electron intensity was investigated by using 13 to 60 mass%, average atomic number; 24.8 to 25.74) as a sample, and accelerating voltage; 15 kV, probe current; 0.3 nA. At this time, the backscattered electron intensity was measured three times in the same visual field, and was measured in three visual fields. The result is shown in FIG. In the figure, error bars indicate variations in the measurement of three visual fields, and squares indicate the average value thereof. Although the measurement results were different for each visual field, by averaging them, a calibration curve having a good correlation between the average atomic number and the backscattered electron intensity was obtained.
【0016】ここで、得られた検量線の精度を検討する
ために下記式で求められるσd を計算した。 σd =√{Σ(Xreal−Xcal )2 /(n−1)} ここで、σd :検量線の正確さ、Xreal:実線の原子番
号、Xcal :検量線から求めた原子番号、n:測定点で
ある。Here, in order to examine the accuracy of the obtained calibration curve, σ d obtained by the following formula was calculated. σ d = √ {Σ (Xreal−Xcal) 2 / (n−1)} where σ d is the accuracy of the calibration curve, Xreal is the atomic number of the solid line, Xcal is the atomic number obtained from the calibration curve, and n: It is a measurement point.
【0017】その結果、σd は0.026 であった。したが
って、3σd をとれば0.09程度の精度で原子番号を推定
できることがわかった。それゆえ、この0.09は原子番号
分解能であるといえる。つぎに、観察試料に主な成分が
C;1.94mass%,Mo;2.33mass%,Cr;6.64mass%,
V;5.90mass%,W;3.80mass%,Ni;4.48mass%とさ
れるハイス系ロールを用い、標準試料として高純度Al,
Cu,Feを用いて、それぞれ同一のウッドメタルに埋め込
み、研磨した。次に、加速電圧;5kV、入射電流;0.5n
A として、観察試料と標準試料の像を取り込んだ。その
後方散乱電子像を図6に示した。さらに、標準試料の輝
度と原子番号との関係から検量線を作成したところ、図
7の検量線が得られた。As a result, σ d was 0.026. Therefore, it was found that the atomic number can be estimated with an accuracy of about 0.09 by taking 3σ d . Therefore, it can be said that this 0.09 is atomic number resolution. Next, the main components of the observed sample are C: 1.94 mass%, Mo: 2.33 mass%, Cr: 6.64 mass%,
V: 5.90mass%, W: 3.80mass%, Ni: 4.48mass%, using a high-speed steel roll, high-purity Al as a standard sample,
Using Cu and Fe, they were embedded in the same wood metal and polished. Next, acceleration voltage; 5kV, incident current; 0.5n
As A, images of the observation sample and the standard sample were captured. The backward scattered electron image is shown in FIG. Furthermore, when a calibration curve was created from the relationship between the brightness of the standard sample and the atomic number, the calibration curve of FIG. 7 was obtained.
【0018】そこで、図6内に矢印で示す細長い粒状体
に着目して、その元素あるいは化合物の輝度を測定した
結果、その後方散乱電子強度は1.18であり、この値を用
いて図7の検量線から平均原子番号を求めたところ31.5
であった。なお、この観察試料のロール材はすでにSE
MおよびTEM(透過型電子顕微鏡の略称)によって観
察がなされており、種々の炭化物が含まれていてその炭
化物の種類は形状から識別できること、またEDS像の
解析結果からMoが検出されたことから、上記の粒状体は
炭化物の一種であるMo7C3 (平均原子番号;31.2) であ
ることがわかっている。したがって、本実験で測定され
た平均原子番号はMo7C3 のとほぼ一致することがわか
る。Then, as a result of measuring the luminance of the element or compound by paying attention to the elongated granular material indicated by the arrow in FIG. 6, the backscattered electron intensity is 1.18, and using this value, the calibration of FIG. The average atomic number was calculated from the line 31.5
Met. The roll material of this observation sample is already SE
It has been observed by M and TEM (abbreviation of transmission electron microscope), it contains various carbides, the type of the carbides can be identified from the shape, and Mo was detected from the analysis result of the EDS image. It is known that the above-mentioned granular material is Mo 7 C 3 (average atomic number; 31.2), which is a kind of carbide. Therefore, it can be seen that the average atomic number measured in this experiment is almost the same as that of Mo 7 C 3 .
【0019】なお、前出図7の結果から炭化物も検量線
に乗ることが確認されたので、後方散乱電子強度による
元素同定は非伝導物質にも適用できる可能性があること
がわかった。From the results shown in FIG. 7 above, it was confirmed that the carbides also fit on the calibration curve, so it was found that the element identification based on the backscattered electron intensity may be applicable to non-conductive materials.
【0020】[0020]
【発明の効果】以上説明したように、本発明によれば、
電界放射型の電子銃を用いて低加速電圧の電子線を試料
表面に照射し、二次電子像を観察しながら同時に、試料
表面に生じる後方散乱電子を検出し、その輝度分布を解
析するようにしたので、高精度で試料中元素の元素分布
測定および組成分析を行うことができ、これによって試
料中微小部分の元素分布測定および組成分析の能率向上
に寄与する。As described above, according to the present invention,
Irradiate the sample surface with a low accelerating voltage electron beam using a field emission type electron gun, while observing the secondary electron image, simultaneously detect backscattered electrons generated on the sample surface and analyze the brightness distribution. Therefore, the element distribution measurement and the composition analysis of the elements in the sample can be performed with high accuracy, which contributes to the improvement of the efficiency of the element distribution measurement and the composition analysis of the minute portion in the sample.
【図1】本発明に係る測定・分析装置の一例を示す概要
図である。FIG. 1 is a schematic diagram showing an example of a measurement / analysis apparatus according to the present invention.
【図2】Fe;37.31 mass%,Cu;50.75 mass%,C;1
1.94 mass%からなる三元系試料の金属組織を示す顕微
鏡写真である。[Fig. 2] Fe; 37.31 mass%, Cu; 50.75 mass%, C; 1
It is a microscope picture which shows the metal structure of a ternary system sample which consists of 1.94 mass%.
【図3】原子番号と後方散乱電子強度との関係を示す特
性図である。FIG. 3 is a characteristic diagram showing the relationship between atomic number and backscattered electron intensity.
【図4】試料中元素とその含有率との関係を示す特性図
である。FIG. 4 is a characteristic diagram showing a relationship between an element in a sample and its content rate.
【図5】Cr鋼の平均原子番号と後方散乱電子強度との関
係を示す特性図である。FIG. 5 is a characteristic diagram showing the relationship between the average atomic number of Cr steel and the backscattered electron intensity.
【図6】ハイス系ロール鋼の金属組織を示す顕微鏡写真
である。FIG. 6 is a micrograph showing the metal structure of high-speed steel rolls.
【図7】ハイス系ロール鋼の平均元素番号と後方散乱電
子強度との関係を示す特性図である。FIG. 7 is a characteristic diagram showing the relationship between the average element number of high-speed steel rolls and backscattered electron intensity.
1 SEM(走査型電子顕微鏡)の鏡筒部 2 制御部 3 後方散乱電子検出器 4 二次電子検出器 5 後方散乱電子強度増幅器 6 照射電流検出器 7 照射電流測定装置 8 観察用モニタ 9 測定・分析演算装置 10 測定・分析モニタ 1 SEM (scanning electron microscope) lens barrel 2 Control unit 3 Backscattered electron detector 4 Secondary electron detector 5 Backscattered electron intensity amplifier 6 Irradiation current detector 7 Irradiation current measuring device 8 Observation monitor 9 Measurement / Analytical calculation device 10 Measurement / analysis monitor
Claims (2)
二次電子像を観察しながら同時に試料表面に生じる後方
散乱電子を検出してその輝度分布を測定し、あらかじめ
求めた組成既知試料による後方散乱電子強度を用いて校
正することにより、試料中元素の分布測定および組成を
分析することを特徴とする試料中の元素分布測定と組成
分析方法。1. A sample surface is irradiated with a low-acceleration electron beam,
While observing the secondary electron image, the backscattered electrons that occur on the sample surface are detected at the same time, the luminance distribution is measured, and the intensity of the backscattered electrons from the sample whose composition is known in advance is used to calibrate the A method for measuring element distribution in a sample and analyzing the composition, which comprises measuring the distribution and analyzing the composition.
顕微鏡と、この走査型電子顕微鏡の鏡筒部に取り付けら
れる二次電子検出器と後方散乱電子検出器と照射電流測
定装置と、前記後方散乱電子検出器で検出された後方散
乱電子強度信号を入力して一定の輝度分布を得るために
ゲインを調整する後方散乱電子強度増幅器と、あらかじ
め記憶されている組成既知試料の後方散乱電子強度によ
って前記後方散乱電子強度増幅器から入力される後方散
乱電子強度信号を校正して試料の組成を求める演算処理
手段とからなることを特徴とする試料中の元素分布測定
と組成分析装置。2. A scanning electron microscope for irradiating a low-acceleration electron beam, a secondary electron detector, a backscattered electron detector, an irradiation current measuring device attached to the lens barrel of the scanning electron microscope, and the rear side. The backscattered electron intensity amplifier that inputs the backscattered electron intensity signal detected by the scattered electron detector and adjusts the gain to obtain a constant brightness distribution, and the backscattered electron intensity of the sample of known composition stored in advance A device for measuring element distribution in a sample and a composition analyzer, which comprises an arithmetic processing means for calibrating a backscattered electron intensity signal input from the backscattered electron intensity amplifier to obtain a composition of the sample.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7014573A JPH08201317A (en) | 1995-01-31 | 1995-01-31 | Method and apparatus for measuring element distribution in sample and composition analysis |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7014573A JPH08201317A (en) | 1995-01-31 | 1995-01-31 | Method and apparatus for measuring element distribution in sample and composition analysis |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08201317A true JPH08201317A (en) | 1996-08-09 |
Family
ID=11864912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7014573A Pending JPH08201317A (en) | 1995-01-31 | 1995-01-31 | Method and apparatus for measuring element distribution in sample and composition analysis |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08201317A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004163135A (en) * | 2002-11-11 | 2004-06-10 | Jeol Ltd | X-ray analyzer |
| JP2007178445A (en) * | 2007-03-05 | 2007-07-12 | Jeol Ltd | Quantitative analysis method in sample analyzer |
| JP2007220317A (en) * | 2006-02-14 | 2007-08-30 | Jeol Ltd | Electron beam inspection method and apparatus |
| US7569819B2 (en) | 2006-10-17 | 2009-08-04 | Jeol Ltd. | Electron beam system and method of operating the same |
| JP2013224932A (en) * | 2012-03-22 | 2013-10-31 | Taiheiyo Cement Corp | Noise removal method in reflection electron image, method for estimating constituent phase ratio of cement using noise removal method and manufacturing method, and method for estimating hydration reaction rate |
| WO2021075170A1 (en) * | 2019-10-18 | 2021-04-22 | 株式会社日立ハイテク | Inspection system and non-transitory computer-readable medium |
| CN116106349A (en) * | 2022-12-09 | 2023-05-12 | 国标(北京)检验认证有限公司 | A Method for Quantitative Analysis of α+β Titanium Alloy Phase Ratio in Scanning Electron Microscope Images |
-
1995
- 1995-01-31 JP JP7014573A patent/JPH08201317A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004163135A (en) * | 2002-11-11 | 2004-06-10 | Jeol Ltd | X-ray analyzer |
| JP2007220317A (en) * | 2006-02-14 | 2007-08-30 | Jeol Ltd | Electron beam inspection method and apparatus |
| US7569819B2 (en) | 2006-10-17 | 2009-08-04 | Jeol Ltd. | Electron beam system and method of operating the same |
| JP2007178445A (en) * | 2007-03-05 | 2007-07-12 | Jeol Ltd | Quantitative analysis method in sample analyzer |
| JP2013224932A (en) * | 2012-03-22 | 2013-10-31 | Taiheiyo Cement Corp | Noise removal method in reflection electron image, method for estimating constituent phase ratio of cement using noise removal method and manufacturing method, and method for estimating hydration reaction rate |
| WO2021075170A1 (en) * | 2019-10-18 | 2021-04-22 | 株式会社日立ハイテク | Inspection system and non-transitory computer-readable medium |
| CN116106349A (en) * | 2022-12-09 | 2023-05-12 | 国标(北京)检验认证有限公司 | A Method for Quantitative Analysis of α+β Titanium Alloy Phase Ratio in Scanning Electron Microscope Images |
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