JPH08204399A - Mounted board production system - Google Patents

Abstract

(57) [Abstract] [Purpose] In a mounting board production system, it is possible to prevent defective products from flowing to the next process and means, to produce good products without waste, and to obtain solid reliability of product quality. [Structure] Cream solder printing machine 21 and component mounting machine 23
In a mounting board production system having a reflow oven 25 and a solder inspector 26 for inspecting whether or not a component is correctly solder-bonded to a predetermined position on the reflowed board, status data of the solder-bonded board In order to produce a non-defective product by dynamically changing the information of the inspection program and the inspection algorithm based on at least one of the status data of the solder joint state detecting means 30, 31, 32 for detecting And a control means for controlling to prevent the defective product from flowing to the next process / means.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting board production system for mounting components on a board.

[0002]

2. Description of the Related Art In recent years, in a mounting board production system for mounting parts on a circuit board, quality control is performed for each process to prevent defects from occurring and produce good products without waste. There is. As a conventional technique relating to this type of mounting board production system, for example, Japanese Patent Application No.
The application is filed under No. -260449. Hereinafter, an example of a mounting board production system in Japanese Patent Application No. 4-260449 will be described with reference to the drawings.

FIG. 23 is a block diagram showing the structure of a conventional mounting board production system. In FIG. 23, along the transfer line of the circuit board, from the upper side thereof, the solder printing unit 1,
The component mounting portion 2 and the soldering portion 3 are sequentially arranged.

In the solder printing section 1, a cream solder printing machine 4 prints cream solder on a land of an object to be printed such as a circuit board. The cream solder printing inspection machine 5 inspects the state of the board and the printing equipment, and also inspects the printing state of the cream solder printed by the cream solder printing machine 4.
In FIG. 23, the print data holding unit 6 to which the cream solder printing inspection machine 5 is connected monitors the printing state of the cream solder printed on the land, for example, data such as print blur, print misalignment, and presence / absence of print solder. And collects and holds the monitoring items for the board and the printing equipment, for example, data such as the board mark deviation amount and the screen mark deviation amount. The print data analysis unit 7 to which the print data holding unit 6 is connected includes a print data holding unit 6
The data of each monitoring item collected in step 2 is analyzed by aggregating analysis and time series analysis by monitoring item, circuit number, equipment, etc. The state of the cream solder printing machine 4 as the printing equipment and the quality state of the circuit board that has passed through the cream solder printing machine 4 are grasped based on the result of comparison with the warning standard which does not reach the standard. This print data analysis unit 7
Is connected to the cream solder printer 4 and outputs an operation control instruction to the cream solder printer 4 according to the state of the cream solder printer 4 and the quality state of the circuit board that has passed through the cream solder printer 4. Then, the operation state is dynamically changed to control so as to produce a good product.

Further, in the component mounting section 2, the mounting machine 8
Uses an XY driving device to transfer the suction nozzle head to a component supply unit to which electronic components and the like are supplied. The suction nozzle head sucks the component and transfers it to the mounting position of the circuit board for printing on the land. The parts are mounted so that the leads and electrodes are located on the solder paste. At this time, the component is mounted on the circuit board while the component recognition camera photographs the component suction state to manage the suction error. The after-component mounting inspection machine 9 inspects the state of the components and equipment mounted by the mounting machine 8 at a predetermined position on the circuit board. The mounting data holding unit 10 connected to the post-component mounting inspection machine 9 monitors the mounting state of the components mounted by the mounting machine 8, for example, component missing, component standing, component mounting deviation, and component mounting polarity error. Data is collected and held, and monitoring items for the mounting equipment, for example, data such as a suction error and a recognition error of the suction nozzle are collected and held. The mounting data analysis unit 11 to which the mounting data holding unit 10 is connected collects and analyzes the data of each monitoring item collected by the mounting data holding unit 10 by monitoring item, circuit number, equipment, and the like. Analysis such as analysis is performed, and the state of the mounting machine 8 and the quality state of the circuit board that has passed through the mounting machine 8 are grasped in accordance with the result of comparison with a warning standard for a preset monitoring item in the analysis result. The mounting data analysis unit 11 outputs an operation control instruction to the mounting machine 8 to dynamically change the operating state so that the non-defective product is produced.

Further, in the soldering section 3, the reflow furnace 12 is provided with a conveyer for conveying a circuit board, which is an object to be heated, in the furnace body, and heaters are arranged above and below the conveyer, respectively. The fan is arranged at the upper and lower positions and the hot air gas heated through the heater is blown onto the circuit board. Further, the inside of the reflow furnace 12 is divided into a preheating chamber, a reflow heating chamber, and a slow cooling chamber, and the above heater and fan are provided in each chamber. In the reflow heating chamber, the circuit board is uniformly heated. Then, the components are soldered by reflowing the cream solder.

The soldering inspection machine 13 inspects the soldering state of components on the circuit board and the state of equipment. Soldering data holding unit 14 to which the soldering inspection machine 13 is connected
Is a monitoring item for the soldering status of components on the circuit board, for example, collecting and retaining data such as component missing, component standing, component mounting position deviation and component mounting polarity error, and also monitoring items for reflow equipment. , Collect and hold data such as heater temperature, conveyor speed and oxygen concentration. Data of each monitoring item collected by the soldering data analyzing unit 15 to which the soldering data holding unit 14 is connected is analyzed by monitoring item, circuit number, equipment, etc. such as total analysis and time series analysis. Then, the state of the reflow furnace 12 and the quality state of the circuit board that has passed through the reflow furnace 12 are grasped according to the result of comparison with the warning standard for the preset monitoring item in the analysis result. The soldering data analysis unit 15 is connected to the reflow furnace 12 and outputs an operation control instruction to the reflow furnace 12 according to the state of the reflow furnace 12 and the quality state of the circuit board that has passed through the reflow furnace 12. Control to dynamically change the operating state to produce a good product.

Further, the correlation analysis unit 16 to which the print data analysis unit 7, mounting data analysis unit 11 and soldering data analysis unit 15 are connected is a cream solder printing machine 4, a mounting machine 8 and a reflow oven 12. Connected to the print data analysis unit 7, the mounting data analysis unit 11 and the soldering data analysis unit 15 and various analysis data and analysis results, and analyze the mutual correlation of each process related to the failure factor of the monitoring item, An operation control instruction is output to at least one of the cream solder printing machine 4, the mounting machine 8 and the reflow oven 12 to control the operation state dynamically so that a non-defective product is produced.

The print data analysis unit 7, the mounting data analysis unit 11, the soldering data analysis unit 15, and the correlation analysis unit 16 constitute a control means 17 as a computer, and a comparison result with a warning standard for a monitoring item, or Based on the result of comparison with the warning standard for a combination of multiple monitoring items, the system is also controlled to notify the facility of the process requiring a warning by a warning buzzer or a display monitor. Further, in the control means, various analysis data and analysis results such as aggregate analysis and time series analysis for each monitoring item, circuit number, equipment, etc., and correlation analysis data for each process are sequentially made into a database, and when necessary. You can search for the necessary data and view it on the monitor display or copy.

The operation of the mounting board production system having the above structure will be described below. First, the cream solder printing machine 4 prints the cream solder on the lands of the substrate, and then the mounting machine 8 mounts the components so that the leads and electrodes are located on the lands on which the cream solder is printed. The cream solder is reflowed in the reflow oven 12 to solder the leads or electrodes to the land of the substrate. In this way, the circuit board on which the components are mounted is completed, but the cream solder printing inspecting machine 5 monitors the printing state of the cream solder printed on the land,
For example, the presence or absence of print blur, print shift, and print solder is inspected, and monitoring items for the board and printing equipment, for example, board mark misalignment amount and screen mark misalignment amount are inspected. In addition, the post-component mounting inspection machine 9 inspects the monitoring items of the component mounting state mounted by the mounting machine 8, for example, component missing parts, component standing, component mounting position deviation, component mounting polarity error, and the like. Inspection items for the installation equipment, such as suction error and recognition error of the suction nozzle, are inspected. Furthermore, the soldering inspection machine 13
Is a monitoring item of the soldering state of the component on the circuit board, for example, inspecting the component missing, component standing, component mounting position deviation and component polarity error, and monitoring items for the reflow equipment, for example, heater temperature, Inspect conveyor speed and oxygen concentration.

Further, the inspection data from the cream solder printing inspection machine 5 is collected and held by the print data holding section 6, and the inspection data from the after-component inspection machine 9 is collected by the mounting data holding section 10. The soldering data holding unit 14 collects and holds the inspection data from the soldering inspection machine 13. Then, the data of each monitoring item collected by the print data holding unit 6 is printed by the print data analysis unit 7, the data of each monitoring item collected by the mounting data holding unit 10 is printed by the mounting analysis unit 11, and the solder data is further analyzed. The data of each monitoring item collected by the attachment data holding unit 14 is analyzed by the soldering data analyzing unit 15 such as a totaling analysis and a time series analysis for each monitoring item, each circuit, and each equipment. The state of each equipment and the quality state of the circuit board passing through each equipment are grasped according to the result of comparison with the warning standard for the set monitoring item.

Here, as shown in FIG. 24, the data analyzed and aggregated by the print data analysis unit 7, the mounting data analysis unit 11 and the soldering data analysis unit 15 are determined to be defective. Although the criteria have not been reached, warning criteria are set up to issue warnings, and it is detected whether the inspection result of the monitoring item exceeds the warning standard and enters the warning area. The good condition is produced by dynamically changing the operating state in advance so as not to exceed the warning area and stay within the normal area. In the printing process, for example, FIG. 25 shows a print inspection error tabulation analysis for solder deficiency and solder blemishes of a plurality of monitoring items for each circuit number. hand,
The warning criteria and judgment criteria in the print inspection error tabulation analysis are set.

In the case of FIG. 25, the most frequent circuit number N41
Regarding 3 as well, the number of errors in the warning standard has not been reached,
Squeegee check such as squeegee pressure and inclination, and board (PCB) such as land position accuracy and flatness as maintenance instructions for each equipment and board when the warning standard is exceeded.
Informs check and screen check such as position accuracy and push amount check. Further, FIG. 26 shows a time series analysis of inspection measurement values of print solder position deviation (X direction). The warning standard is ± 0.1 mm and the judgment standard is ± 0.2.
mm, the inspection measurement value is within the normal range, but when the warning standard exceeds ± 0.1 mm, squeegee check, board check, temperature check, etc. are notified as a maintenance instruction for each equipment and board, and the print offset Change the printing conditions such as changing, printing pressure adjustment such as squeegee pressure, cleaning operation for screen clogging, etc., to the cream solder printing machine 4,
The operating state is dynamically changed in advance so that the inspection measurement value falls within the normal range to produce a good product.

In the mounting process, for example, FIG.
In addition, the warning standard and the judgment standard in the error aggregation analysis are set according to the number of errors in which the non-adsorption, the standing adsorption, the rotation adsorption, the recognition error, and the recognition abnormality of the plurality of monitoring items for each nozzle reach the warning standards. In the case of FIG. Numbers 4, 5 and 8 exceeded the number of warning standard errors. Notify nozzle cleaning check and cassette check as maintenance instruction to each equipment, replace filter for nozzle clogging due to suction of solder to nozzle, and nozzle cleaning. Etc. to the mounting machine 8. Further, FIG. 28 shows a time series analysis of inspection measurement values of component mounting position deviation (X direction).
Warning standard ± 0.2mm, judgment standard ± 0.38mm,
The inspection measurement values are within the normal range, but the warning standard ±
At the stage of exceeding 0.2 mm, as a maintenance instruction for each equipment, we will inform the check of the reference pin positioned by the board hole and the nozzle cleaning check, etc.
A displacement amount correction such as a data offset correction in the mounting position NC data is performed on the mounting machine 8, and the operation state is dynamically changed in advance so that the inspection measurement value falls within the normal range, and a good product is produced.

Further, in a reflow process which is a soldering process, for example, a soldering inspection for low component height, right rotation deviation, left rotation deviation, bridge failure and edge detection failure in a plurality of monitoring items for each circuit number is shown in FIG. The error aggregation analysis is shown, and the warning standard in the soldering inspection error aggregation analysis is determined according to the number of errors such as low component height, right rotation misalignment, left rotation misalignment, bridge defect and edge detection defect. And the judgment standard is established. In the case of FIG. 29, the most frequent circuit number N413 exceeds the number of errors of the warning standard. As a maintenance instruction for each equipment, solder check, board check, furnace temperature distribution profile check, etc. are notified, and the heater temperature is changed. Correction of reflow conditions such as increase and decrease of N ₂ amount (O ₂ concentration) that influences conveyor speed and solderability is performed on the reflow furnace 12. In addition, in Fig. 30, the component position deviation of the inspection after soldering (X direction)
Shows the time series analysis of the inspection measurement values of the
0.1mm, judgment standard is ± 0.2mm, inspection measurement value exceeds warning standard + 0.1mm, profile check, board check, solder check, etc. are notified as maintenance instruction, and reflow condition such as heater temperature change Is performed on the reflow furnace 12, and the operating state is dynamically changed in advance so that the inspection measurement value falls within the normal range to produce a good product.

Further, the correlation analysis unit 16 correlates the respective processes related to the failure factor of each monitoring item based on the analysis data from the print data analysis unit 7, the mounting data analysis unit 11 and the soldering data analysis unit 15. Correlation analysis is performed, and an operation control instruction is output to at least one of the cream solder printing machine 4, the mounting machine 8 and the reflow furnace 12, and the operation state is dynamically changed to control to produce a good product.

In other words, as a monitoring item, for example, the correlation between the respective steps regarding chip rising defects will be described. In the reflow step, when the heating rate is increased, the solder temperature rapidly rises. At this time, if there is a solder printing deviation or a component mounting deviation, as shown in FIG.
Is placed in a state of being displaced from the printing position of the solder 20, and the side having a small volume melts first due to a rapid change in the solder temperature, so that the terminal 19 is pulled by surface tension to be in a chip standing state. . As described above, as a factor of the chip standing defect, the solder printing process, the component mounting process, and the reflow process all have a defect factor, as shown in the outline of the diagram in FIG. However, the chip standing defect is detected in the inspection process in the mounting process and the reflow process because it is necessary to mount the component.
Therefore, the chip standing defect as the monitoring item is performed in the inspection of the mounting process and the reflow process, and is performed in the inspection of the printing process and the mounting process for the chip standing.
The action for each equipment in the printing process, mounting process and reflow process for chip standing is to improve printing misalignment and printing thickness in the printing process, improve mounting misalignment and pushing amount in the mounting process, and heating speed in the reflow process. The correlation analysis unit 16 analyzes the correlation between each process related to the cause of failure such as weakening the wind speed and the wind speed, and outputs an operation control instruction to each equipment of the printing process, the mounting process, and the reflow process to determine the operation state. Dynamically change in advance and control to produce a good product.

On the contrary, when the detection result is in the warning area in the printing process, for example, if the warning standard of the print misregistration is exceeded, the mounting process in the downstream process from the detection process and the substrate in the reflow process are performed in the downstream process. Depending on the direction and amount of print misalignment, there is no risk of chipping until the equipment reaches the equipment, and improvement measures opposite to the factors shown in the factor analysis chart of chip embossing are executed, and printing misalignment occurs in the printing process. The board exceeding the warning standard of (1) is protected from chip failure, and the improvement process is executed for the next board in the printing process depending on the direction and amount of the print misalignment.

Further, in the print data analysis unit 7, the mounting data analysis unit 11 and the soldering data analysis unit 15,
Data analysis and time-series analysis of each monitoring item, such as each monitoring item, each circuit, and each equipment, and analysis results such as analysis of inspection measurement value distribution (in this case, component mounting position deviation analysis) shown in FIG. 33. On the basis of this analysis result, the correlation analysis unit 16 analyzes the correlation between each process related to the failure factor of the monitoring item, and the correlation analysis result is made into a database at the same time as the production and is displayed or displayed on the monitor at any time. It is possible to copy the part and specify the arbitrary period and analyze the trend of quality, the analysis of quality history, and the analysis of various sources from various angles such as the source analysis of quality. Becomes

Therefore, by empirically observing such a situation, it will become defective next time by clarifying numerically by setting a warning standard. Since it is possible to detect precautions for each process in advance before reaching the defect judgment standard without overlooking even minor changes in the process, it is possible to instruct measures in advance for each process before it becomes defective. Good products can be produced without waste.

In this example, the chip standing defect called Manhattan has been described. However, as shown in FIG. 34, there are a number of defect monitoring items such as solder bridges and component position shifts. Any defect monitoring item that can be acted on in a process is subject to correlation analysis. In FIG. 34, (first) shows a defect judgment standard and (second) shows a warning standard. If the improvement instruction is given by the warning standard shown in (2), in the soldering inspection ( It is possible to prevent defects such as bridges, gaps, and Manhattan shown in (1). Further, in the above description, the predetermined monitoring items of the equipment and the board for each of the three steps of the solder printing step, the component mounting step and the reflow step are detected, and the condition of each equipment and the quality of the board are analyzed based on the detection result. Although the operation control instruction is output to each of the three processes of the printing unit, the component mounting unit, and the reflow unit based on the branching result, any two of the three processes of the solder printing process, the component mounting process, and the reflow process are performed. A predetermined monitoring item may be detected for a process, and an operation control instruction may be output for any process required for defect factor analysis.

[0022]

However, in the configuration of the conventional system as described above, the equipment and the board are predeterminedly monitored for at least one of the printing means, the component mounting means and the reflow means in the mounting board production system of one line. The configuration is such that the information obtained from the items is analyzed, and the feedback control is performed for the equipment in the line based on that information. It is not possible to cope with the production form and equipment operation in which the above equipment group is produced multiple times.

For example, a certain mounting board production system uses a cream solder printing machine 4, a cream solder printing inspection machine 5, a component mounting machine 8, a component mounting post-inspection machine 9, a reflow process from the upper side along a circuit board transfer line. It is assumed that the furnace 12 and the solder inspection machine 13 are sequentially arranged. Considering the case where one board is produced with such a configuration, the cream solder printing machine 4, the cream solder printing inspection machine 5, the component mounting machine 8, the post-component mounting inspection machine 9, the reflow furnace 1
2. If the solder inspection machine 13 determines that the board that has been produced by going through the process of mounting components on the board 2 and the board is defective, the defective part is removed from the line and the defective part is repaired appropriately. There is a case where the solder inspecting machine 13 performs the inspection once again in order to inspect whether or not it is. The conventional system cannot cope with such an operation in board production.

For example, a cream solder printing machine 4, a cream solder printing inspection machine 5, a component mounting machine 8, a post-component mounting inspection machine 9, a reflow oven 12 and a substrate that has been produced by advancing the process of mounting components on the substrate When the solder inspecting machine 13 determines that the defect is detected, the solder inspecting device 13 removes the defect from the line and repairs the defective part. When it is performed, the inspection program in the second solder inspection machine 13 is often not appropriate with the inspection program used in the first solder inspection machine 13. For example, the first time is the soldering by the machine, but the soldering correction is performed by the person by the repair and the change of the solder shape occurs, and the inspection program must be changed. Because other parts (OR parts) that are the same as the originally mounted parts were mounted because the parts were destroyed during the repair of the location,
The inspection program must be changed because the shape and reflection characteristics of the parts are different. Furthermore, if the parts change,
The recommended land mask for soldering is different, so the inspection program must be changed. Further, since the solder used in the cream solder printing machine 4 and the solder used for repair are different, there are cases where the solder area and shape must be changed according to the solder characteristics, and the inspection program is dynamically changed. There must be. For such a first inspection program, at least one of the solder-bonded boards, the parts on each board, and the land / mask state data of each part, which was carried out in each process, is detected. However, dynamically changing the inspection program based on at least one of the information does not exist in the conventional mounting board production system, and causes various problems.

Further, in the case where the inspection means after the reflow is constituted only by the machine judging means by the machine like the conventional system, when the machine judging means gives an erroneous judgment result such as erroneous judgment, overjudgment or unjudgment. There was a problem that there existed.

The present invention solves the above-mentioned conventional problems. Even when a single board is produced, a production mode in which a specific one or more equipment groups in a mounting board production system are produced multiple times It is possible to cope with equipment operation, and in particular, the inspection means after reflow is divided into two parts, a machine determination means by a machine and an inspection determination means by a person. At least one of several pieces of information obtained by the means is fed back, the inspection program and the inspection algorithm in the machine determination means are dynamically controlled, and control is performed so as to produce a good product. By dynamically feeding back various kinds of information obtained dynamically to the inspection program and inspection algorithm in the machine judgment means, An object to provide a mounting board production system can be prevented an erroneous judgment in the goods determination.

In addition, the mounting board production system includes a cream solder printing machine 4, a cream solder printing inspection machine 5, a component mounting machine 8, a post-component mounting inspection machine 9 and a reflow furnace along the transfer line of the circuit board from the upper side. 12 Further solder inspection machine 13
In the soldering state of mechanical soldering produced by the configuration in which the are sequentially arranged, and in the soldering state after the defective portion is repaired manually by a person or the like, there is one Even for the same part at the same location, the soldering shape and other states change, and the inspection program and inspection algorithm in the machine determination means are dynamically controlled appropriately for those histories to make a fundamental good product determination. It is an object of the present invention to provide a mounting board production system capable of preventing erroneous determinations.

Further, in the case of inspecting and judging the soldering condition between the component and the board, the state cannot be recognized by a visual inspection machine or a visual inspection by a person, and therefore the judgment cannot be made. For example, an inspection machine that allows parts to be seen through is required. In such a case, there is a case in which the visual inspection by a person cannot be the final means for determining the non-defectiveness of the board. Feedback any information,
Unless the inspection program and inspection algorithm in the machine determination means are dynamically controlled to produce non-defective products, various defect determinations in high-density mounting cannot be appropriately performed, and the above-mentioned mounting board production The system is particularly effective.

Further, when the defective portion is repaired for the board judged defective by the solder inspecting machine 13 described above, the quality of the defective portion is color-displayed in real time so that it can be visually recognized. It is an object of the present invention to provide a mounting board production system that can prevent erroneous determinations in basic non-defective product determination by executing various repair instructions.

[0030]

In order to solve the above problems, the first means of the present invention is a printing means for printing solder on a land of a substrate, and a component at a predetermined position of the printed solder. Component mounting means to be mounted, reflow means for solder-bonding the land of the substrate on which the component is mounted and the terminal of the component, and whether the component is properly solder-bonded to the reflowed substrate at a predetermined position on the substrate A mounting board production system having an inspecting means for inspecting, comprising: a solder joint state detecting means for detecting at least one of the state data of the solder jointed boards; and a board obtained by the solder joint state detecting means. Of at least one of the inspection program and the inspection algorithm in the inspection means based on the information of at least one of the state data of Ete in which and a control means for controlling so as to good production.

A second means of the present invention is a printing means for printing solder on a land of a substrate, a component mounting means for mounting a component at a predetermined position of the printed solder, and the component for mounting. Reflow means for soldering the land of the board and the terminal of the component, and with respect to the reflowed board,
A mounting board production system having an inspection means for inspecting whether or not a component is correctly solder-bonded to a predetermined position on the board, wherein each solder-bonded substrate, each component on each substrate, and land / mask state data of each component A solder joint state detecting means for detecting at least one of the data, and an inspection program and an inspection in the inspecting means based on at least one of the information on the board state data obtained by the solder joint state detecting means. And a control means for dynamically changing at least one piece of information of the algorithm so as to produce a good product.

A third means of the present invention is a printing means for printing solder on a land of a board, a component mounting means for mounting a component on a predetermined position of the printed solder, and the component for mounting. Reflow means for soldering the land of the board and the terminal of the component, and with respect to the reflowed board,
A mounting board production system having an inspection means for inspecting whether a component is correctly solder-bonded to a predetermined position on a board, and a board repair means for repairing a component and lead judged as NG by the inspection means, Repair data detecting means for detecting at least one of the repair data when the board is repaired by the board repairing means, and at least one of the repair data of the board obtained by the repair data detecting means. In addition, the control means for dynamically changing at least one of the information of the inspection program and the inspection algorithm in the inspection means so as to produce a good product.

A fourth means of the present invention is a printing means for printing solder on a land of a board, a component mounting means for mounting a component on a predetermined position of the printed solder, and the component for mounting. Reflow means for soldering the land of the board and the terminal of the component, and with respect to the reflowed board,
A mounting board production system having an inspection means for inspecting whether a component is correctly solder-bonded to a predetermined position on a board, and a board repair means for repairing a component and lead judged to be NG by the inspection means, Repair data detecting means for detecting at least one of the repair data when the board is repaired by the board repair means, and at least one of the repair data of the board obtained by the repair data detecting means. In addition, the control means for dynamically changing at least one of the information of the inspection program and the inspection algorithm in the inspection means and re-inputting the information into the inspection means to produce a non-defective product.

Further, a fifth means of the present invention is a printing means for printing solder on the land of the substrate, a component mounting means for mounting a component at a predetermined position of the printed solder, and the component for mounting. Reflow means for soldering the land of the board and the terminal of the component, and with respect to the reflowed board,
A mechanical inspection means for inspecting whether or not a component is correctly solder-bonded to a predetermined position on a board, and the mechanical inspection means is NG.
A mounting board production system having a component determined to be erroneous, an erroneous determination by a mechanical determination for a lead, and an inspection determining unit that compensates for undetected, at least one of the inspection determination data of the substrate obtained by the inspection determining unit. Based on this information, control means is provided for dynamically changing at least one of the information of the inspection program and inspection algorithm in the machine inspection means so as to produce a good product.

A sixth means of the present invention is a printing means for printing solder on a land of a substrate, a component mounting means for mounting a component at a predetermined position of the printed solder, and the component mounting. Reflow means for soldering the land of the board and the terminal of the component, and with respect to the reflowed board,
A mechanical inspection means for inspecting whether or not a component is correctly solder-bonded to a predetermined position on a board, and the mechanical inspection means is NG.
Mounting having an inspection determination unit that compensates for an erroneous determination and a non-detection by a mechanical determination with respect to the component and the lead determined to be defective, and a board repair unit that repairs the component and the lead determined to be NG by the inspection determination unit A board production system capable of issuing a repair instruction to the board repair means in real time based on the inspection result information obtained by the machine inspection means and the inspection determination information obtained by the inspection determination means. is there.

Further, a seventh means of the present invention is a printing means for printing solder on a land of a substrate, a component mounting means for mounting a component at a predetermined position of the printed solder, and the component for mounting. A reflow means for solder-bonding a land of the board to a terminal of the component; a mechanical inspection means for inspecting whether the component is correctly solder-bonded to a predetermined position of the board with respect to the reflowed board; and the mechanical inspection means. A mounting board production system having a component judged as NG, an erroneous judgment due to a mechanical judgment for a lead, and an inspection judgment means for compensating for undetected parts, wherein the board is inspected by the machine inspection means and the inspection judgment means. Based on at least one of the determination data, at least one of the inspection program and the inspection algorithm in the machine inspection means is used. It is obtained by a control means for controlling so as to good production varied in manner.

The eighth means of the present invention is a printing means for printing solder on a land of a board, a component mounting means for mounting a component at a predetermined position of the printed solder, and the component mounting. Reflow means for soldering the land of the board and the terminal of the component, and with respect to the reflowed board,
A mechanical inspection means for inspecting whether or not a component is correctly solder-bonded to a predetermined position on a board, and the mechanical inspection means is NG.
Mounting including a component determined to be erroneous, an inspection determination unit that compensates for an erroneous determination and a non-detection by a mechanical determination, and a component repaired to the component and lead determined to be NG by the inspection determination unit A board production system, wherein a part determined to be NG by the inspection determination means,
When there is a lead, based on the inspection result information obtained by the mechanical inspection means and the inspection determination information obtained by the inspection determination means, for the substrate repaired by the substrate repair means, the mechanical inspection means and Through the inspection determination means, the previous machine inspection means obtained before the board is repaired by the board repair means with respect to the inspection result information obtained by the machine inspection means and the inspection judgment information obtained by the inspection judgment means. In the inspection result information and the inspection determination information obtained by the inspection determination means, the inspection result information obtained by the machine inspection means of this time obtained after the board is repaired by the board repairing means and the inspection determination means. Control means for dynamically changing at least one of an inspection program and an inspection algorithm in the machine inspection means based on the obtained inspection determination information so as to produce a good product; It includes those were.

Further, according to the ninth means of the present invention, the repair instruction to be given to the board repairing means in real time can be color-displayed so that the quality condition of the component and the lead can be seen at a glance. It is a thing. Further, a tenth means of the present invention is that the control means for controlling so as to produce a non-defective product controls the machine inspection means so as to improve the inspection accuracy, the accuracy determination rate, and the orthogonal rate to the next process / the next means. Is possible.

Further, the eleventh means of the present invention is that the control means for controlling to produce a non-defective product automatically determines the inspection program and the inspection algorithm from the state of the equipment in the board or the inspection means and other states. Is possible.

[0040]

According to the first means, in the mounting board production system having the printing means, the component mounting means, the reflow means, and the inspection means, at least one of the status data of the solder-bonded boards is stored. At least one of an inspection program and an inspection algorithm in the inspection means can be detected by the solder joint state detection means, and based on at least one of the board state data obtained by the solder joint state detection means. It is possible to control the quality of the product by dynamically changing that information, that is, to improve the inspection accuracy in the inspection device, the accuracy rate, and the orthogonality ratio to the next process / the next device. The generation of non-defective products is prevented and the quality of products is reduced. Solid Do reliability can be realized.

In the mounting board production system having the printing means, the component mounting means, the reflow means, and the inspection means for inspecting by the second means, each board soldered and the parts on each board , At least one of the land / mask state data of each component can be detected by the solder joint state detecting means, and at least one of the board state data obtained by the solder joint state detecting means. Based on the above, the inspection program and inspection algorithm in the inspection means are dynamically changed to produce a good product, that is, the inspection accuracy in the inspection means, the correctness determination rate, It is possible to control so as to improve the orthogonality ratio, which prevents the occurrence of defects from flowing to the next process / means. Rigidly reliability of the product quality is achieved with non-defective product is produced without waste.

In the mounting board production system having the printing means, the component mounting means, the reflow means, the inspection means, and the board repairing means by the third means,
It becomes possible to detect at least one of the repair data when applied to the board by the board repair means by the repair data detection means, and at least one of the repair data of the board obtained by the repair data detection means. Based on the information, at least one of the inspection program and the inspection algorithm in the inspection means is dynamically changed to produce a non-defective product, that is, the inspection accuracy in the inspection means, the correctness determination rate, the next process / the next means It is possible to control so as to improve the orthogonality ratio of, so that the occurrence of defects can be prevented from flowing to the next process and the next means, good products can be produced without waste, and solid reliability of product quality can be realized.

Further, in the mounting board production system having the printing means, the component mounting means, the reflow means, the inspection means, and the board repairing means by the fourth means,
It becomes possible to detect at least one of the repair data when applied to the board by the board repair means by the repair data detection means, and at least one of the repair data of the board obtained by the repair data detection means. On the basis of the information, at least one of the information of the inspection program and the inspection algorithm in the inspection means is dynamically changed, and the inspection means is supplied again to produce a good product.
That is, it becomes possible to control so as to improve the inspection accuracy in the inspection means, the correctness determination rate, and the orthogonality ratio to the next process / next device, and this prevents the occurrence of defects from flowing to the next process / next device. Good products are produced without waste, and solid reliability of product quality is realized.

In the mounted board production system having the printing means, the component mounting means, the reflow means, the machine inspection means, and the inspection determination means by the fifth means, the board obtained by the inspection determination means. Based on at least one of the inspection determination data, the information on at least one of the inspection program and the inspection algorithm in the machine inspection means is dynamically changed to produce a good product, that is, the inspection accuracy in the inspection means. It is possible to control so as to improve the correctness / incorrectness determination rate and the orthogonality rate to the next process / the next means, which prevents the occurrence of defects from flowing to the next process / the next means and produces good products without waste. At the same time, solid reliability of product quality is realized.

The printing means, the component mounting means, the reflow means, the machine inspection means, the inspection determination means, and the component and the lead determined to be NG by the inspection determination means by the sixth means. In a mounted board production system having a board repairing means for repairing by means of a repair, a real-time repair instruction is given to the board repairing means based on the inspection result information obtained by the machine inspection means and the inspection determination information obtained by the inspection determination means. By displaying and expressing the quality status of parts and leads in color, real-time repair instructions and real-time quality status of parts and leads on the board can be seen at a glance. As a result, it is possible to prevent forgetting to correct a defective portion, shorten the search time for which portion of the substrate is a defective portion, produce a good product without waste, and realize solid reliability of product quality.

Furthermore, in the mounting board production system having the printing means, the component mounting means, the reflow means, the machine inspection means, and the inspection determination means by the seventh means, the mechanical inspection means and the inspection determination are performed. Based on at least one piece of information of the board inspection judgment data obtained by the means, control is performed so as to dynamically change at least one piece of information of the inspection program and the inspection algorithm in the machine inspection means to produce a good product This makes it possible to prevent the occurrence of defects from flowing to the next process / next means, produce good products without waste, and realize solid reliability of product quality.

Further, with respect to the printing means, the component mounting means, the reflow means, the machine inspection means, the inspection determination means, and the component and the lead determined to be NG by the inspection determination means by the eighth means. In a mounted board production system having a board repairing means for repairing by means of the above, if there is a component or lead judged to be NG by the inspection judging means, the inspection result information obtained by the machine checking means and the inspection judging means are obtained. Based on the inspection judgment information, the board repaired by the board repair means is passed through the machine inspection means and the inspection judgment means again, and the inspection result information obtained by the machine inspection means and the inspection judgment means are used. Based on the obtained inspection determination information, the inspection result information obtained by the previous machine inspection means obtained before the substrate is repaired by the substrate repair means and the inspection result obtained by the inspection determination means. The machine inspection means is based on the judgment information, the inspection result information obtained by the machine inspection means this time obtained after the board is repaired by the board repair means, and the inspection judgment information obtained by the inspection judgment means. It is possible to control at least one of the inspection program and inspection algorithm in the above to dynamically change so that a good product can be produced. It is produced without waste and solid reliability of product quality is realized.

In addition, since the quality condition can be intuitively visually recognized by the ninth means, it is possible to prevent the erroneous judgment in the fundamental non-defective product judgment by giving an appropriate repair instruction. Further, the tenth means improves the inspection accuracy, the accuracy determination rate, and the orthogonal rate to the next process / next means in the machine inspection means.

Further, the eleventh means makes it possible to automatically determine the inspection program and the inspection algorithm, and it is possible to prevent the occurrence of defects from flowing to the next process / the next means, thereby ensuring good products without waste. In addition, it is produced efficiently, and solid reliability of product quality is realized.

[0050]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A mounting board production system according to an embodiment of the present invention will be described below with reference to the drawings. (Embodiment 1) FIG. 1 is a block diagram showing the configuration of a mounting board production system in an embodiment of the present invention.

As shown in FIG. 1, in this mounting board production system, the cream solder printing machine 21, the cream solder printing inspection machine 22, the component mounting machine 23, the components are arranged along the transfer line of the circuit board from the upper side. Post-installation inspection machine 24,
A reflow furnace 25 and a solder inspection machine 26 are sequentially arranged. In addition, the solder inspection machine 26 is a mechanical inspection 2
7 and the inspection judgment 28 by the person, the solder inspection machine 26 repairs 29 the board judged as NG (defective).
It is a structure that is washed away. Further, the mechanical inspection 27, the inspection determination 28, and the repair 29 are provided with state detection units 30, 31, and 32 for detecting various states of the board, respectively. Further, each of these devices is controlled by a control means (not shown).

The cream solder printing machine 21 prints cream solder on the land of an object to be printed such as a circuit board. The cream solder printing inspection machine 22 inspects the state of the board and the printing equipment, and also inspects the printing state of the cream solder printed by the cream solder printing machine 21.

Further, the component mounting machine 23 transfers the suction nozzle head to the component supply portion to which electronic components are supplied by the XY drive device, sucks the component by the suction nozzle head, and mounts the circuit board on the mounting position. Then, the parts are mounted so that the leads and electrodes are located on the cream solder printed on the land. At this time, mounting the components on the circuit board
The component recognition camera takes a picture of the component pick-up status and manages pick-up errors. The after-component mounting inspection machine 24 inspects the state of components and equipment mounted at predetermined positions on the circuit board by the component mounting machine 23.

Further, in the reflow furnace 25, conveyors for carrying a circuit board, which is an object to be heated, are arranged in the furnace body, heaters are arranged at the upper and lower positions of the conveyor, and fans are arranged at the upper and lower positions thereof. A hot air gas heated through a heater is blown onto the circuit board. Further, the inside of the reflow furnace 25 is divided into a preheating chamber, a reflow heating chamber, and a slow cooling chamber, and the heater and the fan are provided in each chamber. In the reflow heating chamber, the circuit board is evenly arranged. The components are soldered by reflowing the cream solder by heating.

The solder inspecting machine 26 inspects the soldering state of parts on the circuit board and the state of equipment. This solder inspection machine has a machine inspection 27 by a machine and an inspection judgment 28 by a person.
First, an inspection judgment 28 is performed by a person in order to confirm an erroneous judgment (over-detection, non-detection, erroneous error number / code judgment) with respect to the inspection result by the machine.
The inspection result is confirmed for each lead of each component, and the board judged to be NG (defective) is sent to the repair 29 for repair.

FIG. 2 is a flow chart showing a procedure for dynamically changing the inspection program by the control means of the mounting board production system according to the embodiment of the present invention. From the upper side of the line of FIG. 1, a cream solder printing machine 21, a cream solder printing inspection machine 22, a component mounting machine 23, a component mounting inspection machine 24,
In the mechanical inspection 27 of the reflow furnace 25 and the board that has been produced, first, the status detection unit 30 detects the solder-bonded boards, the parts on each board, and the land / mask status of each part ( Step # 1). Next, the inspection program in the mechanical inspection 27 is determined based on at least one of the information detected by the state detection unit 30 in step # 1 (step # 2). Next, based on the information, a mechanical inspection is started (judgment is started; step # 3), and at the same time as step # 3, each substrate soldered in parallel or sequentially, on each substrate The state and the state of the land mask of each component are detected by the state detection unit 30 (step # 4), and step # 4
The inspection program in the mechanical inspection 27 is dynamically changed based on at least one of the information detected by the state detecting unit 30 of No. 4 (step # 5). Therefore, the inspection program is changed in real time based on the information such as the solder-bonded boards obtained in step # 4, the parts on each board, and the state of the land / mask of each part. Then, the inspection determination 27 (step # 3) is performed.

After completion of the mechanical inspection 27,
It is determined whether or not there is an NG (defective part) (step # 6). If there is no NG (defective part), then a non-defective substrate is completed (step # 10). If there is an NG (defective part), then the inspection determination 28. And proceed.

In the inspection judgment 28, erroneous judgments (overdetection, non-detection, erroneous error number / code judgment) are confirmed with respect to the inspection result by the machine, and the inspection result is given to each component, each lead of each component, and the like. Determine. In addition, the state detection unit 31 detects the information of the determination confirmation / determination correction / determination addition performed in the inspection determination 28 in the state detection unit 31, and each solder-bonded board, the component on each substrate, and the land of each component.・
The state of the mask is registered and grasped (step # 7).

After completion of the inspection judgment 28,
It is determined whether or not there is an NG (defective part) (step # 8). If there is no NG (defective part), then a non-defective substrate is completed (step # 10). If there is an NG (defective part), then a repair 29 is performed. Run and repair.

In the repair 29, the NG (defective portion) is repaired, and the status detecting section 32 detects the information carried out in the repair 29 by the status detecting section 31. The components and the state of the land mask of each component are registered and known (step # 9).

The information obtained in steps # 7 and # 9 is fed back to step # 1 of the machine inspection 27. 3, FIG. 4, FIG. 6, FIG. 8, FIG. 10, FIG.
The format of the list and the semantics (meaning) of the definition method of the inspection program and the inspection module used in the above will be described with reference to FIG. This list is composed of four fields separated by comments and separators. Each field is No, (X, Y, θ), inspection module name, control code, and in each field, (OR ) And & (A
ND) logical description is performed. There are four control codes, nx = XXX: The line jumps to the XXX line after execution, and XXX
Move on to the execution of the line. ht: Exit after executing that line. sp: Do not execute the line, move on to the next line. nl: After executing that line, move on to the next line. Represents the meaning of. Based on such description, the inspection program and inspection module are defined.

Explaining FIG. 3 concretely, No = 1
The inspection program name with coordinates (X, Y, θ) = (10.000,20.000,120) is that P = use component shape inspection module and D = solder shape inspection module or X = land.
This means that the inspection module for each mask is used, and after execution of this line, the next line No = 2 is executed at nl. Further, No = 2 means that the coordinates (X, Y, θ) =
The inspection program name of (15.000,45.000,180) indicates that P = use the component shape inspection module, D = use the solder shape inspection module, and C = use the reflection characteristic inspection module. After executing this line, nl indicates that the next line No = 3 is executed. In addition, No = 3 means that the coordinates (X, Y, θ) = (0.000, 0.000,
The inspection program name of (0) indicates that P = inspection module for each component shape is used, and after execution of this line, nl indicates that the next line is executed.

As to what kind of inspection module is specifically used for the various inspection modules designated in FIG. 3, FIG. 4, FIG. 6, FIG. 8, FIG. 10, FIG. 14, the list format and the semantics are the same as in FIG.

Explaining the inspection module list by component shape in FIG. 4, No = 1 indicates the component shape code = parts.
The inspection module name of -A indicates that it is P001, and the control code defined next is n.
Since it is l, No = 2. In No = 2, the inspection module name of the part shape code = parts-A ′ is P.
No. 6 is defined as the control code nx = parts-B, and No = 6 is the part shape code = p.
The inspection module name of arts-B indicates that it is P005, and since the control code nx = parts-C is defined next, No = 3, and No = 3 is Since the control code is sp, the line is ignored (not defined), and the next definition is No = 4, where No = 4 is the part shape code = p.
The inspection module name of arts-D indicates that it is P003, and what is defined next is the control code ht. Therefore, the definition of the inspection module list for each component shape is completed. It means that.

FIG. 5 shows a component shape library for registering the component shape code in FIG. Explaining the solder shape inspection module list of FIG. 6, No = 1
The inspection module name of the solder shape code = tezuke1 indicates that it is D001, and what is defined next is No because the control code is nl.
= 2, and No = 2, solder shape code = tezuk
The inspection module name of e2 indicates that it is D002, and the next defined is the control code nx.
= Kikai1, so No = 4, and No
= 4 indicates that the inspection module name of the solder shape code = kikai1 is D004, and the next defined is the control code nl.
o = 5, and No = 5, solder shape code = kika
The inspection module name of i2 represents D005.

FIG. 7 is a solder shape library for registering the solder shape code in FIG. Explaining the inspection module list by component code in FIG. 8, No = 1
Is the inspection module name of the part code = pcode1,
It is A001, and the next defined is No = 2 because the control code is nl.
No = 2 indicates that the inspection module name of the part code = pcode2 is A002, and the next defined is the control code nl, so No = 3, and No. = 3 control code is sp, so that line is ignored (not defined), the next defined is No = 4, and No = 4 is the inspection module name of component code = pcode3 , A003
It means that.

FIG. 9 shows a component code library for registering the component codes in FIG. Explaining the solder characteristic inspection module list of FIG. 10, No = 1
The inspection module name of the solder characteristic code = tension1 indicates that it is W001, and what is defined next is No because the control code is nl.
= 2 and the control code for No = 2 is sp,
The line is ignored (not defined), and the next one defined is No = 3, which means that the inspection module name of the solder characteristic code = tension3 or nendo3 is W003. Since the control code nl is defined after that, N
o = 4, No = 4, solder characteristic code = tens
The inspection module name of ion3 and Taisan2 is
It is W004.

FIG. 11 is a solder characteristic library for registering the solder characteristic code in FIG. To describe the inspection module list for each reflection characteristic in FIG. 12, No =
1 indicates that the inspection module name of the reflection characteristic code = ref1 is C001, and what is defined next is No because the control code is nl.
= 2, and No = 2, reflection characteristic code = ref1 '
Indicates that the inspection module name of C002 is C002, and the next defined is the control code nl, so No = 3, and No = 3 is the inspection of the reflection characteristic code = ref2. The module name represents C004, and the second definition is No = 4 because the control code is nl, and No =
4 indicates that the inspection module name of the reflection characteristic code = ref5 is C002.

FIG. 13 is a reflection characteristic library for registering the reflection characteristic code in FIG. Explaining the land / mask-specific inspection module list of FIG. 14,
No = 1 indicates that the inspection module name of the land mask code = land1 is X001, and what is defined next is No = 2 because the control code is nl. No = 2 means that the inspection module name of the land mask code = mask2 is X002, and the next defined is
Since the control code is nl, No = 3, and No
= 3 control code is sp, so the line is ignored (not defined) and the next defined is No = 5
And No = 5, Land mask code = land
The inspection module name of 4 indicates that it is X006.

FIG. 15 shows a land mask library for registering the land mask code in FIG. Now, how the above inspection program is determined through the production of one board will be specifically described. In the production line shown in FIG. 1, the cream solder printing machine 2
1, a cream solder printing inspection machine 22, a component mounting machine 23, a component mounting inspection machine 24, a reflow oven 25, and a mechanical inspection 27 for a substrate produced through the process of mounting components on the substrate.
2 is detected according to the flow chart of FIG. 2, first, at least one of the solder-bonded substrate, each component on the substrate, and status data of solder, etc. is detected with respect to the flowing substrate (FIG. 2). Step # 1). Here, the coordinates on the substrate (X, Y, θ) = (10.000,20.000,12)
Consider that different components were mounted on (0), (15.000,45.000,180), and (0.000,0.000,0). Here, from FIG. 3, coordinates (X, Y, θ) = (10.000,20.000,12)
For the part 0), the inspection program name from the above description is that P = inspection module for each shape and D
It can be seen that it is described that == solder shape inspection module or X = land / mask inspection module is used.

Here, the coordinates (X, Y, θ) = (10.000,2)
(0.000,120) components, the state detection unit 30 uses the component shape library of FIG. 5, the solder shape library of FIG.
The component code library of FIG. 9, the solder characteristic library of FIG. 11, the reflection characteristic library of FIG. 13, the land of FIG.
Detects matching parts, solders, etc. from the mask library. For example, from the part shape library of FIG. 5, coordinates (X, Y, θ) = (10.000,20.0)
The part shape of (00,120) is found to be parts-A, and the coordinates (X,
Y, θ) = (10.000,20.000,120) solder shape is kik
It was found that ai1 was found, and the coordinates (X, Y, θ) = (10.000,20.000,12) from the land mask library of FIG.
If the land mask shape of (0) can be detected to be land4, the inspection program for the part is P001 & (D004, X006);
P001 is used as a component shape inspection module and D004 is used as a solder shape inspection module or X00 is used as a land / mask inspection module.
6 is used (step # 2 in FIG. 2). Here, in order to simplify the description, in the following, the coordinates (X,
Y, θ) = (10.000,20.000,120) inspection program is P
001 & D004 (P as a component shape inspection module
001 is used and D004 is used as the solder shape inspection module).

Hereinafter, the inspection program is determined by such a method for all parts for which the inspection program has not been determined. Coordinates (X, Y, θ) = (15.000,45.000,180),
Description of parts (0.000,0.000,0) is omitted.
The inspection is started after the determination of the inspection program for all the components is completed, and the state detection unit 30 is in the process of inspecting the component shape library of FIG. 5, the solder shape library of FIG.
The inspection program may be changed in real time by collating with the component code library of FIG. 11, the solder characteristic library of FIG. 11, the reflection characteristic library of FIG. 13, and the land mask library of FIG. 15 (step # 4 of FIG. 2). Further, even if one inspection program is determined for all the parts without waiting for the inspection start until the inspection program is determined, the inspection program can be determined while detecting the state. (Step # in Figure 2
5).

It is assumed that the inspection result of the mechanical inspection 27 shows that there are three mounted parts on the board, but only the part having the coordinate (15.000,45.000,180) has NG (step # 6 in FIG. 2). ). Consider also the case where it is determined in the inspection determination 28 that the inspection result of the mechanical inspection 27 does not include a situation such as an erroneous determination (steps # 7 and 8 in FIG. 2). Therefore, in repair 29, it is assumed that the part is repaired using a soldering iron or the like. The state is registered by the state detection unit 32 (step # 9 in FIG. 2). The repaired board is sent again to the mechanical inspection 27 to detect the state (step # 1 in FIG. 2). Here, the first machine inspection 27
The inspection program P001 & D004 (parts shape is parts-A, solder shape is kikai1; mechanical soldering shape) used in the above, but in repair 29, the part remains as it is and the soldering iron etc. The solder shape is changed from kikai1 to tezuke.
When the state detection unit 30 confirms that the inspection program has changed to 1, the inspection program is dynamically changed to P001 & D001. Further, in the case where the component is changed to the equivalent component in the repair 29, the component shape changes from parts-A to parts.
-A ', solder shapes from kikai1 to tezuke1
When the state detection unit 30 confirms that the inspection program has changed to, the inspection program is dynamically changed to P002 & D001.
That is, the current board state, component state, solder state, etc. are detected, and control is performed to dynamically change the inspection program that is most suitable for the current board state, component state, solder state, etc. .

According to the inspection program determining procedure as described above, a production form and equipment operation in which one board is produced through a plurality of specific one or more equipment groups in the mounting board production system of one line multiple times You will be able to respond. For example, the cream solder printing machine 21, the cream solder printing inspection machine 22, the component mounting machine 23, the component mounting inspection machine 24, the reflow oven 25, and the mechanical inspection 27 of the substrate that has been produced by the process of mounting the component on the substrate are performed. If the defectiveness is determined by the inspection and the inspection determination 28 is also determined as defective, the mechanical inspection 27 is performed again to check whether or not the defective portion is properly repaired after being removed from the line and repairing the defective portion. When the inspection is performed, the inspection program in the second machine inspection 27 is the first machine inspection 27.
There are many cases where the inspection program used in is not appropriate, but we can flexibly deal with such cases. For example, the first time is the soldering by the machine, but the repair 29 causes the soldering by the person to change the solder shape, and the inspection program must be changed. For reasons such as the destruction of parts during repair of the part,
Since another component (OR component) equivalent to the component originally mounted is mounted, the component shape and reflection characteristics are different, so the inspection program must be changed. Furthermore, if the parts change, the recommended land mask for soldering also changes, so the inspection program must be changed. Further, since the solder used in the cream solder printing machine 21 and the solder used in the repair 29 are different, it may be necessary to change the solder area or shape depending on the solder characteristics, and the inspection program is dynamically changed. There must be. It will be possible to flexibly deal with various problems as described above. (Embodiment 2) Hereinafter, a mounting board production system according to another embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a block diagram showing the configuration of a mounting board production system in an embodiment of the present invention. 1, in this mounting board production system, a cream solder printing machine 21, a cream solder printing inspection machine 22, and a component mounting machine 2 are arranged along the transfer line of the circuit board from the upper side.
3, a component mounting inspection machine 24, a reflow oven 25, and a solder inspection machine 26 are sequentially arranged. Also, the solder inspection machine 2
6 is a machine inspection 27 by a machine and an inspection judgment 28 by a person.
The solder inspecting device 26 determines that the board is NG (defective) and is sent to the repair 29.
Further, each of these devices is controlled by a control means (not shown).

FIG. 16 is a flow chart showing the procedure for recognizing the quality condition in real time in the inspection process according to the embodiment of the present invention. In the production line of FIG. 1, the board that has passed through the reflow furnace 25 is subjected to a mechanical inspection 27 (step # 11), and then it is determined whether or not there is an NG (defective part) (step # 12). If not, proceed to completion of non-defective substrate (step # 21), N
If G is present, quality log (positional deviation, quality status, etc.) information is registered (step # 13). Then NG
The quality status is color-displayed in a visible form with respect to the status of parts, NG leads, etc. (step # 14). afterwards,
In the inspection determination 28, confirmation / correction / addition and confirmation processing are performed on the inspection result of the machine inspection 27 (step #
15) After that, it is judged whether or not there is an NG (defective part) (step # 16), and if there is no NG, proceed to completion of a good product board (step # 21). If there is an NG, quality log (position shift, quality status). Etc.) register information (step #
17). After that, the quality status is color-displayed in a visible form with respect to the status of NG parts, NG leads, etc. (step # 18).

Then, it is determined whether or not there is an NG (defective part) (step # 19).
One part or one lead for the part is repaired (step # 20). After repairing one component or lead, the process returns to step # 11, step # 15, or step # 17 and is repeated.

FIG. 17 shows an example in which the quality of a certain substrate is color-displayed in a visible form. For example, yellow is
Parts or leads judged to be NG by the mechanical inspection 27, red parts or leads judged to be NG in the inspection judgment 28, and green parts are non-defective products by the mechanical inspection 27 and the inspection judgment 28 after being repaired by the repair 29. Supposing that the board is judged to be completed, the quality of the board can be visually observed in real time in each step.

A method of displaying the quality state of the substrate in a visible form in real time will be described with reference to FIGS. 18, 19 and 20. First, as shown in FIG. 18, the component 33 determined to be NG in the mechanical inspection 27 is first displayed in yellow. Next, as shown in FIG. 19, when the inspection determination 28 is determined to be NG and confirmed, the component 33 is displayed in red.
Here, if the result of the mechanical inspection 27 is an erroneous determination, FIG.
The part 33 is displayed in green as shown in FIG. After the repair 29, if the mechanical inspection 27 and the inspection determination 28 determine that the product is non-defective, the component 33 is displayed in green (FIG. 2).
0).

FIG. 21 is an example of a repair registration panel for registering the quality status in the inspection judgment 28. In particular, when the mechanical inspection 27 frequently causes over-detection (erroneously determines a normal portion to be NG), it is possible to collectively input the over-detection after confirmation / correction / addition processing of the NG portion.

As a result, based on the inspection result information obtained by the machine inspection means and the inspection determination information obtained by the inspection determination means, it becomes possible to give a real-time repair instruction to the board repair means, By displaying and expressing the quality status of the leads in color, real-time repair instructions, real-time parts on the board, and the quality status of the leads can be seen at a glance. As a result, it is possible to prevent forgetting to correct a defective portion, shorten the search time for which portion of the substrate is a defective portion, produce a good product without waste, and realize solid reliability of product quality.

FIG. 22 is a diagram of a substrate showing quality information analysis. Based on the preset failure rate, the quality status of the boards produced during the specified period is visibly displayed in the color of each failure rate. , Lower side, left side, right side).

As a result, it becomes possible to intuitively grasp the quality condition of the board produced during the specified period by color for each component, each lead, and each group of leads. The best strategy for eradication can be set in a short time. As a result, non-defective products are produced without waste and solid reliability of product quality is realized.

Even if not all the contents described in the inspection program shown in FIG. 3 are determined, the machine inspection means
Items that have not been determined or have not been detected,
Alternatively, the operation (inspection) can be performed by a method such as guessing or deleting an unregistered item. The same applies to the various module lists and libraries shown in FIGS. 4 to 15.

Needless to say, although the inspection program has been described so far, the same applies to the inspection algorithm.

[0086]

As described above, according to the present invention, the solder joint state detecting means for detecting at least one of the state data of the solder jointed boards and the board obtained by the solder joint state detecting means. Control means for dynamically changing at least any one of the inspection program and the inspection algorithm in the inspection means based on the information of at least one of the state data of 1. This makes it possible for at least one of the status data of the solder-bonded boards to be detected by the solder-bond status detecting means, and at least one of the status data of the boards obtained by the solder-bond status detecting means. Based on the information of at least one of the inspection program and inspection algorithm in the inspection means By dynamically changing, it is possible to control production so that good products can be produced, that is, the inspection accuracy in the inspection means, the correctness determination rate, and the orthogonal rate to the next process / next process can be improved.・
The flow to the next means is stopped, good products are produced without waste, and solid reliability of product quality is realized.

Further, a solder joint state detecting means for detecting at least one of the solder-bonded substrates, the components on each substrate, and the land / mask state data of each component, and the solder joint state detecting means. Control means for dynamically changing at least one of an inspection program and an inspection algorithm in the inspection means so as to produce a good product, based on at least one of the information of the substrate status data obtained by By providing and
At least one of the solder-bonded boards, the parts on each board, and the land / mask status data of each part can be detected by the solder-bonding status detecting means, and can be obtained by the solder-bonding status detecting means. Based on at least one of the information on the state of the printed circuit board, the information on at least one of the inspection program and the inspection algorithm in the inspection means is dynamically changed to produce a good product, that is, the inspection accuracy in the inspection means. It is possible to control so that the correctness determination rate and the orthogonal rate to the next process / next means can be improved.
The flow to the next means is stopped, good products are produced without waste, and solid reliability of product quality is realized.

Further, in a mounting board production system having a board repair means for repairing a component or lead judged to be NG by the inspection means, at least one of repair data when the board is repaired by the board repair means. Repair data detecting means for detecting the data of, and at least one of the inspection program and the inspection algorithm in the inspection means based on the information of at least one of the repair data of the board obtained by the repair data detecting means. By including the control means for dynamically changing the information and controlling so as to produce a good product, at least one of the repair data when the board is repaired by the board repair means can be detected by the repair data detection means. The repair data of the board obtained by the repair data detection means is less Also, based on any one of the information, at least one of the information of the inspection program and the inspection algorithm in the inspection means is dynamically changed to produce a good product, that is, the inspection accuracy in the inspection means, the accuracy determination rate,・ It is possible to control so that the orthogonality ratio to the next means can be improved, so that defects will occur in the next process.
The flow to the next means is stopped, good products are produced without waste, and solid reliability of product quality is realized.

Further, the mounting board production system has a board repairing means for repairing the components and leads judged to be NG by the inspecting means, and at least the repair data when the board is repaired by the board repairing means. At least one of an inspection program and an inspection algorithm in the inspection means, based on at least one of repair data detection means for detecting any data and repair data of the board obtained by the repair data detection means. At least any one of repair data when the board is repaired by the board repairing means by dynamically changing the information and controlling it so as to re-input to the inspecting means and produce a good product. Data can be detected by the repair data detecting means, and the data obtained by the repair data detecting means can be detected. Based on the information of at least one of the repair data, at least one of the inspection program and the inspection algorithm in the inspection means is dynamically changed, and the inspection means is input again to produce a good product, that is, It is possible to control so as to improve the inspection accuracy in the inspection means, the correctness determination rate, and the orthogonality ratio to the next process / next means, which prevents the occurrence of defects from flowing to the next process / next means. Is produced without waste and solid reliability of product quality is realized. In addition, the mounting board production system is provided with a machine inspection means as an inspection means, and an inspection determination means for compensating for an erroneous determination and a non-detection due to a mechanical determination with respect to a component determined to be NG by the mechanical inspection means. Then, based on the information of at least one of the inspection determination data of the board obtained by the inspection determination means, the information of at least one of the inspection program and the inspection algorithm in the mechanical inspection means is dynamically changed to be a non-defective product. At least one of the inspection program and the inspection algorithm in the machine inspection means is provided based on the information of at least one of the inspection determination data of the board obtained by the inspection determination means by including the control means for controlling the production. Dynamically changing any information to produce a good product, that is, the inspection precision in the inspection means. It is possible to control so as to improve the correctness / incorrectness determination rate and the orthogonality rate to the next process / the next means, which prevents the occurrence of defects from flowing to the next process / the next means and produces good products without waste. At the same time, solid reliability of product quality is realized.

Further, a machine inspection means is provided as an inspection means, and an inspection determination means for compensating an erroneous determination and a non-detection by a mechanical determination for a component and a lead determined to be NG by the mechanical inspection means, and the inspection determination means. In a mounting board production system having a component judged to be NG in the above and a board repairing means for repairing the lead, based on the inspection result information obtained by the machine inspection means and the inspection determination information obtained by the inspection determination means. In addition, by instructing the board repair means in real time, the board repair means is repaired in real time based on the inspection result information obtained by the machine inspection means and the inspection determination information obtained by the inspection determination means. It is possible to give instructions, and by displaying and expressing the quality status of parts and leads in color, real-time repair instructions and real-time Parts on the board, lead of quality state it is, as can be seen at a glance look at the eyes. As a result, it is possible to prevent forgetting to correct a defective portion, shorten the search time for which portion of the substrate is a defective portion, produce a good product without waste, and realize solid reliability of product quality.

Further, the mounting board production is provided with the machine inspection means as the inspection means, and the inspection determination means for compensating the erroneous determination by the mechanical determination and the non-detection for the parts determined to be NG by the mechanical inspection means and the leads. In the system, based on at least one piece of information of the board inspection determination data obtained by the machine inspection means and the inspection determination means, at least one of the inspection program and the inspection algorithm in the machine inspection means is used. The machine inspection is provided based on at least one of the machine inspection means and the board inspection determination data obtained by the inspection determination means by providing a control means for dynamically changing and controlling to produce a good product. The information of at least one of the inspection program and inspection algorithm in the method is dynamically changed. Te becomes possible to control so as to good production, thereby failure is robust reliability of the product quality is achieved with non-defective are stemmed to flow to the next step, the following means is produced without waste.

Further, a machine inspection means is provided as an inspection means, and an inspection determination means for compensating an erroneous determination and a non-detection by a mechanical determination for a component and a lead determined to be NG by the mechanical inspection means, and the inspection determination means In a mounting board production system having a component judged to be NG in the above and a board repairing means for repairing the lead, when there is a component and a lead judged to be NG in the inspection judging means, an inspection result by the machine inspection means Based on the information and the inspection determination information obtained by the inspection determination means, the board repaired by the board repair means is passed through the mechanical inspection means and the inspection determination means again, and the inspection obtained by the mechanical inspection means. The result information and the inspection judgment information obtained by the inspection judgment means are obtained by the previous machine inspection means obtained before the board is repaired by the board repair means. Inspection result information and inspection determination information obtained by the inspection determining means, inspection result information obtained by the machine inspection means of this time obtained after the board is repaired by the board repairing means, and inspection obtained by the inspection determining means By providing control means for dynamically changing at least one of information of an inspection program and an inspection algorithm in the machine inspection means based on the judgment information so as to produce a good product, the machine inspection means and the Based on information of at least one of the inspection determination data of the board obtained by the inspection determination means, dynamically change at least any one of the inspection program and the inspection algorithm in the machine inspection means to produce a good product. Can be controlled to prevent the occurrence of defects from flowing to the next process / next means and waste good products. Robust reliability of the product quality with the Ku production is realized.

As a real-time repair instruction to the board repairing means, the quality status can be intuitively visually confirmed by displaying the quality status of the parts and leads visually. It is possible to prevent the erroneous determination in the basic non-defective product determination by giving an appropriate repair instruction.

Further, by controlling so as to improve the inspection accuracy in the machine inspection means, the accuracy rate, and the orthogonality rate to the next process / next means, the occurrence of defects is prevented from flowing to the next process / next means. Good products are produced without waste, and solid reliability of product quality is realized.

Further, the control means automatically determines the inspection program and the inspection algorithm from the state of the equipment in the board or the inspection means and other states, so that the occurrence of defects can be prevented from flowing to the next process / the next means. Good products can be efficiently produced without waste and solid reliability of product quality can be realized.

[Brief description of drawings]

FIG. 1 is a block diagram showing a configuration of a mounting board production system according to an embodiment of the present invention.

FIG. 2 is a flowchart showing a procedure for dynamically changing an inspection program in the same mounting board production system.

FIG. 3 is a list showing the structure of the inspection program

[Fig. 4] Inspection module list for each shape of the inspection program

FIG. 5: Part shape library of the inspection program

FIG. 6 is a solder shape inspection module list of the inspection program.

FIG. 7: Solder shape library of the inspection program

FIG. 8: Inspection module list for each part code of the inspection program

FIG. 9: Part code library of the inspection program

FIG. 10: Inspection module list for each solder characteristic of the inspection program

FIG. 11: Solder characteristic library of the inspection program

FIG. 12: Inspection module list for each reflection characteristic of the inspection program

FIG. 13: Reflection characteristic library of the inspection program

[Fig. 14] Land / mask-based inspection module list of the inspection program

FIG. 15: Land mask library of the inspection program

FIG. 16 is a flowchart showing a procedure for recognizing a quality state in real time in an inspection process of a mounting board production system according to another embodiment of the present invention.

FIG. 17 is a schematic plan view of a board showing a quality status display state of the mounting board production system.

FIG. 18 is a schematic plan view of the board showing the quality status after mechanical inspection of the mounting board production system.

FIG. 19 is a schematic plan view of the board showing the quality status after the inspection determination of the mounting board production system.

FIG. 20 is a schematic plan view of a board showing a quality situation after repairing a part A in the same board manufacturing system.

FIG. 21 is a diagram of a repair registration panel for registering the quality status of the same mounting board production system.

FIG. 22 is a board diagram showing the quality information analysis of the mounting board production system.

FIG. 23 is a block diagram showing a configuration of a conventional mounting board production system.

FIG. 24 is a distribution chart showing each area including a warning area for the deviation amount of the inspection measurement value.

FIG. 25 is a print error inspection tabulation diagram by circuit number of an analysis example in a print data analysis unit of a conventional mounting board production system, and a display monitor diagram showing maintenance instruction contents of operation control instructions for the analysis example.

FIG. 26 is a time-series measurement diagram of a solder printing position deviation of an analysis example in a print data analysis unit of a conventional mounting board production system, and a display monitor diagram showing maintenance instruction content and feedback instruction content of operation control instructions for the analysis example.

FIG. 27 is an error aggregation diagram for each nozzle number of an analysis example in a component mounting data analysis unit of a conventional mounting board production system, and a display monitor diagram showing maintenance instruction contents of operation control instructions for the analysis example.

FIG. 28 is a time-series measurement diagram of component mounting position deviation of an analysis example in a component mounting data analysis unit of a conventional mounting board production system and a display monitor diagram showing maintenance instruction contents of operation control instructions for the analysis example.

FIG. 29 is a diagram of a soldering error inspection tabulation by circuit number of an analysis example in a soldering data analysis unit of a conventional mounting board production system, and a display monitor diagram showing maintenance instruction contents of operation control instructions for the analysis example.

FIG. 30 is a time-series measurement diagram of component position deviation after soldering of an analysis example in a soldering data analysis unit of a conventional mounting board production system, and a display monitor diagram showing maintenance instruction contents of operation control instructions for the analysis example.

FIG. 31 is a front view showing a state of chip standing failure.

FIG. 32 is a diagram for analyzing a general cause of chip standing failure.

FIG. 33 is a diagram of inspection measurement value distribution analysis of component mounting position deviation in the warning area and the NG area.

FIG. 34 is a diagram showing a correlation analysis between processes.

[Explanation of symbols]

 21 cream solder printing machine 22 cream solder printing inspection machine 23 mounting machine 24 post-component mounting inspection machine 25 reflow oven 26 solder inspection machine 27 machine inspection 28 inspection judgment 29 repair 30, 31, 32 state detection unit

Claims (11)

[Claims] 1. A printing means for printing solder on a land of a substrate, a component mounting means for mounting a component on a predetermined device of the printed solder, a land of the substrate on which the component is mounted, and a terminal of the component. A mounting board production system having a reflow means for solder-joining, and an inspection means for inspecting whether or not components are correctly solder-joined at a predetermined position of the board with respect to the reflowed board. Solder joint state detecting means for detecting at least one of the state data, and an inspection program for the inspecting means based on at least one of the state data of the board obtained by the solder joint state detecting means. ,
A mounting board production system, comprising: a control unit that dynamically changes at least one of the inspection algorithm information so as to produce a good product. 2. Solder joint state detecting means for detecting at least one of solder-bonded substrates, components on each substrate, and land / mask state data of each component, and the solder joint state detecting means. Control means for dynamically changing at least one of an inspection program and an inspection algorithm in the inspection means so as to produce a good product, based on at least one of the information of the substrate status data obtained by The mounting board production system according to claim 1, further comprising: 3. A mounting board production system having a board repair means for repairing a component or lead judged to be NG by the inspection means, wherein at least repair data when the board is repaired by the board repair means. At least one of an inspection program and an inspection algorithm in the inspection means based on at least one of repair data detection means for detecting any data and repair data of the board obtained by the repair data detection means. The mounting board production system according to claim 1, further comprising a control unit that dynamically changes the information to control the production of non-defective products. 4. A mounting board production system having a board repairing means for repairing a component and a lead judged to be NG by the inspecting means, wherein at least repair data when the board is repaired by the board repairing means. At least one of an inspection program and an inspection algorithm in the inspection means based on at least one of repair data detection means for detecting any data and repair data of the board obtained by the repair data detection means. 2. The mounting board production system according to claim 1, further comprising: a control unit that dynamically changes the information and inputs the information to the inspection unit again so as to produce a good product. 5. A machine inspection means is provided as the inspection means, and a component judged to be NG by the machine inspection means,
A mounting board production system having inspection judgment means for compensating for erroneous judgment due to mechanical judgment, undetected lead,
Based on the information of at least one of the inspection determination data of the board obtained by the inspection determination unit, at least one of the inspection program and the inspection algorithm in the mechanical inspection unit is dynamically changed to produce a good product. The mounting board production system according to claim 1, further comprising control means for controlling as described above. 6. A machine inspection means is provided as the inspection means, and a component judged as NG by the machine inspection means,
A mounting board production system comprising: an inspection judgment means for compensating for erroneous judgment and non-detection due to mechanical judgment for a lead; a component judged to be NG by the inspection judgment means, and a board repairing means for repairing the lead. The mounting board production system according to claim 1, wherein a repair instruction is issued to the board repair means in real time based on the inspection result information obtained by the machine inspection means and the inspection determination information obtained by the inspection determination means. 7. A machine inspection means is provided as the inspection means, and a component judged as NG by the machine inspection means,
A mounting board production system having inspection judgment means for compensating for erroneous judgment due to mechanical judgment, undetected lead,
Based on at least one information of the inspection determination data of the board obtained by the mechanical inspection means and the inspection determination means, the information of at least one of the inspection program and the inspection algorithm in the mechanical inspection means is dynamically set. The mounting board production system according to claim 1, further comprising control means for controlling so as to produce a non-defective product by changing it. 8. A machine inspection means is provided as an inspection means, and a component judged as NG by the machine inspection means,
A mounting board production system comprising: an inspection / judgment means for compensating for erroneous judgments and non-detection due to mechanical judgments on leads; When there is a component or lead that has been determined to be NG by the inspection determination means,
Based on the inspection result information obtained by the mechanical inspection means and the inspection determination information obtained by the inspection determination means, for the substrate repaired by the substrate repair means, again through the mechanical inspection means and the inspection determination means, For the inspection result information obtained by the mechanical inspection means and the inspection determination information obtained by the inspection determination means,
Before the board is repaired by the board repairing means, the inspection result information obtained by the previous machine inspection means and the inspection judgment information obtained by the inspection judging means, and after the board is repaired by the board repairing means Based on the inspection result information obtained by the machine inspection means and the inspection determination information obtained by the inspection determination means at this time, at least one of the inspection program and the inspection algorithm in the machine inspection means is dynamically changed. The mounting board production system according to claim 1, further comprising control means for controlling to produce a non-defective product in place of the above. 9. The repair instruction issued to the board repairing means in real time is displayed in a color so that the quality of the parts and leads can be visually recognized. Mounted board production system. 10. The control means for controlling to produce a non-defective product controls the machine inspection means so as to improve the inspection accuracy, the accuracy determination rate, and the orthogonal rate to the next process / next means. A mounting board production system according to claim 1. 11. The control means for controlling to produce a non-defective product automatically determines the inspection program and the inspection algorithm from the state of the equipment in the board or the inspection means and other states. Mounted board production system.