JPH08205352A - Cable shield copper tape grounding structure - Google Patents
Cable shield copper tape grounding structureInfo
- Publication number
- JPH08205352A JPH08205352A JP7031647A JP3164795A JPH08205352A JP H08205352 A JPH08205352 A JP H08205352A JP 7031647 A JP7031647 A JP 7031647A JP 3164795 A JP3164795 A JP 3164795A JP H08205352 A JPH08205352 A JP H08205352A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- copper tape
- cable
- small holes
- shielding copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 46
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 38
- 239000010949 copper Substances 0.000 title claims abstract description 38
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 46
- 229910000679 solder Inorganic materials 0.000 claims abstract description 35
- 229910052742 iron Inorganic materials 0.000 claims abstract description 23
- 238000005476 soldering Methods 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000012212 insulator Substances 0.000 abstract description 7
- 238000005491 wire drawing Methods 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Processing Of Terminals (AREA)
Abstract
(57)【要約】
【目的】 ケーブルの遮蔽銅テープの接地線を引き出す
際、接地線の締め付けや半田ごての熱によるケーブル絶
縁体などの変形を防止し、信頼性の高い接地線引き出し
構造を形成する。
【構成】 一端にリードテール４を、中間部に複数の小
孔５を、他端に掛け止め孔２を具えた接地板１をケーブ
ルの遮蔽銅テープ８に巻き付け、リードテール４を掛け
止め孔２に挿入する。この接地板１は、両面に半田が被
着されると共に、前記小孔５に半田が充填されており、
表面から半田ごてで過熱すると、小孔５の半田を介して
裏面の半田が素早く溶融され、接地板１を銅テープ上に
固定することができる。
(57) [Abstract] [Purpose] When pulling out the ground wire of the shielding copper tape of the cable, it is possible to prevent deformation of the cable insulator etc. due to tightening of the ground wire and heat of the soldering iron, and a highly reliable ground wire drawing structure. To form. [Structure] A grounding plate 1 having a lead tail 4 at one end, a plurality of small holes 5 at an intermediate portion, and a hooking hole 2 at the other end is wound around a shielding copper tape 8 of a cable to hook the lead tail 4 at the hooking hole Insert in 2. The ground plate 1 has solder on both sides, and the small holes 5 are filled with solder.
When the surface is overheated with a soldering iron, the solder on the back surface is quickly melted through the solder in the small holes 5, and the ground plate 1 can be fixed on the copper tape.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＣＶケーブルなどの接
続処理や端末処理において、遮蔽銅テープの接地部を引
き出す構造と同引き出し方法並びにこれらに用いる接地
板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for pulling out a grounding portion of a shielding copper tape, a method for pulling out the grounding portion, and a grounding plate used for these in connection processing and terminal processing of CV cables and the like.
【０００２】[0002]
【従来の技術】ケーブルの端末や接続部において、遮蔽
銅テープの接地線の引き出しを行う手順を図４に基づい
て説明する。同図はこの手順の説明図で、（Ａ）は斜視
図、（Ｂ）は断面図である。一般に、ケーブルは内周か
ら順に、導体20、内部半導電層21、絶縁体22、外部半導
電層23、遮蔽銅テープ24、ケーブルシース25で構成され
ている。接地線の引き出しは、まずケーブルシース25を
はぎ取り、遮蔽銅テープ24を露出して、同テープ上に接
地線となる錫メッキ軟銅線26を数回巻き付けるする。次
に、この銅線26をペンチなどでひねり止めし、銅線にペ
ーストを塗布する。その後、銅線26と銅テープ24の間
（Ａ図×印）に半田を沿わせ、そこに加熱した焼きごて
27（電気ごて）をあてがって半田を溶融し、錫メッキ軟
銅線26を銅テープ24上に固定する。2. Description of the Related Art A procedure for pulling out a ground wire of a shielding copper tape at a cable end or a connecting portion will be described with reference to FIG. This figure is an explanatory view of this procedure, (A) is a perspective view, and (B) is a sectional view. Generally, the cable is composed of a conductor 20, an inner semiconductive layer 21, an insulator 22, an outer semiconductive layer 23, a shielding copper tape 24, and a cable sheath 25 in order from the inner circumference. In order to pull out the ground wire, first, the cable sheath 25 is stripped off, the shielding copper tape 24 is exposed, and the tin-plated annealed copper wire 26 serving as the ground wire is wound around the tape several times. Next, the copper wire 26 is twisted and stopped with pliers, and the paste is applied to the copper wire. After that, solder is placed between the copper wire 26 and the copper tape 24 (marked with A in Fig. A), and the heated iron
27 (electric iron) is applied to melt the solder, and the tin-plated soft copper wire 26 is fixed on the copper tape 24.
【０００３】[0003]
【発明が解決しようとする課題】しかし、上記の技術で
は、錫メッキ軟銅線26を遮蔽銅テープ上にひねり止めす
る際、ペンチなどで強くひねるため、銅線26が外部半導
電層23や絶縁体22に食い込む。さらに、そこを半田ごて
で加熱するため、絶縁体が軟化して陥没したり、半導電
層23と絶縁体22が剥離して、絶縁不良の原因となってい
た。However, in the above technique, when the tin-plated annealed copper wire 26 is twisted and stopped on the shielding copper tape, it is strongly twisted with pliers or the like. Cut into body 22. Further, since it is heated by a soldering iron, the insulator is softened and dented, or the semiconductive layer 23 and the insulator 22 are peeled off, causing insulation failure.
【０００４】[0004]
【課題を解決するための手段】本発明は上記の課題を解
消するためになされたもので、その特徴は、一端にリー
ドテールを、中間部に複数の小孔を、他端に掛け止め孔
を具えた接地板をケーブルの遮蔽銅テープに巻き付け、
リードテールを掛け止め孔に挿入したケーブル遮蔽銅テ
ープの接地部引き出し構造であって、接地板は両面に半
田が被着されると共に、前記小孔に半田が充填されてお
り、この半田で遮蔽銅テープ上に固定したことにある。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems and is characterized by a lead tail at one end, a plurality of small holes at an intermediate portion, and a hook hole at the other end. Wrap the grounding plate with the cable around the shielding copper tape of the cable,
It is a grounding structure of the cable shielding copper tape with the lead tail inserted in the hooking hole, and the grounding plate is soldered on both sides and the small holes are filled with solder. It is fixed on copper tape.
【０００５】上記の接地板をケーブルの遮蔽銅テープ上
に巻き付け、リードテールを掛け止め孔に挿入し、接地
板表面から半田を加熱、溶融して接地板を遮蔽銅テープ
上に固定することにある。その際、ケーブルに巻き付け
られた接地板の表面に沿う湾曲状のこて先を具えた半田
ごてを用いることが好適である。さらに、半田ごては、
温度調整機構を具えることが好ましい。The above ground plate is wound around the shield copper tape of the cable, the lead tail is inserted into the hook hole, and the solder is heated and melted from the surface of the ground plate to fix the ground plate on the shield copper tape. is there. At that time, it is preferable to use a soldering iron having a curved iron tip along the surface of the ground plate wound around the cable. In addition, the soldering iron
It is preferable to include a temperature adjusting mechanism.
【０００６】[0006]
【実施例】以下、本発明の実施例を説明する。図１は本
発明に用いる接地板を示すもので、（Ａ）は平面図、
（Ｂ）は部分断面図、図２は本発明引き出し構造の説明
図である。図１に示すように、本発明に用いる接地板１
は、一端に掛け止め孔２を有する矩形部３と、矩形部３
の他端に連続する帯状のリードテール４を具えている。
この接地板１は、従来の接地部引き出し構造における銅
線に代わるもので、ケーブルの銅テープ上に巻き付け、
リードテール４を矩形部の掛け止め孔２に挿入して折り
返すことで半田付け前の位置決めを行う。本例では、厚
さ０．３ｍｍの銅板を用いた。Embodiments of the present invention will be described below. FIG. 1 shows a ground plate used in the present invention, (A) is a plan view,
FIG. 2B is a partial cross-sectional view, and FIG. 2 is an explanatory view of the drawer structure of the present invention. As shown in FIG. 1, a ground plate 1 used in the present invention.
Is a rectangular portion 3 having a hook hole 2 at one end, and a rectangular portion 3
A continuous strip-shaped lead tail 4 is provided at the other end.
This ground plate 1 is an alternative to the copper wire in the conventional grounding part drawing structure, and is wound on the copper tape of the cable.
Positioning before soldering is performed by inserting the lead tail 4 into the hooking hole 2 of the rectangular portion and folding it back. In this example, a copper plate having a thickness of 0.3 mm was used.
【０００７】矩形部３には、ほぼ全体に複数の小孔５が
分散配置され、両面に半田６が被着されていると共に、
小孔５には半田６が充填されている。接地板１を銅テー
プ上に半田付けする際、矩形部３の表面側から加熱する
が、その熱は、表面の半田、小孔中の半田、裏面の半田
と順次伝導して、素早く裏面の半田を溶融させる。小孔
５の形状は特に限定されないが、その配置は、接地板の
広い範囲にわたって半田を素早く溶融できるよう、矩形
部３に分散されていることが望ましい。なお、小孔５の
直径は、１．０〜１．５ｍｍ程度が好適である。また、
半田６の厚みＴは、接地板１を銅テープ上に固定できれ
ばよく、５０μｍ程度が好適である。さらに、矩形部３
の幅（ケーブルに巻回した際、軸方向に沿う辺）は、遮
蔽銅テープとの接触面積をとる必要上、ケーブルの直径
以上とすることが好ましく、長さは遮蔽銅テープ層の外
周を２／３以上覆う程度が好適である。In the rectangular portion 3, a plurality of small holes 5 are dispersed and arranged almost entirely, and solder 6 is adhered on both sides thereof.
The small holes 5 are filled with solder 6. When the ground plate 1 is soldered onto the copper tape, it is heated from the front surface side of the rectangular portion 3, but the heat is sequentially conducted to the front surface solder, the solder in the small holes, and the rear surface solder, and the rear surface is quickly transferred. Melt the solder. The shape of the small holes 5 is not particularly limited, but the arrangement is preferably distributed in the rectangular portions 3 so that the solder can be quickly melted over a wide area of the ground plate. The diameter of the small holes 5 is preferably about 1.0 to 1.5 mm. Also,
The thickness T of the solder 6 is sufficient if the ground plate 1 can be fixed on the copper tape, and is preferably about 50 μm. Furthermore, the rectangular portion 3
The width (side along the axial direction when wound around the cable) is preferably greater than or equal to the diameter of the cable in order to take the contact area with the shielding copper tape, and the length is the outer circumference of the shielding copper tape layer. It is preferable that it covers 2/3 or more.
【０００８】このような接地板１の取り付け手順を図２
に基づいて説明する。まず、ケーブルシース７をはぎ取
って遮蔽銅テープ層８を露出し、その上に前記接地板１
を巻き付ける。次に、リードテール４を掛け止め孔２の
裏面側から表面側に挿入し、これを引き出して接地板１
を銅テープ８に密着させる。その状態でリードテール４
を折り返して接地板１が容易にずれないよう位置決め
し、接地板１の表面から半田ごてをあてがう。The procedure for attaching the ground plate 1 is shown in FIG.
It will be described based on. First, the cable sheath 7 is stripped off to expose the shielding copper tape layer 8, and the ground plate 1 is placed thereon.
Wrap around. Next, the lead tail 4 is inserted from the back surface side of the hook hole 2 to the front surface side, and is pulled out to pull out the ground plate 1.
Is closely attached to the copper tape 8. Lead tail 4 in that state
The grounding plate 1 is folded back and positioned so as not to be easily displaced, and a soldering iron is applied from the surface of the grounding plate 1.
【０００９】ここで用いる半田ごてを図３に示す。図示
のように、半田ごて９のこて先10は巻き付けられた接地
板１の円筒面に沿うような湾曲形状をしている。接地板
を巻き付けたケーブルの外径をＤとすると、こて先10の
湾曲面の曲率半径はＤ／２以上とし、外径がＤ以下の種
々のサイズのケーブルに対応できるよう構成することが
好ましい。また、湾曲面の長さは、ケーブルに巻き付け
た接地板の外周を半周以上覆うようにすることが好まし
い。こて先をこのような構成とすれば、あてがった半田
ごてをケーブル周方向と軸方向にスライドすることで広
範囲の半田を溶融でき、効率的な半田付けを行うことが
できる。特に、３心ケーブルなどの場合、各心線が近接
しており、こて先を各ケーブルの全周にあてがうことが
できないため、こて先湾曲面の長さを大きくとっておく
ことが望ましい。そして、こて先には温度センサ11が設
けられている。このセンサコード12はデジタル調温器
（図示せず）に接続されて、こて先10の温度を所定温度
に保持できるよう構成されている。The soldering iron used here is shown in FIG. As shown in the figure, the tip 10 of the soldering iron 9 has a curved shape that follows the cylindrical surface of the wound ground plate 1. Assuming that the outer diameter of the cable around which the ground plate is wound is D, the radius of curvature of the curved surface of the tip 10 is D / 2 or more, and the outer diameter can be configured to be compatible with cables of various sizes of D or less. preferable. Moreover, it is preferable that the length of the curved surface covers the outer circumference of the ground plate wound around the cable by half or more. If the tip has such a structure, a wide range of solder can be melted by sliding the applied soldering iron in the cable circumferential direction and the axial direction, and efficient soldering can be performed. In particular, in the case of a three-core cable or the like, since the core wires are close to each other and the tip cannot be applied to the entire circumference of each cable, it is desirable to keep the length of the curved surface of the tip large. . A temperature sensor 11 is provided at the tip of the iron. The sensor cord 12 is connected to a digital temperature controller (not shown) so that the temperature of the tip 10 can be maintained at a predetermined temperature.
【００１０】このような半田ごて９により接地板１の半
田を加熱すると、まず表面の半田が、続いて小孔５の半
田が、そして裏面の半田が順次溶融して、接地板１は銅
テープ上に半田付けされる。そして、リードテール４を
接地線として利用すればよい。従来、半田付け時の熱や
銅線の締付による悪影響を抑制するには、半田ごての加
熱温度や銅線をひねり止めする強度など、作業者の熟練
度に左右される点が多かった。以上の実施例ではこのよ
うな点が全て解消されており、信頼性の高い接地部引き
出し構造を形成することができる。When the solder of the ground plate 1 is heated by such a soldering iron 9, first the solder on the front surface, the solder on the small holes 5 and then the solder on the back surface are sequentially melted, and the ground plate 1 is made of copper. Solder on tape. Then, the lead tail 4 may be used as a ground wire. In the past, in order to suppress the adverse effects of heat during soldering and tightening of copper wires, there were many points that depended on the skill level of the operator, such as the heating temperature of the soldering iron and the strength of twisting the copper wires. . In the above embodiment, all of these points are eliminated, and it is possible to form a highly reliable grounding portion drawing structure.
【００１１】[0011]
【発明の効果】以上説明したように、本発明によれば、
次の効果を奏することができる。 接地板をケーブルに巻き付ける構造としているため、
銅テープや絶縁体が締め付けられて変形することもな
く、両者の剥離を防止できる。それに伴い、絶縁破壊を
抑制でき、長期にわたって信頼性の高いケーブル端末
（接続）部を形成することができる。 温度センサ付きの半田ごてを用いることで、こて先温
度が一定に維持されるため、作業者の巧拙にかかわら
ず、一定した半田付け作業を行うことができる。また、
極端な過熱を防止できるため、絶縁体の変形も防止でき
る。 多数の小孔を有する接地板の両面および小孔中に半田
を付着させたことで、接地板の表面から加熱して裏面の
半田を素早く溶融することができ、効率的な半田付けを
行うことができる。 特に、こて先の形状がケーブルに巻き付けられた接地板
の表面に沿う湾曲状のものを用いることで、１回の作業
で広い面積にわたって半田付けを行うことができる。As described above, according to the present invention,
The following effects can be achieved. Since it has a structure in which the ground plate is wrapped around the cable,
It is possible to prevent the copper tape and the insulator from being separated from each other without being clamped and deformed. Along with this, it is possible to suppress dielectric breakdown and form a highly reliable cable terminal (connection) portion for a long period of time. By using a soldering iron with a temperature sensor, the temperature of the tip is kept constant, so that a constant soldering work can be performed regardless of the skill of the operator. Also,
Since excessive overheating can be prevented, deformation of the insulator can also be prevented. By attaching the solder to both sides of the grounding plate with many small holes and to the inside of the small holes, it is possible to heat from the surface of the grounding plate and quickly melt the solder on the back side, and to perform efficient soldering. You can In particular, by using a tip having a curved shape along the surface of the ground plate wound around the cable, it is possible to perform soldering over a wide area in one operation.
【図１】本発明に用いる接地板を示すもので、（Ａ）は
平面図、（Ｂ）は部分断面図である。FIG. 1 shows a ground plate used in the present invention, (A) is a plan view, and (B) is a partial cross-sectional view.
【図２】本発明接地部引き出し構造の説明図である。FIG. 2 is an explanatory view of a grounding portion drawing structure of the present invention.
【図３】本発明方法に用いる半田ごての側面図である。FIG. 3 is a side view of a soldering iron used in the method of the present invention.
【図４】従来の接地線引き出し構造を説明するもので、
（Ａ）は斜視図、（Ｂ）は断面図である。FIG. 4 is a view for explaining a conventional ground wire drawing structure,
(A) is a perspective view and (B) is a sectional view.
１ 接地板 ２ 掛け止め孔 ３ 矩形部 ４ リード
テール ５ 小孔 ６ 半田 ７ ケーブルシース ８ 遮蔽銅テープ層
９ 半田ごて 10 こて先 11 温度センサ 12 センサコード 20
導体 21 内部半導電層 22 絶縁体 23 外部半導電層 24
遮蔽銅テープ 25 ケーブルシース 26 錫メッキ軟銅線 27 焼きご
て1 Grounding Plate 2 Hooking Hole 3 Rectangular Part 4 Lead Tail 5 Small Hole 6 Solder 7 Cable Sheath 8 Shielding Copper Tape Layer
9 Soldering iron 10 Iron tip 11 Temperature sensor 12 Sensor code 20
Conductor 21 Inner semiconductive layer 22 Insulator 23 Outer semiconductive layer 24
Shielding copper tape 25 Cable sheath 26 Tinned annealed copper wire 27 Hot iron
Claims (5)
小孔を、他端に掛け止め孔を具えた接地板をケーブルの
遮蔽銅テープに巻き付け、リードテールを掛け止め孔に
挿入したケーブル遮蔽銅テープの接地部引き出し構造で
あって、 前記接地板は、両面に半田が被着されると共に、前記小
孔に半田が充填されており、 前記半田で遮蔽銅テープ上に固定されていることを特徴
とするケーブル遮蔽銅テープの接地部引き出し構造。1. A cable in which a lead tail is inserted at one end, a plurality of small holes are formed at an intermediate portion, and a grounding plate having a hook hole at the other end is wrapped around a shielding copper tape of the cable, and the lead tail is inserted into the hook hole. In the grounding part lead-out structure of the shielding copper tape, the grounding plate has solder on both sides thereof, the small holes are filled with solder, and is fixed on the shielding copper tape by the solder. The grounding structure for the cable shielding copper tape, which is characterized in that
孔を、他端に掛け止め孔を具え、 両面に半田が被着されると共に、前記小孔に半田が充填
された接地板を、 ケーブルの遮蔽銅テープ上に巻き付け、リードテールを
掛け止め孔に挿入し、 接地板表面から半田を加熱、溶融して接地板を遮蔽銅テ
ープ上に固定するケーブル遮蔽銅テープの接地部引き出
し方法。2. A lead tail is provided at one end, a plurality of small holes are provided in the middle, and a stop hole is provided at the other end. Solder is attached to both surfaces, and a ground plate having the small holes filled with solder is provided. , Wrap it around the shielding copper tape of the cable, insert the lead tail into the retaining hole, heat and melt the solder from the surface of the ground plate to fix the ground plate onto the shielding copper tape. .
が、ケーブルに巻き付けられた接地板の表面に沿う湾曲
状のこて先を具えることを特徴とする請求項２記載のケ
ーブル遮蔽銅テープの接地部引き出し方法。3. The cable shield according to claim 2, wherein the soldering iron used when the solder is heated and melted comprises a curved iron tip extending along the surface of the ground plate wound around the cable. How to pull out the grounding part of copper tape.
が、温度調整機構を具えることを特徴とする請求項２ま
たは３記載のケーブル遮蔽銅テープの接地部引き出し方
法。4. The method for drawing out a ground portion of a cable shielding copper tape according to claim 2, wherein the soldering iron used for heating and melting the solder has a temperature adjusting mechanism.
小孔を、他端にリードテールの掛け止め孔を具え、両面
に半田が被着されると共に、前記小孔に半田が充填され
たことを特徴とする接地板。5. A lead tail is provided at one end, a plurality of small holes are provided at an intermediate portion, and a lead tail hooking hole is provided at the other end. Solder is attached to both surfaces and the small holes are filled with solder. A grounding plate characterized by that.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7031647A JPH08205352A (en) | 1995-01-27 | 1995-01-27 | Cable shield copper tape grounding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7031647A JPH08205352A (en) | 1995-01-27 | 1995-01-27 | Cable shield copper tape grounding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08205352A true JPH08205352A (en) | 1996-08-09 |
Family
ID=12336984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7031647A Pending JPH08205352A (en) | 1995-01-27 | 1995-01-27 | Cable shield copper tape grounding structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08205352A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110768029A (en) * | 2019-10-23 | 2020-02-07 | 芜湖造船厂有限公司 | Electromagnetic shielding device and using method thereof |
-
1995
- 1995-01-27 JP JP7031647A patent/JPH08205352A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110768029A (en) * | 2019-10-23 | 2020-02-07 | 芜湖造船厂有限公司 | Electromagnetic shielding device and using method thereof |
| CN110768029B (en) * | 2019-10-23 | 2021-06-29 | 芜湖造船厂有限公司 | Electromagnetic shielding device and using method thereof |
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