JPH08215648A - Descending flow-straightening type immersion cleaning device - Google Patents

Descending flow-straightening type immersion cleaning device

Info

Publication number
JPH08215648A
JPH08215648A JP2902995A JP2902995A JPH08215648A JP H08215648 A JPH08215648 A JP H08215648A JP 2902995 A JP2902995 A JP 2902995A JP 2902995 A JP2902995 A JP 2902995A JP H08215648 A JPH08215648 A JP H08215648A
Authority
JP
Japan
Prior art keywords
tank
cleaning
cleaning liquid
liquid
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2902995A
Other languages
Japanese (ja)
Other versions
JP3538470B2 (en
Inventor
Yutaka Hiratsuka
豊 平塚
Nobuyuki Fujikawa
伸之 藤川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DAN KAGAKU KK
Original Assignee
DAN KAGAKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DAN KAGAKU KK filed Critical DAN KAGAKU KK
Priority to JP02902995A priority Critical patent/JP3538470B2/en
Publication of JPH08215648A publication Critical patent/JPH08215648A/en
Application granted granted Critical
Publication of JP3538470B2 publication Critical patent/JP3538470B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE: To perform a minute cleaning in which cleanness is high in a short time by a small amount of cleaning water by forming the overflow part of cleaning liquid on one wall surface of an outer tank and attaching the liquid level controlling means of cleaning liquid on the inside wall except the overflow part and connecting a plurality of flow parts in which flow rate is different to the pouring port of cleaning liquid. CONSTITUTION: In a double tank consisting of an inner tank 1 and an outer tank 2 surrounding it, an overflow part 3 is formed by setting up the upper edge of one wall surface of the outer tank 2 lower than the other wall surface. Further, an overflow tank 4 is installed in the outside of the overflow part 3. Furthermore, a plurality of pouring ports 6 of cleaning liquid are arranged in the base of a clearance formed between the inner tank 1 and the outer tank 2. On one side, a discharge port 9 for discharging polluted cleaning liquid is formed in the bottom of the inner tank 1. By the way, the respectiv flow paths A, B consisting of stop valves V6, V7, needle valves V8, V9 for controlling each flow rate, flow meters M1, M2 and filters F1, F2 are connected to the respective pouring ports 6 through the respective stop valves V1-V4. Flow rate of the respective flow paths A, B is controlled respectively according to a liquid level.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、洗浄槽の液表面の浮遊
粒子を除去し、供給液の流量変動に対する液面制御が可
能な下降整流式の浸漬洗浄装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a descending rectification type immersion cleaning apparatus capable of removing suspended particles on the liquid surface of a cleaning tank and controlling the liquid surface against fluctuations in the flow rate of the supplied liquid.

【0002】[0002]

【従来の技術】半導体ウエハや液晶用ガラス基板の洗浄
は、従来から被洗浄物を洗浄液中に浸漬して洗浄する浸
漬化学洗浄を主として行っている。洗浄は、洗浄薬液中
で処理して被洗浄物に付着した汚れを除去する工程と、
処理後の被洗浄物に残存付着している洗浄薬液を純水で
すすぐ工程と、すすぎ後の被洗浄物を乾燥する工程とか
らなっている。
2. Description of the Related Art Conventionally, the cleaning of semiconductor wafers and glass substrates for liquid crystals has mainly been carried out by immersion chemical cleaning in which an object to be cleaned is immersed in a cleaning liquid for cleaning. Cleaning is a step of removing stains adhering to the object to be cleaned by treating it in a cleaning chemical solution,
It comprises a step of rinsing the cleaning chemical liquid remaining on the cleaned object after the treatment with pure water and a step of drying the cleaned object after the rinsing.

【0003】洗浄薬液による浸漬洗浄の場合には、被洗
浄物から遊離した汚染粒子が洗浄液中に分散し、被洗浄
物の数が増大すると洗浄槽内に蓄積される汚染粒子の濃
度が高くなり、洗浄済の被洗浄物に対して上記粒子によ
る再汚染が生じるという問題があり、洗浄槽内の洗浄液
の一部を連続的に抜き出して濾過器を通し、分散する汚
染粒子を除いたのち再び元の槽に戻す、いわゆる循環濾
過を行うことが不可欠になっている。このように洗浄槽
から洗浄液を抜き出して再び洗浄槽に戻す方法には、従
来からオーバーフロー方式の洗浄槽が用いられていた。
In the case of immersion cleaning with a cleaning chemical, the contaminant particles liberated from the object to be cleaned are dispersed in the cleaning solution, and if the number of objects to be cleaned increases, the concentration of the contaminant particles accumulated in the cleaning tank increases and There is a problem that re-contamination of the cleaned object with the above particles occurs, a portion of the cleaning liquid in the cleaning tank is continuously withdrawn and passed through a filter to remove dispersed contaminating particles, and then the original again. It is indispensable to carry out so-called circulation filtration, which is returned to the tank. As described above, the overflow type cleaning tank has been conventionally used for the method of extracting the cleaning liquid from the cleaning tank and returning it to the cleaning tank again.

【0004】一方、すすぎを行う純水リンスの場合に
は、リンス槽の下部から新鮮な純水を連続的に供給し、
リンス槽の上端の周縁部を越えて純水を槽外に溢流さ
せ、洗浄槽から引き上げた被洗浄物に付着して洗浄液が
混入しても、リンス槽内の純水の水質が供給純水の水質
と一致するまで続けるという方法が行われている。
On the other hand, in the case of pure water rinsing for rinsing, fresh pure water is continuously supplied from the lower part of the rinse tank,
Even if the cleaning liquid is mixed with the cleaning liquid that has overflowed from the top of the rinse tank and overflowed from the rinse tank to the outside of the rinse tank, the water quality of the pure water in the rinse tank is supplied. The practice is to continue until the quality of the water matches.

【0005】洗浄液の循環濾過の場合も純水リンスの場
合も、洗浄槽やリンス槽に持ち込まれた薬液成分や汚れ
を短時間で完全に排出する能力が高い程、すなわち排出
置換効率が高い程、浸漬洗浄の高洗浄品質を短時間で経
済的に得ることができる。しかしながら、従来の浸漬洗
浄用の槽は、槽の底側から洗浄液または純水を供給し、
槽の上端から溢流させるオーバーフロー方式がもっぱら
用いられている。
In both cases of circulating filtration of the cleaning liquid and rinsing with pure water, the higher the ability to completely discharge the chemical liquid components and dirt brought into the cleaning tank or the rinse tank in a short time, that is, the higher the discharge displacement efficiency is. The high cleaning quality of immersion cleaning can be obtained economically in a short time. However, the conventional immersion cleaning bath supplies cleaning liquid or pure water from the bottom side of the bath,
The overflow method, which overflows from the upper end of the tank, is mainly used.

【0006】比較的狭い間隔で多数配置されたウエハや
基板等の被洗浄物を洗浄するために、オーバーフロー洗
浄を行っている洗浄槽内の水流を可視化して観察する
と、図6(a)に示すように洗浄槽11の底部から供給
され、(b)に示すすのこ状の被洗浄物支持板12を通
過した洗浄液は、被洗浄物間の狭い間隙は通らずに、被
洗浄物13の周囲と槽内壁との間の広い領域を主に流れ
て上昇する。そして、槽の上縁より溢出するが、上昇流
の一部は液表面に沿って槽の中心方向に移動し、さらに
被洗浄物13の上部からウエハや基板等が作る狭い隙間
を通るゆるやかな下降流に変化する。このゆるやかな下
降流は被洗浄物の下部で供給液の上昇流に誘引され混合
する。すなわち、洗浄槽内には槽の壁側から槽の中心に
向う循環流を生じるが、この循環流はつぎの2点で重要
である。
FIG. 6A shows a visual observation of a water flow in a cleaning tank in which overflow cleaning is performed in order to clean an object to be cleaned such as wafers and substrates arranged at relatively narrow intervals. The cleaning liquid supplied from the bottom of the cleaning tank 11 as shown in FIG. 3B and passed through the saw-toothed cleaning object support plate 12 shown in (b) does not pass through the narrow gaps between the cleaning objects, but around the cleaning object 13. Flows mainly in a wide area between the inner wall of the tank and the inner wall of the tank. Then, although it overflows from the upper edge of the tank, part of the upward flow moves toward the center of the tank along the liquid surface, and further passes through the narrow gap created by the wafer, substrate, etc. from the upper portion of the object to be cleaned 13. It changes to a downward flow. This gentle downward flow is attracted to and mixed with the upward flow of the supply liquid in the lower part of the object to be cleaned. That is, a circulating flow is generated in the cleaning tank from the wall side of the tank toward the center of the tank. This circulating flow is important in the following two points.

【0007】その1は、ウエハや基板のような被洗浄物
をバッチ処理する場合に、被洗浄物の表面における洗浄
液の流れが供給液の流量の大きさに比して非常に遅くな
り、被洗浄物表面からの汚染物の離脱作用および離脱汚
染の被洗浄物近傍から排除する作用が十分に発揮され
ず、供給される洗浄液の大部分は洗浄作用に貢献せずに
流出することになる。またその2は、被洗浄物から離脱
した汚染物が、洗浄槽内の循環流に乗り長時間滞留す
る。そのため、洗浄後の清浄な被洗浄物が再び汚染さ
れ、完全に洗浄されるまでには著しく長時間を要するこ
とになる。
The first problem is that when an object to be cleaned such as a wafer or a substrate is batch-processed, the flow of the cleaning liquid on the surface of the object to be cleaned becomes very slow as compared with the magnitude of the flow rate of the supply liquid. The action of removing the contaminants from the surface of the wash-target and the action of removing the detached contaminants from the vicinity of the wash-target are not sufficiently exerted, and most of the supplied cleaning liquid flows out without contributing to the cleaning action. Further, in No. 2, the contaminants separated from the object to be cleaned stay in the cleaning tank for a long time on the circulating flow. Therefore, the clean object to be cleaned after the cleaning is contaminated again, and it takes a considerably long time to be completely cleaned.

【0008】上記問題点の対策として、図7(a)
(b)に示すように被洗浄物の直下部分だけを除きその
他の支持板部分を遮蔽し、槽の底面から注入された洗浄
液が直接被洗浄物の間を通って上昇するようにするとい
う考えがある。上記の場合に流れを可視化して調べる
と、被洗浄物の間隙を通って液面に達した上昇流は槽壁
に向う水平流となって洗浄槽の上縁から溢流するが、水
平流の可成りの部分は槽壁に衝突したのち槽壁に沿う下
降流となり、洗浄槽内の支持板に当り中心方向に向い上
昇流に誘引されて混合する。すなわち、前記循環流とは
逆向きの循環流が槽壁に向けて生じる。上記その1に示
した問題点は改善されるが、その2の問題点は解決され
ず、十分な洗浄品質を得るには長時間の洗浄処理を必要
とする。
As a measure against the above problems, FIG.
As shown in (b), it is considered that only the portion directly below the object to be cleaned is shielded and the other supporting plate portions are shielded so that the cleaning liquid injected from the bottom of the tank rises directly between the objects to be cleaned. There is. When the flow is visualized and examined in the above case, the upward flow reaching the liquid surface through the gap of the object to be cleaned becomes a horizontal flow toward the tank wall and overflows from the upper edge of the cleaning tank. A substantial part of the above collides with the tank wall, then becomes a downward flow along the tank wall, hits the support plate in the cleaning tank, and is attracted to the upward flow toward the center to be mixed. That is, a circulation flow opposite to the circulation flow is generated toward the tank wall. Although the problem described in No. 1 above is improved, the problem of No. 2 is not solved, and a long-time cleaning process is required to obtain sufficient cleaning quality.

【0009】上記オーバーフロー方式の欠点の解決法と
して、被洗浄物を通過した汚染洗浄液を、細孔を設けた
多孔板を介して洗浄槽底部より強制的に排出し、その排
出流量に見合う洗浄液を洗浄槽内壁に沿って一様に上昇
させて供給する方法を用いた新しい洗浄槽を出願した
(特願平5−260505号)。
As a solution to the drawbacks of the overflow system, the contaminated cleaning liquid that has passed through the object to be cleaned is forcibly discharged from the bottom of the cleaning tank through a perforated plate having pores, and a cleaning liquid suitable for the discharged flow rate is obtained. We applied for a new cleaning tank using a method of uniformly raising and supplying along the inner wall of the cleaning tank (Japanese Patent Application No. 5-260505).

【0010】上記洗浄槽で被洗浄物を洗浄するときの状
態は、洗浄液の流れを可視化して観察した結果は図8に
示すとおりである。被洗浄物13下の多孔板14を介し
て洗浄液をポンプで下方に吸引するため、多孔板に適宜
分散配置した複数の細孔の吸い込み流速はほぼ一様にな
っている。したがって、洗浄槽の被洗浄物設置部では、
一様な流速に整えられた下降流が形成される。そのた
め、被洗浄物の周囲と槽壁間の大きな間隙に選択的に流
れる偏流が生じにくく、被洗浄物であるウエハや基板の
間の狭い隙間にも洗浄液がよく流れ、しかも多くの隙間
の間で流速が一様化されている。
FIG. 8 shows the result of observing the flow of the cleaning liquid by visualizing the state of cleaning the object to be cleaned in the cleaning tank. Since the cleaning liquid is sucked downward by the pump through the perforated plate 14 below the article to be cleaned 13, the suction flow velocity of the plurality of fine holes appropriately dispersed in the perforated plate is substantially uniform. Therefore, in the cleaning object installation part of the cleaning tank,
A downward flow is formed that has a uniform flow velocity. Therefore, a biased flow that selectively flows in the large gap between the periphery of the object to be cleaned and the tank wall is unlikely to occur, and the cleaning liquid flows well even in the narrow gap between the wafer and the substrate, which is the object to be cleaned. The flow velocity is uniform at.

【0011】被洗浄物へ洗浄液を供給する方法にはいろ
いろ考えられるが、下降流の整流が良好に行われるため
には、被洗浄物に対する洗浄液の供給の仕方が重要であ
り、被洗浄物に対し周囲から流入する洗浄液の流速が一
様であるのが最もよい条件である。そのため、洗浄槽を
外槽と内槽とからなる2重槽構造とし、外槽壁と内槽壁
との間隙を利用し下部からの上昇流として、新しい洗浄
液を供給する方法をとっている。この場合、洗浄液の注
入口は前後左右対称になるように4個設けることが望ま
しく、少なくとも対称位置に2個設けることは必要であ
る。注入洗浄液の上昇流は、注入口を中心にした流速の
分布を生じることが防げない。この流速分布をできるだ
け緩和するための方法として、例えば注入口近傍に流れ
を分散させる障害物を設けるか、他の方法として外槽と
内槽との間の壁間隙に整流のための多孔板を設けること
である。
There are various methods of supplying the cleaning liquid to the object to be cleaned, but in order to properly rectify the downward flow, the way of supplying the cleaning liquid to the object to be cleaned is important, and the method of supplying the cleaning liquid to the object to be cleaned is important. On the other hand, the best condition is that the flow rate of the cleaning liquid flowing from the surroundings is uniform. Therefore, the cleaning tank has a double tank structure composed of an outer tank and an inner tank, and a new cleaning liquid is supplied by using the gap between the outer tank wall and the inner tank wall as an upward flow from the lower part. In this case, it is desirable that four injection ports for the cleaning liquid be provided symmetrically in the front-rear direction, and at least two injection ports be provided at symmetrical positions. The upward flow of the injection cleaning liquid cannot prevent the flow velocity distribution from centering around the injection port. As a method for relaxing this flow velocity distribution as much as possible, for example, an obstacle that disperses the flow is provided near the inlet, or as another method, a porous plate for rectifying is provided in the wall gap between the outer tank and the inner tank. It is to provide.

【0012】このような洗浄槽では、被洗浄物によって
槽内に持ち込まれた薬液や汚れ物質は早い下降整流で被
洗浄物表面から離脱し、速やかに移送され槽底から排出
される。被洗浄物は槽内に生じる下降整流の中に設置さ
れるため、遊離した汚染物質の滞留がなく、洗浄槽内で
は洗浄液の置換が短時間で行われて清浄になる。すなわ
ち、高品質の洗浄をオーバーフロー方式の洗浄槽よりも
短時間に完了でき、経済的に有利である。
In such a cleaning tank, the chemicals and contaminants brought into the tank by the object to be cleaned are separated from the surface of the object to be cleaned by quick downward rectification, and are quickly transferred and discharged from the bottom of the tank. Since the object to be cleaned is installed in the descending rectifier that occurs in the tank, there is no retention of released contaminants, and the cleaning liquid is replaced in a short time in the cleaning tank to be cleaned. That is, high quality cleaning can be completed in a shorter time than that of the overflow type cleaning tank, which is economically advantageous.

【0013】同一の槽容積のオーバーフロー槽と下降整
流槽を用い、同一流量の純水によるすすぎ、すなわち純
粋リンスを行った。この際の槽内持込みイオンの置換排
出特性を比較して示すと図9(a)のようになる。それ
ぞれの槽から流出する純水の導電率を縦軸に対数目盛で
とり、食塩水中に浸漬しておいたウエハカセットを引き
上げてリンス槽中に入れたときを基準にし、リンスの経
過時間を等分目盛で横軸にとっている。ただし、各時刻
における導電率値としてはカセットを槽中に入れた直後
の最も高い値との比率で示してある。図9(a)から明
らかなように、下降整流槽の場合を示す実線の方が槽内
イオン濃度の低下が早く、同一の濃度に減少するまでの
リンス時間は、破線で示すオーバーフロー槽の場合の約
1/2である。供給する純水の流量が同じであるから、
下降整流槽を用いることにより高価な純水の使用水量は
半分でよいことになり、ランニングコストの大幅な削減
を行うことができる。
Using an overflow tank having the same tank volume and a descending straightening tank, rinsing with pure water having the same flow rate, that is, pure rinsing was performed. FIG. 9A shows a comparison of the substitution and ejection characteristics of the ions carried in the tank at this time. The conductivity of pure water flowing out from each tank is taken on a logarithmic scale on the vertical axis, and the elapsed time of rinsing is based on when the wafer cassette immersed in saline solution is pulled up and placed in the rinse tank. It is on the horizontal axis on the minute scale. However, the conductivity value at each time is shown as a ratio with the highest value immediately after the cassette was placed in the tank. As is clear from FIG. 9 (a), the solid line showing the case of the downflow rectification tank shows a faster decrease in the ion concentration in the tank, and the rinse time until it decreases to the same concentration is the case of the overflow tank shown by the broken line. It is about 1/2. Since the flow rate of pure water supplied is the same,
By using the descending rectification tank, the amount of expensive pure water used can be halved, and the running cost can be significantly reduced.

【0014】また、循環濾過を行っている洗浄槽内の粒
子濃度の減少速度についても、図9(b)に示すように
下降整流槽はオーバーフロー槽に比べ約2倍の値を有し
ている。すなわち、被洗浄物により槽内に持ち込まれた
汚染微粒子は、同一条件で循環濾過したとして下降整流
槽ではオーバーフロー槽の場合の約半分の時間で濾過し
除去され、被洗浄物への汚染微粒子による再汚染の機会
を著しく減らし、高清浄な洗浄面を得ることが期待でき
る。上記のように下降整流槽を用いることによって槽内
の循環流を発生させることなく、ウエハやガラス基板の
洗浄時のように被洗浄物間の狭い間隙にかなりの流速
で、しかも一様に純水を流すことができるようになり、
オーバーフロー槽に比べ高品質の洗浄が迅速かつ経済的
に実施できる。
As for the decreasing rate of the particle concentration in the cleaning tank in which the circulation filtration is carried out, the descending rectifying tank has a value about twice that of the overflow tank as shown in FIG. 9 (b). . In other words, the contaminant particles brought into the tank by the object to be cleaned are filtered and removed in about half the time in the descending rectification tank as if they were circulated and filtered under the same conditions, and the contaminant particles on the object to be cleaned are removed. It is expected that the chance of recontamination will be significantly reduced and a highly clean cleaning surface will be obtained. As described above, by using the descending rectifying tank, a circulating flow in the tank is not generated, and even in a narrow gap between the objects to be cleaned, such as when cleaning a wafer or a glass substrate, the flow velocity is fairly high and evenly pure. To be able to drain water,
High-quality cleaning can be performed quickly and economically as compared with the overflow tank.

【0015】[0015]

【発明が解決しようとする課題】しかしながら、上記下
降整流式の洗浄槽を用いて実際に洗浄液またはリンスを
行う場合に、つぎに示すような問題点がある。すなわ
ち、供給流量と排出流量とが一致しないと液面の変動
を生じる。液面上に浮遊している汚染微粒子等がある
とそのまま液面に滞留しつづけるため、洗浄後に被洗浄
物を槽外に取り出す際に、上記浮遊微粒子が被洗浄物に
付着し再汚染の原因になる。
However, when the cleaning liquid or the rinse is actually performed by using the above-mentioned descending rectification type cleaning tank, there are the following problems. That is, if the supply flow rate and the discharge flow rate do not match, the liquid level changes. If there are contaminant particles floating on the surface of the liquid, they will continue to stay on the surface of the liquid as they are, and when the object to be cleaned is taken out of the tank after cleaning, the above-mentioned suspended particles adhere to the object to be cleaned and cause recontamination. become.

【0016】また、液面変動により下降し内槽の上縁に
液面が接近すると、内槽内への洗浄液の流入の状態が乱
れ、槽内における洗浄液の整流性がくずれ、洗浄液の置
換効率が低下する。
When the liquid level changes and the liquid level approaches the upper edge of the inner tank, the flow of the cleaning liquid into the inner tank is disturbed, the rectification of the cleaning liquid in the tank is impaired, and the replacement efficiency of the cleaning liquid is deteriorated. Is reduced.

【0017】本発明は、これらの問題点を解決し、洗浄
液または純水の少ない使用流量で、高品質の洗浄を短時
間で行う下降整流式浸漬洗浄装置を得ることを目的とす
る。
An object of the present invention is to solve these problems and to obtain a descending rectification type immersion cleaning apparatus which can perform high quality cleaning in a short time with a small flow rate of cleaning liquid or pure water.

【0018】[0018]

【課題を解決するための手段】上記目的は、角形に形成
された内槽と外槽の2重槽からなり、上記内槽と外槽と
の間に設けた間隙の下部から洗浄液を注入し、上記内槽
の上縁から被洗浄物に洗浄液を注ぎ、上記被洗浄物から
遊離した汚染微粒子を含む汚染洗浄液を、多孔板を介し
て内槽底部から排出する下降整流式浸漬洗浄装置におい
て、上記外槽の1側面の上縁に洗浄液の溢出部を設け、
上記溢出部を設けた以外の外槽内側壁中に洗浄液の液面
制御手段を設置するとともに、流量がそれぞれ異なる2
つの流路を洗浄液注入口に設け、上記流量を制御する手
段を設けることにより達成される。また、上記内槽と外
槽との間の間隙上部に多孔板を設け、上記多孔板を透過
した洗浄液が内槽上縁から被洗浄物に注がれることによ
って達成される。さらに、上記液面の制御を槽内壁に設
けたレベルセンサーで行うことにより達成される。すな
わち、上記液面制御や溢出部を設けることにより浮遊微
粒子の排除を行い、上記流量制御手段により洗浄を行っ
ていない状態における洗浄液の低減を実施する機能を備
えるものである。
The above object is composed of a double tank having an inner tank and an outer tank formed in a rectangular shape, and the cleaning liquid is injected from a lower portion of a gap provided between the inner tank and the outer tank. , A cleaning liquid is poured from the upper edge of the inner tank to the object to be cleaned, and a contaminated cleaning liquid containing contaminated fine particles released from the object to be cleaned is discharged from the bottom of the inner tank through a perforated plate in a descending rectification type immersion cleaning device, An overflow portion of the cleaning liquid is provided on the upper edge of one side surface of the outer tank,
A cleaning liquid level control means is installed in the inner wall of the outer tub other than the above-mentioned overflow portion, and the flow rates are different from each other.
This is achieved by providing one flow path at the cleaning liquid injection port and providing a means for controlling the flow rate. Further, it is achieved by providing a perforated plate above the gap between the inner tank and the outer tank and pouring the cleaning liquid that has permeated through the perforated plate onto the object to be cleaned from the upper edge of the inner tank. Further, it is achieved by controlling the liquid level with a level sensor provided on the inner wall of the tank. That is, the liquid level control and the overflow portion are provided to eliminate the floating particles, and the flow rate control means has a function of reducing the cleaning liquid in a state where the cleaning is not performed.

【0019】[0019]

【作用】角形に形成された内槽と、これを囲むように設
けた外槽で2重槽を構成し、上記外槽の4壁面中の1面
の上縁を他の3壁面上縁より低く形成して洗浄液の溢出
部とし、該溢出部の外壁には溢出した洗浄液を受ける溢
水槽と排水管を設けている。なお、上記外槽内壁と内槽
外壁との間に形成される間隙の底部には洗浄液の注入口
を設け、上記間隙の上部には注入洗浄液の整流用多孔板
を内槽の外周にめぐらせている。上記溢出部より低い位
置に上縁が設定された内槽は、被洗浄物が洗浄液に十分
浸漬される位置に多孔板を設けて被洗浄物の設置台と
し、該設置台の下部の内槽底面には排出口を設け、槽外
に設けたポンプにより上記多孔板を通過した汚染洗浄液
を吸引して排出する。なお、上記溢出部および内槽上縁
の洗浄液または純水が溢流する縁の形状は、上記溢流が
一様に行われるようにするために鋸歯状に形成する。
[Function] A double tank is composed of an inner tank formed in a rectangular shape and an outer tank provided so as to surround the inner tank, and the upper edge of one of the four wall surfaces of the outer tank is higher than the upper edges of the other three wall surfaces. The cleaning liquid is made low to form an overflow portion, and an overflow tank for receiving the overflowing cleaning liquid and a drain pipe are provided on the outer wall of the overflow portion. An inlet for the cleaning liquid is provided at the bottom of the gap formed between the inner wall of the outer tank and the outer wall of the inner tank, and a perforated plate for rectifying the injected cleaning liquid is provided around the outer periphery of the inner tank at the upper part of the gap. ing. The inner tank whose upper edge is set at a position lower than the overflow portion is provided with a perforated plate at a position where the object to be cleaned is sufficiently immersed in the cleaning liquid, and serves as an installation table for the object to be cleaned. A discharge port is provided on the bottom surface, and the contaminated cleaning liquid that has passed through the porous plate is sucked and discharged by a pump provided outside the tank. The shape of the overflow portion and the edge of the upper edge of the inner tank where the cleaning liquid or pure water overflows is formed in a sawtooth shape so that the overflow can be performed uniformly.

【0020】上記構成が下降整流式浸漬洗浄槽の基本構
成であり、被洗浄物に対する洗浄液の注入をできるだけ
均一な流速で行うために、上記内槽および外槽間の間隙
に多孔板を設けて注入洗浄液の整流を行っているが、整
流度をさらによくするために、洗浄液の注入口は内槽周
囲の外槽底面で少なくとも2個以上の対称位置を選んで
設ける。
The above structure is the basic structure of the descending rectification type immersion cleaning tank, and in order to inject the cleaning liquid into the object to be cleaned at a flow velocity as uniform as possible, a porous plate is provided in the gap between the inner tank and the outer tank. Although the injected cleaning liquid is rectified, in order to further improve the rectification degree, at least two symmetrical positions are provided in the cleaning liquid injection port on the bottom surface of the outer tank around the inner tank.

【0021】内槽上縁より上方の位置にはレベルセンサ
を設置して平均液面が一定範囲に保たれるようにしてい
る。本発明の洗浄装置では液面をあらかじめ内槽の上縁
より上方に設置するが、注入する洗浄液の流量とポンプ
による排出流量とが一致すれば、当初設定した液面はそ
のまま保持される。しかし実際には流量が多少変動する
のは避けられないから、注入流量と排出流量との流量差
がプラスであれば液面は上昇し、マイナスであれば下降
する。液面の上昇は、上記設定液面の上方のレベルをこ
えても溢出部の縁に到達すれば、当然溢水して排出され
るので余り問題はないが、液面の下降は内槽上縁にまで
接近すると、上記上縁から被洗浄物に流入する洗浄液の
流れが著しく乱れ、その結果内槽内の整流性がくずれ洗
浄液の置換効率が低下してしまう。したがって、洗浄装
置の性能を安定に維持するためには液面のレベルを比較
的狭い範囲に制御することが重要であり、そのために上
限と下限のレベルにレベルセンサを設置して液面レベル
を維持するようにする。
A level sensor is installed at a position above the upper edge of the inner tank so that the average liquid surface can be kept within a certain range. In the cleaning apparatus of the present invention, the liquid surface is installed above the upper edge of the inner tank in advance. However, if the flow rate of the cleaning liquid to be injected and the discharge flow rate of the pump match, the initially set liquid surface is maintained. However, in practice, it is inevitable that the flow rate slightly fluctuates, so if the flow rate difference between the injection flow rate and the discharge flow rate is positive, the liquid level rises, and if it is negative, the liquid level falls. If the liquid level rises above the level above the set liquid level and reaches the edge of the overflow, it naturally overflows and is discharged, so there is no problem. When approaching to (5), the flow of the cleaning liquid flowing into the object to be cleaned from the upper edge is significantly disturbed, and as a result, the rectifying property in the inner tank is disturbed and the cleaning liquid replacement efficiency is reduced. Therefore, it is important to control the liquid level within a relatively narrow range in order to keep the performance of the cleaning device stable.For this reason, level sensors are installed at the upper and lower limits to control the liquid level. Try to keep it.

【0022】また、洗浄液の注入口には、排出口の吸引
流量より僅かに小さい流量用の流路Aと、上記吸引流量
より若干大きな流量用の流路Bとを設け、開閉バルブ、
流量調節ニードルバルブ、流量計、フィルタをそれぞれ
設置し、独立に流量を選定できるようにする。流路Aで
運転すると液面が低下して低位値のレベルセンサに至
り、該センサにより流路Bのバルブが開き液面が上昇
し、高位置の液面レベルセンサに達し、流路Bのバルブ
が閉じ液面が再び下降する。
The inlet of the cleaning liquid is provided with a flow path A for a flow rate slightly smaller than the suction flow rate of the discharge port and a flow path B for a flow rate slightly larger than the suction flow rate.
Install a flow rate adjusting needle valve, a flow meter, and a filter so that the flow rate can be selected independently. When operating in the flow path A, the liquid level lowers and reaches a low level level sensor, which opens the valve of the flow path B to raise the liquid level and reach the high level liquid level sensor, The valve closes and the liquid level descends again.

【0023】さらに何らかの原因で、洗浄液表面に浮遊
塵埃が落下して液面に滞留した場合には、被洗浄物を槽
から引き上げる時に浮遊塵埃が付着することが避けられ
ない。このような場合は、洗浄液注入口のバルブ以外の
バルブを全べて閉じると液面が上昇し、排出口も閉じら
れているため上位の液面レベルセンサを越え溢出部から
流出するが、この際に浮遊している塵埃は溢出洗浄液と
ともに排出される。上記塵埃が排出されたら閉じたバル
ブを開いて正常な運転に戻す。さらにまた、純水リンス
時に流量が小さい流路Aだけを開き排出口に接続された
吸引ポンプを停止すると、純水が自然流下により排出し
純水の流量を低減できる。循環濾過を行う場合には、吸
引ポンプの行先をドレンの代りに上記流路に接続する。
これらの諸作用により少ない洗浄液の使用流量で、高品
質の洗浄を行うことができる。なお、上記記載は洗浄槽
と洗浄液について主に記載したが、リンス槽における純
水についても全く同様である。
Further, when the floating dust drops on the surface of the cleaning liquid and stays on the liquid surface for some reason, it is inevitable that the floating dust adheres when the object to be cleaned is pulled out from the tank. In this case, when all the valves except the cleaning liquid inlet valve are closed, the liquid level rises and the outlet is also closed, so that it flows over the upper liquid level sensor and flows out from the overflow part. Dust floating at that time is discharged together with the overflow cleaning liquid. When the above dust is discharged, open the closed valve to restore normal operation. Furthermore, when only the flow path A having a small flow rate is opened at the time of rinsing pure water and the suction pump connected to the discharge port is stopped, pure water is discharged by natural flow and the flow rate of pure water can be reduced. When performing circulation filtration, the destination of the suction pump is connected to the above flow path instead of the drain.
Due to these effects, high-quality cleaning can be performed with a small flow rate of the cleaning liquid. Although the above description mainly describes the cleaning tank and the cleaning liquid, the same applies to pure water in the rinse tank.

【0024】[0024]

【実施例】つぎに本発明の下降整流式浸漬洗浄装置の一
実施例を図面とともに説明する。図1は本発明による下
降整流式浸漬洗浄装置の洗浄槽断面を示す図、図2は上
記洗浄槽の外観を示す斜視図、図3は上記洗浄槽の上面
図、図4は液面制御のための説明図、図5は上記浸漬洗
浄装置の配管例を示す図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the descending rectifying type immersion cleaning apparatus of the present invention will be described below with reference to the drawings. FIG. 1 is a view showing a cross section of a cleaning tank of a descending rectification type immersion cleaning apparatus according to the present invention, FIG. 2 is a perspective view showing the appearance of the cleaning tank, FIG. 3 is a top view of the cleaning tank, and FIG. FIG. 5 is a diagram showing an example of piping of the immersion cleaning device.

【0025】本発明の下降整流式浸漬洗浄装置用洗浄槽
は図1に示すように、内槽1とこれを囲む外槽2が角形
に形成された2重槽で、外槽2の壁面のうち短辺をなす
1面の上縁を外槽の他面壁の高さより低くして溢出部3
とし、その外側に溢出した洗浄液を受けるための溢水槽
4と排水管5とを設けている。上記内槽1と外槽2との
間に形成される間隙の底面には洗浄液の注入口6を設
け、間隙の上部には複数個の孔を多数あけた多孔板7
を、注入された洗浄液の整流用として内槽1の外壁に沿
って設けている。上記内槽1はその上縁を上記溢水部3
より低い位置に設定し、内槽内において被洗浄物が洗浄
液に十分浸漬される位置に被洗浄物の設置台8を設けて
いるが、上記設置台8は複数個の孔を多数設けた多孔板
で構成され、被洗浄物を洗浄したのちの汚染洗浄液を通
過させ、内槽1内の洗浄液の流れを整流して、上記設置
台8直下の内槽1の底部に設けた排出口9により、槽外
に設けたポンプの働きで汚染洗浄液を吸引して排出す
る。上記構成では注入口6から注入した洗浄液を内槽1
と外槽2とが作る間隙を上昇させ、上記間隙上部に設け
た多孔板7を通過させることにより、整流された洗浄液
を内槽1の上縁から一様の流速で内槽内の被洗浄物に流
し込むが、上記洗浄液の流速を一様にし、より一層整流
化をはかるためには、上記間隙底面における洗浄液注入
口6の配置をできるだけ対称にする必要があり、少なく
とも2個以上を設け例えば図3に示すような対称配置を
行う。
As shown in FIG. 1, the cleaning tank for the descending rectifying type immersion cleaning apparatus of the present invention is a double tank in which an inner tank 1 and an outer tank 2 surrounding the inner tank 1 are formed in a rectangular shape, and the outer tank 2 has a wall surface. Of the short side, the upper edge of one surface is made lower than the height of the other wall of the outer tank, and the overflow portion 3
Further, an overflow tank 4 and a drain pipe 5 for receiving the overflowed cleaning liquid are provided outside the tank. A cleaning liquid inlet 6 is provided on the bottom surface of the gap formed between the inner tank 1 and the outer tank 2, and a perforated plate 7 having a plurality of holes at the upper portion of the gap.
Are provided along the outer wall of the inner tank 1 for rectifying the injected cleaning liquid. The inner tank 1 has its upper edge at the overflow portion 3
The setting table 8 is set at a lower position, and the setting table 8 for the cleaning object is provided at a position where the cleaning object is sufficiently immersed in the cleaning liquid in the inner tank. It is composed of a plate, passes the contaminated cleaning liquid after cleaning the object to be cleaned, rectifies the flow of the cleaning liquid in the inner tank 1, and uses the discharge port 9 provided at the bottom of the inner tank 1 directly below the installation table 8. , A pump provided outside the tank sucks and discharges the contaminated cleaning liquid. In the above configuration, the cleaning liquid injected from the injection port 6 is used as the inner tank 1
The gap formed by the outer tank 2 and the outer tank 2 is raised, and the perforated plate 7 provided at the upper portion of the gap is passed to clean the rectified cleaning liquid from the upper edge of the inner tank 1 at a uniform flow rate in the inner tank. In order to make the flow rate of the cleaning liquid uniform and to further rectify the flow of the cleaning liquid, it is necessary to arrange the cleaning liquid inlets 6 on the bottom surface of the gap as symmetrically as possible. The symmetrical arrangement as shown in FIG. 3 is performed.

【0026】上記洗浄液の注入口6から注入された洗浄
液の流量と排出口9から排出される汚染洗浄液の流量と
が等しい場合には、洗浄槽内の洗浄液面が一定の状態を
保持するが、上記両流量のバランスがくずれると洗浄液
が増減する。すなわち、注入流量と排出流量との流量差
がプラスになれば液面が上昇し、マイナスになると液面
が下降する。実際には流量が多少変動するのは避けられ
ず、仮りに上昇しつづけた場合には上記溢出部3の上縁
まで到達し、溢出して排出されるので余り問題にはなら
ないが、液面が下降して内槽1の上縁にまで接近する
と、上縁をこえて内部の被洗浄物に注入される洗浄液の
整流性が乱れて、洗浄液の置換効率が低下してしまう。
そのため、槽内における洗浄液の液面レベルの変動を比
較的狭い範囲に制御しなければならないが、その許容変
動の範囲は所定の平均液面に対して、図4に示すように
およそ±10mmであることが望ましい。そのため上限
と下限のレベルにそれぞれ液面センサ10(LHとL
L)を設置して、上記洗浄液面の変動を一定範囲内に維
持するようにする。なお、内槽1と外槽2との高さおよ
び溢出部3高さ、ならびに平均液面との関係の一例は図
4に示すとおりである。
When the flow rate of the cleaning liquid injected from the cleaning liquid injection port 6 and the flow rate of the contaminated cleaning liquid discharged from the discharge port 9 are equal, the cleaning liquid surface in the cleaning tank maintains a constant state. When the balance between the above two flow rates is lost, the amount of cleaning liquid increases or decreases. That is, when the difference between the injection flow rate and the discharge flow rate becomes positive, the liquid level rises, and when it becomes negative, the liquid level falls. Actually, it is unavoidable that the flow rate slightly fluctuates, and if it continues to rise, it will reach the upper edge of the overflow portion 3 and will be overflowed and discharged. When the water drops and approaches the upper edge of the inner tank 1, the rectifying property of the cleaning liquid injected over the upper edge into the object to be cleaned is disturbed, and the replacement efficiency of the cleaning liquid decreases.
Therefore, the fluctuation of the liquid level of the cleaning liquid in the tank must be controlled within a relatively narrow range, but the allowable fluctuation range is about ± 10 mm with respect to a predetermined average liquid level as shown in FIG. Is desirable. Therefore, the liquid level sensor 10 (LH and L
L) is installed to keep the fluctuation of the cleaning liquid level within a certain range. An example of the relationship between the height of the inner tank 1 and the outer tank 2, the height of the overflow portion 3, and the average liquid level is shown in FIG.

【0027】本洗浄槽の内槽1と外槽2との間の間隙底
部に設けた4個の洗浄液注入口6には、それぞれ開閉の
バルブV1、V2、V3、V4を介して洗浄液の流路が接続
されているが、上記流路は図5に示すように、排出口9
の吸引流量Ql/minより僅かに小さい流量、例えば
2l/min程小さくした流量(Q−2)l/minに
設定した流量Aと、約3l/min程度の流量に設定し
た流路Bとからなり、各流路はそれぞれ開閉バルブ
6、V7と流量調節用のニードルバルブV8、V9、およ
び流量計M1、M2とフィルタF1、F2から構成され、各
流路を切替えることにより流量をそれぞれ独立に選定で
きるようにしてある。流路Aにより運転すると、吸引流
量に比べ供給流量が小さいため洗浄液の液面は低下し、
やがて液面レベルセンサLLに達する。センサLLの動
作で流路BのバルブV7が開き、流量(Q−2+3)l
/min、すなわち1l/min程度増し吸引流量より
大きくなって液面は上昇する。上昇が続くと洗浄液面は
やがて液面レベルセンサLHに到達するが、レベルセン
サLHにより流路BのバルブV7を閉じれば洗浄液面を
下降させることができる。このような制御方法により、
洗浄槽内の洗浄液面を、運転開始時のレベルを中心に±
10mmの範囲で上下させ、洗浄処理を行うことができ
る。上記流路AおよびBの流量設定値は、上記例示の値
に決っているわけでなく、洗浄液注入側の流量変動値に
基づいて適切に設定することが必要である。
The four cleaning solution inlets 6 provided at the bottom of the gap between the inner tank 1 and the outer tank 2 of the main cleaning tank are respectively opened and closed via valves V 1 , V 2 , V 3 and V 4 . The flow path for the cleaning liquid is connected to the discharge port 9 as shown in FIG.
Flow rate A slightly lower than the suction flow rate Ql / min, for example, a flow rate A set to a flow rate (Q-2) 1 / min reduced by about 2 l / min and a flow path B set to a flow rate of about 3 l / min. Each flow path is composed of opening / closing valves V 6 and V 7 , needle valves V 8 and V 9 for flow rate adjustment, and flow meters M 1 and M 2 and filters F 1 and F 2 , respectively. The flow rate can be selected independently by switching. When operating with the flow path A, the supply flow rate is smaller than the suction flow rate, so the level of the cleaning liquid decreases,
Eventually, the liquid level sensor LL is reached. The valve V 7 of the flow path B is opened by the operation of the sensor LL, and the flow rate (Q-2 + 3) l
/ Min, that is, about 1 l / min, which is larger than the suction flow rate and the liquid level rises. When the rise continues, the cleaning liquid level eventually reaches the liquid level sensor LH. However, if the level sensor LH closes the valve V 7 of the flow path B, the cleaning liquid surface can be lowered. With such a control method,
The level of the cleaning liquid in the cleaning tank is centered around the level at the start of operation ±
The washing treatment can be carried out by moving up and down within a range of 10 mm. The flow rate setting values of the flow paths A and B are not fixed to the above exemplified values, but it is necessary to appropriately set the flow rate setting values based on the flow rate fluctuation value on the cleaning liquid injection side.

【0028】精密洗浄を行うには、浮遊塵埃などの汚染
を避けるため、クリーンブース内などに洗浄装置を設置
する。しかしながら、万一、洗浄液面に気中の浮遊塵埃
が沈降した場合には、洗浄液面に滞留したままの状態と
なり、洗浄後の被洗浄物を洗浄槽から引き上げる際に上
記浮遊塵埃を付着させ、再び汚染することになる。洗浄
液表面に浮遊塵埃があるときは、図5におけるバルブV
1以外の注入口バルブV2、V3、V4と排出口バルブV5
を閉じると、洗浄液面が上昇し液面レベルセンサLHが
働き流路Bのバルブが閉になるが、排出口バルブV5
閉じているため引続き洗浄液面は上昇し、溢出部3に到
達して排水管5から流出する。この際、洗浄槽の一方か
ら上記溢出部3に向けて表面の水平な流れが形成され、
表面に浮遊する塵埃は上記流れとともに比較的短時間で
排出される。浮遊塵埃が除去されたら閉じたバルブ
2、V3、V4およびV5を開き、ポンプによる排出口9
からの吸引を再開すると、洗浄液注入流量が吸引流量よ
りも小さいため洗浄液面は低下する。なお、洗浄液面を
速く所定レベルに戻すためには、一時的に注入口バルブ
1〜V4を閉にすればよい。
In order to carry out precision cleaning, a cleaning device is installed in a clean booth or the like in order to avoid contamination such as suspended dust. However, in the unlikely event that the airborne dust settles on the cleaning liquid surface, it remains in the cleaning liquid surface, and the floating dust is attached when the object to be cleaned after cleaning is pulled out from the cleaning tank, Will be polluted again. When there is floating dust on the surface of the cleaning liquid, the valve V in FIG.
Inlet valves V 2 , V 3 , V 4 other than 1 and outlet valve V 5
When the valve is closed, the cleaning liquid level rises and the liquid level sensor LH works to close the valve of the flow path B, but since the outlet valve V 5 is closed, the cleaning liquid level continues to rise and reaches the overflow portion 3. And drains from the drain pipe 5. At this time, a horizontal surface flow is formed from one of the cleaning tanks toward the overflow portion 3,
The dust floating on the surface is discharged in a relatively short time together with the above flow. When the suspended dust is removed, the closed valves V 2 , V 3 , V 4 and V 5 are opened, and the pump discharge port 9
When the suction from is restarted, the cleaning liquid level is lowered because the cleaning liquid injection flow rate is smaller than the suction flow rate. In addition, in order to quickly return the cleaning liquid level to a predetermined level, the injection port valves V 1 to V 4 may be temporarily closed.

【0029】また、洗浄を一時中断する場合に、純水リ
ンス槽の清浄度を低下させないため純水の流量を減少さ
せた状態で連続通水するためには、流量が小さい流路B
のバルブV1だけを開き、排出口9に接続されたポンプ
を停止し、バルブV10を開いて自然流下させることによ
り流出する。上記自然流下の流量が流路Bの流量とバラ
ンスするように調節するために、バルブV10の後にはニ
ードルバルブV11を設ける。
Further, when the cleaning is temporarily suspended, in order to continuously pass water in a state where the flow rate of pure water is reduced so as not to lower the cleanliness of the pure water rinse tank, the flow path B having a small flow rate is used.
The valve V 1 is opened, the pump connected to the discharge port 9 is stopped, and the valve V 10 is opened to allow natural flow to flow out. In order to adjust the flow rate under the natural flow to be balanced with the flow rate in the flow path B, a needle valve V 11 is provided after the valve V 10 .

【0030】上記説明は洗浄液を主体に記載したが、リ
ンス槽として純水を用いる場合も同様である。また、上
記液面の調節、浮遊塵埃の排除および小流量へ切替えに
よる節水等のバルブ切替え操作は、自動弁を用いたシー
ケンス制御により自動化を行うことが容易にできる。
Although the above description mainly describes the cleaning liquid, the same applies when pure water is used as the rinse tank. Further, the valve switching operation such as the liquid level adjustment, the elimination of floating dust, and the switching to a small flow rate to save water can be easily automated by sequence control using an automatic valve.

【0031】[0031]

【発明の効果】上記のように本発明による下降整流式浸
漬洗浄装置は、角形に形成された内槽と外槽の2重槽か
らなり、上記内槽と外槽との間に設けた間隙の下部から
洗浄液を注入し、上記内槽の上縁から被洗浄物に洗浄液
を注ぎ、上記被洗浄物から遊離した汚染微粒子を含む汚
染洗浄液を、多孔板を介して内槽底部から排出する下降
整流式浸漬洗浄装置において、上記外槽の1側面の上縁
に洗浄液の溢出部を設け、上記溢出部を設けた以外の外
槽内側壁中に洗浄液の液面制御手段を設置するととも
に、流量がそれぞれ異なる2つの流路を洗浄液注入口に
設け、上記流量を制御する手段を備えたことにより、洗
浄液または純水の少ない使用流量で、洗浄度が高い精密
洗浄を短時間で行うことができる下降整流式浸漬洗浄装
置が得られる。
As described above, the descending straightening type dipping and cleaning apparatus according to the present invention is composed of a double tank including an inner tank and an outer tank, which are formed in a rectangular shape, and has a gap provided between the inner tank and the outer tank. Inject the cleaning liquid from the lower part of the inner tank, pour the cleaning liquid into the object to be cleaned from the upper edge of the inner tank, and discharge the contaminated cleaning liquid containing contaminated fine particles released from the object to be cleaned from the bottom of the inner tank through the perforated plate. In the rectification type immersion cleaning device, an overflow portion of the cleaning liquid is provided on the upper edge of one side surface of the outer tank, and a liquid level control means for the cleaning liquid is installed in the inner wall of the outer tank other than the overflow portion. By providing two flow paths different from each other in the cleaning liquid inlet and providing the means for controlling the above flow rate, it is possible to perform a precision cleaning with a high cleaning degree in a short time at a used flow rate with a small amount of cleaning liquid or pure water. A down-rectifying immersion cleaning device is obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明による下降整流式浸漬洗浄装置の洗浄槽
断面を示す図である。
FIG. 1 is a view showing a cross section of a cleaning tank of a descending rectifying type immersion cleaning apparatus according to the present invention.

【図2】上記洗浄槽の外観を示す斜視図である。FIG. 2 is a perspective view showing an appearance of the cleaning tank.

【図3】上記洗浄槽の上面図である。FIG. 3 is a top view of the cleaning tank.

【図4】液面制御のための説明図である。FIG. 4 is an explanatory diagram for liquid level control.

【図5】上記下降整流式浸漬洗浄装置の配管例を示す図
である。
FIG. 5 is a diagram showing an example of piping of the descending rectifying type immersion cleaning device.

【図6】従来のオーバーフロー式洗浄槽の洗浄液の流れ
を示す図である。
FIG. 6 is a diagram showing a flow of a cleaning liquid in a conventional overflow type cleaning tank.

【図7】上記従来洗浄槽の他の例における洗浄液の流れ
を示す図である。
FIG. 7 is a diagram showing a flow of a cleaning liquid in another example of the conventional cleaning tank.

【図8】下降整流式洗浄槽における洗浄液の流れを示す
図である。
FIG. 8 is a diagram showing a flow of a cleaning liquid in a descending rectification type cleaning tank.

【図9】オーバーフロー式洗浄槽と下降整流式洗浄槽に
おける洗浄効率の比較を示す図で、(a)は純水リンス
の場合、(b)は循環洗浄の場合をそれぞれ示す図であ
る。
FIG. 9 is a view showing a comparison of cleaning efficiency between an overflow type cleaning tank and a downflow rectification type cleaning tank, wherein (a) is a pure water rinse and (b) is a circulation cleaning.

【符号の説明】[Explanation of symbols]

1 内槽 2 外槽 3 溢出部 6 注入口 7、8 多孔板 9 排出口 10 レベルセンサ 1 Inner tank 2 Outer tank 3 Overflow part 6 Injection port 7, 8 Perforated plate 9 Discharge port 10 Level sensor

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】角形に形成された内槽と外槽の2重槽から
なり、上記内槽と外槽との間に設けた間隙の下部から洗
浄液を注入し、上記内槽の上縁から被洗浄物に洗浄液を
注ぎ、上記被洗浄物から遊離した汚染微粒子を含む汚染
洗浄液を、多孔板を介して内槽底部から排出する下降整
流式浸漬洗浄装置において、上記外槽の1側面の上縁に
洗浄液の溢出部を設け、上記溢出部を設けた以外の外槽
内側壁中に洗浄液の液面制御手段を設置するとともに、
流量がそれぞれ異なる2つの流路を洗浄液注入口に設
け、上記流量を制御する手段を備えたことを特徴とする
下降整流式浸漬洗浄装置。
1. A double tank consisting of an inner tank and an outer tank formed in a rectangular shape, and a cleaning liquid is injected from a lower part of a gap provided between the inner tank and the outer tank, and from the upper edge of the inner tank. In a descending straightening type dip cleaning device in which a cleaning liquid is poured into an object to be cleaned and a contaminated cleaning liquid containing contaminated fine particles released from the object to be cleaned is discharged from the bottom of the inner tank through a perforated plate, on one side surface of the outer tank. An overflow portion of the cleaning liquid is provided at the rim, and a liquid level control means for the cleaning liquid is provided in the inner wall of the outer tank other than the overflow portion.
A descending rectifying type immersion cleaning apparatus, characterized in that two flow paths having different flow rates are provided in a cleaning liquid inlet and a means for controlling the flow rate is provided.
【請求項2】上記内槽と外槽との間に設けた間隙は、上
部に多孔板を設け、上記多孔板を透過した洗浄液が内槽
上縁から被洗浄物に注がれることを特徴とする請求項1
記載の下降整流式浸漬洗浄装置。
2. A gap provided between the inner tank and the outer tank is provided with a perforated plate on the upper portion, and the cleaning liquid that has permeated through the perforated plate is poured from the upper edge of the inner tank onto the object to be cleaned. Claim 1
The descending rectification type immersion cleaning device described.
【請求項3】上記洗浄槽内の液面制御は、洗浄槽内に設
置したレベルセンサで行うことを特徴とする請求項1記
載の下降整流式浸漬洗浄装置。
3. The descending rectifying immersion cleaning apparatus according to claim 1, wherein the liquid level in the cleaning tank is controlled by a level sensor installed in the cleaning tank.
JP02902995A 1995-02-17 1995-02-17 Downward rectification type immersion cleaning device Expired - Fee Related JP3538470B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP02902995A JP3538470B2 (en) 1995-02-17 1995-02-17 Downward rectification type immersion cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP02902995A JP3538470B2 (en) 1995-02-17 1995-02-17 Downward rectification type immersion cleaning device

Publications (2)

Publication Number Publication Date
JPH08215648A true JPH08215648A (en) 1996-08-27
JP3538470B2 JP3538470B2 (en) 2004-06-14

Family

ID=12264993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP02902995A Expired - Fee Related JP3538470B2 (en) 1995-02-17 1995-02-17 Downward rectification type immersion cleaning device

Country Status (1)

Country Link
JP (1) JP3538470B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005338803A (en) * 2004-04-30 2005-12-08 Mitsubishi Chemicals Corp Method for manufacturing photoconductor drum
JP2006003884A (en) * 2004-05-18 2006-01-05 Mitsubishi Chemicals Corp Method for manufacturing photoconductor drum
CN104690030A (en) * 2013-12-05 2015-06-10 天津中环领先材料技术有限公司 Tank body for improved silicon chip cleaning machine
CN110711741A (en) * 2019-11-20 2020-01-21 常州捷佳创精密机械有限公司 Washing tank structure capable of improving overflow circulation efficiency
KR20200115223A (en) * 2019-03-29 2020-10-07 가부시키가이샤 에바라 세이사꾸쇼 Cleaning apparatus for heat exchanger and polishing apparatus
CN112058774A (en) * 2020-08-24 2020-12-11 台州市老林装饰有限公司 Overflow groove structure of wet etching cleaning mechanism
CN113416997A (en) * 2021-05-25 2021-09-21 苏州普雷特电子科技有限公司 Plating bath system convenient to tank liquor is changed
WO2024021996A1 (en) * 2022-07-28 2024-02-01 常州捷佳创精密机械有限公司 Compatible tank structure and cleaning apparatus
CN119038707A (en) * 2024-09-30 2024-11-29 广州市保达电热钛制品有限公司 Chromic acid waste water processor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102343340B (en) * 2011-10-20 2016-01-13 高佳太阳能股份有限公司 The potcher of silicon wafer cleaner

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005338803A (en) * 2004-04-30 2005-12-08 Mitsubishi Chemicals Corp Method for manufacturing photoconductor drum
JP2006003884A (en) * 2004-05-18 2006-01-05 Mitsubishi Chemicals Corp Method for manufacturing photoconductor drum
CN104690030A (en) * 2013-12-05 2015-06-10 天津中环领先材料技术有限公司 Tank body for improved silicon chip cleaning machine
KR20200115223A (en) * 2019-03-29 2020-10-07 가부시키가이샤 에바라 세이사꾸쇼 Cleaning apparatus for heat exchanger and polishing apparatus
JP2020167310A (en) * 2019-03-29 2020-10-08 株式会社荏原製作所 Heat exchanger cleaning device and polishing device
CN110711741A (en) * 2019-11-20 2020-01-21 常州捷佳创精密机械有限公司 Washing tank structure capable of improving overflow circulation efficiency
CN112058774A (en) * 2020-08-24 2020-12-11 台州市老林装饰有限公司 Overflow groove structure of wet etching cleaning mechanism
CN113416997A (en) * 2021-05-25 2021-09-21 苏州普雷特电子科技有限公司 Plating bath system convenient to tank liquor is changed
WO2024021996A1 (en) * 2022-07-28 2024-02-01 常州捷佳创精密机械有限公司 Compatible tank structure and cleaning apparatus
CN119038707A (en) * 2024-09-30 2024-11-29 广州市保达电热钛制品有限公司 Chromic acid waste water processor

Also Published As

Publication number Publication date
JP3538470B2 (en) 2004-06-14

Similar Documents

Publication Publication Date Title
KR100226548B1 (en) Wafer Wet Processing Equipment
US6875289B2 (en) Semiconductor wafer cleaning systems and methods
US4997490A (en) Method of cleaning and rinsing wafers
JP3538470B2 (en) Downward rectification type immersion cleaning device
KR100202191B1 (en) Semiconductor Wafer Wet Processing Equipment
KR0179783B1 (en) Cleaning apparatus of semiconductor wafer
JP2000121628A (en) Water quality measuring device
JP2541525B2 (en) Semiconductor substrate processing equipment
JP3898257B2 (en) Wafer cleaning apparatus and wafer cleaning method
JPH0499025A (en) Water rinser
JP3722337B2 (en) Wet processing equipment
JPH10135175A5 (en)
JPH0851093A (en) Cleaning tank
JPH0437131A (en) Pure water washing vessel for semiconductor wafer and washing thereof
JP2000093906A (en) Semiconductor manufacturing equipment
KR100489652B1 (en) Hybrid wafer immersion apparatus for semiconductor device manufacturing
KR100313518B1 (en) Wet station bath for wafer
JP2571261Y2 (en) Semiconductor wafer cleaning equipment
JPH08236496A (en) Semiconductor substrate cleaning tank and cleaning device
JPH0736399B2 (en) Cleaning rinse tank for semiconductor wafers
JPH05291226A (en) Method and apparatus for cleaning by circulation and filtration
JP3615040B2 (en) Cleaning device
JPH07100443A (en) Work cleaning method and device
JPH0714644U (en) Cleaning equipment
JPS63263728A (en) Semiconductor substrate cleaning device

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20040223

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Effective date: 20040302

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20040322

R150 Certificate of patent (=grant) or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 5

Free format text: PAYMENT UNTIL: 20090326

FPAY Renewal fee payment (prs date is renewal date of database)

Year of fee payment: 5

Free format text: PAYMENT UNTIL: 20090326

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100326

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees