JPH0827548A - Amorphous metallic thin film laminated body - Google Patents

Abstract

PURPOSE:To produce an amorphous metallic thin film laminated body excellent in static electricity and electromagnetic wave shielding effect and having mechanical strength sufficient in practical use. CONSTITUTION:This amorphous metallic thin film laminated body is a one obtd. by laminating plural amorphous metallic thin films and adhering the same to each other with an adhesive or a pressure sensitive adhesive, and in which at least one layer of the amorphous metallic thin films has a plating layer constituted of conductive metal, and the amorphous metallic thin films are adhered to each other with an adhesive or a pressure sensitive adhesive distributed in the state of one or more lines or one or more islands and having the distributed area of 1.0 to 90% of the whole adhesion area.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an amorphous metal thin film laminate. To elaborate further,
The present invention relates to a laminated body composed of a plurality of layers of amorphous metal thin films integrated and laminated. These have an excellent shielding effect against electromagnetic waves.

[0002]

2. Description of the Related Art In recent years, with the development and popularization of electronic devices, these devices, magnetic recording media, etc.
It is necessary to protect against the adverse effects of static electricity and electromagnetic waves, and as this protective material, sheet materials such as covering sheet materials and packaging sheet materials are in great demand.

In order to protect electronic equipment from the influence of static electricity, a conductive sheet containing a conductive material containing carbon powder, carbon fiber, metal foil or metal powder has been used. However, such a conventional conductive sheet cannot be said to be sufficiently effective for the purpose of protecting electronic devices from the influence of electromagnetic waves. For example, in an MRI (Nuclear Magnetic Resonance Diagnostic Device) or the like, it is easily damaged by external electromagnetic waves, and therefore the MRI is shielded by an iron plate having a thickness of 2 cm. If such a thick shield material is used, the weight of the device becomes extremely large, and the manufacturing and processing thereof are difficult. Further, the most serious drawback of the iron plate shield is that the iron plate itself is easily magnetized.

The use of amorphous metal has been attempted in order to overcome the above-mentioned drawbacks of conventional electromagnetic wave shielding materials. Amorphous metal has an excellent shield effect against electromagnetic waves, and has an advantage that when the load is removed, it immediately returns to its original state and is not magnetized.

However, the amorphous metal has the following problems with respect to the conventional electromagnetic wave shielding material (for example, iron plate). (A) Generally, the thickness of the amorphous metal material is 100 μm.
m or less (most commercial amorphous metal thin films are 50 μm
However, it is difficult to obtain an amorphous metal material having a thickness greater than that.

(B) Generally, the amorphous metal material is 1
It is supplied with a width of 00 mm or less (most commonly 20 mm or less), and it is difficult to obtain one having a width wider than this. (C) Therefore, a wide width and a considerable thickness, for example, 1
It is difficult to obtain an amorphous metal material having a thickness greater than 00 μm. (D) The laminated body obtained by laminating and bonding the amorphous metal thin films has problems that it is difficult to bend and is easily broken.

[0007]

DISCLOSURE OF THE INVENTION The present invention is intended to provide an amorphous metal thin film laminate which is easily bent and is not easily broken by using an amorphous metal thin film.

[0008]

The amorphous metal thin film laminate of the present invention comprises a plurality of amorphous metal thin films laminated on each other and adhered by an adhesive or a pressure sensitive adhesive, and at least one layer of the amorphous metal thin films. Includes an amorphous metal thin film and a plating layer formed on at least one surface of the amorphous metal thin film and comprising at least one kind of conductive metal, and the adhesive or the adhesive on the adhesive surface of the amorphous metal thin film. The adhesive is
It is distributed in one or more lines or in one or more islands,
The total distribution area of the adhesive or the pressure-sensitive adhesive is in the range of 1.0 to 90% with respect to the area of the adhesive surface of the amorphous metal thin film.

[0009]

[Action] Recently, amorphous metals have been
Attempts have been made to use it in various applications. Amorphous metal thin films are generally supplied as ribbon-shaped materials with a width of 2.54 to 10.16 cm, and it is expected that small width sheets with a width of 20.32 cm will be supplied in the near future for expanding the width. It has been done. The supplied amorphous metal thin film is generally 5 to 50 μm.
Some have a thickness of m and very rarely have a thickness of about 100 μm.

Conventionally, the ribbon-shaped or small (narrow) width material as described above can be used only as a card case or as a packaging material for small articles, which is 100 to 300.
It was thought that it would be almost impossible to use it for a covering sheet that requires a wide width of cm.

In the amorphous metal thin film laminate of the present invention, the amorphous metal thin film has a supply width of
Alternatively, it is used by bonding it to a desired width, if necessary.

The above-mentioned effect of protecting the electronic equipment means the effect of absorbing or reflecting the electromagnetic wave energy by the electromagnetic wave shield means so that the electronic equipment is not affected by the electromagnetic wave energy. The degree of electromagnetic wave energy attenuation by the electromagnetic wave shield means is expressed in a unit decibel (dB). As the electromagnetic wave shield material, the larger this value is, the larger the attenuation effect is, which is preferable.

In the amorphous metal thin film laminate of the present invention, its electromagnetic wave shielding effect depends substantially on the shielding effect of the metal thin film contained therein, and is generally 30d.
It is preferably B or higher, more preferably 60 dB or higher, and even more preferably 90 dB or higher.

The amorphous metal thin film useful in the present invention generally contains iron as a main component, boron,
It is preferably selected from amorphous alloys obtained by adding one or more selected from silicon, carbon, nickel, cobalt, molybdenum and the like. For example, Allied's trade name METGLAS No. 2605SC (F
e: 81%, B: 13.5%, Si: 3.5%, C:
2% amorphous alloy), No. 2605S-2 (F
e: 78%, B: 13%, Si: 9% amorphous alloy), No. 2605-Co (Fe: 87 parts, B: 14
Part, Si: 1 part, Co: 18 parts amorphous alloy)
, No. 2826-MB (Fe: 40%, Ni: 38
%, Mo: 4%, B: 18% amorphous alloy) and the like.

In addition to the above-mentioned alloys containing iron as a main component,
Alloy system containing cobalt as a main component (for example, Co₉₀Zr
_Ten, Co₇₈Si_TenB_12,Co₅₆Cr₂₆C₁₈, CO₄₄Mo
₃₆C ₂₀, Co₃₄Cr₂₈Mo₂₀C₁₈), The main component is nickel
Alloy system (for example, Ni₉₀Zr_Ten, Ni₇₈Si
_TenB₁₂, Ni₃₄Cr_{twenty four}Mo_{twenty four}C₁₈) And other metals
Alloys containing as a main component (for example, Pd₈₀Si₂₀, Cu₈₀Z
r₂₀, Nb₅₀Ni₅₀, Ti₅₀Cu₅₀) Etc. can also be used.

The amorphous metal thin film may be a perforated thin film as long as it does not substantially affect the electromagnetic wave shielding property.

Since these amorphous metal thin films are often supplied in the form of ribbons or narrow sheets as described above, when they are used in the amorphous metal thin film laminate of the present invention, they may be used as needed. A plurality of ribbon-shaped or narrow sheet-shaped amorphous metal thin films arranged in parallel with each other to form a wide thin film, or if necessary, their opposing side edges are formed by a conductive adhesive or solder. Bonded to form a wide thin film having a desired width. When forming a wide thin film from a plurality of ribbons, the ribbons may be arranged to extend parallel to the longitudinal axis of the resulting laminate, or they may be arranged to extend in a direction perpendicular to this. May be. In addition, the amorphous metal thin film may be formed using amorphous metal powder. Alternatively, it may be used as a knitted woven fabric-like or non-woven fabric-like sheet from thin wires made of amorphous metal, and this sheet may be used as an amorphous metal thin film.

The amorphous metal thin film has a shielding effect against an electric field, but particularly an excellent shielding effect against a magnetic field.

In the amorphous metal thin film laminate of the present invention, the amorphous metal thin film may be formed of the amorphous metal thin film alone, or a substrate composed of the amorphous metal thin film and at least one surface thereof covered. However, at least one layer of the amorphous metal thin film contains the amorphous metal thin film and the conductive metal plating layer.

As the conductive metal for plating, for example, copper,
Nickel, cobalt, iron, aluminum, gold, silver, tin,
Zinc and two or more alloys selected from these can be used. In this way, when a conductive metal is plated on at least one surface of the substrate made of an amorphous metal thin film, the obtained amorphous metal thin film has the electric field shielding property of the plating layer added to the magnetic field shielding property, so that the entire amorphous metal thin film is obtained. It is possible to show an excellent shielding effect against a wide range of electromagnetic waves from low frequency to high frequency. In addition, the conductive metal plating layer,
It also has the effect of improving the solder bondability of the amorphous metal thin film and facilitating the formation of a wide thin film from the amorphous metal thin film ribbon.

The conductive metal plating layer contained in the amorphous metal thin film preferably has a thickness of 0.1 μm or more, more preferably 0.1 to 5 μm. Further, a thin protective film such as a rust preventive may be formed on the surface of the amorphous metal thin film or its metal plating layer.

The amorphous metal thin films each have a thickness of 5 to 50 μm as described above, but the laminated body of the amorphous metal thin films of the present invention has a total thickness of 50 μm.
The thickness is preferably 100 to 5,000.
More preferably it has a thickness of 0 μm. Therefore, in the amorphous metal thin film laminate of the present invention, preferably 2 to 200 amorphous metal thin films are laminated and integrated in the thickness direction. In order to enhance and stabilize the shield effect of the laminated body, it is desirable to laminate a large number of amorphous metal thin films. That is, when using an amorphous metal thin film by bonding it to a wide area,
The larger the area, the more uneven the shielding effect, the lower the effect, or the more unstable. In order to solve such problems and obtain a stable shield effect, it is desirable to stack a large number of thin films.

The amorphous metal thin film laminate of the present invention is
It includes at least one amorphous metal thin film with a plated layer and at least one amorphous metal thin film having no plated layer. Thus, by omitting the plating layer from a part of the amorphous metal thin film, it is possible to obtain the required electromagnetic wave shielding property while reducing the product cost.

When a large number of amorphous metal thin films are laminated and adhered to each other, the adhesion regions formed by the adhesive or the pressure-sensitive adhesive do not overlap each other, so that a portion having a locally different thickness is not formed in the obtained laminate. It is preferable that the adhesives or the adhesives are distributed almost evenly in the laminate so that the adhesive areas of the adhesives do not overlap each other, thereby maintaining the uniformity of thickness and texture.

The adhesive or pressure-sensitive adhesive is used to electrically connect a plurality of laminated amorphous metal thin films to each other.
It is preferably electrically conductive or semi-conductive, and it can also be rustproof. There is no particular limitation on the type of such an adhesive or pressure-sensitive adhesive, and any of the existing ones can be arbitrarily selected and used according to the purpose of use. For example, a material having high cold resistance or a material having high heat resistance may be selected and used according to the use environment.

In general, a plurality of amorphous metal thin films in the laminate are adhered or adhered to each other with an adhesive or a tackifier. In this adhesion or adhesion, when an adhesive or an adhesive is applied and fixed to the entire surfaces of the amorphous metal thin films which are vertically adjacent to each other and overlap each other, when the laminated body is bent, the amorphous materials adhered or adhered to each other. The degree of freedom of mutual displacement between the metal thin films becomes insufficient. This problem,
This is especially noticeable when an adhesive is used. In order to solve such a problem, it is preferable that a plurality of amorphous metal thin films are not adhered or adhered to each other,
In this case, it becomes difficult to integrate a plurality of amorphous metal thin films.

In the amorphous metal thin film laminate of the present invention, the respective amorphous metal thin films are vertically adjacent to each other and overlap each other to be partially adhered or adhered to each other. Therefore, in portions other than the adhered or adhered portions, relative displacements are caused between them. It is possible. That is, in the present invention, each amorphous metal thin film is adhered or adhered to at least one linear or island-shaped adhesive or pressure-sensitive adhesive layer with respect to the vertically adjacent and overlapping portions thereof. There is. For example, in a laminated body composed of a plurality of amorphous metal thin films, the constituent amorphous metal thin films are distributed in at least one linear or island shape, or in a mixed state of these, or in a state in which coating lines intersect. It is adhered or tacked by a layer of adhesive or cohesive. A plurality of amorphous metal thin films are adhered to each other and integrated by the adhesion or adhesion in this manner. However, the non-bonded portions of the amorphous metal thin film can be displaced relative to each other in response to bending, which facilitates bending of the laminated body and prevents breakage of the laminated body due to bending.

The shape of the adhesive portion may be one or more straight lines, curved lines, or a mixed line of these, and these may intersect. Alternatively, it may consist of one or more island-shaped points, but the total adhesive application area is 1 to 9 with respect to the adhesion area of the amorphous metal thin film.
It is necessary to be within the range of 0%. When the adhesive application area ratio is less than 1%, the adhesive strength of the amorphous metal thin film becomes insufficient, and when it exceeds 90%, the bending property and the bending rupture resistance become insufficient.

The island-shaped or linear-shaped adhesive or pressure-sensitive adhesive application areas contained in the amorphous metal thin film laminate do not overlap with each other so that the laminate does not have uneven thickness locally. It is preferable that the layered product is distributed almost uniformly, whereby a laminate having a substantially uniform solidity can be obtained.

When an amorphous metal thin film is formed from the plurality of amorphous metal thin film ribbons, it is preferable to stack the amorphous metal thin film ribbons so that the ribbon bonding areas do not overlap each other.

[0031]

EXAMPLES The amorphous metal thin film laminate of the present invention will be further described below with reference to examples. Example 1 Amorphous alloy (Fe: 81%, B: 13.5%, S
i: 3.5%, C: 2%, trademark: METGLAS N
o. 2605SC, Allied, width 7.62 cm, thickness 2
The entire surface of the ribbon-shaped body having a thickness of 5 μm was plated with copper having a thickness of 1 μm. Thirteen amorphous metal thin film ribbons were arranged in parallel and the side edges of the ribbons were soldered together to form a wide thin film having a width of about 95 cm.

Ten sheets of the amorphous metal thin film with a wide plating layer having a width of 95 cm are laminated, and only the both ends in the length direction are linear (width 10 mm), and a synthetic rubber adhesive (trademark:
SC12N, manufactured by Sony Kelmir Co., Ltd.) was adhered to each other to obtain an integrated amorphous metal thin film laminate. The application area ratio of the adhesive was 2%. This amorphous metal thin film laminate exhibited an electromagnetic wave shielding effect of 90 dB.

Example 2 The same operation as in Example 1 was performed. However, as an adhesive
Dotite FE-102 (manufactured by Fujikura Kasei Co., containing Ag-Cu, acrylic resin adhesive for electromagnetic wave shielding, volume resistance: 10 ^-4 Ω-cm) having conductivity was used. The obtained amorphous metal thin film laminate exhibited an electromagnetic wave shielding property of 50 dB.

Example 3 The same operation as in Example 1 was performed. However, an acrylic resin adhesive was used instead of the adhesive. The obtained amorphous metal thin film laminate exhibited good flexibility and electromagnetic wave shielding properties similar to those of Example 1.

Example 4 The same operation as in Example 1 was performed. However, first, make a wide sheet of plated amorphous metal thin film, and apply non-plated amorphous metal thin film ribbon on both sides of the adhesive in a straight line with a width of 3 mm at 1.2 cm intervals. The thus-formed product was laminated and adhered to form a unit laminate having a three-layer structure. (The application area ratio of the adhesive was about 20%.) As described above, the unit laminated body obtained at low cost by laminating the amorphous metal thin films without plating is 40 dB.
It showed excellent electromagnetic wave shielding properties. Further, the electromagnetic shielding property of the amorphous metal thin film laminated body obtained by further adhering two or three sets of the unit laminated bodies is 60d, respectively.
B and 80 dB were more preferable.

As described above, the amorphous metal narrow ribbon-shaped thin film without plating is sequentially bonded on the entire surface of the wide base material with a pressure sensitive adhesive or an adhesive to widen it and to form a multi-layer. Also, it is possible to manufacture an amorphous metal thin film laminated body at a low cost by a simple method, and in particular, it has opened the way to commercialization of a wide sheet containing an amorphous metal thin film.

Example 5 Three sets of laminated bodies each consisting of five pieces of the amorphous metal thin films with a wide plating layer obtained in Example 1 were prepared, and each set of amorphous metal thin films was prepared by using one of the following adhesives. Then, they were laminated and adhered to obtain an amorphous metal thin film laminate. Adhesive (a) SC-12N (b) Dauite FE-102

The obtained amorphous metal thin film laminate exhibited a good electromagnetic wave shielding property.

Example 6 The same operation as in Example 5 was performed. However, only the outermost front and back layers in the amorphous metal thin film laminate are constituted by plated amorphous metal thin films, and the middle three layers are formed by the non-plated amorphous metal thin film ribbon (same as that described in Example 1). They were arranged side by side so that there were no gaps, and the front and back layers and the intermediate three layers were adhesively adhered to each other to form a laminate. The obtained amorphous metal thin film laminate exhibited a satisfactory electromagnetic wave shielding effect.

[0040]

The amorphous metal thin film laminate of the present invention is formed by laminating and bonding a plurality of amorphous metal thin films including at least one amorphous metal thin film with a conductive plating layer. Sex, flexibility,
It has strength, shock absorption, and workability, and also has excellent electromagnetic wave shielding properties, so it is useful as an electromagnetic wave shielding coating, or as a packaging sheet, rug, wallpaper sheet, or the like and its material. It is something. Further, the amorphous metal thin film laminate of the present invention can be used in combination with any of the intermediate products or finished products in the above applications.

Claims (13)

[Claims] 1. A plurality of amorphous metal thin films laminated on each other and adhered by an adhesive or a pressure sensitive adhesive, wherein at least one layer of the amorphous metal thin film is formed on the at least one surface of the amorphous metal thin film. And a plating layer made of at least one kind of conductive metal, and on the adhesive surface of the amorphous metal thin film, the adhesive or pressure-sensitive adhesive is
It is distributed in one or more lines, or in one or more islands,
The amorphous metal thin film laminate, wherein the total distribution area of the adhesive or the pressure sensitive adhesive is within a range of 1.0 to 90% with respect to the area of the adhesive surface of the amorphous metal thin film. 2. The amorphous metal thin film laminate according to claim 1, wherein the adhesive or pressure-sensitive adhesive has conductivity or semi-conductivity. 3. The amorphous metal thin film laminate according to claim 1, wherein the adhesive or pressure-sensitive adhesive application areas between the plurality of laminated amorphous metal thin films are formed at positions that do not overlap each other. 4. The amorphous metal thin film laminate has at least one amorphous metal thin film with a plated layer,
The amorphous metal thin film laminate according to claim 1, comprising an amorphous metal thin film having no at least one plating layer. 5. The conductive metal plating layer is at least one selected from copper, nickel, cobalt, iron, aluminum, gold, silver, tin, zinc and an alloy containing at least one selected from the above metals. The amorphous metal thin film laminate according to claim 1, which comprises: 6. The amorphous metal thin film laminate according to claim 1, wherein the amorphous metal thin film comprises a plurality of amorphous metal thin film ribbons arranged in parallel with each other. 7. The amorphous metal thin film ribbon according to claim 6, wherein the amorphous metal thin film ribbons are bonded to each other at their longitudinal edges by a conductive adhesive or solder to form a single thin film having a desired width. Amorphous metal thin film laminate. 8. The amorphous metal thin film ribbon according to claim 6, wherein the amorphous metal thin film ribbons are bonded to each other at their long edge portions by an adhesive or a pressure sensitive adhesive to form an integral thin film having a desired width. Metal thin film laminate. 9. The amorphous metal thin film stack according to claim 7, wherein a plurality of amorphous metal thin films composed of the bonded amorphous metal thin film ribbons are stacked so that the ribbon bonding regions do not overlap each other. body. 10. The amorphous metal thin film comprises Fe,
A main component having at least one member selected from Co, Ni, Pd, Cu, Nb and Ti, and B, Si, C, C
o, Ni, Cr, Zr, Nb, Cu, Ti, and Mo
At least one member selected from the group consisting of metal-containing additive components contained in the main component,
The amorphous metal thin film laminate according to claim 1. 11. Each of the amorphous metal thin films comprises:
The amorphous metal thin film laminate according to claim 1, having a thickness of 5 to 100 μm. 12. The amorphous metal thin film laminate has 5 layers.
The amorphous metal thin film laminate according to claim 1, having a total thickness of 0 to 5,000 μm. 13. The conductive metal plating layer has a thickness of 0.1 μm.
The amorphous metal thin film laminate according to claim 1, having a thickness of m or more.