JPH08306960A - Chip type light emitting device - Google Patents

Abstract

(57) 【Abstract】 PROBLEM TO BE SOLVED: To use a convex lens part capable of obtaining emitted light with high brightness, and securely hold it by a suction nozzle by suction, and a chip type in which the convex lens part is not scratched during this suction holding. An object is to provide a light emitting device. According to the present invention, a concave portion is formed on a substantially flat upper surface, and a convex lens portion is formed in the concave portion, and the flat upper surface is flush with a plane including an apex of the convex lens portion. A resin mold which is above and in which the side wall surface of the concave portion is substantially continuous with the convex lens portion; and a plurality of light emitting elements which are covered with the resin mold and which are present just below the apex of the convex lens portion. It is a chip-type light emitting device provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device formed in a chip shape, and more particularly to a chip type light emitting device having a convex lens portion for obtaining emitted light with high brightness.

[0002]

2. Description of the Related Art In recent years, electronic devices equipped with a chip type light emitting device such as a chip LED are often used outdoors and accordingly, the brightness of light emitted from the light emitting device such as the LED device is reduced. The need to raise it is growing. For this reason, a chip-type light emitting device in which a convex lens is provided on the light emitting surface of the light emitting element has been proposed.

A plan view of the chip type light emitting device with a convex lens is shown in FIG. 2, and a side view thereof is shown in FIG. 3 (a). The light emitting part 2 of the chip type light emitting device 1 of the illustrated example is formed by molding a transparent resin into a substantially rectangular parallelepiped shape.
One ends of the leads 3a, 3b, 3c respectively project from both side surfaces of the light emitting section 2.

When such a chip type light emitting device 1 is mounted on, for example, a circuit board (not shown), the convex lens portion 2 is used.
The suction nozzle 4 of the automatic mounting machine is brought into contact with and sucked onto b. The suction nozzle 4 communicates with the exhaust passage,
The inner diameter d is smaller than the lens diameter D of the convex lens portion 2b (d> D).

[0005]

However, since the surface of the convex lens portion 2b has a substantially semi-spherical shape, the structure shown in FIG.
As shown in (b), the chip-type light emitting device 1 is often sucked in a state of being tilted with respect to the axis of the suction nozzle 4. In this case, for example, it becomes difficult to accurately guide the chip-type light emitting device 1 to a position to be mounted on a circuit board (not shown), and mounting failure is likely to occur.
In recent years, as the mounting density of circuit boards has increased,
Such a mounting failure is fatal because it may be mounted in another adjacent mounting area. Moreover, when the chip-type light emitting device 1 is suction-held by using the suction nozzle 4 as described above, suction air is likely to leak due to the surface state of the suction surface of the chip-type light emitting device 1. That is, the suction nozzle 4
The air in the exhaust passage has an adsorption function because the opening surface of the exhaust passage is completely blocked by the chip-type light emitting device 1, but the surface of the chip-type light emitting device 1 to be adsorbed has an uneven shape. If it is present, leakage will occur easily and the adsorption action will not work easily. As a result, the chip type light emitting device 1 may not be surely adsorbed and held.

Further, if such a mounting failure is caused, manual correction work is required, which causes a problem of a great obstacle to automatic assembly. Furthermore, since the convex lens portion 2b directly contacts the suction nozzle 4, the convex lens portion 2
There is a risk that the b is scratched and the yield is reduced. As a prior art for solving this, as a practical technique, Shokai 59-91.
There is a light emitting diode lamp described in Japanese Patent No. 764. As shown in FIG. 4A, this light emitting diode lamp has a structure in which a dome-shaped light emitting portion 5b is provided in a recess 5a formed in the upper surface of the resin sealing portion 5.

However, when the upper surface of the light-emitting diode lamp is suction-held by the suction nozzle (not shown), the light-emitting portion 5b is provided at a lower position in the recess 5a, so Since the space area defined between the resin sealing portion 5 and the recess 5a is large, and since the upper surface of the resin sealing portion 5 does not have a flat surface, the suction nozzle is the resin sealing portion 5. Therefore, the suction air in the suction nozzle is likely to leak and a suction failure is likely to occur.

Further, in the semiconductor device described in Japanese Utility Model Publication No. 58-211764, as shown in FIG.
The resin body 8 has a concave portion 7a formed on the upper surface thereof, and a convex lens 7b formed substantially at the center of the flat bottom surface of the concave portion 7a. Also in this semiconductor device, when the surface on the light emitting side is suction-held by the suction nozzle, the suction nozzle and the recess 7 are provided because the recess 7a has a flat bottom surface.
Since the space area defined between a and a becomes large, the suction air in the suction nozzle easily leaks and a suction failure easily occurs.

The present invention was created under the above-mentioned background, and an object of the present invention is to surely adsorb by a suction nozzle while using a convex lens portion capable of obtaining emitted light of high brightness. It is an object of the present invention to provide a chip-type light emitting device that can be held and in which the convex lens portion is not scratched when held by suction.

[0010]

In order to solve the above problems, the present invention provides a concave portion formed in a substantially flat upper surface, and a convex lens portion is formed in the concave portion. A resin mold whose upper surface is on the same plane as the plane including the apex of the convex lens portion, and the side wall surface of the concave portion is substantially continuous with the convex lens portion; and the convex lens covered with the resin mold. Provided is a chip-type light-emitting device including a plurality of light-emitting elements that are located just below the top of a part.

[0011]

In such a chip type light emitting device, the resin mold has a concave portion formed in a substantially flat upper surface, a convex lens portion is formed in the concave portion, and the flat upper surface has the convex shape. Since it is on the same plane as the plane including the apex of the lens portion and the side wall surface of the concave portion is continuous with the convex lens portion, for example, a chip-type light emitting device is mounted on a circuit board using a suction collet. In this case, when the chip type light emitting device is suction-held on the upper surface thereof by the suction collet, the convex lens portion hardly contacts the suction collet and is scarcely scratched. Since the space of the recess between the lens and the lens is extremely small, the suction air of the suction collet is unlikely to leak, and the chip-type light emitting device can be securely suction-held. To become. Further, since the light emitting element is located substantially directly below the apex of the convex lens portion, light from the light emitting element is most efficiently emitted to the outside through the convex lens portion, and a plurality of light emitting elements are present. As a result, light of higher brightness is emitted.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 1A is a partially cutaway side view of a chip type light emitting device according to an embodiment of the present invention.
The chip-type light emitting device has a substantially rectangular parallelepiped light emitting portion, and FIG. 1A is a side view of the light emitting portion as viewed from the lateral direction side.

The chip type light emitting device 10 of the illustrated example has a light emitting portion 11 formed by molding a transparent resin into a substantially rectangular parallelepiped shape.
And leads 20a to 20d (lead 20b) made of aluminum or the like, each end of which projects outward from the light emitting portion 11.
And 20d are not shown) and the leads 20a, 20
die-bonded on the respective leads 20c,
20d, each of which is electrically connected to each other by wire bonding and includes a diode chip (light emitting element, not shown) located in the light emitting section 11. Lead 20a ~
The two 20 d are projected from the light emitting section 11 in a state where two left and right are arranged along the longitudinal direction of the chip type light emitting device.

The main part of this embodiment will be described in detail below.
An inverted frustoconical recess 11b is formed at a substantially central position on the upper surface 11a of the light emitting unit 11. A convex lens portion 11c is formed in the concave portion 11b, and the upper surface 11a is formed.
Exists on substantially the same plane as the plane including the apex of the convex lens portion 11c, and more specifically, the apex of the convex lens portion 11c is located lower than the upper surface 11a. At this time, the diode chips (not shown) are arranged at positions substantially directly below the convex lens portion 11c.

These leads 20a to 20d are bent and formed in a substantially crank shape so that they can be surface-mounted on a circuit board (not shown). The chip type light emitting device 10
When the suction nozzle 12 has an inner diameter d smaller than the lens diameter of the convex lens portion 11c, the suction nozzle is brought into contact with the upper surface of the light emitting portion 11. At this time, since the apex of the convex lens portion 11c is below the upper surface 11a, the suction nozzle 12 does not contact the convex lens portion 11c.

In this state, a narrow exhaust space is formed by the side wall surface of the concave portion 11b, the surface of the convex lens portion 11c, and the suction surface of the suction nozzle 12, and the suction nozzle 12 that effectively exerts the suction action by the exhaust gas. Therefore, the semiconductor light emitting element 10 can be securely adsorbed and held without hitting the surface of the convex lens portion 11c. Even if the chip-type light emitting device 10 is displaced left and right with respect to the suction surface of the suction nozzle 12, the convex lens portion 11c has a vertex lower than the upper surface 11a, so that the surface of the convex lens portion 11c is almost the suction nozzle. It does not hit 12 and is not damaged, nor is it affected by adsorption as described above.

Here, since the convex lens portion 11c is provided so as to project from the bottom surface of the concave portion 11b having the shape of an inverted truncated cone, the convex lens has a point emission type high brightness effect and a side surface effect of the sidewall surface of the concave portion 11b. The semiconductor light emitting device 10 has a high range and high brightness light emitting characteristics. Furthermore, the convex lens portion 11c
By integrally molding the light emitting portion 11 including the transparent resin, it is possible to reduce the number of parts and simplify the element manufacturing process.

Therefore, the radius of the convex lens portion 11c is set to 0.6 mm, and the apex of the convex lens portion 11c is set to the upper surface 1.
It was confirmed that when it was lowered by about 0.1 mm from 1a, it was about twice as high as the brightness of light emitted from now on. The number of diode chips and leads to be mounted is not limited. Further, as shown in FIG. 1B, the lens apex may be positioned above the upper surface 11a to a position where the nozzle abutment does not hit the inside of the nozzle.

In the present embodiment, the shape of the convex lens portion is not shown, but any shape may be adopted as long as the light emitting element exists substantially directly below the apex thereof. For example, the apex is continuous on a straight line. Existing shape, that is, a semi-cylindrical shape with a semi-lunar cross section, or a plurality of domed semi-spherical spheres arranged to correspond to each light-emitting element But it's okay.

In this embodiment, the light emitting element is
However, the present invention is not limited to this, and a plurality may be used. Furthermore, in this embodiment, the chip-type light emitting device has a structure in which the leads 20a to 20d project from the light emitting portion 11, but the present invention is not limited to this, and for example, a wiring pattern may be formed on the surface. A substrate-type light-emitting device such as a chip LED in which a light-emitting element is die-bonded and wire-bonded to a chip-shaped substrate which is formed and electrodes for external connection are formed at both ends and the light-emitting element is molded with a transparent resin Needless to say, it is included.

In this embodiment, the chip light emitting device has a flat surface on the upper surface. However, the present invention is not limited to this, and the chip light emitting device of the present invention has a flat surface on the upper surface. Including those that do not exist. The apex of the convex lens portion in the present invention indicates, for example, a portion (which may be a point, a line, or a surface) at the uppermost position in the vertical direction in FIG.

The term "substantially directly below the apex of the convex lens portion" in the present invention means a position on or near a perpendicular line (which may be a vertical surface) passing through the apex. Further, whether the side wall surface of the recess in the present invention is inclined or perpendicular to the upper surface of the light emitting section does not limit this. Further, the recess includes those formed so as to reach both end surfaces in the longitudinal direction of the light emitting portion, and those formed so as to be surrounded by the side wall surfaces on all four sides, and the formation region and shape thereof are not limited. .

In addition, in the present invention, the side wall surface of the concave portion being substantially continuous with the convex lens portion means that the side wall surface of the concave portion is substantially flat between the lower end edge and the lower end edge of the convex lens portion. That is, the flat surface referred to here does not include a flat surface that is small in terms of manufacturing (to a degree that allows good die cutting in terms of the resin molding method).

[Brief description of drawings]

FIG. 1 shows a chip type light emitting device of the present invention,
(A) is a partial cutaway side view, and (b) is a partial cutaway side view showing another chip-type light emitting device.

FIG. 2 is a diagram for explaining a conventional chip-type light emitting device and is a plan view of the chip-type light emitting device.

3 (a) and 3 (b) are diagrams showing a nozzle suction state of a conventional chip-type light emitting device.

FIG. 4 is a cross-sectional view showing a conventional chip-type light emitting device.

[Explanation of symbols]

 10 chip LED 11 light emitting part 12 adsorption collet 20 lead

Claims (1)

[Claims] 1. A concave portion is formed on a substantially flat upper surface, a convex lens portion is formed in the concave portion, and the flat upper surface is on the same plane as a plane including the apex of the convex lens portion. A chip provided with a resin mold in which the side wall surface of the concave portion is substantially continuous with the convex lens portion, and a plurality of light emitting elements which are covered with the resin mold and are located substantially directly below the apex of the convex lens portion. Type light emitting device.