JPH083171A - 付加物、該付加物の製造方法及び薄膜の製造方法 - Google Patents

付加物、該付加物の製造方法及び薄膜の製造方法

Info

Publication number
JPH083171A
JPH083171A JP7151083A JP15108395A JPH083171A JP H083171 A JPH083171 A JP H083171A JP 7151083 A JP7151083 A JP 7151083A JP 15108395 A JP15108395 A JP 15108395A JP H083171 A JPH083171 A JP H083171A
Authority
JP
Japan
Prior art keywords
crown
adduct
thd
precursor
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7151083A
Other languages
English (en)
Japanese (ja)
Inventor
Stephen A Dicarolis
スティーブン・エイ・ジカロリス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JPH083171A publication Critical patent/JPH083171A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic Table
    • C07F1/005—Compounds containing elements of Groups 1 or 11 of the Periodic Table without C-Metal linkages
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F13/00—Compounds containing elements of Groups 7 or 17 of the Periodic Table
    • C07F13/005—Compounds without a metal-carbon linkage
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F15/00—Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic Table
    • C07F15/04—Nickel compounds
    • C07F15/045—Nickel compounds without a metal-carbon linkage
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F15/00—Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic Table
    • C07F15/06—Cobalt compounds
    • C07F15/065—Cobalt compounds without a metal-carbon linkage
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F3/00—Compounds containing elements of Groups 2 or 12 of the Periodic Table
    • C07F3/003—Compounds containing elements of Groups 2 or 12 of the Periodic Table without C-Metal linkages
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Vapour Deposition (AREA)
  • Heterocyclic Compounds That Contain Two Or More Ring Oxygen Atoms (AREA)
JP7151083A 1994-06-17 1995-05-25 付加物、該付加物の製造方法及び薄膜の製造方法 Pending JPH083171A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US261572 1994-06-17
US08/261,572 US5412129A (en) 1994-06-17 1994-06-17 Stabilization of precursors for thin film deposition

Publications (1)

Publication Number Publication Date
JPH083171A true JPH083171A (ja) 1996-01-09

Family

ID=22993913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7151083A Pending JPH083171A (ja) 1994-06-17 1995-05-25 付加物、該付加物の製造方法及び薄膜の製造方法

Country Status (4)

Country Link
US (1) US5412129A (sv)
EP (1) EP0687677A1 (sv)
JP (1) JPH083171A (sv)
FI (1) FI952995A7 (sv)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7335783B2 (en) 2004-06-14 2008-02-26 Adeka Corporation Thin film-forming material and method for producing thin film
KR20170107093A (ko) * 2015-07-14 2017-09-22 엘지 나노에이치투오, 인코포레이티드 수분 플럭스 향상을 위한 화학 첨가제들

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5840897A (en) * 1990-07-06 1998-11-24 Advanced Technology Materials, Inc. Metal complex source reagents for chemical vapor deposition
US5820664A (en) * 1990-07-06 1998-10-13 Advanced Technology Materials, Inc. Precursor compositions for chemical vapor deposition, and ligand exchange resistant metal-organic precursor solutions comprising same
US6110529A (en) * 1990-07-06 2000-08-29 Advanced Tech Materials Method of forming metal films on a substrate by chemical vapor deposition
US7323581B1 (en) 1990-07-06 2008-01-29 Advanced Technology Materials, Inc. Source reagent compositions and method for forming metal films on a substrate by chemical vapor deposition
US5679815A (en) * 1994-09-16 1997-10-21 Advanced Technology Materials, Inc. Tantalum and niobium reagents useful in chemical vapor deposition processes, and process for depositing coatings using the same
US5916359A (en) * 1995-03-31 1999-06-29 Advanced Technology Materials, Inc. Alkane and polyamine solvent compositions for liquid delivery chemical vapor deposition
KR100266965B1 (ko) * 1997-12-02 2000-09-15 김충섭 리튬과 13 족 금속의 알킬산알킬헤테로금속 화합물을 사용한 리튬과 13 족 금속의 복합 산화물의 제조방법
US6133051A (en) * 1998-06-30 2000-10-17 Advanced Technology Materials, Inc. Amorphously deposited metal oxide ceramic films
US6015917A (en) 1998-01-23 2000-01-18 Advanced Technology Materials, Inc. Tantalum amide precursors for deposition of tantalum nitride on a substrate
US7012292B1 (en) * 1998-11-25 2006-03-14 Advanced Technology Materials, Inc Oxidative top electrode deposition process, and microelectronic device structure
WO2000067300A1 (en) * 1999-04-29 2000-11-09 President And Fellows Of Harvard College Liquid precursors for formation of materials containing alkali metals
US6994800B1 (en) 1999-04-29 2006-02-07 President And Fellows Of Harvard College Liquid precursors for formation of materials containing alkali metals
KR100381388B1 (ko) * 2000-07-06 2003-04-23 (주)유피케미칼 산화금속 박막 증착용 전구체 화합물 및 그를 이용한 박막증착 방법
US7166732B2 (en) * 2004-06-16 2007-01-23 Advanced Technology Materials, Inc. Copper (I) compounds useful as deposition precursors of copper thin films
US20060102895A1 (en) * 2004-11-16 2006-05-18 Hendrix Bryan C Precursor compositions for forming tantalum-containing films, and tantalum-containing barrier films and copper-metallized semiconductor device structures
US9312557B2 (en) * 2005-05-11 2016-04-12 Schlumberger Technology Corporation Fuel cell apparatus and method for downhole power systems
TW200825200A (en) * 2006-12-05 2008-06-16 Advanced Tech Materials Metal aminotroponiminates, bis-oxazolinates and guanidinates
US7750173B2 (en) * 2007-01-18 2010-07-06 Advanced Technology Materials, Inc. Tantalum amido-complexes with chelate ligands useful for CVD and ALD of TaN and Ta205 thin films

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3911176A (en) * 1974-01-02 1975-10-07 Rca Corp Method for vapor-phase growth of thin films of lithium niobate
US5098516A (en) * 1990-12-31 1992-03-24 Air Products And Chemicals, Inc. Processes for the chemical vapor deposition of copper and etching of copper

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7335783B2 (en) 2004-06-14 2008-02-26 Adeka Corporation Thin film-forming material and method for producing thin film
KR20170107093A (ko) * 2015-07-14 2017-09-22 엘지 나노에이치투오, 인코포레이티드 수분 플럭스 향상을 위한 화학 첨가제들
JP2018516848A (ja) * 2015-07-14 2018-06-28 エルジー・ナノエイチツーオー・インコーポレイテッド 水分流量を向上させるための化学添加剤｛ｃｈｅｍｉｃａｌ ａｄｄｉｔｉｖｅｓ ｆｏｒ ｗａｔｅｒ ｆｌｕｘ ｅｎｈａｎｃｅｍｅｎｔ｝

Also Published As

Publication number Publication date
FI952995A0 (sv) 1995-06-16
FI952995L (sv) 1995-12-18
FI952995A7 (sv) 1995-12-18
EP0687677A1 (en) 1995-12-20
US5412129A (en) 1995-05-02

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