JPH0832010A - Support device for detachably supporting an electronic component and a wiring board on which the electronic component is mounted - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide an electronic component in which stress is prevented from concentrating on a part of solder and reliability of a solder connection portion is improved. [Structure] In an electronic component 1 in which a plurality of leads 3 are adjacently drawn out from a side surface of a package 2 at a narrow pitch, an end surface 4 of each of the plurality of leads 3 to be soldered to a wiring board has an end portion 4A. An inclined surface 5 that is inclined along the length direction L of the lead 3 is formed. This slope 5
Due to the presence of, even if stress occurs during the temperature cycle test,
Since this stress is relieved along the inclined surface 5, it is not concentrated on a part of the solder.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a supporting device for detachably supporting an electronic component and a wiring board on which the electronic component is mounted,
In particular, the present invention relates to a technique effectively applied to an electronic component in which the tips of the leads are soldered to a wiring board.

[0002]

2. Description of the Related Art Recent LSIs known as representative of electronic parts
As the demand for miniaturization, high integration, and multi-functionality is increasing, the lead frames on which semiconductor chips are mounted tend to be those with more pins and multiple pins. This lead frame is manufactured by stamping or etching a metal plate.

As a package technology for dealing with such a fine pitch and a large number of pins, for example, QFP (Quad) is used.
A resin-encapsulated package called a Flat Package) is used, and a plurality of leads are drawn out at a narrow pitch from four side surfaces of this package. Alternatively, SOP (Small Outlet P
A resin-encapsulated package called an "package" is used, and a plurality of leads are drawn out at a narrow pitch from two opposite side surfaces of the package.

The tips of a plurality of leads drawn out from the side surface of such an LSI package are formed into gull wing type, J type, I type or the like, and the tips of the leads are soldered. The LSI is mounted on the wiring board.

In addition to the LSI, a lead frame is used not only in an LSI but also in a transistor which is another electronic component. After mounting a semiconductor chip on the lead frame, the whole is resin-sealed for assembly. .

A technique for mounting a transistor, which is thus resin-sealed and assembled using a lead frame, on a wiring board is disclosed in Japanese Patent Laid-Open No. 63-204634. The mounting technology disclosed in this publication is such that when a metal plate is punched out to form a lead frame, solder is only thinly attached to the sore portion caused by punching existing on both edges of the lead, and the opposite of one side. Paying attention to the phenomenon that solder adheres to the entire surface even if it is thin on the burr part that occurs on the surface where
It is mounted on a wiring board.

Here, both the droop and the burr are formed on both edges along the length direction of the lead. Further, the end faces of the tips of the leads soldered to the wiring board are formed so as to be orthogonal to the length direction of the leads.

[0008]

When the present inventor mounts an electronic component having such a lead on a wiring board and then performs a temperature cycle test, stress concentrates on a part of the solder,
It was discovered that the reliability of the solder joints was reduced.

More specifically, when a mounting board on which electronic parts are mounted is subjected to a temperature cycle test in which a temperature change between a negative low temperature and a high temperature of 100 degrees or more is repeated 1000 times, most of them are tested. However, there was a phenomenon in which the solder expanded and contracted due to the difference in temperature and the stress was concentrated on a part of the solder, and as a result, it was confirmed that solder cracks occurred from the stress concentrated portion. When the phenomenon of stress concentration was further investigated, it was found that the root cause was the shape of the tip of the soldered lead.

That is, if the end face of the tip is formed so as to be orthogonal to the length direction of the lead like a lead formed by punching a metal plate, the tip is soldered to a wiring board. The stress generated during the temperature cycle test is concentrated in the solder near the corners of the end faces of the leads. Therefore, solder cracks are introduced from the stress concentration portion, and there is a problem that the reliability of the solder connection portion is reduced.

Further, in particular, in an electronic component in which a plurality of leads to be soldered to a wiring board from the side surface of the package are adjacently drawn out at a narrow pitch, when these are mounted on the wiring board, a solder bridge is formed between the adjacent leads. Occurs and lead short circuit occurs.

Further, one electronic component in which a plurality of leads are adjacently drawn out from the side surface of the package at a narrow pitch,
Alternatively, in a supporting device such as a socket or a connector that detachably supports a plurality of mounted wiring boards, a plurality of leads that are electrically connected to the terminals of the wiring board are arranged adjacent to each other at a narrow pitch on this side surface. When this support device is incorporated into an electronic device such as a computer, there is a problem that a solder bridge is generated between adjacent leads and a lead short circuit occurs as in the above case.

An object of the present invention is to provide an electronic component which prevents stress from concentrating on a part of the solder and improves the reliability of the solder connection portion.

Another object of the present invention is to provide an electronic component which prevents lead short-circuiting by preventing solder bridging between adjacent leads.

Another object of the present invention is to provide a support device for detachably supporting a wiring board mounted with an electronic component for preventing lead short circuit by preventing solder bridging between adjacent leads. .

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0017]

Among the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

(1) The electronic component of the present invention is an electronic component provided with a lead soldered to a wiring board. In the lead, the end face of the tip soldered to the wiring substrate has a length from the end to the lead. It is formed so as to be inclined along the depth direction.

(2) The electronic component of the present invention is an electronic component provided with a lead to be soldered to a wiring board, wherein the lead has an end face of a tip soldered to the wiring substrate from an end to a length of the lead. It is formed in an arc shape along the vertical direction.

(3) The electronic component of the present invention is an electronic component in which a plurality of leads to be soldered to the wiring board are adjacently drawn from the side surface of the package, and the plurality of leads are soldered to the wiring board. The end face of the tip is formed so as to be inclined from the end along the length direction of the lead.

(4) The electronic component of the present invention is an electronic component in which a plurality of leads to be soldered to a wiring board are adjacently drawn from the side surface of the package, and at least one of the adjacent ones of the plurality of leads. The lead is made of a conductor whose entire peripheral surface except the soldering surface is covered with an insulator.

(5) The electronic component of the present invention is an electronic component in which a plurality of leads to be soldered to a wiring board are adjacently drawn from the side surface of the package, and at least one of the adjacent ones of the plurality of leads. The lead is made of a conductor whose side surface facing the adjacent lead is covered with an insulator.

(6) A supporting device for detachably supporting a wiring board on which an electronic component is mounted according to the present invention includes a frame body for detachably supporting a wiring board on which an electronic component is mounted, and a side surface of the frame body. A plurality of leads that are electrically connected to the terminals of the wiring board are arranged adjacent to each other, and at least one lead of the plurality of leads that is adjacent to each other is covered with an insulator on all peripheral surfaces except a soldering surface. It consists of a conductor.

(7) A supporting device for detachably supporting a wiring board on which an electronic component is mounted according to the present invention includes a frame body for detachably supporting a wiring board on which an electronic component is mounted, and a side surface of the frame body. A plurality of leads that are electrically connected to the terminals of the wiring board are arranged adjacent to each other, and at least one lead of the plurality of leads adjacent to each other has a side surface facing the adjacent lead covered with an insulator. It consists of a body.

[0025]

According to the above-mentioned means (1), in the electronic component of the present invention, the lead soldered to the wiring board is such that the end face of the tip soldered to the wiring board is from the end to the length direction of the lead. Since it is formed so as to be inclined along with, the stress is prevented from being concentrated on a part of the solder due to the existence of the inclined end surface, and the reliability of the solder connection portion can be improved.

According to the above-described means (2), in the electronic component of the present invention, the lead soldered to the wiring board is such that the end face of the tip soldered to the wiring board is from the end to the length direction of the lead. Since it is formed in an arc shape along the edge, it is possible to prevent stress from being concentrated on a part of the solder due to the existence of the arc-shaped end surface, and it is possible to improve the reliability of the solder connection portion.

According to the above-mentioned means (3), in the electronic component of the present invention, the plurality of leads, which are soldered to the wiring board adjacently drawn from the side surface of the package, are soldered to the wiring board. Since the end face of the tip is formed to incline along the length direction of the lead from the end, the concentration of stress on a part of the solder due to the presence of this inclined end face is prevented, and the reliability of the solder joint is improved. It is possible to improve the sex.

According to the above-mentioned means (4), the electronic component of the present invention has at least one of a plurality of leads, which are soldered to the wiring board adjacently drawn from the side surface of the package, and which are adjacent to each other. The lead is made of a conductor whose entire peripheral surface except for the soldering surface is covered with an insulator, so the presence of this insulator prevents solder bridging between adjacent leads, leading to lead shorts. It can be lost.

According to the above-described means (5), the electronic component of the present invention has at least one of a plurality of leads, which are adjacent to each other and are soldered to the wiring board which is pulled out from the side surface of the package. Since the lead of is made of a conductor whose side surface facing the adjacent lead is covered with an insulator, the presence of this insulator prevents solder bridging between the adjacent leads and eliminates lead shorts. You can

According to the above-mentioned means (6), the supporting device which detachably supports the wiring board on which the electronic component of the present invention is mounted is a frame body which detachably supports the wiring board on which the electronic component is mounted. A plurality of leads that are electrically connected to the terminals of the wiring board are arranged adjacent to each other on at least one side of the plurality of leads. Since it is composed of a conductor covered with, the presence of this insulator prevents solder bridging between adjacent leads and eliminates lead shorts.

According to the above-mentioned means (7), the supporting device which detachably supports the wiring board on which the electronic component of the present invention is mounted is a frame body which detachably supports the wiring board on which the electronic component is mounted. A plurality of leads that are electrically connected to the terminals of the wiring board are arranged adjacent to each other on a side surface of the wiring board, and at least one lead of the plurality of adjacent leads is covered with an insulator on a side surface facing the adjacent lead. Since it is made of a broken conductor, the presence of this insulator prevents solder bridging between the adjacent leads, thereby eliminating lead shorts.

[0032]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a perspective view showing an electronic component according to Embodiment 1 of the present invention, FIG. 2 is an enlarged view of a main part of FIG. 1, and FIG. B) is a front view. The electronic component 1 of the present embodiment is composed of, for example, an LSI having a SOP package 2, and a plurality of leads 3 made of, for example, an Fe—Ni alloy material, Cu, Kovar, etc. are arranged at a narrow pitch from two opposing side surfaces of the package 2. It is pulled out next to. The leads 3 are electrically connected to the electrodes of the semiconductor chip sealed by the package 2.

An end surface 4 of each of the plurality of leads 3 which is to be soldered to the wiring board is formed with an inclined surface 5 which is inclined from the end 4A along the length direction L of the lead 3. The inclined surface 5 is formed by press working using a mold having a shape corresponding to this, or by etching.

FIG. 3 is a sectional view showing the structure of the electronic component 1 of this embodiment in which a plurality of leads 3 are mounted on a wiring board 7 by solder 6. Soldering of the plurality of leads 3 is performed by applying a soldering technique such as reflow or flow.

According to the electronic component 1 according to the first embodiment, the following effects can be obtained.

In the plurality of leads 3 to be soldered to the wiring board 7, the end surface 4 at the tip to be soldered to the wiring board 7 has an inclined surface 5 which is inclined from the end portion 4A along the length direction L of the lead 3. Since it is formed, the presence of this inclined surface 5
Even if a stress is generated during the temperature cycle test, this stress is relaxed along the inclined surface 5, and is not concentrated on a part of the solder. That is, since the end surface 4 of the lead 3 of the electronic component 1 of the present embodiment is not formed so as to be orthogonal to the length direction L of the lead 3 unlike the conventional end surface, the end surface 4 has no corner portion. Therefore, the stress does not concentrate on a part. Therefore, since solder cracks do not occur, the reliability of the solder connection portion can be improved.

(Embodiment 2) FIG. 4 shows an electronic component according to Embodiment 2 of the present invention, (A) is a side view and (B) is a front view. The electronic component 1 of this embodiment has a plurality of leads 3
End surface 4 of the tip to be soldered to each wiring board in
An arcuate curved surface 8 is formed along the length direction L of the lead 3 from the end 4A. Similar to the first embodiment, the curved surface 8 is formed by pressing using a mold having a shape corresponding to the curved surface 8 or by etching. FIG. 5 is a cross-sectional view showing a structure in which the electronic component 1 of the present embodiment has a plurality of leads 3 mounted on a wiring board 7 with solder 6.

According to the electronic component 1 according to the second embodiment, the following effects can be obtained.

In the plurality of leads 3 to be soldered to the wiring board 7, the end surface 4 at the tip to be soldered to the wiring board 7 is an arcuate curved surface 8 along the length direction L of the lead 3 from the end 4A.
Since the curved surface 8 is formed, even if a stress is generated during the temperature cycle test due to the presence of the curved surface 8, the stress is relaxed along the curved surface 8 and is not concentrated on a part of the solder. That is, the end surface 4 of the lead 3 of the electronic device 1 of the present embodiment is not formed so as to be orthogonal to the length direction L of the lead 3 unlike the end surface of the related art similar to the first embodiment. Since there is no corner in 4, the stress is not concentrated in a part. Therefore, since solder cracks do not occur, the reliability of the solder connection portion can be improved.

(Embodiment 3) FIG. 6 shows an electronic component according to Embodiment 3 of the present invention, (A) is a side view and (B) is a front view. The electronic component 1 of the present embodiment shows a modification of the second embodiment, and in addition to the side surface shape of FIG. 6A which is the same as FIG. 4A, the lead 3 is provided as shown in FIG. 6B. The front surface of the end surface 4 at the tip of is formed in a semicircular shape having a circumferential surface 9. The semicircular shape having the circumferential surface 9 is formed by pressing or etching using a die having a shape corresponding to the semicircular shape, as in the first embodiment.

The electronic component 1 according to the third embodiment has the following effects.

In the plurality of leads 3 to be soldered to the wiring board 7, the end surface 4 at the tip to be soldered to the wiring board 7 is an arcuate curved surface 8 along the length direction L of the lead 3 from the end 4A.
Not only is formed, but the front shape in the direction orthogonal to the lengthwise direction L is also formed in a semicircular shape having the circumferential surface 9, so that the stress is relieved along the circumferential surface 9 as well. Therefore, it is possible to obtain a larger relaxation effect than the first and second embodiments.

(Fourth Embodiment) FIG. 7 is an enlarged perspective view showing a main part of an electronic component according to a fourth embodiment of the present invention. The electronic component 1 of the present embodiment is composed of, for example, an LSI having a SOP package 2, and a plurality of leads 3 are adjacently drawn out at a narrow pitch from opposite side surfaces of the package 2. Each of the plurality of leads 3 is composed of a conductor 12 whose entire peripheral surface is covered with an insulator 11 except a soldering surface to be soldered to a wiring board. For example, epoxy resin is used as the insulator 11, and Ni, Cu, Au, solder or the like is used as the conductor 12.

Such an electronic component 1 is manufactured by the following method.

First, as shown in FIG. 9A, the lead 3
And tab 13 formed in a desired pattern, such as Fe
-A lead frame 14 made of a Ni alloy material is prepared, the semiconductor chip 15 is mounted on the tab 13 with an adhesive, and then a wire 17 made of, for example, an Au wire is bonded between the electrode 16 of the semiconductor chip 15 and the lead 3. To do.

Next, as shown in FIG. 9B, the lead frame 14 is set in a transfer molding apparatus and resin molding is performed to form the package 2.

Then, as shown in FIG. 9C, the lead 3 protruding from the package 2 to the outside is cut. In this case, the cut surface 3A of the lead 3 is exposed. This is because, as will be described later, it is electrically connected to the conductor by plating.

Next, as shown in FIG. 9D, a conductor 18 made of, for example, a liquid crystal polymer-based or PPS (polyphenylene sulfide) -based plating catalyst mixed resin is projected on the side surface of the package 2 in a gull wing shape, for example. Form a plurality of lead shapes. In this case, the root portion of the conductor 18 is located on the cut surface 3A of the lead 3. This lead shape can be formed by resin molding using a mold.

Subsequently, as shown in FIG. 9 (E), insulation is made of, for example, an epoxy resin on the entire peripheral surface excluding a part (bottom surface serving as a soldering surface) of the plurality of lead-shaped conductors 18. Form and cover body 11. This insulator 11 can be formed by resin molding using a mold.

Next, as shown in FIG. 9 (F), a portion of the surface of the conductor 18 which is not covered with the insulator 11 is subjected to a plating treatment, for example, Ni, Cu, A.
A conductor 12 such as u or solder is formed. This is because by using a plating catalyst-containing resin as the conductor 18,
The conductor 12 is formed only on the exposed surface of the conductor 18.
Can be plated. The conductor 12 is plated so as to conduct from the package 2 to the lead 3 whose cut surface 3A is exposed. As a result, the electronic component 1 as shown in FIG. 7 is obtained. FIG. 11 shows an electronic component 1 of this embodiment, in which a plurality of leads 3 are soldered to a wiring board 7
It is sectional drawing which shows the structure mounted in FIG.

According to the electronic component 1 according to the fourth embodiment, the following effects can be obtained.

The plurality of leads 3 that are adjacently drawn out at a narrow pitch are each composed of the conductor 12 whose entire peripheral surface excluding the soldering surface is covered with the insulator 11. Therefore, the wiring board 7 When mounted on, the presence of the insulator 11 prevents the solder from flowing around the peripheral surface. Therefore,
Solder bridging between adjacent leads is prevented and lead shorts can be eliminated.

(Fifth Embodiment) FIG. 8 is an enlarged perspective view showing a main part of an electronic component according to a fifth embodiment of the present invention. In the electronic component 1 of the present embodiment, the plurality of leads 3 are composed of a conductor 12 whose side surfaces facing the adjacent leads 3 are covered with an insulator 11. For example, epoxy resin is used as the insulator 11, and N is used as the conductor 12.
i, Cu, Au, solder or the like is used.

Such an electronic component 1 is manufactured by the following method.

Similar to FIGS. 9A to 9C, first, FIG.
As shown in FIG. 0 (A), a lead frame 14 in which the leads 3 and the tabs 13 are formed in a desired pattern is prepared,
After mounting the semiconductor chip 15 on the tab 13 with an adhesive, a wire 17 is bonded between the electrode 16 of the semiconductor chip 15 and the lead 3. Next, as shown in FIG. 10 (B), the lead frame 14 is set in a transfer molding device, and resin molding is performed to form the package 2
To form. Subsequently, as shown in FIG. 10C, the portion of the lead 3 protruding from the package 2 to the outside is cut so that the cut surface is exposed.

Next, as shown in FIG. 10D, a conductor 18 made of, for example, a liquid crystal polymer-based or PPS (polyphenylene sulfide) -based plating catalyst mixed resin is projected on the side surface of the package 2 in a gull wing shape, for example. Make multiple lead shapes. In this case, the root portion of the conductor 18 is located on the cut surface 3A of the lead 3. This lead shape can be formed by resin molding using a mold.

Subsequently, as shown in FIG. 10E, insulators 11 made of, for example, an epoxy resin are formed on both side surfaces of the plurality of lead-shaped conductors 18, respectively. This insulator 1
1 can be formed by resin molding using a mold.

Next, as shown in FIG. 10 (F), a portion of the surface of the conductor 18 which is not covered with the insulator 11 is subjected to a plating treatment so as to be electrically conductive such as Ni, Cu, Au or solder. Form body 12. As in the case of the fourth embodiment, by using a resin containing a plating catalyst as the conductor 18, the conductor 12 can be plated only on the exposed surface of the conductor 18. The conductor 12 is formed so as to be electrically connected to the lead 3. As a result, the electronic component 1 as shown in FIG. 8 is obtained. FIG. 12 is a cross-sectional view showing a structure in which the electronic component 1 of the present embodiment has a plurality of leads 3 mounted on a wiring board 7 with solder 6.

According to the electronic component 1 of the fifth embodiment, the following effects can be obtained.

Since the plurality of leads 3 that are adjacently drawn out at a narrow pitch are composed of the conductors 12 whose side surfaces facing the adjacent leads 3 are covered with the insulator 11, When mounted, the presence of the insulator 11 prevents the solder from wrapping around the peripheral surface. Therefore, solder bridging between adjacent leads is prevented,
Lead shorts can be eliminated.

(Embodiment 6) FIG. 13 is a top view showing a supporting device for detachably supporting a wiring board on which an electronic component according to Embodiment 6 is mounted, FIG. 14 is a side view, and FIG. FIG. 16 is a perspective view showing an enlarged main part. The supporting device 20 detachably supporting the wiring board on which the electronic component of the present embodiment is mounted includes, for example, a rectangular frame 22 made of an insulating material having a step portion 21 on the inner surface thereof. A plurality of metallized layers 23 are formed adjacent to each other from the inner wall surface to the bottom surface. Also,
A plurality of leads 24 are arranged adjacent to each other on the side surface of the frame body 22 so as to be electrically connected to the plurality of metallized layers 23.

Each of the plurality of leads 24 is composed of a conductor 26 in which the entire peripheral surface except the soldering surface to be soldered to the wiring board is covered with an insulator 25. For example, epoxy resin is used as the insulator 25, and Ni, Cu, Au, solder, or the like is used as the conductor 26. Thus, the plurality of leads 24 each of which is composed of the conductor 26 whose entire peripheral surface except the soldering surface is covered with the insulator 25 is the electronic component according to the fourth embodiment as shown in FIG. It can be manufactured by a method similar to the manufacturing method of 1.

As shown in FIG. 15, one or a plurality of electronic components such as those shown in the first to fifth embodiments or other electronic components are mounted on the supporting device 20 of the present embodiment. The wiring board 27 is detachably mounted and incorporated into various electronic devices. Corresponding terminals 28 are formed on the surface of the bottom surface of the wiring board 27 facing the metallized layer 23. By connecting the metallized layer 23 and the terminals 28 via solder or the like, the leads 24 are connected to the terminals. Conduction is established with 28. The wiring board 27 is removable as needed.

According to the supporting device 20 which detachably supports the wiring board on which the electronic component is mounted according to the sixth embodiment, the following effects can be obtained.

The plurality of leads 24, which are arranged adjacent to the side surface of the frame body 22 at a narrow pitch, are each composed of a conductor 26 whose entire peripheral surface excluding the soldering surface is covered with an insulator 25. Therefore, when incorporated in an electronic device, the presence of the insulator 25 prevents the solder from wrapping around the peripheral surface. Therefore, solder bridging between adjacent leads is prevented, and lead shorts can be eliminated.

(Embodiment 7) FIG. 17 is an enlarged perspective view showing a main part of a supporting device for detachably supporting a wiring board on which an electronic component according to Embodiment 7 is mounted. In the supporting device 20 detachably supporting the wiring board on which the electronic component of the present embodiment is mounted, the plurality of leads 24 are adjacent to each other.
Is formed of a conductor 26 whose side surface facing to is covered with an insulator 25. For example, an epoxy resin is used as the insulator 25, and Ni, Cu, or the like is used as the conductor 26.
Au, solder or the like is used. As described above, the plurality of leads 24 each of which is composed of the conductor 26 whose side surface facing the adjacent lead 24 is covered with the insulator 25 is shown in FIG.
It can be manufactured by a method similar to the method of manufacturing the electronic component 1 according to the fifth embodiment shown in FIG.

According to the supporting device 20 which detachably supports the wiring board on which the electronic component is mounted according to the seventh embodiment, the following effects can be obtained.

The plurality of leads 24 arranged adjacent to the side surface of the frame body 22 at a narrow pitch have conductors 26 whose side surfaces facing the adjacent leads 24 are covered with an insulator 25.
Since it is composed of, when incorporated in an electronic device,
The presence of the insulator 25 prevents the solder from wrapping around the peripheral surface. Therefore, solder bridging between adjacent leads is prevented, and lead shorts can be eliminated.

As described above, the invention made by the present inventor is
Although the present invention has been specifically described based on the above-mentioned embodiments, the present invention is not limited to the above-mentioned embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention.

For example, the shape of the end face of the tip of the lead 3 of the electronic component 1 for improving the reliability of the solder connection portion is not limited to the shape shown in each of the above-mentioned embodiments, but substantially in the longitudinal direction of the lead 3. It should have a gentle shape so that the stress can be smoothly relieved along it. For example, the front shape of the lead 3 may be circular, polygonal, or the like. Further, the electronic component 1 to be the target is not limited to the one having the plurality of leads 3, but can be applied to the one having only a pair of leads. Further, the material of the lead 3 is not limited to the conductor, but may be a structure in which the conductor is combined with the insulator.

Electronic component 1 for eliminating lead shorts
Is not limited to a package of a specific shape, but a plurality of leads 3
Can be similarly applied to those having any package as long as they are drawn adjacent to each other at a narrow pitch.

Further, the supporting device 20 which detachably supports the wiring board on which the electronic parts are mounted has a structure in which the plurality of leads 24 are arranged adjacent to the side surface of the frame body 22 at a narrow pitch. It can be applied regardless of the lead shape.

Furthermore, the electronic component 1 or the supporting device 20 for eliminating the lead short circuit is provided with a plurality of leads 3, 24.
Does not have to be configured as in the embodiment, and at least one of adjacent components may be configured as such.

In the above description, the case where the invention made by the present inventor is mainly applied to the manufacturing technology of the supporting device which detachably supports the electronic component and the wiring board on which the electronic component is mounted is described in the field of application as the background. However, it is not limited thereto. The present invention can be applied at least under the condition that an electronic component is mounted on a wiring board.

[0076]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

In the electronic component in which the tips of the leads are mounted on the wiring board by soldering, stress is prevented from being concentrated on a part of the solder, and the reliability of the solder connection portion can be improved.

In an electronic component in which a plurality of leads are adjacently drawn out at a narrow pitch from the side surface of the package, solder bridging between adjacent leads is prevented, and lead shorts can be eliminated.

In a supporting device in which a plurality of leads are arranged adjacent to each other on a side surface of the frame body at a narrow pitch and which detachably supports a wiring board on which electronic components are mounted, solder bridging between adjacent leads is prevented. The lead short can be eliminated.

[Brief description of drawings]

FIG. 1 is a perspective view showing an electronic component according to a first embodiment of the present invention.

2A and 2B are enlarged views showing a main part of the electronic component of Example 1, where FIG. 2A is a side view and FIG. 2B is a front view.

FIG. 3 is a cross-sectional view showing a structure in which an electronic component according to the first embodiment is mounted.

4A and 4B are enlarged views showing a main part of an electronic component according to a second embodiment of the present invention, in which FIG. 4A is a side view and FIG. 4B is a front view.

FIG. 5 is a sectional view showing a structure in which an electronic component according to a second embodiment is mounted.

6A and 6B are enlarged views showing a main part of an electronic component according to a third embodiment of the present invention, FIG. 6A being a side view and FIG. 6B being a front view.

FIG. 7 is an enlarged perspective view showing a main part of an electronic component according to a fourth embodiment of the present invention.

FIG. 8 is an enlarged perspective view showing a main part of an electronic component according to a fifth embodiment of the present invention.

9A to 9C show a method of manufacturing an electronic component according to a fourth embodiment, in which (A) to (C) are cross-sectional views and (D) to (F) are perspective views.

FIG. 10 shows a method for manufacturing an electronic component according to a fifth embodiment, in which (A) to (C) are cross-sectional views and (D) to (F) are perspective views.

FIG. 11 is a sectional view showing a structure in which an electronic component according to a fourth embodiment is mounted.

FIG. 12 is a sectional view showing a structure in which an electronic component according to a fifth embodiment is mounted.

FIG. 13 is a top view showing a supporting device which detachably supports a wiring board on which an electronic component is mounted according to a sixth embodiment of the present invention.

FIG. 14 is a side view showing a supporting device which detachably supports a wiring board on which an electronic component according to a sixth embodiment is mounted.

FIG. 15 is an enlarged sectional view showing a main part of a supporting device that detachably supports a wiring board on which an electronic component according to a sixth embodiment is mounted.

FIG. 16 is an enlarged perspective view showing a main part of a supporting device that detachably supports a wiring board on which an electronic component according to a sixth embodiment is mounted.

FIG. 17 is an enlarged perspective view showing a main part of a supporting device which detachably supports a wiring board on which an electronic component is mounted according to a seventh embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic component, 2 ... Package, 3 ... Lead, 4 ... Lead end surface, 5 ... Inclined surface, 6 ... Solder, 7 ... Wiring board, 8 ...
Curved surface, 9 ... circumferential surface, 11 ... insulator, 12 ... conductor, 1
DESCRIPTION OF SYMBOLS 3 ... Tab, 14 ... Lead frame, 15 ... Semiconductor chip, 16 ... Semiconductor chip electrode, 17 ... Bonding wire, 18 ... Conductor, 20 ... Support device which detachably supports a wiring board on which electronic components are mounted, 21 … Stairs, 22
... frame, 23 ... metallization layer, 24 ... lead, 25 ... insulator, 26 ... conductor, 27 ... wiring board, 28 ... terminal.

Claims (10)

[Claims] 1. An electronic component having a lead soldered to a wiring board, wherein the lead has an end surface of a tip soldered to the wiring board inclined from the end along the length direction of the lead. An electronic component characterized by being formed on. 2. In an electronic component having a lead soldered to a wiring board, the lead has an end surface of a tip soldered to the wiring board formed in an arc shape from the end portion along the length direction of the lead. Electronic parts characterized by being made. 3. The electronic component according to claim 1, wherein the lead has a semicircular front shape at an end surface of a tip to be soldered to the wiring board. 4. In an electronic component in which a plurality of leads to be soldered to a wiring board are adjacently drawn from a side surface of a package, the plurality of leads has an end surface of a tip to be soldered to the wiring board from an end portion. An electronic component formed so as to be inclined along the length direction of a lead. 5. In an electronic component in which a plurality of leads to be soldered to a wiring board are adjacently drawn from a side surface of a package, at least one lead of the plurality of leads adjacent to each other except a soldering surface. An electronic component characterized by comprising a conductor whose entire peripheral surface is covered with an insulator. 6. In an electronic component in which a plurality of leads to be soldered to a wiring board are adjacently drawn from a side surface of a package, at least one lead of the plurality of leads adjacent to each other faces an adjacent lead. An electronic component, characterized in that the side surface of the conductor is made of a conductor covered with an insulator. 7. The electronic component according to claim 5, wherein the conductor is made of a conductor plated on the surface of resin. 8. A frame body for detachably supporting a wiring board on which an electronic component is mounted, wherein a plurality of leads electrically connected to terminals of the wiring board are arranged adjacent to each other on a side surface of the frame body,
At least one lead of the plurality of leads adjacent to each other is made of a conductor whose entire peripheral surface except the soldering surface is covered with an insulator. A wiring board mounted with an electronic component is attached and detached. Supporting device that supports as much as possible. 9. A frame body for detachably supporting a wiring board on which an electronic component is mounted, wherein a plurality of leads electrically connected to terminals of the wiring board are arranged adjacent to each other on a side surface of the frame body.
At least one of the adjacent ones of the plurality of leads is made of a conductor whose side surface facing the adjacent lead is covered with an insulator. Supporting device to support. 10. The support for detachably supporting a wiring board on which an electronic component is mounted according to claim 8 or 9, wherein the conductor is made of a conductor plated on a resin surface. apparatus.