JPH0832187A - Module board and electronic device using the same - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] To provide a module substrate on which a heat radiator is mounted without increasing the dimension in the direction perpendicular to the surface, and an electronic device which enables a high-density mounting by narrowing the interval between the module substrates. [Structure] On the bottom surface of the lower layer 2A of the wiring board 2 of the module substrate 1, a plate-shaped radiator 4 made of a highly heat-conductive material such as Al or Cu is provided with a highly heat-conductive adhesive such as silicone rubber. It is attached by being extended in the horizontal direction with respect to the surface of the module substrate 1. Plate-shaped radiator 4
Has at its tip a main portion 4A composed of a plurality of stages of plate-shaped portions 4a, 4b, 4c ... Arranged in the direction perpendicular to the surface of the module substrate 1, and this main portion 4A is the module substrate 1
It is located on the side of the.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a module substrate and an electronic device using the same, and more particularly to an electronic device in which a plurality of module substrates incorporating high heat generating semiconductor chips are mounted on a mounting substrate at high density. Related to effective technology.

[0002]

2. Description of the Related Art Recently, LSIs have been further integrated and improved in performance, but heat generated in semiconductor chips has been increased along with this. For this reason, when a plurality of module boards incorporating such semiconductor chips are used and mounted on a mounting board to assemble an electronic device such as a computer, how to take heat dissipation measures for the module boards that are unit boards The performance of an electronic device depends on whether or not it is used.

As a measure for heat dissipation in a conventional module board, a radiator called a heat dissipation fin is attached to the module board in a direction perpendicular to the surface of the module board so as to make contact with the tab on which the semiconductor chip is mounted. It is being appreciated. Further, when assembling an electronic device with a plurality of module boards to which such a radiator is attached, air cooling means by a fan is provided in the electronic device to circulate the air in the internal space.

[0004]

In the module board having the structure in which the heat radiator is attached to the module board in the direction perpendicular to the surface as described above, the dimension of the module board in the direction perpendicular to the surface is the heat radiator. There is a problem that it becomes larger as much as it is attached.

Further, when assembling an electronic device by mounting a plurality of module boards each having a heat radiator attached in a direction perpendicular to the surface of the module board to assemble an electronic device, the module board is arranged in a direction perpendicular to the surface of each module board. Since the heat radiator is attached, the distance between the module substrates is not narrowed, which causes a problem that high-density mounting is impossible.

[0006] Here, if it is attempted to reduce the dimension of the radiator in the direction perpendicular to the surface of the module substrate, in order to obtain the same heat radiation effect, the heat radiation consisting of overhang fins having a large area in the horizontal direction with respect to the surface of the module substrate. It is necessary to prepare the body. However, this causes a problem that the peripheral parts covered by the overhang fins cannot be repaired.

An object of the present invention is to provide a module substrate on which a heat radiator is mounted without increasing the size in the direction perpendicular to the surface.

Another object of the present invention is to provide an electronic device which enables a high-density mounting by narrowing the intervals between the module substrates.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0010]

Among the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

(1) A module board according to the present invention is a module board that holds a semiconductor chip and a radiator on which the semiconductor chip is mounted. The radiator is extended horizontally with respect to the surface of the module board, Is disposed on the side surface side of the module substrate.

(2) In the electronic device of the present invention, the mounting substrate and the radiator on which the semiconductor chip is mounted are extended in the horizontal direction with respect to the surface of the module substrate, and the main part thereof is arranged on the side surface side of the module substrate. And a plurality of module substrates formed as described above. The plurality of module substrates are mounted parallel to each other on the mounting substrate in a direction perpendicular to the surface.

[0013]

According to the above-mentioned means (1), the module board of the present invention is a module board for holding a semiconductor chip and a radiator mounted with the semiconductor chip, wherein the radiator is horizontal to the surface of the module board. Extended to
Since the main part of the heat radiator is arranged on the side surface side of the module substrate, the heat radiator can be attached without increasing the dimension in the direction perpendicular to the surface.

According to the above-mentioned means (2), in the electronic device of the present invention, the mounting substrate and the radiator on which the semiconductor chip is mounted are extended in the horizontal direction with respect to the surface of the module substrate, and the main part thereof is provided. Is provided on a side surface side of the module substrate, and the plurality of module substrates are mounted parallel to each other on the mounting substrate in a direction perpendicular to this surface. Since the space between them is narrowed, high density mounting can be enabled.

[0015]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a perspective view showing a module substrate according to Embodiment 1 of the present invention, FIG. 2 is a perspective view seen from the bottom of FIG. 1, and FIG. 3 is a sectional view taken along the line AA of FIG. Is. The module board 1 has a wiring board 2 made of, for example, a laminated resin composed of a lower layer 2A and an upper layer 2B, and a through hole 3 is formed in a step shape in a part thereof. On the bottom surface of the lower layer 2A of the wiring board 2 of the module board 1, for example, A
A plate-shaped radiator 4 made of a highly heat-conductive material such as 1 or Cu is attached by being extended in the horizontal direction with respect to the surface of the module substrate 1 by a highly heat-conductive adhesive such as silicone rubber. The plate-shaped radiator 4 has at its tip a main part 4A composed of a plurality of stages of plate-shaped parts 4a, 4b, 4c ... Arranged in the direction perpendicular to the surface of the module substrate 1, and this main part 4A is It is arranged on the side surface side of the module substrate 1.

Through hole 3 of wiring board 2 of module board 1
A semiconductor chip 5 constituting a microcomputer is mounted on the radiator 4 in FIG. 2 by a high thermal conductive adhesive such as silicone rubber. A plurality of terminals 6 are preliminarily formed on the peripheral surface of the through hole 3 in the lower layer 2A of the wiring board 2 of the module substrate 1. Between the terminals 6 and the electrodes 7 of the semiconductor chip 5, for example, an Au wire is formed. The wire 8 is bonded. A cap 9 such as Al whose surface is anodized is attached to the peripheral surface of the through-hole 3 of the upper layer 2B of the wiring board 2 of the module substrate 1 by an adhesive such as silicone rubber. Is sealed. As a result, the module substrate 1 has a structure that holds the semiconductor chip 5 and the radiator 4 on which the semiconductor chip 5 is mounted.

An external component 10 such as an IC memory is attached to the periphery of the module substrate 1 on which the semiconductor chip 5 is mounted. These external components 10 are attached to the front surface side and the back surface side of the module substrate 1. A connector 11 for mounting the module board 1 on a mounting board as described later is provided on the module board 1 on the side opposite to the side surface on which the main portion 4A of the radiator 4 is arranged.
Is attached. This connector 11 is, for example, as shown in FIG.
As shown in (A), two side surfaces 12A orthogonal to each other
, 12B, one end 13A and the other end 13B of the plurality of leads 13 are projected.
FIG. 4B is a cross-sectional view taken along the line AA of FIG. Then, for example, the other end 13B of each lead 13 is removably inserted into a plurality of contact holes provided in the module substrate 1 in advance. Each contact hole is connected to the wiring pattern formed on the module substrate 1.

Such a module substrate 1 is manufactured by the following method.

First, as shown in FIG. 5 (A), a wiring board 2 made of, for example, a laminated resin body composed of a lower layer 2A and an upper layer 2B is used, and a through hole 3 is formed in a part thereof by resin molding.
Are formed stepwise. Next, the lower layer 2A of this wiring board 2
A plurality of terminals 6 are formed on the peripheral surface of the through hole 3.

Subsequently, as shown in FIG. 5B, a wiring board which is made of a high thermal conductive material such as Al or Cu on the bottom surface of the lower layer 2A of the wiring board 2 and has a module board at its tip. 2 using a plate-shaped radiator 4 having a main part 4A composed of a plurality of stages of plate-shaped parts 4a4b, 4c ... The wiring board 2 is attached so as to extend in the horizontal direction with respect to the surface of the wiring board 2 and the main portion 4A is arranged on the side surface side of the wiring board 2.

Next, as shown in FIG. 5 (C), a semiconductor chip 5 constituting a microcomputer is formed on the radiator 4 in the through hole 3 of the wiring board 2 by a highly heat conductive adhesive such as silicone rubber. Equipped with. continue,
A wire 8 such as an Au wire is bonded between the terminal 6 of the lower layer 2A of the wiring board 2 and the electrode 7 of the semiconductor chip 5.

Then, as shown in FIG. 5D, on the upper layer 2B in the through-hole 3 of the wiring board 2, for example, the surface of which is alumite-treated with an adhesive such as silicone rubber is used. Attach the cap 9. As a result, the through hole 3 is covered and the semiconductor chip 5 is sealed.

Next, as shown in FIG. 5E, an external component 10 such as an IC memory is attached to the periphery of the wiring board 2 where the semiconductor chip 5 is mounted by soldering or the like. Then, the main part 4 of the radiator 4 of the wiring board 2
The connector 11 is attached to the side opposite to the side where A is arranged as shown in FIG. As a result, the module substrate 1 according to the first embodiment is obtained.

According to the first embodiment, the following effects can be obtained.

In the module substrate 1, the heat radiator 4 is extended in the horizontal direction with respect to the surface of the module substrate 1.
Since the main part 4A of 4 is disposed on the side surface side of the module substrate 1, the radiator can be attached without increasing the dimension in the direction perpendicular to the surface.

(Second Embodiment) FIG. 6 is a sectional view showing a module substrate according to a second embodiment.

In FIG. 6, the same parts as those in FIG. 3 are indicated by the same numbers. The semiconductor chip 5 of the module substrate 1 is attached to a tab 14 made of, for example, Fe-Ni with a high thermal conductive adhesive such as silicone rubber, and the bottom surface of the tab 14 is attached with a high thermal conductive adhesive such as silicone rubber. The radiator 4 is attached. The radiator 4 is composed of a support portion 4B supporting the semiconductor chip 5 via the tab 14, the main portion 4A, and a heat pipe 15 connecting the main portion 4A and the support portion 4B. ing. The heat pipe 15 is a highly heat conductive metal pipe in which an appropriate amount of a vaporizable liquid is sealed, and the vaporization of the liquid serves to transfer the heat generated in the semiconductor chip 5 from the support portion 4B to the main portion 4A. According to the second embodiment, the following effects can be obtained.

The radiator 4 has a structure in which a support portion 4B supporting the semiconductor chip 5 via the tab 14 and a main portion 4A arranged on the side surface side of the module substrate 1 are integrally connected by a heat pipe 15. Therefore, the heat generated by the semiconductor chip 5 can be efficiently dissipated by the action of the heat pipe 15.

(Third Embodiment) FIG. 7 is a sectional view showing an electronic device according to a third embodiment. The electronic device 16 uses a plurality of module boards 1 obtained in the first embodiment, and mounts the plurality of module boards 1 in parallel with each other on the mounting board 17 in a direction perpendicular to the surface via the connector 11. And then assembled. Around the module board 1,
A fan 18 for supplying cooling air is provided in the space between the module substrates 1. The electronic device 16 assembled in this way is configured as, for example, a computer.

According to the third embodiment, the following effects can be obtained.

(1) In the electronic device 16, the radiator 4 on which the semiconductor chip 5 is mounted is extended in the horizontal direction with respect to the surface of the module substrate 1, and the main portion 4A thereof is arranged on the side surface side of the module substrate 1. Since a plurality of such module substrates 1 are used and mounted on the mounting substrate 17 in parallel with each other via the connector 11 in the direction perpendicular to the surface, the radiator 4 is mounted in the direction perpendicular to the surface of each module substrate 1. Since they are not attached, the intervals between the module substrates 1 can be narrowed and high-density mounting can be achieved.

(2) Accordingly, the electronic device can be downsized.

(Fourth Embodiment) FIG. 8 is a sectional view showing an electronic device according to a fourth embodiment. The electronic device 16 uses a plurality of module boards 1 obtained in the second embodiment, and mounts the plurality of module boards 1 in parallel with each other on the mounting board 17 in the direction perpendicular to the surface via the connector 11. And then assembled.

According to the fourth embodiment, the following effects can be obtained.

The radiator 4 of each module substrate 1 for assembling the electronic device 16 includes a support portion 4B supporting the semiconductor chip 4 via the tabs 14 and a main portion 4A arranged on the side surface side of the module substrate 1. Since it has a structure in which the heat pipes 15 are integrally connected, the heat pipe 15 can efficiently dissipate the heat generated in the semiconductor chip 5.

As described above, the invention made by the present inventor is
Although the present invention has been specifically described based on the above-mentioned embodiments, the present invention is not limited to the above-mentioned embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention.

For example, although the main portion 4A of the radiator 4 is arranged on the side surface opposite to the side surface on which the connector 11 of the module substrate 1 is provided in the above embodiment, the side surface orthogonal to this side surface is described. It can also be placed in. Also,
The case where one semiconductor chip 5 is mounted on the heat radiator 4 has been described as an example, but the semiconductor chip 5 can also be applied when a plurality of semiconductor chips 5 are mounted on the same heat radiator.

In the above description, the case where the invention made by the present inventor is mainly applied to the manufacturing technology of the module substrate and the electronic device using the module substrate which is the background field of the invention has been described, but the invention is not limited thereto. Not a thing. The present invention can be applied at least under the condition that a semiconductor chip with high heat generation is incorporated in the module substrate.

[0040]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

The heat radiator can be attached to the module substrate without increasing the dimension in the direction perpendicular to the surface of the module substrate.

When assembling an electronic device with a plurality of module boards to which heat radiators are attached, the distance between the module boards can be narrowed, so that high-density mounting can be achieved.

[Brief description of drawings]

FIG. 1 is a perspective view showing a module substrate according to a first embodiment of the present invention.

FIG. 2 is a perspective view of FIG. 1 viewed from the bottom.

FIG. 3 is a sectional view taken along line AA of FIG. 1;

4A and 4B show a connector used for a module substrate according to Embodiment 1 of the present invention, FIG. 4A being a perspective view and FIG. 4B being a sectional view taken along line AA of FIG.

FIG. 5 shows a method for manufacturing a module substrate according to a first embodiment of the present invention, in which (A) to (E) are sectional views.

FIG. 6 is a sectional view showing a module substrate according to a second embodiment of the present invention.

FIG. 7 is a sectional view showing an electronic device according to a third embodiment of the present invention.

FIG. 8 is a sectional view showing an electronic device according to Example 4 of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Module substrate, 2 ... Wiring substrate, 2A ... Wiring substrate lower layer, 2B ... Wiring substrate upper layer, 3 ... Through hole, 4 ... Radiator, 4A ... Heat radiator main part, 4B ... Radiator support part, 5
... Semiconductor chip, 6 ... Terminal, 7 ... Semiconductor chip electrode,
8 ... Bonding wire, 9 ... Cap, 10 ... External component, 11 ... Connector, 12A, 12B ... Connector side surface, 13 ... Connector lead, 14 ... Tab, 15 ... Heat pipe, 16 ... Electronic device, 17 ... Mounting Substrate, 18 ...
fan.

Claims (5)

[Claims] 1. A module substrate holding a semiconductor chip and a radiator mounted with the semiconductor chip, wherein the radiator is extended in a horizontal direction with respect to the surface of the module substrate, and the main part of the radiator is the module substrate. A module board, which is arranged on a side surface of the module board. 2. The heat dissipating member comprises a support portion on which the semiconductor chip is mounted, the main portion, and a heat pipe connecting the main portion and the support portion. The module substrate according to claim 1. 3. The module according to claim 1, wherein a main part of the heat radiator is composed of a plurality of plate-shaped parts arranged in a direction perpendicular to a surface of the module substrate. substrate. 4. A plurality of module boards in which a mounting board and a radiator on which a semiconductor chip is mounted are extended in the horizontal direction with respect to the surface of the module board, and main parts thereof are arranged on the side surfaces of the module board. And a plurality of module substrates mounted on the mounting substrate in parallel to each other in a direction perpendicular to the surface. 5. The electronic device according to claim 4, wherein the plurality of module substrates are mounted on the mounting substrate via a connector.