JPH08323627A - Honing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a honing system for simultaneously honing a plurality of light receiving body base bodies. SOLUTION: A honing system includes at least one support assembly having movable support structure 14 and a planetary array comprising a plurality of movable supporting arms 16. Each supporting arm 16 can hold at least one base body 18. A honing chamber surrounds a plurality of support base faces to perform honing. The honing chamber includes a nozzle for spraying a honing solution uniformly to a plurality of base bodies 18 so as to form a smooth non-reflecting surface on each base body 18.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate surface treatment system and method, and more particularly to a photoreceptor substrate surface treatment apparatus and process.

[0002]

BACKGROUND OF THE INVENTION The use of coherent light has increased in recent years in the field of electrophotographic printing for forming images on photoreceptors. However, the use of a coherent light source in combination with a multi-layered photoreceptor results in print quality defects called the "plywood effect" or "interference fringe effect."
Interference fringes are a series of bright and dark fringes that occur when coherent light is reflected by an interface that spreads over a multilayer photoreceptor. For organic photoconductor (OPC) photoreceptors, reflection at the boundary surface (top surface) between the atmosphere and the charge transfer layer and reflection at the boundary surface between the undercoat layer or charge blocking layer and the substrate (substrate surface) Is the main cause of interference fringes. Such an interference fringe effect can be eliminated by eliminating or suppressing the strong reflection on the surface of the substrate and the strong reflection on the surface of the charge transfer layer overlapping with the strong reflection.

US Pat. No. 5,2, Hammond et al.
48,529, Japanese Patent Application No. 2-320559, Japanese Patent Application No. 2-40
No. 4541, Japanese Patent Application No. 2-404540 and the like disclose methods and apparatuses for cleaning, coating, and curing a photoreceptor substrate arranged in a planetary array, all of which are for reducing or eliminating the above-mentioned laminated material effect. Is not mentioned.

On the other hand, many methods for suppressing reflection on the interface surface between the charge transfer layer and the atmosphere have been proposed. For example, the surface of the charge transfer layer is roughened by mixing SiO2 or other particles into the charge transfer layer, an appropriate protective film such as an antireflection film or a scattering material film is applied, anodizing, dry blasting, wet honing There are known methods such as roughening the surface with.

As a patent for a general method for suppressing interference fringes or a method for suppressing interference fringes by suppressing reflection on the surface of a substrate, Tanaka et al., US, which discloses the formation of an opaque conductive layer on a ground plate, is disclosed. Japanese Patent No. 4,741,918, Naji De., Which discloses a coating process using a buffing wheel.
US Patent No. 4, to Nagy de Nagybaczon et al.,
741,918, Kubo et al., U.S. Pat. No. 4,904,557, which discloses the formation of a roughened photosensitive layer on a smooth support substrate.
Fujimura discloses a grinding method for roughening a substrate surface (Fuji
U.S. Pat. No. 4,134,763 to Surason et al., Simpson et al. U.S. Pat. (Andrewa
) Et al., U.S. Pat.
odoin et al., U.S. Pat. No. 5,089,908, Herb
ert, et al., U.S. Pat. No. 5,069,758, Fischer (Fi
Sher) U.S. Pat. No. 4,076,564.

A method for roughening the surface of a photoreceptor substrate by spraying ceramic particles and glass particles on the surface of the photoreceptor substrate is conventionally known. For example, British Patent No. 2,224,224 eliminates interference fringe patterns and spots by honing the electrophotographic printing substrate.
Disclosed is an abrasive spray treatment of an electrophotographic printing substrate.
However, the size distribution of such particles is generally random, and the surface often has an irregular shape.

On the other hand, Japanese Patent Laid-Open No. 2-87154 discloses a technique for roughening the surface of an electrophotographic photoreceptor substrate by wet honing using a suspension of an abrasive. This way,
The problems mentioned above can be overcome. When wet honing is used, the roughening treatment of the substrate can be stably performed in a short time, and the surface can be accurately treated to have a desired roughness. Furthermore, there is an advantage that a uniform rough surface can be obtained with almost no irregularities that cause defective coating. Due to these advantages, wet honing is superior in terms of productivity and image stability (no spots or interference fringes) to surface treatment methods such as anodizing and buffing. I can say.

[0008] Such honing systems typically use two spindles to spray a liquid honing medium, suspended in water, onto a rotating substrate.
Higher productivity and reduction of manufacturing cost are desired. Therefore, it is an object of the present invention to provide a system and method for simultaneously honing multiple photoreceptor substrates.

[0009]

In order to achieve the above object, the present invention particularly relates to a planetary honing assembly for simultaneously honing a plurality of photoreceptor substrates.

The honing assembly of the present invention includes at least one substrate support assembly including a moveable support having a central axis. A plurality of movable support arms are arranged on the movable support in a planetary array configuration about the central axis. Each support arm has a support arm axis that is substantially parallel to the central axis and is capable of holding at least one photoreceptor substrate. Each support arm is rotatable about its axis.

The honing assembly of the present invention further comprises:
It includes a honing chamber surrounding a plurality of substrates. The honing chamber has at least one multi-orifice honing nozzle for spraying the substrate with the honing solution. The at least one multi-orifice honing nozzle is located along the central axis of the support. A non-reflective surface is formed on each photoreceptor substrate by spraying a honing solution containing a mixture of suspended particles.

The honing assembly may be provided as part of a multi-station planetary honing system that simultaneously hones multiple substrates. The honing assembly then functions as one processing station in the series. The honing system includes a wash station to remove excess honing solution from each photoreceptor substrate after honing is complete. The honing system also includes at least one additional station for mounting and removing a plurality of substrates on a plurality of support arms. The honing system also includes an assembly that moves the substrate support assembly between each station.

The present invention also relates to a method of simultaneously honing a plurality of substrates using the honing system described above. The method includes disposing at least one of the plurality of substrates on each of the plurality of support arms. The substrate is then placed in the honing chamber. The support arm rotates while the honing solution is sprayed onto the substrate.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described based on embodiments with reference to the drawings. Like elements are given like numbers. The present invention relates to the manufacture of cylindrical or strip photoreceptor substrates, and more particularly to rigid cylindrical or flexible strip photoreceptors for photocopying. The substrate used in the present invention has a cylindrical or strip-like structure, and its surface is coated with a photoconductive substance to form a photoreceptor. However, of course, the present invention is applicable to other coated substrates and recording methods. (First Embodiment) FIGS. 1 and 2 show a support structure according to a first embodiment of the present invention. The support structure 14 includes a planetary array of support arms 16, each support arm 16 being
It has an offset horizontal axis h which is radially spaced from a central horizontal axis H of the support structure 14. Support arm 1
6 can support at least one substrate 18 (preferably two or more substrates), and the support structure 14 is
A planetary arrangement of the base 18 is realized. Each base 18 is
It is parallel to the central horizontal axis H and is radially spaced from this axis. Preferably, the support arms 16 are arranged in an annular array centered on the central horizontal axis H so that the base bodies are arranged symmetrically with respect to the central horizontal axis H. The support arm 16 need not rotate about the central horizontal axis H, but may rotate about the central axis H, depending on the application. As used herein, the term “planetary” means that the support arm 16 surrounds the central horizontal axis H.

The support structure 14 has a mechanism for rotating each support arm 16 about its offset horizontal axis h such that each planetary arranged substrate 18 is parallel to the central horizontal axis H. It is fixed in a position spaced from this axis and each rotates about an offset horizontal axis h. The support structure 14 can include any mechanism that rotates the support arm 16 to secure the substrate along the horizontal axis h. For example, an inner rod-like structure, a rotatable cap or collet structure that fits on the outer surface of the end of the base, or a rotatable inner extension structure that inserts into the base and fits on the inner surface of the base. Also,
The substrates 18 shown in FIG. 1 all have the same diameter (for example, 84 m).
m), the support arm 16 can support substrates of different diameters (for example 15-300 mm).

The planetary arrangement of the substrates 18 on the support structure 14 allows multiple substrates to be processed simultaneously, increasing throughput and reducing manufacturing costs. In this way, the support arms 16 can each carry a plurality of substrates and can also be processed with substrates of different diameters by simple adjustment and / or modification.
Furthermore, in the coating / curing station detailed below, the processing is performed radially outward from the central axis H while each substrate rotates about its offset axis h. The radial symmetry ensures that each substrate is treated uniformly, ensuring process uniformity and flexibility.

The overall processing operation of the honing system according to this embodiment will be described with reference to FIGS. The carousel 10 rotates about a vertical axis to position the substrate planetary array in front of the honing station 200. Once in place, the support structure reciprocates horizontally relative to the desired station,
Insert the planetary array of 8 into the station. Support structure 14 if the station includes a processing chamber
Includes a sealing mechanism 20 along its perimeter,
The support structure functions as a sealing member that seals the chamber when the substrate is placed in the chamber.
Then, each substrate is rotated about its offset horizontal axis h in the sealed chamber to be treated. At the end of the process, the support structure 14 retracts from the station,
The carousel 10 rotates to move and insert the planetary substrate array into the next processing station.

The plurality of substrates 18 are honed by spraying a honing solution. The honing liquid is injected by the central horizontal axis H of the honing chamber 210.
Injection is preferably from a central conduit 240 located along, although other spraying means may be used, with dedicated nozzles constructed such that each nozzle of the nozzle array is directed to a particular substrate. The central conduit 240 can have a plurality of nozzles 250 therein, and jets the honing solution from all nozzles simultaneously outward. Alternatively,
As shown in FIG. 5, the central conduit 240 may have a reciprocating outflow tube 260 therein and each of the nozzles 2
50 and the reciprocating outflow pipe are sequentially connected to spray honing solution along the axis of each substrate. The drive of the reciprocating outflow pipe can be performed by any well-known mechanism that is programmed to ensure that a radial jet outward from the central conduit 240 is sufficient while the substrate 18 rotates about its offset horizontal axis h. The program control is applied so that the coverage of all the substrates is optimized with respect to the collision angle, the injection pressure, and the distance from the spray nozzle. Furthermore, a central conduit 24 with a plurality of nozzles
Instead of 0, a single reciprocating nozzle 26 as shown in FIG.
1 may be used. When the reciprocating nozzle 261 is used, the same control and operation as the outflow pipe 260 are performed. The flow rate and spray time of the honing solution within the honing station 200 will vary depending on the honing solution used and the substrate being honed.

The honing station 200 includes a honing chamber 210. Honing chamber 2
10 is a draining assembly 270 for draining the honing solution from the honing chamber, as shown in FIG.
Have. The discharged honing solution is recirculated to the nozzle 240 and the honing solution source (not shown) by a well-known pump assembly (not shown). The pump assembly can include a coarse particle filter that separates oversized particles from the honing solution,
Ensure uniform honing to the substrate. The honing chamber 210 also has a catch tray 2 on its bottom.
80, directing the used honing solution to the draining assembly 270.

FIG. 7 is an overall view of a honing system according to an embodiment of the present invention. The honing system consists of the loading station 100 and the honing station 20.
0, cleaning station 300, removal station 4
Including 00. The substrate 18 is mounted on the support arm 16 of the support structure at the mounting station 100. The support structure is then rotated about axis A by carousel 10,
Move to the honing station 200. The seal 20 of the support structure 14 is arranged to engage the end of the honing chamber 210 as shown in FIG. next,
The honing process described above is performed. Next, the support structure 1
4 is rotatably moved to the cleaning station 300 and the substrate 18
To remove excess honing solution.

Alternatively, a cleaning process may be performed within the honing chamber 210. In that case, after the honing solution is completely discharged from the discharge assembly 270 of the honing chamber, a cleaning liquid such as water is introduced into the nozzle 240. After draining the wash solution from the honing chamber, the honing chamber is ready to honing the next support structure 14. In such an apparatus configuration, a valve assembly (not shown) is provided in the discharge assembly to keep the washing liquid flow path away from the honing solution supply source and prevent mixing of the washing liquid and the honing solution.

After the cleaning process is completed, the support structure 14 is rotationally moved to the removal station 400, and the honed substrate 18 is removed from the support arm 16. The support structure 14 is further rotated to the mounting station 100 and the above steps are repeated. The loading station and the unloading station may be combined to form one loading / unloading station.

An intermediate drying station (not shown) is provided between the cleaning station 300 and the removal station 400 to remove the support structure 14 from the removal station 4
The substrate 18 may be dried before being sent to 00. The base 18 may be dried by forced air drying or the like. Air is blown onto the cleaned base 18 to dry it.
This drying process can also be performed in the cleaning station 300. In this case, the forced air is discharged from the nozzle used for spraying the cleaning liquid first. Radiant energy can also be used to dry the substrate. (Second Embodiment) FIG. 8 shows a honing system according to a second embodiment of the present invention. In this configuration, the base 1
The support structure 140 for holding a plurality of support elements 140
a to 140d, each of which has the same structure as the support structure 14 described in the first embodiment. The processing operation of the honing system of the second embodiment is basically the same as the processing operation of the system of the first embodiment described with reference to FIG. 7, but the system of the second embodiment simultaneously performs different processing. Can be done. For example, the loading station 10
At the same time as mounting the plurality of substrates 18 on the support arm 160a of the support element 140a at 0, the honing station 2
At 00, the plurality of substrates 18 mounted on the support arm 160b of the support element 140b at the previous station can be subjected to a honing treatment. Furthermore, the washing station 30
0, the plurality of honing-processed substrates 18 held by the support arm 160c of the support element 140c are cleaned, and the substrate 18 that has undergone all the treatments is removed at the removal station 400 at the support arm 160d of the support element 140d.
Remove from d. The processing at each of these stations is performed simultaneously with the rotational movement of the support elements 140a-140d within the honing system. (Third Embodiment) FIG. 9 is a diagram of a honing system according to a third embodiment of the present invention. The honing chamber 210 'is configured to receive a support structure 14' in which the support arms 16 'are vertically arranged. Each support arm 16 'has an offset vertical axis v that is radially offset from the central vertical axis V of the support structure 14'. Each support arm 16 'carries at least one substrate 18 and is rotatable about its offset vertical axis v. The honing chamber 210 'forms a seal with the support structure 14'. The nozzle 240 extends vertically through the bottom wall 215 of the honing chamber 210 '. The bottom wall 215 slopes toward the draining assembly 271 of the honing chamber 210 'to facilitate draining the honing solution from the honing chamber 210'. The honing process itself is performed by the same method as in the above embodiment. (Fourth Embodiment) FIGS. 10 and 11 show a configuration according to the fourth embodiment of the present invention. This configuration minimizes equipment costs and space requirements while maximizing the number of substrates processed per batch and reducing unit manufacturing costs. The support structure 14 ″ is a modification of the support structure 14 of FIG. 1 to form a dual planetary array support structure. As is apparent from the figure, two planetary arrays of a plurality of support arms 16 ″ extending in opposite directions are combined. The support structure 14 ″ includes a carrier seal surface 700 that supports a cantilever ring 710. Cantilever ring 71
A central horizontal axis H extends in opposite directions on both sides of the ring through the center of 0. Planetary arrays in which a plurality of support arms 16 'are annularly arranged are formed on both sides of the ring. Each support arm 16 '' in both arrays has a central horizontal axis H
Has an offset horizontal axis h that is substantially parallel to and is radially offset from the central horizontal axis. The cantilever ring 710 is
It includes a mechanism (not shown) for rotating each support arm 16 '' about its offset horizontal axis h.

With such a dual planetary array structure, it is possible to process twice as many substrates in one batch. For example, in the case of processing a substrate having a diameter of 40 mm, two substrates can be held by one support arm 16 ″, and 144 to 160 substrates can be processed in one batch. This array configuration is applicable to all types of substrates and is especially suitable for processing small diameter substrates.

To accommodate the support structure 14 '' having the dual planetary array support structure, the processing station, including the honing station, is configured with two opposing honing chambers along the central horizontal axis H. Preferably, each processing chamber has its own processing unit aligned with the central horizontal axis H. On one side of the chamber between the sections that receive the dual planetary array support structure 14 '' there is an opening located in a plane parallel to the central horizontal axis. The size and shape of the opening preferably corresponds to the carrier seal surface 700 so that the carrier seal surface 700 closes the opening of the chamber when the support structure 14 '' is inserted into the chamber. Preferably, the transport seal surface includes a sealing mechanism 20 for sealing the chamber. Each of the chambers has a nozzle that reciprocates in the center of the planetary array. At the end of processing, the nozzle retracts and the support structure 14 '' moves to the next processing station.

Although the present invention has been described in relation to particular embodiments, it will be appreciated that various variations will be apparent to those skilled in the art. The above embodiment is merely an example,
The present invention is not limited thereto, and various modifications can be made within the scope of the present invention.

[0027]

According to the present invention, a plurality of substrates for electrophotographic printing can be simultaneously subjected to honing treatment, the amount of treatment per batch can be remarkably increased to enhance the production efficiency and reduce the unit manufacturing cost.

[Brief description of drawings]

FIG. 1 is a schematic front view of a support structure according to a first embodiment of the present invention.

2 is a perspective view of the support structure of FIG. 1. FIG.

FIG. 3 is a top view showing a state in which the support structure of FIG. 1 is located in a honing chamber.

FIG. 4 is a sectional view taken along line 4-4 of FIG.

5 is a schematic cross-sectional view showing another example of the nozzle configuration used in the honing station shown in FIGS. 3 and 4. FIG.

FIG. 6 is a top view of the support structure of FIG. 1 positioned in a honing chamber, including yet another nozzle arrangement.

FIG. 7 is a schematic view of the entire honing system using the support structure of FIG.

FIG. 8 is a schematic view of a honing system according to a second embodiment of the present invention, showing a support structure having a plurality of support elements.

FIG. 9 is a schematic sectional view of a vertical support structure used in a honing system according to a third embodiment of the present invention.

FIG. 10 is a perspective view of a support structure used in a honing system according to a fourth embodiment of the present invention, showing two annular arrays extending in opposite directions.

11 is a cross-sectional view of the support structure shown in FIG.

[Explanation of symbols]

 14, 14 ', 14 ", 140 Support structure, 16, 16', 16", 160 Support arm 18 Base 20 Sealing mechanism 210 Honing chamber

Claims (1)

[Claims] 1. A honing system for simultaneously honing a plurality of substrates, comprising at least one movable support having a central axis, and movable support arms arranged around the central axis in a planetary array configuration. A honing chamber comprising a substrate support assembly, each of the plurality of support arms having at least one substrate having a support arm axis substantially parallel to the central axis, and enclosing the plurality of substrates. Has at least one honing nozzle,
The honing nozzles are arranged substantially equally spaced from each of the plurality of substrates and arranged along the central axis to spray a honing solution containing a mixture of suspended particles onto the plurality of substrates to cause non-reflection on each of the plurality of substrates. Honing system that forms the surface.