JPH08323629A - Method and apparatus for controlling polishing agent projection area in centrifugal polishing agent projection apparatus - Google Patents
Method and apparatus for controlling polishing agent projection area in centrifugal polishing agent projection apparatusInfo
- Publication number
- JPH08323629A JPH08323629A JP15217095A JP15217095A JPH08323629A JP H08323629 A JPH08323629 A JP H08323629A JP 15217095 A JP15217095 A JP 15217095A JP 15217095 A JP15217095 A JP 15217095A JP H08323629 A JPH08323629 A JP H08323629A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- cleaning material
- projection
- projection area
- impeller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
(57)【要約】
【目的】 インペラの回転により研掃材に遠心力を付与
して研掃材を投射する装置における研掃材投射領域の制
御方法において、被処理品に対応させて研掃材の投射量
や投射速度を変更したとき、研掃材投射領域を所望のも
のに容易に変更できるようにする。
【構成】 研掃材のインペラへの基準供給量と研掃材の
投射領域の中心位置との相関関係、および研掃材の基準
投射速度と研掃材の投射領域の中心位置との相関関係を
予め求めておき、その後、被処理品の形態に対応させて
研掃材のインペラへの供給量および研掃材の投射速度を
特定し、もって、研掃材のインペラへの基準供給量と研
掃材の投射領域の中心位置との相関関係、および研掃材
の基準投射速度と研掃材の投射領域の中心位置との相関
関係に基づき、研掃材投射領域の中心位置を決定するよ
うにする。(57) [Abstract] [Purpose] In the method of controlling the abrasive material projection area in the device that applies centrifugal force to the abrasive material by the rotation of the impeller, and controls the abrasive material projection area, To make it possible to easily change the abrasive cleaning material projection area to a desired one when the material projection amount or projection speed is changed. [Structure] Correlation between the standard supply amount of the abrasive and cleaning material to the impeller and the center position of the projection area of the abrasive and cleaning material, and the correlation between the reference projection speed of the abrasive and cleaning material and the central position of the projection area of the abrasive and cleaning material Then, the supply amount of the polishing / cleaning material to the impeller and the projection speed of the polishing / cleaning material are specified in accordance with the form of the object to be processed, and thus the reference supply amount to the impeller of the polishing / cleaning material is determined. The center position of the abrasive cleaning material projection area is determined based on the correlation with the central position of the abrasive cleaning material projection area and the correlation between the reference projection speed of the abrasive cleaning material and the center position of the abrasive cleaning material projection area. To do so.
Description
【0001】[0001]
【産業上の利用分野】本発明は、遠心式研掃材投射装置
における研掃材投射領域の制御方法および研掃材投射領
域の制御装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for controlling a polishing / cleaning material projection area in a centrifugal polishing / cleaning material projection apparatus and a controller for the polishing / cleaning material projection area.
【0002】[0002]
【従来の技術】遠心式研掃材投射装置によって投射され
る研掃材は、各種の被処理品に対して研掃材の投射量、
投射速度、投射領域等の点において、被処理品の形状、
被処理面の広さ等の形態に対応した的確な条件で投射さ
れることが望ましい。2. Description of the Related Art The abrasive cleaning material projected by a centrifugal abrasive cleaning material projecting device is used for various kinds of objects to be processed.
In terms of projection speed, projection area, etc., the shape of the object to be processed,
It is desirable that the projection is performed under appropriate conditions corresponding to the shape of the surface to be processed.
【0003】[0003]
【発明が解決しようとする課題】しかし、従来の遠心式
研掃材投射装置では、被処理品の変更に伴い、その被処
理品に対応した研掃材の投射量あるいは投射速度に変え
ようとすると、研掃材の投射領域の中心位置がずれ、研
掃効率が悪くなるなどの問題があった。従って、従来
は、被処理品が変った場合、研掃材の投射領域の中心位
置を決定するコントロールゲージの研掃材排出口の位置
を変えて投射領域の中心位置を変更するようにしている
が、コントロールゲージの研掃材排出口の位置を決定す
るためには、その被処理品に対して研掃材の投射量ある
いは投射速度の変更に伴う投射領域の変化について多く
のテストを行わなければならず、しかも、コントロール
ゲージの研掃材排出口の位置を決定した後は、研掃投射
装置を分解してコントロールゲージの研掃材排出口の位
置を変更し、その後再度組み立てなければならず、手間
隙が非常にかかるなどの新たな問題が生じている。本発
明は、上記の事情に鑑みて為されたもので、その目的
は、被処理品に対応させて研掃材の投射量や投射速度を
変更したとき、研掃材投射領域を所望のものに容易に変
更することが可能な遠心式研掃材投射装置における研掃
材投射領域の制御方法および研掃材投射領域の制御装置
を提供することにある。However, in the conventional centrifugal abrasive cleaning material projecting device, when the product to be processed is changed, the amount of the abrasive cleaning material or the projection speed of the abrasive cleaning material corresponding to the product to be processed is changed. Then, there is a problem that the center position of the projection area of the blasting material is displaced and the blasting efficiency is deteriorated. Therefore, conventionally, when the object to be processed changes, the center position of the projection area is changed by changing the position of the abrasive cleaning material discharge port of the control gauge that determines the center position of the projection area of the polishing material. However, in order to determine the position of the abrasive cleaning agent discharge port of the control gauge, many tests must be conducted on the change in the projection area with the change in the projection amount or the projection speed of the abrasive cleaning material for the product to be processed. Moreover, after determining the position of the abrasive cleaning material outlet of the control gauge, the abrasive cleaning projection device must be disassembled to change the position of the abrasive cleaning material outlet of the control gauge, and then reassembled. However, new problems such as a very large hand gap are occurring. The present invention has been made in view of the above circumstances, and an object thereof is to obtain a desired abrasive cleaning material projection area when the amount of abrasive cleaning material or the projection speed is changed in accordance with the object to be processed. It is an object of the present invention to provide a control method of a polishing / cleaning material projection area and a control device of the polishing / cleaning material projection area in a centrifugal polishing / cleaning material projection apparatus that can be easily changed.
【0004】[0004]
【課題を解決するための手段】上記の目的を達成するた
めに第1発明における遠心式研掃材投射装置における研
掃材投射領域の制御方法は、インペラの回転により研掃
材に遠心力を付与して研掃材を投射する遠心式研掃材投
射装置における研掃材投射領域の制御方法であって、前
記研掃材のインペラへの基準供給量と前記研掃材の投射
領域の中心位置との相関関係、および前記研掃材の基準
投射速度と前記研掃材の投射領域の中心位置との相関関
係を予め求めておき、その後、被処理品の形態に対応さ
せて前記研掃材のインペラへの基準供給量および研掃材
の基準投射速度を特定し、もって、前記研掃材のインペ
ラへの基準供給量と前記研掃材の投射領域の中心位置と
の相関関係、および前記研掃材の基準投射速度と前記研
掃材の投射領域の中心位置との相関関係に基づき、研掃
材投射領域の中心位置を決定するようにすることを特徴
とする。In order to achieve the above object, a method of controlling a polishing / blasting material projection area in a centrifugal type polishing / blasting material projection apparatus according to the first aspect of the present invention is to apply a centrifugal force to the polishing / cleaning material by rotating an impeller. A method for controlling a polishing / cleaning material projection area in a centrifugal polishing / cleaning material projection device for projecting a polishing / cleaning material, the method comprising: a reference supply amount of the polishing / cleaning material to an impeller; The correlation with the position and the correlation between the reference projection speed of the polishing / cleaning material and the center position of the projection area of the polishing / cleaning material are obtained in advance, and then the cleaning / polishing is performed according to the shape of the object to be processed. The reference supply amount of the material to the impeller and the reference projection speed of the polishing and cleaning material are specified, and thus the correlation between the reference supply amount to the impeller of the polishing and cleaning material and the center position of the projection area of the polishing and cleaning material, and The reference projection speed of the abrasive material and the projection area of the abrasive material Based on the correlation between the heart position, characterized in that to determine the center position of the blast material projected area.
【0005】[0005]
【作用】このように構成されたものは、被処理品の形態
に対応した前記研掃材のインペラへの供給量および研掃
材の投射速度を特定すると、予め求めた研掃材のインペ
ラへの基準供給量と研掃材の投射領域の中心位置との相
関関係、およびインペラの基準回転数と研掃材の投射領
域の中心位置との相関関係に基づき、その研掃材の供給
量および投射速度に対応した遠心式研掃材投射装置にお
ける研掃材の投射領域の中心位置を決定することができ
ることとなる。When the supply amount of the polishing / cleaning material to the impeller and the projection speed of the polishing / cleaning material corresponding to the form of the article to be processed are specified, the thus-constructed one can be supplied to the impeller of the polishing / cleaning material obtained in advance. Based on the correlation between the standard supply amount of the and the center position of the projection area of the abrasive cleaning material, and the correlation between the reference rotational speed of the impeller and the center position of the projection area of the abrasive cleaning material, It is possible to determine the center position of the projection area of the abrasive cleaning material in the centrifugal abrasive cleaning material projection device corresponding to the projection speed.
【0006】なお、前述の研掃材の基準供給量およびイ
ンペラの基準回転数は、その遠心式研掃材投射装置にお
いて一般に多く用いられているものをいう。The above-mentioned reference supply amount of the abrasive and cleaning agent and the reference rotational speed of the impeller are those generally used in the centrifugal type abrasive and abrasive material projecting device.
【0007】上記の目的を達成するために第2発明にお
ける遠心式研掃材投射装置における研掃材投射領域の制
御装置は、図1に示すように、インペラの回転により研
掃材に遠心力を付与して研掃材を投射する遠心式研掃材
投射装置における研掃材投射領域の制御装置であって、
予め求めた前記研掃材のインペラへの基準供給量と前記
研掃材の投射領域の中心位置との相関関係、および前記
インペラの基準回転数と前記研掃材の投射領域の中心位
置との相関関係に係るデーターを記憶する記憶手段1
と、前記研掃材のインペラへの供給量を特定する供給量
特定機構2と、前記遠心式研掃材投射装置3における研
掃材投射領域の中心位置を変更するコントロールゲージ
を作動するコントロールゲージ作動機構4と、回転数可
変機構を備えた前記インペラ回転駆動用の駆動機構5
と、前記研掃材のインペラへの供給量および研掃材の投
射速度の特定により、前記記憶手段のデーターに基づき
被処理品の形態に対応した前記コントロールゲージの研
掃材排出口の位置を演算してそのコントロールゲージの
研掃材排出口位置に見合ったコントロールゲージの作動
回転量に係る指令信号を前記コントロールゲージ作動機
構4に出す演算手段6と、を具備したことを特徴とす
る。In order to achieve the above-mentioned object, the control unit for the polishing / blasting material projection area in the centrifugal type polishing / blasting material projection apparatus according to the second invention, as shown in FIG. A control device for a polishing / blasting material projection area in a centrifugal type polishing / polishing material projecting device for imparting
Correlation between the reference supply amount to the impeller of the polishing and cleaning material and the center position of the projection area of the polishing and cleaning material obtained in advance, and the reference rotation speed of the impeller and the center position of the projection area of the polishing and cleaning material Storage means 1 for storing data relating to correlation
A supply amount specifying mechanism 2 for specifying the supply amount of the polishing and cleaning material to the impeller, and a control gauge for operating a control gauge for changing the central position of the polishing and cleaning material projection area in the centrifugal type polishing and cleaning material projection device 3. An operating mechanism 4 and a drive mechanism 5 for rotationally driving the impeller, the drive mechanism 5 including a rotational speed varying mechanism.
By specifying the amount of the abrasive supplied to the impeller and the projection speed of the abrasive, the position of the abrasive outlet of the control gauge corresponding to the form of the article to be processed can be determined based on the data in the storage means. And a computing means 6 for computing and outputting to the control gauge actuation mechanism 4 a command signal relating to the operation rotation amount of the control gauge corresponding to the position of the abrasive cleaning material discharge port of the control gauge.
【0008】[0008]
【作用】このように構成されたものは、被処理品の形態
に対応した前記研掃材のインペラへの供給量および研掃
材の投射速度を特定して演算手段1に入力すると、演算
手段6は、供給量特定機構2の開口度と駆動機構5の回
転数とをそれぞれ所望のものにし、さらに記憶手段1に
記憶されている予め求めた研掃材のインペラへの基準供
給量と研掃材の投射領域の中心位置との相関関係、およ
びインペラの基準回転数と研掃材の投射領域との相関関
係に係るデータから必要なデータを読み出し、被処理品
の形態に対応した前記コントロールゲージの研掃材排出
口の位置を演算し、コントロールゲージの研掃材排出口
位置に見合ったコントロールゲージの作動回転量に係る
指令信号を、前記コントロールゲージ作動機構4に出
す。この結果、コントロールゲージ作動機構4は、コン
トロールゲージの研掃材排出口の位置を所望のものにす
べくコントロールゲージを回転させることとなる。With this construction, when the supply amount of the polishing / cleaning material to the impeller and the projection speed of the polishing / cleaning material corresponding to the form of the article to be processed are specified and input to the calculating means 1, the calculating means Reference numeral 6 sets the opening degree of the supply amount specifying mechanism 2 and the rotation speed of the drive mechanism 5 to desired values, respectively, and further, the reference supply amount of the polishing / cleaning material stored in the storage means 1 to the impeller and the polishing amount. The necessary data is read out from the data relating to the correlation with the center position of the projection area of the cleaning material, and the data relating to the correlation between the reference rotational speed of the impeller and the projection area of the abrasive cleaning material, and the control corresponding to the form of the object to be processed. The position of the abrasive cleaning material discharge port of the gauge is calculated, and a command signal relating to the operation rotation amount of the control gauge corresponding to the position of the abrasive cleaning material discharge port of the control gauge is issued to the control gauge operating mechanism 4. As a result, the control gauge actuating mechanism 4 rotates the control gauge so that the position of the abrasive cleaning material discharge port of the control gauge is desired.
【0009】[0009]
【実施例】本発明の実施例について図2〜図4に基づき
詳細に説明する。図2に示すように、研掃室を構成する
キャビネット21の天井の上面には、遠心式研掃材投射
装置3と、コントロールゲージを作動するコントロール
ゲージ作動機構4と、回転数可変機構を備えた前記イン
ペラ回転駆動用の駆動機構5とが、それぞれ設置してあ
り、研掃材投射装置3の研掃材供給口には、研掃材貯蔵
ホッパ22の排出口が、供給量特定機構2および誘導管
23を介して連通接続してある。Embodiments of the present invention will be described in detail with reference to FIGS. As shown in FIG. 2, on the upper surface of the ceiling of the cabinet 21 that constitutes the polishing and sweeping chamber, the centrifugal polishing and cleaning material projection device 3, the control gauge operating mechanism 4 for operating the control gauge, and the rotation speed varying mechanism are provided. The driving mechanism 5 for rotating the impeller is installed respectively, and the discharge port of the polishing / cleaning material storage hopper 22 is provided at the polishing / cleaning material supply port of the polishing / cleaning material projection device 3 and the supply amount specifying mechanism 2 is provided. And is connected through a guide tube 23.
【0010】そして、前記供給量特定機構2は、図3お
よび図4に示すように、ホッパ22の排出口にフランジ
24を介して装着され上下方向へ延びるとともに下端部
が円弧状を成す内筒25と、この内筒25の下部に回転
軸26を介して正逆回動可能に装着されて内筒25の下
端開口部の開口度を制御するゲート27と、前記フラン
ジ24に装着されて前記内筒25およびゲート27を包
囲する外筒28と、外筒28の外面に装着されたサーボ
モータ29と、サーボモータ29の出力軸と前記回転軸
26とを連結する伝動手段30と、で構成してある。As shown in FIGS. 3 and 4, the supply amount specifying mechanism 2 is mounted on the discharge port of the hopper 22 through the flange 24 and extends vertically, and the lower end portion has an arcuate shape. 25, a gate 27 that is mounted on the lower portion of the inner cylinder 25 through a rotary shaft 26 so as to be able to rotate forward and backward, and controls the opening degree of the lower end opening of the inner cylinder 25, and is mounted on the flange 24. An outer cylinder 28 surrounding the inner cylinder 25 and the gate 27, a servomotor 29 mounted on the outer surface of the outer cylinder 28, and a transmission means 30 connecting the output shaft of the servomotor 29 and the rotary shaft 26. I am doing it.
【0011】また、研掃材投射装置3においては、図5
および図6に示すように、インペラ31を包囲するカバ
ー本体32の右側壁外面に、中央部に孔33を有する補
助カバー34が装着してあり、孔33にはコロガリ軸受
35が嵌着してある。コロガリ軸受35の内側には短尺
円筒体36が嵌着してあって、円筒体36は前記カバー
本体32の側壁外面に垂直な中心軸を有して垂直面内で
回転可能とされている。Further, in the abrasive cleaning and projecting device 3, FIG.
Further, as shown in FIG. 6, an auxiliary cover 34 having a hole 33 in the center is attached to the outer surface of the right side wall of the cover body 32 surrounding the impeller 31, and the roller bearing 35 is fitted in the hole 33. is there. A short cylindrical body 36 is fitted inside the roller bearing 35, and the cylindrical body 36 has a central axis perpendicular to the outer surface of the side wall of the cover body 32 and is rotatable in a vertical plane.
【0012】また、円筒体36には、この円筒体36を
貫通するとともに前記インペラ31に挿入したコントロ
ールゲージ37の右端が、嵌合挿入されかつその鍔部3
7aを円筒体36に掛止させて着脱自在に取り付けてあ
り、コントロールゲージ37は、研掃材排出口37bを
有し、かつその右端には、ゴム製の環状弾性部材38を
介して導入筒39の左端が当接してあり、導入筒39は
コントロールゲージ37と挟持機構40とをもって着脱
自在に挟持されている。そして、挟持機構40は、図6
に示すように、前記円筒体36の右端に装着した押え部
材41を介して前記補助カバー34に取り付けた左右方
向へ延びる支持部材42と、支持部材42に螺着した押
えボルト43とで構成してある(図5参照)。The right end of the control gauge 37, which penetrates the cylindrical body 36 and is inserted into the impeller 31, is fitted and inserted into the cylindrical body 36 and the flange portion 3 thereof.
The control gauge 37 has a polishing / cleaning material discharge port 37b, and a right end of the control gauge 37 is provided with a rubber-made annular elastic member 38. The left end of 39 is in contact, and the introducing cylinder 39 is detachably clamped by the control gauge 37 and the clamping mechanism 40. Then, the holding mechanism 40 is shown in FIG.
As shown in FIG. 5, the support member 42 is attached to the auxiliary cover 34 via the holding member 41 attached to the right end of the cylindrical body 36 and extends in the left-right direction, and the holding bolt 43 is screwed to the supporting member 42. (See FIG. 5).
【0013】また、図6に示すように、前記コロガリ軸
受35における転動体35aの左側位置には環状の充填
部材44が装着してあり、充填部材44は、フェルトま
たは金属繊維を固めて製造した構成を成していてある程
度の伸縮性を有しており、かつ補助カバー34の左面に
取り付けたライナ45により押えられるようにして支持
されている。そして、ライナ45は、下部に凹み46が
形成してあって、ライナ45と円筒体36との間におけ
る上部位置から研掃材が仮に侵入しても、その研掃材は
その凹み46から落下できるようになっている。Further, as shown in FIG. 6, an annular filling member 44 is mounted on the left side of the rolling element 35a in the roller bearing 35, and the filling member 44 is manufactured by solidifying felt or metal fiber. It has a structure, has a certain degree of elasticity, and is supported by being pressed by a liner 45 attached to the left surface of the auxiliary cover 34. Further, the liner 45 has a recess 46 formed in the lower portion, and even if the polishing / cleaning material enters from the upper position between the liner 45 and the cylindrical body 36, the polishing / cleaning material falls from the recess 46. You can do it.
【0014】なお、図中47は円筒体36を回転させる
コントロールゲージ作動機構4としての電動シリンダ、
48はインペラ31を回転させる駆動機構5としての減
速機付きモータ、49はカバーライナである。そして、
前記電動シリンダ47の伸縮作動により、コントロール
ゲージ37は円筒体36を介して正逆回転するようにな
っている。Reference numeral 47 in the figure denotes an electric cylinder as the control gauge operating mechanism 4 for rotating the cylindrical body 36,
Reference numeral 48 is a motor with a reduction gear as the drive mechanism 5 for rotating the impeller 31, and 49 is a cover liner. And
The control gauge 37 is rotated forward and backward through the cylindrical body 36 by the expansion and contraction of the electric cylinder 47.
【0015】また、図2に示すように、前記電動シリン
ダ47、減速機付きモータ48、サーボモータ29に
は、マイクロコンピュータ50が電気的に接続してあ
り、マイクロコンピュータ50は、予め求めた前記イン
ペラ31への研掃材の供給量である供給量特定機構2か
らの研掃材の排出量と、前記研掃材の投射領域の中心位
置との相関関係、および前記インペラ31の基準回転数
である減速機付きモータ48の基準回転数と前記研掃材
の投射領域の中心位置との相関関係に係るデーターを記
憶する記憶手段1としての機能と、供給量特定機構2か
らの研掃材の排出量(前記インペラ31への研掃材の供
給量)および研掃材の投射速度の特定により、前記マイ
クロコンピュータ50のデーターに基づき被処理品の形
態に対応した前記コントロールゲージ37の研掃材排出
口37b位置を演算して前記コントロールゲージ作動機
構4に作動の指令信号を出す演算手段6としての機能と
を備えている。Further, as shown in FIG. 2, a microcomputer 50 is electrically connected to the electric cylinder 47, the speed reducer-equipped motor 48, and the servomotor 29, and the microcomputer 50 obtains the previously determined values. Correlation between the discharge amount of the polishing / cleaning material from the supply amount specifying mechanism 2, which is the supply amount of the polishing / cleaning material to the impeller 31, and the center position of the projection area of the polishing / cleaning material, and the reference rotation speed of the impeller 31. The function as the storage means 1 for storing data relating to the reference rotational speed of the motor with reduction gear 48 and the center position of the projection area of the abrasive cleaning material, and the abrasive cleaning material from the supply amount specifying mechanism 2 The discharge amount (the supply amount of the polishing / cleaning material to the impeller 31) and the projection speed of the polishing / cleaning material are specified, and the computer corresponding to the form of the article to be processed is based on the data of the microcomputer 50. And a function as an arithmetic means 6 which calculates the abrasive cleaning agent outlet 37b position of the roll gauge 37 outputs a command signal for actuating said control gauge actuating mechanism 4.
【0016】このように構成したものは、被処理品の形
態に対応した前記研掃材のインペラ31への供給量(研
掃材の投射量)および研掃材の投射速度を特定して演算
手段1に入力すると、演算手段1は、次のような演算を
行う。すなわち、供給量特定機構2のサーボモータ29
を正逆駆動して内筒25の開口度を所望のものにし、か
つ駆動機構5のモータ48の回転数を所望のものにし、
さらにマイクロコンピュータ50に記憶されている予め
求めた研掃材のインペラ31への基準供給量(研掃材の
基準投射量)と研掃材の投射領域の中心位置との相関関
係、およびインペラ31の基準回転数(研掃材の基準投
射速度)と研掃材の投射領域との相関関係に係るデータ
から必要なデータを読み出し、読み出したデータと、決
定した研掃材の投射量および投射速度とをそれぞれ比較
して、被処理品に対応した研掃材の投射領域の中心位置
を得るべく前記コントロールゲージ37の研掃材排出口
37b位置を算出する。With the above-described structure, the supply amount of the polishing / cleaning material to the impeller 31 (projection amount of the polishing / cleaning material) and the projection speed of the polishing / cleaning material corresponding to the form of the article to be processed are specified and calculated. When input to the means 1, the calculation means 1 performs the following calculation. That is, the servomotor 29 of the supply amount specifying mechanism 2
Is driven in the forward and reverse directions to obtain a desired opening degree of the inner cylinder 25, and a desired rotation speed of the motor 48 of the drive mechanism 5,
Further, the correlation between the reference supply amount (reference projection amount of the polishing and cleaning material) of the polishing and cleaning material and the center position of the projection area of the polishing and cleaning material, which is stored in the microcomputer 50 in advance, and the impeller 31. Required data is read out from the data relating to the correlation between the reference rotation speed of the tool (reference projection speed of the polishing and cleaning material) and the projection area of the polishing and cleaning material, and the read data and the determined projection amount and projection speed of the polishing and cleaning material And the respective values are compared with each other, and the position of the abrasive cleaning material discharge port 37b of the control gauge 37 is calculated in order to obtain the center position of the projection area of the abrasive cleaning material corresponding to the object to be processed.
【0017】例えば、この研掃材排出口37b位置を得
るための前記コントロールゲージ37の回転量をγ角度
とすると、γ角度は、研掃材の特定投射量について基準
状態から目標状態の投射流域の中心位置を得るための前
記コントロールゲージ37の回転角度αと、研掃材の特
定投射速度について基準状態から目標状態の投射流域の
中心位置を得るための前記コントロールゲージ37の回
転角度βとを加算して得ることができる。この算出結果
に基づき、前記電動シリンダ47が正転駆動または逆転
駆動されて、コントロールゲージ37の研掃材排出口3
7bの位置は所望のものに変更されることとなる。For example, when the rotation amount of the control gauge 37 for obtaining the position of the abrasive cleaning material discharge port 37b is a γ angle, the γ angle is a projected flow region from a reference state to a target state for a specific projection amount of the abrasive cleaning material. The rotation angle α of the control gauge 37 for obtaining the center position of the control gauge 37 and the rotation angle β of the control gauge 37 for obtaining the center position of the projection basin in the target state from the reference state for the specific projection speed of the abrasive It can be obtained by adding. Based on the calculation result, the electric cylinder 47 is driven to rotate in the normal direction or to rotate in the reverse direction, and the abrasive cleaning material discharge port 3 of the control gauge 37
The position of 7b will be changed to the desired one.
【0018】[0018]
【発明の効果】以上の説明から明らかなように本発明
は、前記研掃材のインペラへの基準供給量と前記研掃材
の投射領域の中心位置との相関関係、および前記研掃材
の基準投射速度と前記研掃材の投射領域の中心位置との
相関関係を予め求めておき、その後、被処理品の形態に
対応させて前記研掃材のインペラへの基準供給量および
研掃材の基準投射速度を特定し、もって、前記研掃材の
インペラへの基準供給量と前記研掃材の投射領域の中心
位置との相関関係、および前記研掃材の基準投射速度と
前記研掃材の投射領域の中心位置との相関関係に基づ
き、研掃材投射領域の中心位置を決定するようにしたか
ら、被処理品に対応させて研掃材の投射量や投射速度を
変更したとき、研掃材投射領域を所望のものに容易に変
更することが可能になるなどの優れた効果を奏する。As is apparent from the above description, according to the present invention, the correlation between the reference supply amount of the polishing and cleaning material to the impeller and the center position of the projection area of the polishing and cleaning material, and the polishing and cleaning material The correlation between the reference projection speed and the center position of the projection area of the polishing / cleaning material is obtained in advance, and thereafter, the reference supply amount of the polishing / cleaning material to the impeller and the polishing / cleaning material are made to correspond to the form of the object to be processed. Of the reference supply speed of the polishing and cleaning material to the impeller and the center position of the projection area of the polishing and cleaning material, and the reference projection speed of the polishing and cleaning material and the polishing and cleaning. Since the center position of the abrasive cleaning material projection area is determined based on the correlation with the central position of the material projection area, when changing the projection amount or the projection speed of the abrasive cleaning material according to the processing target It is now possible to easily change the abrasive cleaning material projection area to the desired one. Excellent effects such as.
【図1】第2発明のクレーム対応図である。FIG. 1 is a diagram corresponding to a claim of the second invention.
【図2】本発明の一実施例の概略正面図である。FIG. 2 is a schematic front view of an embodiment of the present invention.
【図3】図2のA部拡大縦断面図である。FIG. 3 is an enlarged vertical sectional view of a portion A of FIG.
【図4】図3のB−B断面図である。FIG. 4 is a sectional view taken along line BB of FIG.
【図5】図2のC部拡大図である。5 is an enlarged view of portion C in FIG.
【図6】図5のC−C断面図である。FIG. 6 is a sectional view taken along the line CC of FIG. 5;
1 記憶手段 2 供給量特定機構 3 研掃材投射装置 4 コントロールゲージ作動機構 5 駆動機構 6 演算手段 1 Storage Means 2 Supply Amount Specification Mechanism 3 Abrasive Cleaning Material Projector 4 Control Gauge Operation Mechanism 5 Drive Mechanism 6 Computing Means
Claims (2)
付与して研掃材を投射する遠心式研掃材投射装置におけ
る研掃材投射領域の制御方法であって、前記研掃材のイ
ンペラへの基準供給量と前記研掃材の投射領域の中心位
置との相関関係、および前記研掃材の基準投射速度と前
記研掃材の投射領域の中心位置との相関関係を予め求め
ておき、その後、被処理品の形態に対応させて前記イン
ペラへの研掃材の供給量および研掃材の投射速度を特定
し、もって、前記研掃材のインペラへの基準供給量と前
記研掃材の投射領域の中心位置との相関関係、および前
記研掃材の基準投射速度と前記研掃材の投射領域の中心
位置との相関関係に基づき、研掃材投射領域の中心位置
を決定するようにすることを特徴とする遠心式研掃材投
射装置における研掃材投射領域の制御方法。1. A method of controlling a polishing / blasting material projection area in a centrifugal type polishing / polishing material projecting device for applying a centrifugal force to the polishing / cleaning material by rotating an impeller to project the polishing / cleaning material. Correlation between the reference supply amount to the impeller and the center position of the projection area of the polishing and cleaning material, and the correlation between the reference projection speed of the polishing and cleaning material and the center position of the projection area of the polishing and cleaning material are obtained in advance. After that, the supply amount of the polishing / cleaning material to the impeller and the projection speed of the polishing / cleaning material are specified in accordance with the form of the object to be processed, and thus the reference supply amount to the impeller of the polishing / cleaning material and the polishing speed are specified. The center position of the abrasive cleaning material projection area is determined based on the correlation with the central position of the projection area of the cleaning material and the correlation between the reference projection speed of the abrasive cleaning material and the center position of the projection area of the abrasive cleaning material. In a centrifugal abrasive cleaning material projection device, characterized in that Control method of material projection area.
付与して研掃材を投射する遠心式研掃材投射装置におけ
る研掃材投射領域の制御装置であって、予め求めた前記
研掃材のインペラへの基準供給量と前記研掃材の投射領
域の中心位置との相関関係、および前記インペラの基準
回転数と前記研掃材の投射領域の中心位置との相関関係
に係るデーターを記憶する記憶手段1と、前記研掃材の
インペラへの供給量を特定する供給量特定機構2と、前
記遠心式研掃材投射装置3における研掃材投射領域の中
心位置を変更するコントロールゲージを作動するコント
ロールゲージ作動機構4と、回転数可変機構を備えた前
記インペラ回転駆動用の駆動機構5と、前記研掃材のイ
ンペラへの供給量および研掃材の投射速度の特定によ
り、前記記憶手段のデーターに基づき被処理品の形態に
対応した前記コントロールゲージの研掃材排出口の位置
を演算してそのコントロールゲージの研掃材排出口位置
に見合ったコントロールゲージの作動回転量に係る指令
信号を前記コントロールゲージ作動機構4に出す演算手
段6と、を具備したことを特徴とする遠心式研掃材投射
装置における研掃材投射領域の制御装置。2. A control unit for a polishing / blasting material projection area in a centrifugal type polishing / polishing material projection apparatus for applying a centrifugal force to the polishing / cleaning material by the rotation of an impeller to project the polishing / cleaning material. Data concerning the correlation between the reference supply amount of the cleaning material to the impeller and the center position of the projection area of the polishing material, and the correlation between the reference rotational speed of the impeller and the center position of the projection area of the polishing material A storage means 1 for storing the above, a supply amount specifying mechanism 2 for specifying the supply amount of the abrasive cleaning material to the impeller, and a control for changing the center position of the abrasive cleaning material projecting area in the centrifugal abrasive cleaning material projecting device 3. By the control gauge actuation mechanism 4 for actuating a gauge, the drive mechanism 5 for rotating the impeller equipped with the rotation speed variable mechanism, the supply amount of the polishing and cleaning material to the impeller, and the projection speed of the polishing and cleaning material, The data of the storage means Based on the controller, the position of the abrasive cleaning material discharge port of the control gauge corresponding to the form of the processed product is calculated, and a command signal related to the operating rotation amount of the control gauge corresponding to the position of the abrasive cleaning material discharge port of the control gauge is calculated. A control unit for controlling a polishing / blasting material projection area in a centrifugal type polishing / blasting material projection apparatus, comprising: a computing unit 6 for outputting to the control gauge operating mechanism 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15217095A JPH08323629A (en) | 1995-05-26 | 1995-05-26 | Method and apparatus for controlling polishing agent projection area in centrifugal polishing agent projection apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15217095A JPH08323629A (en) | 1995-05-26 | 1995-05-26 | Method and apparatus for controlling polishing agent projection area in centrifugal polishing agent projection apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08323629A true JPH08323629A (en) | 1996-12-10 |
Family
ID=15534575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15217095A Pending JPH08323629A (en) | 1995-05-26 | 1995-05-26 | Method and apparatus for controlling polishing agent projection area in centrifugal polishing agent projection apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08323629A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006055926A (en) * | 2004-08-18 | 2006-03-02 | Kamei Tekkosho:Kk | Abrasive grain injecting device |
| WO2007072863A1 (en) * | 2005-12-20 | 2007-06-28 | Sintokogio, Ltd. | Method of estimating projection condition information by projection machine and device thereof |
| JP2007167979A (en) * | 2005-12-20 | 2007-07-05 | Sintokogio Ltd | Projection state information estimation method, projection state information estimation device, and projection state information estimation program using a blast device |
| JP2007190632A (en) * | 2006-01-18 | 2007-08-02 | Sintokogio Ltd | Projection distribution adjustment method and blasting apparatus using the adjustment method |
| JP2007229867A (en) * | 2006-03-01 | 2007-09-13 | Sintokogio Ltd | Projection state information estimation method, projection state information estimation device, and projection state information estimation program using a blast device |
| CN102590548A (en) * | 2012-02-13 | 2012-07-18 | 浙江大学 | Method for measuring speed difference of screw and revolving drum of spiral discharging sedimentation centrifuge |
| US20160131556A1 (en) * | 2014-11-10 | 2016-05-12 | Robert Bosch Gmbh | Apparatus and method for testing an airbag control unit |
-
1995
- 1995-05-26 JP JP15217095A patent/JPH08323629A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006055926A (en) * | 2004-08-18 | 2006-03-02 | Kamei Tekkosho:Kk | Abrasive grain injecting device |
| WO2007072863A1 (en) * | 2005-12-20 | 2007-06-28 | Sintokogio, Ltd. | Method of estimating projection condition information by projection machine and device thereof |
| JP2007167979A (en) * | 2005-12-20 | 2007-07-05 | Sintokogio Ltd | Projection state information estimation method, projection state information estimation device, and projection state information estimation program using a blast device |
| US8219367B2 (en) | 2005-12-20 | 2012-07-10 | Sintokogio, Ltd. | Method of estimating information on projection conditions by a projection machine and a device thereof |
| JP2007190632A (en) * | 2006-01-18 | 2007-08-02 | Sintokogio Ltd | Projection distribution adjustment method and blasting apparatus using the adjustment method |
| JP2007229867A (en) * | 2006-03-01 | 2007-09-13 | Sintokogio Ltd | Projection state information estimation method, projection state information estimation device, and projection state information estimation program using a blast device |
| CN102590548A (en) * | 2012-02-13 | 2012-07-18 | 浙江大学 | Method for measuring speed difference of screw and revolving drum of spiral discharging sedimentation centrifuge |
| US20160131556A1 (en) * | 2014-11-10 | 2016-05-12 | Robert Bosch Gmbh | Apparatus and method for testing an airbag control unit |
| US9488548B2 (en) * | 2014-11-10 | 2016-11-08 | Robert Bosch Gmbh | Apparatus and method for testing an airbag control unit |
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