JPH08336823A - Ceramic base sheet and method and apparatus for manufacturing it - Google Patents
Ceramic base sheet and method and apparatus for manufacturing itInfo
- Publication number
- JPH08336823A JPH08336823A JP8137675A JP13767596A JPH08336823A JP H08336823 A JPH08336823 A JP H08336823A JP 8137675 A JP8137675 A JP 8137675A JP 13767596 A JP13767596 A JP 13767596A JP H08336823 A JPH08336823 A JP H08336823A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- grooves
- green sheet
- manufacturing
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 238000000034 method Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims description 54
- 238000010304 firing Methods 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 abstract 2
- 238000003825 pressing Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、いわゆるチップ
状の電子部品の絶縁基板となるセラミック基板とその製
造方法及び製造装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic substrate that serves as an insulating substrate for so-called chip-shaped electronic components, and a method and apparatus for manufacturing the same.
【０００２】[0002]
【従来の技術】従来、例えばチップ抵抗器の絶縁基板を
セラミックスで形成する場合、特開昭５８−３０１１８
号公報に開示されているように、セラミックスの焼成前
のグリーンシートに所定の刃よって縦横に細い溝を形成
し、焼成後この溝で分割して個々のチップ抵抗器の絶縁
基板を得ていた。2. Description of the Related Art Conventionally, for example, when an insulating substrate of a chip resistor is made of ceramics, it is disclosed in Japanese Patent Laid-Open No. 58-30118.
As disclosed in Japanese Patent Publication No. JP-A-2003-242242, thin grooves are formed in the vertical and horizontal directions on a green sheet before firing of ceramics by a predetermined blade, and after firing, the insulating substrate of each chip resistor is obtained by dividing by this groove. .
【０００３】この溝は、柔らかいグリーンシートに金型
の刃を押し付けて形成されているものであり、縦方向と
横方向の溝は別々に専用の金型で順次設けていた。これ
は、分割用の溝がきわめて細く浅いものであるため、別
々に設けられた刃を交差させて金型に取り付けることが
できなかったためである。The groove is formed by pressing the blade of the mold against a soft green sheet, and the groove in the vertical direction and the groove in the horizontal direction are separately provided in order by a dedicated mold. This is because the dividing groove is extremely thin and shallow, and therefore it was not possible to cross the blades provided separately and attach them to the mold.
【０００４】[0004]
【発明が解決しようとする課題】上記従来の技術の場
合、柔らかいグリーンシート１０に縦方向と横方向に別
々に刃を押しつけて溝を形成するため、図６に示すよう
に、先に形成した溝１１に後から形成した溝１２による
盛り上り部１３ができてしまうという問題があった。こ
れによって、グリーンシート１０を焼成してセラミック
基板を得た後、溝１１、１２に沿ってこれを分割する
と、盛り上り部１３の部分は厚いのできれいに割れず、
図７に示すように絶縁基板１４の角の部分で盛り上り部
１３がバリとして残ってしまうという欠点が生じてい
た。In the case of the above-mentioned conventional technique, the grooves are formed by pressing the blades separately in the vertical and horizontal directions on the soft green sheet 10, so that the soft green sheet 10 is formed first as shown in FIG. There is a problem in that a raised portion 13 is formed in the groove 11 due to the groove 12 formed later. As a result, when the green sheet 10 is fired to obtain a ceramic substrate and then divided along the grooves 11 and 12, the raised portion 13 is thick and therefore does not crack cleanly.
As shown in FIG. 7, the raised portion 13 remains as a burr at the corner of the insulating substrate 14, which is a drawback.
【０００５】さらに、縦横の溝１１、１２の交差部は単
に溝１１、１２が直交しているだけなので分割の際に角
の部分にヒビ等が入りやすく、チップ部品製造の歩留低
下の原因にもなっていた。Furthermore, since the grooves 11 and 12 intersect at right and left at the intersections of the vertical and horizontal grooves 11 and 12, the cracks and the like are likely to occur at the corners at the time of division, which causes a decrease in the yield of chip component manufacturing. It was also
【０００６】この発明は上記従来の技術に鑑み成された
もので、多数個取りのセラミック基板を分割して得た絶
縁基板に、バリやヒビ割れが生じないセラミック基板と
その製造方法及び製造装置を提供することを目的とす
る。The present invention has been made in view of the above-mentioned prior art, and a ceramic substrate which is free from burrs and cracks in an insulating substrate obtained by dividing a multi-cavity ceramic substrate, its manufacturing method and manufacturing apparatus. The purpose is to provide.
【０００７】[0007]
【課題を解決するための手段】この発明は、チップ部品
の絶縁基板を多数個取りするセラミック基板において、
この基板の表裏面に縦横に各々互いに対向して複数本の
溝が形成され、この各溝の交差部の四方の角部の側面
が、上記溝の幅より大きい曲率半径を有する曲面の凸面
状に形成されていることを特徴とするセラミック基板で
ある。SUMMARY OF THE INVENTION The present invention provides a ceramic substrate for obtaining a large number of insulating substrates for chip parts,
A plurality of grooves are formed on the front and back surfaces of the substrate so as to face each other in the vertical and horizontal directions, and the side surfaces of the four corners of the intersection of each groove have a curved convex surface having a radius of curvature larger than the width of the groove. Is a ceramic substrate.
【０００８】この発明は、いわゆるドクターブレード法
によりグリーンシートを形成するもので、粉体と溶剤及
びバインダーを混合してキャリヤテープ上にグリーンシ
ートを形成し、これを焼成してセラミック基板を得るセ
ラミック基板の製造方法において、グリーンシートを形
成した後、縦横に各々複数本の刃が一体に形成された金
型を上記グリーンシートの表裏面に押し付けて、表裏面
の縦横の溝を同時に上記グリーンシートに形成し、この
後グリーンシートを焼成することを特徴とするセラミッ
ク基板の製造方法である。The present invention forms a green sheet by a so-called doctor blade method. The powder, a solvent and a binder are mixed to form a green sheet on a carrier tape, and the green sheet is fired to obtain a ceramic substrate. In the method for manufacturing a substrate, after forming a green sheet, a mold in which a plurality of blades are integrally formed in the vertical and horizontal directions is pressed against the front and back surfaces of the green sheet, and the vertical and horizontal grooves on the front and back surfaces are simultaneously formed into the green sheet. And a green sheet is fired after that, the method is for producing a ceramic substrate.
【０００９】さらにこの発明は、粉体と溶剤及びバイン
ダーを混合して、キャリヤテープ上に形成された焼成前
のグリーンシートに、所定の溝を形成するセラミック基
板の製造装置において、グリーンシートの表面に縦横に
溝を形成するための複数本の刃が、縦横に一体に形成さ
れた金型を備え、この金型の刃は、上記金型を構成する
金属から削り出して形成されているものであるセラミッ
ク基板の製造装置である。さらに、上記刃の交差部分の
側面は、凹面状の曲面に形成されているものである。Further, according to the present invention, in a device for manufacturing a ceramic substrate in which powder, a solvent and a binder are mixed to form a predetermined groove on a green sheet formed on a carrier tape before firing, the surface of the green sheet is A plurality of blades for forming vertical and horizontal grooves are provided with a mold integrally formed in the vertical and horizontal directions, and the blade of this mold is formed by cutting out from the metal forming the mold. Is a manufacturing apparatus for a ceramic substrate. Further, the side surface of the intersecting portion of the blade is formed into a concave curved surface.
【００１０】[0010]
【発明の実施の形態】以下この発明の実施の形態につい
て図面に基づいて説明する。この実施形態のセラミック
基板は、アルミナ等のセラミックスにより形成され、表
面には横溝１及び縦溝２が一定のピッチで設けられ、そ
の交差部３では、図１に示すように、各溝１，２の交差
部の側面の四方の角部がＲをつけられて凸状の曲面に形
成されている。そして、この溝１，２の深さは、約２５
０μｍ 程度であり、上記Ｒの曲率半径は溝の幅より大
きく形成されている。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. The ceramic substrate of this embodiment is formed of ceramics such as alumina, and has lateral grooves 1 and vertical grooves 2 provided at a constant pitch on the surface thereof, and at intersections 3 thereof, as shown in FIG. The four corners of the side surface of the intersection 2 are rounded to form a convex curved surface. The depth of the grooves 1 and 2 is about 25.
The radius of curvature of R is larger than the width of the groove.
【００１１】このセラミック基板は、チップ部品の基板
を多数個取りするもので、後に、溝１，２に沿って分割
して個々のチップ部品の絶縁基板４を得るものである。This ceramic substrate is used to obtain a large number of chip component substrates, and is subsequently divided along the grooves 1 and 2 to obtain the insulating substrate 4 of each chip component.
【００１２】この実施形態のセラミック基板の製造方法
は、まず、いわゆるドクターブレード法により焼成前の
セラミックスのグリーンシートを作る。このグリーンシ
ートの製法は公知のもので、原料の粉体及び溶剤その他
を混合し、バインダーを加えてさらに混練し、所定のキ
ャリアテープ上にこれを一定の厚さで塗り、乾燥させて
グリーンシートを作る。In the method for manufacturing a ceramic substrate of this embodiment, first, a so-called doctor blade method is used to prepare a green sheet of ceramics before firing. This green sheet is produced by a known method. Powders of raw materials, a solvent and the like are mixed, a binder is added and further kneaded, and this is coated on a predetermined carrier tape with a constant thickness and dried to obtain a green sheet. make.
【００１３】次に、このグリーンシートに溝１，２を形
成する。この溝１，２の形成は、溝形成用の刃５，６
が、縦横に一定のピッチで設けられた金型７によりプレ
スして行う。この金型７の刃５，６の交差部の側面は凹
面状の曲面であるＲをつけて加工されており、このＲの
曲率半径は相対的に刃の厚さより大きく形成されてい
る。これによって溝１，２の交差部３が曲面形状で角の
ない形に形成される。ここで、この金型７は、深さが約
２５０μｍ 程度の極めて細い溝を形成するものであ
り、刃５，６の高さも２５０μｍ位に加工するため、縦
横の刃を交差させて取り付けることは出来ず、放電加工
によって表面に刃５，６を一体に残すように研削して金
型７を作る。そして、溝１，２が形成されたグリーンシ
ートは、所定の温度で焼成され、セラミックスの基板と
なる。Next, grooves 1 and 2 are formed in this green sheet. The formation of the grooves 1 and 2 is performed by using the blades 5 and 6 for forming the grooves.
However, it is performed by pressing with a die 7 provided at a constant pitch in the vertical and horizontal directions. The side surface of the intersection of the blades 5 and 6 of the die 7 is processed with a concave curved surface R, and the radius of curvature of this R is relatively larger than the thickness of the blade. As a result, the intersection 3 of the grooves 1 and 2 is formed in a curved shape without a corner. Here, the die 7 forms an extremely thin groove having a depth of about 250 μm, and since the height of the blades 5 and 6 is also processed to about 250 μm, the vertical and horizontal blades cannot be attached to intersect each other. This cannot be done, and the die 7 is produced by electric discharge machining so that the blades 5 and 6 are left integrally on the surface. Then, the green sheet in which the grooves 1 and 2 are formed is fired at a predetermined temperature to become a ceramic substrate.
【００１４】この実施形態のセラミック基板によれば、
セラミックスの焼成前のグリーンシートに金型によって
２次元的に一度に縦横の溝１，２を形成して焼結してい
るので、溝１，２の交差部に盛り上り部ができず、個々
の絶縁基板に分割する際に、正確に溝に沿って分割でき
る。実験的には、分割後の絶縁基板にできるバリやヒビ
割れが従来１０％程度の頻度であったのが、これにより
０．５ 〜０．０５％以下に減少させることができた。
また、これによって、チップ部品の製造工数の削減、歩
留の向上等を図ることができる。According to the ceramic substrate of this embodiment,
Since the vertical and horizontal grooves 1 and 2 are formed at a time in a two-dimensional manner on the green sheet of ceramics before firing by a die, the ridges cannot be formed at the intersections of the grooves 1 and 2, and When dividing into the insulating substrate, it is possible to accurately divide along the groove. Experimentally, burrs and cracks formed on the insulating substrate after the division were conventionally about 10%, but this can be reduced to 0.5 to 0.05% or less.
Further, this can reduce the number of manufacturing steps of chip parts and improve the yield.
【００１５】次に、この発明の他の実施形態について図
５を基にして説明する。ここで、前述の実施形態と同一
部分については同一符号を付して説明を省略する。Next, another embodiment of the present invention will be described with reference to FIG. Here, the same parts as those in the above-described embodiment are designated by the same reference numerals and the description thereof will be omitted.
【００１６】この実施形態では、セラミック基板の両面
に分割用の溝を形成している。ここで、裏面側の溝１
５，１６の深さは、表面側の溝１，２より浅く、５０μ
ｍ 程度に形成されている。裏面側の溝１５，１６の交
差部１７も表面側と同様に形成されている。In this embodiment, dividing grooves are formed on both surfaces of the ceramic substrate. Here, the groove 1 on the back side
The depth of 5 and 16 is shallower than the grooves 1 and 2 on the front side and is 50μ.
It is formed to about m 2. The intersection 17 of the grooves 15 and 16 on the back surface side is also formed similarly to the front surface side.
【００１７】この実施形態のセラミック基板の製造も前
述の実施形態と同様であり、表面用の金型との刃の高さ
変えた裏面用の金型も用いて、表裏面同時にプレスして
グリーンシートに溝を設けるものである。The production of the ceramic substrate of this embodiment is the same as that of the above-mentioned embodiment, and the front and back surfaces are simultaneously pressed by using the front surface mold and the back surface mold in which the height of the blade is changed. The sheet is provided with a groove.
【００１８】この実施形態によれば、表裏面に分割用の
溝が形成されているので、より分割しやすく、バリやヒ
ビ割れが生じにくい。According to this embodiment, since the dividing grooves are formed on the front and back surfaces, the dividing is easier, and burrs and cracks are less likely to occur.
【００１９】尚、この発明のセラミック基板の材料はア
ルミナ以外に、チタン酸バリウム等の誘電体、フェライ
ト等であっても良い。また、溝の深さや開き角は適宜設
定すれば良くその形状は問わない。さらに、溝のピッチ
は一定でなく、種々の大きさの絶縁基板に分割するもの
であっても良い。The material of the ceramic substrate of the present invention may be a dielectric material such as barium titanate or the like, ferrite or the like, in addition to alumina. Further, the depth and opening angle of the groove may be set appropriately, and the shape thereof does not matter. Furthermore, the pitch of the grooves is not constant, and the grooves may be divided into insulating substrates of various sizes.
【００２０】[0020]
【発明の効果】この発明のセラミック基板は、多数個取
りの分割用の溝の交差部の四方の角部に、溝の幅より大
きい曲率半径のＲを付けるようにしたので、後に個々の
チップ部品毎の絶縁基板に分割する際にも、絶縁基板の
周縁部にバリやヒビ割れがほとんど発生せず、端面の研
磨工程を不要にし、チップ部品製造の歩留も向上させる
ことができる。According to the ceramic substrate of the present invention, the radius R of curvature larger than the width of the groove is attached to the four corners of the intersection of the groove for dividing a plurality of chips. Even when the insulating substrate is divided into each component, burrs and cracks are hardly generated in the peripheral portion of the insulating substrate, an end face polishing step is unnecessary, and the yield of chip component manufacturing can be improved.
【００２１】また、この発明のセラミック基板の製造方
法と製造装置によれば、金型によりグリーンシートに一
度に縦横の溝を形成するので、金型によるプレスの際に
溝の交差部に盛り上り部が生ずることがなく、後の工程
で個々のチップ部品の絶縁基板に分割する際にバリが発
生することがない。しかも、縦横の溝を一度に形成する
ので、製造工数の削減も図ることができる。Further, according to the method and apparatus for manufacturing a ceramic substrate of the present invention, vertical and horizontal grooves are formed in the green sheet at once by the mold, and therefore, when the mold is pressed, the ridge rises at the intersection of the grooves. No part is formed, and no burr is generated when the chip substrate is divided into insulating substrates of individual chip parts in a later step. Moreover, since the vertical and horizontal grooves are formed at once, the number of manufacturing steps can be reduced.
【図１】この発明の一実施形態のセラミック基板の部分
拡大正面図である。FIG. 1 is a partially enlarged front view of a ceramic substrate according to an embodiment of the present invention.
【図２】この実施形態のセラミック基板の正面図であ
る。FIG. 2 is a front view of the ceramic substrate of this embodiment.
【図３】（Ａ）は図１のＡ−Ａ断面図、（Ｂ）は図１の
Ｂ−Ｂ断面図である3A is a sectional view taken along the line AA of FIG. 1, and FIG. 3B is a sectional view taken along the line BB of FIG.
【図４】この実施形態のセラミック基板の製造に用いる
金型の部分拡大斜視図である。FIG. 4 is a partially enlarged perspective view of a mold used for manufacturing the ceramic substrate of this embodiment.
【図５】この発明の他の実施形態のセラミック基板の縦
断面図であるFIG. 5 is a vertical sectional view of a ceramic substrate according to another embodiment of the present invention.
【図６】従来の技術のセラミック基板の部分拡大正面図
である。FIG. 6 is a partially enlarged front view of a conventional ceramic substrate.
【図７】従来の技術により製造したチップ部品の絶縁基
板である。FIG. 7 is an insulating substrate of a chip component manufactured by a conventional technique.
１，２，１５，１６ 溝 ３，１７ 交差部 ４ 絶縁基板 ５，６ 刃 ７ 金型 1,2,15,16 Groove 3,17 Intersection 4 Insulating substrate 5,6 Blade 7 Mold
───────────────────────────────────────────────────── フロントページの続き (72)発明者 山下 卓巳 富山県上新川郡大沢野町下大久保3158番地 北陸電気工業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takumi Yamashita 3158 Shimookubo, Osawano-cho, Kamishinagawa-gun, Toyama Prefecture Hokuriku Electric Industry Co., Ltd.
Claims (4)
セラミック基板において、この基板の表裏面に縦横に各
々互いに対向して複数本の溝が形成され、この各溝の交
差部の四方の角部の側面が、上記溝の幅より大きい曲率
半径を有する曲面の凸面状に形成されていることを特徴
とするセラミック基板。1. A ceramic substrate for obtaining a large number of insulating substrates for chip parts, wherein a plurality of grooves are formed on the front and back surfaces of the substrate so as to face each other vertically and horizontally, and the four corners of the intersection of each groove are formed. A ceramic substrate, wherein a side surface of the portion is formed into a curved convex shape having a radius of curvature larger than the width of the groove.
ャリヤテープ上にグリーンシートを形成し、これを焼成
してセラミック基板を得るセラミック基板の製造方法に
おいて、グリーンシートを形成した後、縦横に各々複数
本の刃が一体に形成された金型を上記グリーンシートの
表裏面に押し付けて、表裏面の縦横の溝を同時に上記グ
リーンシートに形成し、この後グリーンシートを焼成す
ることを特徴とするセラミック基板の製造方法。2. A method for manufacturing a ceramic substrate in which powder, a solvent, and a binder are mixed to form a green sheet on a carrier tape, and the green sheet is fired to obtain a ceramic substrate. It is characterized in that a mold in which a plurality of blades are integrally formed is pressed against the front and back surfaces of the green sheet, vertical and horizontal grooves on the front and back surfaces are simultaneously formed in the green sheet, and then the green sheet is baked. Ceramic substrate manufacturing method.
キャリヤテープ上に形成された焼成前のグリーンシート
に、所定の溝を形成するセラミック基板の製造装置にお
いて、グリーンシートの表面に縦横に溝を形成するため
の複数本の刃が、縦横に一体に形成された金型を備え、
この金型の刃は、上記金型を構成する金属から削り出し
て形成されているものであるセラミック基板の製造装
置。3. Mixing powder, solvent and binder,
In a ceramic substrate manufacturing apparatus for forming predetermined grooves in a green sheet formed on a carrier tape before firing, a plurality of blades for forming grooves in the vertical and horizontal directions are integrally formed in the vertical and horizontal directions on the surface of the green sheet. With the formed mold,
The blade of this mold is a device for manufacturing a ceramic substrate, which is formed by cutting out from the metal forming the mold.
面に形成されている請求項３記載のセラミック基板の製
造装置。4. The apparatus for manufacturing a ceramic substrate according to claim 3, wherein a side surface of the intersecting portion of the blades is formed into a concave curved surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8137675A JP2829276B2 (en) | 1996-05-07 | 1996-05-07 | Method and apparatus for manufacturing ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8137675A JP2829276B2 (en) | 1996-05-07 | 1996-05-07 | Method and apparatus for manufacturing ceramic substrate |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63202142A Division JPH0748409B2 (en) | 1988-08-12 | 1988-08-12 | Ceramic substrate and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08336823A true JPH08336823A (en) | 1996-12-24 |
| JP2829276B2 JP2829276B2 (en) | 1998-11-25 |
Family
ID=15204198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8137675A Expired - Fee Related JP2829276B2 (en) | 1996-05-07 | 1996-05-07 | Method and apparatus for manufacturing ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2829276B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57181060U (en) * | 1981-05-14 | 1982-11-17 | ||
| JPS62204366U (en) * | 1986-06-18 | 1987-12-26 |
-
1996
- 1996-05-07 JP JP8137675A patent/JP2829276B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57181060U (en) * | 1981-05-14 | 1982-11-17 | ||
| JPS62204366U (en) * | 1986-06-18 | 1987-12-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2829276B2 (en) | 1998-11-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2707440B2 (en) | Method and apparatus for manufacturing chip-shaped insulating substrate | |
| JPH0748409B2 (en) | Ceramic substrate and manufacturing method thereof | |
| JPH08336823A (en) | Ceramic base sheet and method and apparatus for manufacturing it | |
| JP2612843B2 (en) | Ceramic substrate and insulating substrate for chip components | |
| JP3305673B2 (en) | Ceramic substrate | |
| JPH10125565A (en) | Method/device for cutting/dividing ceramic stacked body | |
| JP2003347684A (en) | Ceramic substrate and method of manufacturing the same | |
| JP3526527B2 (en) | Ceramic substrate | |
| JPH10156823A (en) | Ceramic substrate having divided grooves and resistor using the same | |
| JP3301927B2 (en) | Method of manufacturing ceramic substrate having divided grooves | |
| JP3325483B2 (en) | Method of manufacturing glaze substrate for thermal head | |
| JPH0259302A (en) | Green sheet pressing method | |
| JP3610173B2 (en) | Ceramic substrate having dividing grooves | |
| JPS61265898A (en) | Manufacture of ceramic wiring board | |
| JP4442964B2 (en) | Ceramic substrate for electronic parts | |
| JPH08213719A (en) | Ceramic substrate for chip-shaped electronic component and manufacturing method thereof | |
| JPH11314972A (en) | Ceramic substrate and method of manufacturing the same | |
| JP4683752B2 (en) | Ceramic substrate having dividing grooves | |
| JP2003338404A (en) | Ceramic substrate having divided grooves and method of manufacturing the same | |
| JP2590335Y2 (en) | Ceramic substrate with split grooves | |
| JPH0528725Y2 (en) | ||
| JPH0453926Y2 (en) | ||
| JP2004179554A (en) | Ceramic substrate for chip resistor and method of manufacturing chip resistor | |
| JPH11163478A (en) | Ceramic substrate with split grooves | |
| JP2005313479A (en) | Method for producing ceramic substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |