JPH083594B2 - Light switch - Google Patents
Light switchInfo
- Publication number
- JPH083594B2 JPH083594B2 JP9290586A JP9290586A JPH083594B2 JP H083594 B2 JPH083594 B2 JP H083594B2 JP 9290586 A JP9290586 A JP 9290586A JP 9290586 A JP9290586 A JP 9290586A JP H083594 B2 JPH083594 B2 JP H083594B2
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- JP
- Japan
- Prior art keywords
- waveguide
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Links
- 230000003287 optical effect Effects 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 17
- 238000005253 cladding Methods 0.000 claims description 11
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 8
- 239000013078 crystal Substances 0.000 claims description 8
- 239000010408 film Substances 0.000 claims description 7
- 238000002161 passivation Methods 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims 2
- 239000000835 fiber Substances 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000010365 information processing Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Landscapes
- Optical Integrated Circuits (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は光信号の伝送路を電気的に切り換える光スイ
ツチに関し、さらに詳しくはプラスチツクフアイバー伝
送及び光計測等に有用な可視光の切り換えが可能な光ス
イツチに関する。Description: TECHNICAL FIELD The present invention relates to an optical switch that electrically switches a transmission path of an optical signal, and more specifically, it can switch visible light useful for plastic fiber transmission and optical measurement. About the light switch.
半導体レーザの実用化と、石英系光フアイバーの低損
失化により光フアイバー通信の利用が、情報化社会の伝
送手段として大きく発展してきたが、長距離通信以外
に、オフイス内、自動車、機器間の信号伝送にもプラス
チツクフアイバーの高品質化により光伝送の利用がすす
められている。又光計測等に於ては人間の目視が可能な
可視域でのレーザ利用及びそれをサポートするための可
視域半導体レーザの開発がすすめられてきた。(例えば
Appl Phys.Lett.48(3),P207 1986記載) 従来、これら光信号を異なる伝送路に切り換えるため
のスイツチは、メカニカルなスイツチが代表的であっ
た。第四図はその原理を示す。入力フアイバ22からの光
はレンズ23により平行光に変換され、可動プリズム24に
より全反射されレンズ25を経て出力フアイバ1,26に導入
される。プリズムを下方に動かす事により光出力は、出
力フアイバ2.29へ切り変える事が可能である。Utilization of optical fiber communication has greatly developed as a transmission means of the information-oriented society due to the practical use of semiconductor lasers and the reduction of loss of silica optical fiber. For signal transmission, the use of optical transmission has been promoted by improving the quality of the plastic fiber. Further, in optical measurement and the like, the use of a laser in the visible range that can be visually recognized by humans and the development of a visible range semiconductor laser to support it have been promoted. (For example
Appl Phys. Lett. 48 (3), P207 1986) Conventionally, a mechanical switch has been typical as a switch for switching these optical signals to different transmission lines. Figure 4 shows the principle. The light from the input fiber 22 is converted into parallel light by the lens 23, totally reflected by the movable prism 24, and introduced into the output fibers 1 and 26 via the lens 25. The light output can be switched to the output fiber 2.29 by moving the prism downward.
一方可動部を無くした電気的切り換えをするための構
成としては、電子技術26巻2号P35記載の如き、サフア
イア基板上にPLZT強誘電体薄膜の電気光学効果を用いた
もの又は、オーム社刊光集積回路昭60年2月25日P309記
載の如き、Li単結晶の電気光学効果を用いたもの等が知
られていた。さらに日経マイクロデバイス1986年3月号
P58記載の如く、InGaAsP系化合物半導体を用いた導波路
にキヤリヤー注入により屈折率を変化させる光スイツチ
も提案されていた。On the other hand, as a configuration for electrically switching without moving parts, as described in Electronic Technology Vol. 26, No. 2, P35, one using the electro-optical effect of the PLZT ferroelectric thin film on the sapphire substrate or published by Ohmsha Optical integrated circuit As described in P309 on February 25, 1960, one using the electro-optical effect of Li single crystal has been known. Nikkei Microdevices March 1986 issue
As described in P58, an optical switch has been proposed in which the refractive index is changed by carrier injection into a waveguide using an InGaAsP-based compound semiconductor.
これら薄膜光スイツチの基本原理を第五図に示す。交
差型導波路の交差部28にストライプ状電極を設け(但し
誘電体の場合は平行対向電極で、電気光学効果により又
半導体の場合は上下電極によるキヤリヤー注入によ
る)、ストライプ状に屈折率を下げる事により、ミラー
29を形成し入力導波路1.30から伝播してきた光波31を全
反射させ出力導波路3.32から出力導波路4.37へ切り換え
るものであった。The basic principle of these thin film optical switches is shown in FIG. A stripe-shaped electrode is provided at the crossing portion 28 of the crossed waveguide (however, in the case of a dielectric, a parallel counter electrode is used, and due to the electro-optic effect, and in the case of a semiconductor, carrier injection is performed by the upper and lower electrodes) to lower the refractive index in a stripe shape By the mirror
The light wave 31 forming 29 and propagating from the input waveguide 1.30 is totally reflected to switch from the output waveguide 3.32 to the output waveguide 4.37.
しかし前述の従来技術では次の如き欠点があり改善が
望まれていた。However, the above-mentioned conventional techniques have the following drawbacks and have been desired to be improved.
1. 可動プリズム式スイツチは応答が遅く又、組み立て
精度のバラ付きが大きく、スイツチ全体も大きくなる。1. The movable prism type switch has a slow response and a large variation in the assembly accuracy, and the entire switch becomes large.
2. 単結晶基板を用いるものはサフアイア,LiNbO3inP共
に高価で品質のよいものが得にくい。2. It is difficult to obtain high quality sapphire and LiNbO 3 inP using a single crystal substrate.
3. GaInAsPはじめGaAs等のIII−V族化合物半導体を用
いるものは小型で発光、受光素子とのモノリシツク化も
可能な反面、基礎吸収端に相当する波長が長く、可視光
では吸収損失が大きすぎて導波路として不適である。3. GaInAsP and other materials using III-V group compound semiconductors such as GaAs are small in size and can be used as a monolith with a light receiving element, but the wavelength corresponding to the fundamental absorption edge is long and the absorption loss in visible light is too large. Is not suitable as a waveguide.
そこで本発明は、かかる問題点を除去するもので、そ
の目的は、電気的制御で可視光を高速に切り換えが可能
で、且つ安価で小型な光スイツチを提供する点にある。Therefore, the present invention eliminates such a problem, and an object thereof is to provide an inexpensive and compact optical switch capable of switching visible light at high speed by electrical control.
本発明の光スイツチは、Si単結晶基板上にn型ZnSよ
りなるクラツド層及びn型ZnSxSe1−x(但し0x<
1)よりなる交差型導波層、及び該導波層交叉部及び基
板側に電極を形成してなる事を特徴とした光スイツチ。The optical switch of the present invention comprises a cladding layer made of n-type ZnS and an n-type ZnSxSe 1 -x (where 0x <
An optical switch comprising a crossed waveguide layer formed of 1) and electrodes formed on the crossing portion of the waveguide layer and the substrate side.
本発明の上記構成によれば、シヨツトキー電極より導
波層に注入されたキヤリヤーにより、フエルミルベルが
上り、見かけ上バンドギヤツプが拡がる事により実効屈
折率が下がるためにそれまで透過していた光波が電極下
に於て全反射され、光の切り換えを可能とするものであ
る。According to the above configuration of the present invention, the carrier injected from the Schottky electrode into the waveguide layer raises the Fermi-Millbell and apparently spreads the bandgear to lower the effective refractive index, so that the light wave that has been transmitted up to that time is transmitted to the electrode. At this point, the light is totally reflected and the light can be switched.
以下実施例に基づき本発明を説明する。 The present invention will be described below based on examples.
〔実施例1〕 第1図は本発明に基づくリツジ型光スイツチの構成上
面図を、又第2図は、スイツチ部の構成断面図を示す。
P型Si単結晶基板1上にノンドープZnSエピタキシヤル
層からなるクラツド層2を1μ形成し、その中央にスト
ライプ状低抵抗n型層3を形成。さらに全面にキヤリヤ
濃度が1015〜1014/cm3のZnS0.5Se0.5混晶層4を3μエ
ピタキシヤル成長した後ドライエツチング等により、交
差型リツジ部5以外を1.7μエツチングにより除去して
導波路とする。[Embodiment 1] FIG. 1 is a structural top view of a ridge type optical switch according to the present invention, and FIG. 2 is a structural sectional view of a switch part.
A cladding layer 2 consisting of a non-doped ZnS epitaxial layer is formed on a P-type Si single crystal substrate 1 by 1 μ, and a stripe-shaped low resistance n-type layer 3 is formed in the center thereof. Further, a ZnS 0.5 Se 0.5 mixed crystal layer 4 having a carrier concentration of 10 15 to 10 14 / cm 3 was epitaxially grown for 3 μm, and then dry etching or the like was used to remove parts other than the cross-type ridge portion 5 by 1.7 μ etching. Use as a waveguide.
さらに交叉部上のリツジ部にストライプ状に低抵抗n
型層6を深さ1.7μ形成し該低抵抗ストライプ部を除い
てSiO2パツシベーシヨン膜7を0.5μさらにその上にキ
ヤリヤ注入用In電極8と、GaAs基板上にAuGe電極9を形
成してなる。In addition, a stripe-shaped low resistance n is provided on the ridge on the intersection.
The mold layer 6 is formed to a depth of 1.7 μ, and the SiO 2 passivation film 7 is formed to a thickness of 0.5 μ except for the low resistance stripe portion, and a carrier injecting electrode 8 is formed on the SiO 2 passivation film 7 and an AuGe electrode 9 is formed on the GaAs substrate. .
リツジ部の幅は導波路部分で10μ、交叉部分で15μ、
又電流閉じ込め用に設けた低抵抗部分の幅は1μ、長さ
200μで、導波路の交叉角10は5゜である。In電極8に
−、AuGe電極9に+のDC数Vを引加する事で光入力端1.
11に入れたHe−Heレーザー光(波長0.633μ)が全反射
を起こし、出力端3.12から4.13へ切り変えられた。消光
比は20dBであった。The width of the ridge is 10μ at the waveguide and 15μ at the crossing.
Also, the width of the low resistance part provided for current confinement is 1μ and the length
At 200μ, the waveguide crossing angle 10 is 5 °. By inputting a negative DC number V to the In electrode 8 and to the AuGe electrode 9, a light input terminal 1.
The He-He laser light (wavelength 0.633μ) put in 11 caused total internal reflection and was switched from the output end 3.12 to 4.13. The extinction ratio was 20 dB.
上記導波路の形状等に関するサイズは単に1例に過ぎ
ないが、クラツド層及び交差部に設けた低抵抗ストライ
ト部を形成しないと、キヤリヤーの拡がりのため、屈折
率変化の空間的急峻性が失われ、全反射の効率が悪く、
消光比が大きくとれなかった。Although the size related to the shape of the above-mentioned waveguide is merely one example, unless the cladding layer and the low resistance striation portion provided at the intersection are formed, the spatial steepness of the refractive index change due to the spread of the carrier. Lost, inefficient total reflection,
The extinction ratio was too high.
又、本素子の作製にあたっては、薄膜形成に於ては、
MBE法、MO−CVD法等低温プロセスが、不純物及び欠陥濃
度の低いものが得られている点で優れており、又、低抵
抗部分は、イオン打込みが好ましい。又導波路のリツジ
部形成に於ては、壁面の形状が散乱損失に大きく効くの
で、イオンビームエツチングが好ましいが、この限りで
はない。Moreover, in the fabrication of this element, in the thin film formation,
Low-temperature processes such as the MBE method and MO-CVD method are excellent in that low impurity and defect concentrations are obtained, and ion implantation is preferable for the low resistance portion. Further, in forming the ridge portion of the waveguide, the ion beam etching is preferable because the shape of the wall surface has a great effect on the scattering loss, but it is not limited to this.
〔実施例2〕 第3図は、導波層として誘電体装荷型を用いた光スイ
ツチの構成断面図を示す。[Embodiment 2] FIG. 3 is a sectional view showing the configuration of an optical switch using a dielectric loaded type as a waveguide layer.
実施例1と同様P型Si単結晶基板上に低抵抗n型ZnS
よりなるクラツド層14を1μ,キヤリヤ濃度1014cmのZn
S0.8Se0.2導波層15を1μ、さらにその上に交差型にn
型低抵抗ZnS層16を1.5μ形成し、さらに該交差部に幅1
μ,長さ300μの窓を残してSiO2パツシベーシヨン膜17
を0.5μ形成した後In電極18を形成してなる。一方、基
板側は、上記窓部に対向させて、基板をストライプ状19
にエツチングにより抜き、露出したクラツド層部を幅1
μ長さ300μ残してSiO2パツシベーシヨン膜20を形成し
た後、Au電極21を形成してなる、本素子では、導波路形
成の際のエツチングの終点をSeの検出により停止すれば
よく、又、低抵抗部をクラツド層、リツジ部に選択的に
つくらなくてもスイツチングが可能な点で製造的には優
れている。又利用する光の波長は赤外から、約0.5μま
で及ぶ。As in Example 1, low resistance n-type ZnS was formed on a P-type Si single crystal substrate.
With a cladding layer of 1μ and a carrier concentration of 10 14 cm Zn
S 0.8 Se 0.2 Waveguide layer 15 of 1μ, and n
-Type low resistance ZnS layer 16 is formed with a thickness of 1.5μ, and the width is 1 at the intersection.
SiO 2 passivation film 17 leaving a window of μ and length of 300μ
Is formed by 0.5 μ, and then the In electrode 18 is formed. On the other hand, on the substrate side, the substrate is arranged in a striped pattern 19 facing the window.
To the exposed cladding layer part with a width of 1
After forming the SiO 2 passivation film 20 leaving a μ length of 300μ, the Au electrode 21 is formed.In this element, the end point of etching at the time of forming a waveguide may be stopped by detecting Se. Manufacture is excellent in that switching can be performed without selectively forming the low resistance portion in the cladding layer and the recess portion. The wavelength of the light used extends from infrared to about 0.5μ.
又、本素子は、光スイツチ部は高々2mm角でよく、Si
基板を用いているので、MO−CVD法等により量産性のあ
る構造を有するものである。In this device, the optical switch part needs to be at most 2 mm square.
Since the substrate is used, it has a mass-producible structure by MO-CVD method or the like.
以上述べた如く、本発明によれば、Si単結晶基板上に
n型ZuSxSe1−x(但し0<x1)よりなるクラツド
層、及びn型ZnSySe(1−y)(但し0y<1且つy
<x)よりなる交差型導波層、及び該導波層交差部及び
基板側に電極を形成する事により、可視光の電気的、高
速切り換えが可能で、且つ安価で小型な光スイツチを提
供するという効果を有する。As described above, according to the present invention, a cladding layer made of n-type ZuSxSe 1 -x (where 0 <x1) and n-type ZnSySe (1-y) (where 0y <1 and y are provided on the Si single crystal substrate.
<X) A cross-type waveguide layer and an electrode formed on the cross-section of the waveguide layer and on the side of the substrate to provide an inexpensive and compact optical switch capable of electrically and rapidly switching visible light. Has the effect of
これにより、従来プラスチツクフアイバー等安価な、
光伝送媒体と価格的にマツチングしなかった光スイツチ
に代り、本発明に基づく光スイツチが普及する事によ
り、オフイス内情報処理、自動車航空機、又は機器間伝
送、その他、短距離での大量でノイズ等に対し安全な情
報処理網を構築する上で本発明の果す役割ははかりしれ
ないと確信する。This makes it cheaper than conventional plastic fiber,
The spread of the optical switch according to the present invention in place of the optical switch that has not been price-matched with the optical transmission medium, information processing in offices, automobile aircraft, or transmission between devices, and other noise in a large amount in a short distance. I am convinced that the role of the present invention in the construction of a safe information processing network for the above is immeasurable.
第1図は、本発明のリツジ型光スイツチの構成上面図。 第2図は、本発明のリツジ型光スイツチの構成断面図。 1:Si基板、2:クラツド層 3:低抵抗層、4:ZnS0.5Se0.5混晶層 5:リツジ部、6:低抵抗層 7:SiO2膜、8:In電極 9:AuGe電極、10:交叉角 11:入力端1、12,13:光出力端 第3図は本発明の積層型光スイツチの構成断面図。 14:クラツド層、15:導波層 16:低抵抗層、17:SiO2膜 18:In電極、19:基板窓部 20:SiO2、21:Au電極 第4図は、従来のメカニカルスイツチの構成図 22:入力フアイバ、23,25:集光レンズ 26,27:出力フアイバ 24:可動プリズム 第5図は、薄膜光スイツチの基本原理図 28:交差部、29:ミラー 30:入力導波路、31:光波 32,33:出力導波路FIG. 1 is a structural top view of a ridge type optical switch of the present invention. FIG. 2 is a sectional view showing the configuration of the ridge type optical switch of the present invention. 1: Si substrate, 2: Cladding layer 3: Low resistance layer, 4: ZnS 0.5 Se 0.5 mixed crystal layer 5: Ridge part, 6: Low resistance layer 7: SiO 2 film, 8: In electrode 9: AuGe electrode, 10 : Crossing angle 11: Input ends 1, 12, 13: Optical output end FIG. 3 is a sectional view showing the structure of the laminated optical switch of the present invention. 14: Cladding layer, 15: Waveguide layer 16: Low resistance layer, 17: SiO 2 film 18: In electrode, 19: Substrate window 20: SiO 2 , 21: Au electrode Fig. 4 shows a conventional mechanical switch. Configuration 22: Input fiber, 23,25: Condenser lens 26,27: Output fiber 24: Movable prism Fig. 5 shows basic principle of thin film optical switch Fig. 28: Intersection, 29: Mirror 30: Input waveguide, 31: Lightwave 32, 33: Output waveguide
Claims (3)
0<x1)よりなるクラツド層、及びn型ZnSySe(1
−y)(但し0y<1且つy<x)よりなる交差型導
波層、及び該導波層交差部及び基板側に電極を形成して
なる事を特徴とした光スイツチ。1. A cladding layer made of n-type ZnSxSe 1 -x (where 0 <x1) and an n-type ZnSySe (1) on a Si single crystal substrate.
-Y) (where 0y <1 and y <x), and an optical switch comprising an intersecting waveguide layer and electrodes formed on the waveguide layer intersection and the substrate side.
のリツジ層の一部及びクラツド層にストライブ状の低抵
抗域を設置した事を特徴とした特許請求の範囲第1項記
載の光スイツチ。2. A stripe type low resistance region is provided in a part of the ridge layer at the intersection and the cladding layer, and the waveguide layer is a ridge type waveguide. Light switch described.
y<1)薄膜上にn型ZnSzSe1−z(但し0<Z1且
つZ<x)ストライプを設けた積層型導波路よりなり、
交叉部の積層部分上にストライプ状金属電極を、又基板
側は該ストライプ状電極に対応して基板をエツチング
し、バツフアー層の露出部を除いてSiO2パツシベーシヨ
ン膜を形成し、該露出部にストライプ状金属電極を設け
た事を特徴とする特許請求の範囲第1項記載の光スイツ
チ。3. The waveguide layer is an n-type ZnSySe (1-y) (provided that 0
y <1) consisting of a laminated waveguide in which n-type ZnSzSe1-z (where 0 <Z1 and Z <x) stripes are provided on a thin film,
A striped metal electrode is formed on the laminated portion of the intersecting portion, and the substrate is etched corresponding to the striped electrode on the substrate side to form a SiO 2 passivation film except the exposed portion of the buffer layer. The optical switch according to claim 1, wherein a striped metal electrode is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9290586A JPH083594B2 (en) | 1986-04-22 | 1986-04-22 | Light switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9290586A JPH083594B2 (en) | 1986-04-22 | 1986-04-22 | Light switch |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62249128A JPS62249128A (en) | 1987-10-30 |
| JPH083594B2 true JPH083594B2 (en) | 1996-01-17 |
Family
ID=14067496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9290586A Expired - Lifetime JPH083594B2 (en) | 1986-04-22 | 1986-04-22 | Light switch |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH083594B2 (en) |
-
1986
- 1986-04-22 JP JP9290586A patent/JPH083594B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62249128A (en) | 1987-10-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |