JPH08501500A - セラミック−金属複合材の製造方法 - Google Patents

セラミック−金属複合材の製造方法

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Publication number
JPH08501500A
JPH08501500A JP6508357A JP50835793A JPH08501500A JP H08501500 A JPH08501500 A JP H08501500A JP 6508357 A JP6508357 A JP 6508357A JP 50835793 A JP50835793 A JP 50835793A JP H08501500 A JPH08501500 A JP H08501500A
Authority
JP
Japan
Prior art keywords
ceramic
metal
molten metal
alumina
percent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6508357A
Other languages
English (en)
Japanese (ja)
Inventor
エー． リットランド，マーカス
ダブリュ． レディ，デニス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPH08501500A publication Critical patent/JPH08501500A/ja
Pending legal-status Critical Current

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    • C22C1/10—Alloys containing non-metals
    • C22C1/1036—Alloys containing non-metals starting from a melt
    • C22C1/1057—Reactive infiltration
    • C22C1/1063—Gas reaction, e.g. lanxide
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
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    • B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
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    • B01D29/111—Making filtering elements
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    • F02F—CYLINDERS, PISTONS OR CASINGS, FOR COMBUSTION ENGINES; ARRANGEMENTS OF SEALINGS IN COMBUSTION ENGINES
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
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    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
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    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
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    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
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    • F05C2203/00—Non-metallic inorganic materials
    • F05C2203/08—Ceramics; Oxides
    • F05C2203/0865—Oxide ceramics
    • F05C2203/0895—Zirconium oxide
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
    • F05C—INDEXING SCHEME RELATING TO MATERIALS, MATERIAL PROPERTIES OR MATERIAL CHARACTERISTICS FOR MACHINES, ENGINES OR PUMPS OTHER THAN NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES
    • F05C2253/00—Other material characteristics; Treatment of material
    • F05C2253/16—Fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Structural Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combustion & Propulsion (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
JP6508357A 1992-09-17 1993-09-17 セラミック−金属複合材の製造方法 Pending JPH08501500A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US94697292A 1992-09-17 1992-09-17
US94742792A 1992-09-18 1992-09-18
US946,972 1992-09-18
US947,427 1992-09-18
PCT/US1993/008835 WO1994006585A1 (en) 1992-09-17 1993-09-17 Method for making a ceramic metal composite

Publications (1)

Publication Number Publication Date
JPH08501500A true JPH08501500A (ja) 1996-02-20

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Country Status (6)

Country Link
EP (1) EP0662019A4 (de)
JP (1) JPH08501500A (de)
AU (1) AU5131293A (de)
BR (1) BR9307067A (de)
CA (1) CA2145161A1 (de)
WO (1) WO1994006585A1 (de)

Cited By (6)

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JP2003048049A (ja) * 2001-05-11 2003-02-18 Schwaebische Huettenwerke Gmbh キャストイン硬質材料体を含む金属鋳造鋳型体
JP2011510502A (ja) * 2008-01-22 2011-03-31 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング ヒートシンク並びにヒートシンクを製造するための方法
CN102962434A (zh) * 2012-10-31 2013-03-13 西安交通大学 一种碳化硅/铜硅合金双连续相复合材料及其制备方法
JP2020516576A (ja) * 2017-04-17 2020-06-11 ベスビウス ユーエスエー コーポレイション 多孔質耐火材、その使用及び製造
JPWO2021112029A1 (de) * 2019-12-03 2021-06-10
WO2023136101A1 (ja) * 2022-01-14 2023-07-20 アドバンスコンポジット株式会社 金属基複合材料の製造方法

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US6247519B1 (en) 1999-07-19 2001-06-19 Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of Natural Resources Preform for magnesium metal matrix composites
US6193915B1 (en) 1999-09-03 2001-02-27 Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of Natural Resources Process for fabricating low volume fraction metal matrix preforms
ES2178912B2 (es) * 2000-02-01 2004-06-16 Faiveley Española, S.A. Procedimiento de obtencion de una superficie antideslizante.
DE10013378A1 (de) * 2000-03-17 2001-10-04 Dornier Gmbh Poröse Keramik
CN100574953C (zh) * 2004-11-30 2009-12-30 加州大学评议会 热膨胀系数相匹配的钎焊体系
DE102006051200A1 (de) 2006-10-30 2008-05-08 Robert Bosch Gmbh Verfahren zur Herstellung eines Körpers aus Metall-Keramik-Verbundwerkstoffen
US8147980B2 (en) 2006-11-01 2012-04-03 Aia Engineering, Ltd. Wear-resistant metal matrix ceramic composite parts and methods of manufacturing thereof
DE102008014355A1 (de) 2008-03-14 2009-09-17 Esk Ceramics Gmbh & Co. Kg Verbundwerkstoff auf Basis von Übergangsmetalldiboriden, Verfahren zu dessen Herstellung und dessen Verwendung
CN112338169A (zh) * 2019-08-09 2021-02-09 Oppo广东移动通信有限公司 结构件、结构件的制造方法和电子设备
CN113058343B (zh) * 2021-04-19 2022-03-29 深圳市华净科技有限公司 一种去除气态污染物用的过滤器
CN115533080B (zh) * 2022-09-26 2025-03-28 华中科技大学 具备梯度孔隙率的多孔陶瓷增强金属复合装甲的制备方法
CN115978336B (zh) * 2022-12-29 2025-06-20 重庆两航金属材料有限公司 一种含中空管道的铸件及其制备方法
CN118530027A (zh) * 2024-05-07 2024-08-23 郑州大学 一种氧化锌铝掺杂碳化硅导电复合材料及其制备方法
CN119287195B (zh) * 2024-10-10 2025-09-09 天津大学 一种多组元协同强化的铝基复合材料及其制备方法

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US3868267A (en) * 1972-11-09 1975-02-25 Us Army Method of making gradient ceramic-metal material
JPS5235043B2 (de) * 1973-01-24 1977-09-07
JPS539254B2 (de) * 1973-03-26 1978-04-04
US4164424A (en) * 1977-10-06 1979-08-14 General Electric Company Alumina core having a high degree of porosity and crushability characteristics
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US5163498A (en) * 1989-11-07 1992-11-17 Lanxide Technology Company, Lp Method of forming metal matrix composite bodies having complex shapes by a self-generated vacuum process, and products produced therefrom

Cited By (12)

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JP2003048049A (ja) * 2001-05-11 2003-02-18 Schwaebische Huettenwerke Gmbh キャストイン硬質材料体を含む金属鋳造鋳型体
JP2011510502A (ja) * 2008-01-22 2011-03-31 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング ヒートシンク並びにヒートシンクを製造するための方法
CN102962434A (zh) * 2012-10-31 2013-03-13 西安交通大学 一种碳化硅/铜硅合金双连续相复合材料及其制备方法
CN102962434B (zh) * 2012-10-31 2014-09-03 西安交通大学 一种碳化硅/铜硅合金双连续相复合材料及其制备方法
JP2020516576A (ja) * 2017-04-17 2020-06-11 ベスビウス ユーエスエー コーポレイション 多孔質耐火材、その使用及び製造
JPWO2021112029A1 (de) * 2019-12-03 2021-06-10
WO2021112029A1 (ja) * 2019-12-03 2021-06-10 日本碍子株式会社 接合基板及び接合基板の製造方法
WO2021111513A1 (ja) * 2019-12-03 2021-06-10 日本碍子株式会社 接合基板及び接合基板の製造方法
CN114599625A (zh) * 2019-12-03 2022-06-07 日本碍子株式会社 接合基板以及接合基板的制造方法
US12412793B2 (en) 2019-12-03 2025-09-09 Ngk Insulators, Ltd. Bonded substrate, and bonded substrate manufacturing method
WO2023136101A1 (ja) * 2022-01-14 2023-07-20 アドバンスコンポジット株式会社 金属基複合材料の製造方法
US12325065B2 (en) 2022-01-14 2025-06-10 Advanced Composite Corporation Method for manufacturing metal matrix composite material

Also Published As

Publication number Publication date
AU5131293A (en) 1994-04-12
WO1994006585A1 (en) 1994-03-31
EP0662019A1 (de) 1995-07-12
EP0662019A4 (de) 1998-07-15
BR9307067A (pt) 1999-06-29
CA2145161A1 (en) 1994-03-31

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