JPH08502829A - 干渉図の空間周波数分析によって表面の形状を測定する方法および装置 - Google Patents
干渉図の空間周波数分析によって表面の形状を測定する方法および装置Info
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Classifications
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- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02083—Interferometers characterised by particular signal processing and presentation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
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- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/0209—Low-coherence interferometers
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- Signal Processing (AREA)
- Mathematical Physics (AREA)
- Instruments For Measurement Of Length By Optical Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.(a)対象物体の表面および参照表面を、照射光源を備えた干渉計で照射し 、対象物体の表面と光学的に一直線上に配置されかつ対象物体表面のそれぞれの 位置に対応する複数の各画素を備えた二次元の検出器上に干渉パターンを生成さ せ; (b)参照表面と対象物体の表面との光路差を変化させて、対象物表面のそれ ぞれの位置に対する干渉図を、検出器の各画素に生成させ、そして前記の各干渉 図は、光路差を変化させたとき、それぞれの対象物体の表面位置について、画素 が受けた、干渉照明強度の変化で形成され; (c)前記の各干渉図を空間周波数ドメインに変換して、前記の各画素につい て、変換された干渉図のデータを形成させ; (d)前記の変換された干渉図のデータを用いて、対象物体表面のそれぞれの 位置の高さを、前記の各画素について計算し; 次いで (e)前記ステップ(d)で計算された高さを用いて、対象物体表面の断面図 を作成する; ステップを含んでなる、対象物体表面の輪郭図を作成する方法。 2.前記の各画素についての、前記変換干渉図のデータが、空間周波数の関数と して前記の各画素において受けた、干渉図の相対的強度と干渉分光位相を示し、 そして前記ステップ(d)が、前記の各画素について、 (i)前記の変換された干渉図のデータに最小二乗多項式当てはめを行うこと によって、角波数の関数としての前記干渉分光位相を概算し;次いで (ii)上記多項式の係数から、対象物体表面のそれぞれの位置の高さを計算す る; ステップを含んでなる請求の範囲1記載の方法。 3.前記ステップ(i)がさらに、 (1)相対強度が高い領域と、角波数の関数として、前記の変換された干渉図 のデータ中に探索し; (2)角波数の関数として干渉分光位相を含有する複数の各データ対を、前記 領域から収集し;次いで (3)前記の集められたデータ対を利用して、前記の最小二乗多項式の係数を 求める; ステップを含んでなる請求の範囲2記載の方法。 4.前記の変換された干渉図のデータを用いて、干渉計の照射光源の平均波長と スペクトル分布を求めるステップを有する請求の範囲3記載の方法。 5.前記ステップ(e)が、 (A)前記ステップ(d)で計算した高さを用いて、対象物体の表面上の位置 の対について、前記の各対の位置の間の相対的高さの差Δhを求め;次いで (B)下記式: (式中、nは屈折率であり、αは一定の位相オフセットであ り、およびφ0とk0はそれぞれ、干渉計の照射光源の平均発光波長のスペクトル ピークの干渉分光の位相と波長である)に、前記の各Δh値を適用することによ って、前記の各対について前記の高さの相対的差の測定値Δhの解像度が改善さ れた値Δh’を得る; ステップを含んでなる請求の範囲3記載の方法。 6.前記の各画素に対する前記の変換された干渉図のデータが、空間周波数の関 数として、前記各画素で受けた、干渉図の相対強度と干渉分光位相を表し、そし て前記ステップ(d)が、前記の各画素について、 (i)前記の変換された干渉図のデータに二次多項式の当てはめを行うことに よって、角波数の関数としての干渉分光位相を概算し;次いで (ii)それぞれの対象物体表面の位置の高さを上記多項式の係数から計算する ; ステップを含んでなる請求の範囲1記載の方法。 7.前記ステップ(i)がさらに、 (1)相対的強度が高い領域を角波数の関数として前記の変換された干渉図デ ータ中に探索し; (2)角波数の関数として干渉分光位相を含有する複数の各データ対を、前記 領域から収集し;次いで (3)前記の収集されたデータ対を利用して、前記多項式の係数を求める; ステップを含んでなる請求の範囲6記載の方法。 8.干渉計の照射光源の平均波長とスペクトル分布を、前記の変換された干渉図 のデータを用いて求めるステップをさらに含む請求の範囲7記載の方法。 9.前記ステップ(e)が、 (A)対象物体の表面上の位置の対に対して、前記ステップ(d)で計算した 高さを用いて、前記各対の位置の間の高さの相対的な高さの差Δhを求め;次い で (B)下記式: (式中、nは屈折率であり、αは一定の移相オフセットであり、およびφ0とk0 はそれぞれ、干渉計の照射光源の平均発光波長スペクトルピークの干渉分光の位 相と波数である)に、前記の各Δh値を適用することによって、前記の各対につ いて前記の高さの相対的差の測定値Δhの解像度が改善された値Δh’を得る; ステップを含んでなる請求の範囲7記載の方法。 10.前記の各画素に対する前記の変換された干渉図のデータが、空間周波数 の関数として、前記各画素で受けた、干渉図の相対強度と干渉分光位相を表し、 そして前記ステップ(d)が、 (i)前記の変換された干渉図のデータを用いて、干渉計の照射光源の平均波 長とスペクトル分布を求め; (ii)前記の各画素についての前記の変換された干渉図のデータに多項式の当 てはめを行うことによって、角波数の関数とし て干渉分光位相を近似し;次いで (iii)前記の各画素についてのそれぞれの対象物体表面の位置の高さを、上 記多項式の係数から計算する; ステップを含んでなる請求の範囲1記載の方法。 11.前記ステップ(e)が、 (A)前記ステップ(d)で計算した高さを用いて、対象物体の表面上の対に ついて、前記の各対の位置の間の相対的高さの差Δhを求め;次いで (B)下記式; (式中、nは屈折率であり、αは一定の位相オフセットであり、およびφ0とk0 はそれぞれ、干渉計の照射光源の平均発光波長のスペクトルピークの干渉分光の 位相と波数である)に、前記の各Δh値を適用することによって、前記の各対に ついて前記の高さの相対的差の測定値Δhの解像度が改善された値Δh’を得る ; ステップを含んでなる請求の範囲10記載の方法。 12.前記多項式の当てはめが、線形の最小二乗多項式当てはめを含んでなる請 求の範囲11記載の方法。 13.前記ステップ(b)がさらに、干渉図の1干渉縞当り二つ未満の強度デー タの試料を提供する比率で、前記の各画素で受けた、前記の変化する干渉照射強 度をサンプリングすることを含んでなる請求の範囲1記載の方法。 14.前記照射光源が広帯域のスペクトルを有する光源で構成されている請求の 範囲1記載の方法。 15.前記照射光源が狭帯域光源で構成されている請求の範囲1記載の方法。 16.(a)干渉計で参照表面と対象物体の表面の間の光路差を変えて、対象物 体表面の位置と光学的に一直線上に配置した検出器上に干渉図を生成させ; (b)検出器で受けた干渉図を、空間周波数ドメインに変換して、変換した干 渉図のデータを形成させ; (c)前記の変換された干渉図データを用いて、対象物体表面の位置の高さを 算出する; ステップを含んでなる、三次元の対象物体表面上の位置の高さを測定する方法 。 17.光路差を変えたときに変化して、検出器が受ける干渉照射強度によって、 前記干渉図が形成され、そして前記ステップ(a)がさらに、干渉図の一つの干 渉縞当り二つ未満の強度データの試料を得る比率で、前記の変化して検出器が受 ける干渉照明強度のサンプリングを行うことを含んでなる; 請求の範囲16記載の方法。 18.前記の変換された干渉図のデータが、空間周波数の関数として干渉図の相 対強度と干渉分光位相を示し、そして、前記ステップ(c)が、下記ステップ: すなわち (i)前記の変換された干渉図のデータに多項式当てはめを行うことによって 、角波数の関数として干渉分光位相を近似し; 次いで (ii)上記多項式の係数から、対象物体表面の位置の高さを算出する; ステップを含んでなる請求の範囲16記載の方法。 19.前記ステップ(i)がさらに、 (1)相対強度が高い領域を角波数の関数として前記の変換された干渉図のデ ータ中に探索し; (2)角波数の関数として干渉分光位相を含有する複数の各データ対を前記領 域から収集し;次いで (3)前記の収集データ対を利用して前記多項式の係数を求める; ステップを含んでなる請求の範囲18記載の方法。 20.前記ステップ(i)が、前記の変換された干渉図のデータに、線形最小二 乗多項式当てはめを行うことによって、角波数の関数として干渉分光位相を近似 することを含んでいる請求の範囲18記載の方法。 21.前記の変換された干渉図のデータが、空間周波数の関数としての干渉図の 相対強度と干渉分光位相を示し;そして前記ステップ(c)が、下記ステップ: すなわち (i)前記の変換された干渉図のデータを使用して、干渉計の照射光源の平均 波長とスペクトル分布を求め; (ii)前記の変換された干渉図のデータに多項式当てはめを行うことによって 、角波数の関数として干渉分光位相を近似し; 次いで (iii)上記多項式の係数から、対象物体表面の位置の高さを計算する; ステップを含んでなる請求の範囲16記載の方法。 22.(a)干渉計で参照表面と対象物体表面の光路差を変化させて、対象物体 表面の位置と光学的に一直線上に配置した検出器上に、光路差を変化させたとき 連続的に等間隔をおいて生成する複数の強度値を有する干渉図を生成させ; (b)検出器が受けた干渉図を空間周波数のドメインに変換して、複数の各角 波数について相対強度と干渉分光位相のデータを有する変換干渉図データを形成 させ; (c)波数の関数として相対強度の高い領域を前記の変換干渉図データ内に探 索し; (d)角波数の関数として干渉分光位相を有する複数の各データ対を、前記の 探索された領域から収集し; (e)前記データ対に多項式を当てはめ; (f)上記多項式の係数を求め;次いで (g)前記係数を用いて、対象物体表面の位置の高さを計算する; ステップを含んでなる、三次元の対象物体表面上の位置の高さを測定する方法 。 23.前記多項式が線形最小二乗多項式である請求の範囲22記載の方法。 24.前記多項式が二次多項式である請求の範囲22記載の方法。 25.前記の等間隔が、干渉図の一つの干渉縞当り2未満の強度値の試料を提供 するよう選択される請求の範囲22記載の方法。
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/014,707 | 1993-02-08 | ||
| US14,707 | 1993-02-08 | ||
| US08/014,707 US5398113A (en) | 1993-02-08 | 1993-02-08 | Method and apparatus for surface topography measurement by spatial-frequency analysis of interferograms |
| PCT/US1994/000660 WO1994018521A1 (en) | 1993-02-08 | 1994-01-13 | Method and apparatus for surface topography measurement by spatial-frequency analysis of interferograms |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08502829A true JPH08502829A (ja) | 1996-03-26 |
| JP2679876B2 JP2679876B2 (ja) | 1997-11-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6518062A Expired - Lifetime JP2679876B2 (ja) | 1993-02-08 | 1994-01-13 | 干渉図の空間周波数分析によって表面の形状を測定する方法および装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5398113A (ja) |
| EP (1) | EP0682771B1 (ja) |
| JP (1) | JP2679876B2 (ja) |
| DE (1) | DE69426070T2 (ja) |
| WO (1) | WO1994018521A1 (ja) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006519992A (ja) * | 2003-03-06 | 2006-08-31 | ザイゴ コーポレーション | 走査干渉分光を用いた複雑な表面構造のプロファイリング |
| JP2007506071A (ja) * | 2003-09-15 | 2007-03-15 | ザイゴ コーポレーション | 表面の干渉分析のための方法およびシステムならびに関連する応用例 |
| JP2011089988A (ja) * | 2009-10-20 | 2011-05-06 | Mitsutoyo Corp | 物体表面の高さマップを求める方法及びその装置 |
| WO2011083544A1 (ja) * | 2010-01-06 | 2011-07-14 | パナソニック株式会社 | 干渉を用いた膜厚計測装置及び干渉を用いた膜厚計測方法 |
| TWI646303B (zh) * | 2015-12-31 | 2019-01-01 | 美商賽格股份有限公司 | 決定裝置之儀器轉移函數之方法以及系統 |
| JP2021084200A (ja) * | 2019-11-29 | 2021-06-03 | 株式会社東京精密 | ワーク加工装置及びワーク加工装置の制御方法 |
Families Citing this family (145)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2011089988A (ja) * | 2009-10-20 | 2011-05-06 | Mitsutoyo Corp | 物体表面の高さマップを求める方法及びその装置 |
| WO2011083544A1 (ja) * | 2010-01-06 | 2011-07-14 | パナソニック株式会社 | 干渉を用いた膜厚計測装置及び干渉を用いた膜厚計測方法 |
| US8619263B2 (en) | 2010-01-06 | 2013-12-31 | Panasonic Corporation | Film thickness measuring apparatus using interference and film thickness measuring method using interference |
| JP5427896B2 (ja) * | 2010-01-06 | 2014-02-26 | パナソニック株式会社 | 干渉を用いた膜厚計測装置及び干渉を用いた膜厚計測方法 |
| TWI646303B (zh) * | 2015-12-31 | 2019-01-01 | 美商賽格股份有限公司 | 決定裝置之儀器轉移函數之方法以及系統 |
| JP2021084200A (ja) * | 2019-11-29 | 2021-06-03 | 株式会社東京精密 | ワーク加工装置及びワーク加工装置の制御方法 |
| JP2024117793A (ja) * | 2019-11-29 | 2024-08-29 | 株式会社東京精密 | ワーク加工装置及びワーク加工装置の制御方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69426070T2 (de) | 2001-06-13 |
| WO1994018521A1 (en) | 1994-08-18 |
| EP0682771A1 (en) | 1995-11-22 |
| JP2679876B2 (ja) | 1997-11-19 |
| EP0682771A4 (en) | 1997-12-10 |
| EP0682771B1 (en) | 2000-10-04 |
| US5398113A (en) | 1995-03-14 |
| DE69426070D1 (de) | 2000-11-09 |
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