JPH085052B2 - Method for manufacturing ceramic laminate - Google Patents

Method for manufacturing ceramic laminate

Info

Publication number
JPH085052B2
JPH085052B2 JP4236481A JP23648192A JPH085052B2 JP H085052 B2 JPH085052 B2 JP H085052B2 JP 4236481 A JP4236481 A JP 4236481A JP 23648192 A JP23648192 A JP 23648192A JP H085052 B2 JPH085052 B2 JP H085052B2
Authority
JP
Japan
Prior art keywords
pressure
laminated
bonding
green
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP4236481A
Other languages
Japanese (ja)
Other versions
JPH05293810A (en
Inventor
直幹 加藤
省吾 武藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP4236481A priority Critical patent/JPH085052B2/en
Publication of JPH05293810A publication Critical patent/JPH05293810A/en
Publication of JPH085052B2 publication Critical patent/JPH085052B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Laminated Bodies (AREA)
  • Press-Shaping Or Shaping Using Conveyers (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、例えばICのラミネ−
トパッケ−ジ等、複数のグリ−ンテ−プを積層圧着して
形成されるセラミックス積層体の積層方法に関するもの
である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is, for example, an IC laminator.
The present invention relates to a method for laminating a ceramics laminated body formed by laminating and pressing a plurality of green tapes such as a top package.

【0002】[0002]

【従来の技術】従来、ICのラミネ−トパッケ−ジは、
ドクタ−ブレ−ド法等によって作成された複数のグリ−
ンテ−プを各々所定形状に形成すると共に必要に応じて
その表面にメタライズ配線を施こし、各グリ−ンテ−プ
を積層して熱間で圧着した後、加湿水素ガス中で焼成す
る、といった手順で以って作成される。
2. Description of the Related Art Conventionally, IC laminate packages are
Multiple grees created by doctor blade method, etc.
Each of the tapes is formed into a predetermined shape, metallized wiring is provided on the surface of the tapes if necessary, and the green tapes are laminated and hot pressed, and then baked in a humidified hydrogen gas. It is created by the procedure.

【0003】ところで、この種のセラミックス積層体を
作成する時、グリ−ンシ−トを積層して圧着する際に
は、従来ではエア−もしくはオイルプレスによって、積
層された複数枚のグリ−ンシ−トを加圧し、その接合部
を接着することが行なわれている。
By the way, when a green sheet is laminated and pressure-bonded when a ceramic laminate of this type is formed, conventionally, a plurality of green sheets are laminated by air or an oil press. The pressure is applied to the joint to bond the joint.

【0004】[0004]

【発明が解決しょうとする課題】ところが上記のように
プレスによってグリ−ンシ−トを積層圧着する場合、積
層体の形状が複雑になると、その形状に対応した治具を
用いて加圧しなければ加圧時に積層体が変型してしまう
といった問題があり、作業性が悪かった。また形状の複
雑な積層体を圧着する際には、寸法精度の高い治具を作
成し、使用する必要があり、個々の形状に対応した多く
の治具が必要となる。更にプレスは平面の為、一度に僅
かな量しか接合することができず、量産には適していな
かった。
However, when the green sheets are laminated and pressure-bonded by pressing as described above, if the shape of the laminated body becomes complicated, pressure must be applied using a jig corresponding to the shape. There was a problem that the laminated body was deformed when pressure was applied, and the workability was poor. Further, when crimping a laminated body having a complicated shape, it is necessary to create and use a jig having high dimensional accuracy, and many jigs corresponding to individual shapes are required. Further, since the press is flat, only a small amount can be joined at one time, which is not suitable for mass production.

【0005】本発明は、上記積層体を加圧して接合する
際、治具を用いることなく簡単な作業で接合することが
でき、しかも、異なる形状のものでも同時に大量に接合
することのできるセラミックス積層体の積層方法を提供
することを目的としてなされたものであって、以下の如
き方法によりその目的を達成した。
According to the present invention, when the above-mentioned laminated body is pressed and joined, it can be joined by a simple operation without using a jig, and a large amount of different shapes can be joined at the same time. The present invention was made for the purpose of providing a method for laminating a laminate, and the object was achieved by the following method.

【0006】[0006]

【課題を解決するための手段】即ち上記問題点を解決す
るための本発明方法は、セラミックスを主成分として所
定形状に形成されたグリーンテープを複数枚積層し、加
圧して接合する際、上記複数のグリーンテープを積層
し、溶剤を用いて仮接着した後、周囲を気密状に保護
し、接合部を40℃〜80℃の温度範囲にある所定圧の
液中で加圧接着することを特徴とするセラミックス積層
体の製造方法を要旨としている。
[Means for Solving the Problems] That is, the method of the present invention for solving the above-mentioned problems is such that, when a plurality of green tapes containing ceramics as a main component and formed in a predetermined shape are laminated and joined by pressing, After stacking a plurality of green tapes and temporarily adhering them with a solvent, protect the surroundings in an airtight manner and press-bond the joints in a liquid of a predetermined pressure in the temperature range of 40 ° C to 80 ° C. The gist is a method of manufacturing a characteristic ceramics laminate.

【0007】ここで、グリ−ンテ−プは、従来より公知
のとおり、有機溶媒に熱可塑性樹脂、可塑剤等を溶解さ
せた中に、アルミナ、フォルステライト、コ−ディエラ
イト等のセラミックス原料粉末を分散させ、平板上に均
一な厚みに流して溶媒を蒸発させる方法、例えば、ドク
タ−ブレ−ド法等によって得られるものである。またこ
の作成されたグリ−ンテ−プは所定形状に形成され、必
要に応じてタングステン、モリブデン等の粉末を主成分
とする金属ペ−ストをスクリ−ン印刷によってメタライ
ズ配線される。
Here, as is known in the art, the green tape is a ceramic raw material powder such as alumina, forsterite, cordierite, etc. in which a thermoplastic resin, a plasticizer and the like are dissolved in an organic solvent. Is dispersed and the solution is made to flow on a flat plate to a uniform thickness to evaporate the solvent, for example, a doctor blade method or the like. The green tape thus formed is formed into a predetermined shape, and if necessary, a metal paste containing powder of tungsten, molybdenum or the like as a main component is metallized by screen printing.

【0008】次に本発明では上記のように形成された複
数のグリ−ンテ−プを積層した後、所定圧の水や油の液
中で加圧接着するのであるが、積層する際には位置ずれ
等を生じないよう接合部を溶剤で仮接着しておく。また
液中に投入する際、その積層体を保護する必要がある
が、これにはポリエチレン等の薄いフイルム製の袋の中
に積層体を入れ真空にしてシ−ルするとか、樹脂膜等で
覆うといったことが考えられる。尚この保護膜に樹脂膜
を用いる場合、積層体の圧着後、その保護膜を剥離する
必要があるので、剥がし易いものを用いることが望まれ
る。
Next, in the present invention, a plurality of green tapes formed as described above are laminated and then pressure-bonded in a liquid of water or oil of a predetermined pressure. Temporarily bond the joints with a solvent to prevent misalignment. In addition, it is necessary to protect the laminated body when it is put into the liquid. For this purpose, the laminated body is put in a bag made of a thin film such as polyethylene and vacuumed or sealed by a resin film or the like. It is possible to cover it. When a resin film is used for this protective film, it is necessary to peel off the protective film after pressure-bonding the laminated body, so it is desirable to use a resin film that can be easily peeled off.

【0009】更に上記のようなグリーンテープの積層で
は、40℃〜80℃の熱間で圧着するとグリーンテープ
中の熱可塑性樹脂が軟化流動し、各層が一体化し易くな
るといったことがある。そこで、加圧用の液体を上記温
度範囲に加熱しておくのである。
[0009] In yet a laminated green tape as described above, the thermoplastic resin to the in the green tape bonding between 40 ° C. to 80 ° C. the heat softened flow, Ru Kotogaa such layers are easily integrated. Therefore, pressurizing liquid above the temperature
It is heated to a range of degrees.

【0010】[0010]

【作用】このように本発明では積層されたグリ−ンテ−
プを加圧接合する際、所定圧の液中で行なうこととな
る。従って従来のようなブレス用の治具をその形状に合
わせて個々に準備しておく必要はなく、単にポリエチレ
ン等の袋によって気密状に保護するだけでよい。
As described above, in the present invention, the laminated green
When the press-bonding is carried out, it is carried out in a liquid having a predetermined pressure. Therefore, it is not necessary to individually prepare a jig for breathing as in the conventional case, and simply protect it in a hermetically sealed manner with a bag made of polyethylene or the like.

【0011】[0011]

【実施例】以下、本発明方法をICのラミネ−トパッケ
−ジの製造に適用した実施例について図面と共に説明す
る。図1は本実施例のラミネ−トパッケ−ジの製造工程
を示すフロ−チャ−トである。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the method of the present invention is applied to the production of a laminated package for an IC will be described with reference to the drawings. FIG. 1 is a flow chart showing the manufacturing process of the laminate package of this embodiment.

【0012】図に示す如く、まず工程P1では原料の調
合が行なわれる。これには例えば添加剤としてSi
2、MgO、CaO等が添加されたアルミナ90%以
上のセラミックス粉末に、ポリビニルブチラ−ル等のバ
インダ−を加え、ボ−ルミル等を用いてトルエン、メタ
ノ−ル等の有機溶剤中で混合してスラリ−とすることが
行なわれる。
As shown in the figure, first, in step P1, raw materials are mixed. For this, for example, Si as an additive
A binder such as polyvinyl butyral is added to 90% or more alumina ceramic powder to which O 2 , MgO, CaO or the like is added, and the mixture is added to an organic solvent such as toluene or methanol by using a ball mill or the like. Mixing to form a slurry is performed.

【0013】原料の調合が行なわれると、次の工程P2
で、その調合された原料をドクタ−ブレ−ド法等により
厚さ例えば600μのグリ−ンテ−プを作成し、次工程
P3で以ってそのグリ−ンテ−プを所定の形状に打抜
く。
When the raw materials are prepared, the next step P2
Then, a green tape having a thickness of, for example, 600 .mu. Is prepared from the blended raw materials by a doctor blade method or the like, and the green tape is punched into a predetermined shape in the next step P3. .

【0014】工程P3で所定の形状に形成されたグリ−
ンテ−プには、工程P4において、所定のマスクを用い
たスクリ−ン印刷法等により、タングステン等を主体と
する金属ペ−ストが印刷され、メタライズ配線が施こさ
れる。
The grease formed into a predetermined shape in step P3
In step P4, a metal paste mainly containing tungsten or the like is printed on the tape by a screen printing method using a predetermined mask, and metallized wiring is provided.

【0015】続く工程P5においては、上記工程P3及
びP4にて夫々形成された、ラミネ−トパッケ−ジを構
成する各層(図2に示すボトム層A、ダイアタッチ層
B、ボンディングパット層C、フレ−ム層D)の位置を
合わせ、溶剤を用いて仮接着する。
In the subsequent step P5, the layers (bottom layer A, die attach layer B, bonding pad layer C, and bonding pad layer C shown in FIG. 2) constituting the laminate package formed in the above steps P3 and P4, respectively, are formed. -Align the layer D) and provisionally bond with solvent.

【0016】仮接着されたグリ−ンテ−プの積層体10
は、工程P6で、図2に示す如く、ポリエチレン等から
なる100μ程度の薄いフイルム製の袋12に入れ、真
空パックされる。そしてこの真空パツクされた積層体1
0は、工程P7において、図3に示す如く、加圧装置1
4により所定圧(例えば100Kg/cm2)に調圧さ
れた水を圧力媒体とした水中プレス槽16内に2分間放
置することで圧着される。
Laminated body 10 of green tape temporarily adhered
In step P6, as shown in FIG. 2, it is placed in a thin film bag 12 made of polyethylene or the like having a thickness of about 100 μm and vacuum packed. And this vacuum-packed laminated body 1
0 is the pressurizing device 1 as shown in FIG.
The pressure is adjusted to a predetermined pressure (for example, 100 Kg / cm 2 ) by means of No. 4 and left in the underwater press tank 16 using water as a pressure medium for 2 minutes for pressure bonding.

【0017】その後工程P8では、上記圧着された積層
体10を、工程P6で真空パツクした袋12から取り出
し、次工程P9で所定の寸法に切断し焼成する。尚、こ
の時、焼成前には、必要に応じて側面にメタライズ印刷
が施こされる。
Thereafter, in step P8, the pressure-bonded laminated body 10 is taken out from the bag 12 vacuum-packed in step P6, cut into a predetermined size and fired in the next step P9. At this time, before firing, metallization printing is applied to the side surface, if necessary.

【0018】このようにセラミックス積層体が焼成され
ると工程P10に移り、大気中に露出しているタングス
テンのメタライズ部分を酸化防止の為にニッケルメッキ
し、次工程P11にて端子やリ−ド線をAg/Cu共晶
銀ろう等によってろう付けする。その後工程P12にて
上記各部を金メッキすることによってラミネ−トパッケ
−ジが完成される。
When the ceramic laminated body is thus fired, the process proceeds to step P10, where the metallized portion of the tungsten exposed in the atmosphere is plated with nickel to prevent oxidation, and in the next step P11 terminals and leads are formed. The wire is brazed with Ag / Cu eutectic silver solder or the like. Thereafter, in step P12, the above-mentioned parts are plated with gold to complete the laminate package.

【0019】このように作成されたラミネートパッケー
ジを、ICの搭載されるキャビティー部、即ち上記図2
に示すダイアタッチ層B上でボンディングパット層C及
びフレーム層Dにより形成される空間を真空にし、外部
よりヘリウムガスを供給するといった気密性試験を行な
ったが、ヘリウムガスの透過は所定時間当たり10−2
[cc.]以下という規格を充分クリアするものであっ
た。(2000個中不良ゼロ)。
The laminated package thus prepared is used in the cavity portion in which the IC is mounted, that is, in FIG.
The space formed by the bonding pad layer C and the frame layer D on the die attach layer B shown in FIG. 2 was evacuated, and an airtightness test was conducted by supplying helium gas from the outside. -2
[Cc. ] The following standards were fully cleared. (Zero defects in 2000).

【0020】以上説明したように、本実施例では積層さ
れたグリ−ンテ−プの積層体10を、水中プレス槽16
内で加圧し、圧着するようにしている。従って従来のよ
うにグリ−ンテ−プの積層圧着を治具を用いることなく
簡単に実行することができ、また単に水中に投入するだ
けでよいので、そのプレス槽を大きくしておけば大量の
積層体を同時に圧着することができるようになる。
As described above, in this embodiment, the laminated green tape laminate 10 is formed into the underwater press tank 16
Pressure is applied inside and pressure is applied. Therefore, as in the prior art, the lamination and pressure bonding of the green tape can be easily performed without using a jig, and since it is only necessary to put it in water, if a large press tank is used, a large amount of mass can be obtained. It becomes possible to press-bond the laminate at the same time.

【0021】尚、上記説明では水中プレス槽の水温につ
いては触れなかったが、常温で加圧接着することもでき
るが、例えば40℃〜80℃程度に加熱しておくことに
よって、その工程をより早く処理することができる。ま
たプレス槽には水を用いるものとしたが、油を用いるこ
ともできる。接着時の加熱の有無による効果の相違を図
4及び図5に示す。これらの図は、いずれも接着時の圧
力を40kg/cm、加圧時間を1分間とし、室温〜
100℃の種々の温度で試料20個を観察した結果であ
り、図4は、グリーンテープの層間のリーク発生率、図
5は、グリーンテープ積層体の気泡発生率を示す。
Although the water temperature of the underwater press tank is not mentioned in the above description, pressure bonding can be performed at room temperature, but the process can be further improved by heating at about 40 ° C. to 80 ° C., for example. It can be processed quickly. Although water was used for the press tank, oil can also be used. Differences in effects depending on the presence or absence of heating during bonding are shown in FIGS. 4 and 5. In all of these figures, the pressure at the time of adhesion is 40 kg / cm 2 , the pressurizing time is 1 minute, and the room temperature to
FIG. 4 shows the results of observing 20 samples at various temperatures of 100 ° C., FIG. 4 shows the leak occurrence rate between layers of the green tape, and FIG. 5 shows the bubble occurrence rate of the green tape laminate.

【0022】図4及び図5より、接着時の温度が40℃
に満たないと接着性が悪くてリークが発生し、他方、8
0℃を越えるとグリーンテープ中の残存溶剤や仮接着用
の溶剤がガス化して積層体にブク現象を起こすのに対し
て、40℃〜80℃の範囲で接着すれば、そのような不
良を生じないことが判る。
From FIGS. 4 and 5, the temperature at the time of bonding is 40 ° C.
If it does not meet the requirements, the adhesiveness will be poor and leakage will occur.
When the temperature exceeds 0 ° C, the residual solvent in the green tape or the solvent for temporary adhesion is gasified to cause a vacancy phenomenon in the laminate, whereas if the bonding is performed in the range of 40 ° C to 80 ° C, such a defect may occur. It turns out that it does not occur.

【発明の効果】以上詳述したように、本発明のセラミッ
クス積層体の製造方法は、積層されたグリーンテープを
加圧して接合する際、所定圧の液中で加圧接着すること
を特徴としている。つまり従来のように治具を用いてプ
レスする必要はなく、単に表面を気密状に覆って液中に
投入しておくだけで、積層されたグリーンテープを簡単
に加圧接着することができるようになるのである。
As described in detail above, the method for producing a ceramics laminate of the present invention is characterized in that when the laminated green tapes are bonded by pressure, they are pressure-bonded in a liquid of a predetermined pressure. There is. In other words, there is no need to press with a jig as in the past, but simply by covering the surface in an airtight manner and putting it in the liquid, the laminated green tape can be easily pressure-bonded. It becomes.

【0023】従って所定の形状に形成された治具が不要
になるのは勿論のこと、積層体の形状に拘らず同時に加
圧接着することができ量産が容易となる。また従来のプ
レス加工の場合、加工板の平行度等に厳重な管理が必要
であったが、本発明は液体中の加圧である為、装置の管
理が簡単となる。更に加圧時に積層体を加熱する際、液
温を上昇しておけば簡単に実行することができる。
Therefore, needless to say, a jig formed in a predetermined shape is unnecessary, and pressure bonding can be performed simultaneously regardless of the shape of the laminated body, which facilitates mass production. Further, in the case of the conventional press working, it is necessary to strictly control the parallelism and the like of the working plate, but since the present invention is pressurization in a liquid, the management of the device becomes simple. Further, when the laminated body is heated during pressurization, it can be easily executed by raising the liquid temperature.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明方法をICのラミネートパッケージの製
造に適用した一実施例であって、その製造工程を示すフ
ローチャートである。
FIG. 1 is a flow chart showing an example of an embodiment in which the method of the present invention is applied to the manufacture of a laminated package of ICs, and the manufacturing process thereof.

【図2】上記工程中に作成された真空パックされたグリ
ーンテープ積層体の断面図である。
FIG. 2 is a cross-sectional view of a vacuum-packed green tape laminate manufactured during the above process.

【図3】積層体の加圧方法を説明する説明図である。FIG. 3 is an explanatory diagram illustrating a pressing method for a laminated body.

【図4】加圧接着時の温度とリーク発生率との関係を示
すグラフである。
FIG. 4 is a graph showing a relationship between a temperature and a leak occurrence rate during pressure bonding.

【図5】加圧接着時の温度と気泡発生率との関係を示す
グラフである。
FIG. 5 is a graph showing the relationship between temperature and bubble generation rate during pressure bonding.

【符号の説明】[Explanation of symbols]

10 積層体 12 袋 14 加圧装置 16 水中プレス槽 10 Laminated body 12 Bag 14 Pressurizing device 16 Underwater press tank

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 セラミックスを主成分として所定形状に
形成されたグリーンテープを複数枚積層し、加圧して接
合する際、 上記複数のグリーンテープを積層し、溶剤を用いて仮接
着した後、周囲を気密状に保護し、接合部を40℃〜8
0℃の温度範囲にある所定圧の液中で加圧接着すること
を特徴とするセラミックス積層体の製造方法。
1. When laminating a plurality of green tapes, each of which has a ceramics as a main component and formed into a predetermined shape, and press-bonding the plurality of green tapes, the plurality of green tapes are laminated and temporarily adhered with a solvent, and then the surroundings. Airtightly protect the joint at 40 ° C-8
A method for producing a ceramics laminate, which comprises pressure bonding in a liquid having a predetermined pressure within a temperature range of 0 ° C.
JP4236481A 1992-08-11 1992-08-11 Method for manufacturing ceramic laminate Expired - Lifetime JPH085052B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4236481A JPH085052B2 (en) 1992-08-11 1992-08-11 Method for manufacturing ceramic laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4236481A JPH085052B2 (en) 1992-08-11 1992-08-11 Method for manufacturing ceramic laminate

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP60068848A Division JPS61227043A (en) 1985-04-01 1985-04-01 Method of laminating ceramics laminate

Publications (2)

Publication Number Publication Date
JPH05293810A JPH05293810A (en) 1993-11-09
JPH085052B2 true JPH085052B2 (en) 1996-01-24

Family

ID=17001375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4236481A Expired - Lifetime JPH085052B2 (en) 1992-08-11 1992-08-11 Method for manufacturing ceramic laminate

Country Status (1)

Country Link
JP (1) JPH085052B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4067830B2 (en) 2002-01-24 2008-03-26 日本碍子株式会社 Ceramic structure joining apparatus and joining method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5694716A (en) * 1979-12-28 1981-07-31 Fujitsu Ltd Method of manufacturing laminated ceramic condenser
JPS6025329B2 (en) * 1980-07-25 1985-06-18 株式会社日立製作所 Steel pipe transfer noise prevention device
JPS59114894A (en) * 1982-12-22 1984-07-03 株式会社日立製作所 Method for manufacturing multilayer printed wiring board

Also Published As

Publication number Publication date
JPH05293810A (en) 1993-11-09

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