JPH0851139A - Processing equipment - Google Patents

Abstract

(57) Abstract: It is possible to flexibly cope with an increase in the size of a transfer jig such as a wafer cassette and automatic transfer, and to suppress the amount of dust adhering to an object to be processed and to improve throughput. There is provided a processing device capable of improving the above. A processing unit (2) having a plurality of processing units (11a to 11f) and a transfer path unit (12) for loading and unloading a semiconductor wafer (10) into and from the processing units (11a to 11f), and a cassette mounting unit for housing a wafer cassette (13). 14 and a transfer mechanism 15 for carrying the semiconductor wafer 10 in and out of the wafer cassette 13
And a transfer mechanism 16 that transfers the semiconductor wafer 10 between the transfer path unit 12 and the transfer mechanism 15, and the transfer path unit 12 and the transfer mechanism 15 are arranged in a T shape.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a processing apparatus.

[0002]

2. Description of the Related Art In recent years, semiconductor devices are rapidly being highly integrated, and their circuit patterns tend to be miniaturized. For this reason, in the semiconductor manufacturing process, it is required to reduce the dust in the atmosphere in the clean room more than ever before and to clean it.
Therefore, by automating each process and unmanned, the demand for cleaning is being met.

Generally, in a semiconductor manufacturing process, a plurality of, for example, 25 semiconductor wafers, which are the objects to be processed, are housed and transferred in a transfer jig called a wafer cassette or the like. Therefore, as one of the above-mentioned automations, robot transfer that automatically transfers such a wafer cassette is being adopted.

[0004]

As described above, in the semiconductor manufacturing process, automatic transfer of wafer cassettes or the like is carried out by robot transfer.

However, when a wafer cassette or the like is transferred to various semiconductor processing apparatuses by such robot transfer, the transfer becomes difficult if the height of the wafer cassette inlet of each semiconductor processing apparatus is different for each apparatus. . Therefore, it is necessary to adjust the heights of the wafer inlets of the wafer cassettes of various semiconductor processing apparatuses so as to match with each other, and depending on the semiconductor processing apparatus, there are cases where a large design change or the like is required.

Further, in recent years, the diameter of semiconductor wafers has tended to be large, for example, 8 inches, and in response to this, the jigs for carrying wafer cassettes and the like have become larger and the weight thereof tends to be heavier. It is also required as a semiconductor manufacturing apparatus to cope with such an increase in the size of a carrying jig.

Further, as the diameter of the semiconductor wafer is increased, the size of the apparatus is increased, and the transport distance of the semiconductor wafer is increased. As a result, the throughput is decreased and the amount of dust adhering to the object to be processed is increased. Problems are emerging.

The present invention has been made in consideration of such a conventional situation, and is capable of flexibly coping with an increase in the size of a transfer jig such as a wafer cassette and automatic transfer, and at the same time, it is possible to process the object to be processed. An object of the present invention is to provide a processing device capable of suppressing the amount of dust adhering to the body and improving throughput.

[0009]

That is, according to the invention of claim 1, a plurality of carrying jigs for accommodating a plurality of objects to be processed are linearly arranged, and the carrying parts are parallel to the carrying parts. A first transport mechanism having a first transport path for loading and unloading an object to be processed into and from the jig for transport, and a direction substantially perpendicular to a central portion of the first transport path. A second transport mechanism which is disposed at a height different from that of the first transport path so as to extend to the first transport path, and which transports an object to be processed while being held by an arm; The processing unit disposed on both sides of the second transport path and having at least a resist coating processing unit, a development processing unit, and a heating unit, and the object to be processed between the first transport mechanism and the second transport mechanism. And a delivery mechanism for vertically delivering and delivering.

According to a second aspect of the present invention, there is provided a placing portion in which a plurality of carrying jigs for accommodating a plurality of objects to be processed are linearly arranged.
A first transport path that is parallel to the mounting portion, and that carries the object to be processed into and out of the transfer jig while holding the object to be processed on the transfer arm.
And a second transport path disposed at a height different from that of the first transport path so as to extend in a direction substantially perpendicular to the central portion of the first transport path. A second transport mechanism for transporting the processing body while holding it on an arm, and at least two units arranged at both sides of the second transport path, at least a resist coating processing unit, a development processing unit, a heating unit, and a cooling unit. And a delivery mechanism for vertically delivering and delivering the object to be processed between the first transport mechanism and the second transport mechanism. Processing equipment.

According to a third aspect of the present invention, there is provided a placing section in which a plurality of carrying jigs for accommodating a plurality of objects to be processed are linearly arranged.
A first transport path that is parallel to the mounting portion, and that carries the object to be processed into and out of the transfer jig while holding the object to be processed on the transfer arm.
And a second transport path arranged at a height different from that of the first transport path so as to extend in a direction substantially perpendicular to the central portion of the first transport path. A second transfer mechanism having an arm, a processing section disposed on both sides of the second transfer path, the processing section having at least a resist coating processing unit, a development processing unit, a heating unit, and a cooling unit, and the first transfer mechanism. A processing apparatus comprising: a transfer mechanism that vertically transfers the object to be processed between the mechanism and the second transfer mechanism and transfers the object.

According to a fourth aspect of the present invention, there is provided a placing portion in which a plurality of carrying jigs for accommodating a plurality of objects to be processed are linearly arranged.
A first transport mechanism that has a first transport path parallel to the mounting portion, and that makes the first transport path movable, and that transports a target object into and out of the transport jig; Object to be processed at a height position different from the conveying height of the object to be processed which is conveyed by the first conveying mechanism that moves in the first conveying path so as to extend from the central portion of the conveying path in a substantially perpendicular direction. A second transport mechanism that is movable in a second transport path for transporting the toner, and at least a resist coating processing unit, a development processing unit, a heating unit, and a cooling unit, which are disposed on both sides of the second transport path. A processing unit including two units; and a delivery mechanism that vertically conveys and delivers the object to be processed between the first transport mechanism and the second transport mechanism. Characterizing processing device.

According to a fifth aspect of the present invention, there is provided a placing portion in which a plurality of carrying jigs for accommodating a plurality of objects to be processed are linearly arranged.
A first transport path that is parallel to the mounting portion, and that carries the object to be processed into and out of the transfer jig while holding the object to be processed on the transfer arm.
And a second transport path arranged at a height different from that of the first transport path so as to extend in a direction substantially perpendicular to the central portion of the first transport path. A second transport mechanism capable of transporting the object to be processed by holding it on a plurality of arms;
Between the first transport mechanism and the second transport mechanism, which are disposed on both sides of the second transport path and have at least a resist coating processing unit, a developing processing unit, a heating unit, and a cooling unit. And a transfer mechanism for vertically transferring and transferring the object to be processed.

According to a sixth aspect of the present invention, there is provided a placing section in which a plurality of carrying jigs for accommodating a plurality of objects to be processed are linearly arranged.
A first transport mechanism that has a first transport path parallel to the mounting portion, and that makes the first transport path movable, and that transports a target object into and out of the transport jig; Object to be processed at a height position different from the conveying height of the object to be processed which is conveyed by the first conveying mechanism that moves in the first conveying path so as to extend from the central portion of the conveying path in a substantially perpendicular direction. A second transport mechanism capable of moving in a second transport path for transporting a plurality of workpieces, the second transport mechanism capable of holding a plurality of objects to be processed by a plurality of arms, and the second transport mechanism. A processing unit which is disposed on both sides of the path and includes at least two units of a resist coating processing unit, a development processing unit, a heating unit, and a cooling unit, the first transport mechanism, and the second transport mechanism. Between the above-mentioned objects to be vertically conveyed and handed over Processing apparatus characterized by comprising a mechanism to.

According to a seventh aspect of the present invention, there is provided a placing section in which a plurality of carrying jigs for accommodating a plurality of objects to be processed are linearly arranged.
A first transport mechanism that has a first transport path parallel to the mounting portion, and that makes the first transport path movable, and that transports a target object into and out of the transport jig; Object to be processed at a height position different from the conveying height of the object to be processed which is conveyed by the first conveying mechanism that moves in the first conveying path so as to extend from the central portion of the conveying path in a substantially perpendicular direction. A second transport mechanism having a plurality of arms that can move in a second transport path, and at least a resist coating processing unit, a developing processing unit, and a heating unit that are disposed on both sides of the second transport path. A processing unit including at least two units, a cooling unit, and a transfer mechanism for vertically transferring the object to be processed between the first transfer mechanism and the second transfer mechanism to transfer the object. A processing device comprising:

The invention according to claim 8 is the processing device according to any one of claims 1 to 7, characterized in that the mounting part and the processing part are constituted by separate casings.

The invention according to claim 9 is the processing apparatus according to any one of claims 1 to 8, characterized in that the transfer arm is configured to support a peripheral portion of the lower surface of the object to be processed.

The invention of claim 10 is the processing apparatus according to any one of claims 1 to 9, wherein the object to be processed is a semiconductor wafer.

In the processing apparatus of the present invention having the above structure, a transfer mechanism for transferring the object to be processed is provided between the first transfer mechanism and the second transfer mechanism. Therefore, it is possible to flexibly cope with robot conveyance having different conveyance heights, only by adjusting the height of the mounting portion without changing the height of the processing section.

Further, by setting the height of the mounting portion to be low, the cassette or the like can be always positioned at a low position, and it is not necessary to lift a large and heavy cassette to a high position. It is possible to prevent the height of the apparatus from becoming high by placing the wafer at a high position, and to flexibly cope with an increase in the diameter of a wafer or the like.

Furthermore, since the first transport mechanism and the second transport mechanism are arranged in a substantially T-shape, the transport distance can be set to the shortest for any object to be processed. As a result, the transport time can be reduced, so that the amount of dust attached to the object to be processed can be suppressed and the throughput can be improved.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the processing apparatus of the present invention is applied to a resist coating and developing processing apparatus will be described below with reference to the drawings.

As shown in FIG. 1, a resist coating / developing processing apparatus 1 has, for example, a processing section 2 and a loader section 3 each of which is composed of a separate housing and arranged in a horizontal direction (X direction in the drawing). Then, it is configured by connecting these.

The processing section 2 includes processing units 11a to 11f for performing a series of processes for photolithography on an object to be processed, for example, a semiconductor wafer 10, and the semiconductor wafer 1.
It is configured by combining a transport path unit 12 (first transport mechanism) for transporting 0 to these processing units 11a to 11f.

The transport path unit 12 is provided so as to run in the central portion of the housing of the processing section 2, and is divided by the transport unit path 12 on one side (lower side in FIG. 1).
Is provided with a resist coating processing unit 11a and a developing processing unit 11b in parallel, and on the other side (upper side in FIG. 1), a plurality of processing units such as post-baking processing from the loader unit 3 side is provided. The units 11c and 11d, and a post-exposure bake unit 11e configured to be stacked in two stages and a cooling temperature control processing unit 11f are provided in parallel.

Further, the transfer path unit 12 has a structure shown in FIG.
As also shown in the drawing, a plurality of wafer tweezers 12a for supporting and transporting the semiconductor wafer 10, for example, two wafer tweezers 12a are provided so as to overlap with each other. These wafer tweezers 12a are formed in an arc shape and are configured to support the peripheral edge of the back surface of the semiconductor wafer 10. The wafer tweezers 12a are configured to be movable in the X, Y, Z, and θ directions by a drive mechanism (not shown). There is. Here, the above two wafer tweezers 12a
Is one of the processing units 11a to 1 of the processing unit 2, for example.
The semiconductor wafer 10 is delivered to 1f, and the other one is configured to receive the processed semiconductor wafer 10.

On the other hand, in the loader section 3, the semiconductor wafer 1
A plurality of, for example, four cassette mounting portions configured to move a wafer cassette (transport jig) 13 configured to accommodate a plurality of 0, for example, 25 sheets, and to move in the vertical direction (Z direction). 14 (transport jig storage portion) is provided. These cassette mounting portions 14 are linearly arranged, and the wafer cassettes 13 are arranged and accommodated linearly. In addition, X,
Wafer tweezers 15a movable in Y and θ directions
The transfer mechanism 15 (second transfer mechanism) for loading / unloading the semiconductor wafer 10 into / from the wafer cassette 13
Is provided. The transport mechanism 15 of the loader unit 3
The transfer path unit 12 of the processing section 2 is arranged in a T shape, and a wafer transfer mechanism 16 for transferring the semiconductor wafer 10 up and down and down is provided at the connecting portion. There is.

That is, in this embodiment, the loader unit 3
In addition, as a wafer transfer mechanism 16 for transferring the semiconductor wafer 10 between the transfer mechanism 15 and the transfer path unit 12, a drive mechanism (not shown), such as a stepping motor and a ball screw, is configured to be movable up and down. Two stage pins 16a are provided so as to support the semiconductor wafer 10. The intervals of these stage pins 16a can be changed by a drive mechanism (not shown) such as an air cylinder.

In addition, at the upper position of these stage pins 16a, a position for aligning the semiconductor wafer 10 is set.
A book centering guide 17 is provided. The centering guide 17 is formed in a semicircular shape on the inside according to the outer shape of the semiconductor wafer 10, and is configured to be positioned by holding the semiconductor wafer 10 by controlling the opening / closing by a driving mechanism (not shown) such as an air cylinder. Has been done. Then, in the open state, these centering guides 1
The semiconductor wafer 10 can be positioned at a predetermined position of the stage pin 16a by carrying in the semiconductor wafer 10 between 7 and performing an operation of closing these centering guides 17 (moving the centering guides 17 in a direction to narrow the gap). Is configured.

Next, the operation (processing step) of the resist processing apparatus 1 having the above structure will be described. First, a wafer cassette 13 in which a semiconductor wafer 10 is accommodated by a dust-free robot transfer, such as a handling arm, which transfers in a clean room, is set in a predetermined cassette mounting section 1 of a loader section 3.
Place on the mounting table of No. 4. The placed information is automatically input to the computer.

After that, the wafer tweezers 15a of the transfer mechanism 15 are aligned with, for example, the wafer cassette 13 by a preassembled program, and inserted into the lower portion of the semiconductor wafer 10 in the corresponding wafer cassette 13, and then the cassette is placed. The wafer cassette 13 is lowered by a predetermined stroke by the placing portion 14 relative to the tweezers 15, and the semiconductor wafer 10 is placed on the wafer tweezers 15a. The wafer tweezers 15a suction-temporarily fix the back surface of the semiconductor wafer 10 by, for example, a vacuum chuck.

Next, the wafer tweezers 15a supporting the semiconductor wafer 10 are moved in the X direction and pulled out from the inside of the wafer cassette 13, and then the wafer tweezers 15a are rotated in the θ direction to be positioned above the stage pins 16. At this time, the stage pin 16 is set in the initial state (the lowered position and the interval between the stage pins 16 is open) in advance and is on standby.

Thereafter, the stage pins 16a are raised and the semiconductor wafer 10 is transferred from the wafer tweezers 15a onto the stage pins 16a. At this time, two stations
The wafer tweezers 15a so that the wafer tweezers 15a pass through between the pin 16a.
And pass each other in the vertical direction.

Then, the stage pins 16a are further raised to position the semiconductor wafer 10 between the centering guides 17 which have been opened beforehand. Here, the centering guides 17 are closed, and the semiconductor pins 10 on the stage pins 16a are closed. The semiconductor wafer 10 is positioned at a predetermined position.

At this time, the stage pin 16a is also closed at the same time. This is because the wafer tweezers 12a of the transfer path unit 12 that is to be transferred after this is the semiconductor wafer 1
This is to prevent the stage pin 16a and the wafer tweezers 12a from interfering with each other because the stage pin 16a insertion opening formed in the tip end portion thereof is formed in a substantially annular shape so as to hold the outer periphery of 0. Therefore, depending on the shape of the wafer tweezers 12a (the shape of the opening for inserting the stage pin 16a), the closing operation of the stage pin 16 may not be performed.

Next, the stage pins 16a are raised to a predetermined height at which the semiconductor wafer 10 can be handed over to the wafer tweezers 12a, and are made to stand by there. When the wafer tweezers 12a are inserted under the semiconductor wafer 10, the stage pins 16a are lowered and the semiconductor wafer 10 on the stage pins 16a is transferred to the wafer tweezers 12a. Wafer tweezers 12a
Thereafter, the semiconductor wafers 10 transferred to the semiconductor wafer 10 are sequentially processed into a predetermined processing unit 11a according to a predetermined program.
The sheet is conveyed to 11 f and subjected to predetermined processing.

Further, when the processed semiconductor wafer 10 is supported by either one of the wafer tweezers 12a provided in the upper and lower two stages at the time of the transfer, the processed semiconductor wafer 10 is transferred after the transfer. The wafer 10 is transferred to the stage pins 16a. That is, the wafer tweezers 12a is advanced to position the processed semiconductor wafer 10 on the stage pins 16a, and then the stage pins 16a are raised to support the semiconductor wafer 10 on the stage pins 16a. , Wafer tweezers 12a
Of the processed semiconductor wafer 10 by retracting
To the stage pin 16a.

The processed semiconductor wafer 10 transferred to the stage pins 16a is then positioned by the centering guide 17 by an operation opposite to the above-mentioned operation, and then the semiconductor pins 10 of the transfer mechanism 15 are moved from the stage pins 16a. The wafers are transferred to the wafer tweezers 15a, and then stored in a predetermined wafer cassette 13.

By repeating such a series of operations, each semiconductor wafer 10 in the wafer cassette 13 is
Is sequentially subjected to predetermined processing.

When all the semiconductor wafers 10 in the wafer cassette 13 have been processed, this wafer cassette 13 is unloaded and a new wafer cassette 13 is loaded. Such loading / unloading of the wafer cassette 13 is carried out. In the resist processing apparatus 1 of this embodiment, the height can be easily adjusted by adjusting the height of the loader unit 3 to the transfer height by robot transfer.

That is, while the height of the processing section 2 is fixed, the height of the loader section 3 is adjusted to the transfer height by the robot transfer, and the height of the loader section 3 is used to adjust the stage. The vertical transfer distance of the semiconductor wafer 10 by the dipin 16a is adjusted. Therefore, it is not necessary to adjust the height or the like of the entire apparatus or make a large design change, and it is possible to flexibly cope with robots having different conveyance heights.

Further, the transport path unit 12 of the processing section 2,
The transfer mechanism 15 of the loader unit 3 is arranged in a T shape, and the wafer transfer mechanism 16 for transferring the semiconductor wafer 10 is provided at the connecting portion between them, so that any cassette mounting The transfer distance of the semiconductor wafer 10 in the wafer cassette 13 of the unit 14 can be minimized, the transfer time can be reduced, and the amount of dust attached to the semiconductor wafer 10 can be suppressed and throughput can be improved. be able to.

FIG. 3 shows a resist processing apparatus 1a of another embodiment.
The same parts as those of the above-described resist processing apparatus 1 shown in FIGS. 1 and 2 are designated by the same reference numerals.

In the resist processing apparatus 1a of this embodiment,
The cassette placement section 14 of the loader section 3 is provided at a lower position than the processing units 11a to 11f of the processing section 2. In addition, the cassette mounting portion 14 does not have a drive mechanism, and the wafer tweezers 15a of the transfer mechanism 15 are X-shaped.
It is configured to be movable in the −Y−Z−θ direction.

Then, the semiconductor wafer 10 is taken out from the wafer cassette 13 placed on the cassette placing section 14 by the wafer tweezers 15a, and the semiconductor wafer 10 is conveyed to the upper part by the wafer tweezers 15a.
It is delivered to the stage pin 16a.

The resist processing apparatus 1 thus configured
In a, it is possible to obtain the same effect as that of the above-described embodiment, and at the same time, the wafer cassette 1 on the cassette mounting portion 14 is
3 can be carried in and out at a low position, and
Since the wafer cassette 13 is not moved up and down, it is possible to prevent the height of the apparatus from increasing, and when the wafer cassette 13 is large, for example, when processing a semiconductor wafer 10 having a large diameter such as 8 inches. It is suitable.

In the above embodiment, an example in which the present invention is applied to a semiconductor wafer resist processing apparatus has been described, but the present invention is not limited to such an embodiment.
It can be applied to any apparatus such as a cleaning apparatus for cleaning the surface of a semiconductor wafer, an etching apparatus, an exposure processing apparatus for exposing a resist-coated semiconductor wafer, and a developing apparatus for developing an exposed semiconductor wafer. Further, the object to be processed is not limited to a semiconductor wafer, but can be applied to a process of processing an LCD substrate or a printed circuit board.

[0048]

As described above, according to the processing apparatus of the present invention, it is possible to flexibly cope with an increase in the size of a transfer jig such as a wafer cassette, automatic transfer, and the like. It is possible to suppress the amount of dust attached to the body and improve the throughput.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a resist processing apparatus according to an embodiment of the present invention.

FIG. 2 is a side view of the resist processing apparatus shown in FIG.

FIG. 3 is a diagram showing a main configuration of a resist processing apparatus of another embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 resist processing apparatus 2 processing section 3 loader section 10 semiconductor wafers 11a to 11f processing unit 12 transfer path unit 12a wafer tweezers 13 wafer cassette 14 cassette mounting section 15 transfer mechanism 15a wafer tweezers 16 wafer transfer mechanism 16a stage pins 17 Centering guide

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Osamu Hirakawa 2655 Tsukyu, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture, Tokyo Electron Kyushu Co., Ltd. (72) Noriyuki Anai, 2655 Tsukyu, Kikuyo-cho, Kikuchi-gun, Kumamoto Tokyo Electron Kyushu Within the corporation

Claims (10)

[Claims] 1. An object to be processed, wherein a carrying jig for accommodating a plurality of objects to be processed has a plurality of placing parts linearly arranged and a first carrying path parallel to the placing parts. For holding in a carrying arm and carrying in and out of the carrying jig
And a second transport path disposed at a height different from that of the first transport path so as to extend from the central portion of the first transport path in a direction substantially perpendicular to the first transport path. A second transfer mechanism for holding and transferring the processing body on an arm; a processing section disposed on both sides of the second transfer path and having at least a resist coating processing unit, a development processing unit, and a heating unit; A processing apparatus comprising: a transfer mechanism for vertically transferring the object to be processed between the first transfer mechanism and the second transfer mechanism to transfer the object. 2. A processing jig for accommodating a plurality of objects to be processed has a plurality of mounting portions arranged linearly and a first transportation path parallel to the mounting portions, For holding in a carrying arm and carrying in and out of the carrying jig
And a second transport path disposed at a height different from that of the first transport path so as to extend from the central portion of the first transport path in a direction substantially perpendicular to the first transport path. A second transport mechanism for transporting the processing body while holding it on an arm, and at least two units disposed at both sides of the second transport path, which are at least a resist coating processing unit, a developing processing unit, a heating unit, and a cooling unit. And a transfer mechanism that transfers the object to be processed vertically between the first transfer mechanism and the second transfer mechanism and transfers the object. Processing equipment. 3. An object to be processed, wherein a carrying jig for housing a plurality of objects to be processed has a plurality of placing parts linearly arranged and a first carrying path parallel to the placing parts. For holding in a carrying arm and carrying in and out of the carrying jig
And a second transport path arranged at a height different from that of the first transport path so as to extend in a direction substantially perpendicular from the central portion of the first transport path. A second transport mechanism having an arm, a processing section disposed on both sides of the second transport path, the processing section having at least a resist coating processing unit, a development processing unit, a heating unit, and a cooling unit; A processing apparatus comprising: a transfer mechanism that vertically transfers the object to be processed between the mechanism and the second transfer mechanism and transfers the object. 4. A transfer jig for accommodating a plurality of objects to be processed has a plurality of mounting portions linearly arranged and a first transfer path parallel to the mounting portions. A first transport mechanism that makes the transport path movable and transports the target object into and out of the transport jig; and the first transport mechanism that extends in a direction substantially perpendicular to the central portion of the first transport path. A second transport mechanism that is movable in a second transport path that transports an object to be processed at a height position different from the transport height of the object to be processed that is transported by the first transport mechanism that moves in one transport path; A processing unit which is disposed on both sides of the second transport path and includes at least two units of a resist coating processing unit, a development processing unit, a heating unit, and a cooling unit; the first transport mechanism; The object to be processed is vertically transferred to and received from the second transfer mechanism. Processing apparatus characterized by comprising a delivery mechanism for teeth. 5. An object to be processed, wherein a carrying jig for accommodating a plurality of objects to be processed has a plurality of placing parts arranged linearly and a first carrying path parallel to the placing parts. For holding in a carrying arm and carrying in and out of the carrying jig
And a second transport path arranged at a height different from that of the first transport path so as to extend in a direction substantially perpendicular from the central portion of the first transport path. Second transport mechanism capable of transporting the object to be treated while being held by a plurality of arms, and disposed on both sides of the second transport path, at least a resist coating processing unit, a development processing unit, a heating unit, and a cooling unit. And a transfer mechanism that transfers the object to be processed vertically between the first transfer mechanism and the second transfer mechanism, and transfers the object. . 6. A transfer jig for accommodating a plurality of objects to be processed has a plurality of mounting portions arranged linearly and a first transfer path parallel to the mounting portions. A first transport mechanism that makes the transport path movable and transports the target object into and out of the transport jig; and the first transport mechanism that extends in a direction substantially perpendicular to the central portion of the first transport path. A second transport mechanism that is movable in a second transport path that transports an object to be processed at a height position different from the transport height of the object to be processed that is transported by the first transport mechanism that moves along the first transport path. And a second transport mechanism capable of transporting a plurality of objects to be held by a plurality of arms, and a second coating mechanism disposed on both sides of the second transport path, at least a resist coating processing unit, a development processing unit, and a heating unit. A processing unit including at least two units of a unit and a cooling unit; Processing apparatus, characterized in that the workpiece between the the feed mechanism the second conveying mechanism conveys the vertical direction, and and a transfer mechanism for transferring. 7. A carrying jig for accommodating a plurality of objects to be processed has a plurality of placing portions linearly arranged and a first conveying path parallel to the placing portions. A first transport mechanism that makes the transport path movable and transports the target object into and out of the transport jig; and the first transport mechanism that extends in a direction substantially perpendicular to the central portion of the first transport path. A plurality of arms that are movable in a second transport path that transports the object to be processed at a height position different from the transport height of the object to be processed that is transported by the first transport mechanism that moves in the first transport path; A second transport mechanism, a processing unit disposed on both sides of the second transport path, the processing unit including at least two units of a resist coating processing unit, a development processing unit, a heating unit, and a cooling unit; Between the second transport mechanism and the second transport mechanism. And conveyed in a direction, the processing apparatus characterized by comprising a transfer mechanism for transferring. 8. The processing device according to claim 1, wherein the placement unit and the processing unit are configured by separate casings. 9. The processing apparatus according to claim 1, wherein the transfer arm is configured to support a peripheral portion of a lower surface of the object to be processed. 10. The processing apparatus according to claim 1, wherein the object to be processed is a semiconductor wafer.