JPH0851181A - Resin-sealed semiconductor device - Google Patents

Abstract

(57) [Summary] [Object] To provide a resin-encapsulated semiconductor device in which a plurality of semiconductor chips are mounted at high density by reducing the area of the resin mold portion. [Structure] The semiconductor chip 3 is bonded to the die pad portion 4,
A semiconductor circuit portion was formed by connecting the semiconductor chip 3 to the inner lead portion 5 with a thin metal wire 6. Then, a plurality of semiconductor circuit parts were arranged vertically with respect to the mounting circuit board 7 by one molding part and sealed. As a result, the resin area per mold can be reduced, and a plurality of semiconductor chips can be mounted in one mold with high density. Therefore, it is possible to reduce the area of the mounting circuit board 7 on which the resin-sealed semiconductor device is mounted, and it is possible to cope with high density.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly relates to a resin-encapsulated semiconductor device capable of reducing a circuit mounting substrate area or a resin molding area and improving circuit integration.

[0002]

2. Description of the Related Art In recent years, as a semiconductor device, a so-called resin-encapsulated semiconductor device of a type in which a semiconductor chip is encapsulated with resin has been actively developed. The high degree of integration is also improved by the fine processing of.

Conventionally, a large number of external electrode terminals are arranged in a matrix on one side surface of a resin-sealed mold part of a resin-sealed semiconductor device, but the number of built-in semiconductor chips is only one. Also, the direction in which the semiconductor chips are embedded is arranged parallel to the circuit board on which the resin-sealed semiconductor device is mounted. FIG. 5 shows a cross-sectional structure of a conventional resin-sealed semiconductor device.

The conventional resin-encapsulated semiconductor device shown in FIG. 5 has a molded portion 1 made of resin and an external electrode terminal 2 protruding from the side surface of the molded portion 1.
The semiconductor chip 3 is bonded on the die pad portion 4 of the lead frame by a conductive adhesive in the mold portion 1, and the inner lead portion 5 of the lead frame and the semiconductor chip 3 are electrically connected by the thin metal wire 6. Has been done.

[0005]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention The arrangement direction of the semiconductor chips embedded in the mold portion of the conventional resin-sealed semiconductor device is parallel to the circuit board on which the resin-sealed semiconductor device is mounted. To some extent, the area of the mold part must be increased, and therefore the area of the circuit board must be increased accordingly. If there are a plurality of built-in semiconductor chips, the area must be increased correspondingly. Further, the larger the number of external electrode terminals, the more the electrical characteristics can be obtained, and thus the function is improved. However, the mold area must be expanded accordingly.

Therefore, the present invention realizes a resin-encapsulated semiconductor device in which a plurality of semiconductor chips are densely mounted in one mold without significantly increasing the area of the molded portion of the resin-encapsulated semiconductor device. It is an object of the present invention to provide a resin-encapsulated semiconductor device capable of suppressing an increase in the area of a circuit board on which the resin-encapsulated semiconductor device is mounted.

[0007]

The resin-sealed semiconductor device of the present invention is formed by bonding a semiconductor chip onto a die pad of a lead frame and connecting the bonded semiconductor circuit chip to the inner lead by wire bonding. A plurality of semiconductor circuit parts are arranged in the same direction so that the semiconductor chips are overlapped in a non-contact manner so that the semiconductor chips are perpendicular to the circuit board on which the resin-sealed semiconductor device is mounted. There is.

[0008]

According to the structure of the present invention, since the embedded direction of the semiconductor chips in the mold portion of the resin-sealed semiconductor device is arranged in the same direction so as to overlap the circuit board vertically and in a non-contact manner, The area of the semiconductor chip with respect to the substrate is reduced, and the area of the mold portion can be reduced. Further, the greater the number of built-in semiconductor chips, the larger the difference in the area of the mold portion as described above. Therefore, the technique according to the present invention is applied to a resin-sealed semiconductor device having a plurality of built-in semiconductor chips. When applied, the degree of integration increases,
The size can be reduced.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is an external perspective view of a resin-sealed semiconductor device according to an embodiment of the present invention. In FIG. 1, reference numeral 1 is a mold portion made of a sealing resin, and 2 is an external electrode terminal for taking out electrical characteristics of a semiconductor chip built in the mold portion 1.

Next, the detailed structure of the resin-sealed semiconductor device shown in FIG. 1 will be described. FIG. 2 is a front cross-sectional view of the resin-sealed semiconductor device shown in FIG. 1, showing a cross-section in a state where the resin-sealed semiconductor device is bonded to a circuit mounting board. Similarly, FIG. 3 is a side sectional view of the resin-sealed semiconductor device shown in FIG. 1, and shows a cross-section in a state where the resin-sealed semiconductor device is bonded to a circuit mounting board. Similarly, FIG. 4 is a plan sectional view of the resin-encapsulated semiconductor device shown in FIG. 1, and shows a section in a state where the resin-encapsulated semiconductor device is bonded to a mounting circuit board.

In FIGS. 2, 3, and 4, reference numeral 3 is a semiconductor chip. Reference numeral 4 is a die pad portion of the lead frame on which the semiconductor chip 3 is mounted and bonded. Reference numeral 5 is an inner lead portion of the lead frame. 6 is a semiconductor chip 3
Is a thin metal wire for electrically connecting the inner lead portion 5 with the inner lead portion 5, and is an aluminum wire or a gold wire. 7 is a mounting circuit board to which a resin-sealed semiconductor device is joined,
The external electrode terminals 2 of the resin-sealed semiconductor device are joined with solder 8. The external electrode terminal 2 is a portion in which the inner lead portion 5 of the lead frame extends and projects to the outside from the mold portion 1 of the sealing resin.

The semiconductor circuit portion is formed by the semiconductor chip 3 bonded on the die pad portion 4 of the lead frame and the thin metal wire 6 electrically connecting the semiconductor chip 3 and one end of the inner lead portion 5 of the lead frame. I am configuring.

In the resin-encapsulated semiconductor device of this embodiment having the above-mentioned structure, a plurality of semiconductor chips 3 are provided.
And, as shown in FIG. 4, it is vertically sealed in the mold part 1. That is, as shown in FIGS. 3 and 4, a plurality of lead frames are used, the semiconductor chip 3 is bonded to the die pad portion 4 of each lead frame, arranged vertically (vertically) in the same direction, and sealed. It is molded with a stop resin, and the inner lead portion 5 of the lead frame is extended downward so as to protrude from the molding portion 1.

Although the number of semiconductor chips 3 is four in the figure, the number can be increased or decreased according to the purpose.

With the structure of this embodiment, lead frame groups each having a die pad on which a semiconductor chip is mounted are arranged in the same direction and perpendicularly to the mounting circuit board to be mounted, and the lead portions of the lead frame are arranged in the same direction. By projecting from the side surface, the degree of integration can be improved, a plurality of semiconductor chips can be resin-sealed, and they can be incorporated in one package at a high density.

[0017]

According to the present invention, the direction of embedding a semiconductor chip in a mold portion of a resin-sealed semiconductor device is made perpendicular to the direction of a circuit mounting board on which the semiconductor chip is mounted. It is possible to obtain a high-density resin-sealed semiconductor device by suppressing the thickness of the. By using the resin-sealed semiconductor device according to the present invention, the mounting area on the mounted circuit board to be mounted can be suppressed. As a result, the mounted circuit board can be downsized and the density can be increased.

[Brief description of drawings]

FIG. 1 is an external perspective view of a resin-sealed semiconductor device according to an embodiment of the present invention.

FIG. 2 is a front sectional view of a resin-sealed semiconductor device according to an embodiment of the present invention.

FIG. 3 is a side sectional view of a resin-sealed semiconductor device according to an embodiment of the present invention.

FIG. 4 is a plan sectional view of a resin-encapsulated semiconductor device according to an embodiment of the present invention.

FIG. 5 is a sectional view of a conventional resin-encapsulated semiconductor device.

[Explanation of symbols]

 1 Mold Part 2 External Electrode Terminal 3 Semiconductor Chip 4 Die Pad Part 5 Inner Lead Part 6 Thin Metal Wire 7 Mounted Circuit Board 8 Solder

Claims (2)

[Claims] 1. A semiconductor circuit portion comprising a semiconductor element bonded on a die pad of a lead frame, and a thin metal wire electrically connecting the semiconductor element and one end of a lead portion of the lead frame, and the semiconductor circuit portion. A resin-sealed semiconductor device in which the resin-sealed semiconductor device is a resin-sealed semiconductor device, and a portion of the lead frame not resin-sealed from one side surface of the resin-sealed semiconductor device serves as an external electrode terminal. And a plurality of the semiconductor circuit portions are arranged in the same direction in the vertical direction with respect to the circuit board on which the resin-sealed semiconductor device is mounted and are resin-sealed. A characteristic resin-encapsulated semiconductor device. 2. A plurality of semiconductor circuit parts, which are arranged in a direction perpendicular to a circuit board on which a resin-sealed semiconductor device is mounted and are resin-sealed, are resin-sealed resin parts. 2. The resin-encapsulated semiconductor device according to claim 1, wherein the resin-encapsulated semiconductor devices are arranged in the same direction so as to overlap in the width or depth direction without contact.