JPH085588Y2 - Cooling structure for semiconductor chip module - Google Patents

Description

[Detailed Description of the Invention] [Overview] Regarding a cooling structure of a semiconductor chip module, for the purpose of facilitating addition and replacement of the semiconductor chip module on a module-by-module basis, a radiator having a radiation fin is fixed to the surface of an insulating substrate. Further, a semiconductor chip in which a cooling unit having an intake fan installed in a circular duct with a mounting flange is screwed onto the radiator, and terminal pins are projectingly provided on the peripheral edge of the back surface and a semiconductor chip is provided in the central portion. A module, a mother wiring board on which sockets for inserting and connecting the terminal pins of the semiconductor chip module are arranged on both sides, and the mother wiring board is erected so as to partition the inner space at the center in a closed box shape. Respective side walls facing both sides of the wiring board are detachable, and suck and support the tip of the circular duct of the semiconductor chip module mounted in the socket. It is configured with a module housing housing in which an inlet is bored and a plurality of exhaust fans are arranged on other side walls.

[Industrial application field]

The present invention relates to a cooling structure for a semiconductor chip module.

2. Description of the Related Art In recent years, electronic circuits used in electronic computers and communication devices have been packaged into a single package in which a large number of semiconductor chips (bare chips) such as LSI are packaged into one package in accordance with the increase in speed and scale.

In many cases, a plurality of semiconductor chip modules (hereinafter, abbreviated as modules) are mounted on a single mother wiring board. Since the modules are for high-speed signals and generate a large amount of heat, they are collectively forcedly cooled by a powerful blower. Uses a cooling structure. However, in the case of a communication device, not all modules are mounted from the beginning, but modules are often added later as the number of lines increases. Therefore, there is a demand for a cooling structure that facilitates module addition and maintenance and repair. There is.

[Conventional technology]

The conventional module 11 is as shown in the perspective view of FIG.
The semiconductor chip 11b in the recess of the rectangular package 11a,
That is, a cooling unit 11 having LSI chips arranged vertically and horizontally and having heat radiation fins 11d-1 sandwiched between them by packing 11c.
d is fixed, and terminal pins 11e are projectingly provided on the mounting surface of the package 11a. This module 11 has a socket 12a of a mother wiring board 12 as shown in a perspective view of FIG.
Is inserted and connected to. The mother wiring board 12 is fixed to the outside of one side wall 13a of the air introduction housing (pressure chamber) 13 so as to face it, and the side wall 13a is provided with air ejection ducts 13a-1 corresponding to the modules 11, respectively. A strong sirocco-shaped blower 13c is fixed to the other lower side wall 13b, and a high-speed airflow is blown from each air ejection duct 13a-1 to the heat radiation fin 11d-1 for forced air cooling.

[Problems to be solved by the device]

However, such a cooling structure is not so problematic in that the necessary number of modules are mounted from the beginning without the need to add the modules, such as the main body of an electronic computer, but the entire front surface of the mother wiring board is not affected. Since an air introduction housing is provided, remove this to add modules.
There is a problem that it is difficult to upgrade the line in an apparatus such as a communication apparatus that adds or replaces a module as the number of lines increases and the structure is not appropriate.

In view of the above problems, it is an object of the present invention to provide a semiconductor chip module cooling structure in which modules can be easily added and replaced in units of modules.

[Means for solving the problem]

In order to achieve the above object, in the cooling structure of the semiconductor chip module of the present invention, a radiator having a radiation fin is fixed to the surface of the insulating substrate, and an intake fan is installed on the radiator in a circular duct with a mounting flange. The cooling unit is installed by screwing, the terminal pin is projected on the peripheral edge of the back surface and the semiconductor chip is arranged in the central part, and the socket for inserting and connecting the terminal pin of the module is arranged on both sides. The installed mother wiring board and the mother wiring board standing in a closed box shape so as to partition the inner space at the center, and the respective side walls facing both sides of the mother wiring board are detachable and mounted on the socket. The module housing has a suction port for inserting and supporting the tip of a circular duct of the module, and a plurality of exhaust fans on the other side wall.

[Action]

Modules connected to the sockets on the mother wiring board can be easily replaced by module by simply removing the side wall of the module housing, and the intake fan attached to each module can be easily replaced by module. . Further, by mounting a socket on the mother wiring board and closing the circular duct in advance, it is possible to easily add modules as needed.

〔Example〕

Hereinafter, the gist of the present invention will be described in detail with reference to the embodiments shown in the drawings.

The cooling structure of the module is composed of a module 1, a mother wiring board 2 and a module housing 3 as shown in the front view of FIG.

As shown in the side view of FIG. 3, the module 1 has a plurality of heat dissipating fins 1b-1 made of a good heat conducting metal on the surface of a rectangular insulating substrate 1a and has screw holes (not shown) on the upper surfaces of the four corners. Fix the body 1b, and then place the cooling unit 1c on the radiator 1b.
Is attached with mounting screw 1d. This cooling unit 1c has a rectangular mounting flange 1c that surrounds the tip half of the radiation fin 1b-1 at one end.
Axial-type intake fan 1c-3 in circular duct 1c-1 with -2
Insert and attach. Further, terminal pins 1e are provided on four sides of the back surface of the insulating substrate 1a, and a plurality of semiconductor chips (LSI chips) 1f are arranged in the central portion.

As shown in FIG. 1, the mother wiring board 2 is provided with female contacts (not shown) for inserting and connecting the terminal pins 1e of the module 1, and the central portion is soldered on both sides with sockets 2a recessed so that the semiconductor chip 1f can escape. It is attached.

As shown in FIGS. 1 and 2, the module housing 3 has a closed box shape, and the mother wiring board 2 is erected by mounting screws 2b so as to partition the internal space at the center position. Then, the side walls 3a on both sides facing both sides of the mother wiring board 2 are fixed with screws 3d with a neck so that they can be attached and detached, and the circular duct 1c- of the module 1 mounted in the socket 2a of the mother wiring board 2 A suction port 3a-1 is formed so that the tip of 1 is inserted and supported. A plurality of (six in the figure) axial flow type exhaust fans 3c are arranged on the other side wall, that is, the upper side wall 3b.

Module 1 connected to socket 2a of mother wiring board 2
Is forcibly air-cooled by the intake fan 1c-3 of the cooling unit 1c provided individually, but the flow of the air flow sucked from the intake fan 1c-3 passes through the radiation fins 1b-1 as shown by the arrow in FIG. As shown by the arrow in FIG. 2, it is drawn between the circular ducts 1c-1 by the exhaust fan 3c on the ceiling and discharged to the outside. (Note that this exhaust fan can also be installed on the left and right side walls to enhance the discharge.) With this configuration, the module connected to the socket of the mother wiring board can be installed in a large air-introducing casing as in the past. By removing only the side wall of the module housing without removing the body, the module can be easily replaced in units of modules, and the intake fan attached to each module can also be easily replaced in units of modules. Further, by mounting a socket on the mother wiring board and closing the circular duct in advance, it is possible to easily add modules as needed.
In addition, the conventional cooling structure requires an air-introducing housing that forms a pressure chamber in order to make the air volume uniform, so the overall structure is large, but the cooling structure of the present invention uses an intake fan and an exhaust fan. Since they are combined, a pressure chamber is not required and the overall structure can be made compact.

In the cooling structure described above, the modules are provided on both sides of the mother wiring board, but the modules may be provided on only one side. In this case, the module can be thinner than the conventional one.

[Effect of device]

As described in detail above, according to the present invention, modules can be easily added or replaced by simply removing the side wall of the module housing, and can be applied to communication devices, etc., and their maintainability and line grade can be improved. It is extremely useful in practice, such as being able to improve expandability such as up and downsize.

[Brief description of drawings]

FIG. 1 is a front view including a partial cutaway of an embodiment according to the present invention, FIG. 2 is a side sectional view of FIG. 1, FIG. 3 is a side view of the module of FIG. 2, and FIG. 5 is a perspective view of a module according to FIG. 5, and FIG. 5 is a perspective view including a partial breakage of a cooling structure according to the prior art. In the figure, 1 is a semiconductor chip module (module), 1a is an insulating substrate, 1b is a radiator, 2 is a mother wiring board, 1b-1 is a radiation fin, 2a is a socket, 1c is a cooling unit, and 3 is a module housing. , 1c-1 is a circular duct, 3a is a side wall, 1c-2 is a mounting flange, 3a-1 is an intake port, 1c-3 is an intake fan, 3b is another side wall (upper side wall), 1e is a terminal pin, 3c is An exhaust fan is shown.

Claims (1)

[Scope of utility model registration request] 1. A radiating fin (1b-on the surface of an insulating substrate (1a).
The heat radiator (1b) having 1) is fixed and the heat radiator (1b) is further fixed.
A cooling unit (1c) with an intake fan (1c-3) installed inside is screwed onto the circular duct (1c-1) with a mounting flange (1c-2) on top, and the terminal pin (1e) is attached to the rear surface periphery. A semiconductor chip module (1) projectingly provided with a semiconductor chip (1f) disposed in the central portion, and the terminal pin (1e) of the semiconductor chip module (1)
A mother wiring board (2) having sockets (2a) for inserting and connecting is provided on both sides, and the mother wiring board (2) is erected so as to partition the inner space at the center in a closed box shape. Each side wall (3a) facing both sides of (2) is detachable, and the socket (2
A suction port (3a-) for inserting and supporting the tip of the circular duct (1c-1) of the semiconductor chip module (1) mounted in a).
1) perforate the other side wall (3b) with multiple exhaust fans (3
A cooling structure for a semiconductor chip module, comprising a module housing (3) in which c) is provided.