JPH08724U - Push switch - Google Patents

Abstract

(57) Abstract: A push switch having a simple structure, formed thin, and easy to manufacture, and a manufacturing method thereof. SOLUTION: Conductor portions 22 and 28 are formed on an insulating substrate 20, a through hole formed in the substrate 20 is cut at a central portion, and electrodes 30 and 32 are provided by the through hole. The tact plate 24 is placed on the conductor portion 28 of the substrate 20 and
Further, the heat-resistant film 36 is directly attached to the tact plate 24 via the adhesive layer 34 so as to be in close contact with each other and fixed to each other.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a push switch used for a contact portion such as an operation panel and a keyboard.

[0002]

[Prior art]

 Conventionally, a push switch used individually as a single unit, as shown in FIG. 11, has an electrode 10 formed by insert molding in an insulating resin such as PBT to form a case 12, and a surface of the case 12 is formed. A tact plate 14 that is slightly curved in a spherical shape is housed, the upper opening of the case 12 is covered with a polyimide sheet 16, and further covered with a metal plate 18 such as SUS.

[0003]

[Problems to be solved by the device]

 In the push switch of the above-mentioned conventional technique, the tact plate 14 is housed in the case 12 formed by insert molding, and the opening is covered with the metal plate 18 or the like. There was a limit to how small it could be, which was an obstacle to making electronic devices smaller and thinner. Furthermore, the shapes of the electrode 10 and the case 12 are complicated, making it difficult to form, and the adhesion between the molding resin and the electrode 10 is poor, resulting in a problem in strength.

The present invention has been made in view of the above-mentioned problems of the conventional technology, and an object thereof is to provide a push switch having a simple structure and a thin shape.

[0005]

[Means for Solving the Problems]

 In this invention, a conductor portion is formed on an insulating substrate, a tact plate forming a contact is placed on the insulating substrate, and a heat resistant film is adhered to the insulating substrate and the tact plate via an adhesive layer to fix them to each other. The push switch is provided with an electrode formed on the end face by a semi-cylindrical through hole connected to the conductor portion.

Further, according to this invention, a conductor pattern is formed on an insulating substrate, a tact plate forming a contact is placed thereon, and a heat resistant film is adhered to the substrate and the tact plate via an adhesive layer to fix them to each other. This is a push switch in which a through hole is formed below the central portion of the tact plate, and a conductor portion connected to the through hole and connected to an electrode on the end surface of the substrate is provided on the back surface of the substrate.

Further, according to the invention, a conductor pattern is formed on an insulating substrate, a tact plate forming a contact is placed on the insulating substrate, and a heat resistant film is adhered to the insulating substrate and the tact plate via an adhesive layer to fix them to each other. This is a push switch in which a metal stud is inserted under the center of the tact plate, the tip of the metal stud is caulked and fixed, and an electrode is provided on the back surface of the substrate.

[0008]

[Action]

 The push switch of this invention has a simple structure, is thin, and has good strength and durability because it is formed only by the thickness of the substrate, the tact plate and the heat resistant film.

[0009]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of the present invention, in which an insulating substrate 20 such as an epoxy copper foil-clad laminate is formed with an arc-shaped conductor portion 22 made of copper foil, and the conductor portion 22 has a spherical surface. The peripheral edge of a tact plate 24, which is made of a metal spring plate and has a curved shape and a central portion swells, contacts. Further, a contact point 26 formed of a part of the copper foil pattern is formed in the central portion of the substrate 20, and a copper foil conductor portion 28 extends from the contact point 26 to the edge portion of the substrate 20. The surface of the conductor portion 28 is covered with a resist or the like (not shown) so as not to short-circuit with the tact plate 24. At one edge of the substrate 20, end face electrodes 30 and 32 are formed by dividing through holes provided with copper foil or conductive paint on the surface. The end face electrodes 30 and 32 have conductor portions 22 respectively. , 26 are connected.

The substrate 20 on which the tact plate 24 is placed is covered with a heat resistant film 36 such as polyimide resin having an adhesive layer 34 of a heat resistant adhesive, and the tact plate 24 is covered with the heat resistant film 36. It is fixed so as to be able to come into contact with the contact 26 between the substrate 20 and the substrate 20.

According to the push switch of this embodiment, since the tact plate 24 is fixed by covering it with the heat resistant film 36 via the adhesive layer 34, the structure is simple, the thickness is extremely thin, and the molten solder Since it can withstand heat, it can be easily mounted on a circuit board. Further, the electrodes 30 and 32 can be easily formed, and the number of manufacturing steps and the cost can be reduced. In addition, the size of the tact plate can be as small as 3φ, and the chip size can be 2.5 x 3 mm and the thickness can be 0.3.

Next, a second embodiment of this invention will be described with reference to FIG. In the push switch of this embodiment, a through hole 38 made of copper foil is formed in the contact 26 formed on the surface of the substrate 20, and the conductor portion 39 on the back surface side of the through hole 38 is connected to one electrode. There is something. The through hole 38 is blocked by the resin 40, and is formed so that dust and dirt do not enter the tact plate 24. Others are formed similarly to the first embodiment.

According to this embodiment, since the conductor portion connected to one of the electrodes is provided on the back surface of the substrate 20, a resist or the like for preventing contact with the tact plate 24 is unnecessary, and the position of the electrode is also free. Can be taken to Further, by using the electrodes in the peripheral portion of the through hole 38, it is possible to arrange more other electronic components around the push switch and increase the mounting density.

Next, a third embodiment of the present invention will be described with reference to FIGS. The push switch of this embodiment has the same structure as the push switch of FIG. 2, and the through hole 42 is formed of a conductive paint such as silver paint. A contact point 44 made of copper foil is formed around the through hole 42, and a through hole 48 is formed at the center of the tact plate 46. The through hole 48 is formed so that it does not come into contact with the conductive paint of the through hole 42, but the peripheral portion of the through hole 48 comes into contact with the contact point 44 of the copper foil. This through hole 42 must be closed inside and have a dustproof effect. The other structure is the same as that of the above-mentioned second embodiment.

According to this embodiment, it is easy to form the through hole 42, and the tact plate 46 does not contact the conductive paint but contacts the contact 44 of the copper foil, so that the durability is high. Further, since the peripheral portion of the through hole 48 of the tact plate 46 contacts the copper foil contact 44, the contact portion is wide and the operation is stable.

Next, a fourth embodiment of the present invention will be described with reference to FIG. In the push switch of this embodiment, similarly to the second embodiment, a through hole is formed and one of the electrodes is provided in the center of the back surface of the substrate 20, and the through hole has a metal tack 50 on the substrate. It is inserted through the through hole 52 in the central portion of 20 and fixed by crimping the tip portion and forming an electrode. The other electrode 54 is provided by fitting a U-shaped metal piece into one end portion of the substrate 20 and contacting a part of the conductor portion 22 for connection. Other configurations are similar to those of the second embodiment.

According to this embodiment, the through hole can be formed more easily and the durability is high. Moreover, the electrodes can be easily formed, and the number of manufacturing steps and the cost can be greatly reduced.

Next, a fifth embodiment of the present invention will be described with reference to FIG. In the push switch of this embodiment, through holes 60 are formed at both edge portions of the substrate 20, and a tact plate 62 in which a central portion of a strip-shaped metal spring plate is curved and inflated is provided, and both ends of the tact plate 62 are provided. The part is inserted into the through hole 60 and the tip part is bent and fixed to the substrate 20. At both ends of the tact plate 62, the central protruding piece 64 is bent in advance and inserted into the through hole 60 by utilizing elasticity, and then the tips of the other protruding pieces 66 protruding from the through hole 60, The protruding pieces 64 are bent in opposite directions. Alternatively, the protruding pieces 64 and 66 may be bent in advance and inserted into the through hole 60 by utilizing the spring property. The protruding piece 64 of the tact plate 62 functions as an electrode and is soldered when it is mounted on the surface of the circuit board.

Further, a through hole 52 is formed in the center of the substrate 20, a metal stud 50 is inserted, and the tip portion is swaged to form an electrode as in the fourth embodiment. The substrate 20 and the tact plate 62 are covered, protected and fixed by a heat resistant film 36 via a heat resistant adhesive layer 34.

According to this embodiment, it is not necessary to form a conductor pattern or an electrode on the substrate, the number of manufacturing steps and the cost can be reduced, and the reliability and durability can be improved. Further, since the strip-shaped tact plate is used, other electronic components can be arranged in other space of the substrate.

Next, a sixth embodiment of the present invention will be described with reference to FIG. In the push switch of this embodiment, a strip-shaped tact plate 72 having the same width as that of the substrate 20 is provided, and a heat-resistant film 74 having substantially the same width is provided so as to cover the tact plate 72 via a heat-resistant adhesive layer 76. It has been pasted. Similar to the sixth embodiment, the electrode is provided by projecting a projecting piece from the through hole in the central portion and the peripheral portion of the tact plate 72 to the back surface side of the substrate 20. The heat resistant film 74 is attached so as to cover the side surface portion and the back surface portion of the substrate 20.

According to this embodiment, since the tact plate 72 is formed in a band shape and is formed to have a width substantially equal to that of the substrate 20, the push switch can be formed in a slender shape, and the degree of integration can be increased. , Contributes to miniaturization of electronic devices.

Next, a seventh embodiment of the present invention will be described with reference to FIG. The push switch of this embodiment is obtained by covering the push switch of the sixth embodiment with a resin case 80. The resin case 80 has an opening 82 formed on the front surface side, is provided so as to be able to press the tact plate 72, and is fixed to the peripheral edge portion on the back surface side of the substrate 20.

According to this embodiment, dust and the like do not enter between the tact plate 72 and the substrate 20, and durability and reliability can be improved.

Next, an eighth embodiment of the present invention will be described with reference to FIG. In the push switch according to this embodiment, the heat resistant film 74 of the push switch according to the sixth embodiment is provided via the adhesive layers 76 so as to cover the four side surfaces of the substrate 20. The heat-resistant film 74 has slits 84 formed in the vicinity of both side edges, and when it is attached to the substrate 20, it is opened as shown in the figure to securely cover and fix the substrate and the tact plate 72. Is.

Next, a ninth embodiment of the present invention will be described with reference to FIG. In the push switch of this embodiment, a through hole 90 is formed in the edge portion of the substrate 20, a heat resistant film 74 is attached to the substrate 20 with a tact plate 72 sandwiched between the resin pin 92 and the heat resistant film 74. The tip 94 is melted and fixed by inserting it from above.

It should be noted that the present invention may be a push switch as a single unit, in which a tact plate is placed on a substrate and the tact plate and the substrate are covered with a heat resistant film via an adhesive layer. Besides, the electrode structure and the shape of the tact plate can be appropriately selected. Further, the pressure-sensitive adhesive layer should have heat resistance, and its material and thickness can be appropriately set.

[0028]

[Effect of device]

 The push switch of this invention has a simple structure because the tact plate is placed on the substrate, covered with a heat resistant film having an adhesive layer, and the tact plate is fixed. Greatly contributes to the reduction in thickness. Moreover, since the heat-resistant film is adhered by the heat-resistant adhesive layer, it can withstand the heat of the molten solder, and the mounting work can be performed efficiently. Furthermore, it has a simple structure, high reliability, and strong strength. In addition, the substrate can be arbitrarily selected according to the application without selecting the type of the substrate. Further, by forming a protruding piece integrally with the tact plate and using this protruding piece as an electrode, cost and durability are improved, and further, it contributes to thinning.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a push switch according to a first embodiment of the present invention.

FIG. 2 is a vertical sectional view of a push switch according to a second embodiment of the present invention.

FIG. 3 is a perspective view of a substrate of a push switch according to a third embodiment of the present invention.

FIG. 4 is a front view of a tact plate of the push switch according to the third embodiment.

FIG. 5 is an exploded perspective view of a push switch according to a fourth embodiment of the present invention.

FIG. 6 is an exploded perspective view of a push switch according to a fifth embodiment of the present invention.

FIG. 7 is a perspective view of a push switch according to a sixth embodiment of the present invention.

FIG. 8 is a partially cutaway perspective view of a push switch according to a seventh embodiment of the present invention.

FIG. 9 is a perspective view of a push switch according to an eighth embodiment of the present invention.

FIG. 10 is a partial sectional view of a push switch according to a ninth embodiment of the present invention.

FIG. 11 is a vertical cross-sectional view of a conventional push switch.

[Explanation of symbols]

 20 Substrate 22,28 Conductor 24,46,72 Tact Plate 30,32 Electrode 34,76 Adhesive Layer 36,74 Heat Resistant Film 64,66 Projecting Piece

Claims (1)

[Scope of utility model registration request] 1. A single push switch in which a conductor portion is formed on an insulating substrate and a tact plate forming a contact is placed in contact with the conductor portion, and a heat resistance is provided on the substrate and the tact plate via an adhesive layer. Stick the films together and fix them together,
A push switch characterized in that an electrode formed by a semi-cylindrical through hole connected to the conductor portion is provided on an end face of the substrate.