JPH08752Y2 - Solid electrolytic capacitor - Google Patents
Solid electrolytic capacitorInfo
- Publication number
- JPH08752Y2 JPH08752Y2 JP3479290U JP3479290U JPH08752Y2 JP H08752 Y2 JPH08752 Y2 JP H08752Y2 JP 3479290 U JP3479290 U JP 3479290U JP 3479290 U JP3479290 U JP 3479290U JP H08752 Y2 JPH08752 Y2 JP H08752Y2
- Authority
- JP
- Japan
- Prior art keywords
- anode
- electrolytic capacitor
- solid electrolytic
- aluminum
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003990 capacitor Substances 0.000 title claims description 23
- 239000007787 solid Substances 0.000 title claims description 22
- 229910052782 aluminium Inorganic materials 0.000 claims description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 21
- 239000003792 electrolyte Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 39
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 8
- 229920000128 polypyrrole Polymers 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000007784 solid electrolyte Substances 0.000 description 2
- PCCVSPMFGIFTHU-UHFFFAOYSA-N tetracyanoquinodimethane Chemical compound N#CC(C#N)=C1C=CC(=C(C#N)C#N)C=C1 PCCVSPMFGIFTHU-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 この考案は、固体電解コンデンサに関し、特に有機導
電性化合物を利用したチップ形の固体電解コンデンサの
改良にかかる。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a solid electrolytic capacitor, and more particularly to improvement of a chip type solid electrolytic capacitor using an organic conductive compound.
近年の電子機器の小型化、プリント基板への実装の効
率化等の要請から電子部品のチップ化が進められてい
る。これに伴い、電解コンデンサのチップ化の要請が高
まっている。In recent years, electronic components have been made into chips due to demands for miniaturization of electronic devices and efficient mounting on a printed circuit board. Along with this, there is an increasing demand for making electrolytic capacitors into chips.
固体電解コンデンサは、一般的に、表面に酸化皮膜層
が形成されたタンタル等からなる陽極体に、例えば二酸
化マンガン等からなる固体電解質層を形成した構成から
なり、小型化が比較的容易であることから、チップ化が
進んでいる。A solid electrolytic capacitor is generally made up of a structure in which a solid electrolyte layer made of, for example, manganese dioxide is formed on an anode body made of tantalum or the like having an oxide film layer formed on the surface thereof, and it is relatively easy to downsize. Therefore, it is becoming a chip.
しかしながら、従来の固体電解コンデンサでは静電容
量範囲が0.1〜10μＦ程度に限られてしまう。However, the capacitance range of the conventional solid electrolytic capacitor is limited to about 0.1 to 10 μF.
ところで、近年テトラシアノキノジメタン（TCNQ）、
ポリピロール等の有機導電性化合物を固体電解コンデン
サに応用したものが提案されている。By the way, recently, tetracyanoquinodimethane (TCNQ),
It has been proposed to apply an organic conductive compound such as polypyrrole to a solid electrolytic capacitor.
これらの有機導電性化合物を使用した固体電解コンデ
ンサは、従来の二酸化マンガン等の金属酸化物半導体か
らなる固体電解質と比較して電導度が高く、特にポリピ
ロールは電解質がポリマー化しているため耐熱性にも優
れることから、チップ化に最適と言われている。Solid electrolytic capacitors using these organic conductive compounds have higher electrical conductivity than conventional solid electrolytes composed of metal oxide semiconductors such as manganese dioxide, and polypyrrole is particularly heat resistant because the electrolyte is polymerized. It is said that it is optimal for chipping because it is excellent.
このポリピロールは、ピロールの化学重合、電解重合
あるいは気相重合等によって陽極体表面に生成されてい
る。ところが、このポリピロール自体の機械的強度は弱
く、電極の引き出し構造によっては、接続工程中にリー
ド線等が電解質層を破壊してしまうことがあった。ある
いは、接続工程の後にリード線にかかる機械的なストレ
スが電解質層に影響を与え、所望の特性を得ることが困
難になることがあった。This polypyrrole is produced on the surface of the anode body by chemical polymerization, electrolytic polymerization, vapor phase polymerization or the like of pyrrole. However, the mechanical strength of the polypyrrole itself is weak, and the lead wire or the like may break the electrolyte layer during the connecting step depending on the electrode lead structure. Alternatively, the mechanical stress applied to the lead wire after the connecting step may affect the electrolyte layer, making it difficult to obtain desired characteristics.
この考案の目的は、微細なチップ形の固体電解コンデ
ンサにおいて、電極引出し用端子の接続状態を良好に保
持し、信頼性の高い固体電解コンデンサを実現すること
にある。An object of the present invention is to realize a solid electrolytic capacitor having a high reliability by maintaining a good connection state of electrode lead-out terminals in a fine chip type solid electrolytic capacitor.
この考案は、固体電解コンデンサにおいて、酸化皮膜
層、電解質層および導電層が順次生成された凹部を備え
た平板状の陽極体を、帯状の陰極体の両面に配置すると
ともに、少なくとも一部に半田付け可能な金属からなる
接続部が形成された帯状の陽極端子を、陽極体の所望の
側面に溶接したことを特徴としている。そして、前記陽
極端子が、半田付け可能な金属とアルミニウムとのクラ
ッド材、もしくは一方の表面に半田付け可能な金属を蒸
着したアルミニウムからなることを特徴としている。According to the invention, in a solid electrolytic capacitor, a flat plate-shaped anode body having a concave portion in which an oxide film layer, an electrolyte layer, and a conductive layer are sequentially formed is arranged on both sides of a strip-shaped cathode body, and at least a part thereof is soldered. It is characterized in that a strip-shaped anode terminal on which a connection part made of attachable metal is formed is welded to a desired side surface of the anode body. Further, the anode terminal is characterized by being made of a clad material of a solderable metal and aluminum, or of aluminum having a solderable metal deposited on one surface thereof.
図面に示すように、この考案では、機械的に脆弱な電
解質層３、例えばポリピロール層は、導電層４とともに
陽極体１の一部に形成した凹部６に形成され、相対的な
凸部７に囲繞されることになる。そして、この陽極体１
を帯状の陰極体５の両面に配置している。そのため、電
解質層３は、強固な陽極体１によって外部から遮断され
ることになる。また、陰極体５の両面に陽極体１を配置
することで、電解質層３と陰極体５との電気的な接続を
行うことができるので、接続構造が簡略となるととも
に、陰極体５をそのまま外部接続用の端子とすることが
できる。As shown in the drawings, in the present invention, a mechanically weak electrolyte layer 3, for example, a polypyrrole layer is formed in a concave portion 6 formed in a part of the anode body 1 together with the conductive layer 4, and a relative convex portion 7 is formed. You will be surrounded. And this anode body 1
Are arranged on both sides of the strip-shaped cathode body 5. Therefore, the electrolyte layer 3 is shielded from the outside by the strong anode body 1. Further, by disposing the anode body 1 on both sides of the cathode body 5, the electrolyte layer 3 and the cathode body 5 can be electrically connected, so that the connection structure is simplified and the cathode body 5 is left as it is. It can be a terminal for external connection.
また、陽極体１に溶接される陽極端子２は、例えばア
ルミニウムと半田付け可能な銅とのクラッド材からな
る。そして、アルミニウムからなる陽極体１との当接部
2bにおいては、陽極端子２のアルミニウムからなる表面
を配置し、プリント基板の配線パターンに臨む接続部2a
においては、半田付け可能な銅を配置している。そのた
め、陽極端子２と陽極体１との溶接、例えば超音波溶接
が容易になるとともに、この固体電解コンデンサをプリ
ント基板に実装して半田付けすることが可能になる。The anode terminal 2 welded to the anode body 1 is made of, for example, a clad material of aluminum and solderable copper. And the contact portion with the anode body 1 made of aluminum
In 2b, the surface of the anode terminal 2 made of aluminum is arranged, and the connection portion 2a facing the wiring pattern of the printed circuit board is formed.
In, the solderable copper is arranged. Therefore, the welding of the anode terminal 2 and the anode body 1, for example, ultrasonic welding is facilitated, and this solid electrolytic capacitor can be mounted on a printed board and soldered.
次いでこの考案の実施例を図面にしたがい説明する。 Next, an embodiment of the present invention will be described with reference to the drawings.
第１図は、この考案の実施例による固体電解コンデン
サの構造を示す分解斜視図、第２図は実施例による固体
電解コンデンサの概念構造を示した部分断面図、第３図
は実施例による固体電解コンデンサを示した斜視図であ
る。1 is an exploded perspective view showing a structure of a solid electrolytic capacitor according to an embodiment of the present invention, FIG. 2 is a partial sectional view showing a conceptual structure of a solid electrolytic capacitor according to the embodiment, and FIG. 3 is a solid structure according to the embodiment. It is the perspective view which showed the electrolytic capacitor.
板状の陽極体１は、アルミニウム等の弁作用金属から
なり、第１図に示したように、その一部に深さ約100μ
ｍの選択的な凹部６が形成されている。この凹部６は、
プレス加工、切削加工等による機械的加工もしくは化学
エッチング加工等による化学的処理のいずれの手段を用
いて形成してもよい。そしてこの凹部６内は、表面積は
拡大するためにエッチング処理、例えば電解エッチング
処理が施されている。The plate-shaped anode body 1 is made of a valve metal such as aluminum and has a depth of about 100 μm in a part thereof as shown in FIG.
m selective recesses 6 are formed. This recess 6 is
It may be formed by any means of mechanical processing such as press working and cutting, or chemical processing such as chemical etching. The inside of the recess 6 is subjected to etching treatment, for example, electrolytic etching treatment, in order to increase the surface area.
更に、エッチング処理を施された凹部６の表面は、化
成処理が施されて酸化皮膜層が形成されている。この酸
化皮膜層は、アルミニウムからなる陽極体１の表層が酸
化した酸化アルミニウムからなり、誘電体となる。Further, the surface of the recessed portion 6 that has been subjected to the etching treatment is subjected to a chemical conversion treatment to form an oxide film layer. This oxide film layer is made of aluminum oxide obtained by oxidizing the surface layer of the anode body 1 made of aluminum and becomes a dielectric.
また凹部６には、一方の端部付近を覆う樹脂層８がス
クリーン印刷等の手段で被覆されている。この樹脂層８
は、耐熱性の合成樹脂、例えばフェノール樹脂等からな
る。The recess 6 is covered with a resin layer 8 that covers the vicinity of one end by means of screen printing or the like. This resin layer 8
Is made of heat-resistant synthetic resin such as phenol resin.
そして、この樹脂層８の非被覆面には、第２図に示し
たように、ポリピロールからなる電解質層３が生成され
る。この電解質層３であるポリピロール層は、陽極体１
を酸化剤を含有するピロール溶液中に浸漬し、凹部６に
化学重合によるピロール薄膜を形成したのち、ピロール
を溶解した電解重合用の電解液中に浸漬するとともに電
圧を印加して生成しており、その厚さは数μｍないし数
十μｍとなる。Then, on the non-coated surface of the resin layer 8, the electrolyte layer 3 made of polypyrrole is formed as shown in FIG. The polypyrrole layer, which is the electrolyte layer 3, is used as the anode body 1.
Is immersed in a pyrrole solution containing an oxidant to form a pyrrole thin film by chemical polymerization in the recesses 6, and then is immersed in an electrolytic solution for electrolytic polymerization in which pyrrole is dissolved, and a voltage is applied to generate. The thickness is several μm to several tens μm.
更に、この電解質層３の表面には、導電層４がスクリー
ン印刷されており、その結果、陽極体１の凹部６には、
第２図に示したように、電解質層３および導電層４が順
次生成されていることになる。この導電層４は、カーボ
ンペーストおよび銀ペーストからなる多層構造、もしく
は導電性の良好な金属粉を含有する導電性接着剤からな
る単層構造の何れでもよい。Further, the conductive layer 4 is screen-printed on the surface of the electrolyte layer 3, and as a result, the recess 6 of the anode body 1 is
As shown in FIG. 2, the electrolyte layer 3 and the conductive layer 4 are sequentially generated. The conductive layer 4 may have either a multi-layer structure made of carbon paste and silver paste or a single-layer structure made of a conductive adhesive containing metal powder having good conductivity.
陰極体５は、第１図に示すように、帯状のアルミニウ
ムもしくはその合金からなる。この陰極体５の両面に、
複数の陽極体1a、1bを、その導電層４が互いに対面する
ように配置して接合し、必要に応じて超音波溶接してい
る。As shown in FIG. 1, the cathode body 5 is made of strip-shaped aluminum or its alloy. On both sides of this cathode body 5,
A plurality of anode bodies 1a and 1b are arranged and joined so that their conductive layers 4 face each other, and ultrasonically welded as necessary.
各陽極体1a、1bの所望の側面には突起９が設けられ、
この突起９において陽極引き出し用の陽極端子２を陽極
体1a、1bに溶接する。陽極端子２は、陽極体1a、1bと当
接する一方の表面2bにアルミニウムを配置し、プリント
基板の配線パターンに臨む接続部2aに半田付け可能な金
属、例えば銅等を接合したクラッド材からなる。この陽
極端子２のアルミニウムからなる表面2bを陽極体1a、1b
に当接するとともに、超音波溶接等の手段で溶接して、
第３図に示したような固体電解コンデンサが得られる。Protrusions 9 are provided on desired side surfaces of each anode body 1a, 1b,
At this protrusion 9, the anode terminal 2 for drawing out the anode is welded to the anode bodies 1a and 1b. The anode terminal 2 is made of a clad material in which aluminum is placed on one surface 2b that abuts on the anode bodies 1a and 1b, and a solderable metal, for example, copper or the like is joined to the connecting portion 2a facing the wiring pattern of the printed circuit board. . The surface 2b made of aluminum of this anode terminal 2 is connected to the anode bodies 1a, 1b.
Abutting against, and welding by means such as ultrasonic welding,
A solid electrolytic capacitor as shown in FIG. 3 is obtained.
なお、図示しないが、陽極体1a、1bの外表面に絶縁処
理を施して、陽極体1a、1bに接続した陽極端子２および
陰極体５の先端を陽極体1a、1bの側面に沿って折り曲げ
て密着させてもよい。Although not shown, the outer surfaces of the anode bodies 1a and 1b are subjected to insulation treatment, and the tips of the anode terminals 2 and the cathode bodies 5 connected to the anode bodies 1a and 1b are bent along the side surfaces of the anode bodies 1a and 1b. May be closely attached.
以上のような固体電解コンデンサでは、第２図に示し
たように、陽極体1a、1bが陰極体５の両面に配置され、
各陽極体1a、1bの電解質層３は導電層４を介して、挟み
込むように陰極体５と接続されるので、電解質層３と陰
極体５との電気的な接続構造が簡略になる。In the solid electrolytic capacitor as described above, as shown in FIG. 2, the anode bodies 1a and 1b are arranged on both sides of the cathode body 5,
Since the electrolyte layer 3 of each anode body 1a, 1b is connected to the cathode body 5 via the conductive layer 4 so as to be sandwiched, the electrical connection structure between the electrolyte layer 3 and the cathode body 5 is simplified.
また、陽極体1a、1bと陽極端子２とは、アルミニウム
からなる陽極体1a、1bと同質の陽極端子２のアルミニウ
ムからなる表面2bにおいて溶接されるため、接合性が良
好であり、強固な接合状態を得ることができるととも
に、その反対面である接続部2aに配置された銅等の半田
付け可能な金属によりプリント基板の配線パターンと半
田付けすることが容易になる。Further, since the anode bodies 1a, 1b and the anode terminal 2 are welded on the surface 2b made of aluminum of the anode body 1a, 1b made of aluminum of the same quality as the anode bodies 1a, 1b made of aluminum, the joining property is good and a strong joint is formed. The state can be obtained, and soldering with a solderable metal such as copper disposed on the connection surface 2a, which is the opposite surface, facilitates soldering to the wiring pattern of the printed board.
なお、この実施例において陽極端子２は、アルミニウ
ムと銅からなるクラッド材を使用したが、アルミニウム
の表面に銅等の半田付け可能な金属を蒸着したものを使
用してもよい。In this embodiment, the anode terminal 2 uses a clad material made of aluminum and copper, but a solderable metal such as copper may be deposited on the surface of aluminum.
以上のようにこの考案は、固体電解コンデンサにおい
て、酸化被膜層、電解質層および導電層が順次生成され
た凹部を備えた平板状の陽極体を、帯状の陰極体の両面
に配置するとともに、少なくとも一部に半田付け可能な
金属からなる接続部が形成された帯状の陽極端子を、陽
極体の所望の側面に溶接したことを特徴とし、具体的に
は、陽極端子が、半田付け可能な金属とアルミニウムと
のクラッド材もしくは一方の表面に半田付け可能な金属
を蒸着したアルミニウムからなることを特徴としている
ので、陰極は、陽極体を陰極体の両面に配置するだけで
外部に引き出せるとともに、陽極側の引き出しも、一部
に半田付け可能な金属が形成された陽極端子を強固な陽
極体に溶接して外部に引き出せる。そのため、両電極の
接続構造が簡略であり、製造工程が容易となるほか、安
定した接続状態を長期にわたり維持することができる。As described above, according to the present invention, in the solid electrolytic capacitor, the flat plate-shaped anode body having the concave portion in which the oxide film layer, the electrolyte layer and the conductive layer are sequentially formed is arranged on both sides of the strip-shaped cathode body, and at least A band-shaped anode terminal, in which a connection part made of a solderable metal is formed, is welded to a desired side surface of the anode body. Specifically, the anode terminal is a solderable metal. It is characterized by being made of a clad material of aluminum and aluminum or of aluminum with a solderable metal vapor-deposited on one surface, so that the cathode can be pulled out to the outside simply by disposing the anode body on both sides of the cathode body. Also for the side pull-out, the anode terminal having a part of solderable metal formed thereon can be welded to a strong anode body and pulled out to the outside. Therefore, the connection structure of both electrodes is simple, the manufacturing process is easy, and a stable connection state can be maintained for a long time.
また、陽極体と陰極端子との接合も、同質のアルミニ
ウムを溶接することになるため、強固な接合状態が実現
できる。Further, since the same quality aluminum is welded to the anode body and the cathode terminal, a strong joint state can be realized.
更に、陽極端子に対する外部からのストレスも陽極端
子が陽極体にのみ接続されているため、内部の電解質層
に影響することはない。そして、陰極端子となる陰極体
へのストレスも複数の陽極体の挟み込みによって吸収さ
れ、内部の電解質層に対するストレスは軽減される。そ
のため、電解質層の電気的特性を維持することが容易に
なる。Further, external stress on the anode terminal does not affect the internal electrolyte layer because the anode terminal is connected only to the anode body. Then, the stress on the cathode body that serves as the cathode terminal is also absorbed by the sandwiching of the plurality of anode bodies, and the stress on the internal electrolyte layer is reduced. Therefore, it becomes easy to maintain the electrical characteristics of the electrolyte layer.
第１図は、この考案の実施例による固体電解コンデンサ
の構造を示す分解斜視図、第２図は実施例による固体電
解コンデンサの概念構造を示した部分断面図、第３図は
実施例による固体電解コンデンサを示した斜視図であ
る。 １……陽極体、２……陽極端子、３……電解質層、４…
…導電層、５……陰極体、６……凹部、７……凸部、８
……樹脂層、９……突起。1 is an exploded perspective view showing a structure of a solid electrolytic capacitor according to an embodiment of the present invention, FIG. 2 is a partial sectional view showing a conceptual structure of a solid electrolytic capacitor according to the embodiment, and FIG. 3 is a solid structure according to the embodiment. It is the perspective view which showed the electrolytic capacitor. 1 ... Anode body, 2 ... Anode terminal, 3 ... Electrolyte layer, 4 ...
... conductive layer, 5 ... cathode body, 6 ... recess, 7 ... projection, 8
…… Resin layer, 9 …… Protrusions.
Claims (3)
生成された凹部を備えた平板状の陽極体を、帯状の陰極
体の両面に配置するとともに、少なくとも一部に半田付
け可能な金属からなる接続部が形成された帯状の陽極端
子を、陽極体の所望の側面に溶接したことを特徴とする
固体電解コンデンサ。1. A metal capable of being soldered to at least a part of a strip-shaped cathode body, on which flat plate-shaped anode bodies having recesses in which an oxide film layer, an electrolyte layer and a conductive layer are sequentially formed are arranged. A strip-shaped anode terminal on which a connecting portion made of is formed is welded to a desired side surface of an anode body.
ルミニウムとのクラッド材からなることを特徴とする請
求項１記載の固体電解コンデンサ。2. The solid electrolytic capacitor according to claim 1, wherein the anode terminal is made of a clad material of solderable metal and aluminum.
能な金属を蒸着したアルミニウムからなることを特徴と
する請求項１記載の固体電解コンデンサ。3. The solid electrolytic capacitor according to claim 1, wherein the anode terminal is made of aluminum on one surface of which a solderable metal is vapor deposited.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3479290U JPH08752Y2 (en) | 1990-03-30 | 1990-03-30 | Solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3479290U JPH08752Y2 (en) | 1990-03-30 | 1990-03-30 | Solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03126040U JPH03126040U (en) | 1991-12-19 |
| JPH08752Y2 true JPH08752Y2 (en) | 1996-01-10 |
Family
ID=31539575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3479290U Expired - Lifetime JPH08752Y2 (en) | 1990-03-30 | 1990-03-30 | Solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08752Y2 (en) |
-
1990
- 1990-03-30 JP JP3479290U patent/JPH08752Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03126040U (en) | 1991-12-19 |
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