JPH087531B2 - High-density LED light emitting display - Google Patents

Description

Detailed Description of the Invention

[0001]

This invention relates to a high density LED (Li
light emitting diode (light emitting diode), and in particular, high density LE in the same area.
The present invention relates to a high-density LED light emitting display in which D is arranged and which has a high-luminance light emitting property.

[0002]

2. Description of the Related Art At present, the display means using an optical light emitting medium is commercialized one after another, and the urban environment is colorful and vivid, and there is no time to rest the eyes. As a light-emitting medium, LED light-emitting indicators are used everywhere such as signboards and light-emitting displays, but due to their own drawbacks, there are many failures or damages.
There was also an aspect that it was inconvenient to use and wasted economically.

In FIG. 8, a conventional LED lamp 30 is used.
Is a single light emitting display in which an LED 31 is sealed in a plastic capsule 32, and is mounted on a substrate (not shown) via external terminals 33 and 34. LE like this
Since the density of the D lamp 30 is limited by the volume of the capsule 32, the emission brightness of the D lamp 30 is unavoidably low. Further, since the LED lamps 30 are basically mounted one by one, it is difficult to fully automate the manufacturing process and the cost is increased, and it is also necessary to rely on manpower. For example, as shown in FIG. Since the LED lamp 30 becomes inclined in the three-dimensional space, a problem of uneven emission angle occurs, and the output light beam cannot be concentrated in a predetermined range, resulting in a disadvantage that the emission brightness decreases. .

Further, it is impossible to make the single LED lamp 30 extremely small due to the limitation of the material of the LED sealing resin, and if it is made too small, the mounted external terminal 3 is mounted.
Since the capsule 32 is cracked when the acting force is applied to the LED lamps 3, 34, the LED lamp 30 that can be mounted in the same area
There was a limit to the number, and it was not possible to achieve high density, and the emission brightness was also low.

Furthermore, in addition to the drawbacks described above, the conventional light emitting display in which the LED lamp 30 is combined has the following drawbacks.
The most troublesome problem is that it cannot be repaired. Even if one LED of the entire board fails, LE
Since the D emission display itself could not be used,
As a manufacturer, there was a big hesitation in manufacturing a large-sized LED light-emitting display, and as a consumer, it was easy to break down and the price was high, so I couldn't stand it.

[0006]

The problem to be solved by the present invention is that the conventional LED light emitting display has a low light emission brightness, is expensive, and cannot be repaired even if it breaks down.

[0007]

According to the present invention, a large number of micro substrates, each having a base portion as one end and a conductive piece as an extension and the other end as an outer end portion, are molded from one metal thin plate, and Each LED is arranged on the base part and each LED is
A high-density LED light-emitting display in which electrical connection is made in sequence from one to the base parts of adjacent micro-substrates in that order, and then the outer end is projected outside the encapsulating resin while encapsulating with an encapsulating resin. The base portion is provided in a bowl shape so as to condense the light rays emitted from the LEDs and output the light, and a protrusion is provided on one side of the base portion to adjoin the LEs.
The sealing resin is provided with an upper cover and a pedestal having a cross-sectional area smaller than that of the upper cover, and a combination of the upper cover and the pedestal seals all LEDs inside. A density LED light emitting display is provided. In addition, at least two of the above-mentioned minute boards extend two conductive pieces from the base part and use the other end of one conductive piece as an outer end portion for power supply connection and the other conductive piece. The other end of the LED is electrically connected to the outer end of the micro substrate which is next in series from the LED or conductor in the failed state when one of the LEDs or one of the conducting wires for electrical connection is in the defective state. It is possible to repair it by re-activating the other LEDs that are not in failure to emit light. Further, at least one pair of adjacent micro substrates is
A short-circuit piece that connects between the two outer ends of the sealing resin that are projected to the outside is provided, and the short-circuit piece is cut during the repair to activate the spare LED for light emission.

[0008]

The present invention reduces the manufacturing cost by mass production by an automatic machine according to the above-mentioned structure, arranges LEDs at high density, and has an LE recessed in a bowl shape in the base portion.
Since the light rays emitted from D are focused and output as light, the emission brightness thereof is significantly improved. Further, even if the LED or the conducting wire is in a failure state, by connecting the outer end portion projecting from the sealing resin of the micro substrate with the conducting wire, other LEDs can be continuously made to emit light, and the two external LEDs can be emitted. It is possible to maintain the original light emission brightness by cutting off the short-circuit piece connecting the end portions and operating the spare LED to emit light.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG. 1, a high density LED light emitting display 1 of the present invention comprises a large number of micro substrates 2, each of which has a disk-shaped base portion 3 at one end thereof.
It usually has a conductive piece 4 extending outward from the base portion 3 by one, and the other end of the minute substrate 2, that is, an outer end portion 5 of the conductive piece 4. And the LED light emitting display 1 is
The base portion 3, the mounting hole 6 recessed in a bowl shape on the base portion 3, and the LED 7 mounted inside the mounting hole 6.
A protrusion 8 provided on one side of the base portion 3, a lead wire 9 for electrically connecting the LED 7 and the protrusion 8, and a plurality of minute substrates 2 in a disk shape in this embodiment except for each outer end portion 5. The sealing resin 10 for sealing is used as an internal component.

In FIG. 2, a high density LED light emitting display 1 of the present invention has a hemispherical upper cover 11 as an external component and an outer diameter smaller than the inner diameter of the upper cover 11 and has a cross-sectional area. Pedestal 12 that is one size smaller
And has a structure in which the sealing resin 10 is hermetically sealed except for the power supply connecting outer end portions 13 and 14.

Referring to FIGS. 3 to 6, the process of manufacturing the high density LED light emitting display 1 of the present invention will be mainly described.
It consists of 6 steps: material punching, hole punching, LED attachment, wire bonding, resin sealing and peripheral removal.

As shown in FIG. 3, the material punching is performed by first punching a metal thin plate 15 having a thickness of 0.6 mm into a pattern as shown by a precision press (not shown). The part 3, the conductive piece 4, and the protrusion 8 are molded. In punching, each base part 3 is dented in a bowl shape with another die to form a mounting hole 6 (FIG. 4). For LED mounting, first apply conductive resin (conductive adhesive) to the mounting holes 6 and then mount the LED 7 on a computer program controlled automatic dice mounting machine.
e, not shown), and the state shown in FIG. 5 is obtained. Wire bonding is performed by automatic bonding equipment (Aut
By electrically connecting the LED 7 mounted in the mounting hole 6 with a wire bond machine (not shown) and the projection 8 of the base portion 3 with a conductive wire 9, a series state is obtained as shown in FIG. As for the resin sealing, the necessary parts are sealed with the sealing resin 10 when the above four steps are completed, and all the LEDs 7 are sealed inside the sealing resin 10 as shown in FIG. 7. To remove the periphery, a thin metal plate 15 (see FIG. 7) outside the sealing resin 10 is cut to a required length by an automatic cutting machine, and as shown in FIG. 1, the high-density LED light emitting display 1 according to the present invention is cut. Complete the internal structure.

Next, the main features of each step will be described. <1> In the material punching step, as shown in FIGS.
As shown in FIG. 3, when punching the thin metal plate 15 with a precision press, in addition to the minute substrate 2 described above, at least two power source minute substrates 2a and 2b are simultaneously formed. At this time, the two conductive pieces 4 and 4 are extended from the base portion 3 and at the same time, ordinary short outer end portions 5 and 5 and long outer end portions 13 and 14 for power supply connection are provided. Further, it is preferable that at least two sets of spare micro-boards 2c and 2d are simultaneously formed, and short-circuit pieces 50 and 50 connecting the outer end portions 5 and 5 are provided to serve as repair members. That is, when the LED 70 of the positive-side power supply micro-board 2a is broken or the conductor 9 is broken, the outer end 5 is electrically connected to the outer end 5 of the micro-board 2e having the normal LED 71 by the conductor 9 ( Both can be repaired (not shown), and by cutting the short-circuit piece 50, the LEDs 7 of the preliminary micro substrates 2c and 2d can be activated to maintain the emission brightness. That is,
For example, when the LED 70 of the minute substrate 2a fails or the conducting wire 9 is broken, the outer end portion 5 of the substrate 2a is set to the normal LE level.
The LED 70 is short-circuited by electrically connecting the outer end portion 5 of the micro substrate 2e having the D71 with a lead wire (not shown), and at the same time, the short-circuit piece 50 is cut to cut the preliminary micro substrate 2c or 2d.
The LED 7 can be made to emit light. The reason is that unless the short-circuit piece 50 is cut off, the electric conduction between the LED 7 and the lead wire 9 is smaller than the electric conductivity of only the short-circuit piece, so that the current always flows through the short-circuit piece 50 and the LED 7 does not emit light, but the short-circuit piece 50 does not emit light. This is because the current will flow through the LED 7 by disconnecting. Then, by performing the processing as described above, the LED 70 does not emit light, but the LED 7 emits light, so that the LED emission display device 1 as a whole maintains the emission brightness.

<2> In the wire bonding step, stitch bonding is employed to electrically connect the micro substrates 2, 2a, 2b, 2c, 2d, 2e in series. <3> In the peripheral removal step, the two conductive pieces 4, 4
The micro boards 2a and 2b for the power source having the above are provided, and the outer end portions 13 and 14 longer than the outer end portions 5 and 5 having the normal length are used for connecting the power source.

1 and 2, the upper cover 11 according to the present invention has a hemispherical shape, but the shape is not limited to the hemispherical shape, and the pedestal 12 has the upper cover 1.
It is formed so as to have a cross-sectional area smaller than 1 so as not to damage the upper cover 11 by soldering or the like during repair. In addition, inside the upper cover 11, each of the minute substrates 2, 2a, 2b sealed with the sealing resin 10 of FIG.
2c, 2d, 2e are protected and the sealing resin 10
Since the outer end portions 5 and 5 protruding from each are bent perpendicularly to one plane indicated by the line VV in FIG. 2 by 90 degrees, the long outer end portions 13 from the power source minute boards 2a and 2b,
High density L of the present invention can be obtained by simply projecting only 14 out of the pedestal 12 and inserting it into a power socket (not shown).
The necessary power is supplied to the ED light emitting display.

When power is supplied from the long outer end portions 13 and 14, each LED 7 is activated to emit light through the conductor 9. At this time, since the LED 7 is arranged inside the mounting hole 6 which is recessed in a bowl shape, the light rays emitted from the LED 7 are focused in one direction and output as light. Therefore, the luminous efficiency from the LEDs 7 can be maximized, and the LEDs 7 are denser and denser than in the past, so that stronger luminous properties and luminous brightness can be achieved.

Next, when the LED 7 of any one of the minute boards 2 fails or the conductor 9 connecting the two minute boards 2 is broken, all the minute boards 2 are in series, so that the conventional LED is used. Although the light emitting display itself cannot be used, in the high density LED light emitting display 1 of the present invention, the outer end portion 5 related to the LED or the wire having the problem is electrically connected to the normal outer end portion 5. High density LE just by doing
The D light emitting display 1 can be repaired and continuously used. Further, since the spare LED 7 operates to emit light only by cutting the short-circuit piece, the original light emission brightness can be maintained.

[0018]

As is clear from the above description, the high-density LED light emitting display of the present invention has a structure that can be mass-produced by an automatic machine, so that the cost can be reduced and
Not only can it be repaired and used continuously, but it can also maintain the original light emission brightness after repairing, so it is highly practical to pave the way for the manufacture of large-sized LED light-emitting displays that manufacturers have been reluctant to do so far. Has become. In addition, because it has excellent luminous sensitivity and good dust resistance, it is a high-density L that can be used outdoors.
An ED light emitting display can be provided.

[Brief description of drawings]

FIG. 1 is a plan view showing an internal structure of a high density LED light emitting display according to the present invention.

FIG. 2 is a side view showing an external structure of a high density LED light emitting display according to the present invention.

FIG. 3 is a plan view showing a material punching step in the manufacturing process of the high density LED light emitting display according to the present invention.

FIG. 4 is a plan view showing a punching step in the manufacturing process of the high density LED light emitting display according to the present invention.

FIG. 5 is a plan view showing an LED attaching step in the manufacturing process of the high density LED light emitting display according to the present invention.

FIG. 6 is a plan view showing a step of line bonding in the manufacturing process of the high density LED light emitting display according to the present invention.

FIG. 7 is a plan view showing resin sealing and peripheral removal steps in the manufacturing process of the high density LED light emitting display according to the present invention.

FIG. 8 is a perspective view showing a known LED lamp.

FIG. 9 is a partial cross-sectional perspective view showing a known LED light emitting display.

[Explanation of symbols]

 1 High Density LED Light Emitting Display 2 Micro Substrate 2a Power Micro Substrate 2b Power Micro Substrate 2c Spare Micro Substrate 2d Spare Micro Substrate 3 Circular Base 4 Conductive Piece 5 Outer End 6 Mounting Hole 7 LED 8 Protrusion 9 Conductor 10 Sealing resin 11 Upper cover 12 Pedestal 13 Long outer end portion 14 Long outer end portion 15 Metal thin plate 50 Short-circuit piece 70 LED 71 LED

Claims (3)

[Claims] 1. A plurality of minute substrates each having a base portion as one end and a conductive piece extending and a second end as an outer end portion are molded from one thin metal plate, and LEDs are arranged on the base portion. A high-density LED light emitting display in which each LED is electrically connected to a base portion of an adjacent minute substrate in series in order and then sealed with a sealing resin, and at the same time, the outer end portion is projected to the outside of the sealing resin. The base portion is concavely provided in a bowl shape and focuses light rays emitted from the LEDs to output the light, and a protrusion is provided on one side of the base portion to connect to adjacent LEDs. It is used for connection, and the sealing resin has an upper cover and a pedestal having a cross-sectional area smaller than that of the upper cover, and all the LEDs are sealed inside by a combination of the upper cover and the pedestal. High density LED light-emitting display device according to claim. 2. At least two micro boards among the above micro boards extend two conductive pieces from a base part to make the other end of one conductive piece an outer end for power supply connection, and the other one. When one of the LEDs or one of the electrical connection conducting wires is in the failure state, the other end of the conductive piece of is the outer end portion of the micro substrate which is the next in series order from the LED or the conducting wire in the failure state. Other L which is not broken down by reconnecting to
2. The high-density LED light emitting display according to claim 1, which can be repaired by causing the ED to emit light. 3. At least one set of adjacent ones of the micro substrates is provided with a short-circuit piece that connects two outer end portions of the sealing resin, which protrude to the outside, and cuts the short-circuit piece during the repair. 3. The density LED light emitting display according to claim 1, wherein the spare LED is operated to emit light.