JPH087733A - Contact resistance vibration reduction method and device between contacts - Google Patents

Contact resistance vibration reduction method and device between contacts

Info

Publication number
JPH087733A
JPH087733A JP13534894A JP13534894A JPH087733A JP H087733 A JPH087733 A JP H087733A JP 13534894 A JP13534894 A JP 13534894A JP 13534894 A JP13534894 A JP 13534894A JP H087733 A JPH087733 A JP H087733A
Authority
JP
Japan
Prior art keywords
contact
vibration
contacts
contact resistance
spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13534894A
Other languages
Japanese (ja)
Inventor
Shinsuke Iihashi
真輔 飯橋
Hiroshi Hosaka
寛 保坂
Reizo Kaneko
礼三 金子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP13534894A priority Critical patent/JPH087733A/en
Publication of JPH087733A publication Critical patent/JPH087733A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】 【目的】電磁リレーやコネクタにおいて、接点の接触力
を増加させずに接触抵抗を低減させ得る接点間接触抵抗
振動低減法及び装置を提供する。 【構成】直流電源6に接触する制御コイル3の電磁作用
により開閉接点2a,2bを接触する電磁リレー1にお
いて、直流電源6に発振回路7を並列したものに加算回
路5を直列した制御回路4を制御コイル3に接続するこ
とを特徴とする。
(57) [Abstract] [PROBLEMS] To provide a contact resistance vibration reducing method and device capable of reducing contact resistance without increasing contact force of contacts in an electromagnetic relay or a connector. In an electromagnetic relay 1 in which switching contacts 2a and 2b are brought into contact by electromagnetic action of a control coil 3 which comes into contact with a DC power supply 6, a control circuit 4 in which an oscillating circuit 7 is connected in parallel to a DC power supply 6 and an adding circuit 5 is connected in series Is connected to the control coil 3.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、低い接触抵抗が要求さ
れるリレーやコネクタ等接点部品における接点間接触抵
抗振動低減法及びその実施に直接使用する装置に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact resistance vibration reducing method for a contact part such as a relay or a connector which requires a low contact resistance, and a device directly used for implementing the method.

【0002】[0002]

【従来の技術】継電器は駆動系の発生力によって、接点
を構成する電極をお互いに押し付け、接点間の導通を得
る。接点の接触抵抗は接触力が大きいほど低くなる。
2. Description of the Related Art In a relay, the electrodes forming the contacts are pressed against each other by the generated force of a drive system to obtain conduction between the contacts. The contact resistance of the contact decreases as the contact force increases.

【0003】[0003]

【発明が解決しようとする課題】従来の継電器では低い
接触抵抗を得るためには、より大きな接触力を必要と
し、大きな接触力を得るために、駆動系も大きくなると
言う欠点があった。またコネクタやソケットにおいて
も、接触抵抗を下げるには大きな接触力を必要とし、こ
のため挿抜力が増加するとともに、ピンも太くしなけれ
ばならないという問題があった。
The conventional relays have a drawback that a large contact force is required to obtain a low contact resistance, and the drive system also becomes large in order to obtain a large contact force. Further, in the case of the connector and the socket, there is a problem that a large contact force is required to reduce the contact resistance, so that the inserting / withdrawing force is increased and the pin has to be thick.

【0004】ここにおいて、本発明が解決しようとする
主要な目的は次に列挙する通りである。本発明の第1の
目的は、継電器やコネクタにおいて、接点の接触力を増
加することなく接触抵抗を低減させ得る接点間接触抵抗
振動低減法及び装置を提供せんとするものである。
The main objects to be solved by the present invention are listed below. A first object of the present invention is to provide a contact resistance vibration reducing method and device capable of reducing contact resistance without increasing contact force of a contact in a relay or a connector.

【0005】本発明の第2の目的は、接点の接触時、接
点間に強制振動を付加する接点間接触抵抗振動低減法及
び装置を提供せんとするものである。
A second object of the present invention is to provide a contact resistance vibration reducing method and device for applying forced vibration between contacts when the contacts are in contact with each other.

【0006】本発明の第3の目的は、接触接点間の絶縁
被膜を振動や振動摩擦熱により破壊除去する接点間接触
抵抗振動低減法及び装置を提供せんとするものである。
A third object of the present invention is to provide a contact resistance vibration reducing method and apparatus for destroying and removing an insulating coating between contact contacts by vibration or vibration friction heat.

【0007】本発明の他の目的は、明細書、図面、特に
特許請求の範囲の記載から明らかとなろう。
Other objects of the invention will be apparent from the description, drawings, and particularly the claims.

【0008】[0008]

【課題を解決するための手段】前記課題の解決は、本発
明が次に列挙する新規な構成手法及び手段を採用するこ
とにより達成される。即ち、本発明法第1の特徴は、電
気接点において、接触時一方又は両方に機械的振動を強
制付加して汚染等絶縁被膜を破壊除去してなる接点間接
触振動低減法である。
The above-mentioned object can be achieved by adopting the novel construction methods and means listed in the following by the present invention. That is, the first feature of the method of the present invention is a contact vibration reduction method between contacts, in which mechanical vibration is forcibly applied to one or both of the electric contacts during contact to destroy and remove the insulating coating such as contamination.

【0009】本発明法の第2の特徴は、前記本発明法の
第1の特徴における機械的振動の強制付加が、開閉接点
の開閉制御信号に振動電流を重畳して励振せしめてなる
接点間接触振動低減法である。
A second feature of the method of the present invention is that between the contacts in which the forced addition of the mechanical vibration in the first feature of the method of the present invention causes excitation by superposing an oscillating current on the switching control signal of the switching contacts. This is a contact vibration reduction method.

【0010】本発明法の第3の特徴は、前記本発明法の
第1の特徴における機械的振動の強制付加が、接点の開
閉方向と異なる方向に振動を付与してなる接点間接触抵
抗振動低減法である。
The third feature of the method of the present invention is that contact resistance vibration between contacts, in which the forced addition of mechanical vibration in the first feature of the method of the present invention imparts vibration in a direction different from the opening / closing direction of the contact. It is a reduction method.

【0011】本発明法の第4の特徴は、前記本発明法の
第1又は第3の特徴における機械的振動の強制付加が、
接点ばねの固有振動数に一致してなる接点間接触抵抗振
動低減法である。
The fourth feature of the method of the present invention is that the forced addition of mechanical vibration in the first or third feature of the method of the present invention is
This is a method for reducing contact resistance vibration between contact points that matches the natural frequency of the contact spring.

【0012】本発明装置の第1の特徴は、直流電源に接
続する制御コイルの電磁作用により開閉接点を接触する
電磁リレーにおいて、前記直流電源に発振回路を並列し
たものに加算回路を直列した制御回路を前記制御コイル
に接続してなる接点間接触抵抗振動低減装置である。
The first feature of the device of the present invention is an electromagnetic relay in which an opening / closing contact is brought into contact by the electromagnetic action of a control coil connected to a DC power source, in which an adding circuit is connected in series with an oscillating circuit in parallel with the DC power source. It is a contact resistance vibration reduction device between contacts formed by connecting a circuit to the control coil.

【0013】本発明装置の第2の特徴は、前記本発明装
置の第1の特徴における発振回路と加算回路が、それぞ
れタイマIC又は非安定マルチバイブレータとオペアン
プである接点間接触抵抗振動低減装置である。
A second feature of the device of the present invention is a contact resistance vibration reducing device between contacts in which the oscillation circuit and the adder circuit in the first feature of the device of the present invention are a timer IC or an astable multivibrator and an operational amplifier, respectively. is there.

【0014】本発明装置の第3の特徴は、片持並行接点
ばねを有する電磁リレーにおいて、前記接点ばねの一方
又は両方の基端にピエゾアクチュエータを取付けて片持
突設してなる接点間接触抵抗振動低減装置である。
A third feature of the device of the present invention is that in an electromagnetic relay having a cantilever parallel contact spring, a contact between the contacts is formed by attaching a piezo actuator to one or both base ends of the contact spring so as to project in a cantilever manner. It is a resistance vibration reduction device.

【0015】本発明装置の第4の特徴は、前記本発明装
置の第1,第2又は第3の特徴における接点ばねが、一
方又は両方の中間適宜部分を前記ばね軸方向に屈伸振動
自在な形状に屈曲してなる接点間接触抵抗低減装置であ
る。
A fourth feature of the device of the present invention is that the contact spring according to the first, second or third feature of the device of the present invention is capable of flexing and stretching vibration of one or both intermediate appropriate portions in the spring axial direction. This is a contact resistance reduction device between contacts that is bent into a shape.

【0016】本発明装置の第5の特徴は、前記本発明装
置の第1,第2,第3又は第4における接点ばねが、一
方又は両方の対向する接点とは対側端に重心が自由端側
に偏寄した横揺れ励起自在な突起を突設してなる接点間
接触抵抗振動低減装置である。
A fifth feature of the device of the present invention is that the contact spring in the first, second, third or fourth device of the present invention has a free center of gravity at the end opposite to one or both opposing contacts. This is a contact resistance vibration reduction device between contacts, which is provided with protrusions that are biased toward the end and that can be excited by rolling.

【0017】本発明装置の第6の特徴は、ICソケット
に挿嵌するピン付ICを把持するロボットハンドにおい
て、前記ピン軸方向に振動自在に当該ロボットハンドの
適宜部所にピエゾアクチュエータを介設してなる接点間
接触抵抗振動低減装置である。
A sixth feature of the device of the present invention is that, in a robot hand that holds an IC with a pin that is inserted into an IC socket, a piezo actuator is provided at an appropriate location of the robot hand so that it can vibrate in the pin axis direction. This is a contact resistance vibration reduction device between contacts.

【0018】[0018]

【作用】本発明は、前記のような新規な手法及び手段を
講じて前記課題を達成するために、接点を構成する電極
を、互いに振動させる。接点表面には汚染絶縁被膜が形
成されているので閉じている接点を振動させ、接点間の
被膜を振動、摩擦熱で破壊、除去すると接触抵抗を低減
させることができる。
According to the present invention, in order to achieve the above-mentioned object by taking the novel method and means as mentioned above, the electrodes constituting the contacts are vibrated with respect to each other. Since a contaminated insulating film is formed on the contact surface, the contact resistance can be reduced by vibrating the closed contact and destroying and removing the film between the contacts by vibration and friction heat.

【0019】[0019]

【実施例】【Example】

(方法例)本発明の方法例を図面について説明する。図
1は、接点に接点開閉方向と同方向に振動を加えた時の
接触抵抗の経時変化特性線図、図2は、接点に接点開閉
方向と直交方向に振動を加えた時の接触抵抗の経時変化
特性線図である。
(Example of Method) An example of the method of the present invention will be described with reference to the drawings. Fig. 1 is a characteristic diagram of change over time of contact resistance when a contact is vibrated in the same direction as the contact opening / closing direction, and Fig. 2 is a contact resistance when a contact is vibrating in a direction orthogonal to the contact opening / closing direction. It is a time-varying characteristic diagram.

【0020】図1は、接点表面材料を金、加えた振動は
200Hz、接点接触力は0.50gfの接点に接点開
閉方向と同方向の振動を加えたときの接触抵抗の一例で
あり、図中縦軸は接触抵抗、区間ABは振動を加える前
の接触抵抗で約0.9Ωを示している。B以降振動を加
えた。振動を加えた後、暫くしてから徐々に抵抗が減少
しC以降は抵抗の低下現象は見られなくなる。
FIG. 1 shows an example of contact resistance when a contact surface material of gold is applied, vibration of which is 200 Hz, and contact contact force of which is 0.50 gf is applied to a contact in the same direction as the contact opening / closing direction. The middle vertical axis shows the contact resistance, and the section AB shows the contact resistance before applying vibration of about 0.9Ω. Vibration was applied after B. The resistance gradually decreases after the vibration is applied for a while, and after C, the phenomenon of the resistance decrease is no longer observed.

【0021】D以降は振動を停止しているが、再び抵抗
が増加することはない。このときの接触抵抗は約0.8
Ωを示している。接触抵抗の減少は約0.1Ωであり、
接触力を1桁大きくしたとしても、これほどの接触抵抗
の現象は得られない。ここで振動を加える時間は、接点
の表面状態や振動の方向、振動数、振幅等の条件によっ
て異なるため一概に推定できないが、ほぼ1秒〜10秒
である。なお、ずっと振動を加え続けると、接触面で発
熱が生じ、接触抵抗が急激に上昇する。
Although the vibration is stopped after D, the resistance does not increase again. The contact resistance at this time is about 0.8
Ω is shown. The decrease of contact resistance is about 0.1Ω,
Even if the contact force is increased by one digit, such a phenomenon of contact resistance cannot be obtained. The time for applying vibration cannot be unconditionally estimated because it varies depending on conditions such as the surface condition of the contact, the direction of vibration, the frequency of vibration, and the amplitude, but it is approximately 1 to 10 seconds. Note that if vibration is continuously applied, heat is generated on the contact surface and the contact resistance sharply increases.

【0022】また、振動方向によって接触抵抗の変化に
は違いがある。図2に接点開閉方向に直交垂直に振動さ
せた場合の接触抵抗の減少の様子を表す。図中縦軸は接
触抵抗、区間ABは振動を加える前の接触抵抗で図1と
同様に約0.9Ωを示している。B以降振動を加えた、
この場合加振と同時に抵抗が低下している。このよう
に、開閉方向と直交方向に振動させた場合、同一方向の
振動より抵抗低減効果が大きい理由は、振動による汚染
被膜の破壊に加え除去効果も加わるためである。
Further, there is a difference in the change of the contact resistance depending on the vibration direction. FIG. 2 shows how the contact resistance decreases when vibrating perpendicularly to the contact opening / closing direction. In the figure, the vertical axis represents the contact resistance, and the section AB represents the contact resistance before vibration is applied, which is about 0.9Ω as in FIG. Vibration was applied after B,
In this case, the resistance is reduced at the same time as the vibration. In this way, when vibrating in a direction orthogonal to the opening / closing direction, the reason why the resistance reducing effect is greater than the vibration in the same direction is that the contaminated film is not only destroyed by the vibration but also removed.

【0023】また、振動周期を接点ばねの固有振動数に
一致させると、少ないエネルギーで振動振幅を大きくで
きる。また固有振動モード形を適切に設定すると、新た
に駆動機構を付加することなく、開閉方向と異なる方向
の振幅を発生できる。
Further, if the vibration cycle is made to coincide with the natural frequency of the contact spring, the vibration amplitude can be increased with less energy. Further, if the natural vibration mode type is properly set, an amplitude in a direction different from the opening / closing direction can be generated without adding a new drive mechanism.

【0024】(装置例1)当該本方法例を適用する本発
明装置の第1装置例を図面につき説明する。図3は、電
磁リレーに取付けた本装置例の概略ブロック構成図であ
る。図中、1は電磁リレー、2a,2bは開閉接点、3
は制御コイル、4は制御回路、5は加算回路、6は直流
電源、7は発振回路である。
(Device Example 1) A first device example of the device of the present invention to which the present method example is applied will be described with reference to the drawings. FIG. 3 is a schematic block configuration diagram of an example of this device attached to an electromagnetic relay. In the figure, 1 is an electromagnetic relay, 2a and 2b are switching contacts, 3
Is a control coil, 4 is a control circuit, 5 is an adding circuit, 6 is a DC power supply, and 7 is an oscillating circuit.

【0025】本装置例の仕様は、このような具体的態様
を呈し、次にその動作につき説明する。本装置例は、電
磁リレー1に採用したもので、制御コイル3に振動電流
を加えることにより、開閉接点2bを振動させる。アク
チュエータを新たに付け加えなくても開閉接点2bを振
動させることができる。振動電流は直流電源6による開
閉接点2a,2b開閉制御の制御電流に、発振回路7
(例えばタイマICや非安定マルチバイブレータを利
用)での発振電流をオペアンプを用いた加算回路5で加
えることによって得ることができる。なお、振動電流の
振動周期を開閉接点2bの固有振動数にあわせると少な
いエネルギーで大きな振動を得ることが出来る。
The specifications of this apparatus example take such a concrete mode, and the operation thereof will be described below. This device example is adopted in the electromagnetic relay 1, and vibrates the switching contacts 2b by applying an oscillating current to the control coil 3. The switching contact 2b can be vibrated without adding an actuator. The oscillating current is used as a control current for opening / closing control of the switching contacts 2a and 2b by the DC power source 6 and the oscillation circuit 7
It can be obtained by adding the oscillation current in (for example, using a timer IC or an astable multivibrator) with the adder circuit 5 using an operational amplifier. If the vibration cycle of the oscillating current is matched with the natural frequency of the switching contact 2b, a large vibration can be obtained with a small amount of energy.

【0026】(装置例2)前記本方法例を適用する本発
明装置の第2の装置例を図面につき説明する。図4は、
電磁リレーの接点部に採用した本装置例の一部破断拡大
正面図である。
(Device Example 2) A second device example of the device of the present invention to which the above method example is applied will be described with reference to the drawings. FIG.
It is a partially broken expanded front view of the example of this apparatus employ | adopted as the contact part of an electromagnetic relay.

【0027】図中、8a,8bは上下二段並行片持接点
ばね、9a、9bは上下片持部、10は絶縁支持部、1
1a,11bはリレー端子、12はピエゾアクチュエー
タ、13はピエゾ制御用端子、14はワイヤ、15は接
子である。
In the figure, 8a and 8b are upper and lower two-stage parallel cantilever contact springs, 9a and 9b are upper and lower cantilever portions, 10 is an insulating support portion, 1
1a and 11b are relay terminals, 12 is a piezo actuator, 13 is a piezo control terminal, 14 is a wire, and 15 is a contact.

【0028】本装置例の仕様は、このような具体的実施
態様を呈し、次にその動作につき説明する。まず、リレ
ー端子11a,11bから接点開閉制御の制御電流を導
通し、上接点ばね8aの接子15と下接点ばね8bが接
触する。
The specifications of this example apparatus present such a specific embodiment, and its operation will now be described. First, a control current for contact opening / closing control is conducted from the relay terminals 11a and 11b, and the contact 15 of the upper contact spring 8a and the lower contact spring 8b come into contact with each other.

【0029】その時点でピエゾ制御用端子13、13に
振動電圧を印加すればピエゾアクチュエータ(PZT)
にはピエゾ効果により図中矢印方向に伸縮歪んで一体的
に下接点ばね8bを往復振動せしめる。その際振動周期
を下接点ばね8bの固有振動数にあわせると少ないエネ
ルギーで大きな振動を得ることが出来る。
At that time, if an oscillating voltage is applied to the piezoelectric control terminals 13 and 13, the piezoelectric actuator (PZT)
The piezo effect causes the lower contact spring 8b to reciprocally vibrate integrally due to expansion and contraction in the direction of the arrow in the figure. At that time, if the vibration cycle is matched with the natural frequency of the lower contact spring 8b, a large vibration can be obtained with a small amount of energy.

【0030】かくの如く、下接点ばね8bを開閉方向と
直交垂直方向に振動させると、汚染絶縁被膜の破壊に除
去効果も加わり、開閉方向に振動させるよりも、より早
く接触抵抗を減少させることができる。なお、上接触ば
ね8a基端にピエゾアクチュエータを下接点ばね8bと
同様に取付けて往復振動させても良い。
As described above, when the lower contact spring 8b is vibrated in the direction perpendicular to the opening / closing direction, the contaminated insulating film is destroyed and the removing effect is added, so that the contact resistance can be reduced more quickly than the vibration in the opening / closing direction. You can A piezo actuator may be attached to the base end of the upper contact spring 8a in the same manner as the lower contact spring 8b to cause reciprocating vibration.

【0031】(装置例3)本発明の第3装置例を図面に
ついて説明する。図5は、本装置例が採用する電磁リレ
ーのばね接点の先端部を示し、(a)は拡大正面斜視
図、(b)はその屈伸振動の挙動説明図である。
(Device Example 3) A third device example of the present invention will be described with reference to the drawings. 5A and 5B show the tip of a spring contact of an electromagnetic relay used in this device example, FIG. 5A is an enlarged front perspective view, and FIG. 5B is a behavior explanatory view of bending and stretching vibrations thereof.

【0032】本装置例のばね接点16の先端部には接点
開閉方向と異なる方向の振動モードを持たせるため正面
三角山形屈曲部16aを形成し、接子16bの図示しな
いばね接点との接触時、ばね接点16の水平方向の図中
矢印方向に接点ばね16の固有振動数に合った最大屈伸
往復振動を共振させ、接触抵抗低減の省エネルギー及び
時間の短縮化を計る。
A front triangular chevron bent portion 16a is formed at the tip of the spring contact 16 of this device example so as to have a vibration mode in a direction different from the contact opening / closing direction, and when the contact 16b comes into contact with a spring contact (not shown). The maximum bending reciprocating reciprocating vibration that matches the natural frequency of the contact spring 16 is made to resonate in the direction of the arrow in the horizontal direction of the spring contact 16, to save energy for reducing the contact resistance and shorten the time.

【0033】(装置例4)本発明の第4装置例を図面に
ついて説明する。図6は、本装置例が採用する電磁リレ
ーのばね接点の先端部を示す拡大正面斜視図である。
(Device Example 4) A fourth device example of the present invention will be described with reference to the drawings. FIG. 6 is an enlarged front perspective view showing a tip end portion of a spring contact of an electromagnetic relay used in this device example.

【0034】本装置例のばね接点17の先端部には前記
第3装置例と同様、接点方向と異なる方向の振動モード
を持たせるため、接点ばね17先端の接子17aと対側
端に揺動ヘッド18aを有する例えば側面T字形突起1
8を植突する。
As in the third device example, the tip of the spring contact 17 of this device example has a vibration mode in a direction different from the contact direction. For example, a side T-shaped projection 1 having a moving head 18a
Implant 8.

【0035】接子17aの図示しないばね接点との接触
時、接点ばね17の捻れる方向の図中矢印方向を共振さ
せれば、接点開閉方向に対して直交垂直方向に揺振し、
接触抵抗を低減させる。その結果省エネルギー及び振動
時間の短縮化が計れる。
When the armature 17a comes into contact with a spring contact (not shown), if the resonance direction of the arrow of the contact spring 17 is resonated, it vibrates in a direction perpendicular to the contact opening / closing direction.
Reduces contact resistance. As a result, it is possible to save energy and shorten the vibration time.

【0036】(装置例5)本発明の第5装置例を図面に
ついて説明する。図7は、ロボットハンドに取付けた本
装置例の正面図である。図中、19はロボット二股ハン
ド、20a,20bはピエゾアクチュエータ、21はI
C、22a,22bはピン、23a,23bはソケット
ばね、24はICソケットである。
(Device Example 5) A fifth device example of the present invention will be described with reference to the drawings. FIG. 7 is a front view of an example of this apparatus attached to a robot hand. In the figure, 19 is a robot bifurcated hand, 20a and 20b are piezo actuators, and 21 is I.
C, 22a and 22b are pins, 23a and 23b are socket springs, and 24 is an IC socket.

【0037】本装置例の仕様は、このような具体的実施
態様を呈し、次にその動作を説明する。ICソケット2
4のソケットばね23a,23bにIC21のピン22
a,22bを挿入する場合であって、ICソケット24
では内部のソケットばね23a,23bをピン22a,
22bに押し付けて導通を確保する。
The specifications of this example apparatus present such a specific embodiment, and its operation will now be described. IC socket 2
4 of the socket springs 23a and 23b
When inserting a and 22b, the IC socket 24
Then the internal socket springs 23a, 23b are connected to the pins 22a,
22b is pressed to ensure continuity.

【0038】その際、部品挿入ロボットの二股ハンド1
9に組み込んだピエゾアクチュエータ20a,20bに
振動電圧を印加すれば、ピエゾ効果により図中矢印方向
に伸縮歪んで把持したIC21と一体的に、挿入方向と
同一方向にピン22a,22bを振動させ、より少ない
押し付け力で安定な導通が得られる。
At this time, the bifurcated hand 1 of the component insertion robot
When an oscillating voltage is applied to the piezo actuators 20a and 20b incorporated in 9, the pins 22a and 22b are vibrated in the same direction as the insertion direction integrally with the IC 21 gripped by expansion and contraction in the arrow direction in the figure due to the piezo effect. Stable conduction can be obtained with less pressing force.

【0039】[0039]

【発明の効果】以上説明したように、本発明により振動
を強制付勢された接点部品では、当該振動が接触時接点
間の絶縁被膜を破壊除去し、接触力を増加させずに接触
抵抗を省エネルギーでしかもより短時間で低減すること
ができる等優れた効果を奏する。
As described above, in the contact parts in which the vibration is forcibly energized according to the present invention, the vibration destroys and removes the insulating film between the contacts at the time of contact, thereby increasing the contact resistance without increasing the contact force. It has excellent effects such as energy saving and reduction in a shorter time.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の方法例において、接点に接点開閉方向
と同方向に振動を加えた時の接触抵抗の経時変化の特性
線図である。
FIG. 1 is a characteristic diagram showing a change over time in contact resistance when a contact is vibrated in the same direction as a contact opening / closing direction in a method example of the present invention.

【図2】同上、接点に接点開閉方向と直交方向に振動を
加えたときの接触抵抗の経時変化の特性線図である。
FIG. 2 is a characteristic diagram showing the change over time in contact resistance when vibration is applied to the contact in a direction orthogonal to the contact opening / closing direction.

【図3】電磁リレーに取付けた本発明の第1装置例の概
略ブロック構成図である。
FIG. 3 is a schematic block configuration diagram of a first device example of the present invention attached to an electromagnetic relay.

【図4】電磁リレーの接点部に採用した本発明の第2装
置例の一部破断拡大正面図である。
FIG. 4 is a partially cutaway enlarged front view of a second device example of the present invention adopted for a contact portion of an electromagnetic relay.

【図5】本発明の第3装置例が採用する電磁リレーのば
ね接点の先端部を示し、(a)は拡大正面斜視図、
(b)はその屈伸振動の挙動説明図である。
FIG. 5 shows a tip end portion of a spring contact of an electromagnetic relay adopted in a third device example of the present invention, (a) is an enlarged front perspective view,
(B) is a behavior explanatory view of bending and stretching vibrations.

【図6】本発明の第4装置例が採用する電磁リレーのば
ね接点の先端部を示す拡大正面斜視図である。
FIG. 6 is an enlarged front perspective view showing a tip portion of a spring contact of an electromagnetic relay used in a fourth device example of the present invention.

【図7】ロボットハンドに取付けた本発明の第5装置例
の正面図である。
FIG. 7 is a front view of a fifth device example of the present invention attached to a robot hand.

【符号の説明】[Explanation of symbols]

1…電磁リレー 2a,2b…開閉接点 3…制御コイル 4…制御回路 5…加算回路 6…直流電源 7…発振回路 8a,8b…上下二段並行片持接点ばね 9a,9b…上下片持部 10…絶縁支持部 11a,11b…リレー端子 12,20a,20b…ピエゾアクチュエータ 13…ピエゾ制御用端子 14…ワイヤ 15,16b,17a…接子 16,17…ばね接点 16a…三角山形屈曲部 18…突起 19…ロボット二股ハンド 21…IC 22a,22b…ピン 23a,23b…ソケットばね 24…ICソケット DESCRIPTION OF SYMBOLS 1 ... Electromagnetic relay 2a, 2b ... Switching contact 3 ... Control coil 4 ... Control circuit 5 ... Addition circuit 6 ... DC power supply 7 ... Oscillation circuit 8a, 8b ... Upper and lower two-stage parallel cantilever contact springs 9a, 9b ... Upper and lower cantilever part DESCRIPTION OF SYMBOLS 10 ... Insulating support part 11a, 11b ... Relay terminal 12, 20a, 20b ... Piezo actuator 13 ... Piezo control terminal 14 ... Wire 15, 16b, 17a ... Armature 16, 17 ... Spring contact 16a ... Triangular chevron bending part 18 ... Protrusion 19 ... Robot bifurcated hand 21 ... IC 22a, 22b ... Pins 23a, 23b ... Socket spring 24 ... IC socket

Claims (10)

【特許請求の範囲】[Claims] 【請求項1】電気接点において、 接触時一方又は両方に機械的振動を強制付加して汚染等
絶縁被膜を破壊除去することを特徴とする接点間接触振
動低減法。
1. A method of reducing contact vibration between contacts, wherein mechanical vibration is forcibly applied to one or both of the electric contacts at the time of contact to destroy and remove the insulating coating such as contamination.
【請求項2】機械的振動の強制付加は、開閉接点の開閉
制御信号に振動電流を重畳して励振せしめることを特徴
とする請求項1記載の接点間接触振動低減法。
2. The method for reducing contact vibration between contacts according to claim 1, wherein the forced addition of mechanical vibration is performed by superposing an oscillating current on an opening / closing control signal of the opening / closing contact to excite it.
【請求項3】機械的振動の強制付加は、接点の開閉方向
と異なる方向に振動を付与することを特徴とする請求項
1記載の接点間接触抵抗振動低減法。
3. The contact resistance vibration reduction method according to claim 1, wherein the forced addition of mechanical vibration applies vibration in a direction different from the opening / closing direction of the contact.
【請求項4】機械的振動の強制付加は、接点ばねの固有
振動数に一致することを特徴とする請求項1又は3記載
の接点間接触抵抗振動低減法。
4. The contact resistance vibration reducing method according to claim 1, wherein the forced addition of the mechanical vibration coincides with the natural frequency of the contact spring.
【請求項5】直流電源に接続する制御コイルの電磁作用
により開閉接点を接触する電磁リレーにおいて、 前記直流電源に発振回路を並列したものに加算回路を直
列した制御回路を前記制御コイルに接続することを特徴
とする接点間接触抵抗振動低減装置。
5. An electromagnetic relay in which an opening / closing contact is brought into contact by an electromagnetic action of a control coil connected to a DC power source, wherein a control circuit in which an oscillating circuit is connected in parallel to the DC power source and an adding circuit is connected in series is connected to the control coil. A contact resistance vibration reduction device between contacts.
【請求項6】発振回路と加算回路は、それぞれタイマI
C又は非安定マルチバイブレータとオペアンプであるこ
とを特徴とする請求項5記載の接点間接触抵抗振動低減
装置。
6. The oscillator circuit and the adder circuit are each provided with a timer I.
The contact resistance vibration reducing device between contacts according to claim 5, wherein the device is a C or astable multivibrator and an operational amplifier.
【請求項7】片持並行接点ばねを有する電磁リレーにお
いて、 前記接点ばねの一方又は両方の基端にピエゾアクチュエ
ータを取付けて片持突設することを特徴とする接点間接
触抵抗振動低減装置。
7. An electromagnetic relay having a cantilever parallel contact spring, wherein a piezo actuator is attached to one or both of the base ends of the contact spring so as to be cantilevered and protruded.
【請求項8】接点ばねは、一方又は両方の中間適宜部分
を前記ばね軸方向に屈伸振動自在な形状に屈曲すること
を特徴とする請求項5,6又は7記載の接点間接触抵抗
低減装置。
8. A contact resistance reducing device according to claim 5, 6 or 7, wherein one or both intermediate appropriate portions of the contact spring are bent in a shape capable of bending and stretching vibrations in the spring axial direction. .
【請求項9】接点ばねは、一方又は両方の対向する接点
とは対側端に重心が自由端側に偏寄した横揺れ励起自在
な突起を突設することを特徴とする請求項5,6,7又
は8記載の接点間接触抵抗振動低減装置。
9. The contact spring is provided with a protrusion capable of exciting wobbling at the end opposite to one or both of the opposing contacts, the center of gravity being biased toward the free end. The contact resistance vibration reduction device between contacts according to 6, 7, or 8.
【請求項10】ICソケットに挿嵌するピン付ICを把
持するロボットハンドにおいて、 前記ピン軸方向に振動自在に当該ロボットハンドの適宜
部所にピエゾアクチュエータを介設することを特徴とす
る接点間接触抵抗振動低減装置。
10. A robot hand for gripping an IC with a pin to be inserted into an IC socket, characterized in that a piezo actuator is provided at an appropriate portion of the robot hand so as to vibrate in the pin axial direction. Contact resistance vibration reduction device.
JP13534894A 1994-06-17 1994-06-17 Contact resistance vibration reduction method and device between contacts Pending JPH087733A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13534894A JPH087733A (en) 1994-06-17 1994-06-17 Contact resistance vibration reduction method and device between contacts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13534894A JPH087733A (en) 1994-06-17 1994-06-17 Contact resistance vibration reduction method and device between contacts

Publications (1)

Publication Number Publication Date
JPH087733A true JPH087733A (en) 1996-01-12

Family

ID=15149668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13534894A Pending JPH087733A (en) 1994-06-17 1994-06-17 Contact resistance vibration reduction method and device between contacts

Country Status (1)

Country Link
JP (1) JPH087733A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111868864A (en) * 2018-03-16 2020-10-30 田中贵金属工业株式会社 Contact Materials for DC High Voltage Relays and DC High Voltage Relays

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111868864A (en) * 2018-03-16 2020-10-30 田中贵金属工业株式会社 Contact Materials for DC High Voltage Relays and DC High Voltage Relays

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