JPH0878821A - Film substrate automatic frame loader - Google Patents

Abstract

PURPOSE: To prevent a substrate from being thermally deformed while it is transferred by a method wherein a drive means which enables a preheating means to approach or recede from the substrate is provided. CONSTITUTION: A preheating section 8 is composed of a heat block 7 where a heater is built in and an air cylinder 6 which makes the heat block 7 ascend or descend. The heat block 7 is formed like a rectangular parallepiped corresponding to the length of a substrate (A) along a direction in which the substrate (A)is fed and provided with a built-in electric heater 18 so as to uniformly heat the rectangular' substrate (A). The heat block 7 is arranged below an aligning section 4 but just under the alignment position of the substrate (A). The heat block 7 is fastened to the cylinder block 6a of the air cylinder 6 through the intermediary of a heat insulating material 19 and capable of ascending or descending. By this setup, when a substrate is transferred to an alignment position, a heat block is positioned apart from the substrate, so that the substrate is capable of being protected against thermal deformation caused by residual heat of the heat block.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an auto frame loader for arranging a film substrate on which an IC core chip is mounted, and more particularly to preheating the substrate.

[0002]

2. Description of the Related Art Generally, as a process for manufacturing an IC component, a molding process is known in which the periphery of the IC core chip is covered with a synthetic resin material in order to protect the core chip of the IC connected and arranged on a substrate.

The substrate before this molding step is formed in a long plate shape, and the substrate is divided into a plurality of sections, and a pattern such as a connection surface is formed in each section, and a core chip is mounted on each section. Has been done. Further, this substrate is composed of an insulating film layer made of a glass / epoxy material and a metal layer such as copper foil or plating for forming a connection surface pattern or the like.

Before the molding step, a plurality of such substrates are arranged in a row on a plane in multiple rows, and the aligned substrates are collectively held by a frame, that is, a large number of substrates are collectively held together. Then, the held frame is transferred to the molding process. In this way, the auto frame loader arranges the film substrates on which the IC core chips are mounted in an aligned manner.

As shown in FIGS. 6 and 7, such an auto frame loader has a carrying roller 21, a stopper member 22, and a positioning pin 23 which are horizontally arranged along the column direction (longitudinal direction of the substrate). And a frame (not shown). That is, the substrate A fed is moved by the transport roller 21 to a predetermined position where it abuts on the stopper member 22. Further, a positioning hole is provided in advance at a predetermined position of the board A, and the positioning hole of this board is aligned with the positioning pin 23 to perform precise positioning. Finally, the aligned substrates A and A are collectively held by a frame and are transferred together with the frame to the next molding step. Then, this frame is housed in a mold, and a plurality of substrates are collectively molded.

A heat block 26 having a heater 25 is fixedly arranged immediately below the substrate A via a heat insulating material 24. After the substrate A is aligned by the heat block 26, for example, , 60 seconds, 120
The substrate is preheated to about 0 ° C. so that the molding material conforms to the substrate A in the subsequent molding process.

[0007]

However, since the heat block is fixedly arranged immediately below the substrate being conveyed, the substrate is heated by radiant heat or the like during the conveyance, and the substrate is thermally deformed. There was an inconvenience that it could not be done normally. That is, since the substrate is made of at least two materials having different coefficients of thermal expansion, it warps to one side and both ends are lifted. Therefore, the vertical distance from the front end of the substrate in the feeding direction to the positioning hole is shortened, and the position of the substrate is displaced. Further, even if the heater is turned off during transportation, residual heat remains to the extent that thermal deformation is caused in the entire heat block, and thermal deformation cannot be avoided.

Further, due to the thermal deformation of the substrate, not only the positioning cannot be performed properly, but also the fine wires connecting the IC core chip and the substrate are deformed, causing disconnection or short circuit, resulting in a defective product. It was also inconvenient.

Therefore, an object of the present invention is to provide an automatic frame loader for film substrates, in which thermal deformation of the substrate during transportation is prevented.

[0010]

SUMMARY OF THE INVENTION The present invention comprises an aligning means for aligning a plurality of fed film substrates, a preheating means for preheating the substrates, and a frame for holding the aligned substrates all together. In the automatic frame loader, the film frame automatic frame loader is provided with a drive unit for moving the preheating means toward and away from the substrate.

[0011]

Therefore, according to the present invention, by providing the drive unit for moving the preheating means toward and away from the substrate,
When the substrates are transported to the aligned position, the preheating means can be positioned away from the substrates being transported, and thermal deformation due to residual heat of the preheating means can be prevented.

Further, at the time of preheating, the preheating means is located in the vicinity of the substrate so that the substrate can be preheated efficiently.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the embodiments shown in FIGS. 1 and 2, an auto frame loader 1 according to the present embodiment includes a film substrate supply unit 2 in which film substrates A and A are stacked and a feed unit that supplies the film substrate A from each supply unit 2 in each row. Roller part 3
An aligning portion 4 for aligning the fed film substrates A, a frame 5 for holding the aligned film substrates A, A together, and an air cylinder arranged just below the aligning portion 4. 6 and a preheating section 8 having a heat block 7 that moves up and down.

The frame 5 is composed of an upper frame 10 and a lower frame 11, one end of which is pivotally supported by a hinge portion, and a holding arm for holding the substrate A at a position corresponding to the alignment position of the substrate A, respectively. 10a and 11a are provided. Further, the grasping portions 10b, 10b are provided on the open end sides of the upper frame 10 and the lower frame 11.
11b is provided, and by providing the grasping portions 10b and 11b, the frame 5 after preheating which will be described later is provided.
To be able to move. Further, the frame 5 is placed on the aligning section 4, and the lower frame 11
Are located below the substrate A transport path.

Therefore, after the substrates A are aligned, the open upper frame 10 of the frame 5 is superposed on the lower frame 11,
The substrate A is held by the holding arms 10 a and 11 a, and the substrate A is clamped in a batch by the frame 5 in an aligned state so that the frame 5 can be moved.

In the film substrate supply section 2, the cartridge cases 2a having upper openings are arranged in four rows in parallel,
The film case A in the form of a thin plate is stacked and stored in the cartridge case 2a.

The feed roller unit 3 is composed of rollers 3a arranged coaxially for each row, and the lowermost substrate A is drawn out from the case 2a of the film substrate supply unit 2 one by one, and the downstream side is taken out. It is provided so that it may be fed to the aligning section 4.

As shown in FIGS. 3 to 5, the alignment section 4 is arranged at the end of the alignment position of the plurality of transport rollers 12 and 12 arranged along the feeding direction in each row and the alignment position of the substrate A. The stopper member 13 and the substrate detecting sensor 14,
Positioning pins 15 arranged according to the alignment position of the board A
It consists of and.

The transport rollers 12 are axially supported at equal intervals along the feed direction of each row, and are rotationally driven in a group unit according to the alignment position of the substrates A by a motor mechanism (not shown). There is. The motor mechanism is connected to a control circuit unit (not shown) to control the operation. Furthermore, the outer side of each of the transport rollers 12 is pivotally supported, and a predetermined gap is provided between the opposing rollers. Therefore, the heat block 7 of the preheating section 8 described later can be positioned in the gap between the conveying rollers 12 facing each other.

An optical fiber sensor is used as the substrate detecting sensor 14, and it is arranged on the terminal side of the alignment position of the substrate A. The sensor 14 is connected to the control circuit unit, detects that the tip of the substrate A is in contact with the stopper member 13, and notifies the control circuit unit. Therefore, in response to this detection signal, the control circuit section is configured to stop the motor drive of the transport roller group when the substrates A reach the aligned position.

Further, the positioning pin 15 is provided at an alignment position corresponding to the positioning hole provided on the substrate side, and the tip is normally located below the transport path, and is moved upward by a vertical movement mechanism (not shown). It is possible. Therefore,
After the alignment of the board A is stopped, the board A is raised and the positioning pins 15 are inserted into the positioning holes of the board A, so that the board A can be positioned more precisely.

Numeral 17 is a spacer for stopping the succeeding substrates A in the same row at a predetermined alignment position. The spacer 17 is lowered to the lower position by the control circuit section while the first substrate A is being conveyed. After the alignment, the substrate A is raised to the upper position and the subsequent substrate A is stopped so that the substrate A is aligned at the predetermined position.

The preheating section 8 comprises a heat block 7 having a built-in heater 18, and an air cylinder 6 for raising and lowering the heat block 7.

That is, the heat block 7 is formed in a rectangular parallelepiped shape corresponding to the length of the substrate A along the feeding direction, has a built-in electrothermal heater 18, and evenly disperses the long plate-shaped substrate A uniformly. It can be heated to. The heat block 7 is arranged below the alignment section 4 and immediately below the alignment position of the substrate A. The heat block 7 is fixed to the cylinder rod 6a of the air cylinder 6 via the heat insulating material 19 and can be moved up and down.

That is, the air cylinder 6 is vertically fixed to the main body of the auto frame loader, and its operation is controlled by the control circuit section. Then, during the transportation for aligning the substrates A, the operation of the air cylinder 6 is stopped and the heat block 7 is stopped as shown by the solid line in FIGS.
Is in the lowered position and is away from the substrate A being transported. Next, when the alignment of the substrates A is completed, the air cylinder 6 is actuated to move up to the vicinity of the substrates A, as indicated by an imaginary line in FIG. And by the radiant heat of this heat block 7,
The substrates A aligned at a predetermined temperature are uniformly preheated for a predetermined time. After completion of this preheating, the operation of the air cylinder 6 is stopped, and the heat block 7 returns to the lowered position again.

As described above, according to the auto frame loader of the present embodiment, by providing the driving unit by the air cylinder for moving the heat block as the preheating means toward and away from the substrate, the substrates are aligned. At the time of transportation to the position, the heat block is positioned away from the substrate being transported, thermal deformation of the substrate due to residual heat of the heat block can be prevented, the substrates can be properly aligned, and product defects due to this deformation can be prevented. It can be avoided.

Further, at the time of preheating, the preheating means can be positioned near the substrate to efficiently preheat the substrate.

[0028]

As described above, according to the auto frame loader of the present embodiment, by providing the driving unit for moving the preheating means, for example, the heat block to and away from the substrate, When transporting to the alignment position,
By arranging the heat block away from the substrate being transported, thermal deformation of the substrate due to residual heat of the heat block can be prevented, the substrates can be properly aligned, and product defects due to this deformation can be avoided.

Further, at the time of preheating, the preheating means can be positioned near the substrate to efficiently preheat the substrate.

[Brief description of drawings]

FIG. 1 is a side view showing an overall configuration according to an embodiment of an automatic frame loader for film substrates of the present invention.

FIG. 2 is a plan view showing the overall configuration of the auto frame loader according to the present embodiment.

FIG. 3 is a partial plan view showing an alignment unit and a preheating unit according to the auto frame loader of the present embodiment.

FIG. 4 is a partial side view showing an alignment unit and a preheating unit according to the auto frame loader of the present embodiment.

FIG. 5 is a partial front view showing an alignment unit and a preheating unit according to the auto frame loader of the present embodiment.

FIG. 6 is a side view showing a schematic configuration of a conventional auto frame loader.

FIG. 7 is a front view showing a schematic configuration of a conventional auto frame loader.

[Explanation of symbols]

 1 Auto Frame Loader 2 Film Substrate Supply Section 3 Feed Roller Section 4 Alignment Section 5 Frame 6 Air Cylinder 6a Cylinder Rod 7 Heat Block 8 Preheating Section 10 Upper Frame Frame 11 Lower Frame Frame 12 Transport Roller 13 Stopper Member 14 Substrate Detection Sensor 15 Positioning pin 17 Spacer 18 Heater

Claims (1)

[Claims] 1. An aligning means for aligning a plurality of fed film substrates, and a preheating means for preheating the substrates,
An auto frame loader for a film substrate, comprising: a frame for collectively holding aligned substrates; and a drive unit for moving the preheating means toward and away from the substrate.