JPH088377A - Method for manufacturing lead frame - Google Patents
Method for manufacturing lead frameInfo
- Publication number
- JPH088377A JPH088377A JP6163038A JP16303894A JPH088377A JP H088377 A JPH088377 A JP H088377A JP 6163038 A JP6163038 A JP 6163038A JP 16303894 A JP16303894 A JP 16303894A JP H088377 A JPH088377 A JP H088377A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- punched
- punching
- semiconductor chip
- chip mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
- B21D28/16—Shoulder or burr prevention, e.g. fine-blanking
Landscapes
- Punching Or Piercing (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】 （修正有）
【目的】 プレス法でリードのピッチ及び幅が微細なリ
ードフレームを製造する際、ねじれや反りを生じさせず
インナーリードを打抜きリ−ド平坦幅及びリ−ドピッチ
を精度よく確保し、また工程途中に矯正工程を必ずしも
必要とせずに平坦度が優れボンディング性の良好な多ピ
ンのリードフレームを得る。
【構成】 プレス加工で金属薄板から半導体チップ搭載
部１の周りに多数のインナーリード２を打抜き、該イン
ナーリードに連続してアウターリード８を打抜き形成す
るリードフレーム１２の製造方法において、前記インナ
ーリードを打抜く際、打抜き対象リ−ドを先端部になる
につれ押圧力又は潰し量を大きくして押え隣接打抜き部
５を打抜き半導体チップ搭載部１に続けて形成し、焼鈍
し、半導体チップ搭載部とインナーリードの接続部を打
抜き前又は後に、インナーリードをコイニングしてリー
ドフレームを製造する。
(57) [Summary] (Correction) [Purpose] When manufacturing a lead frame with a fine lead pitch and width by the pressing method, the inner lead is punched out without causing twisting or warping. (EN) A lead frame having a large number of pins, which secures a precise pitch and does not necessarily require a straightening process in the middle of the process and has excellent flatness and good bondability. A method for manufacturing a lead frame 12 in which a large number of inner leads 2 are punched from a thin metal plate around a semiconductor chip mounting portion 1 by press working, and outer leads 8 are punched continuously from the inner leads. At the time of punching, the pressing target or the crushing amount is increased as the lead to be punched becomes closer to the tip end, and the press-adjacent punching portion 5 is continuously formed on the punching semiconductor chip mounting portion 1 and then annealed. Before or after punching the connection part between the inner lead and the inner lead, the inner lead is coined to manufacture a lead frame.
Description
【０００１】[0001]
【産業上の利用分野】本発明は多ピンのリードフレーム
を製造する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a multi-pin lead frame.
【０００２】[0002]
【従来の技術】リードフレームは、半導体装置の高機
能、高集積度及び小型化等に対応してリ−ドのピッチ、
幅とも微細な多ピンとする必要がある。2. Description of the Related Art Lead frames are used for lead pitches and lead pitches corresponding to high functionality, high integration and miniaturization of semiconductor devices.
It is necessary to use multiple pins with a fine width.
【０００３】リードフレームはプレス法あるいはエッチ
ング法で形成されるが、生産性及びコスト等でプレス法
が優れているので、一般にこれにより多くの製造がなさ
れている。プレス法はエッチング法ほど微細なリ−ドの
形成が難しいが、しかし例えば１６０ピン以上の多ピン
品が製造されるようになっている。The lead frame is formed by a pressing method or an etching method. Since the pressing method is superior in terms of productivity and cost, many manufacturing processes are generally performed by this method. Although the pressing method is more difficult to form a fine lead than the etching method, a multi-pin product having, for example, 160 pins or more is manufactured.
【０００４】リ−ドの多ピン化で、打抜きピッチは狭
く、またリ−ド幅も狭くなることから、その打抜きの際
にリ−ドにねじれを生じやすい。Since the lead has a large number of pins and the punching pitch is narrow and the lead width is also narrow, the lead is likely to be twisted during punching.
【０００５】リードねじれは、その後のワイヤ−ボンデ
ィング等に支障を及ぼし、接続不良、ボンディング作業
性の低下などを引き起こすので、リードフレームの打抜
き工程の途中に矯正工程を新たに介在させることが考え
られる。しかし、これでは多工程となり、また設備増と
なるので、できるだけ該矯正工程を介在させないことが
望ましい。Since the lead twist hinders the subsequent wire bonding and causes a defective connection and a decrease in the bonding workability, it is conceivable to additionally interpose a straightening step during the lead frame punching step. . However, this requires multiple steps and increases equipment, so it is desirable that the correction step is not interposed as much as possible.
【０００６】[0006]
【この発明が解決しようとする課題】プレス法でリ−ド
例えばインナーリードのピッチ及び幅が微細なリードフ
レームを打抜き製造する際、リ−ドにねじれや反りを生
じることなくインナーリードを打抜きリ−ド平坦幅及び
リ−ドピッチの確保が容易で、また、工程途中に矯正工
程を必ずしも必要とせずに平坦度が優れボンディング性
の良好な多ピンのリードフレームを得ることを目的とす
る。When a lead frame, for example, a lead frame having a fine pitch and width of inner leads is punched and manufactured by a pressing method, the inner leads are punched and punched without causing twisting or warping of the leads. An object of the present invention is to obtain a multi-pin lead frame which is easy to secure a flat width and a lead pitch, and which does not necessarily require a straightening process in the middle of the process and has excellent flatness and good bonding property.
【０００７】[0007]
【課題を解決するための手段】本発明の要旨は、金属薄
板からプレス加工により、半導体チップ搭載部の周りに
多数のインナーリードを打抜き、該インナーリードに連
続してアウターリードを打抜き形成するリードフレーム
の製造方法において、前記インナーリードを打抜く際、
打抜き形成対象リ−ドを先端部になるにつれ押圧力又は
潰し量を大きくして押え隣接打抜き部を打抜き半導体チ
ップ搭載部に続けて形成し、焼鈍し、インナーリードを
コイニングし、半導体チップ搭載部とインナーリードの
接続部を打抜くリードフレームの製造方法にある。他の
要旨は前記インナーリードのコイニングを、半導体チッ
プ搭載部とインナーリードの接続部を打抜き後に行うと
ころにある。また他の要旨は、前記焼鈍の後、半導体チ
ップ搭載部外周とインナーリード先端の間に抜き孔を形
成してインナーリードをコイニングし、インナーリード
先端の接続部を打抜くリードフレームの製造方法にあ
る。SUMMARY OF THE INVENTION A gist of the present invention is to form a large number of inner leads around a semiconductor chip mounting portion by pressing from a thin metal plate, and to form outer leads continuously from the inner leads by punching. In the method of manufacturing a frame, when punching the inner lead,
Pressing or crushing amount of the lead to be punched is increased as it goes to the tip, and the adjacent punched part is continuously formed on the punched semiconductor chip mounting part, annealed, the inner leads are coined, and the semiconductor chip mounting part It is a method of manufacturing a lead frame in which a connecting portion between an inner lead and a lead is punched. Another point is that the inner leads are coined after the connecting portions between the semiconductor chip mounting portion and the inner leads are punched out. Another gist is a method of manufacturing a lead frame in which after the annealing, a hole is formed between the outer periphery of the semiconductor chip mounting portion and the tip of the inner lead to coin the inner lead and punch out the connection portion of the inner lead tip. is there.
【０００８】[0008]
【作用】本発明は、リ−ドのピッチ及び幅とも狭いイン
ナーリードを打抜きする際、打抜き形成対象インナーリ
ードの先端部になるにつれ当該リ−ドを、押圧力を強め
て又は潰し量が大きくなるように押えて、隣接打抜き部
を打抜きするから、当該インナーリードは先端部になる
につれ幅及びピッチが狭くなっても打抜き時の剪断力に
基づいた曲げ力に抗して、ねじれや反りの発生を防止す
る。さらにねじれが生じないのでリ−ド平坦幅及びリ−
ドピッチが精度よく確保される。According to the present invention, when an inner lead having a narrow lead pitch and a narrow width is punched, as the tip of the inner lead to be punched becomes closer, the lead is strengthened by increasing the pressing force or the crushing amount is increased. Since the inner lead is punched in the adjacent punched portion, the inner lead does not twist or warp against the bending force based on the shearing force at the punching even if the width and pitch become narrower toward the tip. Prevent occurrence. Furthermore, since no twist occurs, the lead flat width and lead
The pitch is secured accurately.
【０００９】また、コイニングをインナーリード先端の
接続部を除去した後に行う方法では、該コイニングによ
る応力は解放され形状が優れる。Further, in the method in which coining is performed after removing the connecting portion at the tip of the inner lead, the stress due to the coining is released and the shape is excellent.
【００１０】また、焼鈍の後、連続した半導体チップ搭
載部とインナーリード先端の間に抜き孔を形成して、イ
ンナーリードをコイニングする方法でも応力が解放され
同様に形状が優れる。After the annealing, a method of coining the inner leads by forming a hole between the continuous semiconductor chip mounting portion and the tips of the inner leads also releases the stress, and the shape is similarly excellent.
【００１１】[0011]
【実施例】次に、本発明について１実施例に基づき図面
を参照して詳細に説明する。図面において、１は半導体
チップ搭載部で、その周りにインナーリード２を多数形
成する。該インナーリード２はリ−ドのピッチ及び幅と
も狭く、先端部になるほど微細になる。微細なインナー
リード２の打抜きは、剪断力等の加工力の影響を受けリ
−ドがねじれ、あるいは反ることがある。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the drawings based on an embodiment. In the drawing, reference numeral 1 denotes a semiconductor chip mounting portion, around which a number of inner leads 2 are formed. The inner leads 2 have a narrow lead pitch and width and become finer toward the tip. When the fine inner lead 2 is punched, the lead may be twisted or warped due to the influence of processing force such as shearing force.
【００１２】かかる問題が発生しないように本発明は次
のようにする。即ち、図２に示すように打抜き対象イン
ナーリード２ａについて、幅が狭くなる先端部なるにつ
れて押圧力を大にし、又は潰し量が大となるように例え
ば傾斜押え３を設けたストリッパ−４で押圧し、当該イ
ンナーリード２ａの隣接打抜き部５をパンチ６で打抜
く。このようにして打抜きすると当該打抜き対象インナ
ーリード２ａは、幅狭になるほど強くダイ７側に押圧さ
れ、打抜き剪断力に基づく曲げ力に抗してその姿勢が保
たれ、ねじれや反りが生じない。また、該インナーリー
ド２ａの打抜きはその先端部が半導体チップ搭載部１に
連続して行われる。The present invention is as follows so that such a problem does not occur. That is, as shown in FIG. 2, the inner lead 2a to be punched is pressed by a stripper 4 provided with, for example, an inclined presser 3 so that the pressing force becomes larger as the width becomes narrower and the crushing amount becomes larger. Then, the adjacent punching portion 5 of the inner lead 2a is punched with the punch 6. When punching in this manner, the punching target inner lead 2a is strongly pressed toward the die 7 as the width becomes narrower, the posture thereof is maintained against the bending force based on the punching shearing force, and twisting or warping does not occur. Further, the punching of the inner lead 2a is performed such that the tip portion thereof is continuous with the semiconductor chip mounting portion 1.
【００１３】８はアウターリードでインナーリード２に
続けた形て打抜きするが、通常のストリッパ−で押えて
行なえる。該アウターリード８とインナーリード２の打
抜き順序は任意であり、アウターリード８を打抜き後、
インナーリード２を打抜きしてもよい。９はタイバ−
で、インナーリード２とアウターリード８の間に形成す
る。なお、１０はガイドホ−ル、１１はサポ−トバ−で
ある。An outer lead 8 is punched out in a form continuing from the inner lead 2, but it can be pressed by an ordinary stripper. The punching order of the outer lead 8 and the inner lead 2 is arbitrary, and after punching the outer lead 8,
The inner lead 2 may be punched out. 9 is a tie bar
Then, it is formed between the inner lead 2 and the outer lead 8. Reference numeral 10 is a guide wheel, and 11 is a support bar.
【００１４】前記パタ−ンが打抜かれたリードフレーム
１２は焼鈍される。その後、インナーリード２をコイニ
ングし、半導体チップ搭載部１外周とインナーリード２
先端を接続している部分を除去し、リードフレーム１２
を製造する。The lead frame 12 punched with the pattern is annealed. After that, the inner leads 2 are coined, and the outer circumference of the semiconductor chip mounting portion 1 and the inner leads 2 are coined.
The lead frame 12 is removed by removing the part connecting the tips.
To manufacture.
【００１５】また、他の製造方法として、前記焼鈍の後
に、半導体チップ搭載部１外周とインナーリード２先端
を接続している部分を除去し、次いで、インナーリード
２をコイニングしてもよい。As another manufacturing method, after the annealing, the portion connecting the outer periphery of the semiconductor chip mounting portion 1 and the tips of the inner leads 2 may be removed, and then the inner leads 2 may be coined.
【００１６】さらに、他の製造方法として、前記焼鈍の
後、連続している半導体チップ搭載部１外周とインナー
リード２先端の間に図３のように抜き孔１３を打抜き形
成する。次いでインナーリード２をコイニングする際
に、その加工応力が抜き孔１３側に解放するようにす
る。その後にインナーリード２の先端の接続部を打抜き
除去する。Further, as another manufacturing method, after the annealing, a punching hole 13 is formed between the outer periphery of the semiconductor chip mounting portion 1 and the tip of the inner lead 2 which are continuous as shown in FIG. Next, when the inner lead 2 is coined, the processing stress is released to the side of the hole 13. After that, the connecting portion at the tip of the inner lead 2 is punched and removed.
【００１７】[0017]
【発明の効果】本発明では、ピッチ及び幅が微細で多ピ
ンのインナーリードを打抜きする際、幅狭な先端部にな
るにつれて当該打抜き対象インナーリードの押圧力を大
きく、あるいは潰し量を大として押圧し、その隣接部を
打抜くので、当該リ−ドは微細で多ピンであってもねじ
れや反り等の形状不良を生ぜず、さらにリ−ド平坦幅及
びリ−ドピッチが精度よく確保される。According to the present invention, when punching an inner lead having a fine pitch and width and a large number of pins, the pressing force of the inner lead to be punched is increased or the crushing amount is increased as the tip end becomes narrower. Since the lead is pressed and the adjacent part is punched out, even if the lead is fine and has many pins, it does not cause shape defects such as twisting and warping, and the lead flat width and lead pitch can be secured accurately. It
【００１８】また、インナーリードのコイニングは当該
インナーリード先端部と半導体チップ搭載部外周の間を
打抜き後、あるいは、インナーリード先端の接続部を打
抜きしてから行うので、応力が残存せず優れた形状のリ
ードフレームが得られる。Further, since coining of the inner lead is performed after punching between the inner lead tip portion and the outer periphery of the semiconductor chip mounting portion or after punching the connecting portion of the inner lead tip, no stress remains, which is excellent. A shaped lead frame is obtained.
【図１】本発明の１実施例によるリードフレームの製造
を示す図。FIG. 1 is a diagram showing the manufacture of a lead frame according to an embodiment of the present invention.
【図２】本発明の１実施例でのインナーリードの打抜き
を示す図。FIG. 2 is a diagram showing punching of inner leads according to one embodiment of the present invention.
【図３】本発明の他の実施例において半導体チップ搭載
部外周とインナーリード先端部の間の打抜きを示す図。FIG. 3 is a view showing punching between a semiconductor chip mounting portion outer periphery and an inner lead tip portion in another embodiment of the present invention.
【図４】本発明の１実施例により製造されたリードフレ
ームを示す図。FIG. 4 is a diagram showing a lead frame manufactured according to an embodiment of the present invention.
１ 半導体チップ搭載部 ２ インナーリード ３ 傾斜押え ４ ストリッパ− ５ 隣接打抜き部 ６ パンチ ７ ダイ ８ アウターリード ９ タイバ− １０ ガイドホ−ル １１ サポ−トバ− １２ リードフレーム １３ 抜き孔 1 Semiconductor chip mounting part 2 Inner lead 3 Inclined presser 4 Stripper 5 Adjacent punching part 6 Punch 7 Die 8 Outer lead 9 Tie bar 10 Guide wheel 11 Support bar 12 Lead frame 13 Die hole
Claims (3)
チップ搭載部の周りに多数のインナーリードを打抜き、
該インナーリードに連続してアウターリードを打抜き形
成するリードフレームの製造方法において、前記インナ
ーリードを打抜く際、打抜き形成対象リ−ドを先端部に
なるにつれ押圧力又は潰し量を大きくして押え隣接打抜
き部を打抜き半導体チップ搭載部に続けて形成し、焼鈍
し、インナーリードをコイニングし、半導体チップ搭載
部とインナーリードの接続部を打抜くことを特徴とする
リードフレームの製造方法。1. A large number of inner leads are punched from a thin metal plate around a semiconductor chip mounting portion by pressing.
In a method of manufacturing a lead frame in which an outer lead is punched and formed continuously with the inner lead, when the inner lead is punched, a pressing force or a crushing amount is increased as the lead for punching formation becomes a tip end portion. A method for manufacturing a lead frame, which comprises forming an adjacent punching part continuously after a punching semiconductor chip mounting part, annealing, coining an inner lead, and punching a connecting part between the semiconductor chip mounting part and the inner lead.
チップ搭載部の周りに多数のインナーリードを打抜き、
該インナーリードに連続してアウターリードを打抜き形
成するリードフレームの製造方法において、前記インナ
ーリードを打抜く際、打抜き形成対象リ−ドを先端部に
なるにつれ押圧力又は潰し量を大きくして押え隣接打抜
き部を打抜き半導体チップ搭載部に続けて形成し、焼鈍
し、半導体チップ搭載部とインナーリードの接続部を打
抜き、インナーリードをコイニングすることを特徴とす
るリードフレームの製造方法。2. A plurality of inner leads are punched from a thin metal plate around a semiconductor chip mounting portion by press working.
In a method of manufacturing a lead frame in which an outer lead is punched and formed continuously with the inner lead, when the inner lead is punched, a pressing force or a crushing amount is increased as the lead for punching formation becomes a tip end portion. A method for manufacturing a lead frame, which comprises forming an adjacent punched portion continuously from a punched semiconductor chip mounting portion, annealing the same, punching out a connecting portion between the semiconductor chip mounting portion and the inner lead, and coining the inner lead.
チップ搭載部の周りに多数のインナーリードを打抜き、
該インナーリードに連続してアウターリードを打抜き形
成するリードフレームの製造方法において、前記インナ
ーリードを打抜く際、打抜き形成対象リ−ドを先端部に
なるにつれ押圧力又は潰し量を大きくして押え隣接打抜
き部を打抜き半導体チップ搭載部に続けて形成し、焼鈍
し、半導体チップ搭載部外周とインナーリード先端の間
に抜き孔を打抜き、インナーリードをコイニングし、イ
ンナーリード先端の接続部を打抜くことを特徴とするリ
ードフレームの製造方法。3. A large number of inner leads are punched from a thin metal plate around a semiconductor chip mounting portion by pressing.
In a method of manufacturing a lead frame in which an outer lead is punched and formed continuously with the inner lead, when the inner lead is punched, a pressing force or a crushing amount is increased as the lead for punching formation becomes a tip end portion. Adjacent punching part is formed following punching semiconductor chip mounting part, annealed, punching hole is punched between outer periphery of semiconductor chip mounting part and inner lead tip, coining inner lead, punching connection part of inner lead tip A method of manufacturing a lead frame, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6163038A JP3052112B2 (en) | 1994-06-21 | 1994-06-21 | Method for manufacturing lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6163038A JP3052112B2 (en) | 1994-06-21 | 1994-06-21 | Method for manufacturing lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH088377A true JPH088377A (en) | 1996-01-12 |
| JP3052112B2 JP3052112B2 (en) | 2000-06-12 |
Family
ID=15766007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6163038A Expired - Fee Related JP3052112B2 (en) | 1994-06-21 | 1994-06-21 | Method for manufacturing lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3052112B2 (en) |
-
1994
- 1994-06-21 JP JP6163038A patent/JP3052112B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP3052112B2 (en) | 2000-06-12 |
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