JPH088411B2 - Manufacturing method of printed wiring board - Google Patents
Manufacturing method of printed wiring boardInfo
- Publication number
- JPH088411B2 JPH088411B2 JP63287373A JP28737388A JPH088411B2 JP H088411 B2 JPH088411 B2 JP H088411B2 JP 63287373 A JP63287373 A JP 63287373A JP 28737388 A JP28737388 A JP 28737388A JP H088411 B2 JPH088411 B2 JP H088411B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- hole
- printed wiring
- plating
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000007747 plating Methods 0.000 claims description 31
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 238000007772 electroless plating Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 13
- 239000003054 catalyst Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000007800 oxidant agent Substances 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 6
- 229920006015 heat resistant resin Polymers 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 239000000654 additive Substances 0.000 description 8
- 230000000996 additive effect Effects 0.000 description 8
- 238000005553 drilling Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 4
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 4
- 235000011121 sodium hydroxide Nutrition 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- -1 Polyethylene Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000011276 addition treatment Methods 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920006038 crystalline resin Polymers 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明はプリント配線板の製造方法に関し、特に本発
明は接続信頼性に優れたスルーホールが形成されたプリ
ント配線板の製造方法に関する。Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a printed wiring board, and more particularly, the present invention relates to a method for manufacturing a printed wiring board having through holes with excellent connection reliability.
（従来の技術） 近年、電子工業の進歩に伴い、電子機器の高性能化、
小型化および低コスト化が進められており、プリント配
線板においても高密度で高信頼性のものを安価に製造で
きる方法が要求されている。このような要求に応える製
造法として、表面回路とスルーホールを同時に無電解銅
めっきで導体形成するアディティブ法が最近注目されて
いる。(Prior Art) In recent years, with the progress of the electronic industry, the performance of electronic devices has been improved,
Miniaturization and cost reduction are being promoted, and there is a demand for a method of manufacturing a printed wiring board with high density and high reliability at low cost. As a manufacturing method that meets such demands, an additive method in which a surface circuit and a through hole are simultaneously formed by electroless copper plating has attracted attention.
（発明が解決しようとする問題点） しかしながら、従来、アディティブ法による高密度の
プリント配線板の製造方法によれば、スルーホールは、
一般にドリル削孔した後、感光性めっきレジストで回路
パターンを形成し、次いで無電解めっきする工程によっ
て導体形成されているため、特に小径のスルーホールを
形成する場合には、めっきレジストを現像する際にスル
ーホール内部にめっきレジストが残り易く、このめっき
レジスト残りがスルーホールの接続不良の発生原因とな
るという大きな欠点を有していた。(Problems to be Solved by the Invention) However, conventionally, according to the method for manufacturing a high-density printed wiring board by the additive method, the through holes are
Generally, after forming a circuit pattern with a photosensitive plating resist after drilling, the conductor is formed by the process of electroless plating, so especially when forming a small diameter through hole, when developing the plating resist. In addition, the plating resist is likely to remain inside the through hole, and the remaining plating resist has a major drawback that it causes connection failure of the through hole.
本発明は、上記従来技術の問題点を解決し、極めて接
続信頼性の高い、小径のスルーホールを形成することの
できるプリント配線板の製造方法を提供することを目的
とするものである。SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems of the prior art and to provide a method of manufacturing a printed wiring board which has extremely high connection reliability and can form a small-diameter through hole.
（問題点を解決するための手段） 本発明によれば、触媒入り絶縁基板上に酸化剤に対し
て可溶性の予め硬化処理された耐熱性樹脂微粉末が、硬
化処理されることにより酸化剤に対して難溶性となる未
硬化の耐熱性樹脂液中に分散されてなる無電解めっき用
接着剤からなる接着剤層を形成し、これを硬化してその
表面を酸化剤で粗化して露光、現像により感光性めっき
レジストで回路パターンを形成した後、レジスト表面を
保護するためのマスクを被覆してスルーホールを形成す
るための孔をドリル削孔し、次いで無電解めっきを施し
て導体回路を形成することを特徴とするプリント配線板
の製造方法により、前記目的を解決することができる。(Means for Solving Problems) According to the present invention, a pre-cured heat-resistant resin fine powder that is soluble in an oxidizing agent and is pre-cured on an insulating substrate containing a catalyst is converted into an oxidizing agent by curing. On the other hand, an adhesive layer made of an adhesive for electroless plating which is dispersed in an uncured heat-resistant resin liquid that is hardly soluble is formed, and the surface is exposed by roughening the surface with an oxidizing agent by curing this. After forming a circuit pattern with a photosensitive plating resist by development, a mask for protecting the resist surface is covered and a hole for forming a through hole is drilled, and then electroless plating is performed to form a conductor circuit. The above object can be solved by a method for manufacturing a printed wiring board, which is characterized in that the printed wiring board is formed.
以下、本発明を詳細に説明する。 Hereinafter, the present invention will be described in detail.
本発明によれば、触媒入り絶縁基板上に酸化剤に対し
て可溶性の予め硬化処理された耐熱性樹脂微粉末が、硬
化処理されることにより酸化剤に対して難溶性となる未
硬化の耐熱性樹脂液中に分散されてなる無電解めっき用
接着剤からなる接着剤層を形成し、その表面を酸化剤で
処理して、酸化剤に可溶性の耐熱性樹脂微粉末を溶解除
去することにより粗化した後、感光性めっきレジストで
回路パターンを形成し、レジスト表面を保護するための
マスクを被覆してスルーホールを形成するための孔をド
リル削孔することが必要である。感光性めっきレジスト
を形成した後、スルーホールを形成するための孔をドリ
ル削孔する理由は、ドリル削孔した後、めっきレジスト
を形成すると、めっきレジストを現像する際にスルーホ
ール内部にめっきレジストが残り易く、このめっきレジ
スト残りがスルーホールの接続不良の発生原因となるか
らである。また、接着剤層表面が粗化されているため、
感光性めっきレジストとの密着に優れ、ドリル削孔によ
っても剥離する事はない。According to the present invention, a pre-cured heat-resistant resin fine powder that is soluble in an oxidant on an insulating substrate containing a catalyst is hardened in an oxidant by being subjected to a curing treatment. By forming an adhesive layer consisting of an adhesive for electroless plating dispersed in a liquid crystalline resin, treating the surface with an oxidizing agent, and removing the heat-resistant resin fine powder soluble in the oxidizing agent by dissolution. After roughening, it is necessary to form a circuit pattern with a photosensitive plating resist, cover a mask for protecting the resist surface, and drill holes for forming through holes. The reason for drilling a hole for forming a through hole after forming a photosensitive plating resist is that when the plating resist is formed after drilling, the plating resist is developed inside the through hole when the plating resist is developed. Is likely to remain, and the remainder of the plating resist causes a defective connection of the through hole. Also, since the surface of the adhesive layer is roughened,
It adheres well to the photosensitive plating resist and does not peel even when drilled.
本発明によれば、レジスト表面を保護するためのマス
クを被覆してスルーホールを形成するための孔をドリル
削孔し、次いで前記マスクを除去して無電解めっきす
る。前記レジスト表面を保護するためのマスクを被覆す
る理由は、マスクを被覆することなくドリル削孔する
と、ドリル削孔時にレジストに剥がれやクラックが発生
して、信頼性の高い回路パターンを形成することができ
ないからである。According to the present invention, the mask for protecting the resist surface is covered and the holes for forming the through holes are drilled, and then the mask is removed and electroless plating is performed. The reason for coating the mask for protecting the resist surface is that if drilling is performed without covering the mask, peeling or cracks occur in the resist during drilling, and a highly reliable circuit pattern is formed. Because you can't.
前記プリント配線板は、0.5mm以下の径のスルーホー
ルを有するものであることが好ましい。その理由は、0.
5mm以下の径のスルーホールを有するプリント配線板
は、導体回路を形成する面積がスルーホールによって狭
められることがそれほどないため、複雑で高密度の回路
を容易に形成することができるからである。なお、径が
0.5mmより大きいスルーホールであれば、めっきレジス
ト形成時にスルーホール内部にめっきレジストが残るこ
とは殆どないため本発明のような製造方法を必要としな
い。The printed wiring board preferably has a through hole with a diameter of 0.5 mm or less. The reason is 0.
This is because a printed wiring board having a through hole with a diameter of 5 mm or less does not reduce the area for forming a conductor circuit so much by the through hole, so that a complicated and high-density circuit can be easily formed. The diameter is
If the through hole is larger than 0.5 mm, the plating resist hardly remains inside the through hole when the plating resist is formed, and thus the manufacturing method of the present invention is not required.
本発明によれば、表面に接着剤層が形成された絶縁基
板を使用することが必要である。その理由は、本発明に
おける回路パターンは、無電解めっきで形成されるため
絶縁基板の表面に接着剤層が形成されていないと回路パ
ターンを絶縁基板の表面に強固に密着することが困難で
あるからである。According to the invention, it is necessary to use an insulating substrate having an adhesive layer formed on its surface. The reason is that since the circuit pattern in the present invention is formed by electroless plating, it is difficult to firmly adhere the circuit pattern to the surface of the insulating substrate unless an adhesive layer is formed on the surface of the insulating substrate. Because.
本発明によれば、前記接着剤は触媒入りのものを使用
することが有利である。その理由は、触媒入りの接着剤
を使用することにより、めっきレジストを被覆する前の
触媒付加処理を省略することができるからである。According to the invention, it is advantageous to use a catalyst-containing adhesive. The reason is that the catalyst addition treatment before coating the plating resist can be omitted by using the adhesive containing the catalyst.
本発明によれば、絶縁基板は触媒入りのものを使用す
ることが必要である。その理由は、触媒入りの絶縁基板
を使用することにより、めっきレジストを被覆した基板
をドリル削孔してスルーホール孔を形成した後、触媒付
与処理を施すことなく無電解めっきにより、回路パター
ンを形成することができるからである。According to the present invention, it is necessary to use a catalyst-containing insulating substrate. The reason is that by using an insulating substrate containing a catalyst, a substrate coated with a plating resist is drilled to form a through hole, and then a circuit pattern is formed by electroless plating without applying a catalyst. This is because it can be formed.
本発明によれば、前述の如くしてスルーホールを形成
するための孔が形成された基板に無電解めっきを施して
導体回路が形成され、プリント配線板が製造される。According to the present invention, a printed circuit board is manufactured by electroless plating a substrate having holes for forming through holes as described above to form a conductor circuit.
以下、本発明を実施例により、さらに詳細に説明す
る。Hereinafter, the present invention will be described in more detail with reference to Examples.
実施例１ （１） フェノールノボラック型エポキシ樹脂（油化シ
ェル製、商品名：エピコート−154）60部、ビスフェノ
ールＡ型エポキシ樹脂（油化シェル製、商品名：エピコ
ート−1001）40部、イミダゾール系硬化剤（四国化成
型、商品名:2P4MHZ）４部、エポキシ樹脂微粉末（東レ
製、商品名：トレパールEP−Ｂ）30部、塩化パラジウム
（博光化学工業製、特級塩化パラジウム）0.1部とを３
本ロールで混合し、メチルセルソルブで粘度500CPSに調
整して接着剤を作製した。Example 1 (1) 60 parts of phenol novolac type epoxy resin (made by Yuka Shell, trade name: Epikote-154), 40 parts of bisphenol A epoxy resin (made by Yuka Shell, trade name: Epikote-1001), imidazole series 4 parts of curing agent (Shikoku molding, trade name: 2P4MHZ), 30 parts of epoxy resin fine powder (made by Toray, trade name: Trepearl EP-B), 0.1 part of palladium chloride (Hakuko Kagaku Kogyo, special grade palladium chloride) Three
An adhesive was prepared by mixing with this roll and adjusting the viscosity to 500 CPS with methyl cellosolve.
（２） この接着剤をロールコーター（サーマトロニク
ス貿易社製、商品名:MRC−450）を使用して、メッキ触
媒として予め塩化パラジウムを含有させたガラスエポキ
シ絶縁板の両面に塗布した後、100で１時間、さらに150
℃で５時間乾燥硬化させて、厚さ20μｍの接着層を形成
した。(2) Using a roll coater (trade name: MRC-450, manufactured by Thermatronics Trading Co., Ltd.), this adhesive was applied to both surfaces of a glass epoxy insulating plate containing palladium chloride in advance as a plating catalyst, and then 100 1 hour, 150 more
It was dried and cured at 5 ° C. for 5 hours to form an adhesive layer having a thickness of 20 μm.
（３） この基板を無水クロム酸800g/水溶液中に70
℃で20分間浸漬して、接着剤の表面を粗化した後、中和
溶液（シプレイ社製、商品名:PM950）に浸漬し、水洗し
た。(3) 70% of this substrate in 800 g of chromic anhydride / water solution
After immersing at 20 ° C. for 20 minutes to roughen the surface of the adhesive, it was immersed in a neutralizing solution (made by Shipley, trade name: PM950) and washed with water.
（４） アディティブ用感光製ドライフィルム（サンノ
プコ社製、商品名:DFR−40C）をラミネートし、露光し
現象してめっきレジストを形成した。(4) A photosensitive dry film for additive (manufactured by San Nopco, trade name: DFR-40C) was laminated and exposed to light to form a plating resist.
（５） 粘着剤付きポリエチレン、アクリル系フィルム
（スミロン社製、商品名:E−74M）をラミネートし、め
っきレジスト上にこのフィルムによるマスクを形成し
た。(5) Polyethylene with an adhesive and an acrylic film (manufactured by Sumilon, trade name: E-74M) were laminated, and a mask of this film was formed on the plating resist.
（６） 所望の位置に、NC多軸ドリル加工機（Exceilon
Automation社製、商品名:Mark Driller）を使用して0.
3mmφの貫通孔を穿孔した。(6) NC multi-axis drilling machine (Exceilon
Automation, product name: Mark Driller).
A 3 mmφ through hole was drilled.
（７） フィルムによるマスクを剥離し、水洗した。(7) The film mask was peeled off and washed with water.
（８） 活性化処理を行った後、下期に組成を示すアデ
ィテイブ用無電解めっき液に11時間浸漬して、めっき膜
の厚さが約25μｍの無電解銅めっきを施し、両面スルー
ホール配線板を作製した。(8) After the activation treatment, it is dipped in the electroless plating solution for additive which shows the composition in the second half for 11 hours, and the electroless copper plating with the thickness of the plating film is about 25 μm is applied. Was produced.
硫酸銅（CuSO4・5H2O）0.6モル１ ホルマリン（37％） 0.3モル 苛性ソーダ（NaOH） 0.35モル EDTA 0.12モル１ 添加剤 少々 メッキ温度:70〜72℃ PH:12.4 実施例２ （１） エポキシ樹脂ワニス（三井石油化学社製、商品
名:TA−1850）100部、エポキシ樹脂微粉末（東レ製、商
品名：トレパールEP−Ｂ）50部とを３本ロールで混合
し、ブチルセルソルブで粘度500CPSに調整して接着剤を
作製した。Copper sulfate (CuSO 4 .5H 2 O) 0.6 mol 1 Formalin (37%) 0.3 mol Caustic soda (NaOH) 0.35 mol EDTA 0.12 mol 1 Additive A little Plating temperature: 70-72 ° C PH: 12.4 Example 2 (1) Epoxy 100 parts of resin varnish (manufactured by Mitsui Petrochemical Co., Ltd., trade name: TA-1850) and 50 parts of epoxy resin fine powder (manufactured by Toray, trade name: Trepearl EP-B) are mixed with a three-roll mill, and then butyl cellosolve An adhesive was prepared by adjusting the viscosity to 500 CPS.
（２） この接着剤をロールコーター（サーマトロニク
ス貿易社製、商品名:MRC−450）を使用して、メッキ触
媒として予め塩化パラジウムを含有させたガラスエポキ
シ絶縁板の両面に塗布した後、100℃で１時間、さらに1
50℃で５時間乾燥硬化させて、厚さ20μｍの接着層を形
成した。(2) Using a roll coater (trade name: MRC-450, manufactured by Thermatronics Trading Co., Ltd.), this adhesive was applied to both surfaces of a glass epoxy insulating plate containing palladium chloride in advance as a plating catalyst, and then 100 1 hour at ℃, 1 more
It was dried and cured at 50 ° C. for 5 hours to form an adhesive layer having a thickness of 20 μm.
（３） この基板を無水クロム酸500g/水溶液注に70
℃で15分間浸漬して、接着剤の表面を粗化した後、中和
溶液（シプレイ社製、商品名:PM950）に浸漬し、水洗し
た。(3) This substrate was poured into chromic anhydride 500 g / water solution 70
After immersing at 15 ° C. for 15 minutes to roughen the surface of the adhesive, it was immersed in a neutralizing solution (made by Shipley, trade name: PM950) and washed with water.
（４） 基板全面にパラジウム触媒（シプレイ社製、商
品名：キャタポジット44）を付与した。(4) A palladium catalyst (manufactured by Shipley, trade name: Cataposit 44) was applied to the entire surface of the substrate.
（５） アディティブ用感光製ドライフィルム（サンノ
プコ社製、商品名:DFR−40C）をラミネートし、露光し
現象してめっきレジストを形成した。(5) A photosensitive dry film for additive (manufactured by San Nopco, trade name: DFR-40C) was laminated and exposed to light to form a plating resist.
（６） 粘着剤付きポリエチレン、アクリル系フィルム
（スミロン社製、商品名:E−74M）をラミネートし、め
っきレジスト上にこのフィルムによるマスクを形成し
た。(6) A polyethylene with an adhesive and an acrylic film (manufactured by Sumilon, trade name: E-74M) were laminated, and a mask made of this film was formed on the plating resist.
（７） 所望の位置に、NC多軸ドリル加工機（Exceilon
Automation社製、商品名:Mark Driller）を使用して0.
3mmφの貫通孔を穿孔した。(7) NC multi-axis drilling machine (Exceilon
Automation, product name: Mark Driller).
A 3 mmφ through hole was drilled.
（８） フィルムによるマスクを剥離し、水洗した。(8) The film mask was peeled off and washed with water.
（９） 活性化処理を行った後、下期に組成を示すアデ
ィテイブ用無電解めっきに11時間浸漬して、めっき膜の
厚さが約25μｍの無電解銅めっきを施し、両面スルーホ
ール配線板を作製した。(9) After the activation treatment, dip it in the electroless plating for additive which shows the composition in the second half for 11 hours, and apply electroless copper plating with a plating film thickness of about 25 μm to form a double-sided through-hole wiring board. It was made.
硫酸銅（CuSO4・5H2O）0.6モル１ ホルマリン（37％） 0.3モル 苛性ソーダ（NaOH） 0.35モル EDTA 0.12モル１ 添加剤 少々 メッキ温度:70〜72℃ PH:12.4 （発明の効果） 以上述べたように、本発明方法によれば、レジスト残
渣を無くしスルーホール信頼性を向上させると同時にレ
ジストの剥離やクラックを防止できるプリント配線板の
製造方法を提供することができ、産業上寄与する効果は
極めて大きい。Copper sulfate (CuSO 4 .5H 2 O) 0.6 mol 1 Formalin (37%) 0.3 mol Caustic soda (NaOH) 0.35 mol EDTA 0.12 mol 1 Additive A little Plating temperature: 70-72 ℃ PH: 12.4 (Effect of the invention) As described above, according to the method of the present invention, it is possible to provide a method for manufacturing a printed wiring board that can eliminate resist residue and improve through-hole reliability, and at the same time prevent resist peeling and cracks. Is extremely large.
Claims (2)
絶縁基板上に露光し、現像して、感光性めっきレジスト
を形成した後、スルーホールを形成するための孔をドリ
ル削孔し、次いで無電解めっきを施して導体回路を形成
するプリント配線板の製造方法において、 接着剤として、酸化剤に対して可溶性の予め硬化処理さ
れた耐熱性樹脂微粉末が、硬化処理されることにより酸
化剤に対して難溶性となる未硬化の耐熱性樹脂液中に分
散されてなる無電解めっき用接着剤を用い、前記無電解
めっき用接着剤の表面を酸化剤で粗化し、感光性めっき
レジストで回路パターンを形成した後、レジスト表面を
保護するためのマスクを被覆してスルーホールを形成す
るための孔をドリル削孔し、次いで無電解めっきを施し
て導体回路を形成することを特徴とするプリント配線板
の製造方法。1. A photosensitive insulating resist is formed on a catalyst-containing insulating substrate having an adhesive layer formed on its surface by exposure and development to form a photosensitive plating resist, and then a hole for forming a through hole is drilled. Then, in a method for manufacturing a printed wiring board in which a conductor circuit is formed by applying electroless plating, a pre-cured heat-resistant resin fine powder that is soluble in an oxidant as an adhesive is cured. Using an adhesive for electroless plating that is dispersed in an uncured heat-resistant resin liquid that is difficult to dissolve in an oxidizing agent, the surface of the adhesive for electroless plating is roughened with an oxidizing agent, and photosensitive plating is performed. After forming a circuit pattern with a resist, a hole for forming a through hole is drilled by covering a mask for protecting the resist surface, and then electroless plating is performed to form a conductor circuit. A method of manufacturing a printed wiring board.
スルーホールを有する請求項１記載のプリント配線板の
製造方法。2. The method of manufacturing a printed wiring board according to claim 1, wherein the printed wiring board has through holes having a diameter of 0.5 mm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63287373A JPH088411B2 (en) | 1988-11-14 | 1988-11-14 | Manufacturing method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63287373A JPH088411B2 (en) | 1988-11-14 | 1988-11-14 | Manufacturing method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02133989A JPH02133989A (en) | 1990-05-23 |
| JPH088411B2 true JPH088411B2 (en) | 1996-01-29 |
Family
ID=17716524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63287373A Expired - Lifetime JPH088411B2 (en) | 1988-11-14 | 1988-11-14 | Manufacturing method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH088411B2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6358890A (en) * | 1986-08-29 | 1988-03-14 | 日本電気株式会社 | Manufacture of printed wiring board |
| JPH07103274B2 (en) * | 1987-07-08 | 1995-11-08 | 住友化学工業株式会社 | Olefin-based thermoplastic elastomer composition |
| JP3263985B2 (en) * | 1992-08-05 | 2002-03-11 | 住友化学工業株式会社 | Thermoplastic elastomer composition, skin material for industrial parts comprising the composition, and laminate comprising the skin material |
-
1988
- 1988-11-14 JP JP63287373A patent/JPH088411B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02133989A (en) | 1990-05-23 |
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