JPH0897521A - Printed circuit board for mounting cylindrical electronic components - Google Patents
Printed circuit board for mounting cylindrical electronic componentsInfo
- Publication number
- JPH0897521A JPH0897521A JP6228130A JP22813094A JPH0897521A JP H0897521 A JPH0897521 A JP H0897521A JP 6228130 A JP6228130 A JP 6228130A JP 22813094 A JP22813094 A JP 22813094A JP H0897521 A JPH0897521 A JP H0897521A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting hole
- cylindrical electronic
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】
【目的】 円筒状電子部品をプリント基板上に固定する
ための取付穴を開穿する場合に於いて、該取付穴の寸法
を高精度にする必要がなく、また、実装時に於いて該円
筒状電子部品の端子を折曲することなく、容易かつ効率
的に実装できる。
【構成】 円筒状電子部品１３をプリント基板１０上に
固定するために、該プリント基板１０にほぼ台形状の取
付穴１１を開穿する。而して、該円筒状電子部品１３の
直径に対して該取付穴１１の底辺近傍の巾は大きく形成
され、且つ、該取付穴１１の頂部近傍の左右側辺の巾は
小さく形成される。更に、該円筒状電子部品１３の本体
円筒部の長さに対して、該取付穴１１の長手方向の長さ
は小さく形成される。そして、該取付穴１１の底辺近傍
の前記プリント基板１０上に取付ランド１２，１２を設
ける。
(57) [Abstract] [Purpose] When opening a mounting hole for fixing a cylindrical electronic component on a printed circuit board, it is not necessary to make the size of the mounting hole highly accurate, and mounting is also possible. At times, the terminals of the cylindrical electronic component can be mounted easily and efficiently without bending. [Structure] In order to fix the cylindrical electronic component 13 on the printed circuit board 10, a substantially trapezoidal mounting hole 11 is opened in the printed circuit board 10. Thus, the width of the mounting hole 11 near the bottom is larger than the diameter of the cylindrical electronic component 13, and the width of the left and right sides near the top of the mounting hole 11 is small. Further, the length of the mounting hole 11 in the longitudinal direction is smaller than the length of the cylindrical portion of the main body of the cylindrical electronic component 13. Then, the mounting lands 12, 12 are provided on the printed circuit board 10 near the bottom of the mounting hole 11.
Description
【０００１】[0001]
【産業上の利用分野】この発明は、円筒状電子部品を実
装するための取付穴を有するプリント基板に関するもの
であり、特に、該取付穴の寸法を高精度にする必要がな
く、且つ、実装作業を効率的に行うことができるように
するための円筒状電子部品実装用プリント基板に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board having a mounting hole for mounting a cylindrical electronic component, and in particular, it is not necessary to make the size of the mounting hole highly accurate, and mounting is possible. The present invention relates to a printed circuit board for mounting a cylindrical electronic component that enables efficient work.
【０００２】[0002]
【従来の技術】従来、此種円筒状電子部品を実装すべき
プリント基板及び該円筒状電子部品について、図３に従
って説明する。図に於いて、１はプリント基板であり、
該プリント基板１には、例えば水晶発振器、コンデンサ
等の円筒状電子部品２を実装すべき長方形状の取付穴３
が開穿されている。而して、該取付穴３の巾ｍは、該円
筒状電子部品２を所定深さに嵌合するために該円筒状電
子部品２の直径ｄよりやや小に形成され、そして、該取
付穴３の長さ方向は、該円筒状電子部品２の長さよりや
や大に形成されている。2. Description of the Related Art Conventionally, a printed circuit board on which a cylindrical electronic component of this kind is to be mounted and the cylindrical electronic component will be described with reference to FIG. In the figure, 1 is a printed circuit board,
The printed circuit board 1 has a rectangular mounting hole 3 in which a cylindrical electronic component 2 such as a crystal oscillator or a capacitor is to be mounted.
Has been opened. Thus, the width m of the mounting hole 3 is formed to be slightly smaller than the diameter d of the cylindrical electronic component 2 in order to fit the cylindrical electronic component 2 to a predetermined depth, and the mounting hole 3 The length direction of 3 is formed to be slightly larger than the length of the cylindrical electronic component 2.
【０００３】[0003]
【発明が解決しようとする課題】上記従来の此種円筒状
電子部品２を実装すべきプリント基板１に於いては、長
方形状取付穴３の巾ｍが円筒状電子部品２の直径ｄより
も小さすぎると、該円筒状電子部品２がプリント基板１
の上に浮遊した状態となり、一方、該巾ｍが大きすぎる
と円筒状電子部品２が取付穴３を貫通してプリント基板
１の下方に落下することになり、いずれの場合も、該円
筒状電子部品２をプリント基板１に正確に嵌合できな
い。従って、該長方形取付穴３の巾ｍは各円筒状電子部
品２の直径ｄに可及的に近似させ、且つ、直径ｄを超え
ないように設計され、且つ、精密に加工されなければな
らない。In the conventional printed circuit board 1 on which this type of cylindrical electronic component 2 is mounted, the width m of the rectangular mounting hole 3 is larger than the diameter d of the cylindrical electronic component 2. If it is too small, the cylindrical electronic component 2 will be printed on the printed circuit board 1.
On the other hand, when the width m is too large, the cylindrical electronic component 2 penetrates the mounting hole 3 and falls below the printed circuit board 1, and in any case, the cylindrical shape The electronic component 2 cannot be accurately fitted to the printed circuit board 1. Therefore, the width m of the rectangular mounting hole 3 must be designed to be as close as possible to the diameter d of each cylindrical electronic component 2 and must be designed so as not to exceed the diameter d, and must be machined precisely.
【０００４】また、円筒状電子部品２の端子４，４を取
付ランド５，５にハンダ付けするときに於いては、図４
に図示する如く、端子４，４を下方に折曲してその先端
部を前記取付ランド５，５に接触させ、そして、該接触
部をハンダ付けすることになる。従って、該円筒状電子
部品２の実装作業が極めて煩雑となる。Further, when soldering the terminals 4 and 4 of the cylindrical electronic component 2 to the mounting lands 5 and 5, FIG.
As shown in FIG. 3, the terminals 4 and 4 are bent downward so that the tips thereof come into contact with the mounting lands 5 and 5, and the contact portions are soldered. Therefore, the mounting work of the cylindrical electronic component 2 becomes extremely complicated.
【０００５】そこで、プリント基板に設けられる取付穴
の設計上および加工上の高精度を必要とせず、且つ、円
筒状電子部品の端子を容易、確実に溶着して作業性を向
上させるために解決せらるべき技術的課題が生じてくる
のであり、本発明は該課題を解決することを目的とす
る。Therefore, a problem is solved in order to improve workability by welding the terminals of the cylindrical electronic component easily and surely without requiring high precision in the design and processing of the mounting hole provided in the printed circuit board. A technical problem to be raised arises, and an object of the present invention is to solve the problem.
【０００６】[0006]
【課題を解決するための手段】本発明は、上記目的を達
成するために提案せられたものであり、円筒状電子部品
を実装すべきプリント基板に於いて、該プリント基板に
ほぼ台形状の取付穴を開穿すると共に、該取付穴の底辺
近傍の該プリント基板上に取付ランドを設け、且つ、該
取付穴の底辺近傍は前記円筒状電子部品の直径より巾大
に形成され、並びに該取付穴の頂部近傍の左右側辺の巾
は前記円筒状電子部品の直径より巾小に形成され、更
に、該取付穴の長手方向の長さは、該円筒状電子部品の
本体円筒部の長さよりやや大に形成されている円筒状電
子部品実装用プリント基板を提供するものである。DISCLOSURE OF THE INVENTION The present invention has been proposed in order to achieve the above object, and in a printed circuit board on which a cylindrical electronic component is to be mounted, the printed circuit board has a substantially trapezoidal shape. The mounting hole is opened, a mounting land is provided on the printed circuit board near the bottom of the mounting hole, and the vicinity of the bottom of the mounting hole is formed wider than the diameter of the cylindrical electronic component. The width of the left and right sides near the top of the mounting hole is smaller than the diameter of the cylindrical electronic component, and the length of the mounting hole in the longitudinal direction is the length of the main body cylindrical portion of the cylindrical electronic component. Provided is a printed circuit board for mounting a cylindrical electronic component, which is formed to be slightly larger.
【０００７】[0007]
【作用】プリント基板に開穿されたほぼ台形状の取付穴
に、実装しようとする円筒状電子部品の端子突設側を該
取付穴の底部側に対峙させ、且つ、該円筒状電子部品の
反対側を該取付穴の頂部側に対峙させて、該円筒状電子
部品を該取付穴に挿入する。In the substantially trapezoidal mounting hole formed in the printed circuit board, the terminal projecting side of the cylindrical electronic component to be mounted faces the bottom side of the mounting hole, and The cylindrical electronic component is inserted into the mounting hole with the opposite side facing the top side of the mounting hole.
【０００８】斯くして、該円筒状電子部品の前記反対側
付近の下方外周面が、該取付穴の頂部近傍の左側辺及び
右側辺の各一箇所で接触して係止される。更に、該円筒
状電子部品の端子突設側は該取付穴に陥入すると共に、
該円筒状電子部品の端子がプリント基板に設けられてい
る取付ランドに接触して該円筒状電子部品が該プリント
基板の前記取付穴に仮固定される。斯くして、該端子
は、該取付ランドにハンダ付け等の手段によって固定さ
れる。Thus, the lower outer peripheral surface of the cylindrical electronic component near the opposite side is brought into contact with and locked at each of the left side and the right side near the top of the mounting hole. Furthermore, the terminal protruding side of the cylindrical electronic component is recessed into the mounting hole,
The terminals of the cylindrical electronic component come into contact with the mounting lands provided on the printed circuit board to temporarily fix the cylindrical electronic component in the mounting hole of the printed circuit board. Thus, the terminal is fixed to the mounting land by means such as soldering.
【０００９】[0009]
【実施例】以下、本発明の一実施例を図１及び図２に従
って詳述する。図に於いて１０はプリント基板であり、
該プリント基板１０にはほぼ台形状の取付穴１１が開穿
されている。また、該取付穴１１の底辺近傍のプリント
基板１０上には取付ランド１２，１２が設けられてい
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to FIGS. In the figure, 10 is a printed circuit board,
The printed circuit board 10 is provided with a substantially trapezoidal mounting hole 11. Mounting lands 12, 12 are provided on the printed circuit board 10 near the bottom of the mounting hole 11.
【００１０】該取付穴１１の寸法は、実装されるべき円
筒状電子部品１３に対応して設定され、該取付穴１１の
底辺の巾ｎは該円筒状電子部品１３の直径ｄよりも巾大
に形成され、且つ、該取付穴１１の頂部近傍の左右側辺
の巾ｍは、該円筒状電子部品１３の直径ｄよりも巾小に
形成されるとともに、該取付穴１１の長手方向の長さＬ
は、該円筒状電子部品１３の長さｈよりもやや大きく形
成されている。The size of the mounting hole 11 is set corresponding to the cylindrical electronic component 13 to be mounted, and the width n of the bottom side of the mounting hole 11 is larger than the diameter d of the cylindrical electronic component 13. And the width m of the left and right sides near the top of the mounting hole 11 is smaller than the diameter d of the cylindrical electronic component 13, and the length of the mounting hole 11 in the longitudinal direction is long. L
Are formed to be slightly larger than the length h of the cylindrical electronic component 13.
【００１１】斯くして、該円筒状電子部品１３の端子突
設側を、該取付穴１１の底部側に対峙させ、且つ、該円
筒状電子部品１３の反対側を該取付穴１１の頂部側に対
峙させて該円筒状電子部品１３を該取付穴１１に挿入す
る。而して、該円筒状電子部品１３の端子突設側は該取
付穴１１に陥入するが、該円筒状電子部品１３の前記反
対側は該取付穴１１に陥入できない。従って、図２に図
示する如く、該円筒状電子部品１３の前記反対側付近の
下方外周面が、該取付穴１１の頂部近傍の左側辺及び右
側辺の各一箇所Ｐ及びＱに於いて接触し、該円筒状電子
部品１３は端子突設側を該取付穴１１にやや陥入させつ
つ、前記反対側をやや上方に持ち上げた状態でプリント
基板１０に係止される。また、該円筒状電子部品１３の
端子１４，１４は、該円筒状電子部品１３本体の傾きに
従じて該取付穴１１底辺近傍のプリント基板１０表面と
接触するが、この時、該端子１４，１４先端が前記取付
ランド１２，１２に接触するように、端子１４，１４の
長さ、または該円筒状電子部品１３の取付穴１１への係
止位置を調整する。斯くして、該端子１４，１４先端と
該取付ランド１２，１２の接触点をハンダ付けすること
によって該円筒状電子部品１３はプリント基板１０に固
定される。Thus, the terminal protruding side of the cylindrical electronic component 13 faces the bottom side of the mounting hole 11, and the opposite side of the cylindrical electronic component 13 is the top side of the mounting hole 11. And the cylindrical electronic component 13 is inserted into the mounting hole 11. Thus, the terminal protruding side of the cylindrical electronic component 13 is recessed in the mounting hole 11, but the opposite side of the cylindrical electronic component 13 cannot be recessed in the mounting hole 11. Therefore, as shown in FIG. 2, the lower outer peripheral surface of the cylindrical electronic component 13 near the opposite side is in contact with the left and right sides P and Q near the top of the mounting hole 11. Then, the cylindrical electronic component 13 is engaged with the printed circuit board 10 with the terminal projecting side slightly recessed into the mounting hole 11 and the opposite side slightly raised. Further, the terminals 14, 14 of the cylindrical electronic component 13 contact the surface of the printed circuit board 10 near the bottom of the mounting hole 11 according to the inclination of the main body of the cylindrical electronic component 13, but at this time, the terminals 14 , 14 adjust the length of the terminals 14, 14 or the position of locking the cylindrical electronic component 13 to the mounting hole 11 so that the tips of the terminals 14 contact the mounting lands 12, 12. Thus, the cylindrical electronic component 13 is fixed to the printed circuit board 10 by soldering the contact points between the tips of the terminals 14 and 14 and the mounting lands 12 and 12.
【００１２】従って、従来の如く、取付穴を高精密に開
穿することなく、円筒状電子部品を容易にプリント基板
上に固定できる。また、該円筒状電子部品の端子を折曲
することなくハンダ付けできる。尚、本発明は、本発明
の精神を逸脱しない限り種々の改変を為すことができ、
そして、本発明が該改変されたものに及ぶことは当然で
ある。Therefore, the cylindrical electronic component can be easily fixed on the printed circuit board without opening the mounting hole with high precision as in the conventional case. Also, the terminals of the cylindrical electronic component can be soldered without bending. The present invention can be modified in various ways without departing from the spirit of the present invention.
And, it goes without saying that the present invention extends to the modified one.
【００１３】[0013]
【発明の効果】本発明は、上記一実施例にて詳述せる如
く、実装すべき円筒状電子部品の直径よりも底辺は大き
く、且つ、頂部近傍の左右側辺の巾は小さく形成され、
また、該円筒状電子部品の長さよりも長手方向がやや大
きく形成された台形状取付穴を設けたプリント基板によ
って構成されている。従って、該円筒状電子部品をプリ
ント基板上に固定する機能を維持しつつ、且つ、取付穴
の設計が容易となる。また、該取付穴の開穿は高精密に
行う必要もない。更に、該円筒状電子部品の端子を折曲
することなく、該端子を取付ランドに接触させることが
できるので極めて容易にハンダ付けでき、実装作業効率
が著しく向上すると共にコストダウンにも寄与する等正
に諸種の効果を奏する発明である。As described in detail in the above embodiment, the present invention is formed such that the bottom side is larger than the diameter of the cylindrical electronic component to be mounted and the widths of the left and right side sides near the top are small.
Moreover, the printed circuit board is provided with a trapezoidal mounting hole whose longitudinal direction is slightly larger than the length of the cylindrical electronic component. Therefore, the design of the mounting hole is facilitated while maintaining the function of fixing the cylindrical electronic component on the printed circuit board. Further, it is not necessary to open the mounting hole with high precision. Furthermore, since the terminals of the cylindrical electronic component can be brought into contact with the mounting lands without bending, the terminals can be soldered very easily, the mounting work efficiency is significantly improved, and the cost is reduced. It is an invention that exhibits various kinds of effects.
【図１】本発明の一実施例を示し、円筒状電子部品をプ
リント基板に実装しようとする状態を示す一部切欠斜視
図。FIG. 1 is a partially cutaway perspective view showing a state where a cylindrical electronic component is about to be mounted on a printed circuit board according to an embodiment of the present invention.
【図２】本発明の一実施例を示し、円筒状電子部品を実
装した状態を示す一部切欠斜視図。FIG. 2 is a partially cutaway perspective view showing a state in which a cylindrical electronic component is mounted according to an embodiment of the present invention.
【図３】従来例を示し円筒状電子部品をプリント基板に
実装しようとする状態を示す一部切欠斜視図。FIG. 3 is a partially cutaway perspective view showing a conventional example in which a cylindrical electronic component is about to be mounted on a printed circuit board.
【図４】円筒状電子部品を実装した状態における図４の
Ａ−Ａ線断面図。FIG. 4 is a cross-sectional view taken along the line AA of FIG. 4 in a state where a cylindrical electronic component is mounted.
１０ プリント基板 １１ 取付穴 １２ 取付ランド １３ 円筒状電子部品 １４ 円筒状電子部品端子 10 Printed Circuit Board 11 Mounting Hole 12 Mounting Land 13 Cylindrical Electronic Component 14 Cylindrical Electronic Component Terminal
Claims (1)
板に於いて、該プリント基板にほぼ台形状の取付穴を開
穿すると共に、該取付穴の底辺近傍の該プリント基板上
に取付ランドを設け、且つ、該取付穴の底辺近傍は前記
円筒状電子部品の直径より巾大に形成され、並びに該取
付穴の頂部近傍の左右側辺の巾は前記円筒状電子部品の
直径より巾小に形成され、更に、該取付穴の長手方向の
長さは、該円筒状電子部品の本体円筒部の長さよりやや
大に形成されていることを特徴とする円筒状電子部品実
装用プリント基板。1. In a printed circuit board on which a cylindrical electronic component is to be mounted, a substantially trapezoidal mounting hole is opened in the printed circuit board, and a mounting land is provided on the printed circuit board near the bottom of the mounting hole. Provided, the vicinity of the bottom of the mounting hole is formed wider than the diameter of the cylindrical electronic component, and the width of the left and right sides near the top of the mounting hole is smaller than the diameter of the cylindrical electronic component. A printed circuit board for mounting a cylindrical electronic component, wherein the mounting hole is formed so that the length of the mounting hole in the longitudinal direction is slightly larger than the length of the main body cylindrical portion of the cylindrical electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6228130A JPH0897521A (en) | 1994-09-22 | 1994-09-22 | Printed circuit board for mounting cylindrical electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6228130A JPH0897521A (en) | 1994-09-22 | 1994-09-22 | Printed circuit board for mounting cylindrical electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0897521A true JPH0897521A (en) | 1996-04-12 |
Family
ID=16871691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6228130A Pending JPH0897521A (en) | 1994-09-22 | 1994-09-22 | Printed circuit board for mounting cylindrical electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0897521A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016151666A (en) * | 2015-02-17 | 2016-08-22 | キヤノン株式会社 | Scanning optical device |
| JP2019139249A (en) * | 2019-05-07 | 2019-08-22 | キヤノン株式会社 | Scanning optical device |
-
1994
- 1994-09-22 JP JP6228130A patent/JPH0897521A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016151666A (en) * | 2015-02-17 | 2016-08-22 | キヤノン株式会社 | Scanning optical device |
| JP2019139249A (en) * | 2019-05-07 | 2019-08-22 | キヤノン株式会社 | Scanning optical device |
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