JPH09126184A - Fan resin composition and fan - Google Patents

Abstract

(57) [Summary] [Purpose] A resin composition for fans and a resin composition for fans which are excellent in antibacterial property, mildewproof property and rigidity, and can be used for blower fans such as air conditioners for both heating and cooling and various equipment are molded. To provide fans. [Structure] A fan resin composition and a fan comprising the following components (A) and (B). Component (A): Contains 100 parts by weight of the resin component (a) and 5 to 100 parts by weight of the filler (b), and has a bending modulus of 60,000 kg at room temperature (23 ° C.).
100 parts by weight of a resin composition having a density of at least 1 / cm ^2, component (B):
0.1 to 10 parts by weight based on 100 parts by weight of the antibacterial agent (A) component.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a blower fan such as an air conditioner for both heating and cooling, a resin composition for a fan used in various kinds of equipment, and a fan formed from these resin compositions.

2. Description of the Related Art A fan such as a blower fan used in an air conditioner has conventionally been made of metal, but recently, due to demands for reduction of raw material cost and processing cost, freedom of design and weight reduction, a synthetic resin is used. Those made of products tend to be widely used. These resin fans have a problem in that dust and the like adhere to the mold and bacteria and the like propagate. In particular, it has been pointed out that when molds propagate, the number of mites that eat mold spores increases, causing allergic symptoms. Therefore, measures against the reproduction of such molds and bacteria are required. Further, synthetic resins generally have a lower bending modulus than metal materials and have a problem of being largely deformed by heat, and it has been pointed out that rigidity and heat resistance are insufficient, and countermeasures are required.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides a fan resin composition and a fan formed by molding these fan resin compositions. The purpose is to do.

[0002]

The present invention provides (1) (A)
Filler (b) 10 per 100 parts by weight of resin component (a)
To 100 parts by weight, and 100 parts by weight of a resin composition having a bending modulus of 60,000 kg / cm ² or more at room temperature (23 ° C.) (B) an antibacterial agent 0.1 to 10 parts by weight.
A resin composition for a fan containing 100 parts by weight of the resin composition for a fan, wherein (2) the resin composition for a fan in which (b) of the component (A) is a fibrous filler; A resin composition for a fan, comprising 0.1 to 50 parts by weight of at least one selected from compounds having antistatic properties as the component (C), (4) (a) in the component (A).
Is a styrene resin, a resin composition for a fan, (5) a fan formed by molding the resin composition for a fan, (6) an aspect ratio (weight average fiber) of a fibrous filler dispersed in the fan. A fan having a long / average fiber diameter of 20 or more is provided. Examples of the resin component (a) in the component (A) of the present invention include styrene resins, olefin resins such as polyethylene and polypropylene, polyvinyl chloride resins, polyamide resins such as nylon 6, nylon 66, nylon 46 and nylon 12, Examples thereof include polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polycarbonate resins, modified polyphenylene ether resins, PPS resins, liquid crystal polyester resins, polyarylate resins, and thermoplastic resins such as polysulfone resins. The styrene-based resin preferable as the component (a) of the present invention is a monomer containing an aromatic vinyl compound or another monomer copolymerizable with the aromatic vinyl compound in the presence or absence of a rubbery polymer. A (graft) polymer resin obtained by (graft) polymerizing a body component, or a blend of a thermoplastic resin obtained by polymerizing the above-mentioned monomer component and the graft polymer resin. It may be a blend type graft copolymer resin. Examples of the rubbery polymer used in the present invention include polybutadiene, polyisoprene, butyl rubber, styrene-butadiene copolymer, styrene-isoprene copolymer, acrylonitrile-butadiene copolymer, ethylene-propylene- ( Diene) copolymer, ethylene-butene-1- (diene) copolymer, isobutylene-isoprene copolymer, acrylic rubber, styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, SEBS Hydrogenated diene (block, random and homo) polymers, such as
Examples thereof include polyurethane rubber and silicone rubber. As the aromatic vinyl compound, styrene, t-butylstyrene, α-methylstyrene, p-methylstyrene, divinylbenzene, 1,1-diphenylstyrene, N, N-
Diethyl-p-aminoethylstyrene, N, N-diethyl-p-aminomethylstyrene, vinylpyridine, vinylxylene, monochlorostyrene, dichlorostyrene,
Examples thereof include monobromostyrene, dibromostyrene, fluorostyrene, ethylstyrene and vinylnaphthalene, and styrene and α-methylstyrene are particularly preferable. These aromatic vinyl compounds may be used alone or in combination of two or more. In addition, as other monomers, acrylonitrile, vinyl cyanide compounds such as methacrylonitrile, methyl acrylate, ethyl acrylate,
Acrylic esters such as propyl acrylate, butyl acrylate, amino acrylate, hexyl acrylate, octyl acrylate, 2-ethylhexyl acrylate, cyclohexyl acrylate, dodecyl acrylate, octadecyl acrylate, phenyl acrylate, benzyl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate. ,
Butyl methacrylate, amino methacrylate, hexyl methacrylate, octyl methacrylate, 2-ethylhexyl methacrylate, cyclohexyl methacrylate, dodecyl methacrylate, octadecyl methacrylate, phenyl methacrylate, methacrylic acid esters such as benzyl methacrylate, maleic anhydride, itaconic anhydride, citraconic anhydride, etc. Unsaturated acid anhydrides, unsaturated acids such as acrylic acid and methacrylic acid, maleimide, N-methylmaleimide, N-butylmaleimide,
Α such as N- (p-methylphenyl) maleimide, N-phenylmaleimide, N-cyclohexylmaleimide,
Imido compound of β-unsaturated dicarboxylic acid, glycidyl methacrylate, unsaturated compound containing epoxy group such as allyl glycidyl ether, acrylamide, unsaturated carboxylic acid amide such as methacrylamide, acrylamine,
Amino group-containing unsaturated compounds such as aminomethyl methacrylate, aminoether methacrylate, aminopropyl methacrylate, aminostyrene, 3-hydroxy-1-propene, 4-hydroxy-1-butene, cis-4-hydroxy-2- Butene, trans-4-hydroxy-2-
Butene, 3-hydroxy-2-methyl-1-propene,
Examples thereof include hydroxyl group-containing unsaturated compounds such as 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate and hydroxystyrene, and oxazoline group-containing unsaturated compounds such as vinyl oxazoline. Among the above monomers copolymerizable with the aromatic vinyl compound, particularly preferable are vinyl cyanide compounds, (meth) acrylic acid esters, unsaturated acid anhydrides, unsaturated acids, α, β-unsaturated carboxylic acids. Imide compound, an epoxy group-containing unsaturated compound,
It is one or more monomers selected from hydroxyl group-containing unsaturated compounds. Specific examples of the other monomer copolymerizable with the particularly preferable aromatic vinyl compound include acrylonitrile, methacrylic acid, methyl methacrylate,
Examples thereof include maleic anhydride, N-phenylmaleimide, glycidyl methacrylate, 2-hydroxyethyl methacrylate and the like. In the above imide compound copolymer of α, β-unsaturated dicarboxylic acid, a copolymer of the aromatic vinyl compound and the unsaturated acid anhydride which is post-imidized (completely or partially) is also included in the present invention. It is included in the component (a) of the component (A). The component (a) of the component (A) may be used alone or in combination of two or more. Examples of the filler (b) in the component (A) of the present invention include glass fiber, carbon fiber, wollastonite, rock filler, calcium carbonate, talc, mica, kaolin, sulfuric acid, barium, graphite, wood powder,
Examples thereof include molybdenum disulfide, magnesium oxide, zinc oxide whiskers, potassium titanate whiskers, and ceramic balloons. These fillers are preferably fibrous fillers, for example, glass fibers and carbon fibers, and those having a fiber diameter of 6 to 60 μm and a fiber length of 30 μm or more are particularly preferable. The amount of the filler (b) used in the component (A) is 5 to 100 parts by weight, preferably 10 to 80 parts by weight, more preferably 10 to 50 parts by weight, based on 100 parts by weight of the resin component (a). Yes, if less than 5 parts by weight, the bending modulus is inferior,
If it exceeds 100 parts by weight, the moldability will be poor. Also,
The bending modulus (according to the test method ASTM D790) of the resin composition of the component (A) at room temperature is 60,000.
kg / cm ² or more, preferably 80,000 kg
/ Cm ² or more. Bending modulus is 60,000k
If it is less than g / cm ² , the rigidity as a fan is poor.

The antibacterial agent as the component (B) is, for example, an organic or inorganic metal compound, a substance having a porous structure (porous structure) on which a metal compound and / or a metal complex salt is carried, Alternatively, a porous structure in which metal ions are ion-exchanged, or a boric acid-based glass containing a metal oxide may be used. The metals used here are silver, copper, zinc, magnesium, mercury, tin, lead,
Bismuth, cadmium, chromium, cobalt, nickel,
Examples thereof include iron, manganese, arsenic, antimony, barium, etc., preferably silver, copper, zinc, magnesium, etc., more preferably silver, copper, zinc, etc. Particularly preferred as component (B) is a boric acid-based glass containing 0.01 to 10% by weight of silver oxide. The specific composition of the boric acid-based glass is preferably the following composition. SiO ₂ 25 to 60 wt% B ₂ O ₃ 18-60 wt% Al ₂ O ₃ 0 to 20 wt% R ₂ O 8 to 30 wt% (R; Li, Na, K) R'O 0~20 wt% (R ′; Ca, Mg, Zr, Ba) The average particle diameter of the component (B) is preferably 50 μm or less, more preferably 30 μm or less, and particularly preferably 20 μm.
It is as follows. The amount of component (B) used in the present invention is 0.1 to 10 parts by weight, preferably 0.2 to 5 parts by weight, more preferably 0.5 to 3% by weight, based on 100 parts by weight of component (A). If it is less than 0.1 part by weight, the antibacterial and antifungal properties are poor, and if it exceeds 10 parts by weight, the impact resistance is poor.

The component (C) of the present invention is polyethylene glycol, polyethylene oxide, a polyethylene glycol-containing polymer, a polyethylene oxide-containing polymer and an antistatic agent, and these are used alone or in combination of two or more. be able to. Polyethylene glycol having a molecular weight in the range of 500 to 20,000, or polyethylene glycol having a molecular weight increased to about 100,000 by modifying the molecular end of the polyethylene glycol with, for example, an isocyanate group or an epoxy group, and reacting can be used. Polyethylene oxide having a molecular weight of 20,000 to 500,000 is preferably used. The preferred polyethylene oxide used here has an average molecular weight of 50,000-
It is preferably 500,000, and more preferably 100,000 to 400,000. As the polyethylene glycol-containing polymer, an unsaturated compound having a repeating unit of ethylene oxide and the aromatic vinyl compound, a copolymer of the aromatic vinyl compound and another vinyl monomer which is copolymerizable, a polyethylene glycol-containing block Examples include copolymers and polymers obtained by graft-polymerizing polyethylene glycol. Polyethylene glycol-containing block copolymers include known polyamide elastomers, polyamideimide elastomers, polyester elastomers, and the like.Polyethylene glycol graft-polymerized polymers include known polyamide polymers grafted with polyethylene glycol. is there. As the polyethylene glycol used as the component (C), those containing bisphenol A in the molecule are also used.

The antistatic agent used in the present invention includes:
All commonly used antistatic agents are used. The antistatic agent used here includes anionic type, cationic type, nonionic type, amphoteric type, and the like.
Both are used. Particularly preferred are anionic type and nonionic type, and of these, sodium sulfonic acid type and monoglyceride type are preferable. The amount of the component (C) used in the present invention is (A) + (B) resin composition 1
0.1 to 50 parts by weight, preferably 0.2 to 30 parts by weight, and more preferably 0.5 to 20 parts by weight, based on 00 parts by weight, if less than 0.1 parts by weight, antibacterial and antifungal properties are sufficient. However, if it exceeds 50 parts by weight, the heat resistance is poor. The resin composition for a fan of the present invention can be molded into a fan-shaped molded article by injection molding, vacuum molding, profile molding, foam molding, injection press, gas assist molding, press molding, blow molding, etc., preferably injection molding. Molding, injection press, press molding. In addition, the aspect ratio (weight average fiber length / average fiber diameter) of the fibrous filler dispersed in the fan obtained by the above-mentioned molding method is 20 or more, preferably 30 or more. If the aspect ratio is less than 20, the impact resistance as a fan is not sufficient. Further, a known coupling agent in the composition of the present invention,
Additives such as flame retardants, flame retardant aids, antioxidants, weathering (light) agents, plasticizers, colorants (pigments, dyes, etc.), lubricants, metal powders and the like can be added. The resin composition for a fan of the present invention includes various extruders, Banbury mixers, kneaders,
It can be obtained by kneading each component using a roll or the like. A preferable manufacturing method is a method using an extruder. In addition, when kneading the respective components, the respective components may be kneaded together or may be kneaded by a multi-stage addition method.

[0005]

The present invention will now be described more specifically with reference to examples. In the examples, parts are based on weight unless otherwise specified. Moreover, various evaluations in the examples are values measured as follows. Antibacterial test 1) Test strain Staphylococcus aureus IID 1677 (MRSA) 2) Medium for measuring cell number SCDLP agar medium [Nippon Pharmaceutical Co., Ltd.] 3) Preparation of bacterial solution 35 ° C 16-2
The test strains cultured for 0 hours were suspended in a sterilized 1/100 concentration normal broth, and the number of bacteria per ml was 3 × 10.
^It was prepared to be ⁶ . 4) Test operation 0.2 ml of the bacterial solution was inoculated into a sample (about 35 mm x 15 mm), and a polyethylene film was adhered to the sample, which was then stored at 35 ° C. The surviving bacteria were washed out. The viable cell count of this wash-out solution was determined by the agar plate culture method (35
C., 2 days), and converted into the viable cell count per sample. Mold growth test 1) Test strain Rhizopus oryzae IFO 31005 (Kunosu mold) 2) Preparation of spore suspension Potato dextrose agar slope medium [Eiken Chemical Co., Ltd.]
The spores of the test strain that had been sufficiently formed by
% Dioctyl sodium sulfosuccinate solution was added and suspended. After removing fruiting bodies and mycelium from this suspension, the number of spores per 1 m1 was 1,000,000.
A spore suspension was prepared by adding to the inorganic salt medium (table below) so that the number was ± 200,000. Composition of inorganic salt medium Dipotassium hydrogen phosphate 0.7 g Potassium dihydrogen phosphate 0.7 g Magnesium sulfate heptahydrate 0.7 g Ammonium nitrate 1.0 g Sodium chloride 0.005 g Ferrous sulfate heptahydrate 0.002 g Zinc sulfate heptahydrate 0.002 g Manganese sulfate heptahydrate 0.001 g Purified water 1000 ml PH 6.0 to 6.5 3) Test operation Inorganic salt agar plate medium (solidified inorganic salt medium containing 1.5% agar) The test piece was placed on a flat plate), sprayed with a spore suspension, and cultured at a temperature of 28 to 30 ° C. and a relative humidity of 85% or more for 21 days. The growth state of hyphae generated on the surface of the test piece was observed with the naked eye and a stereoscopic microscope. It should be noted that a sterilized filter paper piece having a diameter of 25.4 mm is placed on an inorganic salt agar plate medium, and a spore suspension is sprayed on the plate, and cultured at a temperature of 28 to 30 ° C. and a relative humidity of 85% or more for 14 days. The mold growth was confirmed. Display method of test results Display content 0 No mold growth is observed 1 Mold growth is slightly (10% or less of test piece surface) 2 Mold growth is a little (10% to 30% of test piece surface) ) Recognized 3 Mold growth is moderate (30% to 60% of test piece surface) 4 Mold growth is severe (60% or more of test piece surface)

Bending Modulus Bending modulus was measured according to ASTM D790. Molding processability Flowability; 240 ° C load 1 according to ASTM D1238
It was measured at 0 kg. Impact resistance Izod impact strength; 1 / according to ASTM D256
Measured at 4 inches and 23 ° C. Heat resistance heat distortion temperature; measured according to ASTM D648 at 1/2 inch, 264 psi. Aspect Ratio A fan formed by molding the resin composition of the present invention is baked in a furnace at 400 ° C. for 5 hours. Alternatively, the resin component is dissolved in a solvent in which the resin component is soluble, and the fibrous filler contained therein is separated. Using an optical microscope, measure the fiber length and fiber diameter of this fibrous filler to 80
Zero or more were measured, and the aspect ratio was calculated according to the following formula. Aspect ratio (−) = weight average fiber length (μm) / average fiber diameter (μm) Reference Example The following resin was used as (a) in the component (A) of the present invention. Styrenic Resins (a) -1 to (a) -7 Table 1 shows the rubber-like polymer used for the styrene resin of the present invention.

[0007]

[Table 1]

The rubber-like polymer (a), (b),
Resins obtained by polymerizing the monomer components in the presence or absence of (c) and (d) were obtained, respectively. The compositions of these styrene resins are shown in Table 2.

[0009]

[Table 2]

(A) -8: Amylan CM1017 manufactured by Toray Industries, Inc. was used as polyamide 6. (A) -9: PBT-12 manufactured by Kanebo Co., Ltd. as PBT
4 was used. (A) -10: As a polycarbonate, Teijin Chemicals Ltd.
Manufactured by Panlite L-1225 was used. The following filler was used as (b) in the component (A) of the present invention. (B) -1: A chopped glass fiber having a fiber diameter of 13 μm, a cut length of 3 mm, and an aminosilane treatment / acrylic focusing was used. (B) -2: Talc having an average particle diameter (D ₅₀ ) measured by the sedimentation test method of 1.9 μm (Fuji Talc Industry Co., Ltd.)
Manufactured by LMS-100) was used. (B) -3: Chopped carbon fiber having a fiber diameter of 7 μm and a cut length of 6 mm (“Vesfight” manufactured by Toho Rayon Co., Ltd.)
Chopped fiber HTA-C6-S) was used. The following inorganic antibacterial agents were used as the component (B) of the present invention. (B) -1: Boric acid glass having the following composition was used. SiO ₂ 34% B ₂ O ₃ 50% Na ₂ O 15% Ag ₂ O 1% (B) -2: Toa Gosei Chemical Industry Co., Ltd., Novalon AG
Z330 was used. (B) -3: Zeomic X manufactured by Sinanen Ceramics Co., Ltd.
AW10D was used. The following was used as the component (C) of the present invention. (C) -1: Polyamide 6 oligomer modified with adipic acid at the molecular end and polyethylene glycol (molecular weight of about 15
00) was used in a weight ratio of 1: 1 with the multi-block copolymer. (C) -2: A multi-block copolymer having a weight ratio of 1: 1 of a terephthalic acid modified product of a polyamide 6 oligomer at the molecular end and a bisphenol A copolymer polyethylene glycol (molecular weight: about 1500) was used. (C) -3: Polyethylene oxide having an average molecular weight of 200,000 was used. (C) -4: An antistatic agent having the following structure was used.

[0011]

【Chemical formula】

Examples 1 to 21 and Comparative Examples 1 to 6 Preparation of resin compositions for fans was carried out by adding the above components to a water content of 0.1%.
It was dried to the following, mixed with the formulation of Table 3, melt-kneaded using a twin-screw extruder with a vent, and pelletized. The filler (b) in the component (A) of the present invention was added in the middle of the extruder. The obtained pellets were dried to a water content of 0.1% or less, and injection-molded to mold test pieces for measuring antibacterial properties, mold resistance, impact resistance and heat resistance, and evaluated by the above-mentioned evaluation methods. The bending modulus was measured only with the component (A). As for the fan, a cross flow fan in a home air conditioner indoor unit was molded from the fan resin composition using a 650 ton injection molding machine, and a part of this molded product was cut out to evaluate the aspect ratio. Table 3 shows the evaluation results.

[0013]

[Table 3]

Comparative Example 1 is (b) in the component (A) of the present invention.
Is an example in which the amount used is less than the range of the invention, and the bending modulus is inferior. Comparative Example 2 is (b) in the component (A) of the present invention.
This is an example in which a large amount of is used outside the scope of the invention, and the moldability is poor. Comparative Example 3 is an example in which the amount of the component (B) used in the present invention is small outside the range of the invention, and the antibacterial property and antifungal property are poor. Comparative Example 4 is an example in which the amount of the component (B) used in the present invention is large outside the range of the invention, and the impact resistance is poor. Comparative Example 5 is an example in which the bending modulus is low outside the range of the invention because the processing conditions of the fan resin composition of the present invention are bad. Comparative Example 6 is an example in which the component (B) of the present invention is not used, and the antibacterial property and antifungal property are poor.

[0015]

EFFECT OF THE INVENTION The resin composition for a fan of the present invention is excellent in antibacterial properties, antifungal properties and rigidity, and is useful for a fan used in a blower fan such as an air conditioner for both heating and cooling and various equipment.

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Claims (3)

[Claims] 1. A fan resin composition comprising the following components (A) and (B): Component (A): 5 to 100 parts by weight of filler (b) per 100 parts by weight of resin component (a). And the bending modulus at room temperature (23 ° C) is 60,000 kg.
100 parts by weight of a resin composition having a density of at least 1 / cm ^2, component (B):
0.1 to 10 parts by weight per 100 parts by weight of the antibacterial agent (A) component, 2. The resin composition (A) 100 according to claim 1.
The resin composition for a fan according to claim 1, further comprising 0.1 to 50 parts by weight of at least one compound selected from compounds having an antistatic property as the component (C) in parts by weight. 3. A fan formed by forming the resin composition according to claim 1.