JPH09135079A - Method of manufacturing multilayered board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make feasible of the cost down, the enhancement of productivity as well as the avoidance of the positional slippage between copper clad laminated layer boards by a method wherein pins having back-up holes are inserted into respective guide holes of wiring boards having guide holes so as to melt- solidify the pins by laminatedly pressurize the pins with one another through the intermediary of prepreg. SOLUTION: Plural guide holes 1 are made in a pattern formed copper clad laminated board 2 so as to insert the front end 3 of the pin 4 into one of the guide holes 1. Next, the guide hole 8 of a prepreg 9 is mate-inserted into the pin 4 previously inserted into the copper clad laminated board 2 so as to connect the back up hole 7 of another pin 6 to the front end 3 of the pin 4 for fixing the copper clad laminated board 2 to the prepreg 9. Next, another copper clad laminated board 10 is laminated so as to insert the front end of the pin 6 into the guide hole 1 of the board 10 as a wiring board for manufacturing the set body of the board 10. Finally, the pins 4, 6 fixed to this set body 11 are heated to be temporarily melted down, cooled down and solidified to manufacture a deformed pin 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer board, and more particularly, to a method for manufacturing a multilayer board in which inner layers are aligned by guide holes provided in the inner layers and laminated.

[0002]

2. Description of the Related Art Among multilayer printed wiring boards, for example, a 6-layer board is manufactured as shown in FIG. Copper clad laminate 2 having copper foils 21 and 22 patterned on both sides of insulating plate 20
3 are overlapped via the prepreg 24, and
In general, a structure in which a prepreg 25 and an outer copper foil 26 are overlapped on both surfaces of a set, respectively. Then, the whole of them is pressed by the hot platen 18 to be integrally molded. At this time 2
Since it is necessary to register the patterned copper foils 21 and 22 between the copper clad laminates 23, various alignment methods are adopted. In general, the manufacturing method widely used includes an eyelet (rivet) method and an adhesive method in addition to the pin lamination method shown in FIG. Two types of manufacturing methods have been disclosed that overcome these disadvantages.

Japanese Patent Application Laid-Open No. Hei 3-160785 discloses a manufacturing method using an improved eyelet (hereinafter referred to as a pin), and FIG. A plurality of guide holes 28 (one of which is shown in FIG. 9) is provided in the copper-clad laminate 27 after pattern formation shown in FIG.
9 is inserted into the guide hole 28 (FIG. 9).
(B)). This pin body 29 has a plurality of guide holes 28.
Are inserted in at least two places. As shown in FIG. 9C, the first projection 31 is inserted into the receiving hole 30 at one end of the pin body 29, and the gap between the flange 32 of the pin body 29 and the flange 33 of the first projection 31 is changed. Holds the first copper-clad laminate 27. Next, as shown in FIG. 9D, the other end of the pin body 29 is inserted into the guide holes 35 of the second copper-clad laminate 34 and the guide holes of the prepreg 36. And FIG.
As shown in (E), the receiving hole 37 at the other end of the pin body 29 is provided.
The second projection 38 is inserted into the
Then, the second copper-clad laminate 34 and the prepreg 36 are held between the flange 39 of the second protrusion 38 and the set body 40 of the copper-clad laminate.

[0004] The set body 40 is superimposed on a copper foil via a prepreg, the outside is sandwiched between stainless steel plates, and heated and pressed using a hot plate to perform lamination molding.

Japanese Unexamined Patent Application Publication No. 63-56995 discloses a manufacturing method utilizing ultrasonic waves, and FIG. 10 is a diagram showing an embodiment thereof. The patterned copper-clad laminates 41, 42 are overlapped with each other via a prepreg 43, set on a positioning jig, and the outer portion of the product is clamped by clamps 44, 45 from above and below and pressurized. The transducer 46 is applied to the copper-clad laminate 41 and ultrasonic vibration is applied in parallel to the pressurizing section, thereby bonding the interface between the copper-clad laminates 41 and 42 and the prepreg 43 in this portion. This set body is overlaid with copper foil via a prepreg in the same manner as the improved eyelet method,
It is molded by heating and pressing.

[0006]

Among the conventional techniques of alignment, in the improved eyelet method disclosed in JP-A-3-160785, it is necessary to prepare various pins depending on the layer structure.
In addition to the poor work efficiency when laying up a complicated layer configuration, there are disadvantages in that the manufacturing cost of the pins increases.

Further, in the ultrasonic bonding method disclosed in Japanese Patent Laid-Open No. 63-56995, since the layers are fixed by adhering the resin, there is a drawback that the resin is likely to be misaligned when it is melted by heat and pressure during molding. .

The present invention is an alignment method for solving the above-mentioned problems, and relates to a multilayer printed wiring board using at least two copper-clad laminates, which requires alignment of a patterned copper-clad laminate. It is an object of the present invention to provide a manufacturing method capable of reducing the cost and improving the productivity and preventing the displacement between the copper-clad laminates.

[0009]

SUMMARY OF THE INVENTION The present invention relates to a method of manufacturing a multilayer printed wiring board by laminating at least two wiring boards provided with a plurality of guide holes, wherein a conical pin is inserted into the guide hole of the wiring board. Means, connecting the pins on the pins via a prepreg, means for stacking the guide holes of the wiring board in alignment with the pins, and means for melting and solidifying the pins while pressing and fixing so as not to cause displacement. It is characterized by having.

[0010] The wiring boards are aligned with each other using pins, and the wiring boards are pressurized and fixed using a jig for each guide hole, and then the pins are melted and fixed. Further, a pin having a melting point higher than the hot platen temperature is used. For this reason, the fixed pins are stable even when heated and pressed by the hot plate, and no positional displacement occurs between the wiring boards.

The shape of the pin is one type, and it is not necessary to properly use the pin according to the layer configuration. For this reason, the working efficiency at the time of lamination is good, and the manufacturing cost of pins is reduced.

[0012]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a view showing one embodiment of a method of manufacturing a multilayer board according to the present invention in the order of steps. As shown in FIG. 1A, a double-sided wiring board as a wiring board, for example, a patterned copper-clad laminate 2 has a plurality of guide holes 1 as shown in FIG. 2 (one is shown in FIG. 1A). ) Is provided, and the tip 3 of the pin 4 is inserted into the guide hole 1 (FIG. 1B).

FIG. 3 shows the structure of the pin used here.
This will be described with reference to a cross-sectional view of FIG. 3A and a perspective view of FIG. The outer side of the pin is formed in a conical shape, the lower portion is formed with a brim 5, the bottom surface is flat, and a conical receiving hole 7 is provided in the center, into which the conical tip 3 of the other pin is inserted. And connect.

As shown in FIG. 1C, the guide hole 8 of the prepreg 9 is aligned with the pin 4 inserted in the copper clad laminate 2, and the receiving hole 7 of the pin 6 and the tip 3 of the pin 4 are connected. ,
The copper clad laminate 2 and the prepreg 9 are fixed.

As shown in FIG. 1D, the copper-clad laminate 10 is stacked so that the tips of the pins 6 are inserted into the guide holes 1 of the copper-clad laminate 10 serving as a wiring board. Create 11.

The pins 4 and 6 fixed to the set body 11 are heated, temporarily melted, cooled, and solidified to form a deformed pin 12 as shown in FIG. As shown in FIG. 2, all pins inserted into the plurality of guide holes 1 are subjected to melting and solidification.

Further, as shown in FIG. 4, the operation of melting the pins 4 and 6 is performed by pressing and fixing the periphery of the guide hole with the pressing jig 13 and then bringing the heat jig 14 into contact with the pin 6. The solidification operation is performed by separating the heat jig 14 from the pin and allowing it to cool naturally. After the solidification is completed, the pressing and fixing by the holding jig 13 is released to complete the operation of forming the deformable pin 12 in one guide hole. By pressing and fixing with the holding jig 13, it is possible to prevent displacement of the copper-clad laminate due to pin melting, and it is possible to control the interlayer thickness by adjusting the pressure.

As shown in FIG. 5, a set 1 of a copper-clad laminate
1 is laminated with a copper foil 16 via a prepreg 15, and the outside is sandwiched between stainless steel plates 17, and heated and pressed using a hot plate 18 to perform lamination molding. After completion of the heating and pressurization, the stainless steel plate 17 is removed and disassembled to obtain a six-layer copper-clad laminate 19 (FIG. 7) containing an inner circuit.

An example of pin dimensions will be described with reference to FIGS. 7A and 7B and FIG. In order to set the diameter A at the bottom of the cone of the pin to be equal to the diameter of the guide hole into which the pin 4 is inserted, if the diameter of the guide hole is 5 mm,
A of 5 mm.

Next, the height D for fixing the copper-clad laminate and the prepreg at the time of pin-to-pin connection is set to be equal to the thickness of the copper-clad laminate plus the thickness of the prepreg, which is the largest of the applied layer configurations. At this time, the target copper-clad laminate and the prepreg are adjacent to each other, and are limited to a layer fixed between them when pin-to-pin connection is performed. Since the portion 3 is not in close contact with the receiving hole 7) and the pins are fixed, the registration failure due to the displacement of the copper-clad laminate can be prevented.

Further, in order to secure the height D, the diameter B of the receiving hole needs to be equal to the diameter G of the conical section from the bottom of the cone to the height D.

Further, a height E from the height D to the tip of the pin is obtained.
Is equal to the receiving hole depth C, and the conical side surface length F needs to be larger than the conical cross-sectional diameter B in order to increase the reliability of the pin connection. When F ≦ B, the pin-pin connection is likely to shift due to the stress from the side surface. However, when F> B, the reliability against the stress from the side surface is high and the possibility of deviation is low, so the height D is set according to Equation 1. I do.

D> 0.87 × B (Equation 1) The material of the pin is a lay-up pin connection, a hardness that does not deform during the work of fixing the copper clad laminate, melting and solidifying in a short time by heating and cooling. It must have a melting point (softening point) that does not deform by heating and pressurization due to lamination. An example of a material having such properties is a high melting point solder,
For example, in a composition of Sn10% -Pb90%, the melting point is 302.
° C, Sn5% -Pb90% -Ag5% composition, melting point 2
It is 92 ° C., there is no melting due to heating (200 ° C. or less) during lamination, and it can be applied as a pin material.

[0025]

The first effect is that it is possible to lay up the layers with high working efficiency, thereby improving the productivity.

The second effect is that the manufacturing cost of the pins is reduced, thereby reducing the cost of the laminating material. The reason for the first and second effects is that, since pins are not properly used depending on the layer configuration, only one kind of pin shape is required.

Further, a third effect is that the registration accuracy between the inner layer plates is improved, thereby reducing the misalignment. The reason is that the deformed and fixed pins are stable even when heated and pressed by a hot platen.

[Brief description of the drawings]

FIGS. 1A to 1E are cross-sectional views illustrating a manufacturing process according to an embodiment of the present invention.

FIG. 2 is a perspective view of a patterned copper clad laminate used in the present invention.

3A is a sectional view of a pin used in the manufacturing method of the present invention, and FIG. 3B is a perspective view of the pin used in the present invention.

FIG. 4 is a sectional view of a jig used for melting a pin according to the present invention.

FIG. 5 is a cross-sectional view showing a configuration when laminating and molding using the set body created in the present invention.

FIG. 6 is a cross-sectional view of a six-layer plate laminated and formed using the present invention.

FIGS. 7A and 7B are cross-sectional views illustrating dimensions of a pin used in the present invention.

FIG. 8 is a sectional view showing a configuration of a conventional pin lamination method.

FIG. 9 is a cross-sectional view showing a manufacturing process using a conventional improved eyelet.

FIG. 10 is a cross-sectional view showing a method of manufacturing a set body using a conventional ultrasonic bonding method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Guide hole 2,10 Copper-clad laminate with pattern formation 3 Pin tip 4,6 Conical pin 5 Pin flange 7 Pin receiving hole 8 Prepreg guide hole 9,15 Prepreg 11 Inner plate set body 12 After deformation No. pin 13 Holding jig 14 Heating jig 16 Copper foil 17 Stainless steel plate 18 Heating board 19 Six boat copper-clad laminate with inner layer circuit 20 Insulation plate 21, 22 Patterned copper foil 23 Patterned copper-clad laminate 24, Reference Signs List 25 prepreg 26 copper foil 27, 34 patterned copper-clad laminate 28 guide hole 29 conventional pin 30, 37 conventional pin receiving hole 31, 38 conventional pin projection 32 conventional pin flange 33, 39 conventional pin Projection collar 35 Guide hole 36 Pre-preg 40 Set of copper-clad laminate 41, 42 Patterned copper-clad laminate 43 prepreg 44, 45 clamp 46 ultrasonic Trang juicer

Claims (7)

[Claims] 1. A plurality of wiring boards each having a guide hole, wherein a pin having a receiving hole is inserted into each of the guide holes, and the pins are stacked and pressed via a prepreg to melt and solidify the pins. Manufacturing method of multilayer board. 2. The method according to claim 1, wherein the receiving hole has the same shape as the outer shape of the tip of the pin. 3. The method according to claim 2, wherein the outer shape of the pin is conical. 4. The method according to claim 1, wherein the wiring board is a double-sided wiring board obtained by etching both sides of a copper-clad laminate. 5. A method for manufacturing a multilayer board, comprising the following steps: A) a step of forming a desired inner layer circuit by etching a copper-clad laminate; and B) a step of forming a desired inner-layer circuit on the copper-clad laminate. A step of providing a plurality of guide holes for positioning; a step of surface treating the inner layer circuit; a step of inserting a conical pin into the guide hole of the copper clad laminate; and a step of inserting a conical pin through the prepreg. F) a step of stacking a copper-clad laminate on this pin, G) a step of melting and solidifying the pin while pressing and fixing it so as not to cause displacement, and H) a hot plate. A step of integrally laminating and molding by heating and pressing. 6. The pin material has a melting point of 200 ° C. or higher, and is made of a material having a property of melting and solidifying in a short time by heating and cooling.
Alternatively, the method for producing a multilayer board according to item 5. 7. The method according to claim 6, wherein the pin material is a high melting point solder.