JPH09141585A - Semiconductor chip pickup device and pickup method - Google Patents

Abstract

(57) An object of the present invention is to provide a pickup device and a pickup method for a semiconductor chip which can surely pick up an adhesive sheet and a semiconductor chip without causing positional displacement and which does not generate dust at the time of pickup. A porous material 15 is formed on a lower surface of an adhesive sheet 2 to which a plurality of individually divided semiconductor chips 1 are attached.
A pickup needle that is guided by the sheet guide surface 14 formed by the step (1) and that sucks the adhesive sheet 2 to the sheet guide surface 14 by the negative pressure acting through the sheet guide surface 14, and has a tip shape made into a flat surface or a curved surface. The tip of 17 is brought into contact with the lower surface of the adhesive sheet 2, and the semiconductor chip 1 is pushed up and separated by the pickup needle 17, and at the same time, the semiconductor chip 1 is sucked by the suction nozzle 18
It was made to adsorb | suck by and was peeled from the adhesive sheet 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and method for peeling a semiconductor chip that has been diced from an adhesive sheet and picking it up with a pickup member.

[0002]

2. Description of the Related Art In the process of manufacturing a semiconductor device, a large number of elements formed on a silicon wafer are individually separated by dicing, and these are attached to an adhesive sheet to pick up semiconductor chips one by one and lead them. There is a device for die bonding at a predetermined position on the frame. A device for picking up individual semiconductor chips and transporting them to a bonding position on a lead frame in this step is generally called a pickup device.

3 and 4 are schematic structural views showing an example of a conventional pickup device. In FIG. 3 and FIG. 4, the semiconductor chips 1 are individually separated by dicing and attached on the adhesive sheet 2 at equal intervals. The semiconductor chip 1 attached to the elastic adhesive sheet 2 is successively conveyed onto the pickup main body 52 of the pickup device 51 by means not shown.

The pickup body 52 has a negative pressure portion 5 inside.
3 is formed in a cylindrical shape, and the upper surface is closed by a top wall portion 55 having a flat sheet guide surface 54 for receiving the lower surface of the adhesive sheet 2. In addition, a vacuum hole 56 formed as a through hole slightly larger than the bottom surface of the semiconductor chip 1 and smaller than the width of the adhesive sheet 2 is provided at the center of the top wall portion 55. Further, a pickup needle 57, which comes into contact with the lower surface of the adhesive sheet 2 through a vacuum hole 56, is disposed in the pickup body 52 so as to be vertically movable. In addition,
As shown in FIGS. 3 and 4, the tip of the pickup needle 57 is formed in a sharply pointed shape.

On the other hand, on the outside of the pickup body 52,
A suction nozzle 58 is arranged at an upper position corresponding to the vacuum hole 56. The suction nozzle 58 has a suction hole 59 connected to a vacuum suction machine (not shown), and a chuck portion 58a for sucking the semiconductor chip 1 is formed at the lower end. The suction nozzle 58
Has a structure in which the semiconductor chip 1 chucked by the chuck portion 58a can be peeled off from the adhesive sheet 2 and picked up and conveyed to a predetermined position for die bonding on a lead frame (not shown).

Next, the operation of the pickup device constructed as described above will be described. The adhesive sheet 2 to which the semiconductor chip 1 is attached is arranged so as to slide on the sheet guide surface 54 of the pickup body 52, and the semiconductor chip 1 is placed at the center of the vacuum hole 56. It is intermittently transported by a transport mechanism (not shown). Further, when the negative pressure portion 53 is operated, the pressure-sensitive adhesive sheet 2 arranged on the sheet guide surface 54 is sucked through the vacuum holes 56 by the negative pressure in the negative pressure portion 53, and this suction force causes the sheet guide surface 54 to be sucked. Be bound by 54. The back surface of the adhesive sheet 2 is the sheet guide surface 54.
When it is in close contact with and is restrained, it is confirmed by a negative pressure sensor (not shown), and the position of the semiconductor chip 1 is detected by an image position detecting means (not shown). here,
When there is a position shift, the position is corrected.

When the position is corrected, the suction nozzle 5
8, the semiconductor chip 1 is vacuum-sucked (chucked) by the chuck part 58a. FIG. 3 shows this state.
At the same time, the pickup needle 57 is raised,
As shown in FIG. 4, the tip pierces the adhesive sheet 2 and pushes the semiconductor chip 1, and the semiconductor chip 1 is attached to the adhesive sheet 2.
Peel off from the upper surface (adhesive surface) of. Further, the suction nozzle 58
Moves up while chucking the semiconductor chip 1, and thus the semiconductor chip 1 can be picked up.

[0008]

However, the above-mentioned conventional pickup device has a structure in which the tip of the lifted pickup needle 57 pierces the adhesive sheet 2 and pushes the semiconductor chip 1.
When it is broken, dust (adhesive sheet dust) is generated, and this dust is diffused on the upper surface of the semiconductor chip 1 in the periphery. The dust diffused on the upper surface of the semiconductor chip 1 is, for example, C
In the case of an image semiconductor device such as a CD, a black dot appears on the TV monitor screen, and the semiconductor chip 1 becomes defective. In addition, the back surface of the semiconductor chip 1 is picked up by a pickup needle 57.
When the tip of the chip breaks the adhesive sheet 2, this tip comes into contact with the semiconductor chip 1 and dust of the semiconductor chip 1 (silicon dust)
And the semiconductor chip 1 becomes defective as in the case of the adhesive sheet dust. Therefore, in any case, there is a problem that causes a decrease in yield.

The present invention has been made in view of the above problems, and an object thereof is to suppress the positional deviation between the adhesive sheet and the semiconductor chip and to pick up the semiconductor chip without generating dust at the time of pickup. An object is to provide an apparatus and a pickup method.

[0010]

In order to achieve the above object, in the device of the present invention, in a device for picking up a plurality of semiconductor chips which are divided into individual semiconductor chips and attached to an adhesive sheet, The pressure-sensitive adhesive sheet has a negative pressure portion inside and a sheet guide surface formed of a porous material for guiding the lower surface of the pressure-sensitive adhesive sheet is provided on the upper surface, and the negative pressure of the negative pressure portion acting through the sheet guide surface causes the pressure-sensitive adhesive sheet. And a pickup / chuck means for holding the semiconductor chip conveyed on the sheet guide surface and peeling the semiconductor chip from the adhesive sheet, the pickup body adsorbing the pickup body. Is provided in the pickup main body so as to face the pickup / chuck means, and has a flat or curved tip shape. And a pickup needle that pushes up the semiconductor chip by bringing the tip into contact with the lower surface of the adhesive sheet through a guide hole formed in the sheet guide surface. Is.

In order to achieve the above object, the method of the present invention is a method for picking up a plurality of semiconductor chips which are divided into individual semiconductor chips and attached to an adhesive sheet, wherein the lower surface of the adhesive sheet is guided. The pressure-sensitive adhesive sheet is attracted to the sheet guide surface by a negative pressure acting through the sheet guide surface formed of a porous material, and the tip of a pickup needle whose tip shape is made to be a flat surface or a curved surface is formed on the sheet guide surface. The semiconductor chip is pushed up to be peeled off by being brought into contact with the lower surface of the adhesive sheet through a guide hole formed in the same, and at the same time, the semiconductor chip is held by a pickup / chuck means to be peeled off from the adhesive sheet. It is the one.

According to this, since the tip shape of the pick-up needle, which comes into contact with the lower surface of the adhesive sheet when picking up the semiconductor chip, is made flat or curved, the lower surface of the adhesive sheet is not broken. The semiconductor chip can be picked up by pressing. As a result, it is possible to eliminate the pressure-sensitive adhesive sheet dust, the silicon dust and the like generated by breaking the pressure-sensitive adhesive sheet by the conventional method. Further, since the porous material is used for the sheet guide surface, a wide portion of the adhesive sheet around the semiconductor chip can be adsorbed to the sheet guide surface, so that the displacement of the adhesive sheet on the sheet guide surface can be eliminated, A reliable pickup becomes possible.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. 1 and 2 are schematic structural views showing an example of one embodiment of a pickup device according to the present invention. In FIGS. 1 and 2, the same reference numerals as those in FIGS. 3 and 4 indicate the same parts as those in FIGS. That is, in FIG. 1 and FIG. 2, the semiconductor chips 1 are individually separated by dicing and attached on the adhesive sheet 2 at equal intervals. The semiconductor chip 1 is attached to the elastic adhesive sheet 2, and the pickup body 12 of the pickup device 11 is provided by means not shown.
Sequentially transported to the top.

The pickup body 12 has a negative pressure portion 1 inside.
3 is formed into a cylindrical shape, and its upper surface is closed by a porous material 15 having a flat sheet guide surface 14 for receiving the lower surface of the adhesive sheet 2. In addition, the porous material 15
A guide hole 16 formed as a through hole slightly smaller than the bottom surface of the semiconductor chip 1 is provided at the center of the. Here, the porous material 15 is made by collecting fine and round balls such as powder metallurgy, alumina oxide, plastic, pottery, wooden measuring materials (fiber board), glass, etc., and heating them to solidify them. The structure allows air to pass through. That is, when the inside of the negative pressure portion 13 is made to have a negative pressure with the guide hole 16 closed, air is taken into the negative pressure portion 13 through the porous material 15 and thereby the sheet guide surface 14 A negative pressure is generated on the surface, and the adhesive sheet 2 arranged on the sheet guide surface 14 can be adsorbed to the sheet guide surface 14.

Further, a pickup needle 17 is provided in the pickup body 12 so as to be vertically movable through the guide hole 16 and brought into contact with the lower surface of the adhesive sheet 2. The tip portion 17a of the pickup needle 17 is formed in a hemispherical curved surface as shown in FIGS. The pickup needle 17 has a tip portion 17a inside the guide hole 16.
Are always arranged, the inside of the guide hole 16 and the negative pressure portion 13 are shut off in terms of pressure, and the inside of the guide hole 16 is held as a normal pressure portion.

On the other hand, on the outside of the pickup body 12,
A suction nozzle 18 is arranged at an upper position corresponding to the guide hole 16. The suction nozzle 18 has a suction hole 19 connected to a vacuum suction machine (not shown), and a chuck portion 18a as a pickup / chuck means for sucking the semiconductor chip 1 is formed at the lower end. .
The suction nozzle 18 has a structure in which the semiconductor chip 1 chucked by the chuck portion 18a is separated from the adhesive sheet 2 and picked up, and can be conveyed to a predetermined position for die bonding on a lead frame (not shown). ing.

Next, the operation of the pickup device constructed as described above will be described. The pressure-sensitive adhesive sheet 2 to which the semiconductor chip 1 is attached is arranged so as to slide on the sheet guide surface 14 of the pickup body 12, and the semiconductor chip 1 is placed at the center of the guide hole 16, It is intermittently transported by a transport mechanism (not shown).
Further, when the image is sent to a predetermined position, it is recognized by an image processing device (not shown), and the conveyance is stopped. When the adhesive sheet 2 is conveyed, the pickup needle 17 moves downward, and the tip portion 17a is arranged in the guide hole 16 below, as shown in FIG.

Further, when it is recognized that the adhesive sheet 2 has been conveyed to a predetermined position together with the semiconductor chip 1, the inside of the negative pressure portion 13 is negatively pressured. Then, since air is sucked in through the porous material 15, a negative pressure is generated in substantially the entire sheet guide surface 14, and the adhesive sheet 2 moves to the sheet guide surface 14
Is adsorbed on and restrained. In this case, a guide hole 16 serving as a normal pressure portion is arranged directly below the semiconductor chip 1. Further, when the back surface of the adhesive sheet 2 is closely attached to the sheet guide surface 14 and constrained, this is confirmed by a negative pressure sensor (not shown), and the position of the semiconductor chip 1 is detected by an image position detecting means (not shown). To be done. Here, if there is a position shift, the position is corrected.

When the position is corrected, the suction nozzle 18 descends, and the semiconductor chip 1 is vacuum-sucked (chucked) to the chuck portion 18a. FIG. 1 shows this state. At the same time, the pick-up needle 17 is raised, and the tip is brought into contact with the lower surface of the adhesive sheet 2 to push up the semiconductor chip 1 as shown in FIG.
Is peeled from the upper surface (adhesive surface) of the adhesive sheet 2. afterwards,
The suction nozzle 18 moves up while chucking the semiconductor chip 1, and thus the semiconductor chip 1 can be picked up.

Therefore, in the structure of this embodiment, when the suction nozzle 18 picks up the suction chip 1, the inside of the guide hole 16 becomes a normal pressure portion and no negative pressure is applied, so that the semiconductor chip 1 to be picked up is selected. The pressure-sensitive adhesive sheet 2 on the lower surface of is in a state of being easily stretched. Moreover, since the peripheral portion is sucked and held by the sheet guide surface 14, the semiconductor chip 1 is not displaced even if the adhesive sheet 2 extends. As a result, the pickup accuracy is improved, and the reliability after die bonding can be improved. Further, since the tip portion 17a of the pickup needle 17 that is brought into contact with the lower surface of the adhesive sheet 2 and pushes up the semiconductor chip 1 is formed in a hemispherical shape, the semiconductor chip 1
The tip portion 17a of the pickup needle 17 does not break the adhesive sheet 2 when picking up.
As a result, it is possible to eliminate problems such as the pressure-sensitive adhesive sheet dust and the silicon dust that are generated by breaking the pressure-sensitive adhesive sheet, which is a problem in the conventional method, and also eliminate the inclination when peeled. The shape of the tip portion 17a of the pickup needle 17 has been described as a hemispherical curved surface shape, but it may be a flat surface, a trapezoid, or the like. In short, the pickup needle 17 pushes up the lower surface of the adhesive tape 1. Sometimes, the tip portion 17a may have a shape that does not break through the adhesive tape 1.

[0021]

As described above, according to the present invention,
When the semiconductor chip is picked up, the tip shape of the pickup needle that comes into contact with the lower surface of the adhesive sheet is made to be a flat surface or a curved surface. You can As a result, it is possible to eliminate the pressure-sensitive adhesive sheet dust, the silicon dust and the like generated by breaking the pressure-sensitive adhesive sheet by the conventional method. Also,
Since a wide area of the adhesive sheet around the semiconductor chip can be adsorbed to the sheet guide surface by using a porous material for the sheet guide surface, it is possible to eliminate the positional deviation of the adhesive sheet on the sheet guide surface, and to ensure the Pickup is possible.

[Brief description of the drawings]

FIG. 1 is a schematic structural view showing an example of one embodiment of the present invention.

FIG. 2 is a structural schematic diagram showing one embodiment of the present invention.

FIG. 3 is a schematic structural view showing an example of a conventional device.

FIG. 4 is a schematic structural view showing an example of a conventional device.

[Explanation of reference numerals] 1 semiconductor chip 2 adhesive sheet 12 pickup body 13 negative pressure portion 14 sheet guide surface 15 porous material 16 guide hole 17 pickup needle 17a tip portion 18 suction nozzle (pickup / chuck means)

Claims (7)

[Claims] 1. A device for picking up a plurality of semiconductor chips which are divided into individual semiconductor chips and attached to an adhesive sheet, wherein a porous structure having a negative pressure portion inside and guiding the lower surface of the adhesive sheet to the upper surface. A pickup main body that is provided with a sheet guide surface formed of a quality material and that adsorbs the adhesive sheet by the negative pressure of the negative pressure portion that acts through the sheet guide surface, and is arranged at a position facing the sheet guide surface. A pickup / chuck means for holding the semiconductor chip conveyed on the sheet guide surface and peeling it from the adhesive sheet, and a tip shape provided in the pickup body facing the pickup / chuck means. Is formed as a flat surface or a curved surface, and the tip is formed on the sheet guide surface. A pickup device for a semiconductor chip, comprising: a pickup needle that pushes up the semiconductor chip by abutting the lower surface of the adhesive sheet through a formed guide hole. 2. The semiconductor chip pickup device according to claim 1, wherein a suction nozzle is used for the pickup / chuck means. 3. The semiconductor chip pickup device according to claim 1, wherein the negative pressure is not applied to the portion of the guide hole by the negative pressure portion. 4. The semiconductor according to claim 3, wherein the inside of the guide hole and the inside of the negative pressure portion are pressure-blocked by keeping the tip of the pickup needle always inserted in the guide hole. Chip pickup device. 5. A method for picking up a plurality of semiconductor chips, which are divided into individual semiconductor chips and attached to an adhesive sheet, through a sheet guide surface formed of a porous material that guides the lower surface of the adhesive sheet. The negative pressure causes the pressure-sensitive adhesive sheet to be attracted to the sheet guide surface, and the tip of a pickup needle whose tip shape is made to be a flat surface or a curved surface passes through a guide hole formed in the sheet guide surface to the pressure-sensitive adhesive sheet. A semiconductor chip pick-up method in which the semiconductor chip is pushed up to be peeled off while being brought into contact with the lower surface of the same, and at the same time, the semiconductor chip is held by a pick-up / chuck means and peeled off from the adhesive sheet. 6. The method for picking up a semiconductor chip according to claim 5, wherein a suction nozzle is used for the pickup / chuck means. 7. The method of picking up a semiconductor chip according to claim 5, wherein the negative pressure by the negative pressure portion is not applied to the portion of the guide hole.