JPH09143342A - Phenolic resin composition - Google Patents
Phenolic resin compositionInfo
- Publication number
- JPH09143342A JPH09143342A JP30402195A JP30402195A JPH09143342A JP H09143342 A JPH09143342 A JP H09143342A JP 30402195 A JP30402195 A JP 30402195A JP 30402195 A JP30402195 A JP 30402195A JP H09143342 A JPH09143342 A JP H09143342A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- filler
- water
- resistance
- phenolic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 19
- 239000000203 mixture Substances 0.000 title claims abstract description 10
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title abstract description 6
- 229920001568 phenolic resin Polymers 0.000 title abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000945 filler Substances 0.000 claims abstract description 10
- 239000003063 flame retardant Substances 0.000 claims abstract description 10
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000002425 crystallisation Methods 0.000 claims abstract description 5
- 230000008025 crystallization Effects 0.000 claims abstract description 5
- 229920003987 resole Polymers 0.000 claims abstract description 3
- 239000012778 molding material Substances 0.000 abstract description 9
- 239000011347 resin Substances 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 3
- 239000013078 crystal Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- VLCLHFYFMCKBRP-UHFFFAOYSA-N tricalcium;diborate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]B([O-])[O-].[O-]B([O-])[O-] VLCLHFYFMCKBRP-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 235000011116 calcium hydroxide Nutrition 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、耐水性、耐燃性、電気
特性に優れたフェノール樹脂成形材料を与えるフェノー
ル樹脂組成物に関し、特に電子部品に適したフェノール
樹脂組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phenol resin composition which gives a phenol resin molding material excellent in water resistance, flame resistance and electric characteristics, and more particularly to a phenol resin composition suitable for electronic parts.
【０００２】[0002]
【従来の技術】近年、フェノール樹脂成形材料は数多く
の電子部品に使用されている。かかる部品には耐湿寸法
安定性、耐熱性、耐燃性、高強度等の特性が要求され
る。特に近年の電子部品の小型、薄肉化に従い、より薄
い成形品での耐熱性、耐燃性が要求されつつある。一般
的に、フェノール樹脂は自己消火性があり、難燃性の高
い成形品が得られるが、１．０ｍｍ以下の厚さの成形品
となると、難燃性が低下し、結晶水を持つ無機充填材、
塩素、臭素といったハロゲン系難燃剤、リン酸エステル
等の難燃剤を大量に添加していた。これら難燃剤の多く
は、大量に添加すると、成形品の比重が高くなる、ブリ
ードを起こし外観に劣る、耐湿、耐熱性が低下する等の
問題があり、電子部品用途への使用には限界があった。2. Description of the Related Art In recent years, phenolic resin molding materials have been used for many electronic components. Such components are required to have properties such as dimensional stability against moisture, heat resistance, flame resistance, and high strength. In particular, as electronic parts have become smaller and thinner in recent years, heat resistance and flame resistance of thinner molded products are being demanded. In general, phenolic resin has self-extinguishing property and a molded product with high flame retardancy can be obtained. However, when molded product with a thickness of 1.0 mm or less, the flame retardant property is lowered, and an inorganic substance having crystal water is formed. Filling material,
A large amount of halogen-based flame retardants such as chlorine and bromine, and flame retardants such as phosphoric acid esters were added. When many of these flame retardants are added, there are problems that the specific gravity of the molded product becomes high, bleeding causes poor appearance, moisture resistance and heat resistance decrease, and there is a limit to the use for electronic parts. there were.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、耐水性、耐
燃性、電気特性に優れ、電子部品を成形するのに適した
フェノール樹脂成形材料を提供することを目的とするも
のである。SUMMARY OF THE INVENTION It is an object of the present invention to provide a phenol resin molding material which is excellent in water resistance, flame resistance and electric characteristics and which is suitable for molding electronic parts.
【０００４】[0004]
【課題を解決するための手段】本発明は、樹脂組成がレ
ゾール型フェノール樹脂であり、樹脂１００重量部に対
して、難燃剤成分として２００℃以上５００℃以下で結
晶水を放出するフィラーを４０〜７５重量部含むことを
特徴とするフェノール樹脂組成物で、フェノール樹脂と
しては、レゾール型フェノール樹脂が用いられるが、硬
化性の調整、耐湿性、外観改良等のため、ノボラック型
フェノール樹脂を併用することもできる。According to the present invention, a resin composition is a resol type phenolic resin, and 40 parts by weight of a filler which releases crystal water at 200 ° C. or more and 500 ° C. or less as a flame retardant component is added to 100 parts by weight of the resin. In a phenol resin composition characterized by containing ˜75 parts by weight, a resol type phenol resin is used as the phenol resin, but a novolac type phenol resin is also used for adjusting curability, moisture resistance, appearance improvement, etc. You can also do it.
【０００５】難燃剤成分として使用される２００℃以上
５００℃以下で結晶水を放出するフィラーとしては、水
酸化アルミニウム、水酸化マグネシウム、硼酸亜鉛、硼
酸カルシウム等が挙げられる。２００℃以上５００℃以
下で結晶水を放出するフィラーとして少なくとも１種類
以上は、２００℃以上５００℃以下でフィラーの重量に
対して２０重量％以上の結晶水を放出するものが用いら
れる。これらのものとしては、水酸化マグネシウム、水
酸化アルミニウム、硼酸カルシウムといったものが挙げ
られる。添加量としては、樹脂１００重量部に対し４０
〜７５重量部が望ましい。これ以下の添加量では、耐燃
性が充分に発揮されず、これ以上の添加量では成形品の
比重が高くなり過ぎる、又、成形性が低下し実用性に欠
けるという問題がある。２００℃以下で結晶水を放出す
るフィラーを用いた場合、成型品の耐熱性が低下し、電
機、電子部品用としては望ましくない。Examples of the filler which is used as a flame retardant component and releases crystal water at 200 ° C. or higher and 500 ° C. or lower include aluminum hydroxide, magnesium hydroxide, zinc borate, calcium borate and the like. As the filler that releases crystal water at 200 ° C. or more and 500 ° C. or less, at least one filler that releases 20% by weight or more of crystal water at 200 ° C. or more and 500 ° C. or less based on the weight of the filler is used. These include magnesium hydroxide, aluminum hydroxide and calcium borate. The addition amount is 40 with respect to 100 parts by weight of the resin.
˜75 parts by weight is desirable. If the amount added is less than this range, the flame resistance is not sufficiently exhibited, and if the amount added is more than this range, the specific gravity of the molded product becomes too high, and the moldability deteriorates, resulting in lack of practicality. When a filler that releases water of crystallization at 200 ° C. or lower is used, the heat resistance of the molded product decreases, which is not desirable for electric machines and electronic parts.
【０００６】材料化にあたっては、上記樹脂組成物に対
し、通常の成形材料同様に、パルプ，木粉等の有機フィ
ラー，ガラス繊維，焼性クレー，ワラステナイト、炭酸
カルシウム等の無機フィラー，消石灰，顔料，離型剤等
を添加することが出来、上記原料を均一に混合後、加圧
ニーダー、２軸押出し、加熱ロール等で混練し材料化す
ることができる。In the materialization, the above resin composition is treated with an organic filler such as pulp and wood powder, glass fiber, calcinable clay, wollastonite, an inorganic filler such as calcium carbonate, and slaked lime, in the same manner as usual molding materials. A pigment, a release agent, etc. can be added, and after the above raw materials are uniformly mixed, a pressure kneader, biaxial extrusion, and kneading with a heating roll or the like can be made into a material.
【０００７】本発明のフェノール樹脂組成物から得られ
た成形材料は、耐水性、耐燃性、電気特性に優れ、電子
部品を成形するのに適し、小型、薄肉での耐燃性の要求
される電子部品用に適用できる。The molding material obtained from the phenol resin composition of the present invention is excellent in water resistance, flame resistance, and electrical characteristics, suitable for molding electronic parts, and is required to have a small size and a thin wall. Applicable for parts.
【０００８】[0008]
【実施例】表１の上欄に示す組成配合にてフェノール樹
脂成形材料を作製した。各成形材料についてを成形品の
特性を測定し、表１の下欄に示した。EXAMPLES A phenolic resin molding material was prepared according to the composition shown in the upper column of Table 1. With respect to each molding material, the characteristics of the molded product were measured and shown in the lower column of Table 1.
【０００９】[0009]
【表１】 [Table 1]
【００１０】［測定方法］ 吸水率，荷重たわみ温度，絶縁抵抗：ＪＩＳ Ｋ ６９１
１に準じて行う。テストピースは１７５℃で３分間トラ
ンスファ成形したものである。 ハンダ耐熱性：５０φ×３ｍｍ厚さのテストピースを１
７５℃で３分トランスファー成形し，４００℃の半田槽
に３秒間浸漬し、厚さの変化率を測定した。 耐燃性：１２．７ｍｍ×１２７ｍｍ×０．４ｍｍ厚さの
テストピースを１７５℃で３分トランスファー成形し、
ＵＬ９４垂直法に準じて、耐燃性を確認した。[Measurement method] Water absorption rate, deflection temperature under load, insulation resistance: JIS K 691
Perform according to 1. The test piece was formed by transfer molding at 175 ° C. for 3 minutes. Solder heat resistance: 1 test piece of 50φ x 3mm thickness
Transfer molding was performed at 75 ° C. for 3 minutes, and the resultant was immersed in a solder bath at 400 ° C. for 3 seconds, and the rate of change in thickness was measured. Flame resistance: 12.7 mm × 127 mm × 0.4 mm thick test piece is transfer molded at 175 ° C. for 3 minutes,
The flame resistance was confirmed according to the UL94 vertical method.
【００１１】[0011]
【発明の効果】以上の実施例及び比較例から明らかなよ
うに、本発明のフェノール樹脂組成物から得られた成形
材料は、耐水性、耐燃性、電気特性に優れている。特に
耐燃性、電気特性に優れており、これらの特性が要求さ
れる成形品、特に電子部品に好適である。As is apparent from the above examples and comparative examples, the molding material obtained from the phenol resin composition of the present invention is excellent in water resistance, flame resistance and electric characteristics. In particular, it has excellent flame resistance and electrical characteristics, and is suitable for molded products, particularly electronic parts, which require these characteristics.
Claims (2)
に対して、難燃剤成分として、２００℃以上５００℃以
下で結晶水を放出するフィラーを４０〜７５重量部含む
ことを特徴とするフェノール樹脂組成物。1. A phenol resin composition comprising 100 parts by weight of a resol type phenol resin and 40 to 75 parts by weight of a filler which releases water of crystallization at 200 ° C. or more and 500 ° C. or less as a flame retardant component. .
０重量％以上放出するフィラーが、使用される全難燃剤
の内少なくとも１種類以上含む請求項１記載のフェノー
ル樹脂組成物。2. Water of crystallization is applied at 200 ° C. or higher and 500 ° C. or lower.
The phenol resin composition according to claim 1, wherein the filler that releases 0% by weight or more contains at least one kind of all flame retardants used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30402195A JPH09143342A (en) | 1995-11-22 | 1995-11-22 | Phenolic resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30402195A JPH09143342A (en) | 1995-11-22 | 1995-11-22 | Phenolic resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09143342A true JPH09143342A (en) | 1997-06-03 |
Family
ID=17928126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30402195A Pending JPH09143342A (en) | 1995-11-22 | 1995-11-22 | Phenolic resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09143342A (en) |
-
1995
- 1995-11-22 JP JP30402195A patent/JPH09143342A/en active Pending
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