JPH09143425A - Curable coating composition - Google Patents
Curable coating compositionInfo
- Publication number
- JPH09143425A JPH09143425A JP30423395A JP30423395A JPH09143425A JP H09143425 A JPH09143425 A JP H09143425A JP 30423395 A JP30423395 A JP 30423395A JP 30423395 A JP30423395 A JP 30423395A JP H09143425 A JPH09143425 A JP H09143425A
- Authority
- JP
- Japan
- Prior art keywords
- group
- resin
- weight
- coating composition
- curable coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008199 coating composition Substances 0.000 title claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 57
- 229920005989 resin Polymers 0.000 claims abstract description 57
- -1 aromatic sulfonium salt Chemical class 0.000 claims abstract description 43
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 41
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000013522 chelant Substances 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 15
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 14
- 125000000524 functional group Chemical group 0.000 claims abstract description 13
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 11
- 239000003054 catalyst Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 238000010538 cationic polymerization reaction Methods 0.000 claims abstract description 7
- 239000002685 polymerization catalyst Substances 0.000 claims abstract description 7
- 125000003118 aryl group Chemical group 0.000 claims abstract description 6
- 125000003710 aryl alkyl group Chemical group 0.000 claims abstract description 5
- 229910017048 AsF6 Inorganic materials 0.000 claims abstract description 3
- 125000005843 halogen group Chemical group 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- 125000000547 substituted alkyl group Chemical group 0.000 claims description 4
- 229910018286 SbF 6 Inorganic materials 0.000 claims description 3
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 abstract description 7
- 238000005260 corrosion Methods 0.000 abstract description 7
- 238000002156 mixing Methods 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract description 2
- 150000001768 cations Chemical class 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 238000004321 preservation Methods 0.000 abstract 1
- 239000000178 monomer Substances 0.000 description 18
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 15
- 238000000576 coating method Methods 0.000 description 15
- 239000000243 solution Substances 0.000 description 15
- 229920000178 Acrylic resin Polymers 0.000 description 13
- 239000004925 Acrylic resin Substances 0.000 description 13
- 239000007787 solid Substances 0.000 description 11
- 125000005595 acetylacetonate group Chemical group 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 7
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 239000003973 paint Substances 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- 239000008096 xylene Substances 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- MQPPCKJJFDNPHJ-UHFFFAOYSA-K aluminum;3-oxohexanoate Chemical compound [Al+3].CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O MQPPCKJJFDNPHJ-UHFFFAOYSA-K 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000013035 low temperature curing Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000010526 radical polymerization reaction Methods 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 125000005370 alkoxysilyl group Chemical group 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- FIMUXQLLGBMSAI-UHFFFAOYSA-N cyclohexylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CCCCC1 FIMUXQLLGBMSAI-UHFFFAOYSA-N 0.000 description 3
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 3
- 229940093858 ethyl acetoacetate Drugs 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 235000010215 titanium dioxide Nutrition 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 description 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- KJNZOAZUWTWQKR-UHFFFAOYSA-J 3-oxoheptanoate zirconium(4+) Chemical compound [Zr+4].CCCCC(=O)CC([O-])=O.CCCCC(=O)CC([O-])=O.CCCCC(=O)CC([O-])=O.CCCCC(=O)CC([O-])=O KJNZOAZUWTWQKR-UHFFFAOYSA-J 0.000 description 1
- MBBIERQKUVRPHB-UHFFFAOYSA-J 3-oxohexanoate tin(4+) diacetate Chemical compound C(C)(=O)[O-].C(C)(=O)[O-].[Sn+4].C(C)CC(CC(=O)[O-])=O.C(C)CC(CC(=O)[O-])=O MBBIERQKUVRPHB-UHFFFAOYSA-J 0.000 description 1
- AMUZLNGQQFNPTQ-UHFFFAOYSA-J 3-oxohexanoate zirconium(4+) Chemical compound [Zr+4].CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O AMUZLNGQQFNPTQ-UHFFFAOYSA-J 0.000 description 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- XIUOHAWYOAXLEC-UHFFFAOYSA-J C(C)CC(CC(=O)[O-])=O.C(C)CC(CC(=O)[O-])=O.C(C)CC(CC(=O)[O-])=O.C(C)CC(CC(=O)[O-])=O.[Sn+4] Chemical compound C(C)CC(CC(=O)[O-])=O.C(C)CC(CC(=O)[O-])=O.C(C)CC(CC(=O)[O-])=O.C(C)CC(CC(=O)[O-])=O.[Sn+4] XIUOHAWYOAXLEC-UHFFFAOYSA-J 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- 101100008044 Caenorhabditis elegans cut-1 gene Proteins 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- YABBMWRVNGAUNW-UHFFFAOYSA-K aluminum;3-oxooctanoate Chemical compound [Al+3].CCCCCC(=O)CC([O-])=O.CCCCCC(=O)CC([O-])=O.CCCCCC(=O)CC([O-])=O YABBMWRVNGAUNW-UHFFFAOYSA-K 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- NPAIMXWXWPJRES-UHFFFAOYSA-N butyltin(3+) Chemical compound CCCC[Sn+3] NPAIMXWXWPJRES-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- MCJLRTHYUFIPCD-UHFFFAOYSA-K di(pentanoyloxy)alumanyl pentanoate Chemical compound [Al+3].CCCCC([O-])=O.CCCCC([O-])=O.CCCCC([O-])=O MCJLRTHYUFIPCD-UHFFFAOYSA-K 0.000 description 1
- JBSLOWBPDRZSMB-FPLPWBNLSA-N dibutyl (z)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C/C(=O)OCCCC JBSLOWBPDRZSMB-FPLPWBNLSA-N 0.000 description 1
- 125000005594 diketone group Chemical group 0.000 description 1
- VNGOYPQMJFJDLV-UHFFFAOYSA-N dimethyl benzene-1,3-dicarboxylate Chemical compound COC(=O)C1=CC=CC(C(=O)OC)=C1 VNGOYPQMJFJDLV-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- REOJLIXKJWXUGB-UHFFFAOYSA-N mofebutazone Chemical group O=C1C(CCCC)C(=O)NN1C1=CC=CC=C1 REOJLIXKJWXUGB-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- YJGJRYWNNHUESM-UHFFFAOYSA-J triacetyloxystannyl acetate Chemical compound [Sn+4].CC([O-])=O.CC([O-])=O.CC([O-])=O.CC([O-])=O YJGJRYWNNHUESM-UHFFFAOYSA-J 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- TUQLLQQWSNWKCF-UHFFFAOYSA-N trimethoxymethylsilane Chemical compound COC([SiH3])(OC)OC TUQLLQQWSNWKCF-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000000326 ultraviolet stabilizing agent Substances 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は新規な硬化型塗料組
成物に係わる。TECHNICAL FIELD The present invention relates to a novel curable coating composition.
【0002】[0002]
【従来の技術】従来、アルコキシシラン基、水酸基及び
エポキシ基を官能基成分として含有する樹脂にアルミニ
ウム、ジルコニウム、チタニウム等の金属キレ−ト触媒
を配合してなる硬化型塗料組成物は特開昭63−108
048号公報、特開昭63−108049号公報等に記
載されているように公知である。しかしながら、該塗料
組成物は鋼板に対する防食性が十分でないといった欠点
がある。2. Description of the Related Art Conventionally, a curable coating composition prepared by blending a resin containing an alkoxysilane group, a hydroxyl group and an epoxy group as a functional group component with a metal chelate catalyst such as aluminum, zirconium or titanium has been disclosed. 63-108
It is publicly known as described in JP-A-048, JP-A-63-108049 and the like. However, the coating composition has a drawback that it does not have sufficient anticorrosion properties for steel sheets.
【0003】また、上記した金属キレ−トに変えてスズ
キレ−ト触媒を配合したものは防食性は向上するが低温
硬化性に劣るといった欠点がある。Further, a composition containing a tin silicate catalyst in place of the above metal chelate has a drawback that the corrosion resistance is improved but the low temperature curability is poor.
【0004】[0004]
【発明が解決しようとする課題】本発明はアルコキシシ
ラン基、水酸基及びエポキシ基を官能基成分とする硬化
性塗料組成物の欠点である防食性及び低温硬化性の性能
を共に満足させる塗料を開発することを目的としてなさ
れたものである。DISCLOSURE OF THE INVENTION The present invention has developed a paint which satisfies both the anticorrosion property and the low temperature curability which are the drawbacks of a curable paint composition containing an alkoxysilane group, a hydroxyl group and an epoxy group as a functional group component. It was made for the purpose of doing.
【0005】[0005]
【課題を解決するための手段】本発明者等は、上記した
問題点を解決するために鋭意研究を重ねた結果、反応性
珪素基、水酸基及びエポキシ基を必須官能基成分として
含有する樹脂に金属キレ−ト及び特定のカチオン重合触
媒を特定量配合したものが防食性及び低温硬化性に優れ
た性能を発揮することを見出し、本発明を完成するに至
った。Means for Solving the Problems As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that a resin containing a reactive silicon group, a hydroxyl group and an epoxy group as an essential functional group component. The inventors have found that a composition containing a metal chelate and a specific cationic polymerization catalyst in a specific amount exerts excellent performances in corrosion resistance and low temperature curability, and have completed the present invention.
【0006】即ち、本発明は、下記成分 (A)反応性珪素基、水酸基及びエポキシ基を必須官能基成分として含有し、 該これらの官能基が分子中に、同一に含有する樹脂もしくは異なって含有する樹 脂混合物 100重量部 (B)金属キレ−ト触媒 0.1〜5重量部 (C)下記一般式(1)That is, the present invention contains the following component (A) reactive silicon group, hydroxyl group and epoxy group as essential functional group components, and these functional groups are the same or different resins contained in the molecule. Resin mixture contained 100 parts by weight (B) Metal chelate catalyst 0.1 to 5 parts by weight (C) General formula (1)
【0007】[0007]
【化3】 Embedded image
【0008】 (式中、R1 は水素原子、水酸基、アルコキシル基または(In the formula, R 1 is a hydrogen atom, a hydroxyl group, an alkoxyl group, or
【0009】[0009]
【化4】 Embedded image
【0010】 を示し、Yは置換されてもよい、アルキル基、アルコキシル基、フェニル基また はフェノキシ基を示し、R2 及びR3 は各々水素原子、ハロゲン原子またはアル キル基を示し、R4 及びR5 は置換されてもよい、アルキル基、アラルキル基ま たはアリ−ル基を示し、X- はSbF6 - 、PF6 - 、AsF6 - またはBF4 - を示す) で表される芳香族スルホニウム塩のカチオン重合触媒 0.1〜5重量部 を配合してなることを特徴とする硬化型塗料組成物に係
わる。And Y is an optionally substituted alkyl group, alkoxyl group, phenyl group or phenoxy group, and R isTwoAnd RThreeEach represents a hydrogen atom, a halogen atom or an alkyl group, and RFourAnd RFiveRepresents an optionally substituted alkyl group, aralkyl group or aryl group, and X-Is SbF6 -, PF6 -, AsF6 -Or BFFour - And a cationic polymerization catalyst of an aromatic sulfonium salt of 0.1 to 5 parts by weight.
Wow
【0011】本発明塗料組成物で使用する樹脂(A)
は、反応性珪素基、水酸基及びエポキシ基を必須官能基
成分として含有する樹脂もしくは樹脂混合物である。Resin (A) used in the coating composition of the present invention
Is a resin or resin mixture containing a reactive silicon group, a hydroxyl group and an epoxy group as essential functional group components.
【0012】反応性珪素基としては、ヒドロキシシリル
基及び加水分解性シリル基等が挙げられる。加水分解性
シリル基としては、水の存在下でヒドロキシシルル基を
生成する官能基であり、例えば、アルコキシシリル基、
アシロキシシリル基等が好ましいものとして挙げられ
る。これらの基の中でもアルコキシシリル基が好まし
く、更に、メトキシ、エトキシ等の低級アルコキシシリ
ル基が低温硬化性の観点から好ましい。Examples of the reactive silicon group include a hydroxysilyl group and a hydrolyzable silyl group. The hydrolyzable silyl group is a functional group that forms a hydroxysilulyl group in the presence of water, for example, an alkoxysilyl group,
An acyloxysilyl group and the like are preferred. Among these groups, an alkoxysilyl group is preferable, and a lower alkoxysilyl group such as methoxy and ethoxy is more preferable from the viewpoint of low temperature curability.
【0013】水酸基は炭素に直接結合する水酸基であ
り、第1〜3級の水酸基が使用できるが、好ましくは第
1級水酸基のものが好ましい。The hydroxyl group is a hydroxyl group which is directly bonded to carbon, and primary to tertiary hydroxyl groups can be used, but primary hydroxyl groups are preferred.
【0014】エポキシ基としては、グリシジル等の脂肪
族エポキシ基及び3,4−エポキシシクロヘキシル等の
脂環族エポキシ基等のいずれにおいても使用できる。As the epoxy group, any of an aliphatic epoxy group such as glycidyl and an alicyclic epoxy group such as 3,4-epoxycyclohexyl can be used.
【0015】樹脂(A)の例としては、例えば、 水酸基含有樹脂(a)、エポキシ基含有樹脂(b)、
反応性珪素基含有樹脂(c)の3成分を含有する樹脂混
合物(以下、「樹脂(1)」と略す」、 エポキシ基含有樹脂(b)、反応性珪素基含有樹脂
(c)の2成分の混合樹脂であって、かつ樹脂(b)及
び樹脂(c)成分のいずれか一方もしくは両方に水酸基
を含有する混合樹脂(以下、「樹脂(2)」と略す)、 水酸基、エポキシ基、反応性珪素基を含有する樹脂
(以下、「樹脂(3)と略す) などが挙げられる。Examples of the resin (A) include a hydroxyl group-containing resin (a), an epoxy group-containing resin (b),
A resin mixture containing three components of the reactive silicon group-containing resin (c) (hereinafter abbreviated as "resin (1)"), an epoxy group-containing resin (b), and a reactive silicon group-containing resin (c). A mixed resin containing a hydroxyl group in one or both of the resin (b) and the resin (c) components (hereinafter abbreviated as "resin (2)"), hydroxyl group, epoxy group, reaction Examples thereof include a resin containing a conductive silicon group (hereinafter, abbreviated as “resin (3)”).
【0016】樹脂(1):水酸基含有樹脂(a)として
は、1分子中に平均約2個以上の水酸基を有し、好まし
くは数平均分子量約1000〜100000、好ましく
は約3000〜80000のものが使用できる。水酸基
が平均約2個を下回ると低温硬化性が悪いので好ましく
ない。水酸基の数は耐候性、耐水性などの点から平均約
400個以下が好ましい。数平均分子量が1000未満
では防食性、加工性、耐候性等が劣るものとなり、一
方、100000を上回ると他の成分との相溶性が低下
し、その結果として硬化性が不均一となり仕上り外観、
加工性等が劣るため好ましくない。Resin (1): The hydroxyl group-containing resin (a) has an average of about 2 or more hydroxyl groups in one molecule and preferably has a number average molecular weight of about 1,000 to 100,000, preferably about 3,000 to 80,000. Can be used. If the average number of hydroxyl groups is less than about 2, it is not preferable because the low temperature curability is poor. From the viewpoint of weather resistance and water resistance, the number of hydroxyl groups is preferably about 400 or less on average. If the number average molecular weight is less than 1000, the anticorrosion property, processability, weather resistance, etc. are poor, while if it exceeds 100,000, the compatibility with other components is reduced, and as a result, the curability becomes uneven and the finished appearance,
It is not preferable because the workability is poor.
【0017】水酸基含有樹脂(a)としては、従来から
公知の樹脂が使用できるが、特に、アクリル系樹脂、ポ
リエステル系樹脂が好ましい。As the hydroxyl group-containing resin (a), conventionally known resins can be used, but acrylic resins and polyester resins are particularly preferable.
【0018】水酸基含有アクリル系樹脂としては、例え
ば、ヒドロキシエチル(メタ)アクリレ−ト、ヒドロキ
シプロピル(メタ)アクリレ−ト、ヒドロキシブチル
(メタ)アクリレ−ト、エチレングリコ−ルモノ(メ
タ)アクリレ−ト、これらのモノマ−とラクトン類との
付加物等の水酸基含有モノマ−類とその他のラジカル重
合性モノマ−(例えば、メチル(メタ)アクリレ−ト、
エチル(メタ)アクリレ−ト、ブチル(メタ)アクリレ
−ト、ヘキシル(メタ)アクリレ−ト、オクチル(メ
タ)アクリレ−ト、ラウリル(メタ)アクリレ−ト、シ
クロヘキシル(メタ)アクリレ−ト等の(メタ)アクリ
ル酸のC1〜24個のアルキルまたはシクロアルキルエス
テル類、スチレン等のビニル芳香族化合物類、パ−フル
オロブチルエチル(メタ)アクリレ−ト、パ−フルオロ
イソノニルエチル(メタ)アクリレ−ト、パ−フルオロ
オクチルエチル(メタ)アクリレ−ト等のパ−フルオロ
アルキル(メタ)アクリレ−ト類、(メタ)アクリロニ
トリル等のニトリル化合物類等が挙げられる。Examples of the hydroxyl group-containing acrylic resin include hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, ethylene glycol mono (meth) acrylate. , Hydroxyl group-containing monomers such as adducts of these monomers and lactones, and other radically polymerizable monomers (for example, methyl (meth) acrylate,
(Ethyl (meth) acrylate, butyl (meth) acrylate, hexyl (meth) acrylate, octyl (meth) acrylate, lauryl (meth) acrylate, cyclohexyl (meth) acrylate and the like ( C1-24 alkyl or cycloalkyl esters of (meth) acrylic acid, vinyl aromatic compounds such as styrene, perfluorobutylethyl (meth) acrylate, perfluoroisononylethyl (meth) acrylate And perfluoroalkyl (meth) acrylates such as perfluorooctylethyl (meth) acrylate and nitrile compounds such as (meth) acrylonitrile.
【0019】水酸基含有ポリエステル樹脂としては、多
塩基酸(例えば、フタル酸、イソフタル酸、テレフタル
酸、コハク酸、セバシン酸、アゼライン酸、イソフタル
酸ジメチル、テレフタル酸ジメチル等)と多価アルコ−
ル(例えば、ネオペンチルグリコ−ル、1,6−ヘキサ
ンジオ−ル、トリメチロ−ルプロパン、ペンタエリスリ
ト−ル等)とを水酸基が含有するようにエステル化もし
くはエステル交換反応させることにより得られるものが
使用できる。Examples of the hydroxyl group-containing polyester resin include polybasic acids (for example, phthalic acid, isophthalic acid, terephthalic acid, succinic acid, sebacic acid, azelaic acid, dimethyl isophthalate, dimethyl terephthalate, etc.) and polyhydric alcohols.
(For example, neopentyl glycol, 1,6-hexanediol, trimethylolpropane, pentaerythritol, etc.) to be obtained by esterification or transesterification so that the hydroxyl group contains Can be used.
【0020】エポキシ基含有樹脂(b)としては、1分
子中に平均約2〜300個を有し、好ましくは数平均分
子量約120〜100000、好ましくは約240〜6
0000のものが使用できる。エポキシ基の数が平均約
2個未満になると低温硬化性、防食性等な悪くなり、一
方、300個を越えると耐候性等が悪くなるので好まし
くない。分子量が約120を下回るものは入手し難く、
一方、100000を越えると他の成分との相溶性が劣
り、塗膜仕上り外観、低温硬化性、防食性等が悪くなる
ので好ましくない。The epoxy group-containing resin (b) has an average of about 2 to 300 in one molecule, preferably a number average molecular weight of about 120 to 100,000, preferably about 240 to 6.
0000 can be used. If the number of epoxy groups is less than about 2 on average, low-temperature curability, corrosion resistance and the like deteriorate, while if it exceeds 300, weather resistance and the like deteriorate. It is difficult to obtain those with a molecular weight below 120,
On the other hand, if it exceeds 100,000, the compatibility with other components is poor and the finished appearance of the coating film, low-temperature curing property, anticorrosion property and the like are deteriorated, which is not preferable.
【0021】エポキシ基含有樹脂(b)としては、エポ
キシ基含有重合性不飽和単量体(例えば、特開平2−1
60879号公報に記載される一般式(4)〜(18)
の脂環式ビニルモノマ−、グリシジル(メタ)アクリレ
−ト等)の単独重合体もしくはこのものとその他のラジ
カル重合性モノマ−との共重合体等が挙げられる。ま
た、上記以外にERL4221(ユニオンカ−バイド社
製、商標名、脂環式ジエポキシ化合物)等のエポキシ樹
脂も使用できる。As the epoxy group-containing resin (b), an epoxy group-containing polymerizable unsaturated monomer (for example, JP-A No. 2-1
General formulas (4) to (18) described in JP-A-60879.
Alicyclic vinyl monomers, glycidyl (meth) acrylate homopolymers, etc., or copolymers of these with other radically polymerizable monomers. In addition to the above, an epoxy resin such as ERL4221 (trade name, alicyclic diepoxy compound manufactured by Union Carbide Co.) can also be used.
【0022】反応性珪素基含有樹脂(c)としては、1
分子中に平均約1個以上、好ましくは平均約2〜500
個の反応性珪素基を有し、数平均分子量が約130〜1
00000、好ましくは約700〜80000のものが
使用できる。反応性珪素基が約1個を下回ると低温硬化
性が悪くなるので好ましくない。また、分子量が約13
0を下回るものは入手し難く、一方、100000を越
えるものは他の成分との相溶性が悪くなるので塗膜仕上
り外観、低温硬化性、防食性等が悪くなるため好ましく
ない。The reactive silicon group-containing resin (c) is 1
An average of about 1 or more in the molecule, preferably about 2 to 500
Having a number of reactive silicon groups and a number average molecular weight of about 130 to 1
00000, preferably about 700-80,000 can be used. If the number of reactive silicon groups is less than about 1, the low temperature curability is deteriorated, which is not preferable. The molecular weight is about 13
If it is less than 0, it is difficult to obtain, and if it exceeds 100,000, the compatibility with other components is deteriorated, so that the finished appearance of the coating film, low temperature curing property, anticorrosion property, etc. are deteriorated, which is not preferable.
【0023】反応性珪素基含有樹脂(c)としては、シ
ランモノマ−(例えば、γ−(メタ)アクリロキシプロ
ピルトリメトキシシラン、γ−(メタ)アクリロキシプ
ロピルトリエトキシシラン、ビニルトリメトキシシラン
等)、シランモノマ−縮合物(例えば、上記シランモノ
マ−とトリアルコキシシランと縮合させたマクロモノマ
−類等、例えば、特開平2−160879号公報記載の
ポリシロキサン系マクロモノマ−)の単独重合体もしく
はこのものとその他のラジカル重合性モノマ−との共重
合体等が挙げられる。また、上記以外にアルコキシシラ
ン(テトラメトキシシラン、トリメトキシメチルシラ
ン、テトラエトキシシラン、トリエトキシエチルシラ
ン、トリメトキシフェニルシラン等)及びこれらの縮合
物等が使用できる。The reactive silicon group-containing resin (c) is a silane monomer (eg, γ- (meth) acryloxypropyltrimethoxysilane, γ- (meth) acryloxypropyltriethoxysilane, vinyltrimethoxysilane). A homopolymer of a silane monomer condensate (for example, a macromonomer condensed with the silane monomer and a trialkoxysilane, for example, a polysiloxane macromonomer described in JP-A-2-160879), or a homopolymer thereof And a copolymer with a radical-polymerizable monomer of. In addition to the above, alkoxysilanes (tetramethoxysilane, trimethoxymethylsilane, tetraethoxysilane, triethoxyethylsilane, trimethoxyphenylsilane, etc.) and their condensates can be used.
【0024】上記樹脂(a)、(b)及び(c)の配合
割合は、これらの3成分の総合計量(固形分)で樹脂
(a)約5〜98重量%、好ましくは約20〜94重量
%、樹脂(b)約2〜95重量%、好ましくは約5〜8
0重量%、樹脂(c)約0.1〜80重量%、好ましく
は約1〜40重量%の範囲が低温硬化性、防食性等の観
点から好ましい。The mixing ratio of the above resins (a), (b) and (c) is about 5 to 98% by weight of the resin (a), preferably about 20 to 94, based on the total amount (solid content) of these three components. % By weight, resin (b) about 2-95% by weight, preferably about 5-8
The range of 0% by weight and about 0.1 to 80% by weight, preferably about 1 to 40% by weight of the resin (c) is preferable from the viewpoint of low temperature curing property, anticorrosion property and the like.
【0025】樹脂(2):上記樹脂(b)及び/又は樹
脂(c)に水酸基を導入したものが使用できる。この場
合の水酸基の数は1分子中に平均約2個以上、好ましく
は平均約400個以下の範囲で含有させることが前記の
理由から好ましい。また、水酸基を導入した樹脂は数平
均分子量約1000〜100000、好ましくは約10
00〜80000のものが好ましい。また、樹脂に水酸
基を導入する方法としては、例えば、アクリル樹脂の製
造において水酸基含有不飽和単量体を必須成分とするこ
とにより製造できる。樹脂の配合割合は2成分の総合計
量でそれぞれ約5〜95重量%、好ましくは20〜80
重量%が低温硬化性、防食性等の観点から好ましい。樹
脂(2)には必要に応じて前記水酸基含有樹脂(a)を
配合することができる。Resin (2): The above resin (b) and / or resin (c) into which a hydroxyl group is introduced can be used. In this case, the number of hydroxyl groups contained in one molecule is preferably about 2 or more on average, and preferably about 400 or less on average, for the reasons described above. The resin having a hydroxyl group introduced has a number average molecular weight of about 1,000 to 100,000, preferably about 10
It is preferably from 00 to 80,000. As a method of introducing a hydroxyl group into the resin, for example, it can be produced by using a hydroxyl group-containing unsaturated monomer as an essential component in the production of an acrylic resin. The compounding ratio of the resin is about 5 to 95% by weight, preferably 20 to 80 by total measurement of the two components.
Weight% is preferable from the viewpoint of low temperature curability, anticorrosion and the like. The resin (2) may be blended with the hydroxyl group-containing resin (a), if necessary.
【0026】樹脂(3):樹脂(3)としては、1分子
中に平均約1個以上、好ましくは約2〜500個の反応
性珪素基、1分子中に平均約2〜300個のエポキシ基
及び1分子中に平均約2〜200個の水酸基を有するこ
とが低温硬化性、防食性等の観点から好ましい。Resin (3): As the resin (3), an average of about 1 or more, preferably about 2 to 500, reactive silicon groups in one molecule, and an average of about 2 to 300 epoxies in one molecule. It is preferable to have a group and an average of about 2 to 200 hydroxyl groups in one molecule from the viewpoint of low-temperature curability, corrosion resistance, and the like.
【0027】樹脂(3)としては、例えば、前記水酸基
含有モノマ−前記エポキシ基含有重合性不飽和単量体、
シランモノマ−(縮合物)及び必要に応じて前記その他
のラジカル重合性モノマ−との共重合体が好適に使用で
きる。該モノマ−の配合割合は、樹脂中の官能基が上記
範囲に入るように配合すれば良い。As the resin (3), for example, the hydroxyl group-containing monomer, the epoxy group-containing polymerizable unsaturated monomer,
A silane monomer (condensate) and, if necessary, a copolymer with the above-mentioned other radically polymerizable monomer can be preferably used. The mixing ratio of the monomer may be such that the functional group in the resin falls within the above range.
【0028】樹脂の数平均分子量は約1000〜100
000、好ましくは約3000〜80000のものが望
ましい。The number average molecular weight of the resin is about 1000-100.
000, preferably about 3000 to 80,000 is desirable.
【0029】本発明で使用する金属キレ−ト触媒(B)
は、上記樹脂(A)中の水酸基、エポキシ基及び反応性
珪素基の反応を促進するために使用する触媒であって、
アルミニウムキレ−ト化合物、スズキレ−ト化合物、ジ
ルコニウムキレ−ト化合物、チタニウムキレ−ト化合物
等が挙げられる。キレ−ト化剤としては、ケト・エノ−
ル互変異性体を構成し得るキレ−ト化合物が好ましい。Metal chelate catalyst (B) used in the present invention
Is a catalyst used for promoting the reaction of the hydroxyl group, the epoxy group and the reactive silicon group in the resin (A),
An aluminum chelate compound, a tin silicate compound, a zirconium chelate compound, a titanium chelate compound etc. are mentioned. As a chelating agent, keto-eno
A chelate compound capable of forming a rutile tautomer is preferable.
【0030】金属キレ−トの具体例としては、例えば、
トリス(エチルアセトアセテ−ト)アルミニウム、トリ
ス(プロピルアセテ−ト)アルミニウム、トリス(ブチ
ルアセトアセテ−ト)アルミニウム、プロポキシビス
(エチルアセトアセテ−ト)アルミニウム、トリス(ア
セチルアセトナト)アルミニウム、トリス(プロピオニ
ルアセトナト)アルミニウム、トリス(アセトアセトナ
ト)アルミニウム、テトラキス(エチルアセトアセテ−
ト)チタニウム、テトラキス(アセチルアセトナト)チ
タニウム、ジプロポキシビス(エチルアセトアセテ−
ト)チタニウム、ジプロポキシビス(アセチルアセトナ
ト)チタニウム、テトラキス(アセチルアセトナト)ジ
ルコニウム、テトラキス(プロピルアセトアセテ−ト)
ジルコニウム、テトラキス(エチルアセトアセテ−ト)
ジルコニウム、モノブチルビス(エチルアセトアセテ−
ト)スズアセテ−ト、モノブチルビス(アセチルアセト
ナト)スズオクテ−ト、モノブチルトリス(エチルアセ
トアセテ−ト)スズ、モノブチルトリス(アセチルアセ
トナト)スズ、ビス(エチルアセトアセテ−ト)スズジ
アセテ−ト、ブチルビス(アセチルアセトナト)スズオ
クテ−ト、ビス(アセチルアセトナト)スズジオクテ−
ト等が挙げられる。これらのものは1種もしくは2種以
上組合せて使用することができる。Specific examples of the metal chelate include, for example,
Tris (ethylacetoacetate) aluminum, tris (propylacetate) aluminum, tris (butylacetoacetate) aluminum, propoxybis (ethylacetoacetate) aluminum, tris (acetylacetonato) aluminum, tris ( Propionylacetonato) aluminum, tris (acetoacetonato) aluminum, tetrakis (ethylacetoacetate)
G) Titanium, tetrakis (acetylacetonato) titanium, dipropoxybis (ethylacetoacetate)
G) Titanium, dipropoxybis (acetylacetonato) titanium, tetrakis (acetylacetonato) zirconium, tetrakis (propylacetoacetate)
Zirconium, tetrakis (ethyl acetoacetate)
Zirconium, monobutyl bis (ethyl acetoacetate
G) tin acetate, monobutylbis (acetylacetonato) tin octate, monobutyltris (ethylacetoacetate) tin, monobutyltris (acetylacetonato) tin, bis (ethylacetoacetate) tin diacetate, Butyl bis (acetylacetonato) tin octate, bis (acetylacetonato) tin dioctate
And the like. These can be used alone or in combination of two or more.
【0031】金属キレ−ト(B)の配合割合は樹脂
(A)100重量部に対して0.1〜5重量部、好まし
くは0.2〜4重量部の範囲が好適である。配合割合が
0.1を下回ると低温硬化性、加工性、防食性等が悪く
なり、一方、5重量部を上回ると耐水性等が悪くなるの
で好ましくない。The proportion of the metal chelate (B) is 0.1 to 5 parts by weight, preferably 0.2 to 4 parts by weight, based on 100 parts by weight of the resin (A). If the compounding ratio is less than 0.1, the low-temperature curability, processability, anticorrosiveness, etc. will deteriorate, while if it exceeds 5 parts by weight, the water resistance etc. will deteriorate, such being undesirable.
【0032】本発明で使用するカチオン重合触媒(C)
は前記一般式(1)で表される芳香族スルホニウム塩で
ある。Cationic polymerization catalyst (C) used in the present invention
Is an aromatic sulfonium salt represented by the general formula (1).
【0033】一般式(1)において、R1 又はYのアル
コキシル基としては、メチル基、エチル基等のC1〜4
のアルキル基又はメトキシ基、エトキシ基等のC1〜4
のアルコキシル基が好ましい。Yのアルキル基として
は、メチル基、エチル基等のC1〜4 のアルキル基が好
ましい。また、R1 のYにおいて置換されてもよいアル
キル基、アルコキシル基の置換基としてはハロゲン原
子、アルコキシル基、また、置換されてもよいフェニル
基、フェノキシ基の置換基としてはアルキル基、アルコ
キシル基、ハロゲン原子、ニトロ基等が挙げられる。In the general formula (1), the alkoxyl group for R 1 or Y is C 1-4 such as methyl or ethyl.
C 1-4 such as alkyl group, methoxy group and ethoxy group of
Alkoxy groups are preferred. The Y alkyl group, a methyl group, an alkyl group of C 1 to 4, such as ethyl are preferred. Further, as the substituent of the alkyl group or the alkoxyl group which may be substituted in Y of R 1, a halogen atom or an alkoxyl group may be substituted, and the phenyl group which may be substituted or the substituent of the phenoxy group may be an alkyl group or an alkoxyl group. , Halogen atom, nitro group and the like.
【0034】[0034]
【化5】 Embedded image
【0035】の具体例としては、アセトキシ基、メトキ
シカルボニルオキシ基、エトキシカルボニルオキシ基、
ベンジルオキシカルボニルオキシ基、フェノキシカルボ
ニルオキシ基、フルオレニルメトキシカルボニルオキシ
基等が挙げられる。R1 としては、特に、水酸基が好ま
しい。R2 又はR3 のアルキル基としてはメチル基、エ
チル基等のC1〜4 のアルキル基が好ましい。As specific examples of, acetoxy group, methoxycarbonyloxy group, ethoxycarbonyloxy group,
Examples thereof include a benzyloxycarbonyloxy group, a phenoxycarbonyloxy group, and a fluorenylmethoxycarbonyloxy group. As R 1 , a hydroxyl group is particularly preferable. The alkyl group of R 2 or R 3 is preferably a C 1-4 alkyl group such as a methyl group or an ethyl group.
【0036】R4 及びR5 のアルキル基としてはメチル
基、エチル基等のC1〜4 のアルキル基が好ましい。ア
ラルキル基としてはベンジル基、フェネチル基等が挙げ
られる。また、アリ−ル基としてはフェニル基、フェネ
チル基等が挙げられる。アルキル基、アラルキル基また
はアリ−ル基の置換基としてはメチル基、エチル基等の
C1〜4 のアルキル基、メトキシ基等のC1〜4 のアルコ
キシル基、ハロゲン原子、ニトロ基等が挙げられる。R
4 及びR5 において、これらのいずれか一方もしくは両
方がベンジル基のものは低温硬化性及び塗膜性能に優れ
た性能を発揮することからこのものを使用することが好
ましい。The alkyl group for R 4 and R 5 is preferably a C 1-4 alkyl group such as a methyl group or an ethyl group. Examples of the aralkyl group include a benzyl group and a phenethyl group. Further, examples of the aryl group include a phenyl group and a phenethyl group. Alkyl group, an aralkyl group or an ant - alkyl C 1 to 4 such as methyl group, ethyl group, an alkoxyl group of C 1 to 4 such as methoxy group, a halogen atom, a nitro group mentioned as the substituent of Le group To be R
It is preferable to use one having a benzyl group in either one or both of 4 and R 5 because it exhibits excellent low temperature curability and excellent coating film performance.
【0037】一般式(1)においてハロゲン原子として
は、弗素、塩素、臭素等が挙げられ、中でも塩素、弗素
が好ましい。Examples of the halogen atom in the general formula (1) include fluorine, chlorine, bromine and the like, among which chlorine and fluorine are preferable.
【0038】一般式(1)において、X- がSbF6 -
のものは低温硬化性、塗膜性能に優れた性能を発揮する
ことからこのものを使用することが好ましい。In the general formula (1), X − is SbF 6 −.
It is preferable to use these because they exhibit excellent low-temperature curability and coating film performance.
【0039】一般式(1)において、R1 が水酸基、R
4 がベンジル基、X- がSbF6 -の組合わせが好まし
い。In the general formula (1), R 1 is a hydroxyl group and R is
A combination in which 4 is a benzyl group and X − is SbF 6 — is preferable.
【0040】一般式(1)で表される芳香族スルホニウ
ム塩としては、例えば、ベンジル−4−ヒドロキシフェ
ニルメチルスルホニウムヘキサフルオロアンチモネ−
ト、ベンジル−4−ヒドロキシフェニルメチルスルホニ
ウムヘキサフルオロホスフェ−ト、4−アセトキシフェ
ニルベンジルメチルスルホニウムヘキサフルオロアンチ
モネ−ト、4−アセトキシフェニルジメチルスルホニウ
ムヘキサフルオロアンチモネ−ト、ベンジル−4−メト
キシフェニルメチルスルホニウムヘキサフルオロアンチ
モネ−ト、ベンジル−2−メチル−4−ヒドロキシフェ
ニルメチルスルホニウムヘキサフルオロアンチモネ−
ト、ベンジル−3−クロロ−4−ヒドロキシフェニルメ
チルスルホニウムヘキサフルオロアルセネ−ト、ベンジ
ル−3−メチル−4−ヒドロキシ−5−tert−ブチ
ルフェニルメチルスルホニウムヘキサフルオロアンチモ
ネ−ト、4−メトキシベンジル−4−ヒドロキシフェニ
ルメチルスルホニウムヘキサフルオロホスフェ−ト、ジ
ベンジル−4−ヒドロキシフェニルスルホニウムヘキサ
フルオロアンチモネ−ト、ジベンジル−4−ヒドロキシ
フェニルスルホニウムヘキサフルオロホスフェ−ト、4
−アセトキシフェニルジベンジルスルホニウムヘキサフ
ルオロアンチモネ−ト、ジベンジル−4−メトキシフェ
ニルスルホニウムヘキサフルオロアンチモネ−ト、ニト
ロベンジル−4−ヒドロキシフェニルメチルスルホニウ
ムヘキサフルオロアンチモネ−ト、3,5−ジニトロベ
ンジル−4−ヒドロキシフェニルメチルスルホニウムヘ
キサフルオロアンチモネ−ト、β−ナフチルメチル−4
−ヒドロキシフェニルメチルスルホニウムヘキサフルオ
ロアンチモネ−ト等が挙げられる。Examples of the aromatic sulfonium salt represented by the general formula (1) include benzyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate.
, Benzyl-4-hydroxyphenylmethylsulfonium hexafluorophosphate, 4-acetoxyphenylbenzylmethylsulfonium hexafluoroantimonate, 4-acetoxyphenyldimethylsulfonium hexafluoroantimonate, benzyl-4-methoxyphenyl Methylsulfonium hexafluoroantimonate, benzyl-2-methyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate
, Benzyl-3-chloro-4-hydroxyphenylmethylsulfonium hexafluoroarsenate, benzyl-3-methyl-4-hydroxy-5-tert-butylphenylmethylsulfonium hexafluoroantimonate, 4-methoxybenzyl -4-hydroxyphenylmethylsulfonium hexafluorophosphate, dibenzyl-4-hydroxyphenylsulfonium hexafluoroantimonate, dibenzyl-4-hydroxyphenylsulfonium hexafluorophosphate, 4
-Acetoxyphenyldibenzylsulfonium hexafluoroantimonate, dibenzyl-4-methoxyphenylsulfonium hexafluoroantimonate, nitrobenzyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate, 3,5-dinitrobenzyl- 4-hydroxyphenylmethylsulfonium hexafluoroantimonate, β-naphthylmethyl-4
-Hydroxyphenylmethylsulfonium hexafluoroantimonate and the like.
【0041】また、一般式(1)で表される芳香族スル
ホニウム塩の市販品としては、例えば、サンエイドSI
−L85、同左(サンエイドSI)−L110、同左−
L145、同左−L150、同左−L160、同左−H
15、同左−H20、同左−H25、同左−H40、同
左−H50、同左−60L、同左−80L、同左−10
0L(以上、三新化学工業株式会社製、商標名)等が挙
げられる。Commercial products of the aromatic sulfonium salt represented by the general formula (1) include, for example, San-Aid SI.
-L85, same as left (Sun aid SI) -L110, same as left-
L145, Same as left-L150, Same as left-L160, Same as left-H
15, same left-H20, same left-H25, same left-H40, same left-H50, same left-60L, same left-80L, same left-10
0L (above, brand name by Sanshin Chemical Industry Co., Ltd.) and the like.
【0042】一般式(1)で表される芳香族スルホニウ
ム塩の配合割合は、エポキシ基含有樹脂100重量部
(固形分)当たり、約0.1〜5重量部、好ましくは約
0.2〜3重量部の範囲が好ましい。配合割合が約0.
1重量部を下回ると硬化性が低下し耐水性、耐蝕性、耐
候性、加工性等が悪くなり、一方、約5重量部を上回る
と塗膜外観が悪くなるので好ましくない。The compounding ratio of the aromatic sulfonium salt represented by the general formula (1) is about 0.1 to 5 parts by weight, preferably about 0.2 to about 100 parts by weight (solid content) of the epoxy group-containing resin. A range of 3 parts by weight is preferred. The mixing ratio is about 0.
If it is less than 1 part by weight, the curability is lowered and water resistance, corrosion resistance, weather resistance, workability, etc. are deteriorated, while if it exceeds about 5 parts by weight, the coating film appearance is deteriorated, which is not preferable.
【0043】本発明塗料組成物は、上記(A)〜(C)
成分を有機溶剤に溶解もしくは分散させてなる有機溶剤
系塗料組成物として好適に使用できる。The coating composition of the present invention comprises the above (A) to (C).
It can be suitably used as an organic solvent-based coating composition obtained by dissolving or dispersing the components in an organic solvent.
【0044】有機溶剤系塗料組成物で使用する有機溶剤
としては、上記(A)〜(C)成分を溶解もしくは分散
でき、これらの成分と実質的に反応しない有機溶剤が使
用でき、具体的には、トルエン、キシレン等の芳香族
系、エタノ−ル、プロパノ−ル、ブタノ−ル等のアルコ
−ル系、エチルセロソルブ、ブチルセロソルブ等のエ−
テル系、メチルイソブチルケトン等のケトン系、酢酸ブ
チル、セロソルブアセテ−ト等のエステル系等が挙げら
れる。該溶剤は1種もしくは2種以上混合して使用する
こととができる。As the organic solvent used in the organic solvent-based coating composition, an organic solvent which can dissolve or disperse the components (A) to (C) and does not substantially react with these components can be used. Is an aromatic type such as toluene and xylene, an alcohol type such as ethanol, propanol and butanol, and an ethyl type such as ethyl cellosolve and butyl cellosolve.
Examples thereof include ter series, ketone series such as methyl isobutyl ketone, and ester series such as butyl acetate and cellosolve acetate. The solvent may be used alone or in combination of two or more.
【0045】本発明塗料組成物には、上記した成分以外
にも、必要に応じて着色剤、充填剤、紫外線安定剤、紫
外線吸収剤、流動性調整剤、ハジキ防止剤、垂れ止め
剤、硬化剤、塗料貯蔵安定剤(例えば、アセチルアセト
ン、ジケトン)等が配合できる。In the coating composition of the present invention, in addition to the above-mentioned components, if necessary, a coloring agent, a filler, an ultraviolet stabilizer, an ultraviolet absorber, a fluidity adjusting agent, an anti-cissing agent, an anti-sagging agent, and a curing agent. Agents, paint storage stabilizers (eg, acetylacetone, diketone) and the like can be added.
【0046】本発明塗料組成物は、被塗物に塗装し、焼
付け(例えば、約120℃以上の温度)硬化させること
によって塗膜を形成することができる。The coating composition of the present invention can be applied to an article to be coated and cured by baking (for example, at a temperature of about 120 ° C. or higher) to form a coating film.
【0047】被塗物としては、金属(鉄、アルミニウム
等)、無機質(ガラス等)、プラスチック(ポリエステ
ル等)及びこれらのものに表面処理、下塗り等を施した
ものが使用できる。As the article to be coated, metals (iron, aluminum, etc.), inorganic materials (glass, etc.), plastics (polyester, etc.) and those obtained by subjecting these to surface treatment, undercoating, etc. can be used.
【0048】塗装は、それ自体公知の方法、例えば、吹
付け塗装、刷毛塗装、ロ−ラ−塗装、流し塗り塗装等の
塗装方法によって行うことができる。The coating can be carried out by a method known per se, for example, spray coating, brush coating, roller coating, flow coating and the like.
【0049】塗装膜厚は、特に制限されないが、約10
ミクロン〜100ミクロン、好ましくは約20ミクロン
〜80ミクロンの範囲が好適である。The coating film thickness is not particularly limited, but is about 10
A range of microns to 100 microns, preferably about 20 to 80 microns is suitable.
【0050】硬化条件は、例えば、約100〜180℃
の温度で約20〜40分間で硬化が可能である。The curing conditions are, for example, about 100 to 180 ° C.
It can be cured at the temperature of about 20 to 40 minutes.
【0051】[0051]
【発明の効果】本発明塗料組成物は、水酸基、エポキシ
基及び反応性珪素基を硬化官能基とする硬化性組成物
に、触媒として金属キレ−ト及び特定のカチオン重合触
媒を組合わせることにより、これらの触媒が低温(約4
0℃)では作用せずに、また、加熱(約100℃以上)
によって上記官能基の触媒として作用することから1液
での塗料貯蔵安定性が優れ、且つ低温硬化性、仕上がり
性、防食性等の性能が優れるといった効果を発揮する。The coating composition of the present invention comprises a curable composition having a hydroxyl group, an epoxy group and a reactive silicon group as a curing functional group in combination with a metal chelate as a catalyst and a specific cationic polymerization catalyst. , These catalysts are at low temperature (about 4
Does not work at 0 ℃, and also heats (about 100 ℃ or more)
Since it acts as a catalyst for the above-mentioned functional groups, it exhibits excellent effects such as excellent storage stability of the coating composition in one liquid and excellent properties such as low-temperature curing property, finish property, and anticorrosion property.
【0052】[0052]
【実施例】以下、実施例を掲げて本発明を詳細に説明す
る。EXAMPLES The present invention will be described in detail below with reference to examples.
【0053】アクリル樹脂溶液A製造例 メタクリロキシプロピルトリメトキシシラン150g、
3.4−エポキシシクロヘキシルメチルメタクリレ−ト
220g、ヒドロキシエチルアクリレ−ト232g、シ
クロヘキシルメチルアクリレ−ト200g、ブチルメタ
クリレ−ト198gの単量体及びα,α´−アゾビスイ
ソブチロニトリル(重合開始剤)の混合物をキシレン1
000gに滴下し110℃で5時間ラジカル重合反応を
おこない固形分50重量%のアクリル樹脂溶液Aを製造
した。樹脂は数平均分子量約1万、水酸基価112mg
KOH/g、エポキシ当量909g/mol(1分子当
たりエポキシ基11個)、アルコキシシラン当量526
g/mol(1分子当たりアルコキシシラン基19個)
であった。Preparation Example of Acrylic Resin Solution A Methacryloxypropyltrimethoxysilane 150 g,
3.4-Epoxycyclohexylmethyl methacrylate 220 g, hydroxyethyl acrylate 232 g, cyclohexylmethyl acrylate 200 g, butyl methacrylate 198 g monomer and α, α′-azobisisobutyro Add a mixture of nitriles (polymerization initiators) to xylene 1
It was added dropwise to 000 g and radical polymerization reaction was carried out at 110 ° C. for 5 hours to produce an acrylic resin solution A having a solid content of 50% by weight. The resin has a number average molecular weight of about 10,000 and a hydroxyl value of 112 mg.
KOH / g, epoxy equivalent 909 g / mol (11 epoxy groups per molecule), alkoxysilane equivalent 526
g / mol (19 alkoxysilane groups per molecule)
Met.
【0054】アクリル樹脂溶液B製造例 3.4−エポキシシクロヘキシルメチルメタクリレ−ト
400g、ヒドロキシエチルアクリレ−ト232g、シ
クロヘキシルメチルアクリレ−ト184g、ブチルメタ
クリレ−ト184gの単量体及びα,α´−アゾビスイ
ソブチロニトリル(重合開始剤)の混合物をキシレン1
000gに滴下し110℃で5時間ラジカル重合反応を
おこない固形分50重量%のアクリル樹脂B溶液を得
た。樹脂は数平均分子量約1万、水酸基価112mgK
OH/g、エポキシ当量500g/mol(1分子当た
りエポキシ基20個)であった。Preparation Example of Acrylic Resin Solution B 3.4 Epoxycyclohexylmethyl methacrylate 400 g, hydroxyethyl acrylate 232 g, cyclohexylmethyl acrylate 184 g, butyl methacrylate 184 g of monomer and α , Α'-azobisisobutyronitrile (polymerization initiator) was mixed with xylene 1
It was added dropwise to 000 g and radical polymerization reaction was carried out at 110 ° C. for 5 hours to obtain an acrylic resin B solution having a solid content of 50% by weight. The resin has a number average molecular weight of about 10,000 and a hydroxyl value of 112 mgK.
OH / g and epoxy equivalent were 500 g / mol (20 epoxy groups per molecule).
【0055】アクリル樹脂溶液C製造例 メタクリロキシプロピルトリメトキシシラン243g、
ヒドロキシエチルアクリレ−ト232g、シクロヘキシ
ルメチルアクリレ−ト263g、ブチルメタクリレ−ト
262gの単量体及びα,α´−アゾビスイソブチロニ
トリル(重合開始剤)の混合物をキシレン1000gに
滴下し110℃で5時間ラジカル重合反応をおこない固
形分50重量%のアクリル樹脂溶液Cを製造した。樹脂
は数平均分子量約1万、水酸基価112mgKOH/
g、アルコキシシラン当量333g/mol(1分子当
たりアルコキシシラン基30個)であった。Preparation Example of Acrylic Resin Solution C Methacryloxypropyltrimethoxysilane 243 g,
A mixture of 232 g of hydroxyethyl acrylate, 263 g of cyclohexylmethyl acrylate and 262 g of butyl methacrylate and α, α'-azobisisobutyronitrile (polymerization initiator) was added dropwise to 1000 g of xylene. Then, a radical polymerization reaction was carried out at 110 ° C. for 5 hours to produce an acrylic resin solution C having a solid content of 50% by weight. The resin has a number average molecular weight of about 10,000 and a hydroxyl value of 112 mgKOH /
g, alkoxysilane equivalent was 333 g / mol (30 alkoxysilane groups per molecule).
【0056】アクリル樹脂溶液D製造例 スチレン380g、ヒドロキシエチルアクリレ−ト23
2g、ジ−n−ブチルマレ−ト373g、メタクリル酸
15gの単量体及びt−ブチルパ−オキシ−2−エチル
ヘキサノエ−ト(重合開始剤)の混合物をスワゾ−ル1
000(芳香族石油ナフサ、有機溶剤) 1000gに
滴下し150℃で2時間ラジカル重合反応をおこない固
形分50重量%のアクリル樹脂溶液Dを製造した。樹脂
は重量平均分子量約1万、水酸基価112mgKOH/
gであった。Production Example of Acrylic Resin Solution D 380 g of styrene, 23 of hydroxyethyl acrylate
A mixture of 2 g, 373 g of di-n-butyl maleate, 15 g of methacrylic acid and t-butyl peroxy-2-ethylhexanoate (polymerization initiator) was added to Swazol 1.
000 (aromatic petroleum naphtha, organic solvent) was added dropwise to 1000 g to carry out a radical polymerization reaction at 150 ° C. for 2 hours to produce an acrylic resin solution D having a solid content of 50% by weight. The resin has a weight average molecular weight of about 10,000 and a hydroxyl value of 112 mgKOH /
g.
【0057】実施例1 アクリル樹脂溶液A 60g、チタン白 CR−95
(石原産業株式会社製、商品名、着色顔料)100g、
キシレン20g、アセチルアセトン2gの混合物をシェ
カ−分散してチタン白顔料ペ−ストを製造した。次い
で、このものにアクリル樹脂溶液A 140g、アセチ
ルアセトン5g、固形分10重量%トリス(エチルアセ
トアセテ−ト)アルミニウム溶液5g、固形分50重量
%ベンジル−4−ヒドロキシフェニルメチルスルホニウ
ムヘキサフルオロアンチモネ−ト0.4gを配合して実
施例1の塗料を製造した。Example 1 60 g of acrylic resin solution A, titanium white CR-95
(Ishihara Sangyo Co., Ltd., trade name, color pigment) 100 g,
A mixture of 20 g of xylene and 2 g of acetylacetone was dispersed in a shaker to prepare a titanium white pigment paste. Then, 140 g of acrylic resin solution A, 5 g of acetylacetone, 5 g of tris (ethylacetoacetate) aluminum solution having a solid content of 10% by weight, and 50 g of solid content of 50% by weight benzyl-4-hydroxyphenylmethylsulfonium hexafluoroantimonate were added to this product. The coating material of Example 1 was manufactured by adding 0.4 g.
【0058】実施例2及び3 表1に記載の配合で実施例1と同様にして実施例2及び
3の塗料を製造した。 比較例1〜3 表1に記載の配合で実施例1と同様にして比較例1〜3
の塗料を製造した。Examples 2 and 3 The paints of Examples 2 and 3 were produced in the same manner as in Example 1 with the formulations shown in Table 1. Comparative Examples 1 to 3 Comparative Examples 1 to 3 with the formulations shown in Table 1 in the same manner as in Example 1.
Was manufactured.
【0059】[0059]
【表1】 [Table 1]
【0060】表1において、エポキシ化合物はセロキサ
イド2021(ダイセル化学株式会社製、商品名、脂環
式エポキシ樹脂)、シリル基含有樹脂はテトラエチルシ
リケ−トの低縮合物(平均縮合度約6)とε−カプロラ
クタムとの反応生成物、アルミキレ−ト溶液は固形分1
0重量%トリス(エチルアセトアセテ−ト)アルミニウ
ム溶液、スズキレ−ト溶液は固形分50重量%モノブチ
ルスズトリス(アセチルアセトナト)、カチオン重合触
媒溶液は固形分50重量%ベンジル−4−ヒドロキシフ
ェニルメチルスルホニウムヘキサフルオロアンチモネ−
トを表わす。In Table 1, epoxy compounds are Celoxide 2021 (trade name, alicyclic epoxy resin, manufactured by Daicel Chemical Co., Ltd.), and silyl group-containing resins are low condensation products of tetraethyl silicate (average degree of condensation about 6). The reaction product of ε-caprolactam and the aluminum chelate solution has a solid content of 1
0 wt% tris (ethylacetoacetate) aluminum solution, Suzukilate solution has a solid content of 50 wt% monobutyltin tris (acetylacetonate), and cationic polymerization catalyst solution has a solid content of 50 wt% benzyl-4-hydroxyphenylmethyl. Sulfonium hexafluoroantimony
Represents
【0061】上記で得られた実施例及び比較例の塗料を
使用して性能試験をおこなった。その結果を表1に示
す。Performance tests were carried out using the paints of Examples and Comparative Examples obtained above. Table 1 shows the results.
【0062】表1において、塗料の貯蔵安定性は下記の
方法で行った。In Table 1, the storage stability of the coating composition was determined by the following method.
【0063】実施例及び比較例のものをスト−マ−粘度
計で70KUの粘度になるように希釈したものを試料と
して用いた。試料を40℃−2週間間密閉状態で貯蔵し
た後、試料の粘度を測定して下記の基準で評価した。○
は粘度上昇が0〜10KUのもの、△は粘度上昇が11
〜19KUのもの、×は20KU以上のものからゲル化
のものを示す。The samples of the examples and comparative examples were diluted with a Stormer viscometer to a viscosity of 70 KU and used as samples. After storing the sample in a sealed state at 40 ° C. for 2 weeks, the viscosity of the sample was measured and evaluated according to the following criteria. ○
Indicates a viscosity increase of 0-10 KU, △ indicates a viscosity increase of 11
.About.19 KU, x indicates gelation from 20 KU or more.
【0064】また、表1において塗膜性能試験は下記の
方法で行った。Further, in Table 1, the coating film performance test was conducted by the following method.
【0065】塗装板の調整:燐酸亜鉛処理した厚さ0.
8mm鋼板に乾燥膜厚が約40ミクロンになるようにス
プレ−塗装し、140℃で30分間焼付けを行ったもの
を試験として使用した。Preparation of coated plate: Zinc phosphate treated to a thickness of 0.
An 8 mm steel plate was spray-coated to a dry film thickness of about 40 microns and baked at 140 ° C for 30 minutes, which was used as a test.
【0066】鏡面反射率:JIS K−5400の60
度鏡面光沢度を測定した。Specular reflectance: 60 of JIS K-5400
The degree of specular gloss was measured.
【0067】硬化性:塗膜表面をキシレンを含浸させた
ガ−ゼを指先で強く往復10回払拭した後の外観を目視
評価した。○は表面に異常がなく硬化性が良いもの、△
はわずかに表面に傷が認められ硬化性が劣るもの、×は
表面が溶解し硬化性が著しく劣るものを表わす。Curability: The appearance of the coating film was visually evaluated after wiping the surface of the coating film with xylene impregnated ten times with a fingertip. ○ indicates that the surface has no abnormality and has good curability.
Indicates that the surface is slightly scratched and the curability is inferior, and x indicates that the surface is dissolved and the curability is remarkably inferior.
【0068】鉛筆硬度:JIS K−5400に規定す
るスリ傷による評価を行った。Pencil hardness: An evaluation was made by a scratch according to JIS K-5400.
【0069】防食性:塗膜にNTカッタ−を用いて素地
鋼板に達するクロスカットを入れ、エッジ部および裏面
に防食塗料を施し、5重量%の食塩水による噴霧試験
(JIS−K−5400)を行った。240時間試験し
た後、セロファンテ−プでクロスカット部の剥離試験を
行った。◎はクロスカットからの剥離幅が1mm未満の
もの、○はクロスカットからの剥離幅が1〜3mmのも
の、△はクロスカットからの剥離幅が3.1〜5mmの
もの、×はクロスカットからの剥離幅が5mmを越える
ものを表わす。Corrosion resistance: A cross cut reaching the base steel plate was put in the coating film using an NT cutter, an anticorrosion paint was applied to the edge part and the back surface, and a spray test with 5% by weight of saline solution (JIS-K-5400). I went. After testing for 240 hours, a peeling test of the cross-cut portion was performed with cellophane tape. ◎: peel width less than 1 mm from cross cut, ○: peel width from cross cut 1 to 3 mm, △: peel width from cross cut 3.1 to 5 mm, ×: cross cut The peeling width from the sheet exceeds 5 mm.
Claims (2)
ニウム塩のX- がSbF6 - であることを特徴とする請
求項1記載の硬化型塗料組成物。2. The curable coating composition according to claim 1, wherein X − of the aromatic sulfonium salt represented by the general formula (1) is SbF 6 − .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30423395A JPH09143425A (en) | 1995-11-22 | 1995-11-22 | Curable coating composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30423395A JPH09143425A (en) | 1995-11-22 | 1995-11-22 | Curable coating composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09143425A true JPH09143425A (en) | 1997-06-03 |
Family
ID=17930611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30423395A Pending JPH09143425A (en) | 1995-11-22 | 1995-11-22 | Curable coating composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09143425A (en) |
-
1995
- 1995-11-22 JP JP30423395A patent/JPH09143425A/en active Pending
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