JPH09148792A - Electronic component mounting equipment - Google Patents

Abstract

It is an object of the present invention to provide an electronic component mounting apparatus capable of mounting chips efficiently with less loss time. Kind Code: A1 Chip supply units 11 and 1 for supplying chips.
2 and a take-out head 2 for taking out chips from the chip supply section
5, 26 and a take-out head, which are separate from each other, and which receives a chip from the take-out head and reverses the received chip; and a chip reversing unit for receiving the reversed chip and positioning the chip. And a pre-center table 29 that transfers the pre-center table 29 to a pick-up station away from the position where the chips are picked up from the pre-center table at the pick-up station S1 and the substrate 6 at the mounting station S4 at a position far from the pick-up station. In addition, a plurality of mounting heads 33 to 36 for mounting the chips are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting a chip on a substrate such as a liquid crystal panel using an anisotropic conductor.

[0002]

2. Description of the Related Art In recent years, in mounting a chip on a substrate such as a liquid crystal panel, an electronic component mounting apparatus using an anisotropic conductor has been put into practical use.

[0003]

By the way, in the conventional electronic component mounting apparatus, not only the chip take-out operation but also the chip reversal process is performed by the take-out means for taking out the chip from the chip supply section. However, when doing this,
There is a problem that the next chip cannot be taken out until the taking-out means returns to the posture before being turned over after the chip is turned over, resulting in a large loss time.

Further, in the conventional electronic component mounting apparatus, only one mounting head for receiving the chip inverted by the pick-up means and transferring it to the substrate is provided. Therefore, after the mounting head starts moving from the chip receiving position, the next chip transfer operation cannot be performed until the chip is transferred to the substrate and returned to the chip receiving position again. there were.

From the above two points, the conventional electronic component mounting apparatus has a problem that the loss time is large and the productivity when mounting a plurality of chips on one substrate is low.

[0006] Therefore, an object of the present invention is to provide an electronic component mounting apparatus capable of mounting chips efficiently with less loss time.

[0007]

In the electronic component mounting apparatus of the present invention, a chip supply unit for supplying a chip, a take-out head for taking out a chip from the chip supply unit, and a take-out head are separately constructed and taken out. It has a chip reversing unit that receives chips from the head and reverses the received chips, and a pre-center table that receives the reversed chips, positions the chips, and transfers the chips to a pickup station away from the position where the chips were received. The pickup station picks up the chips from the pre-center table, and the mounting station located at a position distant from the pickup station mounts the chips on the substrate.

[0008]

According to the first aspect of the present invention, the take-out operation of the take-out head and the reversing operation of the chip reversing section can be simultaneously performed in parallel, and the mounting operation of the chip can be performed by a plurality of mounting heads. The chip pick-up operation can be performed simultaneously in parallel. Thereby, loss time can be suppressed and a plurality of chips can be efficiently mounted on one substrate.

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. In FIG. 1, 1
Is a horizontal base, and 2 is a board positioning portion provided in the front part of the base 1.

Of the substrate positioning portion 2, 3 and 4 are arms that move in the X direction by an arm moving shaft 5 that is long in the X direction, and the arms 3 and 4 support the lower surface of the substrate 6 to support the substrate. 6 can be transferred.

In the present embodiment, a liquid crystal panel is used as the substrate 6, the second chip P2 is mounted on the first side A and the third side C of the substrate 6, and the first chip P1 is mounted on the second side B. It will be implemented. Then, these first chips P
The first and second chips P2 are flip chips having bumps on the lower surface.

Reference numeral 7 is a holding portion for holding the central portion of the lower surface of the substrate 6, 8 is a θ table for rotating the holding portion 7 in the θ direction, 9 is an X table for moving the θ table 8 in the X direction, and 10 is a base. The Y table is provided on the table 1 and moves the X table 9 in the Y direction. These θ table 8, X
By driving the table 9 and the Y table 10, one of the first side A, the second side B, and the third side C of the substrate 6 to be mounted next can be positioned at the mounting station described later. it can.

At the rear of the base 1, a first chip supply section 11 for supplying the first chip P1 and a second chip supply section 12 for supplying the second chip P2 are arranged symmetrically.

In the first chip supply section 11, 13 is a magazine for accommodating trays 16 in multiple stages, and 14 is a magazine 13.
And a tray 16 for inserting and removing the tray 16 between the tray holding table 15. On the tray holding table 15, there are placed trays 16 for accommodating the first chips P1 in a matrix shape with their bumps facing upward. Also nail 1
4, the tray holding table 15 pulled out from the magazine 13 can be moved in the Y direction by the tray Y table 17. Reference numeral 18 is a magazine elevating mechanism for elevating the magazine 13.

Similar to the first chip supply unit 11, the second chip supply unit 12 includes a magazine 19, a claw 20, a tray holding table 21, a tray 22 for accommodating the second chip P2, a tray Y table 23, and a magazine lifting mechanism. 24 are provided.

Further, as shown in FIG. 2, reference numeral 25 is a chip reversing portion which rotates in a vertical plane. On the peripheral surface of the chip reversing portion 25, holding heads 25a to 25d are radially provided so as to project.

In FIG. 1, reference numerals 26 and 27 denote the first chip P1 and the second chip P from the trays 16 and 22, respectively.
It is a take-out head for taking out 2. Extraction head 26, 27
Is driven by the moving shaft 28 to move in the X direction. The take-out heads 26 and 27 are connected to the tray Y.
The first chip P1 or the second chip P2 is taken out from the trays 16 and 22 which are positioned in the Y direction by the tables 17 and 23, and the holding head 2 of the chip reversing unit 25 is taken out.
The first chip P1 or the second chip P2 that has been taken out is transferred to one of 5a to 25d that is currently facing upward. It is not always necessary to provide a plurality of take-out heads 26 and 27, and a single take-out head is used for the first chip P1 and the second chip P.
2 may be transferred to the holding heads 25a to 25d.

Reference numeral 29 is a holding head 25 of the chip reversing section 25.
a to 25d, the first chip P1 or the second chip P2 held by the one facing downward is received, and the chuck claw 29a receives the first chip P1 or the second chip P1.
It is a pre-center table for positioning the chip P2. The pre-center table 29 is placed on the reciprocating table 30, and the center of the pre-center table 29 reciprocates between directly below the chip reversing unit 25 and the pickup station S1 (solid line and broken line in FIG. 3).

Reference numeral 31 is a turntable provided in the central portion of the base 1. The turntable 31 rotates in a horizontal plane about a shaft 32, and the turntable 31 has an outer peripheral portion at intervals of 90 degrees. The mounting heads 33 to 36 are provided downward. 37 is the first sticking station S
2 is a first conductor supply portion provided in 2, and 38 is a shaft 32
Is a second conductor supply unit provided in the second attaching station S3 which is symmetrical to the first attaching station S2 with respect to the center. The configurations of the first conductor supply section 37 and the second conductor supply section 38 will be described in detail later.

Now, as shown in FIG. 3, the turntable 3
A cylinder 39 as an elevating mechanism corresponding to the mounting heads 33 to 36 in a one-to-one correspondence is provided on the upper part of the mounting head 33. The mounting heads 33 to 36 are moved up and down independently by driving the cylinder 39. It has become. Further, reference numeral 40 denotes a lower pedestal for lowering the lower surface of the substrate 6,
Reference numeral 1 denotes a camera for observing the substrate 6 and the first chip P1 or the second chip P2 from below in the mounting station S4. From the image data obtained by the camera 41, the substrate 6 and the first chip P1 or the second chip P2 are aligned with each other by a control means (not shown).

Next, the structure of the first conductor supply section 37 will be described. Note that the second conductor supply unit 38 has the same configuration as the first conductor supply unit 37, and a description thereof will be omitted.

Now, in FIG. 4, reference numeral 43 is a vertical support plate for supporting each element of the first conductor supply portion 37. Below the support plate 43, a supply reel 44 around which a leader tape 46 to which an anisotropic conductor 47 is adhered is wound is pivotally supported. Reference numeral 45 is a winding reel for winding the leader tape 46 after the anisotropic conductor 47 is peeled off. Then, the leader tape 46 is wound on the winding reel 45 from the supply reel 44 through the vertical guide 48, the guide roller 49, the horizontal guide 50, and the guide roller 51 as shown by an arrow N1. .

The anisotropic conductor 47 guided to the leader tape 46 maintains a vertical posture while being in contact with the vertical guide 48, and the cutter 52 moves in the direction of the arrow N2, whereby the first chip P1 of the first chip P1 is moved. It is cut into a predetermined length according to the size to form a tape. Then, the cut anisotropic conductor 47 is in contact with the horizontal guide 50, and the mounting head 34 descends to be pressed against the bumps 42 of the first chip P1 adsorbed to the mounting head 34 and anisotropically conductive. It is attached to the body 47. Here, the mounting heads 33 to 3
6 is a heater H and the first chip P1 or the second chip P
A suction path V for adsorbing 2 is provided. Due to the heat of the heater H, the first chip P1 and the bump 42 are heated, and when the first chip P1 is pressed against the anisotropic conductor 47, the heat is different as shown in FIG. The anisotropic conductor 47 is transmitted to the anisotropic conductor 47 and adheres to the first chip P1. Then, when the mounting head 33 is raised, the anisotropic conductor 47 is separated from the leader tape 46 and rises together with the first chip P1.

Next, an outline of the operation of the electronic component mounting apparatus according to this embodiment will be described with reference to FIG. Here, it is assumed that the second chip P2 is mounted on the first side A of the substrate 6.

First, the ejection head 27 is driven to drive the tray 2
To the top of 2. The tray 22 is a tray Y table 23.
Is positioned directly below the moving path of the take-out head 27. Then, as shown by the arrow M, the ejection head 2
7 picks up the second chip P2 from the tray 22,
The second chip P2 is transferred to the holding head 25a of the chip reversing unit 25 which is currently facing upward.

Next, when the chip inverting section 25 rotates and the holding head 25a faces downward, the pre-center table 2
9 reaches directly under the holding head 25a as shown by the solid line in FIG. At this time, the holding force of the holding head 25a is released, and the second chip P2 is dropped between the chuck claws 29a. Then, the chuck claw 29a is closed to position the second chip P2. Then, as shown by the chain line in FIG. 6, the pre-center table 29 chucking the second chip P2 is moved to the pickup station S1, and the chuck claw 29a is moved.
Release the chuck by.

At this time, the pickup station S1
It is assumed that the mounting head 33 has arrived. Then, the cylinder 39 is driven to lower the mounting head 33, and the second chip P2 is sucked by the suction path V of the mounting head 33.

As described above, since the take-out heads 26 and 27 and the chip reversing section 25 are formed separately so that they can operate independently, the reversing operation of the chip reversing section 25 and the take-out head 2 are performed.
6 and 27 can be taken out in parallel at the same time,
Lost time can be suppressed.

Next, the mounting head 33 is moved to the second sticking station S3 via the path L3. And
By the sticking operation described above, the anisotropic conductor 47 is stuck to the lower surface (the surface where the bumps 42 are exposed) of the second chip P2 (FIG. 5A).

When the pasting is completed, go through the route L4,
The mounting head 33 is moved to the mounting station S4. At this time, the θ table 8, the X table 9, and the Y table 10 are positioned so that the area of the first side A of the substrate 6 to be mounted this time is on the mounting station S4. Then, the camera 41 images the bumps 42 of the second chip P2 and the electrodes of the substrate 6, and the positional deviation between the bumps 42 of the second chip P2 and the substrate 6 is obtained by the control means (not shown) to drive the θ table 8, the X table 9, and the Y table 10. To correct.

Then, as shown in FIG. 5B, at the mounting station S4, the mounting head 33 is lowered to sandwich the anisotropic conductor 47 and the bump 42 and the electrode 53 on the first side A.
Crimp. At this time, the anisotropic conductive body 47 is heated by the heat of the heater H built in the mounting head 33 to cause the second chip P2 to move.
Then, the first side A is strongly adhered, and when the suction of the suction path V is released and the mounting head 33 is raised, the mounting of the second chip P2 can be completed as shown in FIG. 5C. it can.

As described above, according to the electronic component mounting apparatus of this embodiment, the step of attaching the anisotropic conductor and the step of mounting the chip in the conventional electronic component mounting apparatus are performed in a single electronic component mounting apparatus. This can be performed by a series of operations, and the installation space can be saved as compared with the case where the first device and the second device are installed separately. Although the second chip P2 has been described above, the first chip P1 can be similarly mounted by changing the route.

Further, the turntable 31 is provided with a plurality of mounting heads 33 to 36, and the turntable 31 is index-rotated about the shaft 32.
When one mounting head mounts a chip at the mounting station S4, another mounting head can perform a chip pick-up operation at the pickup station S1 in parallel with this, suppressing loss time and The productivity when mounting a plurality of chips on the substrate can be improved.

[0034]

According to the electronic component mounting apparatus of the present invention, the chip supply unit for supplying the chip, the take-out head for taking out the chip from the chip supply unit, and the take-out head are constructed separately, and the chip is removed from the take-out head. Receiving and reversing the received chip and the chip reversing unit, and receiving the reversed chip,
It has a pre-center table that positions this chip and transfers it to a pickup station away from the position where the chip was received, and picks up the chip from the pre-center table at the pickup station.
Since a plurality of mounting heads for mounting the chips on the substrate are provided at the mounting station located at a position distant from the pickup station, loss time is suppressed and productivity when mounting a plurality of chips on one substrate is improved. be able to.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a view taken along the arrow in FIG.

FIG. 3 is a view on arrow in FIG. 1b-b.

FIG. 4 is a front view of a second conductor supply portion according to the embodiment of the present invention.

FIG. 5A is a diagram illustrating a pasting operation according to the embodiment of the present invention. FIG. 5B is a diagram illustrating a pasting operation according to the embodiment of the present invention. FIG. 5C is a pasting operation according to the embodiment of the present invention. Illustration

FIG. 6 is an overall operation explanatory diagram of the electronic component mounting apparatus according to the embodiment of the present invention.

[Explanation of symbols]

 6 substrate 11 1st chip supply part 12 2nd chip supply part 25 chip reversing part 26 extraction head 27 extraction head 29 pre-center table 31 turntable 33-36 mounting head P1 1st chip P2 2nd chip S1 pickup station S4 mounting station

Claims (3)

[Claims] 1. A chip supply unit for supplying a chip, a take-out head for taking out a chip from the chip supply unit, and a take-out head are formed separately from each other, and receive the chip from the take-out head, and receive the received chip. It has a chip reversing unit for reversing and a pre-center table that receives the reversed chip, positions this chip, and transfers it to a pickup station away from the position where the chip was received. An electronic component mounting apparatus comprising a plurality of mounting heads for picking up chips from a table and mounting the chips on a substrate at a mounting station located at a position apart from the pickup station. 2. The electronic component mounting apparatus according to claim 1, wherein the plurality of mounting heads are provided on a turntable that rotates in an index manner. 3. A conductor supply unit for attaching an anisotropic conductor to a chip is provided in a movement path of the mounting head between the pickup station and the mounting station. Electronic component mounting equipment.