JPH09162242A - Thermocompression bonding equipment - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] Liquid crystal panel, anisotropic conductive adhesive sheet, and T
Thermocompression bonding device 20 using as a pressure-bonded body such as a temporary pressure-bonded body with AB
At 0, when the pressure force of the thermocompression bonding head 21 against the object 1 to be pressure-bonded is measured using the load cell, it is possible to easily and accurately measure even a multi-head type thermocompression bonding head having a narrow pitch. SOLUTION: From a table portion 10A having a crimping pedestal on which an object to be crimped is mounted, a head unit 20 having a thermocompression bonding head 21 for heating and pressurizing the object to be crimped 1, and a pressurizing means 30 for pressing the head unit 20. Thermocompression bonding equipment 20
0, the load cell 51 for measuring the pressing force of the thermocompression bonding head 21 has a measurement surface 53x of the load cell, and
It is provided so that it can move in the same level in the height direction as the pressure-bonding surface of the pressure-bonded body 1 placed on.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a thermocompression bonding apparatus. Especially, liquid crystal panel and TAB (Tape Automated Bondi)
ng) is temporarily pressure-bonded through an anisotropic conductive adhesive sheet (ACF) to form a pressure-bonded body, and the pressure-bonded body is heated and pressed by a thermocompression bonding head to perform main pressure-bonding of the liquid crystal panel and the TAB. In a thermocompression bonding apparatus used in some cases, the present invention relates to a thermocompression bonding apparatus in which the pressure applied to the object to be pressure bonded by the thermocompression bonding head can be easily measured with a load cell.

[0002]

2. Description of the Related Art A liquid crystal panel and a TAB are temporarily pressure-bonded via an anisotropic conductive adhesive sheet to form a pressure-bonded body, and this pressure-bonded body is heated and pressed by a thermocompression bonding head to form the liquid crystal panel and the TAB. In the case of main compression bonding, in the case of connecting a liquid crystal panel and an IC, in the case of connecting a rigid or film-like substrate and TAB, in the case of mounting an IC on a rigid or film-like substrate, and on other various circuit boards semiconductor elements are mounted. In the case of mounting or the like, a device 100 as shown in FIG. 5 is used as a heating and pressurizing device for a pressure-bonded body.

The thermocompression bonding apparatus 100 shown in FIG. 1 has a table portion 10 having a pressure-bonding base 2 on which the pressure-bonded body 1 is mounted, and a thermocompression-bonding head 21 for heating and pressing the pressure-bonded body mounted on the pressure-bonding base 2.
And a support unit 22 that supports the thermocompression bonding head 21, and a pressure unit 30 that presses the head unit 20.

The pressurizing means 30 has a pressurizing member 31, an arm 32 and a pressurizing cylinder 33. The lower end of the pressurizing cylinder 33 is fixed to a support 34, and the upper rod 33a is connected to one end 32 of the arm 32.
a. The arm 32 is fixed to the pressurizing member 31, and these are swingable around the shaft 36 of the support column 35.

FIG. 6 is a front view of the head unit 20 of the thermocompression bonding apparatus 100. As shown in the figure, the head unit 20 includes six similar head units 20a-2a.
This is a multi-head type unit in which 0f are continuously arranged, and these head units 20a to 20f are simultaneously pressed by the pressing member 31.

A heater 21h and a temperature sensor are built in the thermocompression bonding head 21 of each of the head units 20a to 20f, and the thermocompression bonding surface 21x is heated to a predetermined temperature. In addition, the thermocompression bonding head 21 is detachable from the support 22 as shown in the drawing,
It is sandwiched by the U-shaped portion at the bottom of 2, and is fixed by tightening with a fixing screw 23. Although not shown,
In some devices, the thermocompression bonding head may be integrated with the support.

A load adjusting screw 24 is provided on the support 22. By adjusting the load adjusting screw 24, the pressing force of the thermocompression bonding head 21 against the pressure-bonded body 1 can be adjusted. ing.

The operation of the thermocompression bonding apparatus 100 at the time of thermocompression bonding is to position the pressure-bonding base 2 on which the object to be pressure-bonded 1 is placed in advance under the thermocompression-bonding head 1, and then press the pressure cylinder 33. Activate. As a result, the rod 33a moves upward, and the pressing member 31 fixed to the arm 32 moves to the shaft 3
6, the head unit 20 is pushed down, and the thermocompression bonding head 21 heats and pressurizes the pressure-bonded body 1. On the contrary, when the rod 33a of the pressurizing cylinder 33 is moved downward, the pressurizing member 31 rotates in the opposite direction about the shaft 36, and the pressure-bonded body 1 is released from the heating and pressurizing state.

[0009]

By the way, in such a thermocompression bonding apparatus 100, the thermocompression bonding head 21 may need to be replaced depending on the shape and size of the object 1 to be pressure bonded. When the thermocompression bonding head 21 is replaced, the area where the thermocompression bonding surface 21x of the thermocompression bonding head 21 presses the pressure-bonded body 1 also changes. Therefore, as long as the pressing force received by the head unit 20 from the pressing means 30 is constant, The pressure with which the pressure bonding head 21 presses the pressure-bonded body 1 also changes. Therefore,
Every time the thermocompression bonding head 21 is replaced, a load cell is arranged below the thermocompression bonding head 21, and the pressure of the thermocompression bonding head 21 is adjusted with the load adjusting screw 24 while measuring the applied pressure of the thermocompression bonding head 21. . In this case, the head unit is
In the case of the multi-head type as shown in FIG.
a to 21f), the pressure is measured by a load cell,
Based on this, the pressure of each thermocompression bonding head 21a to 21f is adjusted.

There is a case where the appropriate pressure is different depending on the pressure-bonded body 1. In such a case, the pressure measurement using the load cell and the pressure adjustment of the thermocompression bonding head based on the pressure measurement are similarly performed. There is.

However, each time the pressure of the thermocompression bonding head 21 needs to be adjusted, a load cell is prepared and placed under each of the thermocompression bonding heads 21 (21a to 21f) to measure the pressure applied thereto. There is a problem of being complicated.

To solve this problem, it is conceivable to install as many load cells as the number of thermocompression bonding heads 21 on the table portion 10 corresponding to each of the thermocompression bonding heads 21a to 21f. However, it takes a lot of cost to install the load cells corresponding to the number of the thermocompression bonding heads 21. Even when the load cell is installed on the table portion 10 so as to correspond to the thermocompression bonding heads 21a to 21f, when the head unit 20 is replaced with another multi-head type head unit and the pitch of the thermocompression bonding heads is changed. , Load cells installed corresponding to the existing head units cannot be used.

Further, the pitch of the thermocompression bonding heads of the multi-head type head unit in recent years has become very narrow. For example, in the case of a TAB mounting head unit, the pitch of the thermocompression bonding heads is only about 15 mm. Therefore, it is difficult to install the load cell at a narrow pitch corresponding to the pitch of the thermocompression bonding head.

The present invention is intended to solve the above-mentioned problems of the prior art. When the pressure applied to the object to be pressure-bonded by the thermocompression head is adjusted by using a load cell,
The purpose is to facilitate the measurement of the pressing force of the thermocompression bonding head using the load cell.

[0015]

The inventor of the present invention provides a load cell movably in the thermocompression bonding apparatus to provide one load cell even when the head unit is a multi-head type including a plurality of thermocompression bonding heads. The work force of each thermocompression bonding head can be measured with good workability, and at that time, the measurement surface of the load cell can move on the same level surface in the height direction as the pressure bonding surface of the pressure-bonded object placed on the pressure-bonding base. By doing so, it was found that the pressure when the thermocompression bonding head pressurizes the pressure-bonded body can be accurately measured, and the present invention has been completed.

That is, the present invention comprises a table portion having a crimping pedestal on which a pressure-bonded body is placed, a head unit having a thermocompression bonding head for heating and pressing the pressure-bonded body, and a pressing means for pressing the head unit. In thermocompression bonding equipment,
The load cell for measuring the pressing force of the thermocompression bonding head is provided so that the measurement surface of the load cell can move in the same level in the height direction as the pressure bonding surface of the pressure-bonded object placed on the pressure-bonding base. Provided is a thermocompression bonding device.

In particular, in such a thermocompression bonding apparatus, the head unit is composed of a multi-head in which a plurality of thermocompression bonding heads are connected in series, and a guide is provided on the table portion so as to extend in the pitch direction of the thermocompression bonding head. We will provide a load cell that moves along the guide.

According to the thermocompression bonding apparatus of the present invention, since the load cell is provided in the thermocompression bonding apparatus so as to be movable at a constant level in the height direction, the thermocompression bonding apparatus has a plurality of thermocompression bonding heads. Even when the head type head unit is provided, it is possible to measure the pressing force of each thermocompression bonding head with one work cell with good workability. in this case,
The pressing force of the thermocompression bonding head can be measured regardless of the pitch of the thermocompression bonding head.

Further, according to the apparatus of the present invention, the load cell is configured so that the measurement surface of the load cell can move in the same level in the height direction as the crimping surface of the object to be crimped placed on the crimping table. It is possible to accurately measure the pressing force when the thermocompression bonding head actually pressurizes the object to be pressure bonded by the load cell.

[0020]

Embodiments of the present invention will be described below with reference to the drawings. In addition, in each of the drawings, including the above-mentioned conventional example, the same reference numerals represent the same or equivalent constituent elements.

FIG. 1 is an illustration of an embodiment of the thermocompression bonding apparatus of the present invention. The thermocompression bonding apparatus 200 has the same configuration as the thermocompression bonding apparatus 100 shown in FIG. That is, the thermocompression bonding apparatus 20 of this embodiment
Reference numeral 0 denotes a table portion 10A having a pressure-bonding base on which the pressure-bonded body 1 is placed, and a thermocompression bonding head 21 for heating and pressing the pressure-bonded body 1.
The head unit 20 includes a head unit 20 including a support 22 that supports the thermocompression bonding head 21, and a pressurizing unit 30 that presses the head unit 20.
It is of a multi-head type composed of a plurality of thermocompression bonding heads 21a to 21f. Also, in the thermocompression bonding operation of the thermocompression bonding apparatus 200, the rod 33a moves upward by the operation of the pressure cylinder 33, and the pressure member 31 fixed to the arm 32 is centered around the shaft 36 as in the conventional apparatus. Rotating in the R direction, the head unit 20 is pushed down,
The thermocompression bonding head 21 heats and pressurizes the pressure-bonded body 1. On the contrary, when the rod 33a of the pressurizing cylinder 33 is moved downward, the pressurizing member 31 rotates in the opposite direction about the shaft 36, and the pressure-bonded body 1 is released from the heating and pressurizing state.

However, the apparatus 200 of this embodiment is greatly different in that the load cell unit 50 incorporating the load cell for measuring the pressing force of the thermocompression bonding head 21 is provided in the table portion 10A.

FIG. 2 is a perspective view (FIG. 2A) and a sectional view (FIG. 2B) of the load cell unit 50.
As shown in the figure, the load cell unit 50 includes a load cell 51, a cylindrical outer case 52 accommodating the load cell 51, a lid member 53 placed on the load cell 51, and an outer case supporting the outer case 52. It comprises a case support 54 and a guide 55 into which the outer case support 54 is fitted.

As the load cell 51, various types used for load measurement can be used.

Since the surface 53x of the lid member 53 is in direct contact with the thermocompression bonding surface 21x when the pressure applied to the thermocompression bonding head 21 is measured by the load cell unit 50, the thermocompression bonding surface 21x of the thermocompression bonding head 21 is damaged. It is preferable to use a non-existing material or to apply such a surface treatment. For example, the surface material of the lid member 53 is preferably made of polytetrafluoroethylene or the like.

The guide 55 extends on the base 56 of the table portion in the pitch direction of the multi-head type thermocompression bonding heads 21a to 21f. The outer case support 54 can be moved along the guide 55, and can be further fixed by a lock screw 57 at an arbitrary position. The outer case 52 and the outer case support 54 are screwed together, and by rotating the outer case 52 in the S direction as appropriate, the outer case 52 is moved up and down as shown by an arrow T to measure the load cell, that is, the lid member. The surface 53x of 53 can be adjusted to a desired height from the base 56.

Therefore, this load cell unit 50
According to the above, the level in the height direction of the measurement surface of the load cell (the surface 53x of the lid member) in the height direction is placed on the pressure-bonding base 2 regardless of the thickness of the pressure-bonded body 1 placed on the pressure-bonding base 2. Crimped object 1
It is possible to adjust it to the same level as the crimping surface of. By adjusting the level of the measurement surface of the load cell in this way, the thermocompression head accurately applies the same pressing force as when pressing the object to be crimped placed on the crimping cradle with this load cell. It becomes possible to measure. Therefore, as shown in FIG. 3A, the pressure applied by the thermocompression bonding head 21 is measured by the load cell unit 50 while the thermocompression bonding head 2 is being measured.
1 is adjusted by the load adjusting screw 24, and then,
When the pressure-bonded body 1 placed on the pressure-bonding base 2 is heated and pressed as shown in (b), the pressure force of the thermocompression bonding head 21 against the pressure-bonded body 1 at that time is adjusted by using the load cell unit 50. The pressing force of will be reproduced with high accuracy.

As shown in FIG. 3, in the thermocompression bonding apparatus 200, the load cell unit 50 and the crimp receiving base 2 can be moved and arranged below the thermocompression bonding head 21, respectively. Load cell unit 5
0 and the movement and position adjustment of the pressure-bonding base 2 can be performed by a known position adjustment mechanism.

Further, according to the load cell unit 50, after the level in the height direction of the measurement surface is adjusted as described above, the load cell unit 50 is maintained while maintaining the level.
4 can be moved in the pitch direction of the thermocompression bonding heads 21a to 21f along the guide 55 as shown in FIG. Therefore, even if the head unit 20 is of a multi-head type including a plurality of thermocompression bonding heads 21a to 21f, each of the thermocompression bonding heads 21a to 21 has good workability.
It is possible to sequentially measure the pressing force of f. In this case, even if the head unit 20 is replaced according to the shape and size of the object to be pressure-bonded 1 and the pitch of the thermocompression-bonding head 21 is changed, the load cell unit 50 can be easily moved to an arbitrary position on the guide 55. Since it can be fixed to the thermocompression bonding head 2 after replacement using one load cell unit 50
It is possible to measure a pressing force of 1. Further, even when the pitch of the thermocompression bonding heads 21a to 21f forming the multi-head type head unit 20 is narrow, it is possible to measure the pressing force of each of the thermocompression bonding heads 21a to 21f.

Although the thermocompression bonding apparatus of the present invention has been described above centering on the apparatus 200 shown in FIG. 1, the thermocompression bonding apparatus of the present invention is not limited to this. For example, the thermocompression bonding apparatus 20 of FIG.
In No. 0, the thermocompression bonding head 21 is screwed to the support 22 as the head unit 20, and
I showed the one that is removable with respect to
The head unit 20 may be in a form in which the thermocompression bonding head 21 is integrated with the support 22. Also,
The thermocompression bonding apparatus 200 of FIG. 1 shows a case where the head unit is a multi-head type in which six thermocompression bonding heads 21a to 21f are arranged in series, but the head unit is not limited to this. Further, in the case of the multi-head type, there is no particular limitation on the number of thermocompression bonding heads to be continuously arranged.

The thermocompression bonding apparatus of the present invention can be used as a heating and pressing apparatus for various objects to be pressure bonded. For example, a liquid crystal panel and a TAB are temporarily pressure-bonded through an anisotropic conductive adhesive sheet to form a pressure-bonded body, and the pressure-bonded body is heated and pressed by a thermocompression bonding head to perform the main pressure-bonding of the liquid crystal panel and the TAB. When connecting the liquid crystal panel and the IC, when connecting the rigid or film-like substrate and the TAB, when mounting the IC on the rigid or the film-like substrate, and when mounting semiconductor elements on various other circuit boards. Can be used as a device of a liquid crystal panel and a TAB.
It is useful as a device for temporarily pressure-bonding and are temporarily pressure-bonded through an anisotropic conductive adhesive sheet.

[0032]

According to the present invention, in a thermocompression bonding apparatus using a temporary pressure bonding body of a liquid crystal panel, an anisotropic conductive adhesive sheet and TAB as a pressure bonded body, a thermocompression bonding head is applied to the pressure bonded body. When adjusting the pressure using a load cell,
It is possible to easily and accurately measure the pressing force of the thermocompression bonding head using the load cell. In this case, even if the thermocompression bonding head constitutes a multi-head type head unit, the pressing force of each thermocompression bonding head can be measured with one load cell, and the thermocompression bonding heads are arranged in a row at a narrow pitch. Can be measured even when.

[Brief description of the drawings]

FIG. 1 is a side view of a thermocompression bonding apparatus of the present invention.

FIG. 2 is a perspective view (FIG. 2A) and a sectional view (FIG. 2B) of a load cell unit.

FIG. 3 is an explanatory diagram at the time of measuring the pressing force of the thermocompression bonding head by the load cell unit (FIG. 3A) and at the time of heating and pressurizing the object to be pressure bonded by the thermocompression bonding head (FIG. 3B).

FIG. 4 is an explanatory diagram of the operation of the load cell unit.

FIG. 5 is a side view of a conventional thermocompression bonding apparatus.

FIG. 6 is a front view of a head unit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Crimped object 2 Crimping cradle 10 Table part 10A Table part 20 Head unit 21 Thermocompression bonding head 21x Thermocompression bonding surface 21h Heater 22 Support 23 Fixing screw 24 Load adjusting screw 30 Pressing means 31 Pressing member 32 Arm 33 adding Pressure cylinder 33a Rod 34 Support 35 Strut 36 Shaft 50 Load cell unit 51 Load cell 52 Outer case 53 Lid 53x Lid surface (load cell measurement surface) 54 Support 55 Guide 56 Base 100 Conventional thermocompression bonding equipment

Claims (2)

[Claims] 1. A thermocompression bonding apparatus comprising: a table portion having a pressure-bonding pedestal on which a pressure-bonded body is placed; a head unit having a thermocompression-bonding head that heats and pressurizes the pressure-bonded body; and a pressure unit that presses the head unit. The load cell for measuring the pressing force of the thermocompression bonding head is provided so that the measurement surface of the load cell can move in the same level in the height direction as the pressure bonding surface of the object to be pressure-bonded mounted on the pressure-bonding base. Characteristic thermocompression bonding device. 2. The head unit comprises a multi-head in which a plurality of thermocompression bonding heads are connected in series, and a guide is provided on the table portion so as to extend in the pitch direction of the thermocompression bonding head, and a load cell is provided along the guide. Claim 1 to move
The thermocompression bonding apparatus according to the above.