JPH09167237A - Standard data generator for parts recognition - Google Patents

Abstract

(57) Abstract: An object of the present invention is to provide a component recognition standard data generation device that can generate accurate standard data. SOLUTION: Component image inputting means 21 and 22 for inputting a component image and having a function of changing an imaging condition, the inputted component image measures standard data of the component. Determination unit 31 for determining whether or not a component image suitable for the component image is input, and when the input component image is not a component image suitable for measuring the standard data of the component, the standard data of the component is measured. After adjusting the imaging conditions of the component image input means 21 and 22 so as to obtain a suitable component image, the component image is input to the component image input means 21,
If the control means 1 to be input again by 22 and the input component image are component images suitable for measuring the standard data of the component, the standard for measuring the standard data based on the component image. The data measuring means 32 is provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component recognition standard data generation device for generating standard data used for component recognition based on a component image.

[0002]

2. Description of the Related Art With the miniaturization and weight reduction of electric products, further densification is required for an electronic component automatic mounting apparatus for automatically mounting chip-shaped electronic components on a printed circuit board. In order to realize the mounting accuracy that satisfies the demand, it is indispensable to recognize the position of the electronic component by applying the image processing technology.

Standard data such as pre-registered shapes and sizes of parts are used for position recognition of electronic parts to which image processing technology is applied. For electronic components whose position is recognized based on the lead image, the standard data include the outermost size, the size information of the mold, the direction of the lead,
Information about the number, width, length and pitch is used. In an electronic component in which position recognition is performed based on a corner image, information regarding a corner shape and a corner size of the electronic component is used as standard data.

Such standard data was manually input by the person in charge with reference to the dimensions and the like described in the catalogs of each electronic component, so that the registration procedure was troublesome.
Therefore, the applicant has developed a technique for automatically generating standard data based on the part image.

By the way, the electronic components mounted by the electronic component automatic mounting apparatus include components having different shapes and sizes such as a small angle chip, a semi-fixed volume, and an IC. However, since the imaging conditions such as resolution are fixed, the input component image is not always an image for generating suitable standard data for all electronic components. Therefore, accurate standard data may not be generated depending on the shape, size, and type of electronic component.

[0006]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a component recognition standard data generating apparatus capable of generating accurate standard data.

[0007]

A first component recognition standard data generating device according to the present invention is a component recognition standard data generating device for generating standard data used for component recognition based on a component image. , A component image input means for inputting a component image and having a function of changing an imaging condition, a component image suitable for measuring standard data of the component A determination means for determining whether or not the input component image is not a component image suitable for measuring the standard data of the component, and a component image suitable for measuring the standard data of the component is obtained. After adjusting the imaging conditions of the component image input means as described above, the control means for inputting the component image again by the component image input means, and the input component image are
In the case of a component image suitable for measuring the standard data of the component, a standard data measuring means for measuring the standard data based on the component image is provided. The imaging condition is one or any combination arbitrarily selected from the imaging position, the imaging rotation angle position, the resolution, and the illumination method.

A second component recognition standard data generating device according to the present invention inputs a component image in the component recognition standard data generating device which generates standard data used for component recognition based on the component image. The image processing apparatus includes a component image input unit having a function of changing the image pickup condition, an image processing device for performing image processing, and a host-side device for controlling the component image input unit. , Means for determining whether or not the input component image is a component image suitable for measuring standard data of the component,
When the input part image is not a part image suitable for measuring the standard data of the part, the part image is provided so that the host side device can obtain the part image suitable for measuring the standard data of the part. A means for adjusting the imaging condition of the input means and inputting the component image again, and if the input component image is a component image suitable for measuring standard data of the component, based on the component image And is provided with means for measuring standard data.

In the component recognition standard data generating apparatus according to the present invention, when the input component image is not a component image suitable for measuring the standard data of the component, the standard data of the component is measured. After the imaging conditions of the component image input means are adjusted so that a suitable component image can be obtained, the component image is input again by the component image input means. Therefore, since the standard data can be measured based on the part image suitable for measuring the standard data, accurate standard data can be obtained. As a result, the recognition accuracy is improved in the position recognition of the component.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to an electronic component automatic mounting system will be described below with reference to the drawings.

FIG. 1 shows the overall construction of an electronic component automatic mounting system.

The electronic component automatic mounting system includes a host computer 1 for controlling the entire system, an electronic component mounting device 2 for mounting electronic components on a printed circuit board, measurement of standard data used for position recognition of electronic components, and component position recognition. The image processing device 3 is provided. The host computer (host-side device) 1 includes a database 4 in which standard data is stored. A monitor 5 and a user interface 6 are connected to the image processing device 3.

The electronic component mounting apparatus 2 includes a suction nozzle for sucking and holding an electronic component, holds the electronic component and mounts the electronic component on a printed board, and the electronic component sucked by the suction nozzle. CCD
A component image input device 22 that captures an image with a camera and inputs a component image is provided. In this embodiment, the component holding / mounting device 21 and the component image input device 22 constitute the component image input means of claim 1 of the claims.

The image processing device 3 includes a component image input device 22.
The electronic component image obtained by
A 12-pixel, 8-bit 256-gradation grayscale image is captured in an image memory, and the position of an electronic component is recognized and standard data is measured by image processing. On the monitor 5, parts images,
The processing result is displayed.

The image processing device 3 includes a position recognizing means 31 and a standard data measuring means 32. The position recognizing unit 31 detects the position of the center of gravity, the inclination angle, and the like of the electronic component based on the electronic component image and standard data such as the type, size, and shape of the electronic component supplied from the host computer 1. The standard data measuring means 32 obtains standard data such as the type, size and shape of the electronic component based on the electronic component image.

The user interface 6 corrects the standard data obtained by the standard data measuring means 32 as necessary. The host computer 1 controls each device, registers standard data in the database 4,
Update and read.

FIG. 2 shows a schematic configuration of the component image input device 22. The light irradiation method by the component image input device 22 includes a transmission method and a reflection method. The component image input device 22 also has a function of changing the image pickup position and the resolution. The component image input device 22 includes a CCD camera 101, a light source 102 for transmission, a light source 103 for reflection, and a diffusion plate 104.

In the case of the transmissive system, the light emitted from the transmissive light source 102 is directly applied to the diffusion plate 104 on the back surface of the electronic component 100, and the reflected light thereof is the CCD camera 10.
Incident on 1. Therefore, a silhouette image of the electronic component 100 can be obtained.

In the case of the reflection type, the light emitted from the reflection light source 103 is directly applied to the front surface of the electronic component 100, and the reflected light is incident on the CCD camera 101. Therefore, it is possible to obtain an image in which bright portions such as electrodes and other portions can be clearly distinguished.

Therefore, the transmissive method is suitable for measuring the standard data based on the outer shape of the electronic component such as the size and shape of the mold, and the reflective method is suitable for measuring the standard data based on the electrodes. Is suitable.

The resolution is adjusted by moving the CCD camera 101 to the z-axis which is the optical axis direction. When generating standard data for a relatively small electronic component, the resolution is increased to obtain a large image, and the standard data is measured based on the obtained image. This improves the measurement accuracy of standard data.

When measuring standard data based on a local portion of an electronic component, the CCD camera 101 is moved in parallel on the xy plane orthogonal to the z axis, and
By moving the CCD camera 101 to the z-axis which is the optical axis direction, an enlarged image of a local portion of the electronic component is obtained,
Standard data is measured based on the obtained enlarged image.
This improves the measurement accuracy of standard data.

The resolution may be adjusted by fixing the CCD camera and moving the other optical system and illumination system.

FIG. 3 shows the operation of the component holding means 21. The component holding / mounting device 21 includes a suction nozzle 111,
The suction nozzle 111 is provided with a vacuum pump (not shown) for sucking the electronic component 100, a mechanism (not shown) for rotating the suction nozzle 111, and the like.

At the time of measuring the standard data, as shown in FIG. 3A, the electronic component 100 is sucked by the suction nozzle 111 by the vacuum pump. Next, as shown in FIG. 3B, while the electronic component 100 is held by the suction nozzle 111, the electronic component 10 is moved by the CCD camera 101.
0 is imaged. Then, the standard data measuring means 32 sequentially measures the suction posture, size, etc. of the electronic component 100 in a sequential manner.

In each of the processing steps, as shown in FIG. 3C, position correction by rotation of the suction nozzle 111 or the like is performed as necessary, an electronic component image is captured again, and standard data is measured. A suitable image is obtained. For example, when it is difficult to measure standard data from an electronic component image in a tilted posture, the tilt angle is corrected by rotating the suction nozzle 111 or the like to obtain an image in which the electronic component is not tilted, and based on the obtained image. By measuring standard data, the load of measurement processing is reduced and the measurement accuracy is improved.

At the time of component mounting, as shown in FIG. 3A, the electronic component 1 is attached to the suction nozzle 111 by a vacuum pump.
00 is adsorbed. Next, as shown in FIG. 3B, the electronic component 100 is imaged by the CCD camera 101 while the electronic component 100 is held by the suction nozzle 111. Then, the position recognition means 31 recognizes the position of the center of gravity, the tilt angle, etc. of the electronic component 100 using the standard data of the electronic component. Further, after the position correction amount is calculated and the position is corrected by rotating the suction nozzle 111 or the like, the electronic component 100 is mounted on the printed board.

4 and 5 show examples of standard data. As shown in FIG. 4, in an electronic component in which position recognition is performed based on a lead image, the type of the electronic component, the size of the outermost shape (the outermost length X, the outermost width Y), and the size of the mold (mold length). X, mold width Y), lead direction, number of leads, lead length L, lead width D, lead pitch P
Etc. are used as standard data.

In the electronic component whose position is recognized based on the image of the corner portion, as shown in FIG. 5, the type of the electronic component, the corner size, the shape of the corner portion, etc. are used as the standard data. 5 (a) shows an R chamfered corner, FIG. 5 (b) shows a C chamfered corner, and FIG.
The other corners (defective corners) are shown in (c).

FIG. 6 shows a processing procedure for generating standard data. First, the image processing apparatus 3 roughly detects the size of the electronic component image with respect to the input electronic component image (step 1), and determines whether or not the size of the electronic component image is appropriate (step 1). 2).

When the size of the electronic component image is not appropriate, the host computer 1 controls the component image input device 22 to change the resolution. Then, the image is re-acquired by the component image input device 22 (step 3).
Then, the process returns to step 1.

When it is determined in step 2 that the size of the electronic component image is appropriate, the image processing device 3
Detects the mold or the outermost shape, and detects the suction posture of the electronic component (step 4).

Then, it is determined whether or not the suction posture is appropriate (step 5). When the suction posture is not appropriate, the host computer 1 rotates the suction nozzle of the component holding / mounting device 21 so that the suction posture of the electronic component becomes the proper posture. Then, the image is re-acquired by the component image input device 22 (step 6). Then, the process returns to step 4.

When it is determined in step 5 that the suction posture is appropriate, the image processing apparatus 3 measures the size of the electronic component (step 7). Further, the image processing device 3 recognizes a local shape and measures a local size according to the type of electronic component (local recognition measurement process).
(Step 8) or measurement processing based on electrodes (Step 9) is performed.

The host computer 1 registers the standard data of the electronic component measured in steps 7, 8 and 9 in the database 4 (step 10).

The processing of steps 1 to 6 of FIG. 6 will be specifically described with reference to FIG. 7 by taking a square chip component as an example.

In the coarse detection of the size of the electronic component image in step 1, as shown in FIG. 7A, for example, the size of the circumscribed rectangle of the electronic component image is obtained. FIG.
As shown in (a), when the circumscribed rectangle of the electronic component image is smaller than the full screen size (step 2), the host computer 1 is instructed to increase the resolution. The host computer 1 controls the component image input device 22 so as to increase the resolution. And
The electronic component image is captured again (step 3). The resolution magnification is calculated based on the size of the circumscribing rectangle.

As a result, a high resolution electronic component image is obtained as shown in FIG. The mold is detected from the obtained high-resolution electronic component image, and the suction posture of the electronic component is detected from the tilt angle (step 4). When the suction posture of the electronic component is not appropriate (NO in step 5), the tilt angle of the mold is sent to the host computer 1. The host computer 1 rotates the suction nozzle of the component holding / mounting device 21 so that the suction posture of the electronic component becomes an appropriate posture. Then, the electronic component image is captured again (step 6).

As a result, as shown in FIG. 7C, a high-resolution electronic component image having an appropriate suction posture can be obtained. Then, based on the obtained electronic component image, steps 7 to 9 are performed.
The standard data measurement process is performed. In this way, the standard data of the electronic component is measured based on the image of the electronic component having an appropriate size and suction posture. Therefore, the processing load is reduced and accurate standard data can be obtained. Like

FIG. 8 shows the procedure of the local recognition measurement process of step 8 of FIG. The local recognition measurement process is performed, for example, as in an electronic component (see FIG. 5) whose position is recognized based on the image of the corner (see FIG. 5), the shape of the corner (local shape), the corner size (local size). Local information such as is given to electronic components used as standard data.

First, the image processing device 3 determines whether or not to continue the local recognition measurement process (step 81). If the electronic component uses local information as standard data, and if all of the local information required for the standard data has not been measured, YES is obtained in step 81. If the electronic component does not have local information as standard data, or if the electronic component has local information as standard data and all local information required for the standard data is measured. If YES, step 81 is NO.

If NO in step 81, the process proceeds to step 9 in FIG. If YES in step 81, the host computer 1 causes the component image input device 22 to obtain an enlarged image of a local portion such as a corner portion of the electronic component.
Control. That is, while moving the CCD camera in the xy plane of FIG. 2 so that a local part can be imaged,
The CCD camera is moved in the z-axis direction in FIG. 2 to obtain a magnified image. Then, the electronic component image is captured by the electronic component image input device 22 (step 82).

The image processing device 3 recognizes a local shape and measures a local size based on the captured image (step 83). Then, the process returns to step 81.

FIG. 9 shows the procedure of the measurement processing based on the electrodes in step 9 of FIG. In the electrode-based measurement process, information about electrodes such as lead length, lead width, and lead pitch is used as standard data, such as an electronic component whose position is recognized based on a lead image (see FIG. 4). Is done to.

First, the image processing apparatus 3 determines whether or not to continue the measurement processing based on the electrodes (step 91). If the electronic component uses the information regarding the electrodes as the standard data and all the information regarding the electrodes necessary for the standard data has not been measured, the result of step 91 is YES. If the electronic component does not have electrode information as standard data, or the electronic component has electrode information as standard data, and all of the electrode information necessary for the standard data is measured. In this case, step 91 is NO.

If NO in step 91, the process proceeds to step 10 in FIG. If YES in step 91, the image processing apparatus 3 determines whether it is necessary to switch the illumination system (step 92). As the illumination method, the transmissive method is usually selected. When the transmission method is selected, it is determined that the illumination method needs to be switched to the reflection method.

When it is determined that the illumination system needs to be switched to the reflection system, the host computer 1 controls the component image input device 22 to switch the illumination system to the reflection system (step 93). Then, the electronic component image is captured by the component image input device 22, and the process proceeds to step 94. When it is determined in step 92 that it is not necessary to switch the illumination system, the process proceeds to step 94 without performing the process of step 93.

In step 94, the image processing device 3 determines whether or not the resolution and the image pickup position need to be changed based on the electronic component image currently taken in. When it is determined that the resolution and the imaging position need to be changed, the host computer 1 controls the component image input device 22 so that an enlarged image of the electrode can be obtained (step 95). Then, the electronic component image is captured by the electronic component image input device 22, and the process proceeds to step 96. If it is determined in step 94 that the resolution and the image pickup position do not need to be changed, the process proceeds to step 96 without performing the process of step 95.

In step 96, the image processing apparatus 3 measures the information about the electrodes such as the lead length, the lead width, the lead pitch, etc., based on the currently captured image. Then, the process proceeds to step 10.

As described above, after the standard data of the electronic component is registered in the database 4, the electronic component automatic mounting system is operated. The electronic component to be mounted on the board is imaged and stored in the image memory. On the other hand, the standard data of the electronic component is read from the database 4 from the host computer 1 and transferred to the image processing apparatus 3. The position recognition means 31 in the image processing device 3 recognizes the position of the electronic component based on the electronic component image stored in the image memory and the standard data for the electronic component, and the recognition result is obtained by the host computer 1. Sent to. Then, after the position is corrected, the electronic component is mounted on the printed board.

In the position recognition, if an error occurs due to an error in the measurement result of the standard data, the standard data generation process is performed again or the correction is performed by the user interface.

[0052]

According to the present invention, accurate standard data can be generated.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an overall configuration of an electronic component automatic mounting system.

FIG. 2 is a perspective view showing a schematic configuration of a component image input device.

FIG. 3 is an explanatory diagram showing the operation of the component holding / mounting device.

FIG. 4 is a schematic diagram showing an example of standard data.

FIG. 5 is a schematic diagram showing an example of standard data.

FIG. 6 is a flowchart showing a processing procedure for generating standard data.

FIG. 7 is an explanatory diagram for specifically explaining the processing of steps 1 to 6 in FIG.

FIG. 8 is a flowchart showing a procedure of local recognition measurement processing in step 8 of FIG.

FIG. 9 is a flowchart showing the procedure of an electrode-based measurement process in step 9 of FIG.

[Explanation of symbols]

 1 Host Computer 2 Electronic Component Mounting Device 3 Image Processing Device 4 Database 21 Component Holding / Mounting Device 22 Component Image Input Device 31 Position Recognition Unit 32 Standard Data Measuring Unit

Claims (3)

[Claims] 1. A component recognition standard data generation device for generating standard data used for component recognition based on a component image, for inputting a component image, and having a function of changing imaging conditions. Part image input means that has, determination means that determines whether the input part image is a part image suitable for measuring the standard data of the part, the input part image is the standard of the part When the component image is not suitable for measuring the data, after adjusting the imaging condition of the component image input means so that the component image suitable for measuring the standard data of the component is obtained, the component image is input as the component image. If the control means for re-inputting by the means and the input part image are part images suitable for measuring the standard data of the part, based on the part image , A standard data generation device for measuring standard data, and a standard data generation device for component recognition. 2. A component recognition standard data generation device for generating standard data used for component recognition based on a component image, for inputting a component image, and having a function of changing imaging conditions. The image processing apparatus is provided with a component image input unit, an image processing device that performs image processing, and a host-side device that controls the component image input unit. A means for determining whether or not the component image is suitable for measurement, and when the input component image is not a component image suitable for measuring the standard data of the component, the host side device causes the standard data of the component to be measured. Means for adjusting the imaging condition of the component image input means so as to obtain a component image suitable for measuring the component image and inputting the component image again, and the input portion. Images, when a component image suitable to measure standard data of the component,
An apparatus for generating standard data for component recognition, which comprises means for measuring standard data based on the component image. 3. The component recognition according to claim 1, wherein the image pickup condition is 1 or an arbitrary combination arbitrarily selected from an image pickup position, an image pickup rotation angle position, a resolution and an illumination system. Standard data generator.