JPH0917607A - Chip type circuit component and its manufacture - Google Patents

Abstract

PURPOSE: To prevent a chip type component element from being eroded by plating liquid and enable adjustment of characteristic values in a manufacturing process. CONSTITUTION: Conducting films 14' acting as outer electrodes 14 are formed on the surface of a chip type component element 13, and a part of the conducting films 14' except the parts acting as the outer electrodes 14, 14 and a part of the surface of the chip type component element 13 are eliminated. At this time, initial characteristic values of the resistance value or the like are previously measured between the conducting films 14', l4', and a cutting width or depth is adjusted on the basis of the initial characteristic values. Then, an insulating resin 19 having durability to plating liquid is spread on a cutting part and cured. After that, plating films 21, 22 are formed by plating the outer electrodes 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-shaped circuit component having an external electrode at the end of a chip-shaped component body, and in particular, the surface of the external electrode is plated and the resistance value changes depending on the temperature, for example. Temperature compensation of electronic equipment, current control,
The present invention relates to a chip circuit component such as a thermistor used for temperature detection and the like, in which a chip component element body is easily eroded by a plating solution and a method for manufacturing the same.

[0002]

2. Description of the Related Art This type of thermistor has been formed into chips in the same manner as resistors, capacitors, inductors and the like, and in many cases, similarly to multilayer ceramic capacitors, chip-shaped ceramics in the form of prisms or square plates have been developed. A terminal for connection, a so-called external electrode, is provided on both end surfaces of the element body. FIG. 4 particularly shows a chip-shaped circuit component having a chip-shaped component body 1 made of a ceramic laminate. That is, two sets of internal electrodes 5, 6 are formed between the layers of the chip-shaped circuit component layer 4 forming the chip-shaped component body 1, and these internal electrodes 5, 6 face each other with the chip-shaped circuit component layer 4 in between. ing. The internal electrodes 5 and 6 of each set are led out to the opposite end faces of the chip-shaped component body 1, respectively, and are electrically connected to the external electrodes 2 and 3 formed at the respective ends of the chip-shaped component body 1. There is. In such a chip-shaped circuit component, its resistance value is determined by the resistivity specific to the ceramic element body 1 and the distance and area between the internal electrodes 5 and 6 facing each other inside the ceramic element body 1.

Such a thermistor is manufactured as follows. First, a ceramic in which manganese oxide and cobalt oxide are the main components and a thermistor ceramic powder containing a sintering aid such as copper oxide and a valence control agent such as nickel oxide is uniformly dispersed in a resin binder dissolved in a solvent. Make a rally. This ceramic slurry is thinly applied onto a base film such as a polyethylene terephthalate film by a doctor blade method or the like, and dried to form a ceramic green sheet. Next, an internal electrode pattern for a plurality of thermistor bodies is printed on the ceramic green sheet using a conductive paste such as a Pd paste. And
As shown in FIG. 4, the ceramic green sheets peeled from the base film are sequentially laminated so that the internal electrodes 5 and 6 are alternately displaced to both ends, thereby obtaining an unfired ceramic laminated body including a plurality of thermistor bodies. . After that, the laminated body is cut and fired to obtain the individual chip-shaped component bodies 1. External electrodes 2 and 3 are formed by applying a conductive paste to both end portions of the chip-shaped component body 1 and baking it. As a result, a chip circuit component, which is a thermistor as shown in FIG. 4, is completed.

[0004]

The chip-shaped circuit component as described above is mounted on a circuit board, and the external electrodes 2 and 3 are soldered to land electrodes on the circuit board. At this time, in order to improve the solder wettability of the external electrodes 2 and 3 of the chip-shaped circuit component and the soldering to the land electrodes, nickel plating or solder plating may be applied to the surfaces of the external electrodes 2 and 3. Has been done. Such nickel plating or solder plating is performed by electroless plating or the like by immersing the chip-shaped circuit component having the external electrodes 2 and 3 in a plating bath.

However, among the chip-shaped component bodies of the chip-shaped circuit component, there are some such as thermistors that are vulnerable to the plating liquid and the chip-shaped component body is eroded by the plating liquid and melts out. In addition, during the plating process, the plating solution adheres to the surface of the chip-shaped component body. In this way, the chip-shaped component body is eroded by the plating solution,
When the plating solution adheres, the resistance value of the element body fluctuates and the characteristics such as the insulation resistance deteriorate. In view of the problems of the conventional chip-shaped circuit component having a plating film on the external electrode and the manufacturing method thereof, the present invention makes it difficult for the chip-shaped component element body to be eroded by the plating solution, and moreover the characteristic value can be adjusted in the manufacturing process. A chip-shaped circuit component and a method for manufacturing the same.

[0006]

In order to achieve the above object, the present invention cuts between the edge portions of the external electrodes 14 formed at the end portions of the chip-shaped component body 13, and the cut portions 18 are formed.
A plating liquid resistant insulating resin 19 was provided on the above portion, and in this state, plating films 21 and 22 such as nickel plating and solder plating were formed on the external electrodes 14 and 14. This prevents the chip-shaped component body 13 from being immersed in the plating solution. At the same time, the characteristic value of the chip-shaped circuit component can be adjusted in the cutting process.

That is, the chip-shaped circuit component according to the present invention comprises a chip-shaped component element body 13 and this chip-shaped component element body 1.
3 has an external electrode 14 formed at the end thereof, and the surface of the chip-shaped component body 13 is partially cut between the edges of the external electrode 14, and the cutting portion 18 is exposed to the plating liquid. Insulating resin 19 having high resistance is formed, and plating films 21 and 22 are formed on the external electrode 14.

Further, in the method of manufacturing a chip-shaped circuit component according to the present invention for manufacturing such a chip-shaped circuit component, a step of obtaining the chip-shaped component body 13 and an external electrode at the end of the chip-shaped component body 13. 20 and a step of forming a conductor film 14 ′ serving as the external electrode 14 on the surface of the chip-shaped component body 13, and a step of forming the conductor film 14 ′, the external electrode 14, A step of cutting a part of the conductor film 14 ′ and a part of the surface of the chip-shaped component body 13 except the part to be 14, and an insulating resin having resistance to the plating liquid in the part of the cutting part 18. 19 is applied and cured, and the plating film 2 is formed by plating the external electrode 14.
1 and 22 are formed.

Here, when part of the peripheral edges of the conductor films 14 ', 14' facing each other and the chip-shaped component body 13 between them are partially cut, the conductor films 14 ', 14' are separated from each other. Adjust the cutting width or depth based on the initial characteristic values measured in. The plating film 2 applied to the external electrodes 14
1, 22 are generally nickel and solder plated films.

[0010]

In the chip-shaped circuit component and the manufacturing method thereof according to the present invention, the external electrode 14 is provided on the surface of the chip-shaped component body 13.
After forming the conductor film 14 ′ to be the external electrodes 14 and 14
A part of the conductor film 14 ′ and a part of the surface of the chip-shaped component body 13 are cut except for a portion to be the target, and an insulating resin 19 resistant to a plating solution is applied to the cut portion 18 and cured. After that, the plating film 2 is formed on the external electrode 14 after that.
Even when the chip-shaped component element body 13 is immersed in the plating solution when applying steps 1 and 22, the chip-shaped component element body 13 still has the insulating resin 19
Protected against, does not corrode or adhere to the plating solution. As a result, the characteristic deterioration of the chip-shaped circuit component does not occur during the plating process.

Further, as described above, the conductor film 1
When cutting the outer peripheral surfaces of the chip-shaped component body 13 between the opposite edges of 4 ′ and 14 ′ and between them, the initial characteristic values measured between the separated conductor films 14 ′ and 14 ′ are also included. And
By adjusting the cutting width, this cutting step can be used as a characteristic value adjusting means. As a result, the chip-shaped circuit component having the desired characteristics can be finally and accurately manufactured.

[0012]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing an embodiment of the present invention; FIG. 2 shows an example of a laminated structure of the chip-shaped component body 13 of the chip-shaped circuit component according to the present invention. For example, when the chip-like circuit component is a thermistor, the ceramic layers 11, 17, and 18 constituting the chip-like component body 13 are mainly composed of manganese oxide and cobalt oxide having positive or negative temperature characteristics in resistance. And a rectangular layer in the case shown in the figure. Of the ceramic layers 11, 17 and 18, two types of internal electrodes 15 and 16 are formed on the surfaces of the intermediate ceramic layers 11, 11 ... Of these, the internal electrodes 15, 15 ... Are formed so as to be biased so as to reach only the left side edge of the ceramic layers 11, 11 ... Further, the internal electrodes 16, 16 ... Formed on the other ceramic layer 11, 11 ...
In the drawing of 11 ..., it is formed so as to be biased so as to reach only the edge of the right side.

The ceramic layers 11, 11 ... With such internal electrodes 15, 16 are alternately laminated by the required number of sets, and the ceramic layers 17 without the internal electrodes 15, 16 formed on both sides thereof. , 18 are laminated in an appropriate number, and the chip-shaped component element body 13 is constituted by this laminated body. It should be noted that such a thermistor is not manufactured by individually laminating the thermistor as shown in FIG. 2, but as described above, actually, in the same manner as the monolithic ceramic capacitor, formation of a ceramic green sheet and formation of a ceramic green sheet on the surface thereof. Through the steps of printing the internal electrode pattern, laminating the ceramic green sheets, cutting the laminated body, firing the laminated body, and forming external electrodes on the fired laminated body, a large number of things are manufactured at the same time.

The chip-shaped component body 13 thus obtained is shown in FIG. In this chip-shaped component body 13, a pair of internal electrodes are alternately opposed to each other with a ceramic layer laminated inside. Then, the end portions of these internal electrodes are exposed at the facing end surfaces of the chip-shaped component body 13. As shown in FIG. 1B, this chip-shaped component body 1
Apply a conductive paste such as silver paste on the end surface of 3
Conductor film 1 for baking to form external electrode 14
4 ', 14' are formed. Then, the initial resistance value (R2 between the conductor films 14 'and 14' of this chip-shaped circuit component is
5) is measured and ranked.

Thereafter, as shown in FIG. 1 (c), the outer peripheral surfaces of the chip-shaped component body 13 between the opposing edges of the conductor films 14 'and 14' and between them are partially cut. In this case, the cutting width and the cutting depth are determined by the rank of the initial resistance value R described above. That is, those having a low initial resistance value R have a wide or deep cutting width, and those having a low initial resistance value R have a narrow cutting width or a shallow cutting width. Thereby, the initial resistance value R of the final chip-shaped circuit component is adjusted. In the case of a thermistor, the characteristic value to be adjusted is the resistance value, but for example, in the multilayer ceramic capacitor, the capacitance value is the target of adjustment, and in the multilayer ceramic inductor,
The inductance value is subject to adjustment. In this way, the characteristic value to be adjusted differs depending on the type of chip-shaped circuit component.

Next, as shown in FIG. 1 (d), a resin having resistance to a plating solution such as an epoxy resin is applied to the cutting portion 18 and cured to form an insulating resin 18. After that, the chip-shaped circuit component is dipped in a plating solution,
As shown in (d), plating films 21 and 22 made of a nickel plating film or a solder plating film are formed. This allows
Chip circuit parts are completed.

Next, FIG. 3 shows another embodiment of the present invention.
FIG. 3A shows a chip-shaped component body 13 having a laminated structure as shown in FIG. 2. First, as shown in FIG. 3B, the central portion of the chip-shaped component body 13 is cut. , The cutting portion 18 'is formed. Next, as shown in FIG.
On the entire surface of this chip-shaped component body 13, sputtering,
Conductor film 1 made of chromium or the like by means such as vacuum deposition or plating
4 'is formed.

Then, as shown in FIG. 3D, the conductor film 14 'is formed into a chip shape by partially cutting the intermediate portion of the conductor film 14' and the outer peripheral surface of the chip-shaped component body 13 in that portion. Separated at both ends of the component body 13, the external electrodes 14, 1
4 is formed. In this case, the initial resistance value (R25) between the external electrodes 14 and 14 is measured and the rank is classified.
Then, according to the rank of the initial resistance value R, the cutting portion 1
Adjust the cutting width and depth of 8. That is, the initial resistance value R
The cutting width of the cutting portion 18 is widened or deepened when the cutting resistance is low, and the cutting width of the cutting portion 18 is narrowed or shallowed when the initial resistance value R is low. Thereby, the initial resistance value R of the final chip-shaped circuit component is adjusted. As described above, the characteristic value to be adjusted differs depending on the type of chip-shaped circuit component.

Next, as shown in FIG. 3 (e), a resin having resistance to a plating solution such as an epoxy resin is applied to the cutting portion 18 and cured to form an insulating resin 18. After that, this chip-shaped circuit component is dipped in a plating solution,
As shown in (f), plating films 21 and 22 made of a nickel plating film or a solder plating film are formed. This allows
Chip circuit parts are completed. Although the thermistor and the method for manufacturing the thermistor have been mainly described in the above embodiments, the present invention can be similarly applied to chip-shaped circuit components such as the above-mentioned multilayer ceramic capacitors and multilayer ceramic inductors. Yes.

[0020]

As described above, according to the present invention, the characteristic value can be adjusted in the manufacturing process, and the insulating resin 19 provided on the cutting portion 18 formed by the adjustment can be applied to the external electrode 14. When the plating films 21 and 22 are applied, the chip-shaped component element body 13 is not corroded by the plating solution. As a result, it becomes possible to manufacture the chip-shaped circuit component with high yield while adjusting the variation of the characteristic value.

[Brief description of the drawings]

FIG. 1 is a vertical sectional side view of a chip-shaped circuit component and a manufacturing process thereof according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view showing an example of a laminated structure of a chip-shaped component element body of the chip-shaped circuit component according to the embodiment.

FIG. 3 is a vertical sectional side view of a chip-shaped circuit component and a manufacturing process thereof according to another embodiment of the present invention.

FIG. 4 is a partially cutaway perspective view of a conventional chip-shaped circuit component.

[Explanation of symbols]

 13 Chip Component Element 14 External Electrode 14 'Conductor Film 18 Cutting Part 19 Insulating Resin 21 Plating Film 22 Plating Film

Claims (5)

[Claims] A chip-like component body (13) and an external electrode (1) formed at an end of the chip-like component body (13).
4), the surface of the chip-shaped component body (13) is partially cut between the edges of the external electrode (14), and the cutting portion (18) is coated with a plating solution. A chip-shaped circuit component, characterized in that an insulating resin (19) having resistance to the external electrodes (14) is formed, and plating films (21) and (22) are formed on the external electrodes (14). 2. The chip-shaped circuit component according to claim 1, wherein the plating films (21) and (22) are nickel and solder plating films. 3. A method for manufacturing a chip-shaped circuit component, comprising: a step of obtaining a chip-shaped component element body (13); and a step of forming an external electrode (20) at an end of the chip-shaped component element body (13). In the step of forming a conductor film (14 ′) to be the external electrode (14) on the surface of the chip-shaped component body (13), and then removing the conductor film (14 ′) to be the external electrode (14). And a step of cutting a part of the surface of the chip-shaped component body (13), and a step of applying an insulating resin (19) having resistance to a plating liquid to the cutting portion (18) and curing the insulating resin (19). And a step of plating the external electrodes (14) to form plating films (21) and (22). 4. The method for manufacturing a chip-shaped circuit component according to claim 3, wherein the plating films (21), (22) are nickel and solder plating films. 5. The conductor film (14 ') is formed according to initial characteristic values measured after the conductor films (14') and (14 ') are formed on both ends of the chip-shaped component body (13) and then separated. ,
Characteristic value is adjusted by adjusting at least one of a cutting width and a cutting depth of the outer peripheral surface of the chip-shaped component body (13) between the facing edges of (14 ′) and between them. The method for manufacturing the chip-shaped circuit component according to claim 3.