JPH09186493A - Electronic parts mounting system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount electronic parts on a printed board with excellent precision and high performance. SOLUTION: A plurality of vacuum-suction head 70 are rotatably held about their axes in an intermittent rotation board 58 which rotates intermittently about a vertical axis. When each of the vacuum-suction heads 70 is stopped in a part supply position, electronic parts W are vacuum-sucked from a parts supply device, and when it is stopped in the parts mounting position, it is mounted to the printed board. In a part imaging position being a stop position between the parts supply position and the parts mounting position, the electronic parts W in a stop state are imaged by an image system provided with a floodlight 146, a prism device 148 and an imaging device 150, and a central position error and a rotation position error of the electronic parts W with respect to the vacuum-suction head 70 are detected. A head rotation device rotates the vacuum-suction head 70, whereby the rotation position error is corrected, and further the central position error is corrected by control of a printed board positioning device, and then the printed boards W are mounted to the printed board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting system for mounting electronic components on a base material such as a printed circuit board, and more particularly to an electronic component equipped with a plurality of component holding heads which pivot about one axis. It concerns a mounting system.

[0002]

2. Description of the Related Art A plurality of component holding heads are supported at an angular interval equal to the fixed angle on a support means including an intermittent rotating body which rotates intermittently around a vertical axis by a fixed angle.
An electronic component in which each component holding head receives an electronic component from the component supply device at a component supply position, which is one of stop positions, and mounts the electronic component on a printed circuit board at a component mount position, which is another stop position. Mounting systems are already widely known. According to such an electronic component mounting system, electronic components can be sequentially mounted on a printed circuit board by a plurality of component holding heads that swivel in one direction around an axis along with intermittent rotation of an intermittent rotor.
The cycle time can be shortened and the efficiency of component mounting work can be improved.

Further, in an electronic component mounting system, it is possible to correct a holding position error and a holding orientation error of an electronic component held by a component holding head.
It is already known from publication 99. The holding position error is the deviation of the reference line (for example, the center line) of the electronic component from the reference line (for example, the center line) of the component holding head, and the holding orientation error is the rotation of the electronic component around the reference line of the component holding head. It is a position error. In the electronic component mounting system described in the above publication, a component suction head, which is a component holding head, is held by a head holder in a state in which it can rotate around the center line of a suction tube that sucks and holds electronic components. Therefore, while the head holder is moved along a straight line, an image of the electronic component sucked by the suction tube is picked up by an image pickup system equipped with a line scan camera. Based on the resulting image of the electronic component, the holding position error and the holding orientation error of the electronic component by the suction head are detected, and the head rotation device rotates the component suction head to correct the holding orientation error of the electronic component. The holding position error is corrected by controlling the positioning of the printed board by the board positioning device, and then the electronic component is mounted on the printed board. Therefore, the electronic component can be mounted on the printed circuit board with high position accuracy and azimuth accuracy.

[0004]

However, in the electronic component mounting system described in the above publication, the electronic component mounting head receives the electronic component, the electronic component held by the mounting head is imaged, and the electronic component is printed on the printed circuit board. Since the mounting and the like are performed in a time series, there is a problem that the cycle time for mounting one electronic component becomes long and the efficiency of component mounting work is suppressed to be low. Further, in the image pickup system described in the above publication, a plurality of component holding heads are supported by a supporting means including an intermittent rotator that rotates intermittently around a vertical axis by a constant angle, and electronic components are received at a component supply position. This is difficult to apply to an electronic component mounting system of a type that performs mounting at a component mounting position in parallel. In this type of electronic component mounting system, the component holding head moves along a circular trajectory, and the electronic component held by the component holding head rotates as it moves, so a line scan of the entire electronic component image is performed. In order to acquire it with a camera, it is necessary to correct the line-shaped image acquired every unit time by the rotation angle of the electronic component, and it is difficult to acquire the image of the entire electronic component itself. is there. Moreover, since the intermittent rotating body repeatedly accelerates and decelerates, and there is usually no time to rotate at a constant angular velocity or extremely short, the rotation angle per unit time is often not constant. It is more difficult to correct the rotation angle. The present invention has been made to solve the above problems.

[0005]

SUMMARY OF THE INVENTION The gist of the present invention is to provide an electronic component mounting system comprising: (a) a supporting means including an intermittent rotating body that intermittently rotates about a vertical axis; and (b) a supporting means. A component that is rotatably supported around its own vertical center line at an angular interval equal to the intermittent rotation angle of the intermittent rotor on a circle centered on the vertical axis, and holds electronic components at their lower ends. A plurality of component holding heads each having a holding portion, and (c) a component supply position that is one of the stop positions of the plurality of component holding heads when the intermittent rotating body is stopped, and each component holding head has an electronic component And (d) a component mounting position that is another one of the plurality of stop positions, which supports a printed circuit board on which electronic components are mounted by a component holding head, and Multiple electronic components A board positioning device that moves the printed circuit board to a position where the planned mounting position is opposed to the component holding head that has stopped at the component mounting position, and (e) between the component supply position and the component mounting position of the plurality of stop positions. An electronic component held at a component holding head based on an image of the electronic component captured by the image capturing system, the image capturing system being provided at a component image capturing position that is one of the stop positions of the electronic component. Error detecting means for detecting the holding position error and holding direction error of (1), and (f) the holding direction error detected by the error detecting means is corrected by rotating the part holding head between the part imaging position and the part mounting position. The head rotation device and (g) substrate positioning device require the printed circuit board a distance from the expected position that is necessary to cancel the holding position error detected by the error detection means. Lies in the as including a holding position error correcting means for positioning shifting direction.

It is desirable that the component holding head be provided with a vertically downward suction tube for sucking and holding an electronic component by vacuum, and the image pickup system should be suctioned from the electronic component held by the suction tube. It is desirable to include an illuminating device provided with a light projector that is arranged coaxially with the adsorption tube at a position on the tube side and converts electric energy into light. In addition to the above-mentioned components, the electronic component mounting system frictionally engages a continuous surface of the component holding head or a member that rotates integrally with the component holding head to move the component holding head to a continuous arbitrary rotational position. It is desirable to include a braking device that maintains and allows rotation by the head rotating device.

[0007]

In the electronic component mounting system configured as described above, the plurality of component holding heads are sequentially moved to the component supply position, the component image pickup position and the component mounting position with the intermittent rotation of the intermittent rotating body. Then, at the component supply position, the component holding head receives the component from the component supply device, and at the component imaging position, the imaging system captures an image of the electronic component held by the component holding head, and the resulting image of the electronic component is obtained. Based on the error detection means, the error detection means detects the holding position error and the holding orientation error of the electronic component by the component holding head. The holding position error is corrected by correcting the positioning of the printed board by the board positioning device until the component holding head mounts the electronic component on the printed board, and the holding orientation error is corrected by the head rotating device by the component holding head. Is corrected by rotating the electronic component, and the electronic component is mounted on the printed circuit board in the correct position at the component mounting position and in the correct orientation.

[0008]

As described above, in the electronic component mounting system according to the present invention, the electronic component is received by the component holding head, the electronic component is imaged by the imaging system, and the electronic component is mounted on the printed board by the component holding head. Are performed in parallel, the cycle time for mounting one electronic component is shortened, and the efficiency of component mounting work is improved. Moreover, since the holding position error and the holding orientation error of the electronic component by the component holding head are both corrected, the electronic component is mounted on the printed circuit board, so that high mounting accuracy can be obtained. In addition, since the imaging system images the electronic component that is stopped at the component imaging position, an accurate image of the electronic component can be easily acquired even though the movement trajectory of the electronic component is the circumference, and based on the image. Acquisition of the holding position error and the holding orientation error is accurate, and the accuracy of the mounting position and orientation of the electronic component with respect to the printed circuit board is improved also from this point.

In a preferred embodiment, the lighting device is provided with a light projector which is disposed coaxially with the suction tube at a position closer to the suction tube than the electronic component held by the suction tube and which changes the electric energy into light. As in the case where the illuminating device is provided with a reflector disposed behind the electronic component and a projector for irradiating the reflector with illumination light, the projector causes interference due to interference with the substrate positioning device. It does not limit the movement range of the material narrowly. Further, when the illuminating device is provided with a reflector and a projector, the illumination light projected from the projector is also applied to the surface of the electronic component held by the component holding head on the side opposite to the component holding head. The light that is irradiated and reflected on this surface enters the image pickup device together with the light that has been reflected by the reflector and passed around the electronic components, and the image of the electronic components does not become a complete silhouette image, and the image pickup device malfunctions. However, in a desirable mode in which the projector itself is arranged on the same side as the component holding head with respect to the electronic component, this malfunction can be satisfactorily avoided. Further, since the light projector is disposed coaxially with the suction tube, the entire electronic component sucked by the suction tube can be uniformly illuminated, and a good silhouette image can be obtained.

Further, the component holding head or the member which rotates integrally with the component holding head is frictionally engaged with the component holding head to maintain the component holding head in an arbitrary continuous rotation position, and
In a desirable mode including a brake device that allows rotation by the head rotating device, the component holding head undesirably rotates while the component holding head moves from the component imaging position to the component mounting position, and the orientation of the electronic component changes. Since there is no fear, it is easy to increase the intermittent rotation speed of the intermittent rotor, and the effect of improving the mounting efficiency can be obtained.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows an external appearance of an electronic component mounting system according to an embodiment of the present invention. The electronic component mounting system includes a body frame 10, a component supply device 12,
A substrate loading device 14, a substrate unloading device 16, a substrate positioning device 18, an electronic component mounting device 20 (hereinafter simply referred to as mounting device), and the like are provided. The component supply device 12 is configured such that a large number of component supply units 32 are arranged adjacent to each other in the moving direction of the moving base 30 on a moving base 30 movably supported by the main body frame 10 along a straight line. Each component supply unit 32 holds one type of taping electronic component, and is moved to a position directly facing the mounting device 20 by the movement of the moving table 30 to supply one electronic component at a time. However, since it is well known, detailed description will be omitted.

The printed circuit board on which electronic components are mounted is carried in by the board carry-in device 14 and is mounted in the board positioning device 18 by a loading device (not shown). The substrate positioning device 18 includes a substrate support base 36, and the substrate support base 36 is installed on an XY table movable in an X-axis direction parallel to the moving direction of the moving base 30 and a Y-axis direction perpendicular to the moving direction. The printed circuit board is supported at an accurate position and positioned at an arbitrary position on the XY plane. As a result, a plurality of planned electronic component mounting positions on the printed circuit board are sequentially positioned at the component mounting positions, and the mounting device 20 sequentially mounts the electronic components received from the component supply device 12 at these planned electronic component mounting positions. The printed circuit board on which the products have been mounted is removed by an unloading device (not shown), and is carried out by the substrate carrying-out device 16. These operations are controlled by the controller 22.
The control device 22 is mainly composed of a computer,
Each device is controlled based on a program stored in a memory of a computer and information provided from the outside by a magnetic disk, a magnetic tape, or the like. Operation panel 40
Is provided with a display 42 for displaying the operation instructions, input data, operating conditions of each device, and the like, and a monitor television 44 for an operator to monitor an image of an electronic component held by a suction head (described later). ing. Since the substrate loading device 14, the substrate unloading device 16, the substrate positioning device 18, the control device 22, the operation panel 40, the display 42, the monitor television 44 and the like are well known, detailed description thereof will be omitted and the following description will be omitted. The device 20 will be described.

As is apparent from FIG. 2, the mounting device 20 includes a rotary shaft 50 rotatably held by the body frame 10 about a vertical axis. This rotating shaft 5
A rotary plate 52 is fixed to an upper end portion of the rotary plate 52.
Twelve cam followers 54 are attached to the outer periphery of the cam follower at equal angular intervals, and these cam followers 54 are adapted to engage with a cam 56 that rotates around a horizontal axis. As a result, the rotating plate 52 and the rotating shaft 50 are intermittently rotated by 30 degrees each time the cam 56 makes one rotation.

An intermittent rotary disk 58 is fixed to the lower end of the rotary shaft 50, and 12 sets of suction head units 60 are attached to the intermittent rotary disk 58 at equal angular intervals.
These suction head units 60 are all shown in FIGS.
It has a structure shown in. As is clear from FIG. 3, two rods 62, which are paired with each other, are attached to the outer peripheral portion of the intermittent rotary disc 58 in a vertical posture and movably in the axial direction. And 64
Are connected to each other by. A cam follower 65 is attached to the upper connecting member 63.
Are engaged with the cam 66 shown in FIG.
The cam 66 is fixed to the main body frame 10, and has an annular cam groove 67 formed on the outer peripheral surface so as to be inclined with respect to the horizontal plane.
The rod 62 is moved up and down as the intermittent turntable 58 rotates. An arm 69 is fixed to the lower connecting member 64 by a shaft member 68, and a suction head 70 is attached to the arm 69.

As shown most clearly in FIG. 4, each suction head 70 has a head main body formed by fixing transparent plates 82 and 84 made of glass or synthetic resin to both ends of a tubular member 80 made of metal. It is equipped with 86. The head body 86
A substantially airtight space is formed inside, and a vertical through hole communicating with this space is formed in the lower transparent plate 84, and this through hole functions as a component holding portion of the suction head 70. The adsorption pipe 88 is press-fitted. The head main body 86 is fitted into the outer cylinder 90 so as not to be relatively rotatable and slidable in the axial direction, and is always held by the spring 92 at the lower end position where it abuts the stopper 94. The outer cylinder 90 is rotatably and axially slidably fitted into a through hole formed in the arm 69 in the vertical direction, and is always at a rising end position where a flange 98 contacts the arm 69 by a spring 96. The driven rotating body 102 having a cylindrical inner peripheral friction surface 100 centered on the center line of the suction head 70, that is, the center line of the suction pipe 88 is screwed on the upper end of the outer cylinder 90. The driven rotating body 102 and the spring 96 are fixed to each other by the cover 1
04.

The arm 69 serving as the head holder is provided with a suction head 70, more specifically, a brake device 110 for preventing rotation of the outer cylinder 90 and the head body 86. The brake device 110 includes the friction member 112 and the lever 1
14, a spring 115 and the like. Lever 114
Is rotatably attached to the arm 69 at a middle portion by a pin 116, a friction member 112 is fixed to one end portion, and the spring 11 is provided between the other end portion and the arm 69.
5 is attached. The friction member 112 is fitted into a through hole formed in the arm 69, and the tip end portion thereof has the spring 11
5 against the outer peripheral surface of the outer cylinder 90,
The suction head 70 is prevented from rotating. The outer peripheral surface of the outer cylinder 90 is a continuous surface, and the brake device 11
0 has a function of frictionally engaging the continuous surface with the friction member 112 and maintaining the suction head 70 at a continuous arbitrary rotational position.

The suction pipe 88 is a space formed in the head main body portion 86, and the connection passage 11 formed in the cylindrical member 80.
7. Connection passage 118 formed in outer cylinder 90, arm 69
And passages 119 and 120 formed in shaft member 68
Through the passages 122 and 124 formed in the intermittent rotary disk 58 and the rotary shaft 50, and
It is connected to a vacuum device (not shown) via a joint 126 at a port 128. A switching valve 130 is provided at a connecting portion between the passages 120 and 122, and the adsorption valve 8 is switched by switching the valve 130 by a valve operating device (not shown).
8 is selectively connected to the vacuum device and the atmosphere.

Each of the suction heads 70 is stopped at positions 12 of A to L shown in FIG. 5 with the intermittent rotation of the intermittent turntable 58. Then, at position A, the electronic component is received from the component supply device 12, and at position G it is mounted on the printed circuit board. The position A is the component supply position, and the position G is the component mounting position. Position C
An image pickup system 140 and a head rotation device 142 are provided at positions E and E, respectively, and position C is the component image pickup position and position E is the holding orientation change position. Furthermore, position D
In the above, when the electronic component detected at the position C is different from the expected one, the switching valve 130 is switched to release the wrong electronic component from the suction head 70. Since the imaging system 140 detects the outline of the electronic component, it is possible to detect not only the holding position and holding direction of the electronic component but also the type of the electronic component.

As shown in FIG. 6, the image pickup system 140 includes an auxiliary frame 144 fixed to the main body frame 10.
The projector 146, the prism device 148, and the image pickup device 150 which are assembled in The projector 146 is fixed to the auxiliary frame 144 by the bracket 152,
It is positioned right above the suction head 70 stopped at the component imaging position C. The light projected from the light projector 146 passes through the suction head 70, is then turned by 90 degrees by the two prisms 154 of the prism device 148, and enters the imaging device 150. The image pickup device 150 is provided with a lens 156, and converts the silhouette image of the electronic component W formed on the solid-state image pickup device (not shown) by the lens 156 into a binarized signal. The imaging device 150 is attached to the auxiliary frame 144 by the bracket 160, but the height of the bracket 160 is adjusted by the adjustment screw 16.
The focal length can be adjusted by the adjustment by 2. Note that 164 is a power unit of the imaging device 150.

As shown in FIG. 7, the head rotating device 142 includes a guide bush 1 fixed to the auxiliary frame 170.
A drive rotating body 174 is held by 72 so as to be rotatable and slidable in the axial direction. The drive rotor 174 includes a gear 176, and the gear 176 is connected to the servo motor 182 shown in FIG. 8 via the gear 178 and the timing belt 180. Therefore, the driving rotator 17
4 is rotated by the servo motor 182 at an arbitrary angle.

The drive rotor 174 is a hollow shaft-shaped member as shown in FIG. 9, but a wide annular groove 184 is formed on the outer peripheral surface of the lower end thereof, and a rubber friction ring 186 is formed in this. Is fitted. A plurality of through holes are formed in the bottom wall of the annular groove 184 so as to penetrate therethrough in the radial direction, and one ball 188 is movably accommodated in each through hole. A rod-shaped expansion member 192 having a plurality of inclined grooves 190 at its lower end is slidably inserted into the drive rotor 174, and the pin 194 fixed to the expansion member 192 and the drive rotor 174 are formed. By the engagement with the elongated hole 196, the relative rotation between the expansion member 192 and the drive rotator 174 is prevented, and the relative movement limit of the two in the axial direction is defined.

A stopper ring 200 is fixed to the upper end of the drive rotor 174, and the stopper ring 200 abuts the upper end surface of the guide bush 172 to define the lower end position of the drive rotor 174. The expansion member 19
A nut 202 is fixed near the upper end of 2, and a spring 203 as an elastic member is attached between the nut 202 and the upper end surface of the driving rotator 174 to attach the expansion member 192 to the driving rotator 174. Are pushing upwards. A taper portion 204 is formed at the upper end of the expansion member 192, and an elevating member 206 is engaged with this via a bearing 208. An engaging member 210 is also attached to the elevating member 206, which engages with the nut 202 to move the expansion member 192 up and down together with the elevating member 206.

As is apparent from FIG. 7, the elevating member 206 is held by the auxiliary frame 170 via the two rods 212 and the guide block 214 so as to be able to ascend and descend, and the connecting rod 216 is used for elevating and lowering drive not shown. It is connected to the cam device. The lifting member 20
6, the rod 212, the guide block 214, and the connecting rod 216 are shown rotated by a certain angle around the axis of the driving rotor 174 in FIG. 8 for easy understanding.

The head rotating device 142 is provided at a position where the drive rotor 174 is concentric with the suction head 70 in a state where the suction head 70 is stopped at the position E.
6 is lowered, first, the elevating member 206 and the driving rotator 174 are integrally lowered so that the lower end portion of the driving rotator 174, that is, the portion where the friction ring 186 is mounted is shown in FIG. Driven rotating body 102
It fits inside. Then, after the stopper ring 200 comes into contact with the upper end surface of the guide bush 172 and the descent of the drive rotor 174 is stopped, the expansion member 192 is opposed to the drive rotor 174 against the biasing force of the spring 203. The ball 188 by the action of the inclined groove 190.
Are pushed outward in the radial direction to partially bulge the friction ring 186 to frictionally engage the inner circumferential friction surface 100 of the driven rotary body 102.

That is, the bottom surface of the inclined groove 190 functions as an inclined surface formed on the expansion member 192 inclining with respect to its axial direction, and the friction ring 186 is expanded by the inclined surface via the ball 188. The ball 188 and the friction ring 18 function as a member.
6 forms an expanded portion of the drive rotor. In addition, the driving rotary member 174 is fitted inside the driven rotary member 102 by the lifting member 206 acting on the expansion member 192 and a cam device for driving the lifting member driving the expansion member 192, and the expanded portion thereof is expanded and driven. Rotating body 17
4 and the driven rotary body 102 are frictionally engaged with each other.

As is apparent from FIG. 7, the auxiliary frame 1
A release lever 220 of a brake release device 218 that releases the brake device 110 is attached to 70. One arm of the release lever 220 is connected to the cam device by the connecting rod 222, and the acting member 224 is attached to the other arm. The connecting rod 222 is adapted to be moved up and down in relation to the connecting rod 216 by a cam device, so that the driving rotor 1 is rotated.
74 descends and the friction ring 186 moves the driven rotating body 102.
After being pressed against the inner peripheral friction surface 100 of the
4 acts on the lever 114 to release the brake device 110, and after the suction head 70 is rotated by a predetermined angle, the brake device 110 is released before the drive rotor 174 is separated from the driven rotor 102. It is designed to return to the working state.

Next, the operation of the entire electronic component mounting system will be described. While the suction head 70 stopped at the position A (component supply position) in FIG. 5 receives the component from the component supply device 12, the suction head 70 stopped at the position C (component imaging position) images the electronic component W. And the head rotation device 1 is operated at the position E (holding direction change position).
The suction head 70 is rotated by 42, the rotational position error of the electronic component W around the suction head center line is corrected, and further, the electronic component W is mounted on the printed board at the position G (component mounting position). . The operation at each of these positions is performed in parallel with respect to the different suction heads 70, but the operation at each position will be described in detail below, focusing on one suction head 70.

When the suction head 70 is stopped at the position A, a selected one of the many component supply units 32 of the component supply device 12 is positioned right below the suction head 70, and the component supply unit 32 is located. The cover tape is peeled off from the component holding tape held in the state where the electronic component W can be taken out. Therefore, if a head pressing device (not shown in FIG. 4) abuts on the driven rotating body 102 and pushes it down against the urging force of the spring 96, the head main body portion 86 and the suction tube 8 are pressed.
8 also moves down accordingly, and the lower end surface of the suction tube 88 contacts the upper surface of the electronic component W. The driven rotary body 102 and the outer cylinder 90 are still pushed down thereafter, but the head main body 86 and the suction tube 88 are allowed to remain stopped by the compression of the spring 92. In this state, since the suction pipe 88 is communicated with the vacuum device, the electronic component W is sucked by the suction pipe 88, the action of the head depressing device is released, and the suction head 70 moves up, the electronic component W is accompanied by it. Then, the mounting device 20 finishes receiving the electronic component W from the component supply device 12.

When the suction head 70 that has received the electronic component W is stopped at the position C in this way, the suction head 70
Is a light projector 146 and a prism device 148 as shown in FIG.
Is located between Therefore, the light projected from the light projector 146 forms a silhouette image of the electronic component W on the surface of the solid-state imaging device of the imaging device 150. Imaging device 15
0 converts this silhouette image into a binary signal and outputs it to the control device 22. The control device 22 compares the binarized signal with the binarized signal indicating the position of the regular electronic component W stored in advance in the memory of the control device 22 itself, and holds the electronic component W at the regular position. Position errors ΔX and ΔY (deviation of the center line of the electronic component W in the X and Y axis directions with respect to the center line of the suction head 70) and holding orientation error Δθ (electronic component W
(Rotational position error around the center line of the suction head 70) is calculated.

After the suction head 70 stops at the position E after the error is detected as described above, the suction head 70
Will be located directly below the drive rotating body 174 of the head rotating device 142 as shown in FIG. Therefore, when the elevating member 206 is lowered by the cam device, the lower end portion of the driving rotator 174 fits inside the driven rotator 102 shown in FIG. If the elevating member 206 is further lowered from this state, the expansion member 192 is relatively lowered with respect to the drive rotating body 174 in FIG.
8 and the friction ring 186 are expanded and pressed against the inner peripheral friction surface 100 of the driven rotating body 102. Then, the brake release device 218 operates to release the brake device 110, so that the suction head 70 becomes rotatable, and in that state, the servo motor 182 is operated to rotate the suction head 70. The servo motor 182 is rotated by an angle corresponding to the holding azimuth error Δθ obtained by the control device 22 as described above,
Accordingly, the suction head 70 and the electronic component W held by the suction head 70 are rotated by an angle required to cancel the holding orientation error Δθ. Then, the brake device 110 is activated again, the elevating member 206 is raised, the drive rotor 174 is disengaged from the driven rotor 102, and the attitude change of the electronic component W is completed.

After the holding orientation error is removed as described above, when the suction head 70 stops at the position G, the printed circuit board positioning device 18 positions the printed circuit board under the control of the control device 22. This positioning is performed to cancel the holding position errors ΔX and ΔY from the position where one center point of a plurality of parts mounting planned positions on the printed circuit board is located on the center line of the suction nozzle 70 stopped at the position G. It is performed by shifting the printed circuit board in the required direction by the required distance. Therefore, when the suction head 70 is pushed down by a head pressing device (not shown), the electronic component W held by the suction pipe 88 is pressed to a predetermined component mounting location on the printed circuit board with high positional accuracy and orientation accuracy, and is bonded or the like. Fixed. In this state, the switching valve 130 is switched so that the suction pipe 88 communicates with the atmosphere, so that the electronic component W is released from the suction head 70. Then, when the suction head 70 moves up, the electronic component W is mounted on the printed circuit board. Complete.

As is clear from the above description, in this embodiment, the suction head 70 functions as a component holding head, and the intermittent rotary disk 58 as an intermittent rotary body is replaced by the cam 6.
6, cam follower 65, rod 62, connecting members 63, 6
4 and the arm 69 and the like form a support means for the component holding head. Further, the portion of the control device 22 for calculating the holding position errors ΔX, ΔY and the holding orientation error Δθ constitutes an error detecting means, and the substrate positioning device 18 requires a distance required to cancel the holding position errors ΔX, ΔY. The portion for positioning the printed circuit board displaced in the direction constitutes the holding position error correcting means.

As is apparent from the above description, in the present electronic component mounting system, reception of the electronic component W by the suction head 70, posture detection, posture change, and mounting on the printed circuit board are performed in parallel at a plurality of positions. Because
The cycle time is shortened and the efficiency of electronic component mounting work is improved. Further, since the image pickup system 140 and the head rotating device 142 need only be provided for each of the 12 suction heads 70, the structure of the device is simplified, and the effect of reducing the manufacturing cost can be obtained. Further, since the head rotating device 142 is separated from the intermittent rotary disk 58 and provided at a fixed position, the moment of inertia of the intermittent rotary disk 58 is reduced, and vibration and noise due to the intermittent rotation are reduced. Turntable 58
Can be rotated at high speed. Further, since the image formed on the surface of the solid-state image pickup device of the image pickup device 150 is the silhouette image of the electronic component W, it is affected by the surface roughness and color of the electronic component W like the image of the electronic component W by reflected light. Therefore, the posture of the electronic component W can be accurately detected.

In the embodiment described in detail above, the component holding head is the suction head 70 that sucks electronic components by vacuum, and the periphery of the suction tube of the head main body 86 is formed of a transparent body, so Although there is an advantage that a silhouette image can be obtained over the entire circumference of the component W, the component holding head is not limited to this, and the electronic component W can be held in a state in which the attitude of the electronic component W can be detected. Any holding head can be used. For example, the electronic component W can be held by a component holding head provided with a pair of grip claws together with or instead of the suction tube 88. In short, one side of the electronic component W and the corners of both ends thereof or crossing each other. Any component holding head capable of holding an electronic component in a state where a silhouette image of a portion necessary for detecting the position of the electronic component such as two sides can be obtained can be adopted. In this case, if the members that support and operate the gripping claws are obstructive in obtaining the silhouette image of the electronic component, tilt the projection direction of the projector from the center line of the electronic component by a certain angle. Is also possible.

Further, in the above embodiment, only the holding orientation error of the electronic component is corrected at the posture changing position for easy understanding, but the posture in which the electronic component is received from the component supply device is When it is necessary to mount the printed circuit board in a different posture, it is possible to rotate the electronic component at this position by an angle required for the electronic component. In this case, the function of rotating the printed circuit board by the substrate positioning device 18 can be achieved. It is possible to mount the electronic component in an arbitrary posture without holding. Further, in the above-described embodiment, the posture detection position and the posture change position are different from the component supply position and the mounting position, but these positions are appropriately set, for example, by matching the posture change position with the component mounting position. It is also possible to change.

Further, in the above embodiment, the expanding portion of the driving rotary member 174 was mechanically expanded, but it is possible to make appropriate changes such as expanding by fluid pressure. In addition, the extended portion of the driving rotor 174 is connected to the inner peripheral friction surface 1 of the driven rotor 102.
It is not indispensable that the driving rotary body 174 and the driven rotary body 102 are engaged by being pressed against 00. For example, the driving rotator 174 may be fitted to the outside of the driven rotator 102, and the contracting portion of the driving rotator may be frictionally engaged with the outer peripheral friction surface of the driven rotator. Furthermore, it is also possible to frictionally engage the driving rotating body and the driven rotating body by concentrically abutting the driving rotating body and the driven rotating body at their end faces, or to connect the driving rotating body and the driven rotating body in the radial direction. It is also possible to make a relative movement so that the outer peripheral surfaces of both, or one outer peripheral surface and the other inner peripheral surface are locally frictionally engaged. In this case, it is needless to say that the contact / separation device also needs to be changed according to each mode. Other than that, I will not give an example,
It goes without saying that the present invention can be implemented in various modified and improved modes based on the knowledge of those skilled in the art.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing an entire electronic component mounting system according to an embodiment of the present invention.

FIG. 2 is a front sectional view showing a main part of an electronic component mounting apparatus of the electronic component mounting system shown in FIG.

FIG. 3 is a sectional view taken along the line III-III in FIG. 2;

FIG. 4 is a front sectional view showing the suction head shown in FIG. 2 and its periphery.

5 is an explanatory diagram showing a relative positional relationship between the main part of the electronic component mounting device shown in FIG. 2, an imaging system attached to the electronic component mounting device, and a head rotating device, and is a sectional view taken along line VV in FIGS. 6 and 7. is there.

6 is a front view of the imaging system shown in FIG.

7 is a front view of the brake release device and the head rotating device shown in FIG. 5;

FIG. 8 is a bottom view of the brake release device and the head rotating device shown in FIG. 7;

FIG. 9 is a sectional view taken along line IX-IX in FIG. 7;

[Explanation of symbols]

 20 Electronic Component Mounting Device 58 Intermittent Rotating Disk 60 Suction Head Unit 62 Rod 63, 64 Connecting Member 66 Cam 65 Cam Follower 69 Arm 70 Suction Head 80 Cylinder Member 82, 84 Transparent Plate 86 Head Main Body 88 Suction Tube 90 Outer Cylinder 100 Inner Circumference Friction surface 102 Driven rotating body 110 Braking device 140 Imaging system 142 Head rotating device 146 Projector 148 Prism device 150 Imaging device 154 Prism 174 Driving rotating body 176, 178 Gear 180 Timing belt 182 Servo motor 210 Engaging member

Claims (2)

[Claims] 1. A supporting means including an intermittent rotating body which intermittently rotates around a vertical axis, and an angular interval equal to the intermittent rotating angle of the intermittent rotating body on a circle centered on the vertical axis by the supporting means. And a plurality of component holding heads, each of which is rotatably supported around its own vertical center line and has a component holding portion for holding an electronic component at its lower end, and a plurality of components when the intermittent rotating body is stopped. A component supply device that is provided at a component supply position that is one of the stop positions of the holding head and that supplies electronic components to each component hold head, and a component mounting position that is another one of the plurality of stop positions. The printed circuit board on which electronic components are mounted is supported by the component holding head, and a plurality of planned electronic component mounting locations on the printed circuit board are opposed to the component holding head stopped at the component mounting position. A board positioning device for moving the printed board to the mounting position, and a plurality of stop positions, which are provided at a component imaging position which is one of the stop positions between the component supply position and the component mounting position, of the electronic component. An image pickup system for picking up an image, and an error detection unit for detecting a holding position error and a holding orientation error of the electronic component held by the component holding head based on the image of the electronic component picked up by the image pickup system; A head rotation device that rotates the component holding head between the imaging position and the component mounting position to correct the holding orientation error detected by the error detection means, the board positioning device, and a printed circuit board, A holding position for shifting the holding position error detected by the error detecting means from a predetermined position by a distance necessary for canceling the error in a necessary direction. Electronic component mounting system which comprises a differential correction means. 2. The head holding device is further provided to frictionally engage a continuous surface of the component holding head or a member that rotates integrally with the component holding head to maintain the component holding head at a continuous arbitrary rotational position, and at the same time, to rotate the head. 2. The electronic component mounting system according to claim 1, further comprising a brake device that allows rotation by.