JPH0919782A - Substrate processing method and processing apparatus thereof - Google Patents

Abstract

(57) Abstract: In processing such as cleaving or cutting of a substrate, a cleaved cut surface or a cleaved surface is made smooth and generation of microcracks is prevented. A carbon dioxide gas laser beam is applied to a substrate 20 while irradiating a carbon dioxide gas laser beam onto a processing substrate 20 mounted on a substrate moving device 100 while flowing an assist gas G along a propagation direction of the carbon dioxide gas laser beam. In the substrate processing method of moving in a direction orthogonal to the light propagation direction and cutting or cleaving from one end to the other end of the substrate 20, the holding arms 28-1 and 28-2 provided in the substrate moving device 100.
In 8-2, the vicinity of the carbon dioxide laser light irradiation surface of the substrate 20 is pressed down.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing method for moving a substrate while irradiating the substrate with carbon dioxide laser light while flowing an assist gas along the direction of propagation of carbon dioxide laser light, and a method of processing the substrate. Regarding processing equipment.

[0002]

2. Description of the Related Art In recent years, on and in substrates of non-metal materials such as glass materials, magnetic materials, semiconductor materials and dielectric materials,
Product development of integrated circuits, optical integrated circuits having optical circuits mounted therein, or electric / optical integrated circuits in which electric circuits and optical circuits are integrated has become active.

This type of integrated circuit is densely integrated in a range of several tens to several tens of thousands on a circular or square substrate having a size of 3 inches to 10 and several inches. For example, as shown in FIG. 4, the substrate 701 is cut and separated into n × m integrated circuit 702 chips. As a method of cutting and separating the substrate 701, the substrate 701 is defined by alternate long and short dash lines 703a to 703.
There is scribing by performing diamond blade dicing along the n, 704a to 704m or irradiating with laser light.

FIG. 5 is a block diagram of a glass cutting device by irradiation of carbon dioxide gas laser light previously proposed by the present inventor (Japanese Patent Application No. 6-247436).

[0005] This is on the base 803 while blowing the assist gas G through the assist gas introduction pipe 802 around the laser light L which is emitted from the carbon dioxide gas (CO ₂ ) laser 801 and then condensed by the condenser lens Le. The glass substrate 804 fixed by vacuum suction is irradiated and cut into two pieces A and B. Reference numeral 805 denotes a through-hole, which allows the laser light L to penetrate through the glass substrate 804. The presence of the through-hole 805 makes it possible to maintain the same cutting conditions during cutting.

[0006]

By the way, it has been found that the following problems occur when the ceramic substrate or the glass substrate is vapor-cut or cleaved by using the apparatus shown in FIG.

(1) Even if the glass substrate 804 is vacuum-adsorbed and fixed on the base 803, when the gas pressure of the assist gas G exceeds 2 Kg / cm ² , the glass substrate 804 floats above the base 803 and vibrates. It was found that non-uniform evaporation cutting or cleaving occurred. That is, when the glass substrate 804 floats, the lens Le and the glass substrate 804
The distance between and will change. Therefore, it was found that the energy density of the carbon dioxide laser light with which the glass substrate 804 was irradiated was changed, resulting in uneven unevenness and microcracks on the cut surface or the fractured surface.

(2) Due to the floating or vibration of the glass substrate 804, it is difficult to cut or cut the glass substrate 804 with good linearity.

[0009]

According to the present invention, while supplying an assist gas along the propagation direction of a carbon dioxide laser beam, a carbon dioxide laser beam is irradiated onto a processing substrate placed on a substrate moving device. In a method of processing a substrate in which the substrate is moved in a direction orthogonal to the propagation direction of the carbon dioxide gas laser light and the one end to the other end of the substrate is cut or cleaved, the carbon dioxide of the substrate is cut by a holding arm provided in the substrate moving device. The gas laser light irradiation surface is pressed in the vicinity thereof.

In addition to the above structure, in the present invention, the holding arm may hold at least two positions of the substrate.

In addition to the above structure, in the present invention, the back surface other than the back surface of the surface of the substrate irradiated with the carbon dioxide laser light may be fixed on the substrate moving device by vacuum suction.

According to the present invention, a carbon dioxide gas laser device, a condenser system for condensing carbon dioxide gas laser light emitted from the carbon dioxide gas laser device, a gas introduction system for flowing an assist gas along the propagation direction of the carbon dioxide gas laser light, and a substrate are provided. A substrate moving device that moves in a direction orthogonal to the propagation direction of carbon dioxide laser light,
The fixing mechanism is provided on the substrate moving device and holds the vicinity of the carbon dioxide laser light irradiation surface of the substrate with a holding arm.

In addition to the above structure, in the present invention, the substrate moving device may be provided with a vacuum suction device for fixing the back surface of the substrate other than the back surface of the surface irradiated with the carbon dioxide laser light onto the substrate moving device by vacuum suction.

According to the above construction, since the substrate for processing is held on the substrate moving device by the holding arm, the substrate floats or vibrates due to the gas pressure even when the assist gas is made to flow along the propagation direction of the carbon dioxide laser light. It will not happen. Therefore, the energy density of the carbon dioxide laser light with which the substrate is irradiated becomes constant, and the cut surface or the split surface becomes uniform.

By pressing at least two positions of the substrate with the pressing arm, the substrate is prevented from rotating, the energy density of the carbon dioxide laser light with which the substrate is irradiated becomes constant, and the cut surface or the split surface becomes uniform. Become.

By fixing the back surface of the substrate other than the surface directly irradiated with the carbon dioxide laser light onto the substrate moving device by vacuum suction, the substrate is strongly pressed by the substrate moving device, so that the floating and vibration are further prevented. The energy density of the carbon dioxide laser light with which the substrate is irradiated becomes constant, and the cut surface or split surface becomes uniform.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION When the present invention is applied to the processing of a substrate made of a non-metal material, the substrate for processing is held by the holding arm on the substrate moving device, so that an assist is provided along the propagation direction of the carbon dioxide laser light. The substrate does not float or vibrate due to the gas pressure even when the gas is flowed. Therefore, the energy density of the carbon dioxide laser light with which the substrate is irradiated becomes constant, and the cut surface or the split surface becomes uniform. The rotation of the substrate is prevented by pressing at least two places on the substrate with the pressing arm. By fixing the back surface of the substrate other than the surface directly irradiated with the carbon dioxide laser light onto the substrate moving device by vacuum suction, the substrate is strongly pressed by the substrate moving device, so that the floating and the vibration are further prevented.

As the substrate, ceramic, non-alkali glass, mullite or the like is used. As the assist gas, N
₂ , O ₂ , Ar, air or a mixed gas thereof is used. As the holding arm, a fluororesin-based material is preferable.

[0019]

EXAMPLES Before explaining the substrate processing method of the present invention, a substrate made of a non-metal material (hereinafter referred to as "substrate").
Fig. 2 and Fig. 3 show how to cut (or cleave)
This will be described with reference to FIG.

FIG. 2A is a plan view of the substrate before processing, and FIG.
3B is a plan view of the processed substrate, FIG. 3A and FIG.
(B) is an explanatory view for explaining the principle of the substrate processing method of the present invention.

The substrate 1 shown in FIG. 2 (a) is cut along the broken lines 2 to 7 to be separated into 16 substrates 1-1 to 1-16 as shown in FIG. 2 (b).

A method as shown in FIG. 3 is used as a method of separating the substrate into a plurality of pieces by cutting.

As shown in FIG. 3 (a), the substrate 1 is connected to the broken line 2
When cutting along a to 4a, the holding arm 8
-1, 8-2 are arranged on both sides of the broken line 2a, respectively, are fixed by applying pressure from the surface of the substrate 1, and the side faces 1a to 1d of the substrate 1 are fixed by movement preventing parts (not shown), A carbon dioxide laser beam (hereinafter referred to as a "laser beam") and an assist gas in the Z direction (direction perpendicular to the paper surface)
And the substrate 1 is moved in the Y direction so that the laser beam moves along the broken line 2, and the laser beam is cut.

After cutting the substrate 1 along the broken line 2a, the holding arms 8-1 and 8-2 are moved so that both sides of the next broken line 3a adjacent to the broken line 2a (position L indicated by a chain line).
1, L2) respectively, and apply pressure from the surface of the substrate 1 to fix it, and irradiate the laser beam in a direction perpendicular to the paper surface, and at the same time, move the substrate 1 Y along the broken line 3a. Move in the direction and cut.

When the cutting of the substrate 1 is completed, the pressing arms 8-1 and 8-2 are similarly moved to both sides of the broken line 4a (positions L3 and L4 indicated by the one-dot chain line) to perform the cutting.

Subsequently, as shown in FIG. 3B, when cutting is performed along broken lines 9a to 11a orthogonal to the cutting lines 2b to 4b, new holding arms 12-1 and 12 are provided.
-2 is arranged on both sides of the broken line 9a, pressure is applied from the surface of the substrate 1 to fix it, the laser beam is irradiated in the Z direction, and the substrate 1 is moved in the X direction so that the laser beam moves along the broken line 9a. Move to and cut.

When the cutting work along the broken line 9a is completed, the pressing arms 12-1 and 12-2 are moved to both sides of the broken lines 10a and 11a (dashed lines L5, L6, L7, L8) to carry out the cutting work.

In the above, the holding arms 8-1, 8-2, 1 are provided near the irradiation surface of the substrate 1 irradiated with the laser beam.
By pressing with 2-1 and 12-2, the substrate 1 does not float or vibrate due to the pressure of the assist gas, and while maintaining the substantially same state as the fixed state before cutting the substrate 1, All cutting processes can be performed. Also,
Since the surface of the substrate on both sides of the cutting or severing line is planarly pressed by a wide range, there is no fear of floating or vibration of the substrate due to gas pressure.

An embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 is a diagram showing an embodiment of a processing apparatus to which the substrate processing method of the present invention is applied.

As shown in the figure, the substrate 20 is placed on the substrate fixing base 21. A plurality of (six in the figure, but not limited to) vacuum suction holes 22 are formed in the substrate fixing base 21, and these vacuum suction holes 22 are tubes 23.
Is connected to the vacuum suction device 24 via. Substrate 20
Is closely attached to the substrate fixing base 21 by a vacuum suction device 24.

The substrate fixing table 21 is fixed on the XY moving device 25, and can be moved in the X direction or the Y direction by driving the motor of the XY moving device 25. Substrate 2
0 is a movable magnet chuck 2 provided on the side surface
It is fixed at 6-1 and 26-2.

Movable magnet chucks 26-1, 26
-2 can fix the built-in magnet by attracting the built-in magnet to the board fixing base 21 by rotating the dials 27-1 and 27-2 in one direction (for example, rightward direction). Therefore, the substrate 20 is fixed to the substrate fixing table 21 by the magnet chuck.
After being fixed to the upper side, it does not shift in the X and Y directions (the fixing can be released by rotating the dials 27-1 and 27-2 in the other direction (left direction)). Both moving magnet chucks 26-1, 26-2
Is a plate-shaped holding arm 28-1, which has a V-shaped cross section,
28-2 is provided.

These substrate fixing base 21 and XY moving device 25
The movable magnet chucks 26-1 and 26-2 constitute the substrate moving device 100.

Holding arms 28-1 and 2 as a fixing mechanism
8-2 is a substrate fixing base 2 with springs 29-1 and 29-2 so that the surface of the substrate 20 can be fixed by applying pressure.
It is biased to the 1st side. Also, the presser arms 28-1, 2
8-2 can change its length in the longitudinal direction like a rod antenna, for example. Therefore, an arbitrary position on the surface of the substrate 20 can be pressed by these pressing arms 28-1 and 28-2. If the pressing arms 28-1 and 28-2 are made of a fluororesin-based material (for example, Teflon) that has heat resistance and is not easily scratched, an electric or optical circuit is formed on the surface of the substrate 20. Even if it is done, it is unlikely to break these. Further, it is more preferable that the tips of the presser arms 28-1 and 28-2 are rounded.

On the upper side of the substrate 20, a laser beam consisting of a lens 33 for condensing a carbon dioxide gas laser beam 31 emitted from a carbon dioxide gas laser device (not shown) into a laser beam 32, a gas introduction pipe 34 and a gas nozzle 35. A gas introduction system 36 for flowing the assist gas G is arranged along the propagation direction of 32.

The surface of the substrate 20 is irradiated with the laser beam 32. The laser beam 32 is set so that the lens 33 focuses the point P ₀ . The laser beam 32 focused at the point P ₀ has its beam diameter expanded again after passing through the point P ₀ , and is 500 μm to 2000 μm on the surface of the substrate 20.
Irradiation is performed with a beam spot diameter D _B of m diameter. Since the laser beam 32 is covered with the gas introduction pipe 34, it is kept in the atmosphere of the assist gas G.

A gas nozzle 35 at the outlet of the gas introduction pipe 34
Although the flow rate of the assist gas G blown out from the device is very large, according to the configuration of the present invention, it is possible to use the movable magnet chucks 26-1, 26-2, the holding arms 28-1, 28-2 and the vacuum suction device 24. Adhesion on the board fixing base 21,
Since it is fixed, the substrate 20 does not float or vibrate due to the gas pressure of the assist gas G. The pressing arms 28-1 and 28-2 can press an extremely wide area in a plane as shown in FIG. You may make it hold down by a member which becomes.

Next, numerical values will be described, but the present invention is not limited thereto.

Using the apparatus shown in FIG. 1, the thickness is 1 mm.
Now, a case where a 50 mm square mullite substrate is divided into 16 parts will be described.

The wavelength of the carbon dioxide laser beam is set to 10.6 μm.
m, the optical power at point O is 60 W (optical power value of continuous oscillation without flowing assist gas G), the distance from point P ₀ to substrate 20 is about 13 mm, and the assist gas at gas nozzle 35 is The pressure of N ₂ gas as 3 Kg
/ Cm ² and the moving speed of the substrate 20 by the XY moving device 25 was 10 mm / sec, and the substrate 20 was divided into 16 equal parts. There was no floating or vibration of the substrate 20 during the cutting, and it was possible to divide into 16 in a continuous process.

Next, the thickness is about 1.1 mm and 450 mm ×
560 mm non-alkali glass substrate (substrate warpage: ±
0.1 mm) was similarly cleaved, but despite the warpage of the substrate, there was no floating or vibration of the substrate during the cleaving, and in each case there were no microcracks on the cleaved surface,
And a smooth surface could be obtained. In addition, the breaking line was very linear and stable cutting could be performed. When the evaporation cutting is performed, the substrate fixing base may be provided with a groove for propagating and diffusing the laser beam after the laser beam penetrates the substrate.

[0043]

In summary, according to the present invention, the following excellent effects are exhibited.

Since the pressing arm provided in the substrate moving device presses the vicinity of the surface of the substrate irradiated with the carbon dioxide laser light, the cut surface or the fractured surface of the substrate is smooth and no microcracks are generated.

[Brief description of the drawings]

FIG. 1 is a diagram showing an embodiment of a processing apparatus to which a substrate processing method of the present invention is applied.

2A is a plan view of a substrate before processing, and FIG. 2B is a plan view of a substrate after processing.

FIG. 3 is an explanatory diagram for explaining the principle of the substrate processing method of the present invention.

FIG. 4 is an explanatory diagram for explaining a method of cutting and separating an integrated circuit.

FIG. 5 is a configuration diagram of a glass cutting device that has been previously proposed by the inventor of the present invention by irradiation with carbon dioxide gas laser light.

[Explanation of symbols]

 20 Substrate 24 Vacuum Suction Device 28-1, 28-2 Fixing Mechanism (Holding Arm) 33 Condensing System (Lens) 36 Gas Introducing System 100 Substrate Moving Device G Assist Gas

Claims (5)

[Claims] 1. A carbon dioxide gas laser beam is irradiated onto a substrate for processing mounted on a substrate moving device while the carbon dioxide gas laser beam is radiated while an assist gas is flowed along the propagation direction of the carbon dioxide gas laser beam. In a direction orthogonal to the propagation direction of the substrate, in the substrate processing method of cutting or cleaving from one end to the other end of the substrate, a pressing arm provided in the substrate moving device is used to A method of processing a substrate, characterized in that the vicinity of the irradiation surface is pressed. 2. The method for processing a substrate according to claim 1, wherein the holding arm holds at least two places of the substrate. 3. The method for processing a substrate according to claim 1, wherein the back surface of the substrate other than the back surface of the carbon dioxide laser light irradiation surface is fixed on the substrate moving device by vacuum suction. 4. A carbon dioxide laser device, a condenser system for condensing carbon dioxide laser light emitted from the carbon dioxide laser device, a gas introduction system for flowing an assist gas along the propagation direction of the carbon dioxide laser light, and the substrate. A substrate moving device for moving the carbon dioxide gas laser light in a direction orthogonal to the propagation direction of the carbon dioxide laser light, and a fixing mechanism provided on the substrate moving device for pressing a vicinity of the carbon dioxide laser light irradiation surface of the substrate with a holding arm. A substrate processing device characterized by the above. 5. The substrate moving device is provided with a vacuum suction device for fixing the back surface of the substrate other than the back surface of the carbon dioxide laser light irradiation surface to the substrate moving device by vacuum suction.
The substrate processing apparatus described.