JPH0919791A - Lead-free solder - Google Patents
Lead-free solderInfo
- Publication number
- JPH0919791A JPH0919791A JP7339644A JP33964495A JPH0919791A JP H0919791 A JPH0919791 A JP H0919791A JP 7339644 A JP7339644 A JP 7339644A JP 33964495 A JP33964495 A JP 33964495A JP H0919791 A JPH0919791 A JP H0919791A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- free solder
- solder
- temperature
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】
【課題】 本発明は、Ｓｎ−Ａｇ−Ｂｉ系無鉛半田の組
成を適切に制御することによって、既存のＳｎ−４０Ｐ
ｂ半田よりも機械的強度が増加し、特に、一般電子部品
の電子機器配線用として好適なＳｎ−Ａｇ−Ｂｉ系無鉛
半田を提供することを課題とする。
【解決手段】 本発明は、重量％で、Ａｇ：３．１〜７
％，Ｂｉ：６〜３０％および残部Ｓｎからなる組成を有
する無鉛半田であり、また、Ａｇ，ＢｉおよびＳｎを含
み、固相線温度が１３８〜２００℃であり、液相線温度
が１４４〜２２０℃である無鉛半田であることを特徴と
する。(57) Abstract: The present invention provides an existing Sn-40P by appropriately controlling the composition of a Sn-Ag-Bi lead-free solder.
It is an object of the present invention to provide a Sn-Ag-Bi-based lead-free solder which has mechanical strength higher than that of the solder b and is particularly suitable for wiring electronic devices of general electronic components. The present invention provides Ag: 3.1 to 7 in weight%.
%, Bi: 6 to 30% and the balance Sn, a lead-free solder, which also contains Ag, Bi and Sn, and has a solidus temperature of 138 to 200 ° C. and a liquidus temperature of 144 to It is a lead-free solder having a temperature of 220 ° C.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は電子部品の電子機器
配線用として用いられる汎用の無鉛半田に関するもので
あって、より詳しくは錫−銀−ビスマス系無鉛半田に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a general-purpose lead-free solder used for wiring electronic components of electronic components, and more particularly to a tin-silver-bismuth-based lead-free solder.
【０００２】[0002]
【従来の技術】半田付けに用いられる半田はその使用用
途に適合するように固有の特性を持つが、通常の半田で
はその溶融温度および凝固温度範囲が重要である。2. Description of the Related Art The solder used for soldering has specific characteristics so as to be adapted to the intended use, but the melting temperature and solidification temperature range are important for ordinary solder.
【０００３】即ち、特定の用途に選択された半田は隣接
の部品、特に温度に敏感な部品に損傷を与えない程度に
低い溶融温度を有すべきものであるが、半田付け後には
使用中に接合状態が熱的に安定するように高い溶融温度
範囲を持つことが必要である。[0003] That is, the solder selected for a particular application should have a melting temperature that is low enough not to damage adjacent components, especially temperature-sensitive components, but after soldering, the solder must be joined during use. It is necessary to have a high melting temperature range so that the condition is thermally stable.
【０００４】更に、半田は大部分共晶反応が生じる成分
系から構成されるため、共晶組成以外の特定組成を有す
るようになる場合には、半田付け後に溶融状態から凝固
が始まる液相線を通過するようになって、液相と固相と
が共存するようになり、次いで、完全に凝固が終了する
固相線に至る凝固温度範囲を持つようになるが、万一、
この半田の凝固温度範囲が広い場合には、半田付け後に
凝固時間が長引き収縮現象を生じることがあるので、で
きるだけ狭い凝固温度範囲を持つことが必要となる。[0004] Furthermore, since the solder is mostly composed of a component system in which a eutectic reaction occurs, if the solder has a specific composition other than the eutectic composition, the liquidus line starts to solidify from a molten state after soldering. , The liquid phase and the solid phase coexist, and then have a solidification temperature range up to the solidus line at which complete solidification is completed.
If the solidification temperature range of the solder is wide, the coagulation time may be prolonged after the soldering, and a contraction phenomenon may occur. Therefore, it is necessary to have a solidification temperature range as narrow as possible.
【０００５】凝固温度範囲が狭い範囲を持つ半田の場合
には、連続的な自動半田付けを行う時、段階的な半田付
けができる点でより有利となる。In the case of a solder having a narrow solidification temperature range, it is more advantageous that continuous automatic soldering can be performed in a stepwise manner.
【０００６】上記特性を有する従来の半田の例を挙げれ
ばＳｎ−Ｐｂ系合金を挙げることができる。このＳｎ−
Ｐｂ系合金はいろいろな機械的、物理的特性が優れてお
り、主に配管、熱交換器のような構造用および一般電子
産業用として多用されている。An example of a conventional solder having the above characteristics is an Sn-Pb alloy. This Sn-
Pb-based alloys are excellent in various mechanical and physical properties and are widely used mainly for structures such as pipes and heat exchangers and for general electronic industries.
【０００７】しかし、鉛は分解されない金属であって、
一旦摂取されると排泄されずに体内に蓄積される。実例
として米国の疾病管理センター（ＣＤＣ）において明示
した鉛の毒性は血中濃度１０μｇ／ｄｌ以上となれば致
命的であり、特に幼児には知能の低下を誘発させ、ま
た、鉛の廃棄物は土壌を汚染させる問題がある。However, lead is a metal that cannot be decomposed,
Once ingested, they are accumulated in the body without being excreted. As an example, the toxicity of lead, as specified by the US Centers for Disease Control (CDC), is fatal if the blood concentration is above 10 μg / dl, causing intellectual decline, especially in infants, and lead waste. There is a problem of polluting the soil.
【０００８】特に、５０Ｓｎ−５０Ｐｂや７０Ｓｎ−３
０Ｐｂ等のような従来の配管用の半田は広い温度範囲に
おいて使用が可能であり、強い機械的連結部位を形成
し、銅パイプ溶接に大変有用であるが、鉛が水に溶け込
んで長い時間が経過した後には健康に致命的な障害を与
えるという事が発見され、飲料水を供給するパイプのよ
うな配管用半田でも鉛の使用が規制されることとなっ
た。In particular, 50Sn-50Pb and 70Sn-3
Conventional piping solder such as 0Pb can be used in a wide temperature range, forms a strong mechanical connection part, and is very useful for copper pipe welding. However, lead is dissolved in water for a long time. Over time, it was discovered that it could cause fatal health problems, and the use of lead was restricted in piping solder, such as pipes that supply drinking water.
【０００９】鉛と鉛含有組成物に対する規制の例を挙げ
れば米国の場合、１９８７年に商用ペイント（ｃｏｎｓ
ｕｍｅｒ ｐａｉｎｔ）分野において、鉛使用が全面的
に規制されて以来、米国環境保護庁（ＥＰＡ）において
は毒性物質規制法（Ｔｏｘｉｃ ｓｕｂｓｔａｎｃｅ
Ｃｏｎｔｒｏｌ Ａｃｔ，ＴＳＣＡ）の下において鉛を
含む中間生成物の製造業者は最終生成物の廃棄と回収に
対する義務があるものと規定し、米国の下院はＰｂ除去
（Ｐｂ−Ｃｌｅａｎｕｐ）基金の財源として１００〜２
００％の税金を賦課するように提案（ＨＲ２４７９）し
ており、また、米国の上院においても鉛暴露規制法（Ｌ
ｅａｄ Ｅｘｐｏｓｕｒｅ Ａｃｔ，Ｓ−７２９）を発
表、産業用鉛の全面規制を提案した。更に、米国職業安
全衛生管理局（ＯＳＨＡ）においては大気中および作業
場において許容される鉛の濃度を規制した鉛の基準を制
定しており、大気中に多くの鉛が放出されている状況に
おいて従事者の鉛に対する暴露を最少化すべきであると
要求している。このように米国においては法を以て配管
工に対して、特に５０Ｓｎ−５０Ｐｂの使用を禁止し、
飲料に係わる全ての分野において鉛含有半田の使用を禁
止しており、配管以外の他の鉛含有半田に対しても使用
を規制している。このような趨勢は韓国内に於いても殆
ど大同小異となっているのが実情である。For example, in the United States, in 1987, commercial paints (cons)
In the U.S. Environmental Protection Agency (EPA), since the use of lead has been completely regulated in the field of umer paint, the Toxic Substance has been proposed.
(Control Act, TSCA) stipulates that manufacturers of intermediate products containing lead have an obligation to dispose of and recover the end product, and the US House of Representatives provides 100% funding for the Pb-Cleanup fund. ~ 2
It has proposed to impose a 00% tax (HR2479), and the US Senate has also proposed a lead exposure control law (L
EAD Exposure Act, S-729) was announced, and a total regulation of industrial lead was proposed. In addition, the U.S. Occupational Safety and Health Administration (OSHA) has established lead standards that regulate the concentration of lead allowed in the atmosphere and in the workplace, and engage in situations where a large amount of lead is released into the atmosphere. Requires that exposure to lead be minimized. Thus, in the United States, the use of 50Sn-50Pb was banned for plumbers by law,
The use of lead-containing solder is prohibited in all fields related to beverages, and the use of lead-containing solder other than piping is restricted. In fact, such trends are almost identical in Korea.
【００１０】一方、このような鉛に対する規制措置が抬
頭するに伴い無鉛半田が開発され始めた。米国特許第
１，７７８，７３３号に開示されたところによれば、Ｓ
ｎ−Ａｇ（０．０５〜３％）−Ｃｕ（０．７〜６％）か
らなる組成を有する無鉛半田が提案されており、更に、
米国特許第４，９２９，４２３号にはＳｎ−Ｂｉ（０．
０８〜２０％）−Ａｇ（０．０１〜１．５％）−Ｃｕ
（０．０２〜１．５％）−Ｐ（０．０１％）−稀土類元
素混合物からなる組成を有する無鉛半田が提案されてい
る。[0010] On the other hand, lead-free solder has begun to be developed in accordance with the rise of such measures for controlling lead. According to U.S. Pat. No. 1,778,733, S
A lead-free solder having a composition of n-Ag (0.05 to 3%)-Cu (0.7 to 6%) has been proposed.
U.S. Pat. No. 4,929,423 discloses Sn-Bi (0.
08-20%)-Ag (0.01-1.5%)-Cu
A lead-free solder having a composition of (0.02 to 1.5%)-P (0.01%)-rare earth element mixture has been proposed.
【００１１】この他にも米国特許第４９９，４５２Ａ１
に開示されたところによれば、Ｓｎ（８７〜９７％），
Ａｇ（０．１〜３％），Ｂｉ（３〜７％）からなる組成
を有する無鉛半田が提案されており、更に日本特開平５
−２２８６８５号公報にはＳｎ（９２〜９５．８％），
Ａｇ（３〜５％），Ｂｉ（１．２〜３％）を含有する無
鉛半田が提案されている。しかし、上記の無鉛半田は溶
融温度が高い高温用無鉛半田となるため、特殊用途には
適合するが一般部品の半田付けには使用し難いという欠
点がある。[0011] In addition, US Patent No. 499,452A1
According to the disclosure of Sn (87-97%),
A lead-free solder having a composition consisting of Ag (0.1 to 3%) and Bi (3 to 7%) has been proposed.
No. 228,885 discloses Sn (92 to 95.8%),
A lead-free solder containing Ag (3 to 5%) and Bi (1.2 to 3%) has been proposed. However, since the above-mentioned lead-free solder is a high-temperature lead-free solder having a high melting temperature, it has a drawback that it is suitable for special uses but is difficult to use for soldering general components.
【００１２】[0012]
【発明が解決しようとする課題】したがって、本発明者
等は上記の従来の無鉛半田が有する欠点を解決するた
め、度重なる研究と実験を行い、その結果に基づいて本
発明をなすに至ったものであり、本発明はＳｎ−Ａｇ−
Ｂｉ系無鉛半田の組成を適切に制御することによって、
既存のＳｎ−４０Ｐｂ半田よりも機械的強度が増加し、
特に、一般電子部品の電子機器配線用として好適なＳｎ
−Ａｇ−Ｂｉ系無鉛半田を提供することを目的とする。Accordingly, the present inventors have conducted frequent studies and experiments in order to solve the above-mentioned drawbacks of the conventional lead-free solder, and have made the present invention based on the results. The present invention relates to Sn-Ag-
By appropriately controlling the composition of Bi-based lead-free solder,
Mechanical strength is increased compared to existing Sn-40Pb solder,
In particular, Sn which is suitable for electronic equipment wiring of general electronic parts
An object is to provide an Ag-Bi-based lead-free solder.
【００１３】[0013]
【課題を解決するための手段】上記の目的達成のため、
本発明の無鉛半田は、重量％でＡｇ：３．１〜７％，Ｂ
ｉ：６〜３０％および残部Ｓｎからなる組成を有するも
のであることを特徴とする。また、本発明の無鉛半田
は、Ａｇ，ＢｉおよびＳｎを含み、固相線温度が１３８
〜２００℃であり、液相線温度が１４４〜２２０℃であ
ることも特徴とする。以下、本発明について詳しく説明
する。In order to achieve the above object,
The lead-free solder of the present invention has an Ag content of 3.1 to 7% by weight,
i: characterized by having a composition of 6 to 30% and the balance Sn. The lead-free solder of the present invention contains Ag, Bi and Sn, and has a solidus temperature of 138.
To 200 ° C, and the liquidus temperature is 144 to 220 ° C. Hereinafter, the present invention will be described in detail.
【００１４】先ず、本発明のＳｎ−Ａｇ−Ｂｉ系半田中
に含有されるＡｇは、半田の低い溶融温度を考慮すると
３％近くの共晶組成を保つようにするのが良いが、熱疲
労特性改善のため３．１％以上添加することが好まし
い。First, the Ag contained in the Sn-Ag-Bi solder of the present invention should preferably maintain a eutectic composition of about 3% in consideration of the low melting temperature of the solder. It is preferable to add 3.1% or more for improving characteristics.
【００１５】しかし、添加量が余りにも多い量となる
と、半田の溶融温度を急上昇させることになるため、７
％以下の量で含有させることが好ましい。However, if the amount of addition is too large, the melting temperature of the solder will be sharply increased.
% Is preferably contained.
【００１６】上記ＢｉはＳｎ−Ａｇ合金系、例えば、Ｓ
ｎ−３％Ａｇ合金系（溶融温度２２１℃）に添加した場
合、溶融温度を下げ、湿潤性を向上させる役割をする。
しかし、上記Ｂｉの添加量が６％以下では、その効果が
少なく、一方、３０％以上では、低温の溶融温度を有
し、湿潤性は更に向上することになるが、半田自体が脆
弱となり溶融温度範囲を広げるようになる。Bi is an Sn-Ag alloy based material, for example, S
When added to an n-3% Ag alloy system (melting temperature 221 ° C.), it serves to lower the melting temperature and improve wettability.
However, when the content of Bi is 6% or less, the effect is small. On the other hand, when the content of Bi is 30% or more, the melting temperature is low and the wettability is further improved. The temperature range is expanded.
【００１７】[0017]
【発明の実施の形態】上記の組成を有する半田は、金属
原料を秤量し、大気中においてポット（ｐｏｔ）やルツ
ボを用いて加熱、攪拌しながら溶融する通常の方法によ
り鋳造し、製造することができる。空気中において溶融
する場合、金属原料中の不純物、非金属性物質または合
金溶湯が空気と反応して半田合金中に溶存窒素や溶存酸
素のような溶存ガスを形成し、これによって基材材料表
面に対する湿潤性が妨げられて半田適性が低下したり、
半田付け接合部に空隙（ｖｏｉｄ）が生ずるため熱伝
導、熱疲労特性および製品信頼性に問題が生じる場合が
ある。したがって、不純物または非金属性物質や空気中
において合金製造時に生ずる合金中の溶存ガスを最少化
し、半田適性を向上させ熱疲労特性および製品信頼性を
改善するため、本発明の半田製造時には真空状態または
不活性ガス雰囲気において溶融し、原料金属中、特にＢ
ｉの酸化を抑制し、ドロス（ｄｒｏｓｓ）の発生を最少
化する溶融方法がより好ましい。BEST MODE FOR CARRYING OUT THE INVENTION Solder having the above-mentioned composition is manufactured by weighing a metal raw material and casting it by a usual method of melting while heating and stirring using a pot or crucible in the atmosphere. Can be. When melted in the air, impurities in the metal raw material, non-metallic substances or molten alloy react with the air to form dissolved gases such as dissolved nitrogen and dissolved oxygen in the solder alloy. The wettability of the solder is impaired,
Since voids are generated in the solder joints, problems may occur in heat conduction, thermal fatigue characteristics, and product reliability. Therefore, in order to minimize impurities or non-metallic substances and dissolved gas in the alloy produced in the air during the production of the alloy, to improve the solderability and to improve the thermal fatigue characteristics and product reliability, a vacuum state is required during the production of the solder of the present invention. Alternatively, it is melted in an inert gas atmosphere,
More preferred is a melting method that suppresses the oxidation of i and minimizes the generation of dross.
【００１８】このような方法により製造される本発明の
無鉛半田はいろいろな形態（インゴット、長方形状の断
面を有するような形態、円形状の断面を有するような形
態など）に製造可能であり、更に、種々の大きさの球形
の粉体にも製造することができる。更に、粉体形態の半
田の場合には、適当なフラックスと混合して半田ペース
トも製造可能である。The lead-free solder of the present invention produced by such a method can be produced in various forms (an ingot, a form having a rectangular cross section, a form having a circular cross section, and the like). Further, spherical powders of various sizes can be produced. Further, in the case of a solder in powder form, a solder paste can be produced by mixing with an appropriate flux.
【００１９】このように製造された本発明の無鉛半田
は、一般電子部品の電子機器配線用として使用可能な融
点を有するのみならず、凝固範囲が狭く段階的な自動半
田付けに大変有効であり、従来のＳｎ−Ｐｂ系よりも機
械的強度が増加するという特徴を有している。The lead-free solder of the present invention thus manufactured not only has a melting point that can be used for wiring electronic devices of general electronic components, but also has a narrow solidification range and is very effective for stepwise automatic soldering. It has a feature that the mechanical strength is increased as compared with the conventional Sn-Pb system.
【００２０】以下、本発明を実施例により具体的に説明
するが、本発明はこれら代表的な実施例によって限定さ
れることはない。Hereinafter, the present invention will be described specifically with reference to Examples, but the present invention is not limited to these Representative Examples.
【００２１】[0021]
実施例１ 下記表１のような組成となるようにＳｎ，Ａｇ，Ｂｉ金
属原料を秤量した後、高周波誘導炉を用いて１０-3ｔｏ
ｒｒ以下の真空状態において溶融し、鋳造した。製造し
た合金について凝固時の固相線温度と液相線温度とを測
定し、その結果を下記表１に示した。Example 1 After weighing Sn, Ag, and Bi metal raw materials so as to have a composition as shown in Table 1 below, 10 −3 ton was measured using a high-frequency induction furnace.
It was melted and cast in a vacuum state of rr or less. The solidus temperature and the liquidus temperature at the time of solidification of the produced alloy were measured, and the results are shown in Table 1 below.
【００２２】[0022]
【表１】 上記表１に示したように、実施例１の無鉛半田は液相線
温度が２２０℃、固相線温度が２００℃であり、凝固温
度範囲は２０℃となり汎用の無鉛半田として非常に好適
なものであることがわかる。[Table 1] As shown in Table 1, the lead-free solder of Example 1 has a liquidus temperature of 220 ° C., a solidus temperature of 200 ° C., and a solidification temperature range of 20 ° C., which is very suitable as a general-purpose lead-free solder. It turns out to be something.
【００２３】実施例２ 下記表２のような組成の無鉛半田を空気中において、高
周波誘導炉を用いて金属原料を溶融し、鋳造した。鋳造
した合金について固相線および液相線凝固温度を測定
し、その結果を下記表２に示した。Example 2 A lead-free solder having a composition shown in Table 2 below was melted in a high-frequency induction furnace in the air to cast a metal material. The solidus and liquidus solidification temperatures of the cast alloy were measured, and the results are shown in Table 2 below.
【００２４】[0024]
【表２】 上記表２に示したように、実施例２の無鉛半田は液相線
温度が２１８℃、固相線温度が１９５℃であり、凝固温
度範囲は２３℃となり、汎用の無鉛半田として非常に好
適なものであることがわかる。[Table 2] As shown in Table 2, the lead-free solder of Example 2 has a liquidus temperature of 218 ° C., a solidus temperature of 195 ° C., and a solidification temperature range of 23 ° C., which is very suitable as a general-purpose lead-free solder. It is understood that it is.
【００２５】実施例３ 下記表３のような組成の無鉛半田を、高周波誘導炉で不
活性ガス（Ｎ2 ）を２５０〜３００ｍｂａｒに保ち金属
原料を溶融し、鋳造した。鋳造した合金について固相線
および液相線温度を測定し、その結果を下記表３に示し
た。Example 3 A lead-free solder having the composition shown in Table 3 below was cast in a high-frequency induction furnace while melting an inert gas (N 2 ) at 250 to 300 mbar with a metal raw material. The solidus and liquidus temperatures of the cast alloy were measured and the results are shown in Table 3 below.
【００２６】[0026]
【表３】 上記表３に示したように、実施例３の無鉛半田は液相線
温度が２０６℃、固相線温度が１８０℃であり、凝固温
度範囲は２６℃となり、汎用の無鉛半田として使用可能
なものであることがわかる。[Table 3] As shown in Table 3 above, the lead-free solder of Example 3 has a liquidus temperature of 206 ° C., a solidus temperature of 180 ° C., a solidification temperature range of 26 ° C., and can be used as a general-purpose lead-free solder. It turns out to be something.
【００２７】実施例４ 下記表４のような組成を有する無鉛半田を、実施例３の
同様な方法で製造し、製造した無鉛半田に対する凝固温
度測定結果を下記表４に示した。Example 4 A lead-free solder having the composition shown in Table 4 below was produced in the same manner as in Example 3, and the solidification temperature measurement results for the produced lead-free solder are shown in Table 4 below.
【００２８】[0028]
【表４】 上記表４に示すように、実施例４の無鉛半田は、液相線
温度が１４４℃、固相線温度が１３８℃であり、凝固温
度範囲は６℃となり、低温用として特に好適なものであ
ることがわかる。[Table 4] As shown in Table 4 above, the lead-free solder of Example 4 has a liquidus temperature of 144 ° C., a solidus temperature of 138 ° C., a solidification temperature range of 6 ° C., and is particularly suitable for use at low temperatures. You can see that there is.
【００２９】比較例１ 下記表５のような組成を有する従来の無鉛半田を製造
し、製造した無鉛半田の凝固温度を測定し、その結果を
下記表５に示した。Comparative Example 1 A conventional lead-free solder having the composition shown in Table 5 below was manufactured, and the solidification temperature of the manufactured lead-free solder was measured. The results are shown in Table 5 below.
【００３０】[0030]
【表５】 上記表５のような組成を有する無鉛半田は、液相線温度
が２２０℃、固相線温度が２１５℃であり、凝固温度範
囲が５℃である高温用無鉛半田となることがわかる。[Table 5] It can be seen that the lead-free solder having the composition shown in Table 5 above has a liquidus temperature of 220 ° C., a solidus temperature of 215 ° C., and a high-temperature lead-free solder having a solidification temperature range of 5 ° C.
【００３１】比較例２ 下記表６のような組成を有する無鉛半田を、比較例１と
同様な方法で製造し、その結果を下記表６に示した。Comparative Example 2 A lead-free solder having a composition as shown in Table 6 below was produced in the same manner as in Comparative Example 1, and the results are shown in Table 6 below.
【００３２】[0032]
【表６】 上記表６に示した無鉛半田は、液相線温度が２２３〜２
３６℃、固相線温度が約２１１℃であり、凝固温度範囲
が１２〜２５℃となり、高温用無鉛半田となることがわ
かる。[Table 6] The lead-free solder shown in Table 6 has a liquidus temperature of 223 to 2
It is 36 ° C., the solidus temperature is about 211 ° C., the solidification temperature range is 12 to 25 ° C., and it can be seen that this is a high-temperature lead-free solder.
【００３３】実験例１ 高周波誘導炉を用い、空気中においてＳｎ−３．１％，
Ａｇ−６．９％，Ｂｉからなる組成の実施例２とＳｎ−
３．５％，Ａｇ−４．５％，Ｂｉから組成の比較例３を
溶融し、鋳造した。鋳造した夫々の合金について湿潤性
を測定した結果を図１に示した。Experimental Example 1 In a high-frequency induction furnace, Sn-3.1%,
Example 2 having a composition of Ag-6.9% and Bi and Sn-
Comparative Example 3 having a composition of 3.5%, Ag-4.5%, and Bi was melted and cast. FIG. 1 shows the results of measuring the wettability of each of the cast alloys.
【００３４】図１に示したように、実施例２の場合、比
較例３の場合に比べ潤滑性が優れ、半田適性が優れるて
いることがわかる。As shown in FIG. 1, it can be seen that in the case of Example 2, the lubricity and the suitability for soldering are superior to those of Comparative Example 3.
【００３５】実験例２ 本発明による無鉛半田と従来の半田に対する機械的性質
を調べるため、実施例２とＳｎ−４０Ｐｂ半田とについ
て機械的性質を測定し、その結果を図２に示した。Experimental Example 2 In order to examine the mechanical properties of the lead-free solder according to the present invention and the conventional solder, the mechanical properties of Example 2 and Sn-40Pb solder were measured, and the results are shown in FIG.
【００３６】図２に示したように、実施例２の場合、従
来例に比べて引張強度が極めて優れていることがわかる
が、これは、結局、半田付け後の最終接合強度が本発明
の無鉛半田を用いることにより、一層優れたものになる
ことを意味している。As shown in FIG. 2, it can be seen that the tensile strength of Example 2 is extremely superior to that of the conventional example, but this is because the final bonding strength after soldering is lower than that of the present invention. By using lead-free solder, it means that it will be more excellent.
【００３７】[0037]
【発明の効果】以上の実施例からわかるように、本発明
による無鉛半田は、従来のＳｎ−Ｐｂ系半田に比べて機
械的性質が優れており、半田付け後の最終接合強度が既
存の半田に比べて卓越しているばかりでなく、鉛が含ま
れていないため作業環境等が改善され、特に溶融温度が
低く凝固温度範囲が狭いことから従来の高温用Ｓｎ−Ａ
ｇ−Ｂｉ系無鉛半田に比べて一般電子部品の配線用等に
用いることができるものである。As can be seen from the above embodiments, the lead-free solder according to the present invention has better mechanical properties than the conventional Sn-Pb-based solder, and the final bonding strength after soldering is the same as that of the existing solder. In addition to the superiority, Sn-A for conventional high-temperature Sn-A is improved because it does not contain lead, so that the working environment and the like are improved. In particular, the melting temperature is low and the solidification temperature range is narrow.
Compared to g-Bi lead-free solder, it can be used for wiring of general electronic components.
【図１】本発明の無鉛半田に対する半田適性を示すグラ
フである。FIG. 1 is a graph showing solder suitability for a lead-free solder of the present invention.
【図２】従来の半田と本発明の無鉛半田に対する機械的
性質を比較したグラフである。FIG. 2 is a graph comparing mechanical properties of a conventional solder and a lead-free solder of the present invention.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 李 道 宰 大韓民国 クァンジュ ヨンボン−ドン 1104−４ ヒュンダイアパートメント 203−301 ─────────────────────────────────────────────────── ───Continued from the front page (72) Inventor Lee Do-soo Gwangju Yongbong-dong 1104-4 Hyundai Apartment 203-301
Claims (4)
６〜３０％および残部Ｓｎからなる組成を有する無鉛半
田。1. Ag: 3.1 to 7% by weight, Bi:
Lead-free solder having a composition of 6 to 30% and the balance Sn.
Ｂｉ：２９〜３０％および残部Ｓｎである請求項１に記
載の無鉛半田。2. The composition according to claim 1, wherein the composition is expressed in% by weight,
The lead-free solder according to claim 1, wherein Bi is 29 to 30% and the balance is Sn.
％，Ｂｉ：６〜７％および残部Ｓｎである請求項１に記
載の無鉛半田。3. The composition according to claim 1, wherein the composition is expressed by weight% and Ag: 3.1-4.
%, Bi: 6 to 7% and the balance Sn.
度が１３８〜２００℃であり、液相線温度が１４４〜２
２０℃である無鉛半田。4. It contains Ag, Bi and Sn, has a solidus temperature of 138 to 200 ° C. and a liquidus temperature of 144 to 2
Lead-free solder that is 20 ℃.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950019012A KR970000429A (en) | 1995-06-30 | 1995-06-30 | General purpose lead free solder |
| KR1995-19012 | 1995-06-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0919791A true JPH0919791A (en) | 1997-01-21 |
| JP2638759B2 JP2638759B2 (en) | 1997-08-06 |
Family
ID=19419408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7339644A Expired - Fee Related JP2638759B2 (en) | 1995-06-30 | 1995-12-26 | Lead-free solder |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2638759B2 (en) |
| KR (1) | KR970000429A (en) |
| SG (1) | SG50377A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0787559A1 (en) * | 1996-02-09 | 1997-08-06 | Matsushita Electric Industrial Co., Ltd. | Soldering alloy, cream solder and soldering method |
| JP2010512250A (en) * | 2007-12-31 | 2010-04-22 | トゥクサン ハイ‐メタル シーオー エルティディ | Lead-free solder alloy and manufacturing method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105215569A (en) * | 2015-10-30 | 2016-01-06 | 苏州优诺电子材料科技有限公司 | A kind of leadless welding alloy |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08132277A (en) * | 1994-11-01 | 1996-05-28 | Ishikawa Kinzoku Kk | Leadless solder |
-
1995
- 1995-06-30 KR KR1019950019012A patent/KR970000429A/en not_active Ceased
- 1995-12-04 SG SG1995002013A patent/SG50377A1/en unknown
- 1995-12-26 JP JP7339644A patent/JP2638759B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08132277A (en) * | 1994-11-01 | 1996-05-28 | Ishikawa Kinzoku Kk | Leadless solder |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0787559A1 (en) * | 1996-02-09 | 1997-08-06 | Matsushita Electric Industrial Co., Ltd. | Soldering alloy, cream solder and soldering method |
| JP2010512250A (en) * | 2007-12-31 | 2010-04-22 | トゥクサン ハイ‐メタル シーオー エルティディ | Lead-free solder alloy and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR970000429A (en) | 1997-01-21 |
| SG50377A1 (en) | 1998-07-20 |
| JP2638759B2 (en) | 1997-08-06 |
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